CN111676444A - Evaporation mask plate and OLED device - Google Patents
Evaporation mask plate and OLED device Download PDFInfo
- Publication number
- CN111676444A CN111676444A CN202010494508.7A CN202010494508A CN111676444A CN 111676444 A CN111676444 A CN 111676444A CN 202010494508 A CN202010494508 A CN 202010494508A CN 111676444 A CN111676444 A CN 111676444A
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- 230000008020 evaporation Effects 0.000 title claims abstract description 50
- 238000001704 evaporation Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000011521 glass Substances 0.000 claims description 24
- 230000005415 magnetization Effects 0.000 abstract description 6
- 230000037396 body weight Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 description 39
- 238000000576 coating method Methods 0.000 description 39
- 238000009834 vaporization Methods 0.000 description 39
- 230000008016 vaporization Effects 0.000 description 39
- 239000010408 film Substances 0.000 description 13
- 230000005484 gravity Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000005389 magnetism Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention relates to the technical field of evaporation mask plates, in particular to an evaporation mask plate and an OLED device, which comprise a first mask substrate, a second mask substrate and an electrified coil, wherein the first mask substrate and the second mask substrate are mutually attached, and the electrified coil is sleeved on the outer wall of the first mask substrate, so that when the electrified coil is electrified with current, the first mask substrate and the electrified coil form a magnet, the cathode and the anode of the magnet can be changed by changing the direction of the current, the magnetic size of the magnet can be controlled by adjusting the size of the current, the polarity of the evaporation mask plate and the size of Lorentz magnetic force can be adjusted, the balance between the Lorentz magnetic force of the evaporation mask plate and the body weight can be realized, the influence caused by the magnetization of the evaporation mask plate can be eliminated, the yield of the evaporation device can be improved, and the product quality can be improved.
Description
Technical Field
The invention relates to the technical field of evaporation mask plates, in particular to an evaporation mask plate and an OLED device.
Background
An Organic Light Emitting Diode (OLED) display has the characteristics of low power consumption, wide viewing angle, fast response speed, ultra-Light thinness, good shock resistance and the like, and is increasingly applied to a high-performance display area as an autonomous Light Emitting device;
adopt the coating by vaporization mode to prepare OLED device at present, in the coating by vaporization film forming process, on permanent magnet magnetic sheet through the cavity is inside will the coating by vaporization mask plate adsorbs the glass substrate, glass substrate and coating by vaporization mask plate are not laminated completely, there is certain clearance in the middle of, in order to protect the film not by the coating by vaporization mask plate scratch, long-term coating by vaporization in-process, the coating by vaporization mask plate can be magnetized by the permanent magnet, make the coating by vaporization mask plate become the magnetism the same with the permanent magnet, because like polarity magnet repels each other, lead to the coating by vaporization mask plate can not adsorb completely, make the coating by vaporization mask plate under the effect of gravity with the clearance grow of glass substrate, when the coating by vaporization, the coating by vaporization material takes place the diffraction in clearance department, lead to the regional grow of shadow.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides a can solve coating by vaporization mask plate and OLED device by the magnetization problem.
In order to solve the above technical problems, a first technical solution adopted by the present invention is:
the utility model provides an evaporation mask plate, includes first mask base plate, second mask base plate and circular telegram coil, first mask base plate laminates with second mask base plate each other, set up the first logical groove that is the array distribution more than two on the first mask base plate, set up the second that is the array distribution more than two on the second mask base plate and lead to the groove, the quantity that the second led to the groove is the same with the quantity that first leads to the groove, first logical groove sets up and communicates with each other with second logical groove one-to-one, the circular telegram coil cover is established at first mask base plate outer wall.
The second technical scheme adopted by the invention is as follows:
an OLED device comprises a magnetic plate, wherein a glass substrate and the evaporation mask plate are sequentially stacked on one side surface of the magnetic plate;
the glass substrate is in contact with the magnetic plate, and a space is arranged between the glass substrate and the evaporation mask plate.
The invention has the beneficial effects that:
through setting up first mask base plate and second mask base plate, first mask base plate and the laminating of second mask base plate each other, set up first logical groove on the first mask base plate, set up the second on the second mask base plate and lead to the groove, the circular telegram coil cover is established at first mask base plate outer wall, make when circular telegram coil leads to the electric current, first mask base plate and circular telegram coil constitute a magnet, can change the negative and positive poles of magnet through the direction that changes the electric current like this, also can control the magnetism size of magnet through the size of regulating current, and then adjust the polarity of coating by vaporization mask board and the size of lorentz magnetic force, realize the balance of lorentz magnetic force and this body weight of coating by vaporization mask board, with this influence that the coating by vaporization mask board is magnetized and brought of elimination, thereby improve the yield of coating by vaporization device, and improve the product quality.
Drawings
FIG. 1 is a schematic structural diagram of an evaporation mask according to the present invention;
FIG. 2 is a schematic structural diagram of an evaporation mask according to the present invention;
FIG. 3 is a schematic diagram of a side view structure of an evaporation mask according to the present invention;
FIG. 4 is a schematic structural diagram of an OLED device according to the present invention;
FIG. 5 is a schematic structural diagram of an OLED device according to the present invention;
FIG. 6 is a schematic diagram of a crucible evaporation structure of an OLED device according to the present invention;
description of reference numerals:
1. a first mask substrate; 101. a first through groove;
2. a second mask substrate; 201. a second through groove;
3. an electrified coil;
4. a magnetic plate;
5. a glass substrate;
6. a spring;
7. a crucible is provided.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a technical solution provided by the present invention:
the utility model provides an evaporation mask plate, includes first mask base plate, second mask base plate and circular telegram coil, first mask base plate laminates with second mask base plate each other, set up the first logical groove that is the array distribution more than two on the first mask base plate, set up the second that is the array distribution more than two on the second mask base plate and lead to the groove, the quantity that the second led to the groove is the same with the quantity that first leads to the groove, first logical groove sets up and communicates with each other with second logical groove one-to-one, the circular telegram coil cover is established at first mask base plate outer wall.
From the above description, the beneficial effects of the present invention are:
through setting up first mask base plate and second mask base plate, first mask base plate and the laminating of second mask base plate each other, set up first logical groove on the first mask base plate, set up the second on the second mask base plate and lead to the groove, the circular telegram coil cover is established at first mask base plate outer wall, make when circular telegram coil leads to the electric current, first mask base plate and circular telegram coil constitute a magnet, can change the negative and positive poles of magnet through the direction that changes the electric current like this, also can control the magnetism size of magnet through the size of regulating current, and then adjust the polarity of coating by vaporization mask board and the size of lorentz magnetic force, realize the balance of lorentz magnetic force and this body weight of coating by vaporization mask board, with this influence that the coating by vaporization mask board is magnetized and brought of elimination, thereby improve the yield of coating by vaporization device, and improve the product quality.
Furthermore, the shape of the first mask substrate is a cuboid, four side faces of the first mask substrate are all inwards recessed, and the electrified coil is wound at the recessed position of the first mask substrate.
Known by the above description, all inwards cave in through four sides with first mask base plate, circular telegram coil winding is in the depressed place of first mask base plate, not only can make circular telegram coil stable the winding at first mask base plate outer wall, can avoid the increase of circular telegram coil and increase the volume of coating by vaporization mask plate in addition, the orderly winding of circular telegram coil can make the magnet that first mask base plate and circular telegram coil constitute produce stable lorentz force, make its and the keeping balance always of gravity itself, eliminate the influence that the coating by vaporization mask plate was brought by the magnetization.
Furthermore, the depth of the inward recess of the four side surfaces of the first mask substrate is 5mm-8 mm.
From the above description, the depth of the inward recess of the four side surfaces of the first mask substrate is set to be 5mm-8mm, so that the yield of the evaporation device can be further improved, and the product quality can be improved.
Furthermore, the number of turns of the electrified coil is 40-60 turns.
It can be known from the above description that the number of turns of the energizing coil is 40-60 turns, so that the magnet formed by the first mask substrate and the energizing coil can generate stable lorentz magnetic force, the lorentz magnetic force is always balanced with the self gravity, and the influence caused by the magnetization of the evaporation mask plate is eliminated.
Further, the thickness of the first mask substrate is 4mm-10mm, and the thickness of the second mask substrate is 0.1mm-0.3 mm.
Referring to fig. 4, another technical solution provided by the present invention:
an OLED device comprises a magnetic plate, wherein a glass substrate and the evaporation mask plate are sequentially stacked on one side surface of the magnetic plate;
the glass substrate is in contact with the magnetic plate, and a space is arranged between the glass substrate and the evaporation mask plate.
From the above description, the beneficial effects of the present invention are:
through setting up foretell structure can overcome the coating by vaporization mask plate and be magnetized, realize the adjustable of interval between glass substrate and the coating by vaporization mask plate, optimize the homogeneity of coating by vaporization mask plate fretwork edge film and middle film, reduce the shadow region, the uneven problem of colour mixture and luminance of annihilator spare.
Further, still include the spring, the one end of spring and a side fixed connection that the magnetic sheet is close to the coating by vaporization mask plate, the other end that the one end of spring is relative and a side fixed connection that the coating by vaporization mask plate is close to the magnetic sheet.
Known from the above-mentioned description, through setting up the spring, the one end of spring and a side fixed connection that the magnetic sheet is close to the coating by vaporization mask plate, the other end that the one end of stating the spring is relative is close to a side fixed connection of magnetic sheet with the coating by vaporization mask plate, can prevent like this that because the rotation of mechanism or magnetic sheet are too big to coating by vaporization mask plate magnetic force, cause glass substrate and coating by vaporization mask plate direct contact, lead to the organic material film on glass substrate surface to be scratched, further improve the yield of coating by vaporization device, improve product quality.
Referring to fig. 1 to fig. 3, a first embodiment of the present invention is:
referring to fig. 1, 2 and 3, an evaporation mask plate includes a first mask substrate 1, a second mask substrate 2 and an electrical coil 3, the first mask substrate 1 and the second mask substrate 2 are attached to each other, the first mask substrate 1 is provided with more than two first through grooves 101 distributed in an array, the second mask substrate 2 is provided with more than two second through grooves 201 distributed in an array, the number of the second through grooves 201 is the same as that of the first through grooves 101, the first through grooves 101 and the second through grooves 201 are arranged in a one-to-one correspondence and communicated, and the electrical coil 3 is sleeved on the outer wall of the first mask substrate 1.
The shape of the first through groove 101 and the shape of the second through groove 201 are both square and equal in size.
The shape of the first mask substrate 1 is a cuboid, four side faces of the first mask substrate 1 are all inwards recessed, and the electrified coil 3 is wound at the recessed position of the first mask substrate 1.
The second mask substrate 2 is also shaped like a rectangular parallelepiped.
The four side surfaces of the first mask substrate 1 are recessed inwards to a depth of 5mm-8mm, preferably 6.7 mm.
The number of turns of the energized coil 3 is 40-60 turns, preferably 55 turns.
The thickness of the first mask substrate 1 is 4mm to 10mm, preferably 6mm, and the thickness of the second mask substrate 2 is 0.1mm to 0.3mm, preferably 0.2 mm.
Referring to fig. 4 to fig. 6, a second embodiment of the present invention is:
referring to fig. 4, an OLED device includes a magnetic plate 4 (the material of the magnetic plate may be iron, cobalt, nickel, etc., and the thickness is 1cm to 5cm, preferably 3cm), a glass substrate 5 and the above evaporation mask are sequentially stacked on one side surface of the magnetic plate 4;
the glass substrate 5 contacts with the magnetic plate 4, a distance is arranged between the glass substrate 5 and the evaporation mask plate, the glass substrate 5 can be made of SiO2, the thickness is 0.3mm-0.7mm, and the preferable thickness is 0.5 mm.
Still include spring 6, a side fixed connection that the one end of spring 6 and magnetic sheet 4 are close to the coating by vaporization mask plate, the other end that the one end of spring 6 is relative is close to a side fixed connection of magnetic sheet 4 with the coating by vaporization mask plate, the quantity of spring 6 is four, distributes respectively in four right angles departments of rectangle coating by vaporization mask plate.
Referring to fig. 6, in the vapor deposition, organic materials or metals in a crucible 7 are heated in a vacuum environment to become gaseous particles or atoms, and the gaseous particles or atoms move linearly at a nearly constant speed with a large free path, and a specific pattern thin film is deposited on a glass substrate 5 through a specific mask plate;
the mode of adopting the evaporation mask plate to form the film is to select regional shielding to form the film, carry out the evaporation of the required film at the hollow part (namely the first through groove 101 and the second through groove 201) of the evaporation mask plate, and shield the deposition of the film at the non-hollow part.
According to the evaporation mask plate designed by the scheme, the periphery of the first mask substrate 1 is inwards sunken, the electrified coil 3 is wound at the sunken part, the electrified coil 3 and the first mask substrate 1 form an adjustable magnet, the polarity of the magnet plate 4 in the evaporation chamber is just opposite to that of the magnet plate 4, the gravity (indicated by G in figure 5) of the evaporation mask plate and the Lorentz magnetic force (indicated by F in figure 5) of the magnet plate 4 are balanced, the optimal gap between the evaporation mask plate and the glass substrate 5 is obtained, and the evaporation film forming uniformity is optimized;
through design circular telegram coil 3 in the sunken department of first mask base plate 1, the polarity of coating by vaporization mask plate and the size of lorentn magnetic force are adjusted to the size of the direction of accessible regulating current and electric current, realize with the balance of own gravity, eliminate the influence that the coating by vaporization mask plate was brought by the magnetization, reduce the clearance of glass substrate 5 and mask plate to improve the yield of coating by vaporization device, improve product quality.
Referring to fig. 5, by adjusting the gap (indicated by H in fig. 5) between the evaporation mask and the glass substrate 5, the penetration of the thin film in the gap can be reduced, and the distance of the shadow region can be reduced;
when the shadow area of the film becomes long, the current in the electrified coil 3 can be increased, so that the magnetism of the evaporation mask plate is increased, the attraction of the magnetic plate 4 to the evaporation mask plate is further increased, and the distance of H is shortened;
the evaporation mask plate designed by the scheme can make up for the defects that the mask plate sags due to gravity and a shadow area is lengthened to cause poor devices;
in principle, as the H value is smaller, the smaller the gap is, the smaller the free path of the ion motion is shielded, the narrower the region reached by the ions is, the smaller the length of the shadow region is, and the spring 6 is matched, so that the film can be protected from being scratched by the mask plate, the shadow region can be reduced, and the uniformity of the center and the edge of the film can be optimally adjusted.
In summary, according to the evaporation mask plate and the OLED device provided by the present invention, the first mask substrate and the second mask substrate are disposed, the first mask substrate and the second mask substrate are attached to each other, the first mask substrate is provided with the first through groove, the second mask substrate is provided with the second through groove, the electrical coil is sleeved on the outer wall of the first mask substrate, so that when the energizing coil is energized with current, the first mask substrate and the energizing coil form a magnet, thus, the cathode and the anode of the magnet can be changed by changing the direction of the current, the magnetic strength of the magnet can be controlled by adjusting the magnitude of the current, further adjusting the polarity of the evaporation mask plate and the Lorentz force, realizing the balance of the Lorentz force and the body gravity of the evaporation mask plate, therefore, the influence of magnetization of the evaporation mask plate is eliminated, the yield of evaporation devices is improved, and the product quality is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (7)
1. The utility model provides an evaporation mask plate, its characterized in that, includes first mask base plate, second mask base plate and circular telegram coil, first mask base plate laminates with second mask base plate each other, set up the first logical groove that is the array distribution more than two on the first mask base plate, set up the second that is the array distribution more than two on the second mask base plate and lead to the groove, the quantity that the second led to the groove is the same with the quantity in first logical groove, first logical groove sets up and communicates with each other with second logical groove one-to-one, the circular telegram coil cover is established at first mask base plate outer wall.
2. An evaporation mask according to claim 1, wherein the first mask substrate is rectangular, four sides of the first mask substrate are recessed inward, and the energizing coil is wound around the recess of the first mask substrate.
3. An evaporation mask according to claim 2, wherein the four sides of the first mask substrate are recessed inward to a depth of 5mm to 8 mm.
4. An evaporation mask according to claim 1, wherein the number of turns of the energizing coil is 40-60 turns.
5. A mask according to claim 1, wherein the first mask substrate has a thickness of 4mm to 10mm, and the second mask substrate has a thickness of 0.1mm to 0.3 mm.
6. An OLED device is characterized by comprising a magnetic plate, wherein a glass substrate and the evaporation mask plate of any one of claims 1 to 5 are sequentially stacked on one side surface of the magnetic plate;
the glass substrate is in contact with the magnetic plate, and a space is arranged between the glass substrate and the evaporation mask plate.
7. The OLED device according to claim 6, further comprising a spring, wherein one end of the spring is fixedly connected with one side face, close to the evaporation mask plate, of the magnetic plate, and the other end, opposite to one end of the spring, of the spring is fixedly connected with one side face, close to the magnetic plate, of the evaporation mask plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010494508.7A CN111676444A (en) | 2020-06-03 | 2020-06-03 | Evaporation mask plate and OLED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010494508.7A CN111676444A (en) | 2020-06-03 | 2020-06-03 | Evaporation mask plate and OLED device |
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| Publication Number | Publication Date |
|---|---|
| CN111676444A true CN111676444A (en) | 2020-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010494508.7A Pending CN111676444A (en) | 2020-06-03 | 2020-06-03 | Evaporation mask plate and OLED device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114032500A (en) * | 2021-11-19 | 2022-02-11 | 昆山国显光电有限公司 | Mask plate assembly |
| CN114643180A (en) * | 2022-02-28 | 2022-06-21 | 长电集成电路(绍兴)有限公司 | Photoresist curing device |
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| JP2013204129A (en) * | 2012-03-29 | 2013-10-07 | Hitachi High-Technologies Corp | Vacuum deposition device and vacuum deposition method |
| CN107858650A (en) * | 2017-11-22 | 2018-03-30 | 京东方科技集团股份有限公司 | A kind of evaporated device and evaporation coating method |
| CN109072401A (en) * | 2016-03-10 | 2018-12-21 | 鸿海精密工业股份有限公司 | The manufacturing method of exposure mask, evaporation coating device, evaporation coating method and organic EL display device is deposited |
| CN212955305U (en) * | 2020-06-03 | 2021-04-13 | 福建华佳彩有限公司 | Evaporation mask plate and OLED device |
-
2020
- 2020-06-03 CN CN202010494508.7A patent/CN111676444A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013204129A (en) * | 2012-03-29 | 2013-10-07 | Hitachi High-Technologies Corp | Vacuum deposition device and vacuum deposition method |
| CN109072401A (en) * | 2016-03-10 | 2018-12-21 | 鸿海精密工业股份有限公司 | The manufacturing method of exposure mask, evaporation coating device, evaporation coating method and organic EL display device is deposited |
| CN107858650A (en) * | 2017-11-22 | 2018-03-30 | 京东方科技集团股份有限公司 | A kind of evaporated device and evaporation coating method |
| CN212955305U (en) * | 2020-06-03 | 2021-04-13 | 福建华佳彩有限公司 | Evaporation mask plate and OLED device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114032500A (en) * | 2021-11-19 | 2022-02-11 | 昆山国显光电有限公司 | Mask plate assembly |
| CN114643180A (en) * | 2022-02-28 | 2022-06-21 | 长电集成电路(绍兴)有限公司 | Photoresist curing device |
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