KR20190062380A - A substrate carrier for supporting a substrate, a mask chucking device, a vacuum processing system, and a method of operating a substrate carrier - Google Patents

Abstract

The present disclosure provides a substrate carrier for supporting a substrate in a vacuum chamber, a mask chucking apparatus, a vacuum processing system, and a method for operating an electro permanent magnet element, in accordance with the independent claims. According to an aspect of the present disclosure, a substrate carrier for supporting a substrate in a vacuum chamber is provided. The substrate carrier includes an electromagnetically permanent magnet element, wherein the electromagnetically permanent magnet element is configured to apply a magnetic holding force to the mask. According to another aspect of the present disclosure, a vacuum processing system is provided. The vacuum processing system includes a vacuum processing chamber having at least one substrate carrier or mask chucking device, according to other aspects of the present disclosure. According to a further aspect of the present disclosure, a method is provided for operating an electromagnetically permanent magnet element in a system including an electromagnetically permanent magnet element. The method includes providing a mask carrier on a surface of a substrate supported by a substrate carrier, switching the electromagnet element from a non-magnetizing state to a magnetizing state by applying a current in the electromagnet, .

Description

A substrate carrier for supporting a substrate, a mask chucking device, a vacuum processing system, and a method of operating a substrate carrier

[0001] Embodiments of the present disclosure are directed to devices and methods for securing and supporting a mask on a substrate carrier. In particular, embodiments of the present disclosure are directed to devices and methods for securing and supporting a mask on a substrate carrier, particularly in a processing system having a vacuum process chamber for OLED manufacturing.

[0002] BACKGROUND OF THE INVENTION Opto-electronic devices using organic materials, such as organic light emitting diodes (OLEDs), are becoming more and more popular for a number of reasons. OLEDs are special types of light emitting diodes in which the light emitting layer comprises a thin film of certain organic compounds. Organic light emitting diodes (OLEDs) are used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc. for displaying information. OLEDs can also be used for general spatial illumination. Possible color ranges, brightness, and viewing angles in OLED displays are greater than the color range, brightness, and viewing angles of conventional LCD displays because OLED pixels emit light directly, which does not require a backlight. Thus, the energy consumption of OLED displays is significantly less than the energy consumption of conventional LCD displays. In addition, the fact that OLEDs can be fabricated on flexible substrates creates additional applications.

[0003] The functionality of the OLED depends on the thickness of the coating of the organic material. This thickness must be within a predetermined range. In the production of OLEDs, there are technical difficulties in the deposition of evaporated materials to achieve high resolution OLED devices. In particular, it remains a challenge to accurately and smoothly transport substrate carriers and masks through a processing system. In addition, precisely fixing and supporting the mask on the substrate carrier to achieve high quality processing results remains a challenge, for example, for the production of high resolution OLED devices.

[0004] Accordingly, there is a continuing need to provide improved apparatus and methods for securing and supporting a mask on a substrate carrier.

[0005] In view of the foregoing, there is provided, in accordance with the independent claims, a substrate carrier for supporting a substrate and a mask in a vacuum chamber, a vacuum processing system, and a method for operating a substrate carrier. Further aspects, benefits, and features of the present disclosure are apparent from the claims, the description, and the accompanying drawings.

[0006] According to aspects of the present disclosure, a substrate carrier for supporting a substrate and a mask in a vacuum chamber is provided. The substrate carrier comprises an electropermanent magnet element, wherein the permanent magnet element is configured to apply a magnetic holding force to the mask.

[0007] According to another aspect of the present disclosure, a vacuum processing system is provided. A vacuum processing system includes a vacuum processing chamber having at least one substrate carrier in accordance with other aspects of the present disclosure.

[0008] According to a further aspect of the present disclosure there is provided a method for operating a substrate carrier for supporting a substrate and a mask carrier, wherein the substrate carrier comprises an electromagnetically permanent magnet element. The method includes providing a mask carrier on a surface of a substrate supported by a substrate carrier, switching the electromagnet element from a non-magnetizing state to a magnetizing state by applying a current in the electromagnet, .

[0009] Embodiments also relate to apparatus for performing the disclosed methods and apparatus portions for performing each of the described method aspects. These methodological aspects may be performed by hardware components, by a computer programmed by appropriate software, by any combination of the two, or in any other manner. In addition, embodiments in accordance with the present disclosure also relate to methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for performing all of the respective functions of the apparatus.

[0010] In the manner in which the above-recited features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be had by reference to embodiments. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings relate to embodiments of the present disclosure and are described below.
Figure 1a shows a schematic side view of a substrate carrier according to embodiments described herein.
Figure 1B shows a schematic side view of a substrate carrier according to further embodiments described herein.
Figure 2a illustrates a schematic side view of an electro permanent magnet assembly of a substrate carrier, in accordance with embodiments described herein.
Figure 2B shows a schematic side view of an electro permanent magnet assembly of a substrate carrier, according to embodiments described herein.
Figure 3 shows a schematic side view of an electro permanent magnet assembly of a substrate carrier, in accordance with embodiments described herein.
Figure 4 shows a schematic side view of a vacuum processing system in accordance with the embodiments described herein.
Figure 5 shows a flow diagram illustrating a method for operating a substrate carrier and a mask carrier, in accordance with embodiments described herein.

[0011] Reference will now be made in detail to various embodiments, and one or more examples of various embodiments thereof are illustrated in the figures. Each example is provided as an illustration, and is not intended as a limitation. For example, features illustrated or described as part of an embodiment may be used with any other embodiment or for any other embodiment to yield further embodiments. It is intended that the disclosure cover such modifications and variations.

[0012] In the following description of the drawings, the same reference numbers refer to the same or similar components. In general, only differences for the individual embodiments are described. Unless otherwise specified, the description of parts or aspects in one embodiment may be applied to corresponding parts or aspects in other embodiments as well.

[0013] Before various embodiments of the present disclosure are described in further detail, some aspects of some terms and expressions used herein are described.

[0014] 1A and 1B illustrate schematic side views of a substrate carrier 100 in accordance with the embodiments described herein. In particular, in accordance with embodiments that may be combined with any other embodiment described herein, the substrate carrier 100 is configured to support the substrate 101 and the mask 401 in a vacuum chamber, (200). The permanent magnet element 200 is configured to apply a magnetic holding force to the mask 401. The permanent magnet element 200 is shown in a non-magnetized state in which a magnetic holding force is not applied to the mask 401 in FIG. 1A, and is in a magnetized state in which a magnetic holding force is applied to the mask 401 in FIG. do.

[0015] In this disclosure, " substrate carrier " should be understood as a carrier as described herein, particularly a carrier configured to hold a large area substrate. Typically, a substrate held or supported by a substrate carrier includes a front surface and a rear surface, wherein the front surface is a substrate surface to be processed, e.g., a substrate surface on which the material layer is to be deposited.

[0016] The term " substrate " as used herein in particular will encompass substantially unmanipulated substrates, such as glass plates and metal plates. However, the present disclosure is not so limited, and the term " substrate " may also encompass flexible substrates such as webs or foils. The term " substantially unlikely " is understood to mean " flexible ". Specifically, a substantially non-flexible substrate, for example, a glass plate having a thickness of 0.9 mm or less, such as 0.5 or less, may have some degree of flexibility, wherein the flexibility of the substantially non- . According to the embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be formed of any material or material that can be coated by a deposition process, such as glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, ≪ / RTI > and combinations thereof.

[0017] According to some embodiments, the substrate can be a "large area substrate" and can be used for display manufacturing. For example, a " large area substrate " may have a major surface having an area of 0.5 m ² or greater, specifically 1 m ² or greater. In some embodiments, the large area substrate has GEN 4.5 corresponding to a substrate of about 0.67 m ² (0.73 x 0.92 m), GEN 5 corresponding to a substrate of about 1.4 m ² (1.1 mx 1.3 m), a height of about 4.29 m ² corresponding to the substrate (1.95 mx 2.2 m) GEN 7.5 , GEN 8.5, or even, the substrate (2.85 mx 3.05 m) of about 8.7 m ² corresponding to a substrate (2.2 mx 2.5 m) of approximately 5.7 m ^2, which corresponds to 0.0 > 10 < / RTI > Larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.

[0018] The permanent magnet element 200 is configured to apply a magnetic holding force to the mask 401. The magnetic holding force acting on the mask 401 causes the mask 401 to be pulled toward the surface of the substrate 101 so that the mask 401 is moved to the surface of the substrate 101 . ≪ / RTI > The magnetic holding force may be sufficient to cause the mask 401 to be held at the fixed position with respect to the substrate 101. [ The holding mask 401 in the fixed position enables an improvement in the quality of the layers deposited on the substrate 101 during processing, which can be achieved during the processing stages, between the processing stages, Since any movement of the mask 401 is suppressed.

[0019] According to embodiments described herein, the deposition of materials using pattern masks, such as a fine metal mask (FMM), can be provided on large area substrates. Thus, the size of the area over which the material is to be deposited is, for example, 1 m ² or more. In addition, the pattern mask for pixel creation of the display, for example, provides a pattern in the micron range. The positioning tolerances of the apertures of the pattern mask in the micron range can be complicated for large areas. This is especially true for vertically or essentially vertically oriented substrates. Even gravity acting on each frame of the pattern mask and / or pattern mask can degrade the positioning accuracy of the pattern mask. Thus, improved chucking arrangement for chucking a pattern mask on a substrate is particularly beneficial for vertical (essentially vertical) substrate processing.

[0020] The substrate carrier 100 is configured to support the substrate 101 and the mask 401 in a vacuum chamber. The vacuum chamber may be any closed chamber in which the interior of the vacuum chamber is maintained at a pressure lower than the ambient pressure outside the vacuum chamber. The vacuum chamber may be a processing chamber in which the substrate 101 is processed. Such processing operations include depositing material on the surface of the substrate 101, etching the material layer of the substrate 101, applying heat to the substrate 101, or cooling the substrate 101 can do. Alternatively, the vacuum chamber may be a transport chamber or a transport chamber in which the substrate 101 is transported or transported from one vacuum chamber to another vacuum chamber. Alternatively, the vacuum chamber may be a load lock chamber capable of transferring the substrate 101 between one vacuum chamber maintained at a constant pressure and another vacuum chamber maintained at a different pressure.

[0021] The substrate carrier 100 is configured to support the mask 401. A mask 401 is provided on the surface of the substrate 101. The mask 401 may comprise a plurality of holes defining a masking pattern for selective deposition of material onto the surface of the substrate 101. [

[0022] The mask 401 may include any structure that allows providing a plurality of holes to define a masking pattern. For example, the mask 401 may comprise a flat plate element in which holes are created through an etching process or a machining process. The mask 401 may be a fine metal mask (FMM).

[0023] The mask 401 may include at least one element including a magnetically attractable material, e.g., metal, so that a magnetic holding force is applied to the mask 401 by the permanent magnet element 200 , Which has the effect of holding the mask 401 at the fixed position on the surface of the substrate 101. [ All of the structural elements of the mask 401 may include a magnetically attractable material or only a portion of the structural elements of the mask 401 may comprise a magnetically attractable material .

[0024] The mask 401 may be an edge exclusion mask or a shadow mask. An edge exclusion mask is a mask configured to mask one or more edge zones of a substrate such that material is not deposited on one or more edge zones during coating of the substrate 101. The shadow mask is a mask configured to mask a plurality of features to be deposited on the substrate 101. For example, the shadow mask may comprise a plurality of small openings, e.g., a grid of small openings. For example, a plurality of small apertures may correspond to pixels of the display.

[0025] The mask 401 may be mounted on the mask carrier 400. In this disclosure, " mask carrier " should be understood as a carrier configured to hold a mask. The mask 401 may comprise a thin plate element having a plurality of apertures defining a masking pattern for selective deposition. Thus, mask 401 may have insufficient stiffness to effectively mount on substrate carrier 100 and demount from substrate carrier 100. The mask carrier 400 including the mask carrier frame 402 can hold and hold the mask 401 at the peripheral edge of the mask 401 and the mask 401 can be mounted on the substrate carrier 100 And can be removed from the substrate carrier 100 to provide sufficient rigidity. The mask carrier 400 may comprise a magnetically attractable material, such as a metal, such that the mask carrier 400 is also held stationary by a magnetic holding force generated by the permanent magnet element 200, Can be pulled toward the surface 304.

[0026] The electromagnet permanent magnet element 200 and the electrostatic chuck 300 may be integrated within the common carrier body of the substrate carrier 100. For example, the electrostatic chuck 300 may be embedded in a first inner volume of the carrier body, and the permanent magnet element 200 may be embedded in a second inner volume of the carrier body. Alternatively or additionally, the electrostatic chuck 300 and the electromagnet element 200 may be attached or fixed by, for example, attaching or fixing both the electrostatic chuck 300 and the electromagnet element 200 to the same carrier body, So that the electrostatic chuck 300 and the permanent magnet element 200 can be transported and moved as a single unit. For example, the carrier body may be formed as a unitary plate structure in which both the electrostatic chuck 300 and the permanent magnet element 200 are arranged. As a further example, the electrostatic chuck 300 and the permanent magnet element 200 may be integrated with each other.

[0027] The electrostatic chuck 300 may be arranged between the permanent magnet element 200 and the substrate 101, as exemplarily shown in Figs. 1A and 1B. Alternatively, the permanent magnet element 200 may be arranged between the electrostatic chuck 300 and the substrate 101.

[0028] Figures 1A and 1B illustrate an exemplary permanent magnet element 200 as part of a substrate carrier 100. According to further embodiments, which may be combined with other embodiments described herein, the electromagnet permanent magnet element 200 may be a separate, non-volatile structure provided near the substrate carrier, e.g., at a position to cause the mask to be pulled towards the substrate Lt; / RTI > A mask chucking device may be provided in the vacuum chamber. The apparatus includes an electromagnet permanent magnet element, the electromagnet permanent magnet element comprising: a first permanent magnet; At least one second permanent magnet; And a control magnet assembly having at least one control magnet and an electromagnet adjacent to the at least one control magnet.

[0029] The mask chucking device may be provided in a position to cause the mask to be pulled from the vacuum chamber to the substrate on the substrate carrier. The features, details, and aspects of the permanent magnet element 200 described with respect to other examples having the permanent magnet element 200 as part of the substrate carrier can be correspondingly utilized.

[0030] The substrate carrier 100 may be configured to support the substrate 101 and the mask 401 in a non-horizontal orientation, particularly an intrinsic vertical orientation. As used herein, " intrinsic vertical orientation " is understood as an orientation in which the angle between the gravitational vector and the major surface of the substrate carrier 100 is between + 10 ° and -10 °, specifically between 5 ° and -5 ° . In some embodiments, the orientation of the substrate carrier 100 is not perpendicular (precisely) during transport and / or during deposition, e.g., at an oblique angle of 0 [deg.] To -5 [deg.], May be slightly inclined relative to the vertical axis. Negative angles refer to the orientation of the substrate carrier 100 in which the substrate carrier 100 is tilted downward, i.e., the substrate surface to be processed is facing downward. Deviations of the orientations of the mask 401 and substrate 101 during deposition from the gravitational vector can be beneficial and can result in a more stable deposition process or a downward orientation can reduce the particles on the substrate during deposition . However, accurate vertical alignment (+/- 1 [deg.]) Of the mask device during transport and / or during deposition is also possible.

[0031] Larger angles between the gravitational vector and the substrate carrier 100 during transport and / or during deposition are also possible. Angles of 0 [deg.] To +/- 30 [deg.] May be understood as " non-horizontal orientations " as used herein. Transporting the substrate carrier 100 in a non-horizontal orientation can save space and enable smaller vacuum chambers.

[0032] The substrate carrier 100 may further include a power supply element 104 configured to provide power to the permanent magnet element 200. The power supply element 104 may be an external power supply that is not attached to the substrate carrier 100 or integrated into the substrate carrier 100. Alternatively, the power supply element 104 may be attached to the substrate carrier 100 or incorporated into the substrate carrier 100. 2A and 2B, the power supply element 104 may include one or more power supply elements 104 that may be suitable for switching the electromotive permanent magnet element 200 between the magnetized state and the non-magnetized state, Electric pulses, such as one or more current pulses. For example, ten or more pulses may be provided. Depending on the number of pulses, the magnetization of the at least one control magnet 204 can be varied and / or adjusted. The magnetization affects the magnetic holding force acting on the mask.

[0033] According to further embodiments, which may be combined with other embodiments described herein, the magnetic force may be adjusted to be zero in the plane of the substrate and / or the mask. The magnetic forces of the various elements are canceled each other, or magnetic flux lines are guided away from the substrate or mask.

[0034] When the power supply element 104 is located outside of the substrate carrier 100, this is because only at the designated points in the vacuum processing system, due to the bistable characteristics of the electromagnet permanent magnet element 200, The power supply can be advantageous. For example, the power supply element 104 may be provided in a mask mounting station in a vacuum processing system, so that power is provided to the electromagnet permanent magnet element 200 only by the power supply element 104 in the mask mounting station . Thus, while the substrate carrier 100 is being transported throughout the vacuum processing system, the electromagnet permanent magnet element 200 is inadvertently switched to the non-magnetizing state, causing the mask (not shown) 401) is not likely to occur.

[0035] According to embodiments that may be combined with any of the other embodiments described herein, the substrate carrier 100 further includes an electrostatic chuck 300 that includes a substrate support surface 304. The electrostatic chuck 300 includes insulating layers 301 and 303 and an electrode layer 302. The surfaces of the insulating layers 301, 303 may form a substrate support surface 304.

[0036] An electrostatic chuck 300 (also referred to herein as an " e-chuck ") may be used to pull the substrate 101 into the substrate support surface 304 of the substrate carrier 100 during substrate processing. For example, the substrate 101 may include a material, such as a dielectric material, that can be pulled toward the substrate support surface 304 by electrostatic forces, such that the substrate 101 may be pulled in direct contact with the substrate support surface 304 . Holding of the substrate 101 may also be possible during high temperature processes, coating processes, and plasma processes in a vacuum environment.

[0037] The electrostatic chuck 300 includes insulating layers 301 and 303. The insulating layers 301 and 303 may be formed of a dielectric material such as a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or equivalent materials such as thermally resistant polymeric materials such as polyimide- . ≪ / RTI > The electrodes of the electrostatic chuck may each be connected to a power supply, for example a voltage source, capable of applying a predetermined voltage to the electrodes to produce a predetermined electrostatic holding force.

[0038] The electrostatic chuck 300 includes an electrode layer 302 including a plurality of electrodes. The plurality of electrodes may be coupled to a power supply element 105, e.g., a voltage source, that can apply a predetermined voltage to the electrodes to produce a predetermined static charge that may be adjustable on the substrate support surface 304.

[0039] The substrate carrier 100 may further include a substrate support surface 304. The substrate support surface 304 may be the surface of the electrostatic chuck 300 or may be the surface of another element provided on the electrostatic chuck 300. In particular, the substrate support surface 304 may be the surface of one of the insulating layers 301, 303. The substrate support surface 304 is configured to support the substrate 101 and includes a surface that supports the substrate 101 over the entire surface of the substrate 101. The substrate support surface 304 may have an area equal to or greater than the area of the substrate 101. [

[0040] The substrate support surface 304 may be electrostatically charged by the electrostatic chuck 300. Electrostatic charging of the substrate support surface 304 has the effect of attracting the substrate 101 to the substrate support surface 304 such that the substrate 101 is electrostatically chucked to the substrate carrier 100.

[0041] The substrate support surface 304 can be a flat surface so that the substrate support surface 304 supports the substrate 101 over the entire area of the substrate 101. [ Alternatively, the substrate support surface 304 may have a non-planar surface. In particular, the substrate support surface 304 may have a surface shaped to conform to the shape of the substrate 101.

[0042] The substrate carrier 100 may further include a power supply element 105 configured to provide power to the electrostatic chuck 300. The power supply element 105 may be an external power supply that is not attached to the substrate carrier 100 or integrated into the substrate carrier 100. Alternatively, the power supply element 105 can be attached to the substrate carrier 100 or integrated into the substrate carrier 100. The power supply element 105 may generate an electric pulse, such as a current pulse, that may be suitable for switching the electromagnet permanent magnet element 200 between a magnetized state and a non-magnetized state.

[0043] The power supply element 105 provides power to the permanent magnet element 200 so that a single power supply element provides power to both the permanent magnet element 200 and the electrostatic chuck 300 individually and independently Lt; RTI ID = 0.0 > 104 < / RTI > Such a merged single power supply element may be integrated within the substrate carrier 100, or may be located external to the substrate carrier 100.

[0044] The electrostatic chuck 300 may be configured as a monopolar chuck, a bipolar chuck, or a multi-pole chuck. &Quot; Unipolar chuck " can be understood as an electrostatic chuck comprising a power supply, e.g., one or more electrodes connectable to a high voltage source. The power supply element 104 is configured to provide a single polarity voltage to a plurality of electrodes. For example, a positive voltage may be applied to a plurality of electrodes of the electrostatic chuck 300, thereby causing a negative charge to be induced on the substrate support surface 304 of the substrate carrier 100. Alternatively, a negative voltage may be applied to the plurality of electrodes, thereby causing a positive charge to be induced on the substrate support surface 304 of the substrate carrier 100.

[0045] A " bipolar chuck assembly " as used herein can be understood as an electrostatic chuck comprising at least one first electrode and at least one second electrode connectable to a power supply, e.g. a high voltage source. The power supply element 104 is configured to provide a first polarity voltage to the first electrodes and a second polarity voltage to the second electrodes. For example, a negative voltage may be applied to the first electrodes, a positive voltage may be applied to the second electrodes, or vice versa. Accordingly, corresponding negatively charged regions and corresponding positively charged regions can be generated in the substrate support surface 304 by electrostatic induction.

[0046] In a multipolar chuck assembly, a plurality of electrodes, which may be independently controllable, may be provided.

[0047] The electrostatic chuck 300 may include at least one first electrode and at least one second electrode wherein a positive voltage (+) is applied to the first electrode through the power supply element 104, e.g., a high voltage source, ), And a negative voltage (-) is applied to the second electrode. In order to increase the gripping force provided by the electrostatic chuck 300, at least one first electrode may be interleaved with at least one second electrode. Alternatively or additionally, the first electrodes and the second electrodes may be arranged alternately. For example, the electrostatic chuck 300 may include a plurality of wires that are positively and negatively charged in an alternating manner.

[0048] According to embodiments that may be combined with any of the other embodiments described herein, the permanent magnet element 200 is switchable between a magnetized state and a non-magnetized state by applying an electric current. For example, a power supply element 104 for supplying current to the permanent magnet element 200 may be provided. Applying a current causes the magnetic field of the permanent magnet element 200 to be reconfigured, which in turn causes the magnetic force applied to the mask carrier 400 to change.

[0049] According to embodiments that may be combined with any of the other embodiments described herein, the electromagnet permanent magnet element 200 includes a first permanent magnet 201, At least one second permanent magnet 202 and a control magnet assembly having at least one control magnet 204 and an electromagnet 205 adjacent to the at least one control magnet 204, . The permanent magnet element 200 as shown in FIG. 2A is in a non-magnetizing state while the permanent magnet element 200 as shown in FIG. 2B is in a magnetized state, So that the mask 200 can apply a magnetic force to the mask 401 to precisely fix the mask 401 to a proper position on the substrate 101. [

[0050] The electromagnet permanent magnet element 200 includes a first permanent magnet 201 having a first polarity 201a and a second polarity 201b and a second permanent magnet 201 having a first polarity 202a and a second polarity 202b, Of the second permanent magnet (202). The first permanent magnet 201 and the at least one second permanent magnet 202 are arranged so that their adjacent polarities are the same. For example, in the permanent magnet element 200 shown illustratively in FIGS. 2A and 2B, adjacent second polarities 201b, 201b of the first permanent magnet 201 and the at least one second permanent magnet 202, respectively, 202b may both be configured as north polarities.

[0051] The first permanent magnet 201 and the at least one second permanent magnet 202 may be designated as " clamping magnets ", so that the first permanent magnet 201 and the at least one second permanent magnet 202 Form a " clamping magnet assembly ". The clamping magnet assembly of the permanent magnet element 200 is configured to generate a magnetic field required to apply a magnetic holding force to the mask 401 in the sense of " clamping " the mask 401 to the substrate 101.

[0052] The control magnet assembly includes at least one control magnet (204) having a first polarity (204a) and a second polarity (204b). At least one control magnet (204) may generate a magnetic field sufficient to control the state of the permanent magnet element (200). 2A, when at least one control magnet 204 is polarized with a first polarization, the magnetic field generated by the at least one control magnet 204 is applied to the permanent magnet element 200 Non-magnetized state. By switching the first and second polarities 204a, 204b of the at least one control magnet 204 so that at least one control magnet 204 is polarized with a second polarization, as illustrated by way of example in FIG. 2B , The magnetic field generated by at least one control magnet (204) configures the electromagnet permanent magnet element (200) to be magnetized so that a magnetic holding force is applied to the mask (401).

[0053] The electromagnet 205 can be positioned near the control magnet 204. [ The electromagnet 205 may substantially surround at least one control magnet 204. [ The electromagnet (205) is configured to switch the polarity of the at least one control magnet (204). The electromagnet 205 may comprise at least one coil, or at least one winding of an electrically conductive wire. Directing the current to at least one coil of the electromagnet 205 produces a magnetic field, e.g., an inverse magnetic field, in the electromagnet 205. If the inverse magnetic field in the electromagnet 205 exceeds the resistance to intrinsic coercivity or demagnetization of the at least one control magnet 204, then the inverse magnetic field is such that the polarity of at least one control magnet 204 changes from the first polarity to the second Polarity.

[0054] Applying the first current causes the electromagnet element 200 to switch from the non-magnetization state to the magnetization state while applying the second current different from the first current causes the electromagnet element 200 to be in the magnetized state To a non-magnetizing state. The first current may be applied in the forward direction and the second current may be applied in the reverse direction.

[0055] A current applied to switch the electromagnet permanent magnet element 200 between the non-magnetizing state and the magnetizing state may be provided, where a power of 1 kW or more, such as 8 kW or more, is provided. The current can be applied for a duration of less than 3 seconds, specifically less than 1 second, more specifically 0.3 seconds to 1 second.

[0056] According to embodiments that may be combined with any of the other embodiments described herein, the permanent magnet element 200 is configured to remain in a magnetized or non-magnetized state after removal of the current. After application of current to the permanent magnet element 200 and subsequent removal of the current, the configuration of the magnetic field produced by the permanent magnet element 200 is maintained in a stable state. Thus, the permanent magnet element 200 exhibits a bistable behavior in a stable non-magnetizing state and a stable magnetizing state. Constructing the electromagnet permanent magnet element 200 in a bistable manner allows the mask carrier 400 to remain fixed to the substrate carrier 100 even when power is not applied, Thereby accurately fixing the mask carrier 400 in place.

[0057] At least two permanent magnets 201 and 202 and at least one control magnet 204 comprise certain magnetic alloys to obtain desired magnetic properties. The material of the first permanent magnet 201 and the at least one second permanent magnet 202 should be suitable for generating high magnetic fields for effectively securing the mask 401 in place. Additionally or alternatively, the intrinsic coercive force of the first permanent magnet 201 and the at least one second permanent magnet 202 is higher than the magnetic field generated by the at least one control magnet 204. At least one control magnet 204 does not produce a strong magnetic field for switching the polarity of the at least two permanent magnets 201, 202. In this sense, at least two permanent magnets 201, 202 may be referred to as "hard" magnets while at least one control magnet 204 is referred to as a "soft" .

[0058] According to embodiments that may be combined with any of the other embodiments described herein, the electromagnet permanent magnet element 200 is disposed between the first permanent magnet 201 and the at least one second permanent magnet 202 Wherein at least one core element (203) comprises a ferromagnetic material.

[0059] The at least one core element 203 may comprise a ferrous material. In particular, at least one core element 203 may comprise carbon steel, ferritic stainless steel, or martensitic stainless steel. If the at least one core element 203 comprises a ferromagnetic material, the strength of the magnetic field produced by the permanent magnet element 200 is enhanced. An enhanced magnetic holding force is applied to the mask 401 to hold the mask 401 in the fixed position on the surface of the substrate 101. [ In addition, when at least one core element 203 comprises a ferromagnetic material, the magnetic field generated by the permanent magnet element 200 is more evenly distributed over the entire surface of the permanent magnet element 200, So that the magnetic holding force can be applied to the mask 401 more evenly.

[0060] 3, the electromagnet permanent magnet element 200 includes a plurality of permanent magnet elements 201, 202, a plurality of control magnets 204, a plurality of core elements 203, And may include a plurality of electromagnets 205. The permanent magnet elements 201 and 202 are arranged such that the polarity of one permanent magnet element 201 and 202 facing the surface of the adjacent core element 203 faces the other surface of the same adjacent core element 203 202 are the same as the polarities of the permanent magnet elements 201, 202. The permanent magnet element 200 shown in Fig. 3 is in a magnetized state, where a magnetic holding force is applied to the mask 401. Fig.

[0061] An electropositive element 200 having a plurality of permanent magnet elements 201 and 202 and a plurality of core elements 203 is configured such that a magnetic field generated by the electropagnet element 200 is applied to the substrate support surface 304, Lt; RTI ID = 0.0 > and / or < / RTI > In addition, the resulting magnetic field may have a higher intensity than the arrangement comprising only one permanent magnet element 201, 202 and one core element 203, respectively.

[0062] According to embodiments that may be combined with other embodiments described herein, a first permanent magnet 201, at least one second permanent magnet 202, and at least one core element 203 define Is at least 80% of the area of the substrate (101).

[0063] The area defined by the first permanent magnet 201, the at least one second permanent magnet 202, and the at least one core element 203 may be referred to as the effective area of the permanent magnet element 200. The effective area of the permanent magnet element 200 is an area where a magnetic field is generated by the permanent magnet element 200 and accordingly an area where a magnetic holding force is applied to the mask 401. [

[0064] The effective area of the permanent magnet element 200 may be smaller than the area of the substrate 101. [ For example, the effective area may be at least 80% of the area of the substrate 101. When the effective area is smaller than the area of the substrate 101, the permanent magnet element 200 applies a magnetic holding force to the mask 401 at a smaller area than the substrate 101. [ This feature has the effect of preventing the mask 401 from being pulled around the edges of the substrate 101, which can prevent damage to the edges of the substrate 101 or the mask 401.

[0065] Alternatively, the effective area of the electromagnet element 200 may be greater than the area of the substrate 101. For example, the effective area may be at most 110% of the area of the substrate 101, specifically at most 130% of the area of the substrate 101. When the effective area is larger than the area of the substrate 101, the magnetic field generated by the permanent magnet element 200 also applies a magnetic holding force to the elements of the mask 401 outside the area of the substrate 101 . For example, the permanent magnet element 200 may also apply a magnetic holding force to the mask carrier 400, which may cause the mask carrier 400 to be chucked to the substrate carrier 100, .

[0066] According to embodiments that may be combined with any of the other embodiments described herein, the first permanent magnet 201 and the at least one second permanent magnet 202 comprise a rare earth metal. In particular, the first permanent magnet 201 and the at least one second permanent magnet 202 may comprise a neodymium alloy. The permanent magnets 201 and 202 including the neodymium alloy can be magnetized to generate a high magnetic field, and have high coercive force, or resistance to magnetic erasure. Having a high coercive force makes it possible to resist at least two permanent magnets 201, 202 being magnetically erased by at least one control magnet 204.

[0067] According to embodiments that may be combined with any of the other embodiments described herein, at least one of the control magnets 204 includes an aluminum nickel cobalt (AlNiCo) alloy. If at least one control magnet 204 comprises an AlNiCo alloy, then at least one control magnet 204 may be used to generate a strong magnetic field for switching the electromagnet permanent magnet element 200 between the non- Can be magnetized. AlNiCo magnets have high coercivity, or resistance to magnetic erasure. However, the AlNiCo magnets have a lower coercive force than the coercive force of the neodymium alloy contained in the permanent magnets 201, 202. An electric current may be applied to the electromagnet 205 to generate an inverse magnetic field for switching the polarity of at least one control magnet 204 comprising an AlNiCo alloy.

[0068] Figure 4 shows a schematic side view of a vacuum processing system 500 in accordance with a further aspect described herein. In particular, and in accordance with embodiments that may be combined with other embodiments described herein, the vacuum processing system 500 may include a vacuum processing system 100 having at least one substrate carrier 100 in accordance with the embodiments described herein And includes a chamber 501.

[0069] The vacuum processing chamber 501 may include one or more processing devices 502 arranged therein. The one or more processing devices 502 may be operable to perform one or more processing operations within the vacuum processing chamber 501. One or more of the processing devices 502 may include a deposition device, a thermal processing device, a cooling device, or any other device that performs processing operations. The vapor deposition device may be a vaporization device, which includes a crucible for housing the material to be vaporized and at least one distribution pipe, the at least one distribution pipe comprising vaporized material, which is directed toward the substrate 101 For guiding towards the plurality of openings in the pipe.

[0070] The processing device 502 may be provided on a moveable support so that the processing device 502 may be moved past the substrate 101 during a processing operation. For example, if the processing apparatus 502 comprises a deposition apparatus, the deposition apparatus may be moved past the substrate 101 so that the material to be deposited is distributed over the entire surface of the substrate 101.

[0071] Vacuum processing system 500 includes at least one substrate carrier 100 in accordance with the embodiments described herein. The substrate carrier 100 may be transported into or out of the vacuum processing system 500, or through the vacuum processing system 500.

[0072] The substrate carrier 100 is arranged such that when the substrate 101 is held on the substrate support surface 304 of the substrate carrier 100 the angle between the vertical direction and the substrate 101 is 0 ° to -10 ° . In particular, the substrate 101 may be arranged such that the surface to be coated faces slightly downward during deposition. Such an arrangement has the effect of reducing the amount of particles falling on the surface of the substrate 101, thereby improving the quality of the layers of deposited material. When the substrate 101 is held at a certain angle, the processing apparatus may be arranged in parallel with the substrate 101.

[0073] The substrate 101 is attracted to the substrate support surface 304 of the substrate carrier 100 by the electrostatic chuck 300 and the mask 401 is moved by the electropagnet element 200 to the substrate support surface 304 and / And pulled toward the surface of the substrate 101.

[0074] The vacuum processing system 500 may include additional vacuum processing chambers 501 such that the vacuum processing system 500 includes a plurality of vacuum processing chambers 501. [ A plurality of vacuum processing chambers 501 may be arranged in sequence so that a first processing operation is performed in the first processing chamber and the substrate carrier 100 is transported to the second processing chamber, A second processing operation is performed in the chamber, and so on in subsequent processing chambers. The plurality of vacuum processing chambers 501 may be connected such that the vacuum environment is common to all or some of the vacuum processing chambers or the vacuum processing chambers 501 may be coupled to the vacuum processing chambers 501, Devices.

[0075] The vacuum processing system 500 may further comprise a track configured for non-contact transport. In the present disclosure, a " track configured for non-contact transport " should be understood as a track configured for contactless transport of a carrier, particularly a substrate carrier or a mask carrier. The term " non-contact type " may be understood to mean that the weight of a carrier, e.g. a substrate carrier or mask carrier, is held by magnetic force, rather than held by mechanical contact or mechanical forces. In particular, the carrier may be held in a floating or floating state using magnetic forces instead of mechanical forces. For example, in some implementations, there may be no mechanical contact between the carrier and the transport track, particularly during the lifting, movement, and positioning of the substrate carrier and / or the mask carrier.

[0076] The non-contact transport system includes a substrate carrier support rail 505 and a mask carrier support rail 506, each configured to lift at least a portion of the weight of the substrate carrier 100 and the mask carrier 400 using magnetic attraction forces can do. The non-contact transport system may further include a substrate carrier drive rail 503 and a mask carrier drive rail 504. The substrate carrier drive rail 503 and the mask carrier drive rail 504 may each be configured to translate the substrate carrier 100 and the mask carrier 400 using magnetic forces. The support rails 505 and 506 and the drive rails 503 and 504 are arranged and configured to support and / or transport the substrate carrier 100 and the mask carrier 400 in a vertical or intrinsic vertical orientation.

[0077] The substrate carrier drive rail 503 and the mask carrier drive rail 504 may each comprise linear operating elements configured to magnetically transport the mask carrier 400 and the substrate carrier 100. The linear actuating elements may be linear motors. The drive rails 503 and 504 are coupled to the substrate carrier 100 and the mask carrier 400 via the vacuum processing system 500 and into the vacuum processing system 500, .

[0078] The non-contact transport system has the advantage of zero friction transport of the substrate carrier 100 and the mask carrier 400, which reduces particle generation. Reduction of the resulting particles through transport of the substrate carrier 100 and the mask carrier 400 improves the quality of the material layers deposited on the surface of the substrate 101.

[0079] The vacuum processing system 500 may further include at least one load lock chamber. The load lock chamber allows the substrate carrier 100 to be transported from a surrounding environment (e.g., from a non-vacuum) to a vacuum environment within the vacuum processing chamber 501. The load lock chamber may include a vacuum pump to create a vacuum inside the load lock chamber and may further include at least one valve for venting the load lock chamber to the environment.

[0080] The vacuum processing system 500 may further include a mask alignment device. Proper alignment of the mask 401 with respect to the substrate 101 can be performed while the mask carrier 400 supporting the mask 401 is mounted on the substrate carrier 100. [ The mask alignment device may include any device configured to translate or rotate the mask carrier 400 in at least one direction relative to the substrate 101. [ The mask alignment apparatus may be provided in the vacuum processing chamber 501 or may be provided in a separate vacuum chamber specific for mounting and aligning the mask carrier 400 supporting the mask 401. [

[0081] According to embodiments that may be combined with other embodiments described herein, the substrate carrier 100 is a magnetic chuck for chucking a mask 401 on a substrate 101, wherein the magnetic chuck is a chucking surface 304, and an electro permanent magnet element 200 is provided behind chucking surface 304.

[0082] Figure 5 is a flow chart for illustrating a method for operating a substrate carrier, in accordance with a further aspect described herein. The method 600 begins at block 601 and includes providing a mask carrier on the surface of the substrate that is supported by the substrate carrier (block 602), applying an electric current to the electromagnet, - switching from the magnetizing state to the magnetizing state (block 603), and removing the current (block 604), and the method ends at box 605.

[0083] At block 602, a mask carrier is provided on the surface of the substrate 101 that is supported by the substrate carrier 100. The substrate 101 can be attracted to the substrate support surface 304 by the electrostatic force generated by the electrostatic chuck 300 so that the substrate 101 is held in the fixed position. A mask carrier having a plurality of holes is then provided on the surface of the substrate 101 to define a plurality of deposition regions for depositing one or more layers of material thereon.

[0084] At block 603, the permanent magnet element 200 is switched from the non-magnetizing state to the magnetizing state. The application of the current of the electromagnet 205 creates a magnetic field in the electromagnet 205, which has the effect of switching the polarity of at least one control magnet 204. [ Switching the polarity of at least one control magnet 204 causes the electromagnet permanent magnet element 200 to switch from the non-magnetizing state to the magnetizing state. The magnetic field generated by the permanent magnets 201 and 202 applies a magnetic holding force to the mask 401 so that the mask 401 is attracted to the surface of the substrate support surface 304 and the substrate 101, ) In place.

[0085] At block 604, the current in electromagnet 205 is removed. Due to the bistable characteristics of the permanent magnet element 200, the elimination of the current allows the polarity of the at least one control magnet 204 to be maintained at the switched polarity, and then the permanent magnet element 200 So that it can be maintained in the magnetized state.

[0086] After removing the electromagnet 205 current, the mask carrier is magnetically fixed in place on the surface of the substrate 101, and the substrate carrier 100 can be transported through the vacuum processing system for processing. The permanent magnet element 200 having bistable characteristics will remain in a magnetized state and will continue to apply a magnetic holding force to the mask 401 to fix the mask 401 in place. Accordingly, movement of the mask 401 relative to the substrate 101 is also inhibited during transportation of the substrate carrier 100, resulting in higher quality and reliability of the deposited layers.

[0087] The method 600 may be performed in the order specified above to mount the mask carrier on the substrate carrier 100. [ The electric current applied to the electromagnet 205 can be applied in the forward direction so that the electromagnet permanent magnet element 200 is switched from the non-magnetizing state to the magnetizing state, A magnetic holding force is applied to fix the magnetic field to a proper position.

[0088] Conversely, the method 600 may also be performed in reverse order to unmount the mask carrier from the substrate carrier 100. When the mask carrier is removed, the applied current of the electromagnet 205 can be applied in the reverse direction, whereby the electromagnet permanent magnet element 200 is switched from the magnetized state to the non-magnetized state, Releasing the magnetic holding force exerted on the mask carrier.

[0089] According to embodiments that may be combined with any other embodiment described herein, the method 600 includes aligning the mask carrier with respect to the substrate carrier (block 602a) prior to switching the electromagnet permanent magnet element, . Aligning the mask carrier may include operating the mask alignment apparatus such that the mask carrier is translated and / or rotated to a predetermined position relative to the substrate carrier 100 and / or the substrate 101. Precise alignment of the mask carrier increases the reliability and quality of the deposited layers on the surface of the substrate 101. Alignment of the mask carrier may include a first rough alignment and subsequent fine alignment so that the mask has a thickness of 10 [mu] m or less, in particular, 3 [mu] m or less in the up-down direction and / lt; RTI ID = 0.0 > um < / RTI > or less.

[0090] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, and the scope of the present disclosure is defined by the following claims Lt; / RTI >

[0091] In particular, it will be clear to those skilled in the art, that this description, including the best modes, is for the purpose of disclosing the disclosure and also for anyone skilled in the art to make and use any devices or systems, And examples, to enable those skilled in the art to implement the described subject matter. While various specific embodiments have been disclosed above, the mutually exclusive features of the embodiments described above may be combined with one another. A patentable scope is defined by the claims, and other examples include equivalent structural elements having claims that have structural elements that do not differ from the words of the claims, or claims having non-substantive differences from the words of the claims Is intended to be within the scope of the claims.

Claims (15)

A substrate carrier for supporting a substrate in a vacuum chamber,
An apparatus comprising an electropermanent magnet element configured to apply a magnetic holding force to a mask,
A substrate carrier for supporting a substrate in a vacuum chamber. The method according to claim 1,
Further comprising a substrate support surface configured to support the substrate and an electrostatic chuck,
A substrate carrier for supporting a substrate in a vacuum chamber. 3. The method according to claim 1 or 2,
Wherein the electromagnet element is capable of switching between a magnetized state and a non-magnetized state by applying an electric current,
A substrate carrier for supporting a substrate in a vacuum chamber. The method of claim 3,
Wherein the electromagnet element is configured to remain in a magnetized or non-magnetized state after removal of the current,
A substrate carrier for supporting a substrate in a vacuum chamber. 5. The method according to any one of claims 1 to 4,
Wherein the permanent magnet element comprises:
A clamping magnet assembly comprising clamping magnets; And
A control magnet assembly comprising at least one control magnet and at least one coil
/ RTI >
Wherein the at least one coil substantially surrounds the at least one control magnet of the control magnet assembly and is configured to switch the polarity of the at least one control magnet.
A substrate carrier for supporting a substrate in a vacuum chamber. 6. The method according to any one of claims 1 to 5,
Wherein the substrate carrier is configured to support the substrate and the mask,
A substrate carrier for supporting a substrate in a vacuum chamber. A mask chucking device in a vacuum chamber,
Comprising an electromagnetically permanent magnet element,
Wherein the permanent magnet element comprises:
A first permanent magnet;
At least one second permanent magnet; And
A control magnet assembly having at least one control magnet and an electromagnet adjacent said at least one control magnet
/ RTI >
A mask chucking device in a vacuum chamber. 8. The method of claim 7,
Wherein the permanent magnet element further comprises at least one core element disposed between the first permanent magnet and the at least one second permanent magnet,
Wherein the at least one core element comprises a ferromagnetic material,
A mask chucking device in a vacuum chamber. 9. The method of claim 8,
Wherein the area defined by the first permanent magnet, the at least one second permanent magnet, and the at least one core element is at least 80%
A mask chucking device in a vacuum chamber. 10. The method according to any one of claims 7 to 9,
Wherein said first permanent magnet and said at least one second permanent magnet comprise a rare earth metal, particularly a neodymium alloy,
A mask chucking device in a vacuum chamber. 11. The method according to any one of claims 7 to 10,
Wherein the at least one control magnet comprises an aluminum nickel cobalt (AlNiCo)
A mask chucking device in a vacuum chamber. A vacuum processing apparatus, comprising a vacuum processing chamber having at least one substrate carrier according to any one of claims 1 to 6, or a mask chucking apparatus according to any one of claims 7 to 11,
Vacuum processing system. 13. The method of claim 12,
The substrate carrier is a magnetic chuck for chucking a mask on a substrate,
The magnetic chuck comprises:
A chucking surface, and the permanent magnet element provided behind the chucking surface.
Vacuum processing system. A method for operating an electromagnet permanent magnet element in a system having an electromagnet permanent magnet element,
Providing a mask carrier on a surface of a substrate supported by the substrate carrier;
Switching the electromagnet element from a non-magnetizing state to a magnetizing state by applying a current of an electromagnet; And
Removing the current
/ RTI >
A method for operating an electromagnet permanent magnet element. 15. The method of claim 14,
Further comprising aligning the mask carrier with respect to the substrate carrier prior to switching the permanent magnet element.
A method for operating an electromagnet permanent magnet element.

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