CN111668362A - Conductive film and preparation method thereof, manufacturing method of display substrate and display panel - Google Patents
Conductive film and preparation method thereof, manufacturing method of display substrate and display panel Download PDFInfo
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- CN111668362A CN111668362A CN202010564654.2A CN202010564654A CN111668362A CN 111668362 A CN111668362 A CN 111668362A CN 202010564654 A CN202010564654 A CN 202010564654A CN 111668362 A CN111668362 A CN 111668362A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a conductive film and a preparation method thereof, a manufacturing method of a display substrate and a display panel, wherein the preparation method of the conductive film comprises the following steps: forming a conductive microsphere bearing layer on the substrate, wherein a plurality of bearing holes are formed in the conductive microsphere bearing layer; forming a separation layer on the conductive microsphere bearing layer; self-assembling the conductive microspheres into the bearing holes; forming an adhesive film on the self-assembled substrate meeting the preset requirement, and adhering a first release film on the adhesive film; and peeling the substrate, the conductive microsphere bearing layer and the separation layer, and adhering a second release film to one side of the exposed conductive microspheres. According to the preparation method provided by the embodiment of the invention, the rigorous requirements on the size and density of the conductive microspheres in the preparation process are reduced, the pressure required by bonding conduction between the light-emitting device and the circuit backboard is reduced, the distribution of the conductive microspheres in the prepared conductive film is more uniform, and the conductive film is better in uniformity and thinner in thickness.
Description
Technical Field
The invention relates to the technical field of display, in particular to a conductive film and a preparation method thereof, a manufacturing method of a display substrate and a display panel.
Background
The Micro-LED has the characteristics of self-luminescence without a backlight source, has the advantages of simple structure, very long service life, high brightness, low power consumption, ultrahigh resolution and the like compared with LCD and OLED products, and has good application prospect.
However, Micro-LEDs still face a lot of difficulties in mass production, for example, there are still process problems in mass transfer and bonding with a circuit backplane, such as poor uniformity of the anisotropic conductive film used for bonding, severe requirements on the size and density of the conductive microspheres when preparing the anisotropic conductive film, and large pressure required for bonding and conducting the LEDs and the circuit backplane through the anisotropic conductive film.
Disclosure of Invention
In view of the above, the invention provides a conductive film and a preparation method thereof, a manufacturing method of a display substrate, and a display panel, which can solve the problems that the requirements on the size and the density of a conductive microsphere are strict when an anisotropic conductive film is prepared in the prior art, and the pressure required when an LED and a circuit backboard are bonded and conducted through the anisotropic conductive film is large.
In order to solve the technical problems, the invention adopts the following technical scheme:
an embodiment of one aspect of the present invention provides a method for preparing a conductive film, including:
forming a conductive microsphere bearing layer on a substrate, wherein a plurality of bearing holes are formed in the conductive microsphere bearing layer;
forming a separation layer on the conductive microsphere carrying layer;
self-assembling conductive microspheres into the bearing holes;
forming an adhesive film on a self-assembled substrate meeting a preset requirement, and adhering a first release film on the adhesive film;
and peeling the substrate, the conductive microsphere bearing layer and the separation layer, adhering a second release film to one side exposed out of the conductive microspheres, wherein the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film.
Optionally, the forming a conductive microsphere carrying layer on the substrate includes:
coating impression glue on a substrate;
impressing the impressing glue to obtain a plurality of bearing holes positioned on the impressing glue;
and curing the imprinting adhesive with the bearing holes to form the conductive microsphere bearing layer.
Optionally, the thickness of the imprinting adhesive is 0.8-1.2 times of the diameter of the conductive microspheres.
Optionally, the self-assembling the conductive microspheres into the carrier holes includes:
and placing the substrate with the separation layer in liquid with conductive microspheres for self-assembly, so that the conductive microspheres fall into the bearing holes of the conductive microsphere bearing layer.
Optionally, in the step of placing the substrate with the separation layer in a liquid with conductive microspheres for self-assembly:
the self-assembly is assisted by means of ultrasonic vibration and/or mechanical agitation.
Optionally, before the step of sequentially forming the adhesive film and the first release film on the self-assembled substrate meeting the preset requirement, the method further includes:
and detecting the self-assembly result of the self-assembled substrate, and repeating the self-assembly process under the condition that the self-assembly result does not meet the preset requirement.
Optionally, the preset requirement is:
the proportion of the conductive microspheres in the bearing holes is not less than 99%, and the conductive microspheres are not lost between the adjacent bearing holes simultaneously.
Optionally, the thickness of the adhesive film is 1.2-1.5 times of the diameter of the conductive microspheres.
Optionally, the diameter range of the conductive microspheres is 2-100 μm, the aperture of the bearing hole is 1-1.9 times of the diameter of the conductive microspheres, and the center distance between two adjacent bearing holes is 1.5-5 times of the diameter of the conductive microspheres.
Optionally, the peeling force between the first release film and the adhesive film is smaller than the peeling force between the second release film and the adhesive film.
Another embodiment of the present invention further provides a conductive film, including:
an adhesive film;
the conductive microspheres are positioned on the adhesive film, and at least part of each conductive microsphere is embedded in the adhesive film;
the first release film is attached to one side face, not exposed out of the conductive microspheres, of the adhesive film;
the second release film is attached to one side face, exposed out of the conductive microspheres, of the adhesive film;
and the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film.
In another aspect, an embodiment of the present invention provides a method for manufacturing a display substrate, including:
providing a circuit backplane and a conductive film as described above;
peeling the first release film of the conductive thin film, and attaching the peeled conductive thin film to the circuit back plate;
stripping the second release film of the conductive film to expose the conductive microspheres on the adhesive film on the side back to the circuit backboard;
transferring the LED device by using a transfer head, and aligning the electrode of the LED device with the conductive microsphere so as to enable the electrode of the LED device to be in contact with the conductive microsphere;
and controlling the transfer head to be pressed downwards until the electrode of the LED device is conducted with the electrode pin on the circuit backboard through the conductive microsphere.
In another aspect, the embodiment of the invention further provides a display panel, which includes the display substrate as described above.
The technical scheme of the invention has the following beneficial effects:
according to the preparation method provided by the embodiment of the invention, the rigorous requirements on the size and density of the conductive microspheres in the preparation process are reduced, the pressure required by bonding conduction between the light-emitting device and the circuit backboard is reduced, the distribution of the conductive microspheres in the prepared conductive film is more uniform, and the conductive film is better in uniformity and thinner in thickness.
Drawings
FIG. 1 is a schematic diagram of a prior art Micro-LED structure;
FIG. 2 is a schematic diagram of the bonding of a Micro-LED using an isotropic conductive material according to the prior art;
FIG. 3 is a schematic diagram of a prior art bonding process for Micro-LEDs using eutectic solder;
FIG. 4 is a diagram illustrating a prior art bonding process using ACF conductive adhesive;
FIG. 5 is a schematic diagram of a prior art conductive microsphere;
FIG. 6 is a schematic diagram of the situation that the Micro-LED cannot be conducted with the circuit backplane due to the low distribution density of the conductive microspheres;
FIG. 7 is a schematic diagram of bonding of the Micro-LED and the circuit backplane using an ACF conductive adhesive film;
fig. 8 is a schematic flow chart illustrating a method for manufacturing a conductive film according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a conductive microsphere bearing layer formed on a substrate according to an embodiment of the present invention;
FIG. 10 is a schematic plan view of a conductive microsphere bearing layer provided in accordance with an embodiment of the present invention;
FIG. 11 is a schematic illustration of a separation layer formed on a conductive microsphere bearing layer according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of self-assembly of conductive microspheres into a support hole according to an embodiment of the present invention;
fig. 13 is a schematic view illustrating an adhesive film and a first release film formed on a substrate according to an embodiment of the present invention;
FIG. 14 is a schematic view of peeling the separation layer and adhering a second release film in an embodiment of the present invention;
fig. 15 is a schematic structural diagram of a conductive film according to an embodiment of the present invention;
fig. 16 is a schematic flow chart illustrating a method for manufacturing a display substrate according to an embodiment of the invention;
fig. 17 is a schematic diagram of a bonding process of the Micro-LED and the circuit backplane in the display substrate according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Please refer to fig. 1, which is a schematic structural diagram of a Micro-LED in the prior art. As shown in fig. 1, which is a typical Micro-LED at present, the size of the Micro-LED is very small, the size of the electrode is only about 10 μm, and the spacing between two electrodes is only about 8 μm, so that there are many difficulties in transferring the Micro-LED with such a small size and a large number onto the circuit backplane and realizing bonding (bonding) with the circuit backplane.
Fig. 2 is a schematic diagram illustrating bonding of Micro-LEDs using an isotropic conductive material in the prior art. As shown in fig. 2, since the distance between two electrodes of the Micro-LED is very small, when the Micro-LED is bonded using an isotropic conductive material such as an isotropic conductive paste, a solder paste, a silver paste, etc., the following problems occur: firstly, when materials such as isotropic conductive adhesive, tin paste, silver paste and the like are patterned by screen printing, needle coating and the like, the precision of bonding a Mini-LED (the size is more than 100 mu m) can only be achieved at present, and the precision requirement of Micro-LED on material coating during bonding can not be met; and secondly, materials such as isotropic conductive adhesive, tin paste and silver paste are easy to deform in the Micro-LED transfer and bonding process, so that the risk of short circuit exists.
At present, the technical scheme of ultra-narrow pitch bonding applicable to Micro-LEDs mainly comprises two types:
(1) the Micro-LEDs were bonded using eutectic solder.
Fig. 3 is a schematic diagram illustrating a bonding process of Micro-LEDs using eutectic solder in the prior art. Eutectic welding is also called low-melting-point alloy welding, the basic characteristic of the eutectic alloy is that two different metals can form alloy according to a certain weight proportion at the temperature far lower than the respective melting points, the Micro-LED is welded on a base or a lead frame through the eutectic alloy, and common eutectic metal systems comprise Au-In, In-ITO, Au-Sn and the like; as shown in fig. 3, a eutectic metal layer 33 is prepared on the circuit back plate 31, the eutectic metal layer 33 covers the leads 32 on the circuit back plate 31, the electrodes of the Micro-LEDs are coated with another eutectic metal 34, the Micro-LEDs are moved to above the circuit back plate 31 by a transfer head 35, and finally, the bonding of the Micro-LEDs and the circuit back plate 31 is completed by pressurization/heating. However, the eutectic soldering technology applied to bonding the Micro-LED and the circuit backboard has the problems of high difficulty in preparing the eutectic metal layer, high cost and the like.
(2) The bonding of the Micro-LED and the circuit backplane is performed using an Anisotropic Conductive Films (ACF) film.
Fig. 4 is a schematic diagram illustrating a conventional bonding process using an ACF conductive adhesive. As shown in fig. 4, the ACF conductive paste has the characteristics of longitudinal conduction and transverse non-conduction. The ACF conductive adhesive friction 41 is internally coated with a plurality of conductive microspheres 42, in the using process, the conduction between the Micro-LEDs and the circuit backboard 31 can be realized only by attaching the ACF conductive adhesive film 41 to the circuit backboard 31, then transferring the Micro-LEDs to corresponding positions by using the transfer head 35, applying certain pressure to complete pressing and curing, and then using the conductive microspheres 42 in the ACF conductive adhesive film 41 as intermediate media. The ACF conductive adhesive film 41 can avoid the problem of short circuit between the positive and negative electrodes of the Micro-LED, and can avoid the difficulty caused by a high-precision coating process, and is the most common method at present.
The preparation of the ACF conductive adhesive film mainly comprises three parts: firstly, preparing a crosslinkable prepolymer (adjusting polymerization degree); secondly, mixing materials, namely mixing the conductive microspheres, the curing agent, the coupling agent, the tackifier and the like with the crosslinkable prepolymer, and uniformly stirring; and thirdly, forming a film, namely throwing the film on a spin coater to form the film, and refrigerating and storing the film to prevent the ACF film from crosslinking, curing and losing efficacy at room temperature.
However, the ACF conductive adhesive film has the following disadvantages: firstly, the ACF conductive adhesive film has high requirement on the size uniformity of the conductive microspheres, and secondly, the ACF conductive adhesive film has overlarge pressure required for realizing the conduction between the Micro-LED and the circuit back panel in the using process.
The above-mentioned disadvantages were analyzed one by one.
Fig. 5 is a schematic structural diagram of a conductive microsphere in the prior art. As shown in fig. 5, in general, the conductive microsphere includes an inner polymer microsphere and a metal coating layer coated on the surface of the polymer microsphere. When the ACF conductive adhesive film is prepared, the size range of commonly used conductive microspheres is 2-15 microns, the size fluctuation amplitude of each conductive microsphere is required to be less than or equal to 10%, if the size fluctuation amplitude of the conductive microspheres is too large, the conductive microspheres with larger sizes form a supporting effect between the electrodes of the Micro-LED and the pins of the circuit backboard in the pressing process, so that the microspheres with smaller sizes cannot communicate the electrodes of the Micro-LED and the pins of the circuit backboard, and finally the conduction performance of the ACF conductive adhesive film is reduced.
Referring to fig. 6, fig. 6 is a schematic diagram illustrating that the Micro-LED cannot be conducted with the circuit backplane due to the low distribution density of the conductive microspheres. Furthermore, the ACF conductive adhesive film has high requirements on the mixing and dispersing process of the conductive microspheres and the resin, and in the material mixing process, if the doping ratio of the conductive microspheres is high or the mixing is not uniform, the conductive microspheres are connected with each other to generate aggregation, so that the ACF conductive adhesive film fails to be prepared; and if the doping proportion of the conductive microspheres is low, the risk of mutual connection of the conductive microspheres in the ACF conductive adhesive is reduced, but meanwhile, because the doping proportion of the conductive microspheres is low, the distribution density of the conductive microspheres in the ACF conductive adhesive is low, and the problem that the conduction of the Micro-LED and the pins on the circuit backboard cannot be realized exists. As shown in fig. 6, that is, there may be a portion of the electrode 61 of the Micro-LED just falling on the position of the ACF conductive adhesive film that is not covered with the conductive microspheres, and the electrode 61 of the Micro-LED cannot be conducted with the pins on the circuit backplane without the intermediate connection effect of the conductive microspheres. Therefore, in the preparation process of the ACF conductive adhesive film, the conductive microspheres are not aggregated, and the distribution density of the conductive microspheres is improved as much as possible, which has very high requirements on the doping ratio and the mixing process of the conductive microspheres. In addition, the manufacturing cost of the ACF conductive adhesive film is high due to the above reasons.
Please refer to fig. 7, which is a schematic diagram of bonding the Micro-LED and the circuit board by using the ACF conductive adhesive film. As shown in fig. 7, taking an ACF conductive adhesive film 41 with a thickness of 6 μm as an example, where the diameter of the conductive microspheres contained therein is 2.2 μm, first, the Micro-LED is transferred to a corresponding position above the ACF conductive adhesive film 41 by using a transfer head 35, and then heated and pressurized, under the action of hot pressing, after the ACF conductive adhesive film with a thickness of 6 μm below the electrodes of the Micro-LED is pressed to a deformation value of 2.2 μm, the electrodes of the Micro-LED can be conducted with the pins on the circuit backplane, the ACF conductive adhesive film with a thickness of 6 μm is a pre-polymerized polymer film, and is difficult to deform greatly, so a very large pressure needs to be applied, usually a pressure of 50 to 60Mpa is needed, and this pressure value is quite large, and a dedicated device is needed to perform corresponding pressing, and such a large pressure has certain requirements for the structural strength of the Micro-LED and the structural strength of the circuit backplane, otherwise damage to both at high pressure is easily caused.
To solve the above technical problem, please refer to fig. 8, which is a flowchart illustrating a method for manufacturing a conductive film according to an embodiment of the present invention. As shown in fig. 8, the method for preparing a conductive film in an embodiment of the present invention may include the following steps:
step 81: a conductive microsphere bearing layer is formed on a substrate, and a plurality of bearing holes are formed in the conductive microsphere bearing layer.
Fig. 9 is a schematic diagram of forming a conductive microsphere carrier layer on a substrate according to an embodiment of the present invention. As shown in fig. 9, in this step, first, a layer of imprint glue 102 is coated on a substrate 101, then, the imprint glue 102 is imprinted by using a patterned template 103, a pattern corresponding to the patterned template 103 is formed on the imprint glue 102, then, the imprint glue 102 after being imprinted is irradiated by UV (i.e., ultraviolet irradiation) to cure the imprint glue 102, so as to obtain a conductive microsphere bearing layer 104, a plurality of bearing holes 105 are formed on the conductive microsphere bearing layer 104, and the bearing holes 105 are used for bearing conductive microspheres.
Fig. 10 is a schematic plan view of a conductive microsphere carrier layer according to an embodiment of the present invention. As shown in fig. 10, a plurality of carrying holes 105 are distributed in an array on the conductive microsphere carrying layer 104, the aperture R of the carrying hole 105 in the embodiment of the present invention may be designed to be 1 to 1.9 times of the diameter of the conductive microsphere to be carried, and the size range of the conductive microsphere adopted in the embodiment of the present invention may be 2 to 100 μm, the aperture R of the carrying hole 105 is designed to be slightly larger than the diameter of the conductive microsphere, so that the conductive microsphere can be conveniently assembled into the carrying hole 105 quickly, and inaccurate positioning due to too large movement after falling into the carrying hole 105 is avoided, and only one conductive microsphere can be filled into each carrying hole 105; the distance d between two adjacent bearing holes 105 is 1.5-5 times the diameter of the conductive microspheres, more specifically, d can represent the horizontal distance between the centers of two adjacent bearing holes 105, and the distance d in the value range can ensure that the conductive microspheres in two adjacent bearing holes 105 are not in contact when the conductive film is deformed under pressure, so that the short circuit phenomenon is avoided.
In the embodiment of the present invention, the substrate 101 may be a glass substrate, the adopted imprint glue 102 may be a nanoimprint glue, and specifically may be an acrylic resin system nanoimprint glue, and two manners, namely Spin (Spin coating) and Slit (Slit coating), may be adopted in the process of coating the imprint glue 102 on the substrate 101, and the thickness of the imprint glue 102 may be adjusted by adjusting the rotation speed during Spin or adjusting the glue output amount during Slit during coating. The thickness of the imprinting adhesive 102 is related to the size diameter of the conductive microspheres, that is, the specific thickness of the imprinting adhesive 102 can be determined according to the size diameter of the selected conductive microspheres, in the embodiment of the invention, the thickness of the imprinting adhesive 102 is 0.8-1.2 times of the diameter of the conductive microspheres, and the size range of the conductive microspheres adopted in the scheme is 2-100 μm, so the thickness of the imprinting adhesive 102 can be 1.6-120 μm.
In the embodiment of the present invention, the process of imprinting the imprinting adhesive 102 may specifically be performed by using a nano-imprinting flexible film, and of course, may also be performed by using processes such as ultraviolet imprinting and thermal imprinting, as long as the uniformly distributed bearing holes 105 with predetermined apertures are imprinted on the imprinting adhesive 102.
Step 82: and forming a separation layer on the conductive microsphere carrying layer.
Referring to fig. 11, a schematic diagram of forming a separation layer 106 on a conductive microsphere carrying layer according to an embodiment of the present invention is shown. As shown in fig. 11, after the conductive microsphere carrying Layer 104 is formed, a release adhesive or a DBL separation film (De-bonded Layer) may be sprayed on the surface of the conductive microsphere carrying Layer 104 to form a separation Layer 106, and the separation Layer 106 may be coated to be thin as long as it covers the surface of the conductive microsphere carrying Layer 104.
Step 83: and self-assembling the conductive microspheres into the bearing holes.
Fig. 12 is a schematic diagram illustrating self-assembly of conductive microspheres into a carrying hole according to an embodiment of the invention. As shown in fig. 12, the substrate 101 after the separation layer 106 is formed is placed in a liquid in which the conductive microspheres 107 are mixed to perform self-assembly, so that the conductive microspheres 107 fall into the carrier holes 105; in order to prevent the liquid from reacting with the conductive microspheres 107, the liquid can be deionized water, and the content of the conductive microspheres 107 in the deionized water can be set to be 1-5%; in the embodiment of the present invention, the conductive microspheres 107 may be made of all-metal material, or may be microspheres with high polymer material inside and metal plating layer outside; the size diameter of the conductive microspheres 107 can be selected from a range of 2-100 μm.
In the embodiment of the invention, during the self-assembly process, the conductive microspheres 107 can be assisted to be self-assembled in the bearing holes 105 by adopting the modes of ultrasonic oscillation, mechanical stirring and the like, so that the self-assembly efficiency and success rate are improved; wherein, when the auxiliary mode of ultrasonic oscillation is adopted, the ultrasonic oscillation frequency can choose 150-250 KHz, and when the auxiliary mode of mechanical stirring is adopted, the speed of mechanical stirring can choose 10-50 r/min, so that the conductive microspheres 107 are distributed in the liquid as uniformly as possible, and the conductive microspheres 107 have certain regular motion, thereby improving the efficiency of self-assembly.
In the preparation process of the existing ACF conductive adhesive film, the conductive microspheres and an adhesive are mechanically stirred and mixed, and if the proportion of the doped conductive microspheres is too high or the stirring and mixing are not uniform, the problem of conductive microsphere aggregation can occur, so that the ACF film material is failed to prepare; however, in the embodiment of the present invention, the conductive microspheres 107 are filled in the carrying holes 105 by self-assembly, and since the aperture of the carrying hole 105 is 1-1.9 times the diameter of the conductive microspheres 107, only one conductive microsphere 107 is filled in one carrying hole 105, and the distance d between two adjacent carrying holes 105 is 1.5-5 times the diameter of the conductive microsphere, the prepared conductive film does not have the condition that the conductive microspheres are connected with each other as in the prior art.
Step 84: and forming an adhesive film on the self-assembled substrate meeting the preset requirement, and adhering a first release film on the adhesive film.
Fig. 13 is a schematic diagram illustrating an adhesive film and a first release film formed on a substrate according to an embodiment of the invention. As shown in fig. 13, after the self-assembly is completed, the substrate is immersed in a liquid, so that the substrate may be dried first, and then an adhesive film 108 is formed on the self-assembled substrate meeting the preset requirement, where the adhesive film 108 is an anisotropic adhesive, specifically, the adopted adhesive may be a thermoplastic adhesive or a thermosetting adhesive, where the thermoplastic adhesive may be polyvinyl acetate, polyvinyl acetal, ethylene-vinyl acetate copolymer resin, and the thermosetting adhesive may be epoxy resin, phenolic aldehyde, heterocyclic polymer, and the like. The process of forming the adhesive film 108 is specifically: and coating an adhesive on the conductive microsphere carrying layer 104 which meets the preset requirements in the self-assembly process, and then pre-curing the adhesive to form an adhesive film 108.
In the preparation process of the ACF conductive adhesive film in the prior art, the colloid after uniform mixing is dripped to the plane of a spin coater, and the spin coater is utilized to form a film, so that the higher the rotating speed of the spin coater is, the thinner the prepared film layer is, the smaller the viscosity of the colloid is, and the thinner the prepared film layer is; however, the existing preparation process can not prepare an ultra-thin ACF conductive adhesive film, which can only reach about 6 μm, and the reason is found by analysis: the preparation of the cross-linkable prepolymer (adjustment of polymerization degree) of the adhesive is needed to ensure that the adhesive is not deposited and aggregated in an injection pipeline after being mixed with the conductive microspheres, however, the prepared cross-linkable prepolymer has high viscosity, generally the flow viscosity reaches above 5000CP, so that the ultra-thin film layer can be prepared only by rotating the spin coater at a high rotating speed, the spin coater rotates the spin coater by taking the rotating transmission shaft as the center, the centrifugal force applied to the adhesive material at different positions of the spin coater is different, the smaller the distance r between the spin coater and the rotating center point is, the smaller the centrifugal force is (F is m omega 2r), the larger the rotating speed is (omega is larger the centrifugal force applied to different areas is, and the worse the uniformity of the thickness of the prepared film layer is. In the embodiment of the invention, before the adhesive is coated, a prepolymerization reaction is not needed to be carried out as in the existing preparation scheme, but precuring is carried out for crosslinking after the coating is finished, so that the viscosity of the adhesive is low during the coating; the method for coating the adhesive in the embodiment of the invention can be used for preparing an ultrathin film layer by using a Spin (Spin coating) method, Slit coating (Slit coating) and Ink Jet Print (inkjet printing) high-precision film layer preparation method, which means that conductive microspheres with smaller size can be selected, and the size of the Micro-LED capable of realizing bonding is smaller.
In the embodiment of the invention, the thickness of the adhesive film 108 is 1.2-1.5 times of the diameter of the conductive microspheres 107, and when the method is specifically implemented, the adhesive film 108 within the range of 3-150 μm can be prepared according to requirements, and the minimum thickness of the adhesive film can be thinner than 6 μm in the prior art.
After the adhesive film 108 is formed, a first release film, in the embodiment of the present invention, a so-called release film, i.e., a film that has no tackiness, or a slight tackiness after being exposed to a specific material under a limited condition, is adhered to the adhesive film 108; generally, in order to change the release force of the film, the film is subjected to plasma treatment, or fluorine coating, or silicon (silicone) release agent is coated on the surface layer of the film material, such as PET, PE, OPP, etc., so that it can exhibit very light and stable release force for various organic pressure-sensitive adhesives (such as hot-melt adhesive, acrylic and rubber-based pressure-sensitive adhesives); according to the release force of the release film with different requirements, the viscosity of the isolation product glue is different, and the release force is correspondingly adjusted, so that the extremely light and stable release force is achieved when the isolation film is stripped. Therefore, in the invention, the first release film can be a release film treated by plasma, and can also be a release film coated with a removable adhesive; as shown in fig. 13, in the specific implementation of the embodiment of the present invention, the first release film includes a first removable adhesive 109 and a first PET release film 110, that is, the first PET release film 110 is adhered to the adhesive film 108 through the first removable adhesive 109, and when the first PET release film 110 is peeled off in a subsequent use process, the first removable adhesive 109 is peeled off together with the first PET release film 110.
In an embodiment of the present invention, before the step of sequentially forming the adhesive film and the first release film on the self-assembled substrate meeting the preset requirement, the method further includes:
and detecting the self-assembly result of the self-assembled substrate, and repeating the self-assembly process under the condition that the self-assembly result does not meet the preset requirement.
That is to say, after the self-assembly is finished, the self-assembled substrate is further detected, whether the self-assembly result meets the preset requirement is judged, and the self-assembly operation process can be repeated for the substrate which does not meet the requirement until the preset requirement is met. During detection, an Automatic Optical Inspection (AOI) device can be used to detect the self-assembly effect.
In the embodiment of the present invention, the preset requirements are: the proportion of the conductive microspheres in the bearing holes is not less than 99%, and the conductive microspheres are not lost between the adjacent bearing holes simultaneously. That is, at least 99% of the carrying holes 105 need to be filled with the conductive microspheres 107, and the adjacent carrying holes 105 cannot simultaneously lack the conductive microspheres 107, so as to avoid the occurrence of the condition that the circuit backplane and the Micro-LED cannot be conducted. Of course, the preset requirements may be determined according to actual production requirements, and higher standards may be set to obtain better bonding results.
Step 85: and peeling the substrate, the conductive microsphere bearing layer and the separation layer, adhering a second release film to one side exposed out of the conductive microspheres, wherein the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film.
Fig. 14 is a schematic diagram illustrating the separation layer being peeled off and the second release film being adhered in the embodiment of the invention. In the embodiment of the present invention, after the first release film is adhered, the substrate 101, the conductive microsphere carrier layer 104, and the separation layer 106 are peeled off, wherein the peeling force between the separation layer 106 and the adhesive film 108 and the conductive microspheres 107 is smaller than the peeling force between the first release film and the adhesive film 108, for example, the peeling force between the separation layer 106 and the conductive microspheres 107 and the adhesive film 108 is 7gN/cm2The peeling force between the first release film and the adhesive film 108 is greater than 7gN/cm2(e.g., 10 gN/cm)2) After the first release film is attached to the adhesive film 108, the conductive microspheres 107 can be ensured to remain on the adhesive film 108 when the separation layer 106 is peeled off; since the first release film in the embodiment of the present invention includes the first removable adhesive 109 and the first PET release film 110, the first removable adhesive having a peeling force meeting the requirement is selectedMixture 109 is used.
In the embodiment of the present invention, after the substrate 101, the conductive microsphere carrier layer 104, and the separation layer 106 are peeled off, a second release film is adhered to one side where the conductive microspheres 107 are exposed, so as to cover and protect the conductive microspheres 107, and finally obtain a conductive thin film containing the conductive microspheres 107, which is similar to the first release film, and the second release film may be a release film subjected to plasma treatment or a release film coated with a removable adhesive; in the specific implementation of the present invention, the second release film includes a second removable adhesive 111 and a second PET release film 112, that is, the second PET release film 112 is adhered to the adhesive film 108 through the second removable adhesive 111, and when the second PET release film 112 is peeled off in the subsequent use process, the second removable adhesive 1111 is peeled off together with the second PET release film 112.
In the embodiment of the invention, the peeling force between the first release film and the adhesive film 108 is not equal to the peeling force between the second release film and the adhesive film 108, so that when the conductive film is used, the release film with small peeling force between the conductive film and the adhesive film 108 can be peeled off firstly, then the release film is adhered to a circuit back plate, and then the other release film is peeled off, and finally the adhesive film 108 and the conductive microspheres 107 thereon are left; wherein the peeling force between the first release film and the adhesive film 108 and the peeling force between the second release film and the adhesive film 108 can be set to be 1-100 gN/cm2. In an optional embodiment, the peeling force between the first release film and the adhesive film 108 is smaller than the peeling force between the second release film and the adhesive film 108, so that during the process of using the conductive film, the first release film can be peeled off (i.e. the first removable adhesive 109 and the first PET release film 110 are peeled off together), then one side of the first release film is attached to the circuit back board, since the conductive microspheres 107 do not leak out, the flatness is better, then the second release film is peeled off (i.e. the second removable adhesive 111 and the second PET release film 112 are peeled off together), only the adhesive film 108 and the conductive microspheres 107 thereon are left, and the conductive microspheres 107 leak out from the upper surface of the adhesive film 108, which is convenient for Micro-materialsThe position of the LEDs is aligned.
In the prior art, when the ACF conductive adhesive film is used for hot pressing, the whole electrode of the Micro-LED is in contact with the ACF conductive adhesive film, and the stress area is the whole electrode surface, so the required pressure is large.
According to the preparation method of the conductive film, the rigorous requirements on the size and the density of the conductive microspheres in the preparation process are reduced, the pressure required by bonding conduction between the light-emitting device and the circuit back plate is reduced, the conductive microspheres in the prepared conductive film are distributed more uniformly, and the conductive film is better in uniformity and thinner in thickness.
Fig. 15 is a schematic structural diagram of a conductive film according to an embodiment of the present invention. As shown in fig. 15, another embodiment of the present invention further provides a conductive film, where the conductive film is prepared by the method for preparing a conductive film in the foregoing embodiment, and the conductive film may include:
an adhesive film 108;
a plurality of conductive microspheres 107 positioned on the adhesive film 108, wherein each conductive microsphere 107 is at least partially embedded in the adhesive film 108;
a first release film attached to one side of the adhesive film 108 where the conductive microspheres 107 are not exposed;
a second release film attached to one side of the adhesive film 108 where the conductive microspheres 107 are exposed;
and the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film.
In the embodiment of the present invention, the first release film may include a first removable adhesive 109 and a first PET release film 110, and the second release film may include a second removable adhesive 111 and a second PET release film 112.
According to the conductive film disclosed by the embodiment of the invention, in the use process, the pressure required by bonding conduction between the light-emitting device and the circuit backboard is reduced, the distribution of the conductive microspheres in the conductive film is more uniform, and the conductive film has better uniformity and thinner thickness.
Fig. 16 is a schematic flow chart illustrating a manufacturing method of a display substrate according to an embodiment of the invention. As shown in fig. 16, another embodiment of the present invention further provides a method for manufacturing a display substrate, where the method for manufacturing a display substrate includes:
step 161: providing a circuit backboard and a conductive film;
fig. 17 is a schematic diagram illustrating a bonding process between a Micro-LED and a circuit backplane in a display substrate according to an embodiment of the present invention. As shown in fig. 17, a circuit back plate 171 is provided, and a plurality of electrode pins 172 are distributed in an array on the circuit back plate 171; the conductive thin film may include: an adhesive film 108; a plurality of conductive microspheres 107 positioned on the adhesive film 108, wherein each conductive microsphere 107 is at least partially embedded in the adhesive film 108; a first release film attached to one side of the adhesive film 108 where the conductive microspheres 107 are not exposed; a second release film attached to one side of the adhesive film 108 where the conductive microspheres 107 are exposed; the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film; the first release film may include a first removable adhesive 109 and a first PET release film 110, and the second release film may include a second removable adhesive 111 and a second PET release film 112.
Step 162: and peeling the first release film of the conductive film, and attaching the peeled conductive film to the circuit back plate.
The first release film of the conductive film is peeled off, and the peeling force between the first release film and the adhesive film 108 is smaller than the peeling force between the second release film and the adhesive film 108, so that the first release film is peeled off firstly (i.e. the first removable adhesive 109 and the first PET release film 110 are peeled off together), and then one surface of the first release film is attached to the circuit back plate, and the surface conductive microspheres 107 do not leak out, so that the flatness is better.
Step 163: and stripping the second release film of the conductive film to expose the conductive microspheres on the adhesive film on the side back to the circuit backboard.
Next, the second release film is peeled off (i.e., the second removable adhesive 111 and the second PET release film 112 are peeled off together), leaving only the adhesive film 108 and the conductive microspheres 107 thereon, and the conductive microspheres 107 leak out on the upper surface of the adhesive film 108, facilitating the alignment of the Micro-LEDs.
Step 164: and transferring the LED device by using a transfer head, and aligning the electrode of the LED device with the conductive microsphere so as to enable the electrode of the LED device to be in contact with the conductive microsphere.
Since the conductive microspheres 107 now leak out of the top surface of the adhesive film 108, it is convenient to adjust the position of the transfer head and thus achieve alignment of the electrodes 174 of the Micro-LED173 with the conductive microspheres 107.
Step 165: and controlling the transfer head to be pressed downwards until the electrode of the LED device is conducted with the electrode pin on the circuit backboard through the conductive microsphere.
Because the electrode 174 of the Micro-LED173 is in contact with the exposed conductive microsphere 107 on the upper surface of the adhesive film 108 after alignment, pressure can be completely applied to the conductive microsphere 107, and the conductive microsphere 107 can be conducted between the electrode 174 of the Micro-LED173 and the electrode pin 172 on the circuit back plate 171 only by pressing through the adhesive film 108 below under the action of hot pressing.
According to the manufacturing method of the display substrate, the pressure required by bonding conduction between the light-emitting device and the circuit backboard is reduced, the bonding process is accelerated, the bonding accuracy is improved, and the yield of products is finally improved.
In another aspect, an embodiment of the present invention further provides a display panel, including the display substrate, in which the bonding condition between the Micro-LEDs and the circuit backplane of the display panel in the embodiment of the present invention is good, the conduction effect is good, and the yield is high.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (13)
1. A method for preparing a conductive film, comprising:
forming a conductive microsphere bearing layer on a substrate, wherein a plurality of bearing holes are formed in the conductive microsphere bearing layer;
forming a separation layer on the conductive microsphere carrying layer;
self-assembling conductive microspheres into the bearing holes;
forming an adhesive film on a self-assembled substrate meeting a preset requirement, and adhering a first release film on the adhesive film;
and peeling the substrate, the conductive microsphere bearing layer and the separation layer, adhering a second release film to one side exposed out of the conductive microspheres, wherein the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film.
2. The method of claim 1, wherein the forming a conductive microsphere bearing layer on a substrate comprises:
coating impression glue on a substrate;
impressing the impressing glue to obtain a plurality of bearing holes positioned on the impressing glue;
and curing the imprinting adhesive with the bearing holes to form the conductive microsphere bearing layer.
3. The preparation method according to claim 2, wherein the thickness of the imprinting adhesive is 0.8 to 1.2 times the diameter of the conductive microspheres.
4. The method of claim 1, wherein the self-assembling conductive microspheres into the carrier pores comprises:
and placing the substrate with the separation layer in liquid with conductive microspheres for self-assembly, so that the conductive microspheres fall into the bearing holes of the conductive microsphere bearing layer.
5. The production method according to claim 4, wherein in the step of placing the substrate on which the separation layer is formed in a liquid having conductive microspheres for self-assembly:
the self-assembly is assisted by means of ultrasonic vibration and/or mechanical agitation.
6. The method for manufacturing a semiconductor device according to claim 1, wherein before the step of sequentially forming the adhesive film and the first release film on the self-assembled substrate meeting the predetermined requirement, the method further comprises:
and detecting the self-assembly result of the self-assembled substrate, and repeating the self-assembly process under the condition that the self-assembly result does not meet the preset requirement.
7. The method according to claim 6, wherein the preset requirements are:
the proportion of the conductive microspheres in the bearing holes is not less than 99%, and the conductive microspheres are not lost between the adjacent bearing holes simultaneously.
8. The preparation method of claim 1, wherein the thickness of the adhesive film is 1.2 to 1.5 times the diameter of the conductive microspheres.
9. The preparation method according to claim 1, wherein the diameter of the conductive microsphere is in a range of 2 to 100 μm, the aperture of the bearing hole is 1 to 1.9 times the diameter of the conductive microsphere, and the center-to-center distance between two adjacent bearing holes is 1.5 to 5 times the diameter of the conductive microsphere.
10. The production method according to claim 1, wherein a peeling force between the first release film and the adhesive thin film is smaller than a peeling force between the second release film and the adhesive thin film.
11. A conductive film, comprising:
an adhesive film;
the conductive microspheres are positioned on the adhesive film, and at least part of each conductive microsphere is embedded in the adhesive film;
the first release film is attached to one side face, not exposed out of the conductive microspheres, of the adhesive film;
the second release film is attached to one side face, exposed out of the conductive microspheres, of the adhesive film;
and the peeling force between the first release film and the adhesive film is not equal to the peeling force between the second release film and the adhesive film.
12. A method for manufacturing a display substrate is characterized by comprising the following steps:
providing a circuit backplane and the conductive film of claim 11;
peeling the first release film of the conductive thin film, and attaching the peeled conductive thin film to the circuit back plate;
stripping the second release film of the conductive film to expose the conductive microspheres on the adhesive film on the side back to the circuit backboard;
transferring the LED device by using a transfer head, and aligning the electrode of the LED device with the conductive microsphere so as to enable the electrode of the LED device to be in contact with the conductive microsphere;
and controlling the transfer head to be pressed downwards until the electrode of the LED device is conducted with the electrode pin on the circuit backboard through the conductive microsphere.
13. A display panel comprising the display substrate as claimed in claim 12.
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| CN113838963A (en) * | 2021-09-14 | 2021-12-24 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
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