CN116130583A - Display panel and display device - Google Patents
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- CN116130583A CN116130583A CN202310273731.2A CN202310273731A CN116130583A CN 116130583 A CN116130583 A CN 116130583A CN 202310273731 A CN202310273731 A CN 202310273731A CN 116130583 A CN116130583 A CN 116130583A
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- 239000000758 substrate Substances 0.000 claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 claims description 22
- 238000005538 encapsulation Methods 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 229910021389 graphene Inorganic materials 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 238000002834 transmittance Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 22
- 230000000694 effects Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- Engineering & Computer Science (AREA)
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Abstract
The application discloses a display panel and a display device. Wherein, the display panel includes: the display panel includes upper base plate and lower base plate, and upper base plate and lower base plate set up relatively, and upper base plate sets up color film layer towards lower base plate one side, and lower base plate sets up the light-emitting part towards the one side of upper base plate, and color film layer includes a plurality of pixel areas, and each pixel area corresponds to setting up a light-emitting part, and display panel still includes: the light-transmitting heat-conducting layer is arranged between the color film layer and the light-emitting piece, and the radiating surface of the light-emitting piece faces the light-transmitting heat-conducting layer; the heat conduction piece is close to the luminous piece and is connected with the light-transmitting heat conduction layer at one end, and the other end extends to the lower substrate. The application derives the heat of luminous piece through printing opacity heat conduction layer to spread the external world along the heat conduction piece, the luminous chip generates heat seriously, reduces display panel's unusual.
Description
Technical Field
The application belongs to the technical field of panel display, and particularly relates to a display panel and a display device.
Background
Micro LEDs (Micro light emitting diodes) have advantages of higher color saturation, higher brightness, and the like, and are gradually expanding in application in display panels. But at higher pixel densities the size of Micro LED chips becomes smaller. The smaller the Micro LED chip size, the more severe the heat generation, and thus the heat accumulation may cause abnormal display of the display panel. Severe conditions can damage the Micro LED chip and even lead to a reduced lifetime of the Micro LED chip.
Disclosure of Invention
The purpose of the present application is to provide a display panel and a display device, which reduce serious heat generation of a light emitting chip and reduce abnormality of the display panel.
Other features and advantages of the present application will be apparent from the following detailed description, or may be learned in part by the practice of the application.
According to an aspect of the embodiment of the present application, the present application provides a display panel, the display panel includes an upper substrate and a lower substrate, the upper substrate with the lower substrate sets up relatively, the upper substrate is towards lower substrate one side sets up color filter layer, lower substrate is towards one side of upper substrate sets up the light-emitting component, color filter layer includes a plurality of pixel areas, each pixel area corresponds to set up one the light-emitting component, the display panel still includes:
the light-transmitting heat-conducting layer is arranged between the color film layer and the luminous piece, and the radiating surface of the luminous piece is arranged towards the light-transmitting heat-conducting layer;
the heat conduction piece is close to the luminous piece, one end of the heat conduction piece is connected with the light-transmitting heat conduction layer, and the other end of the heat conduction piece extends to the lower substrate.
In one aspect, the display panel further includes a heat sink, the heat sink is disposed at an end of the heat conducting member away from the light-transmitting heat conducting layer, and a projection area of the heat sink on the lower substrate is greater than a projection area of the heat conducting member on the lower substrate.
In one aspect, the heat sink is disposed on a side of the lower substrate facing the heat conductive member;
or, the heat sink is disposed on a side of the lower substrate facing away from the heat conducting member.
In one aspect, the lower substrate is provided with a heat conducting hole, the heat conducting hole is arranged corresponding to the heat conducting piece, and the heat conducting piece extends to the heat conducting hole and at least partially fills the heat conducting hole.
In one aspect, the light-transmitting and heat-conducting layer is graphene, and the heat-conducting member is cured silver paste.
In one aspect, the thickness of the graphene is L, L is less than or equal to 0.3nm, the visible light transmittance of the graphene is T, and T is more than or equal to 97%;
the diameter of the heat conducting piece is d, and d is more than or equal to 0.5um.
In one aspect, the display panel further includes a packaging layer, the packaging layer is disposed on a side of the lower substrate facing the upper substrate, the packaging layer is provided with a plurality of mounting vacancies, each mounting vacancy corresponds to one pixel area, the light emitting element is disposed on the mounting vacancies, the light-transmitting heat conducting layer is disposed between the packaging layer and the color film layer, the packaging layer is provided with a heat dissipation hole, and the heat conducting element penetrates through the heat dissipation hole and is connected with the light-transmitting heat conducting layer.
In one aspect, a surface of the light emitting member facing the light-transmitting and heat-conducting layer is flush with a surface of the encapsulation layer facing the light-transmitting and heat-conducting layer;
or, the surface of the light emitting piece facing the light-transmitting heat conducting layer protrudes out of the surface of the packaging layer facing the light-transmitting heat conducting layer.
In one aspect, the packaging layer includes a buffer layer, an insulating layer, a first dielectric layer, a second dielectric layer, a flat layer and a retaining wall, where the buffer layer, the insulating layer, the first dielectric layer, the second dielectric layer, the flat layer and the retaining wall are sequentially arranged from the lower substrate to the upper substrate, and the retaining wall forms the installation vacancy;
the display panel comprises a driving transistor, wherein the driving transistor comprises a source-drain layer, an active layer and a grid electrode layer, the active layer is arranged between the buffer layer and the insulating layer, the grid electrode layer is arranged between the insulating layer and the first dielectric layer, and the source-drain layer is arranged between the second dielectric layer and the flat layer;
the display panel further comprises an electrode layer which is arranged in the mounting vacancy and is connected with one electrode of the light emitting piece, the electrode layer is connected with the source drain layer through a first through hole, the source drain layer is connected with the active layer through a second through hole, the first through hole penetrates through the flat layer, and the second through hole penetrates through the insulating layer, the first dielectric layer and the second dielectric layer;
and when the radiating fin is positioned on the upper surface of the upper substrate, holes are synchronously formed in the buffer layer and the insulating layer, so that the radiating fin is deposited on the upper surface of the upper substrate.
In addition, in order to solve the above-mentioned problem, this application still provides a display device, display device includes color film packaging layer, display device still includes as above display panel, color film packaging layer set up in color film layer towards one side of lower base plate, the heat-conducting piece is provided with a plurality ofly, every the side of luminescent part sets up at least one the heat-conducting piece.
In this application, luminescent part produces heat at the during operation, and luminescent part and printing opacity heat conduction layer contact, heat transfer to printing opacity heat conduction layer. And the light-transmitting heat-conducting layer is also connected with the heat-conducting piece, and heat on the light-transmitting heat-conducting layer is transferred through the heat-conducting piece. Because the heat conducting member extends towards the lower substrate, heat transferred to the heat conducting member can be dissipated along the heat conducting member, the heat conducting member is closer to the external environment, and the heat can be transferred to the external environment. Therefore, the heat of the light-emitting chip can be led out through the arrangement of the light-transmitting heat-conducting layer and the heat-conducting piece, and the heat aggregation is reduced, so that the display abnormality of the display panel is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application. It is apparent that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 schematically shows a schematic structure of a display panel in the present application.
Fig. 2 schematically illustrates a schematic structure in which a heat sink of a display panel is disposed on an upper surface of a lower substrate in the present application.
Fig. 3 schematically illustrates a schematic structure in which a heat sink of a display panel is disposed on a lower surface of a lower substrate in the present application.
Fig. 4 schematically shows a schematic structure of the display panel of fig. 1 provided with driving transistors in the present application.
Fig. 5 schematically shows a schematic structure of the display panel of fig. 2 provided with driving transistors in the present application.
Fig. 6 schematically shows a schematic view of the structure of the lower surface of the lower substrate in the display device of the present application.
The reference numerals are explained as follows:
10. an upper substrate; 20. a lower substrate; 30. a color film layer; 40. a light emitting member; 50. a light-transmitting heat-conducting layer; 60. a heat conductive member; 70. a heat sink; 80. an encapsulation layer; 90. a driving transistor;
301. a matrix layer; 302. a color film packaging layer; 410. an electrode layer; 810. a buffer layer; 820. an insulating layer; 830. a first dielectric layer; 840. a second dielectric layer; 850. a flat layer; 860. a retaining wall; 910. a source drain layer; 920. an active layer; 930. a gate layer; 901. a capacitance layer; 902. a first through hole; 903. and a second through hole.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.
Example 1
Referring to fig. 1, the present application provides a display panel, the display panel includes an upper substrate 10 and a lower substrate 20, the upper substrate 10 and the lower substrate 20 are disposed opposite to each other, a color film layer 30 is disposed on a side of the upper substrate 10 facing the lower substrate 20, a light emitting member 40 is disposed on a side of the lower substrate 20 facing the upper substrate 10, the color film layer 30 includes a plurality of pixel regions, and each pixel region is correspondingly disposed with a light emitting member 40. Each pixel region is provided with a film layer of a different color, such as red, blue, green, and the like. Different colors can be displayed by different proportions of the three colors. The light emitting element 40 emits white light after being lighted, and the light emitting element 40 serves as a backlight element to emit light, and the light passes through the color film layer 30 to be in different colors, thereby completing the picture display.
The display panel further includes: a light-transmitting heat-conducting layer 50 and a heat-conducting member 60; the light emitting member 40 generates heat during operation, and the heat is sequentially transferred to the outside of the display panel through the light-transmitting heat conducting layer 50 and the heat conducting member 60, so that the heat collection on the light emitting member 40 is reduced, and the display effect is ensured.
The light-transmitting heat-conducting layer 50 is arranged between the color film layer 30 and the light-emitting piece 40, and the radiating surface of the light-emitting piece 40 faces the light-transmitting heat-conducting layer 50; the surface of the light emitting member 40 facing the upper substrate 10 contacts the light-transmitting and heat-conducting layer 50, and the upper surface of the light emitting member 40 is also a main heat dissipation surface. The light-transmitting and heat-conducting layer 50 has excellent heat-conducting performance, and the light-transmitting and heat-conducting layer 50 also has good light transmittance, so that the light emitted by the light-emitting element 40 can pass through the light-transmitting and heat-conducting layer 50, the brightness of the color film layer 30 can be ensured, and the occurrence of insufficient picture display brightness is reduced.
The heat conducting member 60 is disposed near the light emitting member 40, and has one end connected to the light-transmitting heat conducting layer 50 and the other end extending toward the lower substrate 20. The heat conducting member 60 has good heat conducting performance, the other end of the heat conducting member 60 extends towards the lower substrate 20, the heat generated by the light emitting member 40 is transferred to the light-transmitting heat conducting layer 50, the light-transmitting heat conducting layer 50 transfers the heat to the heat conducting member 60, and the heat dissipation is completed through the transfer of the heat conducting member 60.
In this embodiment, the light emitting member 40 generates heat during operation, the light emitting member 40 contacts the light-transmitting heat-conducting layer 50, and the heat is transferred to the light-transmitting heat-conducting layer 50. The transparent heat conducting layer 50 is also connected with the heat conducting member 60, and heat on the transparent heat conducting layer 50 is transferred through the heat conducting member 60. Since the heat conductive member 60 extends toward the lower substrate 20, heat transferred to the heat conductive member 60 can be emitted along the heat conductive member 60, and the heat conductive member 60 is closer to the external environment, and the heat can be transferred to the external environment. By providing the light-transmitting heat-conducting layer 50 and the heat-conducting member 60, heat of the light-emitting chip can be conducted out, heat accumulation can be reduced, and abnormal display of the display panel can be reduced.
Referring to fig. 2 and 3, in order to improve the heat dissipation effect, the display panel further includes a heat sink 70, where the heat sink 70 is disposed at an end of the heat conducting member 60 away from the transparent heat conducting layer 50, and a projection area of the heat sink 70 on the lower substrate 20 is larger than a projection area of the heat conducting member 60 on the lower substrate 20. The heat conductive member 60 transfers heat to the heat sink 70, and the heat sink 70 has a larger area and a larger area in contact with the surrounding space, thereby improving the heat dissipation effect.
Referring to fig. 2, at least two of the heat sinks 70 are disposed. The heat sink 70 is disposed on a side of the lower substrate 20 facing the heat conducting member 60; i.e., the heat sink 70 is disposed on the upper surface of the lower substrate 20. The heat generated from the light emitting member 40 sequentially passes through the light-transmitting heat conductive layer 50, the heat conductive member 60, and the heat sink 70. In this arrangement, the lower substrate 20 does not need to be perforated, the punching operation on the lower substrate 20 is reduced, and the process steps are fewer. Although the heat sink 70 is not directly in contact with the air around the display panel, the heat transferred to the heat sink 70 can penetrate the lower substrate 20 to dissipate the heat to the surrounding environment.
Referring to fig. 3, in a second arrangement, the heat sink 70 is disposed on a side of the lower substrate 20 facing away from the heat conducting member 60. In this way, through holes are provided on the lower substrate 20, and the heat conductive member 60 is connected to the heat sink 70 through the through holes. The heat sink 70 is located outside the display panel and directly contacts air around the display panel. In this way, the heat of the heat sink 70 can more rapidly accomplish heat dissipation.
In addition, in order to make the structure simpler, the arrangement of the heat sink 70 can be reduced. For example, the lower substrate 20 is provided with heat conducting holes, the heat conducting holes are arranged corresponding to the heat conducting members 60, and the heat conducting members 60 extend towards the heat conducting holes and at least partially fill the heat conducting holes. By providing the heat conduction holes on the lower substrate 20, the heat conduction member 60 can be directly contacted with the external environment, thereby improving heat dissipation efficiency. The heat conductive member 60 may be embedded in the heat conductive hole or may be flush with the lower surface of the lower substrate 20.
In order to ensure smooth heat transfer, the transparent heat conducting layer 50 is graphene, and the heat conducting member 60 is cured silver paste. The graphene has excellent heat conduction performance, and the heat conduction coefficient of the graphene can reach 5300W/mK, so that the heat generated by the luminous element 40 can be rapidly transferred. The heat conductive member 60 is a solidified silver paste, which is prepared from silver or a compound thereof, a flux, an adhesive and a diluent, and the metallic silver particles are the main components of the silver paste. The silver paste also has excellent heat conducting property, and the heat of the graphene is transferred to the silver paste and then radiated through the silver paste.
The light-transmitting and heat-conducting layer 50 may be a carbon nanotube, in addition to graphene. The heat conductive member 60 may be made of other materials, such as graphene or carbon nanotubes, copper, or gold, which are the same as the transparent heat conductive layer 50.
Further, silver paste is selected as the material of the heat conductive member 60, and the silver paste is used to have a certain fluidity. If other metal materials are selected to be difficult to achieve the required thickness by plating, the heat conducting member 60 may have a low thickness, and it may be difficult to effectively connect the light-transmitting heat conducting layer 50 with the external environment. Through the mode of filling, utilize the mobility of silver thick liquid can fill up the louvre, guarantee the transmission effect of heat.
Further, the materials of the transparent heat conducting layer 50 and the heat conducting member 60 may be the same, for example, the transparent heat conducting layer 50 and the heat conducting member 60 are both graphene.
Further, the heat sink 70 may be made of the same material as the heat conductive member 60, and is made of solidified silver paste. The heat sink 70 may be made of a metal having a good heat conduction effect, such as aluminum metal or copper metal.
In order to ensure that the light of the light-emitting part 40 can pass through the light-transmitting and heat-dissipating layer, the thickness of the graphene is L which is less than or equal to 0.3nm, the visible light transmittance of the graphene is T which is more than or equal to 97%; when the thickness of the graphene is 0.3nm, the transmittance of visible light is generally 97%, and the shielding of the light by the 97% transmittance is very small, so that the picture display of the display panel is not basically affected. Thus, the thickness of graphene is controlled to be less than or equal to 0.3nm, for example, 0.3nm, 0.2nm, or 0.1nm.
In addition, in order to ensure the heat dissipation effect, the diameter of the heat conducting member 60 is d, and d is not less than 0.5um. The heat conductive member 60 may be understood as a columnar structure, d being the diameter of the heat conductive member 60 if it is cylindrical, and d being the cross-sectional side length of the heat conductive member 60 if it is square cylindrical. The cylindrical heat conductive member 60 is convenient to process, and can ensure the heat transfer effect when the diameter of the heat conductive member 60 is 0.5um.
In order to improve the protection of the light emitting element 40, the display panel further includes a packaging layer 80, the packaging layer 80 is disposed on a side of the lower substrate 20 facing the upper substrate 10, the packaging layer 80 is provided with a plurality of mounting vacancies, each mounting vacancy corresponds to a pixel area, the light emitting element 40 is disposed in the mounting vacancies, the light-transmitting heat conducting layer 50 is disposed between the packaging layer 80 and the color film layer 30, the packaging layer 80 is provided with heat dissipation holes, and the heat conducting element 60 penetrates through the heat dissipation holes and is connected with the light-transmitting heat conducting layer 50.
The encapsulation layer 80 is disposed around the light emitting element 40 to form a half-package on the light emitting element 40, thereby protecting the light emitting element 40 and making the light emitting element 40 more firmly fixed. The encapsulation layer 80 can also insulate the effects of outside moisture.
The color film layer 30 is provided with a matrix layer 301, the matrix layer 301 separates pixel regions with different colors, and the materials of the encapsulation layer 80 and the matrix layer 301 may be the same. Of course, the materials may also be different, for example, the carbon black ratio in the matrix layer 301 is higher than that in the encapsulation layer 80.
The light emitted by the light emitting element 40 is emitted towards the periphery, if the height of the encapsulation layer 80 is higher than that of the light emitting element 40, the light emitted by the light emitting element 40 will be blocked by the encapsulation layer 80, the angle of the light emitted by the light emitting element 40 becomes smaller, and the situation that the light cannot cover the color film layer 30 corresponding to the pixel area may occur. For this purpose, the luminous element 40 is arranged in at least two ways.
The first arrangement is that the side of the light emitting element 40 facing the light-transmitting and heat-conducting layer 50 is flush with the side of the encapsulation layer 80 facing the light-transmitting and heat-conducting layer 50.
The second arrangement mode is that one surface of the light emitting element 40 facing the light-transmitting heat conducting layer 50 protrudes from one surface of the encapsulation layer 80 facing the light-transmitting heat conducting layer 50. It can be known from the above two light emitting arrangements that the height of the light emitting element 40 is equal to the height of the encapsulation layer 80, or the light emitting element 40 is slightly higher than the encapsulation layer 80. In this way, the light shielding of the light emitting element 40 is reduced, so that the light of the light emitting element 40 can cover the color film layer 30 corresponding to the pixel area.
Referring to fig. 4 and 5, in order to reduce the number of process steps when the heat conductive member 60 is provided, the partial hole segment arrangement of the heat dissipation holes may be completed at the same time when the driving transistor 90 is provided. The driving transistor 90 may be one of LTPS (Low Temperature Poly-Silicon) low temperature polysilicon, IGZO (Indium Gallium Zinc Oxide) indium gallium zinc Oxide, oxide TFT (Oxide thin-film transistor) Oxide thin film transistor. Specifically, the encapsulation layer 80 includes a buffer layer 810, an insulating layer 820, a first dielectric layer 830, a second dielectric layer 840, a flat layer 850 and a retaining wall 860, where the buffer layer 810, the insulating layer 820, the first dielectric layer 830, the second dielectric layer 840, the flat layer 850 and the retaining wall 860 are sequentially arranged from the lower substrate 20 to the upper substrate 10, and the retaining wall 860 forms an installation vacancy; the retaining wall 860 is formed of a material surrounding the luminous element 40.
The display panel includes a driving transistor 90, the driving transistor 90 includes a source drain layer 910, an active layer 920 and a gate layer 930, the active layer 920 is disposed between the buffer layer 810 and the insulating layer 820, the gate layer 930 is disposed between the insulating layer 820 and the first dielectric layer 830, and the source drain layer 910 is disposed between the second dielectric layer 840 and the flat layer 850.
The display panel further includes an electrode layer 410, the electrode layer 410 being disposed in the mounting space and connected to one electrode of the light emitting device 40, the electrode layer 410 being connected to the source and drain layer 910 through the first through hole 902. The source and drain layer 910 includes a source electrode and a drain electrode, and the electrode layer 410 is provided with two electrodes, one connected to the anode of the light emitting element 40 and the other connected to the cathode of the light emitting element 40. The driving transistor 90 may supply power to the light emitting element 40, for example, a drain electrode is connected to one of the electrode layers 410, and the electrode layer 410 is connected to an anode electrode of the light emitting element 40.
The source drain layer 910 is connected to the active layer 920 through a second via 903, the first via 902 passes through the planarization layer 850, and the second via 903 passes through the insulation layer 820, the first dielectric layer 830, and the second dielectric layer 840, wherein when the heat sink 70 is located on the upper surface of the upper substrate 10, holes are simultaneously formed in the buffer layer 810 and the insulation layer 820 to deposit the heat sink 70 on the upper surface of the upper substrate 10. Therefore, the number of the process steps for independently arranging the heat dissipation holes can be reduced, and the process time can be shortened.
Taking the example that the heat sink 70 is disposed on the upper surface of the lower substrate 20, for example: a buffer layer 810 is disposed on the lower substrate 20, and the buffer layer 810 is not separately perforated. An active layer 920 is provided on the upper surface of the buffer layer 810, an insulating layer 820 is provided on the active layer 920, and simultaneously, holes are formed in the insulating layer 820 and the buffer layer 810. Thereby saving a yellow light process. A metal layer is deposited at the open locations to form the heat sink 70. A gate layer 930 is disposed on the insulating layer 820, and a first dielectric layer 830 is disposed on the gate layer 930. The first dielectric layer 830 simultaneously overlies the heat sink 70. A capacitor layer 901 is disposed on the first dielectric layer 830, where the capacitor layer 901 is an electrode plate of the capacitor. A second dielectric layer 840 is disposed over the capacitive layer 901. A source-drain layer 910 is disposed on the second dielectric layer 840, and a via hole is disposed between the source-drain layer 910 and the active layer 920, and the active layer 920 is connected to the source and the drain in the source-drain layer 910, respectively. A planarization layer 850 is provided on the source/drain layer 910, and an electrode layer 410 is provided on the planarization layer 850 while forming an opening in the planarization layer 850, and the electrode layer 410 is connected to a source or a drain through the opening in the planarization layer 850. The light emitting member 40 is transferred onto an electrode layer 410, the electrode layer 410 having a positive electrode layer 410 and a negative electrode layer 410, the anode of the light emitting member 40 being connected to the positive electrode layer 410, and the cathode of the light emitting member 40 being connected to the negative electrode layer 410. The periphery of the luminous element 40 is provided with a retaining wall 860, and the retaining wall 860 completes the encapsulation of the luminous element 40. The heat conducting member 60 is formed by perforating the retaining wall 860 at a position corresponding to the heat sink 70 to expose the heat sink 70 and pouring silver paste at a position corresponding to the perforation. A light-transmitting and heat-conducting layer 50 is provided on the upper surface of the light-emitting member 40, and the light-transmitting and heat-conducting layer 50 covers the upper surface of the light-emitting member 40 and simultaneously covers the upper surface of the heat-conducting member 60. Thereby realizing the connection of the light-transmitting heat-conducting layer 50, the heat-conducting member 60 and the heat sink 70.
Example two
The application further provides a display device, the display device includes a color film packaging layer 302, the display device further includes a display panel as above, the color film packaging layer 302 is disposed on one side of the color film layer 30 facing the lower substrate 20, and the color film packaging layer 302 is used for packaging and protecting the color film layer 30.
Referring to fig. 6, a plurality of heat conductive members 60 are provided, and at least one heat conductive member 60 is disposed at a side of each light emitting member 40. Thereby, the heat dissipation effect of the light emitting element 40 is improved by the plurality of heat conducting elements 60.
The embodiments of the display device of the present invention include all the technical solutions of all the embodiments of the display panel, and the achieved technical effects are also completely the same, and are not described herein again.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. The utility model provides a display panel, display panel includes upper base plate and lower base plate, upper base plate with lower base plate sets up relatively, upper base plate towards lower base plate one side sets up color film layer, lower base plate towards one side of upper base plate sets up the light-emitting component, color film layer includes a plurality of pixel areas, every the pixel area corresponds and sets up one the light-emitting component, its characterized in that, display panel still includes:
the light-transmitting heat-conducting layer is arranged between the color film layer and the luminous piece, and the radiating surface of the luminous piece is arranged towards the light-transmitting heat-conducting layer;
the heat conduction piece is close to the luminous piece, one end of the heat conduction piece is connected with the light-transmitting heat conduction layer, and the other end of the heat conduction piece extends to the lower substrate.
2. The display panel according to claim 1, further comprising a heat sink disposed at an end of the heat conductive member away from the light-transmitting heat conductive layer, wherein a projected area of the heat sink on the lower substrate is larger than a projected area of the heat conductive member on the lower substrate.
3. The display panel according to claim 2, wherein the heat sink is provided on a side of the lower substrate facing the heat conductive member;
or, the heat sink is disposed on a side of the lower substrate facing away from the heat conducting member.
4. The display panel according to claim 1, wherein the lower substrate is provided with a heat conduction hole, the heat conduction hole is provided corresponding to the heat conduction member, and the heat conduction member extends toward the heat conduction hole and at least partially fills the heat conduction hole.
5. The display panel according to any one of claims 1 to 4, wherein the light-transmitting heat-conducting layer is graphene and the heat-conducting member is cured silver paste.
6. The display panel according to claim 5, wherein the thickness of the graphene is L, L is less than or equal to 0.3nm, the visible light transmittance of the graphene is T, and T is more than or equal to 97%;
the diameter of the heat conducting piece is d, and d is more than or equal to 0.5um.
7. The display panel according to any one of claims 1 to 4, further comprising an encapsulation layer disposed on a side of the lower substrate facing the upper substrate, the encapsulation layer being provided with a plurality of mounting vacancies each corresponding to one of the pixel regions, the light emitting member being disposed in the mounting vacancies, the light-transmitting heat conductive layer being disposed between the encapsulation layer and the color film layer, the encapsulation layer being provided with a heat dissipation hole, the heat conductive member penetrating through the heat dissipation hole and being connected to the light-transmitting heat conductive layer.
8. The display panel according to claim 7, wherein a face of the light emitting member facing the light-transmitting and heat-conducting layer is flush with a face of the encapsulation layer facing the light-transmitting and heat-conducting layer;
or, the surface of the light emitting piece facing the light-transmitting heat conducting layer protrudes out of the surface of the packaging layer facing the light-transmitting heat conducting layer.
9. The display panel of claim 7, wherein the encapsulation layer comprises a buffer layer, an insulating layer, a first dielectric layer, a second dielectric layer, a flat layer, and a retaining wall, the buffer layer, the insulating layer, the first dielectric layer, the second dielectric layer, the flat layer, and the retaining wall being sequentially disposed from the lower substrate to the upper substrate, the retaining wall forming the mounting void;
the display panel comprises a driving transistor, wherein the driving transistor comprises a source-drain layer, an active layer and a grid electrode layer, the active layer is arranged between the buffer layer and the insulating layer, the grid electrode layer is arranged between the insulating layer and the first dielectric layer, and the source-drain layer is arranged between the second dielectric layer and the flat layer;
the display panel further comprises an electrode layer which is arranged in the mounting vacancy and is connected with one electrode of the light emitting piece, the electrode layer is connected with the source drain layer through a first through hole, the source drain layer is connected with the active layer through a second through hole, the first through hole penetrates through the flat layer, and the second through hole penetrates through the insulating layer, the first dielectric layer and the second dielectric layer;
and when the radiating fin is positioned on the upper surface of the upper substrate, holes are synchronously formed in the buffer layer and the insulating layer, so that the radiating fin is deposited on the upper surface of the upper substrate.
10. A display device comprising a color film packaging layer, wherein the display device further comprises a display panel according to any one of claims 1 to 9, the color film packaging layer is disposed on a side of the color film layer facing the lower substrate, the plurality of heat conducting members are disposed, and at least one heat conducting member is disposed on a side of each light emitting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310273731.2A CN116130583A (en) | 2023-03-17 | 2023-03-17 | Display panel and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310273731.2A CN116130583A (en) | 2023-03-17 | 2023-03-17 | Display panel and display device |
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| Publication Number | Publication Date |
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| CN116130583A true CN116130583A (en) | 2023-05-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310273731.2A Pending CN116130583A (en) | 2023-03-17 | 2023-03-17 | Display panel and display device |
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| CN (1) | CN116130583A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705827A (en) * | 2023-08-04 | 2023-09-05 | 季华实验室 | Display panel and preparation method thereof |
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2023
- 2023-03-17 CN CN202310273731.2A patent/CN116130583A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116705827A (en) * | 2023-08-04 | 2023-09-05 | 季华实验室 | Display panel and preparation method thereof |
| CN116705827B (en) * | 2023-08-04 | 2023-12-05 | 季华实验室 | Display panel and preparation method thereof |
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