CN111696973B - 电子设备和电子装置 - Google Patents
电子设备和电子装置 Download PDFInfo
- Publication number
- CN111696973B CN111696973B CN202010102918.2A CN202010102918A CN111696973B CN 111696973 B CN111696973 B CN 111696973B CN 202010102918 A CN202010102918 A CN 202010102918A CN 111696973 B CN111696973 B CN 111696973B
- Authority
- CN
- China
- Prior art keywords
- electronic device
- flexible substrate
- extension region
- edge
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 158
- 230000008878 coupling Effects 0.000 claims description 19
- 238000010168 coupling process Methods 0.000 claims description 19
- 238000005859 coupling reaction Methods 0.000 claims description 19
- 238000010586 diagram Methods 0.000 description 20
- 239000010410 layer Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000011241 protective layer Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 6
- 239000011112 polyethylene naphthalate Substances 0.000 description 6
- -1 polyethylene terephthalate Polymers 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/18—Tiled displays
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
- G06F3/1423—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display
- G06F3/1446—Digital output to display device ; Cooperation and interconnection of the display device with other functional units controlling a plurality of local displays, e.g. CRT and flat panel display display composed of modules, e.g. video walls
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
- H01L24/68—Structure, shape, material or disposition of the connectors after the connecting process
- H01L24/69—Structure, shape, material or disposition of the connectors after the connecting process of an individual connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/02—Composition of display devices
- G09G2300/026—Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2380/00—Specific applications
- G09G2380/02—Flexible displays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Multimedia (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本发明提供了一种用于拼接一另一电子设备的电子设备和一种电子装置,用于拼接一另一电子设备的电子设备包括一支撑基板,具有一第一边缘和一第二边缘,以及一可挠式基板,设置在所述支撑基板上,其中所述可挠式基板延伸超过所述第一边缘和所述第二边缘,以分别定义所述可挠式基板的一第一延伸区域和一第二延伸区域。
Description
技术领域
本发明涉及电子设备(device)和电子装置(apparatus),更具体地,涉及用于拼接于另一电子设备的电子设备。
背景技术
大型或特殊形状的电子设备通常通过拼接(tiling,或可以称为平铺)方法形成(即许多较小的电子设备相互组合,形成较大的电子装置)。例如,一个大的发光二极管显示板由许多小的发光二极管显示板组合而成。为了实现大面积拼接的可挠式发光二极管显示装置,应使用可挠式基板进行拼接,因此,需要解决将多个可挠式发光二极管显示板拼接在一起所产生的技术问题。
发明内容
本发明提供一种用于拼接一另一电子设备的电子设备,包括一支撑基板具有一第一边缘和一第二边缘,以及一可挠式基板,设置在所述支撑基板上,其中所述可挠式基板延伸超过所述第一边缘和所述第二边缘,以分别定义所述可挠式基板的一第一延伸区域和一第二延伸区域。
本发明的特征是提供多种不同的电子设备拼接方法,以形成更大面积的电子装置。其中每个电子设备可以具有相同的结构,从而可以批量生产,然后将电子设备拼接成更大的电子装置。它具有制程简单或节省成本的优点。
附图说明
图1A和图1B示出了本发明中每个电子设备的基本结构的示意图,其中,图1A表示电子设备的剖面图视图,图1B表示电子设备的俯视图。
图2示出了根据本发明第二实施例的电子设备的示意图。
图3示出了根据本发明第三实施例的电子设备的示意图。
图4示出了根据本发明第四实施例的电子设备的示意图。
图5示出了根据本发明第五实施例的电子设备的示意图。
图6示出了根据本发明第六实施例的电子设备的示意图。
图7A示出了根据本发明第七实施例的电子设备的示意图。
图7B示出了根据本发明第八实施例的电子设备的示意图。
图8A示出了根据本发明第九实施例的电子设备的示意图。
图8B示出了根据本发明第十实施例的电子设备的示意图。
图9示出了根据本发明第十一实施例的电子设备的示意图。
图10A和10B示出了根据本发明第十二实施例的电子装置的示意图,其中图10A表示电子装置的俯视图,图10B表示电子装置的剖面图。
附图标记说明:1-电子设备;1A-电子设备;1B-电子设备;10-支撑基板;10A-正面;10B-背面;12-可挠式基板;12A-正面;12A’-可挠式基板;12B-背面;12B’-可挠式基板;12C-可挠式基板;12D-可挠式基板;12E-可挠式基板;13-第一延伸区域;14-第二延伸区域;15-第三延伸区域;16-导电图案层;17-保护层;17A-正面;18-电子单元;18-1-电子单元;18-2-电子单元;19-显示区域;20-外部驱动电路;21-边界区域;21a-边界区域;21b-边界区域;22-异方向性导电膜(ACF);24-可挠式印刷电路(FPC);26-集成电路;28-间距;30-耦合元件;31-基板;32C-角延伸区域;32D-角延伸区域;32E-角延伸区域;33-弯曲斜边;40-间隙;41-角;100-电子装置;E1-第一边缘;E2-第二边缘;E3-第三边缘;L1-延伸长度;L2-延伸长度;W-宽度;W1-宽度;W2-宽度。
具体实施方式
通过参考以下的详细描述并同时结合附图可以理解本发明,须注意的是,为了使读者能容易了解及图式的简洁,本发明中的多张图式只绘出触控显示装置的一部分,且至少部分图式中的特定元件并非依照实际比例绘图。此外,图中各元件的数量及尺寸仅作为示意,并非用来限制本发明的范围。
本发明通篇说明书与权利要求中会使用某些词汇来指称特定元件。本领域技术人员应理解,电子设备制造商可能会以不同的名称来指称相同的元件。本文并不意在区分那些功能相同但名称不同的元件。在下文说明书与权利要求书中,“具有”与“包括”等词为开放式词语,因此其应被解释为“包括但不限定为…”之意。
应了解到,当元件或膜层被称为设置在另一个元件或膜层“上”或“连接”另一个元件或膜层时,它可以直接在此另一元件或膜层上或直接连接到此另一元件或层,或者两者之间存在有插入的元件或膜层(非直接情况)。相反地,当元件被称为“直接”在另一个元件或膜层“上”或“直接连接”另一个元件或膜层时,两者之间不存在有插入的元件或膜层。
术语“大约”、“等于”、“相等”或“基本相同”通常代表落在给定数值或范围的20%范围内,或代表落在给定数值或范围的10%、5%、3%、2%、1%或0.5%范围内。
须知悉的是,以下所举实施例可以在不脱离本发明的精神或相冲突下,将数个不同实施例中的技术特征进行替换、重组、混合以完成其他实施例。
图1A和图1B示出了本发明第一实施例的电子设备1的基本结构。在本发明中,电子设备(device)1用于与其他电子设备组合,以构成更大面积的电子装置(apparatus),例如,电子设备包括显示设备、天线设备、感测器设备或其组合。在一些实施例中,每个电子设备1可以具有相同的结构,因此可以通过相同的制程制造,从而实现简化制程的优点。在一个实施例中,当从电子设备1的俯视图中观察时,电子设备的形状可以相似或不同,并且电子设备的形状可以是矩形、圆形、多边形或其他任意形状。然而本发明不限于此。
图1A表示电子设备1的剖视图,图1B表示电子设备1的俯视图。如图1A所示,本发明的电子设备1包括一支撑基板10和设置在支撑基板10上的一可挠式基板12。在本发明中,可挠式基板12具有比支撑基板10大的面积,因此可挠式基板12延伸超过支撑基板10的至少两个边缘:第一边缘E1与第二边缘E2。更准确地说,如图1B所示,在可挠式基板12上限定了两个区域:一第一延伸区域13和一第二延伸区域14,分别从支撑基板10的第一边缘E1和支撑基板10的第二边缘E2向外延伸,其中第一边缘E1与第二边缘E2相对。在一些实施例中,当从俯视图(图1B)中观察时,第一延伸区域13和第二延伸区域14均为矩形形状,但不限于此。在一些实施例中,第一延伸区域13的区域面积不同于第二延伸区域14的区域面积。在另一个实施例中,第一延伸区域13的面积可以大于第二延伸区域14的面积,但不限于此。在本发明的一些实施例中,第一延伸区域13的延伸长度L1不同于第二延伸区域14的延伸长度L2。此外,在本实施例中,第一延伸区域13的宽度W1基本上等于第二延伸区域14的宽度W2和支撑基板10的宽度W。然而,本发明不限于此,并且在另一实施例中,第一延伸区域13的宽度W1可以不同于第二延伸区域14的宽度W2或支撑基板10的宽度W(第一边缘E1或第二边缘E2)。
支撑基板10可以包括硬性基板或可挠式基板。硬性的支撑基板10的材料可以包括玻璃,可挠式支撑基板10的材料可以包括玻璃、聚对苯二甲酸乙二醇酯(polyethyleneterephthalate,PET)、聚碳酸酯(polycarbonate,PC)、聚萘二甲酸乙二醇酯(polyethylenenaphthalate,PEN)、三乙酸酯(triacetate,TAC)、酚醛棉纸、编织玻璃、环氧树脂、氮化铝、碳化硅或其组合。可挠式基板12可以包括具有较薄厚度的玻璃、铜箔、聚酰亚胺(polyimide,PI)、聚碳酸酯(polycarbonate,PC)、聚萘二甲酸乙二醇酯(polyethylenenaphthalate,PEN)、三乙酸酯(triacetate,TAC)、环氧树脂或其组合。然而,本发明不限于此,其他合适的材料也可以用作支撑基板10或可挠式基板12的材料。
在可挠式基板12上,形成一导电图案层16和一保护层17,并且多个电子单元18设置在可挠式基板12上的一显示区域19内。其中显示区域19是可挠式基板12上至少部分与支撑基板10重叠的区域。在本实施例中,显示区域19是可挠式基板12上除了第一延伸区域13和第二延伸区域14之外的区域。换句话说,在可挠式基板12上的电子单元18并不设置在第一延伸区域13和第二延伸区域14之中,但本发明不限于此。在其他实施例中,当可挠式基板12的第一延伸区域13或第二延伸区域14具有显示功能时,电子单元18也可以设置在可挠式基板12的第一延伸区域13或第二延伸区域14上(图1A中未示出)。电子单元18可以包括发光二极管(LEDs)、天线单元、感测单元或其他元件,例如显示驱动器电路、一个或多个电池、感测器、麦克风、扬声器、集成电路、微处理器、电源管理单元、射频收发器电路、基频处理器电路、离散组件,例如电容器、电阻器和电感器、开关、振动器、连接器、印刷电路板、电线、传输线和其他电气设备或其组合,但是本发明不限于此。在一些实施例中,当电子单元18是发光二极管时,发光二极管可以是有机发光二极管或无机发光二极管(例如量子点发光二极管(quantum dotLED)、次毫米发光二极管(mini LED)或微发光二极管(micro LED)),并且发光二极管的类型可以是垂直型或倒装型,然而,本发明不限于此。在一些实施例中,如果电子单元18是天线单元,则天线单元可以是射频识别(RFID)天线单元、近场通信(NFC)天线单元、WiFi天线单元、蓝牙天线单元、相控阵天线单元(phased array antenna unit)或其组合,但是本发明不限于此
虽然图1A示出了各电子单元18彼此之间的间距28基本相同,但是至少部分电子单元18也可以被设计成彼此之间具有不同的间距28(图1A中未示出),例如,当电子设备1拼接到另一电子设备(图1A中未示出)以获得较佳的显示性能时,靠近第一边缘E1或第二边缘E2的电子单元18可能不同于靠近支撑基板10的中心位置的其他电子单元18。间距28被定义为电子单元18-1的一边缘和另一个电子单元18-2的一边缘之间的距离,其中该另一个电子单元18-2沿着图1A所示的X轴方向最靠近电子单元18-1。
电子单元18设置在可挠式基板12上(电子单元18可以例如通过引线接合法或倒装法形成在可挠式基板12上,或者可以通过磁力连接在一起),并且电子单元18可以分别电连接到导电图案层16。在一个实施例中,首先,电子单元18可以彼此先电连接,然后再一同电连接到导电图案层16。导电图案层16的材料可以包括金属或透明导电材料。金属材料的例子包括镁、铝、银、钨、铜、镍、铬或其合金。透明导电材料的例子包括氧化铟锡(ITO)、氧化铟锌(IZO)、氧化锌或氧化铟。保护层17可用于保护导电图案层16以降低氧化或损坏,保护层17可包括绝缘材料,例如氧化硅、氮化硅、聚酰亚胺、环氧树脂或其他合适的材料。
此外,一外部驱动电路20可以设置在可挠式基板12的第一延伸区域13中。在本实施例中,外部驱动电路20可以包括形成在一可挠式印刷电路(FPC)24上的一集成电路26,并且通过一异方向性导电膜(ACF)22电连接到导电图案层16。在一个实施例中,术语“设置在”被定义为当从俯视图(Z轴方向)观察时,外部驱动电路20与第一延伸区域13重叠。外部驱动电路20用于控制电子单元18。例如,如果电子单元18包括发光二极管,则外部驱动电路20可以用于控制电子单元18是否发光。类似地,当电子单元18包括其他元件时,外部驱动电路20可以执行类似的功能。
在本实施例中,图2示出提供了两个电子设备,它们分别被标记为一电子设备1A和一电子设备1B。具体地,电子设备1A的第一延伸区域13和第二延伸区域14中的至少一个用于拼接(或平铺)另一个电子设备1B。应当注意,这里描述的电子设备1A和电子设备1B各自包括与图1A和图1B所示的上述电子设备1相同的元件,至少包括第一延伸区域13、第二延伸区域14、导电图案层16、保护层17、电子单元18、外部驱动电路20和其他元件。为了简化说明,在图2中没有标记一些元件。然而,元件的结构和功能可以参考上述第一实施例。
参照图2,其示出了根据本发明第二实施例的电子设备1的示意图,该结构通过拼接上述图1A和图1B中描述的至少两个电子设备1来形成。值得注意的是,在本发明的一些实施例中,为了减小电子设备1的边界区域,设置在可挠式基板12的第一延伸区域13上的外部驱动电路20可以选择性地弯曲到支撑基板10的背面,这里提到的电子设备1的边界区域被定义为可挠式基板12不与支撑基板10重叠的区域,例如,如图1B所示,一边界区域21包括一边界区域21a和一边界区域21b。如图2所示,当从截面图观察时,支撑基板10包括一正面10A和与正面10A相对设置的背面10B。上述电子单元18形成在支撑基板10的正面10A上,第一延伸区域13部分地设置在背面10B上,并且外部驱动电路20形成在可挠式基板12的第一延伸区域13中。换句话说,外部驱动电路20形成在支撑基板10的背面10B上,外部驱动电路20就可以不占据支撑基板10的正面10A的区域,使支撑基板10的正面10A可以容纳更多的电子单元18。
在本实施例中,电子设备1A的第一延伸区域13通过耦合元件30与电子设备1B的第二延伸区域14拼接。换句话说,耦合元件30用于拼接另一电子设备1A或电子设备1B。耦合元件30可以包括导电或非导电黏合剂,例如胶层或上述ACF。此外,在本实施例中,电子设备1A的第二延伸区域14或电子设备1B的第一延伸区域13可以进一步与其他电子设备拼接。应当注意,如果电子设备1A的第一延伸区域13或电子设备1B的第二延伸区域14位于最靠外的边界,并且不会与诸如电子设备1A的第二延伸区域14的其他电子设备拼接,电子设备1A的第二延伸区域14可以弯曲到支撑基板10的背面10B(如图2所示),以降低电子设备1A的第二延伸区域14接触其他元件,或者获得电子设备1A的窄边界区域。
此外,上述电子设备1A和电子设备1B沿着第一方向(诸如图2所示的X轴)拼接,但是本发明不限于仅沿着一个方向拼接,电子设备可以沿着其他方向(诸如沿着图2所示的Y方向)拼接。它也应该在本发明的范围内。
除了上述特征之外,该实施例的其他部件、材料特性和制造方法类似于上述第一实施例,因此不再赘述。此外,下面提到的实施例也遵循此规则,除了具体提到的差异之外,其他特征与上述第一实施例中描述的相同。
参照图3,其示出了根据本发明第三实施例的电子设备的示意图。在本实施例中,电子设备1A的第二延伸区域14通过耦合元件30与电子设备1B的第二延伸区域14拼接,并且耦合元件30沿着Z轴方向设置在电子设备1A的可挠式基板12的背面12B和电子设备1B的可挠式基板12的正面12A之间。
参照图4,其示出了根据本发明第四实施例的电子设备的示意图。在本实施例中,电子设备1A的第一延伸区域13通过耦合元件30与电子设备1B的第一延伸区域13拼接,并且耦合元件30设置在电子设备1A的可挠式基板12的正面12A和电子设备1B的可挠式基板12的正面12A之间。在另一个实施例中,耦合元件30可以沿着X轴方向设置在电子设备1A的保护层17和电子设备1B的保护层17之间。此外,耦合元件30直接接触电子设备1A的保护层17和电子设备1B的保护层17。
参照图5,其示出了根据本发明第五实施例的电子设备的示意图。该实施例类似于上述第三实施例,但是与上述第三实施例相比,在本实施例中,电子单元18被分成多个组,每个组包含特定数量的电子单元18,并且电子单元18预先形成在多个基板31上,然后在后续步骤中将包含多个电子单元18的基板31设置在可挠式基板12上。
通过在本实施例中描述的方法,包括电子单元18的多个基板31可以在同一个制程中完成,或者可以在一些批量步骤中形成,因为基板31具有更大的面积,使得当基板31设置在可挠式基板12上时,可以降低该制程的难度。本实施例和上述第三实施例之间的区别在于,本实施例还包括其上设置有电子单元18的多个基板31。此外,本实施例的耦合元件30沿着Z轴设置在电子设备1A的保护层17的正面17A和电子设备1B的可挠式基板12的背面12B之间。然而,本发明不限于此,并且耦合元件30的位置可以根据实际需求来调节。
在本实施例中,电子设备1A和电子设备1B以与上面图2中描述的相同的方式拼接,但是本发明不限于此,电子设备也可以根据其他实施例中描述的拼接方式拼接(例如,图2-图4或以下段落中提到的其他拼接结构的拼接方法)。
参照图6,其示出了根据本发明第六实施例的电子设备的示意图。该实施例类似于上述第三实施例和第五实施例,但是与上述第三实施例和第五实施例相比,在本实施例中,耦合元件30由导电材料制成,并且电子设备1A的导电图案层16和电子设备1B的导电图案层16分别电连接到导电耦合元件30。换句话说,电子设备1A的导电图案层16通过耦合元件30电连接到电子设备1B的导电图案层16。
在本实施例中,以电子设备1A和电子设备1B为例,因为电子设备1A的导电图案层16电连接到电子设备1B的导电图案层16,所以仅需一个外部驱动电路20就可以同时控制电子设备1A上的电子单元18和电子设备1B上的电子单元18。换句话说,在本实施例中可以省略另一个外部驱动电路20,以实现节省成本。或者在另一种情况下,外部驱动电路20仍然可以保留而当作备用外部驱动电路。也应在本发明的范围内。
在本实施例中,电子设备1A和电子设备1B以与上面图2中描述的相同方式拼接,但是本发明不限于此,并且电子设备也可以根据在其他实施例中描述的拼接方式拼接(例如或者在以下段落中提到的其他拼接结构)。
在以下段落中描述的本发明的实施例,主要着重于调整可挠式基板的形状,并且不同形状的可挠式基板具有不同的拼接结构。值得注意的是,图7A至图9表示为俯视图。为了简单起见,省略了除支撑基板10和可挠式基板12之外的其余元件,而其余元件的材料特征和制造方法与上述其他实施例相同,并且不再描述。
参照图7A,其示出了根据本发明第七实施例的电子设备1的示意图。如图7A所示,形成可挠式基板12A’,并且当从俯视图中观察时,可挠式基板12A’至少部分与支撑基板10重叠。然而,图7A示出了第一延伸区域13的宽度W1和第二延伸区域14的宽度W2基本相同,并且小于支撑基板10的宽度W。在一个实施例中,第一延伸区13的面积大于第二延伸区14的面积,并且第一延伸区13和第二延伸区14的面积都小于支撑基板10的面积。在本发明中,每个延伸区域(包括第一延伸区域13和第二延伸区域14)的长度L1与长度L2或宽度W1与宽度W2可以根据实际需求进行调整。
参照图7B,其示出了根据本发明第八实施例的电子设备1的示意图。如图7B所示,形成可挠式基板12B’,并且至少部分与支撑基板10重叠。然而,在本实施例中,可挠式基板12B’还包括延伸超过支撑基板10的第三边缘E3的第三延伸区域15。第三边缘E3邻近第一边缘E1和第二边缘E2设置,并且第一边缘E1沿着X轴方向与第二边缘E2相对。第三延伸区域15可用于沿着Y轴方向与另一电子设备拼接。此外,在本发明的另一实施例中,可以进一步形成第四延伸区域(未示出),沿着Y轴方向与第三延伸边缘E3相对设置。也应该在本发明的范围内。
参照图8A,其示出了根据本发明第九实施例的电子设备1的示意图。如图8A所示,形成可挠式基板12C,并且至少部分与支撑基板10重叠。然而,在本实施例中,可挠式基板12C还包括至少一个角延伸区域32C,在本实施例中,两个角延伸区域32C的其中一个设置成与第三延伸区域15和第一延伸区域13相邻,并且另一个设置成与第三延伸区域15和第二延伸区域14相邻。在一个实施例中,其中一个角延伸区域32C直接连接第三延伸区域15和第一延伸区域13,而另一个角延伸区域32C直接接触第三延伸区域15和第二延伸区域14。此外,两个角延伸区域32C可以皆为矩形图案。
参照图8B,其示出了根据本发明第十实施例的电子设备1的示意图。如图8B所示,形成可挠式基板12D,并且至少部分与支撑基板10重叠。然而,在本实施例中,可挠式基板12D还包括至少一个角延伸区域32D,在本实施例中,至少两个角延伸区域32D的其中一个设置成与第三延伸区域15和第一延伸区域13相邻,并且另一个设置成与第三延伸区域15和第二延伸区域14相邻。在一个实施例中,其中一个角延伸区域32D直接接触第三延伸区域15和第一延伸区域13,而另一个角延伸区域32D直接连接第三延伸区域15和第二延伸区域14。此外,两个角延伸区域32D都具有至少一个弯曲斜边(例如图8B所示的弯曲斜边33)。在本发明的一个实施例中,角延伸区域32D可以是三角形图案,但是具有向内弯曲的斜边,并且在本发明的另一个实施例中,角延伸区域32D可以是三角形图案,但是具有向外弯曲的斜边。
参照图9,其示出了根据本发明第十一实施例的电子设备1的示意图。如图9所示,形成可挠式基板12E,并且至少部分与支撑基板10重叠。然而,在本实施例中,可挠式基板12E还包括至少一个角延伸区域32E,在本实施例中,两个角延伸区域32E的其中一个设置成与第三延伸区域15和第一延伸区域13相邻,并且另一个设置成与第三延伸区域15和第二延伸区域14相邻。在一个实施例中,其中一个角延伸区域32E直接接触第三延伸区域15和第一延伸区域13,而另一个角延伸区域32E直接连接第三延伸区域15和第二延伸区域14。此外,两个角延伸区域32E可以都是L形图案。
参照图10A和图10B,其示出了根据本发明第十二实施例的电子装置的示意图。该实施例示出了将多个电子设备拼接成更大面积的电子装置100的示意图,图10A表示电子装置100的俯视图,图10B是沿着剖面线A-A’截取的截面图。如图10A所示,多个电子设备1排列成阵列并且拼接在一起,每个电子设备1可以沿着不同方向(例如图10B的X轴方向或Y轴方向)与另一个电子设备1拼接。应当注意,图10A或图10B中描述的电子设备1可以由任何前述实施例中所描述的电子设备代替,并且本发明不限于此。此外,在本发明的一个实施例中,较大面积的电子装置不限于仅用一种拼接方法拼接。换句话说,更大面积的电子装置可以由多个具有不同拼接方法(例如上述每个实施例中提到的拼接方法)的电子设备拼接。
此外,在本实施例中定义角41,其中每个角41设置在电子设备1的可挠式基板12的每两个相邻边缘之间,并且这两个相邻边缘具有不同的延伸方向,例如,一个延伸方向是沿着X轴方向,另一个延伸方向是沿着Y轴方向。将每个电子设备1的角41进行削角,因此,可能会留下间隙40在每四个电子设备1的交界处,或者每两个相邻电子设备的角之间。换句话说,至少一个间隙40在一个电子设备1的角41和另一个电子设备1的角41之间。在本实施例中,间隙40被定义为未被可挠式基板12覆盖的区域。留下间隙40的目的是在电子装置完成后,电子装置是可挠式装置。当电子装置弯曲时,其中每个各自的电子设备的角更容易与其他相邻电子设备的角接触,甚至可能会造成电子装置的损坏。因此,在本实施例中,留下间隙40可以防止上述问题。此外,在本实施例中,当从俯视图观察时,间隙40是十字图案,然而,本发明不限于此,并且每个间隙的形状可以根据实际需求进行调整。
综上所述,本发明的特征是提供不同的电子设备拼接方法以形成更大面积的电子装置。其中各个电子设备可以具有相同的结构,从而可以批量生产,然后将电子设备拼接成更大的电子装置。具有制程简单或节省成本的优点。
以上所述仅为本发明的实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (14)
1.一种用于拼接一另一电子设备的电子设备,其特征在于,包括:
一支撑基板,具有一正面和与所述正面相对设置的一背面,其中该支撑基板为硬性基板;
一可挠式基板,设置于所述支撑基板上,其中所述支撑基板具有一第一边缘、一第二边缘和一第三边缘,所述第一边缘与所述第二边缘相对,所述第三边缘邻近所述第一边缘和所述第二边缘设置,所述可挠式基板延伸超过所述第一边缘和所述第二边缘,以分别定义所述可挠式基板的一第一延伸区域和一第二延伸区域,所述可挠式基板延伸超过所述支撑基板的所述第三边缘,以定义所述可挠式基板的一第三延伸区域,所述可挠式基板包括一显示区域,所述显示区域至少部分与所述支撑基板重叠,
其中所述可挠式基板还包括一角延伸区域,与所述第三延伸区域和所述第一延伸区域相邻,
其中所述可挠式基板由所述支撑基板的所述正面弯曲到所述背面,所述可挠式基板的一部分设置在所述支撑基板的所述背面上;
多个电子单元,设置在所述可挠式基板上的所述显示区域内,其中所述多个电子单元不重叠于所述第一延伸区域和所述第二延伸区域;
多个基板,设置在所述可挠式基板上,且所述多个电子单元设置在所述多个基板上;以及
一导电图案层,设置于所述可挠式基板上,并且所述导电图案层将所述多个电子单元中的至少一个与一另一个电子单元电连接,所述导电图案层由所述显示区域延伸到设置在所述支撑基板的所述背面上的所述可挠式基板的所述部分。
2.根据权利要求1所述的电子设备,其特征在于,所述第一延伸区域和所述第二延伸区域中的至少一个用于拼接所述另一电子设备。
3.根据权利要求1所述的电子设备,其特征在于,所述角延伸区域具有一弯曲斜边。
4.根据权利要求1所述的电子设备,其特征在于,所述第一延伸区域的一延伸长度不同于所述第二延伸区域的一延伸长度。
5.根据权利要求1所述的电子设备,其特征在于,所述可挠式基板的所述第一延伸区域的一部分设置在所述支撑基板的所述背面上,所述电子设备还包括一外部驱动电路,设置于在所述支撑基板的所述背面上的所述第一延伸区域的所述部分上,且与所述导电图案层电连接。
6.根据权利要求1所述的电子设备,其特征在于,还包括一耦合元件,设置于所述第二延伸区域中,其中所述耦合元件用于拼接所述另一电子设备。
7.根据权利要求1所述的电子设备,其特征在于,还包括一耦合元件,设置于所述第一延伸区域中,其中所述耦合元件用于拼接所述另一电子设备。
8.根据权利要求1所述的电子设备,其特征在于,所述多个电子单元包括多个发光二极管、多个天线单元、多个感测器单元或多个发光二极管、多个天线单元、多个感测器单元中至少两者的组合。
9.根据权利要求1所述的电子设备,其特征在于,所述多个电子单元设置于所述支撑基板的所述正面。
10.根据权利要求1所述的电子设备,其特征在于,所述角延伸区域具有一L形图案。
11.根据权利要求1所述的电子设备,其特征在于,当从一俯视图观察时,所述第一延伸区域的一宽度小于所述第一边缘的一宽度。
12.一种电子装置,其特征在于,包括:
一第一电子设备拼接一第二电子设备,其中所述第一电子设备和所述第二电子设备都各自包括:
一支撑基板,具有一正面和与所述正面相对设置的一背面,其中该支撑基板为硬性基板;
一可挠式基板,设置在所述支撑基板上,其中所述支撑基板具有一第一边缘、一第二边缘和一第三边缘,所述第一边缘与所述第二边缘相对,所述第三边缘邻近所述第一边缘和所述第二边缘设置,所述可挠式基板延伸超过所述第一边缘和所述第二边缘,以分别定义所述可挠式基板的一第一延伸区域和一第二延伸区域,所述可挠式基板延伸超过所述支撑基板的所述第三边缘,以定义所述可挠式基板的一第三延伸区域,所述可挠式基板包括一显示区域,所述显示区域至少部分与所述支撑基板重叠,
其中所述可挠式基板还包括一角延伸区域,与所述第三延伸区域和所述第一延伸区域相邻,
其中所述可挠式基板由所述支撑基板的所述正面弯曲到所述背面,所述可挠式基板的一部分设置在所述支撑基板的所述背面上;
多个电子单元,设置在所述可挠式基板上的所述显示区域内,其中所述多个电子单元不重叠于所述第一延伸区域和所述第二延伸区域;
多个基板,设置在所述可挠式基板上,且所述多个电子单元设置在所述多个基板上;以及
一导电图案层,设置于所述可挠式基板上,并且所述导电图案层将所述多个电子单元中的至少一个与一另一个电子单元电连接,所述导电图案层由所述显示区域延伸到设置在所述支撑基板的所述背面上的所述可挠式基板的所述部分。
13.根据权利要求12所述的电子装置,其特征在于,还包括至少一个间隙在所述第一电子设备的一角和所述第二电子设备的一角之间。
14.根据权利要求12所述的电子装置,其特征在于,所述可挠式基板的所述第一延伸区域的一部分设置在所述支撑基板的所述背面上,所述第一电子设备还包括一外部驱动电路,设置在所述支撑基板的所述背面上的所述第一延伸区域的所述部分上,且与所述导电图案层电连接。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/354,158 | 2019-03-14 | ||
US16/354,158 US20200295119A1 (en) | 2019-03-14 | 2019-03-14 | Electronic device and electronic apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111696973A CN111696973A (zh) | 2020-09-22 |
CN111696973B true CN111696973B (zh) | 2023-07-11 |
Family
ID=72423885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010102918.2A Active CN111696973B (zh) | 2019-03-14 | 2020-02-19 | 电子设备和电子装置 |
Country Status (2)
Country | Link |
---|---|
US (2) | US20200295119A1 (zh) |
CN (1) | CN111696973B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109950226B (zh) * | 2019-03-26 | 2020-12-15 | 京东方科技集团股份有限公司 | 一种电路基板及其制作方法、显示基板、拼接显示装置 |
KR20220039987A (ko) * | 2020-09-22 | 2022-03-30 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
CN112382212B (zh) * | 2020-12-03 | 2021-12-03 | 深圳市华星光电半导体显示技术有限公司 | 显示面板、显示面板的制作方法和显示屏 |
US20230369233A1 (en) * | 2021-01-28 | 2023-11-16 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Wiring substrate, array substrate and light emitting module |
CN113299184A (zh) * | 2021-05-21 | 2021-08-24 | 维沃移动通信有限公司 | 显示模组和电子设备 |
CN113421878B (zh) * | 2021-06-22 | 2023-07-25 | 成都辰显光电有限公司 | 显示面板、显示模组、显示装置及成型方法 |
WO2024095317A1 (ja) * | 2022-10-31 | 2024-05-10 | 三菱電機株式会社 | 映像表示装置及び映像表示装置の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9058755B2 (en) * | 2008-01-04 | 2015-06-16 | Nanolumens Acquisition, Inc. | Lightweight unitary display |
US8593061B2 (en) * | 2009-08-25 | 2013-11-26 | Seiko Epson Corporation | Electro-optical device and electronic apparatus |
US8305294B2 (en) * | 2009-09-08 | 2012-11-06 | Global Oled Technology Llc | Tiled display with overlapping flexible substrates |
GB2511549B (en) * | 2013-03-07 | 2020-04-22 | Plastic Logic Ltd | Tiled Displays |
WO2016055897A1 (en) * | 2014-10-08 | 2016-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
CN107479752B (zh) * | 2017-08-14 | 2020-06-05 | 业成科技(成都)有限公司 | 触控显示装置 |
WO2019064572A1 (ja) * | 2017-09-29 | 2019-04-04 | シャープ株式会社 | 表示装置の製造方法および表示装置 |
-
2019
- 2019-03-14 US US16/354,158 patent/US20200295119A1/en not_active Abandoned
-
2020
- 2020-02-19 CN CN202010102918.2A patent/CN111696973B/zh active Active
-
2021
- 2021-09-09 US US17/471,128 patent/US11706964B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11706964B2 (en) | 2023-07-18 |
CN111696973A (zh) | 2020-09-22 |
US20210408220A1 (en) | 2021-12-30 |
US20200295119A1 (en) | 2020-09-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111696973B (zh) | 电子设备和电子装置 | |
JP4445343B2 (ja) | Icタグ実装液晶表示器、およびその製造方法 | |
US9113545B2 (en) | Tape wiring substrate and chip-on-film package including the same | |
EP2946643B1 (en) | Method and apparatus for coupling an active display portion and substrate | |
EP3683650B1 (en) | Display screen assembly and mobile terminal | |
EP3805854A1 (en) | Display device and flexible printed circuit | |
US8049127B2 (en) | Touch panel | |
KR20180079422A (ko) | Nfc 통신 기능을 갖는 디스플레이 장치 | |
WO2014025534A1 (en) | Flexible displays | |
US20110063240A1 (en) | Touch panel | |
US11342539B2 (en) | Display panel aligned with window and display device having the same | |
US20140320352A1 (en) | Touch panel module and touch display panel with antenna structure | |
US20110210929A1 (en) | Touch panel-attached display device and antistatic structure | |
CN106843560B (zh) | 触控传感器、触控面板和电子设备 | |
CN106843606B (zh) | 触控传感器、触控面板和电子设备 | |
EP4137912A1 (en) | Flexible display device | |
JP2007200177A (ja) | 電子装置 | |
CN111552401A (zh) | 触控显示装置 | |
US20240036370A1 (en) | Electronic structure | |
CN111610879B (zh) | 触控面板、触控面板的制备方法、触控组件及电子设备 | |
CN111651096A (zh) | 一种显示装置 | |
JP2011242415A (ja) | 表示装置 | |
CN109669569B (zh) | 触摸显示屏及其制作方法、电子设备 | |
CN106990881B (zh) | 触摸式传感器以及电子设备 | |
US20230300981A1 (en) | Printed circuit board and display device including the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |