CN111710635A - Automatic crystal removing machine and crystal removing method - Google Patents
Automatic crystal removing machine and crystal removing method Download PDFInfo
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- CN111710635A CN111710635A CN202010835706.5A CN202010835706A CN111710635A CN 111710635 A CN111710635 A CN 111710635A CN 202010835706 A CN202010835706 A CN 202010835706A CN 111710635 A CN111710635 A CN 111710635A
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- 239000013078 crystal Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 153
- 235000012431 wafers Nutrition 0.000 claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000011084 recovery Methods 0.000 claims abstract description 22
- 238000007790 scraping Methods 0.000 claims description 21
- 238000003825 pressing Methods 0.000 claims description 18
- 238000013459 approach Methods 0.000 claims description 5
- 230000003028 elevating effect Effects 0.000 abstract description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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Abstract
The application provides an automatic crystal removing machine and a crystal removing method; the automatic crystal removing machine comprises: a frame; a track mechanism for transferring the substrate; the crystal removing mechanism is used for removing and sucking the wafer on the substrate; the gantry moving table is used for driving the crystal removing mechanism to move on the horizontal plane above the track mechanism along two directions which are vertical to each other; the recovery mechanism is used for recovering the scraped wafers on the substrate; the crystal removing mechanism comprises a scraper and a lifting mechanism, wherein the scraper is used for removing the wafers on the substrate and sucking the removed wafers to the recovery mechanism, the lifting mechanism is used for driving the scraper to lift, and the lifting mechanism is arranged on the gantry moving table. This application goes brilliant machine automatically, conveys the base plate through rail mechanism, will scrape through longmen mobile station and elevating system and get the ware and remove the wafer department that needs removed to drive and scrape the ware and scrape this wafer and leave the base plate and absorb recovery mechanism, scrape from and retrieve with the automation that realizes the wafer, need not the manual work, it is efficient.
Description
Technical Field
The application belongs to the technical field of die bonding, and particularly relates to an automatic die removing machine and a die removing method.
Background
A Light Emitting Diode (LED) is a Light Emitting element that converts electrical energy into Light energy. With the maturity of LED technology, LED products are gradually applied to the fields of illumination, display, signal indication, and the like. Users have higher requirements on the quality uniformity of the LED products, and particularly the color temperature, brightness, color development and the like of the LED are required to have good consistency. Along with this, higher requirements are also made on die bonding precision, and various errors in the die bonding process of the LED may cause die bonding failure or die bonding failure. At this time, the wafer that has failed in die bonding needs to be scraped off from the substrate and die bonding needs to be performed again. In the past, scraping work is carried out manually, but the wafer is very small and difficult to distinguish by naked eyes, so that the manual scraping speed is very slow, and the efficiency is extremely low.
Disclosure of Invention
An object of the embodiments of the present application is to provide an automatic crystal removing machine and a crystal removing method, so as to solve the problem of low efficiency caused by manual removal of a wafer on a substrate in the related art.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions: provided is an automatic crystal removing machine comprising:
a frame;
a track mechanism for transferring the substrate;
the crystal removing mechanism is used for removing and sucking the wafer on the substrate;
the gantry moving table is used for driving the crystal removing mechanism to move on the horizontal plane above the track mechanism along two directions which are vertical to each other; and the number of the first and second groups,
the recovery mechanism is used for recovering the scraped wafers on the substrate;
the track mechanism is arranged on the rack, the crystal removing mechanism is arranged on the gantry moving table, and the gantry moving table is arranged on the rack;
the crystal removing mechanism comprises a scraper used for removing the wafer on the substrate and sucking the removed wafer and a lifting mechanism driving the scraper to lift, and the lifting mechanism is arranged on the gantry moving table;
the recovery mechanism comprises a collection box communicated with the scraper, a filter communicated with the collection box, an electromagnetic valve used for connecting a vacuumizing source and a collection plate, wherein the electromagnetic valve is communicated with the filter, the collection box, the filter and the electromagnetic valve are arranged on the collection plate, and the collection plate is supported on the gantry moving table.
In an optional embodiment, the scraper comprises a crystal suction cylinder for sucking the wafer and a scraping needle arranged at the lower end of the crystal suction cylinder, and the crystal suction cylinder is mounted on the lifting mechanism.
In an optional embodiment, the scraping needle is arranged on one side of the lower end face of the crystal suction cylinder.
In an optional embodiment, the scraper further comprises a barrel sleeve sleeved on the crystal suction barrel, a ring table fixed on the crystal suction barrel, a spring sleeved on the crystal suction barrel and a pressing sleeve sleeved on the crystal suction barrel, the pressing sleeve is connected with the upper end of the barrel sleeve, two ends of the spring respectively support the ring table and the pressing sleeve, the ring table is slidably arranged in the barrel sleeve, a limiting table for stopping and positioning the ring table is arranged in the barrel sleeve, and the barrel sleeve is connected with the lifting mechanism.
In an optional embodiment, a slide way opening is formed in the barrel sleeve along the axial direction of the barrel sleeve, and a guide rod which is arranged in the slide way opening in a sliding mode is installed on the crystal absorption barrel.
In an optional embodiment, the de-crystallizing mechanism further comprises a lens module for capturing an image of the wafer on the substrate, and the lens module is mounted on the gantry.
In an optional embodiment, the de-crystallizing mechanism further comprises a code scanning gun for scanning the substrate codes, and the code scanning gun is mounted on the gantry moving table.
In an alternative embodiment, the track mechanism comprises:
a conveyor belt for conveying the substrate;
a plurality of support wheels which are matched with and support the conveyor belt;
a guide plate; and the number of the first and second groups,
the conveying motor is connected with one of the plurality of supporting wheels corresponding to the conveying belt;
the conveying motor is arranged on the guide plate, the supporting wheels are rotatably arranged on the guide plate, and the guide plate is supported on the rack.
In an optional embodiment, the guide plates are two guide plates arranged side by side, each guide plate is provided with a plurality of support wheels, the number of the conveyor belts is two, the plurality of support wheels on each guide plate support one conveyor belt in a matched manner, each guide plate is provided with the conveyor motor, the track mechanism further comprises a support plate and a linear driver for driving the two guide plates to approach or separate from each other, the support plate is mounted on the frame, one guide plate is fixed on the support plate, the other guide plate is slidably mounted on the support plate, the linear driver is mounted on the support plate, and the other guide plate is connected with the linear driver.
Another object of the present application is to provide a crystal removing method, including the automatic crystal removing machine according to any of the above embodiments, the crystal removing method further includes:
the track mechanism conveys the substrate to the position below the crystal removing mechanism;
the gantry moving table drives the crystal removing mechanism to move on a horizontal plane, so that the scraper of the crystal removing mechanism is opposite to the wafer to be removed;
the lifting mechanism drives the scraper to be close to the substrate;
the gantry moving table drives the scraper to move horizontally so as to scrape the wafer on the substrate;
and after being sucked by the scraper, the scraped wafer enters a collection box of the recovery mechanism for recovery.
The automatic crystal removing machine and the crystal removing method provided by the embodiment of the application have the beneficial effects that: compared with the prior art, this application removes brilliant machine conveys the base plate through rail mechanism, will scrape through longmen mobile station and elevating system and get the ware and remove the wafer department that needs removed to drive and scrape the ware and scrape this wafer and draw from the base plate, rethread recovery mechanism retrieves, scrape with the automation that realizes the wafer and retrieve, need not the manual work, and is efficient.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an automatic crystal remover according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural view of the track mechanism of FIG. 1;
FIG. 3 is an exploded view of the track mechanism of FIG. 2;
FIG. 4 is a schematic structural diagram of the gantry moving table in FIG. 1;
FIG. 5 is a first schematic structural diagram of the decrystallization mechanism and the recycling mechanism in FIG. 1;
FIG. 6 is a second schematic structural view of the decrystallization mechanism and the recycling mechanism in FIG. 1;
FIG. 7 is a schematic view of the scraper of FIG. 5;
fig. 8 is an exploded view of the scraper of fig. 7.
Wherein, in the drawings, the reference numerals are mainly as follows:
100-an automatic crystal removing machine;
10-a frame;
20-a track mechanism; 21-a guide plate; 22-a conveyor belt; 23-a support wheel; 24-a conveyor motor; 251-a linear drive; 252-a support plate; 253-a guide rail; 254-a slide mount; 26-a holding assembly; 261-pressing the frame; 262-a pallet; 263-a lifter; 27-a positioning assembly; 271-a baffle plate; 272-a lift drive;
30-a gantry mobile station; 31-a support seat; 32-a longitudinal mover; 33-a lateral mover; 34-a fixing frame; 341-a first scaffold; 342-a second bracket; 35-a slide rail; 36-a slide block;
40-a crystal removing mechanism; 41-a lifting mechanism; 411-a support frame; 412-a lift motor; 413-vertical screw; 414-lifting nut; 415-a hinged seat; 416-a mounting plate; 417-a guide rail; 418-a slider; 42-a scraper; 421-crystal sucking cylinder; 422-scraping needle; 423-cylinder sleeve; 4231-a limit table; 4232-slideway crossing; 424-ring table; 425-a spring; 426-pressing sleeve; 427-a guide rod; 43-a support arm; 44-a code scanning gun; 45-a lens module;
50-a recovery mechanism; 51-a collection box; 52-a filter; 53 electromagnetic valve-; 54-collecting plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be a mechanical connection; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Reference throughout this specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 and 5, an automatic crystal remover 100 provided by the present application will now be described. The automatic crystal removing machine 100 comprises a rack 10, a track mechanism 20, a crystal removing mechanism 40, a gantry moving platform 30 and a recovery mechanism 50; the track mechanism 20 and the gantry mobile platform 30 are arranged on the frame 10, and the crystal removing mechanism 40 is arranged on the gantry mobile platform 30. The rail mechanism 20 is used for transferring the substrate to the wafer-removing mechanism 40, and the gantry 30 is used for driving the wafer-removing mechanism 40 to move in two directions perpendicular to each other on a horizontal plane above the rail mechanism 20 so as to move the wafer-removing mechanism 40 to a wafer to be removed on the substrate in the rail mechanism 20.
Referring to fig. 5 and 6, the crystal removing mechanism 40 includes a scraper 42 and a lifting mechanism 41, the lifting mechanism 41 is installed on the gantry 30, the scraper 42 is used for removing the wafer on the substrate and sucking the removed wafer to the recovery mechanism 50, so that when the gantry 30 moves the scraper 42 to the position above the wafer to be removed on the substrate in the track mechanism 20, the lifting mechanism 41 drives the scraper 42 to move downwards to the corresponding wafer, then the gantry 30 drives the scraper 42 to move horizontally to scrape off the wafer from the substrate, and the scraped wafer is sucked by the scraper 42, thereby realizing automatic removal of the wafer on the substrate with high efficiency. The recovery mechanism 50 is mounted on the gantry 30, the recovery mechanism 50 is driven by the gantry 30 to move along with the crystal removing mechanism 40, and the recovery mechanism 50 is connected with the scraper 42 and used for recovering the wafers scraped from the base.
In one embodiment, referring to fig. 5, the recycling mechanism 50 includes a collecting box 51, a filter 52, a solenoid valve 53 and a collecting plate 54, wherein the collecting box 51, the filter 52 and the solenoid valve 53 are all mounted on the collecting plate 54, and the collecting plate 54 is mounted on the gantry 30; the collecting box 51 is communicated with the scraper 42, one end of the filter 52 is communicated with the collecting box 51, the other end of the filter 52 is communicated with the electromagnetic valve 53, and the electromagnetic valve 53 is used for connecting a vacuum source such as a vacuum machine, an air extractor and the like; the collecting box 51 is used for collecting the wafer sucked by the scraper 42, and the filter 52 is communicated with the collecting box 51 and used for filtering the wafer to avoid entering the electromagnetic valve 53; the solenoid valve 53 is used for controlling the on-off of the vacuum source.
The utility model provides an automatic go brilliant machine 100, compare with prior art, this application goes brilliant machine 100 automatically, conveys the base plate through rail mechanism 20, will scrape through gantry mobile station 30 and elevating system 41 and get ware 42 and remove the wafer department that needs the removal to drive and scrape and get ware 42 and scrape this wafer and leave the base plate and absorb, rethread recovery mechanism 50 retrieves, scrape from and retrieve with the automation that realizes the wafer, need not the manual work, and is efficient.
The embodiment of the present application further provides a crystal removing method using the automatic crystal removing machine of the embodiment of the present application, where the crystal removing method includes:
the track mechanism 20 conveys the substrate below the crystal removing mechanism 40;
the gantry moving table 30 drives the wafer removing mechanism 40 to move on a horizontal plane, so that the scraper 42 of the wafer removing mechanism 40 is opposite to the wafer to be removed;
the lifting mechanism 41 drives the scraper 42 to approach the substrate;
the gantry moving table 30 drives the scraper 42 to move horizontally so as to scrape the wafer on the substrate;
the scraped wafers are sucked by the scraper 42 and then collected in a collection box 51 of the collection mechanism 50.
The crystal removing method can realize accurate and automatic removal of the wafer, can also recover the wafer scraped from the substrate, has high efficiency and can reduce resource waste.
In one embodiment, referring to fig. 2 and 3, the track mechanism 20 includes a conveyor belt 22, a plurality of support wheels 23, a guide plate 21, and a conveyor motor 24, the conveyor motor 24 is mounted on the guide plate 21, each support wheel 23 is rotatably mounted on the guide plate 21, the guide plate 21 is supported on the frame 10, the plurality of support wheels 23 cooperate with the support belt 22, and the conveyor motor 24 is connected to one of the support wheels 23, so that the support wheels 23 are driven to rotate by the conveyor motor 24 to drive the conveyor belt 22 to move, thereby conveying the substrate. The track mechanism 20 has a simple structure and low cost. In other embodiments, a linear motion mechanism may be used to push the substrate to effect transfer of the substrate.
In one embodiment, the guide plates 21 are two, the number of the support wheels 23 is two, the support wheels 23 are matched to support one of the conveyor belts 22, and the conveyor motors 24 are arranged on the guide plates 21, so that the conveyor belts 22 on the two guide plates 21 are matched to support two sides of the substrate, and the substrate can be conveyed more stably. In other embodiments, a guide plate 21 may be provided and the substrate may be conveyed by a conveyor belt 22.
In one embodiment, the rail mechanism 20 further includes a support plate 252 and a linear drive 251, the support plate 252 being mounted on the frame 10. Of the two guide plates 21: one guide plate 21 is fixed on the support plate 252, and the other guide plate 21 is slidably mounted on the support plate 252; the linear driver 251 is installed on the support plate 252 and the other guide plate 21 is connected to the linear driver 251, that is, the linear driver 251 is connected to the guide plate 21 slidably installed on the support plate 252, so that the two guide plates 21 can be driven to move closer to or away from each other to adjust the distance between the two guide plates 21, and thus the distance between the two conveyor belts 22, to accommodate substrates of different widths.
In one embodiment, the linear driver 251 may be a linear motor, a lead screw-nut mechanism, a rack and pinion mechanism, or other linear movement mechanism.
In one embodiment, the supporting plate 252 is provided with a guide rail 253 for guiding the movement of the other guide plate 21, the other guide plate 21 is slidably mounted on the guide rail 253, and the guide rail 253 is provided for guiding the other guide plate 21 to slide so as to ensure the smooth sliding of the guide plates 21 and thus the smooth adjustment of the distance between the two guide plates 21.
In one embodiment, the guide rail 253 is provided with a sliding seat 254, and the other guide plate 21 is fixedly connected to the sliding seat 254 so as to guide the other guide plate 21 to move smoothly.
In one embodiment, the track mechanism 20 further comprises a holding assembly 26, the holding assembly 26 being configured to hold the substrate such that the scraper 42 scrapes off the wafer on the substrate. The supporting member 26 includes a pressing frame 261, a supporting plate 262, and a lifter 263. The pressing frame 261 is installed on the guide plate 21 and used for pressing against the side edge of the substrate; the supporting plate 262 is mounted on the lifter 263, the lifter 263 pushes the supporting plate 262 to rise, so as to lift the substrate on the conveyor belt 22 to press against the pressing frame 261, the pressing frame 261 and the supporting plate 262 cooperate to clamp the substrate, and the supporting plate 262 supports the substrate, so that the scraper 42 scrapes the corresponding wafer on the substrate; the lifter 263 descends to drive the support plate 262 to descend, so as to place the substrate on the conveyor belt 22, and the conveyor belt 22 continues to convey the substrate.
In one embodiment, the lifter 263 can be a linear moving mechanism such as a cylinder, a linear motor, or the like.
In one embodiment, the track mechanism 20 further comprises a positioning assembly 27, wherein the positioning assembly 27 positions the substrate when the conveyor 22 transports the substrate, so that the de-crystallizing mechanism 40 positions the wafer on the substrate. The positioning assembly 27 comprises a blocking piece 271 and a lifting driver 272, when the substrate is transferred to the corresponding position of the crystal removing mechanism 40, the lifting driver 272 pushes the blocking piece 271 to ascend so as to stop and position the substrate, thereby positioning the substrate; when the wafer on the substrate is removed, the lifting driver 272 drives the blocking plate 271 to descend, so that the conveyor belt 22 continues to convey the substrate.
In one embodiment, the positioning assembly 27 is coupled to the support assembly 26 to position the substrate via the positioning assembly 27, and the support assembly 26 supports and holds the substrate to better position and hold the substrate for removal of the corresponding wafer from the substrate by the de-wafer mechanism 40.
In one embodiment, the lifting drive 272 may be a linear motion mechanism such as a pneumatic cylinder, linear motor, or the like.
In one embodiment, referring to fig. 1 and 4, the gantry moving table 30 includes a supporting base 31, a longitudinal mover 32, a transverse mover 33 and a fixing frame 34, the longitudinal mover 32 is mounted on the transverse mover 33, the transverse mover 33 is supported on the fixing frame 34, the fixing frame 34 is mounted on the frame 10, the supporting base 31 is mounted on the longitudinal mover 32, and the decrystallization mechanism 40 is mounted on the supporting base 31, so that the supporting base 31 is driven by the longitudinal mover 32 to move longitudinally, i.e., along the conveying direction of the track mechanism 20, to drive the decrystallization mechanism 40 to move longitudinally; the transverse shifter 33 drives the longitudinal shifter 32 to move along the direction perpendicular to the conveying direction so as to drive the crystal removing mechanism 40 to move transversely, so that the crystal removing mechanism 40 is driven to move along two directions perpendicular to each other on the horizontal table. Of course, in other embodiments, the supporting seat 31 may be mounted on the lateral mover 33, the lateral mover 33 may be mounted on the longitudinal mover 32, and the longitudinal mover 32 may be mounted on the fixed frame 34.
In one embodiment, the longitudinal mover 32 may be a linear motor, a lead screw-nut mechanism, a rack and pinion mechanism, or other linear movement mechanism.
In one embodiment, the lateral mover 33 may be a linear motor, a lead screw-nut mechanism, a rack and pinion mechanism, or other linear moving mechanism.
In one embodiment, the fixing frame 34 includes a first bracket 341 and a second bracket 342, the first bracket 341 is disposed across the rail mechanism 20, the second bracket 342 is disposed across the rail mechanism 20, the lateral shifter 33 is mounted on the first bracket 341, one end of the longitudinal shifter 32 is mounted on the lateral shifter 33, and the other end of the longitudinal shifter 32 is slidably supported on the second bracket 342. The structure can more stably support the transverse mover 33 and the longitudinal mover 32, so that the transverse mover 33 and the longitudinal mover 32 can drive the supporting seat 31 to stably move on the horizontal plane, and further, the crystal removing mechanism 40 can be stably driven to move on the horizontal plane.
In one embodiment, the second bracket 342 is provided with a slide rail 35, the slide rail 35 is provided with a slide block 36, and the slide block 36 is connected with the other end of the longitudinal mover 32, so that the transverse mover 33 can drive the longitudinal mover 32 to move more smoothly.
In one embodiment, referring to fig. 5, the decrystallization mechanism 40 further includes a support arm 43, the scraper 42 is mounted on the support arm 43, and the support arm 43 is connected to the lifting mechanism 41. A support arm 43 is provided to fix the scraper 42 to the elevating mechanism 41. In some embodiments, the scraper 42 may also be directly fixed to the lifting mechanism 41.
In one embodiment, the lifting mechanism 41 includes a support frame 411, a mounting plate 416, a guide rail 417, a sliding block 418, a vertical screw 413, a lifting nut 414, a hinge seat 415 and a lifting motor 412, the guide rail 417 is vertically installed on the support frame 411, the sliding block 418 is slidably installed on the guide rail 417, the lifting nut 414 and the sliding block 418 are connected to the mounting plate 416, the lifting nut 414 is installed on the vertical screw 413, the vertical screw 413 is rotatably installed on the hinge seat 415, the hinge seat 415 is installed on the support frame 411, the lifting motor 412 is supported on the support frame 411, the lifting motor 412 is connected to the vertical screw 413, and the lifting motor 412 drives the vertical screw 413 to rotate so as to drive the lifting nut 414 to drive the mounting plate 416 to lift, thereby realizing the. In other embodiments, the lifting mechanism 41 may also be a linear motor, a rack and pinion mechanism, or the like.
In one embodiment, referring to fig. 5 and 6, in one embodiment, the recovery mechanism 50 is mounted on the support frame 411. Such as the collecting box 51, may be mounted on the supporting frame 411. In some embodiments, the recovery mechanism 50 is mounted on the support base 31, such as the collection cassette 51 may be mounted on the support base 31.
In one embodiment, the deglazing mechanism 40 further comprises a lens module 45, the lens module 45 is used for capturing the image of the wafer on the substrate, the lens module 45 is mounted on the gantry 30, and the lens module 45 is configured to accurately position the wafer on the substrate for the corresponding wafer to be scraped by the scraper 42. In one embodiment, the lens module 45 is mounted on the supporting frame 411. In some embodiments, the lens module 45 can be mounted on the supporting base 31.
In one embodiment, the de-crystallizing mechanism 40 further comprises a code scanning gun 44, the code scanning gun 44 is used for scanning the substrate code, and the code scanning gun 44 is installed on the gantry 30 so as to identify the corresponding substrate and further clean the corresponding wafer on the substrate. In one embodiment, the yard scanning gun 44 is mounted on a support bracket 411. In still other embodiments, the yard scanning gun 44 may be mounted on the support base 31.
In one embodiment, referring to fig. 7 and 8, the scraper 42 includes a wafer suction cylinder 421 and a scraping needle 422, the wafer suction cylinder 421 is installed on the lifting mechanism 41, the scraping needle 422 is installed at a lower end of the wafer suction cylinder 421, the wafer suction cylinder 421 is used for sucking a wafer, for example, the wafer suction cylinder 421 may be connected to a vacuum source such as a vacuum machine, an air extractor, etc., and when the scraping needle 422 scrapes off a corresponding wafer on a substrate, the wafer suction cylinder 421 may suck the wafer to recover the wafer. In other embodiments, the scraper 42 may include a scraper blade and a suction cylinder, the scraper blade being arranged side by side with the suction cylinder and being sucked by the suction cylinder after the scraper blade scrapes off the wafer.
In one embodiment, the suction cylinder 421 communicates with the cassette 51 so that the sucked wafer can be stored and retrieved in the cassette 51.
In one embodiment, the scraping needle 422 is disposed on one side of the lower end surface of the wafer suction cylinder 421, the structure can be sucked by the wafer suction cylinder 421 when the scraping needle 422 scrapes a wafer, and the structure can realize integration of the scraping needle 422 and the wafer suction cylinder 421, reduce the volume and improve the integration level. In one embodiment, the scraping needle 422 and the crystal suction cylinder 421 may be an integral molding member to ensure that the scraping needle 422 and the crystal suction cylinder 421 are firmly connected.
In some embodiments, the scraping needle 422 may also be supported by a support rod at the middle position of the lower end of the crystal suction cylinder 421, and this structure can be sucked and recovered by the crystal suction cylinder 421 when the scraping needle 422 scrapes off the wafer in any direction.
In one embodiment, the scraper 42 further includes a cylinder sleeve 423, a ring 424, a spring 425 and a pressing sleeve 426, the cylinder sleeve 423 is sleeved on the crystal suction cylinder 421, the ring 424 is fixed on the crystal suction cylinder 421, the ring 424 is slidably disposed in the cylinder sleeve 423, so that the crystal suction cylinder 421 and the ring 424 can slide in the cylinder sleeve 423, and a limit table 4231 is disposed in the cylinder sleeve 423, so as to function as a stop and position the ring 424, and prevent the crystal suction cylinder 421 from sliding off the cylinder sleeve 423. The pressing sleeve 426 is connected with the upper end of the cylinder sleeve 423, and the pressing sleeve 426 is sleeved on the crystal absorbing cylinder 421, so that the crystal absorbing cylinder 421 can slide in the pressing sleeve 426; the spring 425 is sleeved on the wafer suction cylinder 421, and two ends of the spring 425 respectively abut against the ring table 424 and the pressing sleeve 426, so that the wafer suction cylinder 421 can move up and down elastically in the cylinder sleeve 423, when the lifting mechanism 41 drives the scraper 42 to descend, and when the scraper 422 abuts against the substrate, an elastic buffering effect can be achieved to protect the scraper 422, and the scraper 422 elastically abuts against the substrate, so that the scraper 422 can better scrape off a wafer on the substrate.
In one embodiment, the barrel 423 is provided with a chute port 4232 along the axial direction of the barrel 423, the crystal absorbing barrel 421 is provided with a guide rod 427 slidably disposed in the chute port 4232, and the crystal absorbing barrel 421 can be prevented from rotating in the barrel 423 by the cooperation of the guide rod 427 and the chute port 4232, so that the scraping needle 422 can be better positioned. Of course, in some embodiments, the cross-sectional profile of the crystal suction cylinder 421 may be triangular, square, etc., and the shape of the cylinder 423 is adapted to the shape of the crystal suction cylinder 421, so as to perform the positioning function.
The working process of the automatic crystal removing mechanism 100 of the application is as follows:
the rail mechanism 20 transmits the substrate to the corresponding position of the crystal removing mechanism 40, the gantry moving platform 30 drives the crystal removing mechanism 40 to move on the horizontal plane, so that the scraping needle 422 of the crystal removing mechanism 40 is positioned above the wafer to be removed on the substrate, the lifting mechanism 41 drives the scraper 42 to descend, so that the scraping needle 422 approaches the substrate, the gantry moving platform 30 drives the crystal removing mechanism 40 to move horizontally, so that the scraping needle 422 scrapes the corresponding wafer, when the wafer is scraped from the substrate, the crystal suction cylinder 421 sucks the wafer, and the wafer is recovered by the recovery mechanism 50; then the lifting mechanism 41 drives the scraper 42 to ascend; the gantry moving table 30 drives the crystal removing mechanism 40 to the next wafer to be removed to remove the next wafer, so that the wafers are automatically scraped and recovered.
The automatic crystal removing mechanism 100 can conveniently connect with a wafer processing device by using the track mechanism 20 to transfer the substrate. In addition, can realize removing the brilliant automatically, it is efficient to can use manpower sparingly the cost and reduce manual work error, practice thrift enterprise manufacturing cost. In addition, the automatic crystal removing machine 100 has the advantages of simple structure, low cost and small occupied area.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. Automatic go brilliant machine, its characterized in that includes:
a frame (10);
a rail mechanism (20) for conveying the substrate;
the crystal removing mechanism (40) is used for removing and sucking the wafer on the substrate;
the gantry moving table (30) is used for driving the crystal removing mechanism (40) to move on a horizontal plane above the track mechanism (20) along two directions which are vertical to each other; and the number of the first and second groups,
a recovery mechanism (50) for recovering the scraped wafers on the substrate;
the track mechanism (20) is arranged on the rack (10), the crystal removing mechanism (40) is arranged on the gantry moving table (30), and the gantry moving table (30) is arranged on the rack (10);
the crystal removing mechanism (40) comprises a scraper (42) for removing the wafer on the substrate and sucking the removed wafer and a lifting mechanism (41) for driving the scraper (42) to lift, and the lifting mechanism (41) is arranged on the gantry moving table (30);
the recovery mechanism (50) comprises a collection box (51) communicated with the scraper (42), a filter (52) communicated with the collection box (51), an electromagnetic valve (53) used for connecting a vacuum source and a collection plate (54), wherein the electromagnetic valve (53) is communicated with the filter (52), the collection box (51), the filter (52) and the electromagnetic valve (53) are installed on the collection plate (54), and the collection plate (54) is supported on the gantry moving table (30).
2. The automatic crystal removing machine according to claim 1, wherein the scraper (42) comprises a crystal suction cylinder (421) for sucking the wafer and a scraping needle (422) arranged at the lower end of the crystal suction cylinder (421), and the crystal suction cylinder (421) is mounted on the lifting mechanism (41).
3. The automatic crystal removing machine as claimed in claim 2, wherein the scraping needle (422) is provided at one side of the lower end surface of the crystal suction cylinder (421).
4. The automatic crystal removing machine according to claim 2, wherein the scraper (42) further comprises a cylinder sleeve (423) sleeved on the crystal absorbing cylinder (421), a ring table (424) fixed on the crystal absorbing cylinder (421), a spring (425) sleeved on the crystal absorbing cylinder (421) and a pressing sleeve (426) sleeved on the crystal absorbing cylinder (421), the pressing sleeve (426) is connected with the upper end of the cylinder sleeve (423), two ends of the spring (425) respectively support the ring table (424) and the pressing sleeve (426), the ring table (424) is slidably arranged in the cylinder sleeve (423), a limiting table for stopping and positioning the ring table (424) is arranged in the cylinder sleeve (423), and the cylinder sleeve (423) is connected with the lifting mechanism (41).
5. The automatic crystal removing machine according to claim 4, wherein a slide way port (4232) is arranged on the cylinder sleeve (423) along the axial direction of the cylinder sleeve (423), and a guide rod (427) which is arranged in the slide way port (4232) in a sliding way is arranged on the crystal absorbing cylinder (421).
6. The automatic de-crystallizing machine of any of claims 1-5, wherein the de-crystallizing mechanism (40) further comprises a lens module (45) for taking an image of the wafer on the substrate, the lens module (45) being mounted on the gantry (30).
7. The automatic de-crystallizing machine of any of claims 1-5, wherein the de-crystallizing mechanism (40) further comprises a code scanning gun (44) for scanning the substrate code, the code scanning gun (44) being mounted on the gantry moving table (30).
8. The automatic decrystallizing machine of any of claims 1-5, wherein the track mechanism (20) comprises:
a conveyor belt (22) for conveying the substrate;
a plurality of support wheels (23) which support the conveyor belt (22) in a matching manner;
a guide plate (21); and the number of the first and second groups,
a conveyor motor (24) connected to one of the plurality of support wheels (23) corresponding to the conveyor belt (22);
the conveying motor (24) is mounted on the guide plate (21), the supporting wheels (23) are rotatably mounted on the guide plate (21), and the guide plate (21) is supported on the rack (10).
9. The automatic decrystallizing machine of claim 8 wherein: the guide plates (21) are arranged in parallel, a plurality of support wheels (23) are respectively arranged on each guide plate (21), the number of the conveyor belts (22) is two, the support wheels (23) on each guide plate (21) are matched with and support one conveyor belt (22), the conveyor motors (24) are respectively installed on each guide plate (21), the rail mechanism (20) further comprises a support plate (252) and a linear driver (251) for driving the two guide plates (21) to approach or separate from each other, the supporting plate (252) is arranged on the frame (10), one guide plate (21) is fixed on the supporting plate (252), the other guide plate (21) is arranged on the supporting plate (252) in a sliding way, the linear driver (251) is arranged on the supporting plate (252), the other guide plate (21) is connected to the linear actuator (251).
10. A decrystallization method comprising the automated decrystallization machine of any of claims 1-9, wherein the decrystallization method further comprises:
the track mechanism (20) conveys the substrate below the crystal removing mechanism (40);
the gantry moving table (30) drives the crystal removing mechanism (40) to move on a horizontal plane, so that the scraper (42) of the crystal removing mechanism (40) is opposite to the wafer to be removed;
the lifting mechanism (41) drives the scraper (42) to approach the substrate;
the gantry moving table (30) drives the scraper (42) to move horizontally so as to scrape the wafer on the substrate;
the scraped wafers are sucked by the scraper (42) and then enter a collection box (51) of the recovery mechanism (50) for recovery.
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| CN202010835706.5A CN111710635B (en) | 2020-08-19 | 2020-08-19 | Automatic crystal removing machine and crystal removing method |
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| CN202010835706.5A CN111710635B (en) | 2020-08-19 | 2020-08-19 | Automatic crystal removing machine and crystal removing method |
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| JP2006073647A (en) * | 2004-08-31 | 2006-03-16 | Hitachi High-Tech Instruments Co Ltd | Component feeding device |
| CN102810497A (en) * | 2011-05-24 | 2012-12-05 | 奥博泰克Lt太阳能公司 | Broken wafer recovery system |
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|---|---|
| CN111710635B (en) | 2020-11-20 |
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