CN111663105A - Ultrahigh vacuum electron beam evaporator and electron beam coating device - Google Patents
Ultrahigh vacuum electron beam evaporator and electron beam coating device Download PDFInfo
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- CN111663105A CN111663105A CN202010458697.2A CN202010458697A CN111663105A CN 111663105 A CN111663105 A CN 111663105A CN 202010458697 A CN202010458697 A CN 202010458697A CN 111663105 A CN111663105 A CN 111663105A
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- 238000010894 electron beam technology Methods 0.000 title claims abstract description 57
- 239000011248 coating agent Substances 0.000 title claims abstract description 17
- 238000000576 coating method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 44
- 238000007789 sealing Methods 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 238000001704 evaporation Methods 0.000 claims abstract description 34
- 230000008020 evaporation Effects 0.000 claims abstract description 34
- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 238000001816 cooling Methods 0.000 claims abstract description 29
- 238000004021 metal welding Methods 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 8
- 230000003028 elevating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 230000008569 process Effects 0.000 abstract description 13
- 230000002349 favourable effect Effects 0.000 abstract description 4
- 238000009834 vaporization Methods 0.000 abstract description 4
- 230000008016 vaporization Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 13
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 9
- 238000005859 coupling reaction Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000005684 electric field Effects 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
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- 238000007872 degassing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
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- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/543—Controlling the film thickness or evaporation rate using measurement on the vapor source
Abstract
The invention discloses an ultrahigh vacuum electron beam evaporator and an electron beam coating device, wherein the ultrahigh vacuum electron beam evaporator comprises: the device comprises an ultrahigh vacuum metal sealing flange, a lifting mechanism arranged on the first side of the ultrahigh vacuum metal sealing flange, a water-cooling shielding barrel arranged on the second side of the ultrahigh vacuum metal sealing flange, a material bearing crucible, an electron emitter and an evaporation ion flow detector, wherein the material bearing crucible, the electron emitter and the evaporation ion flow detector are arranged in the water-cooling shielding barrel in sequence; the lifting mechanism is connected with the material bearing crucible through a high-voltage focusing electrode rod and is used for adjusting the distance between the material bearing crucible and the electron emitter; the electron emitter is connected with the ultrahigh vacuum metal sealing flange, and the evaporative ion flow detector is connected with the water-cooling shielding barrel. This application is through adopting water-cooling shielding bucket, avoids among the coating by vaporization process to cause interference or influence to other parts, is favorable to the control to evaporation rate in the coating by vaporization.
Description
Technical Field
The invention relates to the technical field of coating equipment, in particular to an ultrahigh vacuum electron beam evaporator and an electron beam coating device.
Background
Thermal evaporation is widely used in the preparation of thin films in various physical deposition methods. As is well known, the higher the ultimate vacuum degree of the film preparation equipment is, the purer the background is, the fewer the film defects are, and the prepared film hasThe better the film quality, the very high vacuum background of Molecular Beam Epitaxy (MBE) equipment (ultimate vacuum of 2 × 10)-8Pa, maintaining vacuum of 2 × 10-7Pa) to produce high-quality polycrystalline films, microcrystalline films, and single crystal films, and Molecular Beam Epitaxy (MBE) equipment is favored by researchers and device manufacturers.
Under the condition of ultrahigh vacuum, the temperature of the evaporated material in the material bearing crucible is high, and the evaporation rate is difficult to control.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides an ultrahigh vacuum electron beam evaporator and an electron beam coating apparatus, which aims to solve the technical problem that the evaporation rate is difficult to control under ultrahigh vacuum condition.
The technical scheme of the invention is as follows:
an ultra-high vacuum electron beam evaporator, comprising: the device comprises an ultrahigh vacuum metal sealing flange, a lifting mechanism arranged on the first side of the ultrahigh vacuum metal sealing flange, a water-cooling shielding barrel arranged on the second side of the ultrahigh vacuum metal sealing flange, a material bearing crucible, an electron emitter and an evaporation ion flow detector, wherein the material bearing crucible, the electron emitter and the evaporation ion flow detector are arranged in the water-cooling shielding barrel in sequence; the lifting mechanism is connected with the material bearing crucible through a high-voltage focusing electrode rod and is used for adjusting the distance between the material bearing crucible and the electron emitter; the electron emitter is connected with the ultrahigh vacuum metal sealing flange, and the evaporative ion flow detector is connected with the water-cooling shielding barrel.
The ultrahigh vacuum electron beam evaporator is characterized in that a sliding block is arranged on the high-voltage focusing electrode rod, a sliding rod matched with the sliding block is arranged on the ultrahigh vacuum metal sealing flange, and the sliding block can slide along the sliding rod.
The ultrahigh vacuum electron beam evaporator is characterized in that a shielding cover is arranged on the water-cooling shielding barrel, and the shielding cover forms an evaporation channel.
The ultrahigh vacuum electron beam evaporator is characterized in that the evaporation ion flow detector is an ion collecting plate, and the water-cooled shielding barrel and the shielding cover are insulated from the ion collecting plate.
The ultra-high vacuum electron beam evaporator, wherein the ultra-high vacuum electron beam evaporator further comprises: the rotary mechanism is arranged on the first side of the ultrahigh vacuum metal sealing flange, and the electric baffle is connected with the rotary mechanism and used for opening or closing the evaporation channel.
The ultra-high vacuum electron beam evaporator, wherein the elevating mechanism comprises: the metal welding corrugated pipe is arranged on the first side of the ultrahigh vacuum metal sealing flange, the moving block is connected with the metal welding corrugated pipe, the screw rod is in threaded connection with the moving block, and the driving piece is connected with the screw rod; the high-voltage focusing electrode rod is positioned in the metal welding corrugated pipe and is connected with the moving block.
The ultrahigh vacuum electron beam evaporator is characterized in that the electron emitter is a circular ring-shaped electron emitter.
The ultra-high vacuum electron beam evaporator, wherein the ultra-high vacuum electron beam evaporator further comprises: and a ceramic seal electrode connected with the electron emitter.
The ultrahigh vacuum electron beam evaporator is characterized in that the water-cooling shielding barrel is of a totally-enclosed double-wall structure.
An electron beam coating apparatus, comprising: the ultra-high vacuum electron beam evaporator according to any one of the above.
Compared with the prior art, the embodiment of the invention has the following advantages:
according to the ultrahigh vacuum electron beam evaporator provided by the embodiment of the invention, the ultrahigh vacuum electron beam evaporator is formed on the basis of the ultrahigh vacuum metal sealing flange, and the ultrahigh vacuum condition is realized through the ultrahigh vacuum metal sealing flange. And adopt water-cooling to shield bucket and surround material and bear crucible, electron emitter and evaporation ion flow detector, avoid among the coating by vaporization process to cause interference or influence to other parts, be favorable to the control to evaporation rate in the coating by vaporization.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a sectional view of an ultra-high vacuum electron beam evaporator according to an embodiment of the present invention;
FIG. 2 is a partial enlarged view of a water-cooled shielding barrel of an ultra-high vacuum electron beam evaporator according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The magnetron sputtering technology in the prior art is widely applied, however, with the progress of the technology, the magnetron sputtering requires that the background vacuum degree which can be achieved by equipment is higher and higher, except for an ultrahigh vacuum preparation system, vacuum medium temperature degassing treatment needs to be carried out on a vacuum cavity and internal components, and organic materials are forbidden in a vacuum chamber (because degassing and baking are carried out for not less than 2 hours under the vacuum condition at the temperature higher than 200 ℃ after atmosphere explosion every time, the sealing ring is deflated, the sealing ring is invalid, and the vacuum environment is polluted).
Referring to fig. 1, the present invention discloses an ultra-high vacuum electron beam evaporator, comprising: the device comprises an ultrahigh vacuum metal sealing flange, a lifting mechanism 1 arranged on the first side of the ultrahigh vacuum metal sealing flange, a water-cooling shielding barrel 5 arranged on the second side of the ultrahigh vacuum metal sealing flange, a material bearing crucible 4, an electronic emitter 9 and an evaporated ion flow detector 8, wherein the material bearing crucible 4, the electronic emitter 9 and the evaporated ion flow detector are positioned in the water-cooling shielding barrel 5 and are sequentially arranged; the lifting mechanism 1 is connected with the material bearing crucible 4 through a high-voltage focusing electrode rod 2 and is used for adjusting the distance between the material bearing crucible 4 and the electron emitter 9; the electron emitter 9 is connected with the ultrahigh vacuum metal sealing flange, and the evaporation ion flow detector 8 is connected with the water-cooling shielding barrel 5.
The ultrahigh vacuum electron beam evaporator provided by the embodiment is formed on the basis of an ultrahigh vacuum metal sealing flange (CF100), the lifting mechanism 1, the water-cooling shielding barrel 5, the material bearing crucible 4, the electron emitter 9, the evaporated ion flow detector 8 and other parts are all made of metal and are all assembled on the ultrahigh vacuum metal sealing flange, the metal has good high temperature resistance and high pressure resistance and is not easy to deform, all parts of the ultrahigh vacuum electron beam evaporator are made of metal materials and are tightly matched with one another, and the ultrahigh vacuum electron beam evaporator is favorable for realizing the sealing condition of ultrahigh vacuum; the water-cooled shielding barrel 5 is adopted to surround the material bearing crucible 4, the electron emitter 9 and the evaporation ion flow detector 8, namely, the high-temperature part in the working process is contained inside the water-cooled shielding barrel 5, so that the interference or influence of the high temperature generated in the evaporation process on other parts is avoided, and the water-cooled shielding barrel 5 surrounding the outer side generates a stable and uniform cooling effect in the evaporation process, so that the control on the evaporation rate in the evaporation process is facilitated; meanwhile, the main body part of the ultrahigh vacuum electron beam evaporator is arranged on the inner side of the water-cooled shielding barrel 5, so that radiation to the external environment caused by light emission, heat generation and the like during film coating is prevented, and in addition, the ultrahigh vacuum electron beam evaporator is convenient to damage caused by misoperation in maintenance work. In addition, the water-cooling shielding barrel 5 can also play a shielding role, and shields an electric field formed by the electron emitter 9, so that the electric field is prevented from influencing other components.
Specifically, the central axis of the high voltage focusing electrode rod 2, the central axis of the material bearing crucible 4, the central axis of the electron emitter 9, the central axis of the evaporated ion flow detector 8 and the central axis of the water-cooled shielding barrel 5 are all coincident, ensuring that the material in the material bearing crucible 4 can be sufficiently evaporated. The two ends of the water-cooling shielding barrel 5 are provided with openings which are divided into a first opening and a second opening, and the high-voltage focusing electrode rod 2 passes through the first opening to be connected with the material bearing crucible 4. The vaporized ion flow detector 8 is provided at the second opening. The evaporant flow detector 8 is connected with the material bearing crucible 4 through a circular mounting plate, and the evaporant flow detector 8 is positioned in a hole of the circular mounting plate.
Further, in order to ensure that the high-pressure focusing electrode rod 2 and the material bearing crucible 4 can move stably, a sliding block is arranged on the high-pressure focusing electrode rod 2, a sliding rod 3 matched with the sliding block is arranged on the ultrahigh vacuum metal sealing flange, and the sliding block can slide along the sliding rod 3. The slide block plays a guiding role, the high-voltage focusing electrode rod 2 and the material bearing crucible 4 are limited to ascend and descend by the slide block, namely, the high-voltage focusing electrode rod 2 and the material bearing crucible 4 move along the central axis direction of the material bearing crucible 4 in the moving process, the distance between the material bearing crucible 4 and the electron emitter 9 is convenient to adjust, the slide block is matched with the slide rod 3 to slide up and down along the slide rod 3 to limit the moving direction of the high-voltage focusing electrode rod 2 and the material bearing crucible 4, so that the material bearing crucible 4 is always positioned right below the electron emitter 9 and is right opposite to the center of the electron emitter 9, the horizontal deviation can not occur, electrons move to the anode at high speed under the action of a high-voltage electric field and bombard evaporated materials in the material bearing crucible 4 arranged above the high-voltage focusing electrode rod 2 intensively to melt and evaporate the evaporated materials, is convenient for maintaining the high-efficiency and complete film coating of the ultrahigh vacuum electron beam evaporator during working.
Referring to fig. 2, a shielding case 7 is disposed on the water-cooled shielding barrel 5, and the shielding case 7 forms an evaporation passage. Specifically, the shield case 7 includes a circular ring portion 71 and a cylindrical portion 72 surrounding an edge of a hole in which the circular ring portion 71 is provided. The cylindrical portion 72 is opposed to the second opening, and forms an evaporation passage. The cylindrical portion 72 may pass through the second opening and surround the vaporized ion stream detector 8. The diameter of the cylindrical portion 72 corresponds to the diameter of the material-carrying crucible 4. The shield 7 is provided on the water-cooled shield bucket 5, for example, the shield 7 is connected with the water-cooled shield bucket 5 through a circular ring-shaped mounting plate. Under the effect of the shielding 7, the material can be evaporated out through the evaporation channel without interference after evaporation. In addition, the heat that the during operation of ultrahigh vacuum electron beam evaporator produced conducts to water-cooling shield bucket 5 in through shield cover 7 rapidly, takes the heat out of ultrahigh vacuum electron beam evaporator through the cooling water, accomplishes rapid cooling process, is favorable to the heat dissipation, prevents that the high temperature from making equipment damage.
Specifically, the evaporative ion flow detector 8 is an ion collecting plate, and the water-cooling shielding barrel 5 and the shielding cover 7 are insulated from the ion collecting plate. For example, insulators are arranged between the ion collecting plate and the shielding case 7 and between the ion collecting plate and the water-cooled shielding barrel 5, so that the generation of electric leakage and glow phenomena in the working process of the ultrahigh vacuum electron beam evaporator is reduced, and the equipment is prevented from being damaged; and, material bearing crucible 4, electron emitter 9 and ion collecting plate are wrapped up by water-cooling shielding bucket 5 and shield 7, both reduced the photoelectric radiation that produces in the coating film process and produced the influence to outside, can prevent again that the radiation outside the during operation electron beam evaporator from producing the influence to the coating film process simultaneously, are convenient for maintain equipment normal work.
Specifically, the ultra-high vacuum electron beam evaporator further includes: the device comprises a rotating mechanism 11 arranged on the first side of the ultrahigh vacuum metal sealing flange and an electric baffle 6 connected with the rotating mechanism 11 and used for opening or closing the evaporation channel. The electric baffle 6 is opposite to the evaporation channel, the size of the electric baffle 6 is larger than that of the evaporation channel, the rotating mechanism 11 adopts a magnetic coupling rotary driving mechanism, the electric baffle 6 is driven by the magnetic coupling rotary driving mechanism and is opened or closed through electric control, and the electric baffle is rapid, convenient and convenient to operate, reduces the contact between a human body and equipment, and is safer. When the electric baffle 6 is opened, the evaporation channel is not covered by the electric baffle 6, so that the material in the material bearing crucible 4 can be evaporated and then can be discharged through the evaporation channel to form a film. When the electric baffle 6 is closed, the electric baffle 6 covers the evaporation channel, and the material in the material bearing crucible 4 can be evaporated and then go out through the evaporation channel and hit on the electric baffle 6.
The rotating mechanism 11 includes: the second driving piece 11a is arranged on the first side of the ultrahigh vacuum metal sealing flange, and the driving rod 11b is connected with the second driving piece 11 a; the driving rod 11b is connected with the electric baffle 6, and particularly, the driving rod 11b penetrates through the ultrahigh vacuum metal sealing flange to be connected with the electric baffle 6. The second driving part 11a adopts a magnetic coupling rotation driving mechanism, a rotating shaft of the magnetic coupling rotation driving mechanism is connected with the driving rod 11b, and when the rotating shaft of the magnetic coupling rotation driving mechanism rotates, the driving rod 11b also rotates along with the rotating shaft, so that the electric baffle 6 also rotates, and the opening and closing of the electric baffle 6 are realized.
Further, the lifting mechanism 1 includes: the metal welding corrugated pipe 1a is arranged on the first side of the ultrahigh vacuum metal sealing flange, the moving block 1b is connected with the metal welding corrugated pipe 1a, the screw rod 1c is in threaded connection with the moving block 1b, and the first driving piece 1d is connected with the screw rod 1 c; the high-voltage focusing electrode rod 2 is positioned in the metal welding corrugated pipe 1a and is connected with the moving block 1 b. The metal welding corrugated pipe 1a is sleeved outside the high-voltage focusing electrode rod 2. The first driving piece 1d adopts a magnetic coupling rotary driving mechanism, a rotating shaft of the magnetic coupling rotary driving mechanism is connected with the screw rod 1c, and when the rotating shaft of the magnetic coupling rotary driving mechanism rotates, the rotating shaft of the magnetic coupling rotary driving mechanism drives the screw rod 1c to rotate and drives the moving block 1b to move, so that the metal welding corrugated pipe 1a is compressed or stretched. And the high-voltage focusing electrode rod 2 can be driven to move under the movement of the moving block 1b, so that the adjustment of the distance between the material bearing crucible 4 and the electron emitter 9 is realized.
Specifically, the lifting mechanism 1 is sealed by a metal welded bellows 1 a. The metal welding corrugated pipe 1a is formed by welding two hollow membranes at the inner edges in a concentric circle mode to form a membrane pair, stacking a plurality of membrane pairs and welding the outer edges together to form a corrugated section, and welding two ends and end plate metals to form a corrugated pipe group, so that the corrugated pipe can reciprocate with other moving parts according to the external requirement; when the lifting mechanism 1 drives the high-voltage focusing electrode rod 2 and the material bearing crucible 4 to move up and down, the metal welding corrugated pipe 1a moves up and down along with the lifting mechanism 1, so that the protection of the lifting mechanism 1 is maintained, meanwhile, the metal welding corrugated pipe 1a made of metal materials can also adapt to the high-temperature and high-pressure working environment in the ultrahigh vacuum electron beam evaporator, and the sealing performance is ensured while the reciprocating motion is realized.
Specifically, the electron emitter 9 is a circular ring-shaped electron emitter. The tungsten filament is bent into an annular structure and used as the electron emitter 9, electrons can be emitted uniformly, the thickness of each part of a film layer in the film coating process is uniform, and the process control performance is improved; meanwhile, the amount of generated electrons can be controlled by adjusting the current of the tungsten filament, and the evaporation amount can be further adjusted, so that the process parameters such as the film thickness of the coating film and the like can be controlled.
Specifically, the ultra-high vacuum electron beam evaporator further comprises a ceramic sealing electrode 10 connected with the electron emitter 9, a ceramic metal sealing electrode, which has good insulating property and vacuum leakage rate less than 2 × 10-10Pa.l/s, the ceramic sealing of the electrode 10 can reduce the occurrence of phenomena such as leakage current, glow, etc. Of course, the high-voltage focusing electrode rod 2 is also connected with a power supply by adopting a ceramic seal electrode.
Specifically, the water-cooling shielding barrel 5 adopts a totally enclosed double-wall structure. The water cooling system is sealed in an integral brazing mode, the totally-enclosed water cooling system is high in heat dissipation efficiency, low in water consumption, energy-saving, environment-friendly, isolated from external connection, good in air tightness of the integral structure, and capable of reducing the condition of water leakage under high temperature and high pressure; and the water cooling body is of a double-layer wall type, the water cooling loop is uniform and has no dead angle, and high-temperature components can be fully cooled.
Furthermore, the power supply lead inside the ultrahigh vacuum electron beam evaporator of the application is protected by a ceramic tube. The power supply lead is protected by the aid of excellent high-temperature-resistant, high-pressure-resistant and low-outgassing performances of the ceramic tube, the power supply lead is prevented from being damaged during working, and equipment faults are reduced.
The application also discloses an electron beam coating device, wherein the electron beam coating device comprises the ultrahigh vacuum electron beam evaporator.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. An ultra-high vacuum electron beam evaporator, comprising: the device comprises an ultrahigh vacuum metal sealing flange, a lifting mechanism arranged on the first side of the ultrahigh vacuum metal sealing flange, a water-cooling shielding barrel arranged on the second side of the ultrahigh vacuum metal sealing flange, a material bearing crucible, an electron emitter and an evaporation ion flow detector, wherein the material bearing crucible, the electron emitter and the evaporation ion flow detector are arranged in the water-cooling shielding barrel in sequence; the lifting mechanism is connected with the material bearing crucible through a high-voltage focusing electrode rod and is used for adjusting the distance between the material bearing crucible and the electron emitter; the electron emitter is connected with the ultrahigh vacuum metal sealing flange, and the evaporative ion flow detector is connected with the water-cooling shielding barrel.
2. The ultra-high vacuum electron beam evaporator according to claim 1, wherein a slide block is disposed on the high-voltage focusing electrode rod, and a slide rod engaged with the slide block is disposed on the ultra-high vacuum metal sealing flange, and the slide block is slidable along the slide rod.
3. The ultra-high vacuum electron beam evaporator according to claim 1, wherein a shielding case is provided on the water-cooled shielding barrel, the shielding case forming an evaporation passage.
4. The ultra-high vacuum electron beam evaporator according to claim 3, wherein the evaporated ion flow detector is an ion collecting plate, and the water-cooled shielding bucket and the shielding cover are both insulated from the ion collecting plate.
5. The ultra-high vacuum electron beam evaporator of claim 3, further comprising: the rotary mechanism is arranged on the first side of the ultrahigh vacuum metal sealing flange, and the electric baffle is connected with the rotary mechanism and used for opening or closing the evaporation channel.
6. The ultra-high vacuum electron beam evaporator according to claim 1, wherein the elevating mechanism comprises: the metal welding corrugated pipe is arranged on the first side of the ultrahigh vacuum metal sealing flange, the moving block is connected with the metal welding corrugated pipe, the screw rod is in threaded connection with the moving block, and the driving piece is connected with the screw rod; the high-voltage focusing electrode rod is positioned in the metal welding corrugated pipe and is connected with the moving block.
7. The ultra-high vacuum electron beam evaporator according to any one of claims 1 to 6, wherein the electron emitter is a ring-shaped electron emitter.
8. The ultra-high vacuum electron beam evaporator according to any one of claims 1 to 6, further comprising: and a ceramic seal electrode connected with the electron emitter.
9. The ultra-high vacuum electron beam evaporator as recited in any one of claims 1 to 6, wherein said water-cooled shielding barrel has a totally enclosed double-walled structure.
10. An electron beam coating apparatus, comprising: the ultra-high vacuum electron beam evaporator of any one of claims 1 to 9.
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| CN202010458697.2A CN111663105A (en) | 2020-05-26 | 2020-05-26 | Ultrahigh vacuum electron beam evaporator and electron beam coating device |
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| CN202010458697.2A CN111663105A (en) | 2020-05-26 | 2020-05-26 | Ultrahigh vacuum electron beam evaporator and electron beam coating device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114032511A (en) * | 2021-11-16 | 2022-02-11 | 哈尔滨工业大学（深圳） | Electronic action ultrahigh vacuum evaporation source |
| WO2022104966A1 (en) * | 2020-11-20 | 2022-05-27 | 湖南烁科晶磊半导体科技有限公司 | Crucible movable beam source furnace for molecular-beam epitaxy |
| CN115616017A (en) * | 2022-09-30 | 2023-01-17 | 南方科技大学 | Electronic optical test platform device |
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| CN115616017A (en) * | 2022-09-30 | 2023-01-17 | 南方科技大学 | Electronic optical test platform device |
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Application publication date: 20200915 |