CN214088646U

CN214088646U - Magnet rotary target gun

Info

Publication number: CN214088646U
Application number: CN202023146318.0U
Authority: CN
Inventors: 李伟
Original assignee: Changsha Yuanrong Technology Co ltd
Current assignee: Changsha Yuanrong Technology Co ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-08-31
Anticipated expiration: 2030-12-23

Abstract

The utility model relates to a vacuum coating equipment technical field provides a rotatory target gun of magnet, including setting up the target that from top to bottom sets gradually in the target gun cavity, base plate and magnetic control assembly, the magnetic control assembly includes outer lane magnet, the coating of setting at the central magnet at outer lane magnet center and cladding outer lane magnet and central magnet, has add the drive arrangement who is connected with the magnetic control assembly, drive arrangement drive magnetic control assembly rotates or reciprocating motion, the base plate includes upper plate and hypoplastron, form sealed cooling cavity between upper plate and the hypoplastron, the base plate below forms sealing connection with the help of first sealing washer and target gun cavity. Through the technical scheme, the problem of low target material etching utilization rate in the prior art is solved.

Description

Magnet rotary target gun

Technical Field

The utility model relates to a vacuum coating equipment technical field, it is specific, relate to a rotatory target gun of magnet.

Background

Magnetron sputtering is an important branch of Physical Vapor Deposition (PVD) technology, and uses a mode of combined action of a magnetic field and an electric field to constrain electrons in plasma to spirally move near the surface of a target material, so as to increase the probability of generating ions by the electrons colliding with neutral atoms. The increased ion density reduces crook dark areas, increases the ion bombardment rate of the target material, and thus increases the sputtering rate. Ions in the plasma collide with a target surface under the action of an electric field, material atoms are bombed from the target material, the emitted material atoms are diffused to the surface of the substrate and are deposited on the surface of the substrate to form a film, and a sputtering source of the sputtering source is called a magnetron sputtering cathode (hereinafter referred to as a sputtering cathode) or a magnetron sputtering target gun. Depending on the target material used, the sputtering target materials can be classified into a cylindrical sputtering cathode (the target material is in a cylindrical shape) and a flat sputtering cathode (the target material is in a flat plate shape), and the flat sputtering cathode can be further classified into a rectangular sputtering cathode (the target material is in a rectangular shape) and a circular sputtering cathode (the target material is in a circular shape).

In the prior art, the magnetic field of a planar magnetron sputtering cathode is fixed, the distribution of plasma is influenced by the magnetic field, and the sputtering of a target material is influenced by the distribution of the plasma. Therefore, in magnetron sputtering, a so-called "sputtering ring" or "sputtering track" is formed on the surface of the target, as shown in fig. 1 (both circular and rectangular), the target is positioned in the high vacuum chamber, argon gas for sputtering is introduced into the surface of the target, a magnetic field is formed on the surface of the target by the outer ring magnet and the central magnet, and sputtering voltage is applied to the target. The utilization rate of the target material in the existing plane magnetron sputtering technology is very low, and generally 30-35% causes the following problems: firstly, the target is a main material for sputtering coating, which causes great waste, especially for precious targets; secondly, the replacement of the target material needs to be carried out by breaking vacuum of the process chamber and discharging the gas to the atmospheric pressure, so that the production efficiency is reduced, and the opportunity of atmospheric pollution is increased in the process chamber; thirdly, the sputtering process is unstable, and as the sputtering ring is gradually deepened, under the same process conditions (i.e. the sputtering power, the process gas flow and the process gas pressure are not changed), the sputtering rate of the target material is gradually reduced, and the divergence angle of the sputtered target material atoms in motion is gradually reduced! Leading to instability of the sputtering process; fourth, the target area (directly above the central magnet) that is rarely sputtered by ions gradually accumulates impurities that are sputtered onto the substrate and cause contamination;

at present, various ways are adopted at home and abroad to improve the utilization rate of the target, wherein two improvement directions exist, one is to change the shape of the target and change the target into a special-shaped structure, but the improvement of the utilization rate of the target is limited, and the processing cost of the target is improved; in addition, a method of increasing the number of the outer ring magnetic rings is adopted to form a plurality of sputtering rings and increase the sputtering area, but the utilization rate of the target material is improved to a limited extent by the method, and the cost of the target gun is increased; based on the above problems, a novel sputtering target gun with high efficiency and high utilization rate is urgently needed.

SUMMERY OF THE UTILITY MODEL

The utility model provides a rotatory target gun of magnet has solved the problem that target sculpture utilization ratio and water-stop life compromise among the prior art.

The technical scheme of the utility model as follows:

the utility model provides a rotatory target gun of magnet, is including setting up target, base plate and the magnetic control subassembly that from top to bottom sets gradually in the target gun cavity, the magnetic control subassembly includes outer lane magnet, sets up inboard central magnet and the cladding of outer lane magnet with the coating of central magnet, add with the drive arrangement that the magnetic control subassembly is connected, the drive arrangement drive magnetic control subassembly rotates or reciprocating motion, the base plate includes upper plate and hypoplastron, the upper plate with form sealed cooling cavity between the hypoplastron, the base plate below forms sealing connection with the target gun cavity with the help of first sealing washer.

And a second sealing ring is additionally arranged between the upper plate and the lower plate, and a coolant is introduced into the cooling cavity.

The upper plate is made of oxygen-free copper, and the lower plate is made of non-magnetic conductive metal.

And a space exists between the magnetic control assembly and the substrate, and the space is 1-2 mm.

The target and the substrate are circular or rectangular, the outer ring magnet comprises an outer contour part and an inner concave part, and the inner concave part is close to the central magnet.

The driving device is a motor or an electric cylinder.

The coating layer is an insulating layer.

The coating layer is made of polytetrafluoroethylene.

The coating layer is a metal layer with an insulating film.

The utility model discloses a theory of operation and beneficial effect do:

the utility model discloses a magnet rotary target gun, the main body of which is composed of a target material, a substrate and a magnetic control component which are arranged in the target gun cavity from top to bottom in sequence, the substrate is divided into an upper plate and a lower plate which are connected in a sealing way, a sealed cooling cavity is formed between the upper plate and the lower plate, the magnetic control component is composed of an outer ring magnet and a central magnet positioned at the center of the outer ring magnet, a driving device is additionally arranged by wrapping a coating layer, and the driving device drives the magnetic control component to rotate or move; its theory of operation, when carrying out magnetron sputtering, the magnetic field that magnet formed can lead to the different regions of target to be different by the speed of ion etching to form so-called sputtering ring the utility model discloses well drive arrangement drive magnetic control subassembly rotates or removes, can make magnetic field constantly change, and the ion etching speed of corresponding target surface different positions also constantly changes, through optimizing the magnetic field overall arrangement, can be so that the average ion etching speed in all positions on target surface is very close to, thereby realizes the even sculpture in target surface. In addition, a cooling cavity for cooling the target material and the substrate are integrated in the etching process, the substrate and the target gun cavity are sealed by means of the first sealing ring, and the target gun cavity is divided to form two environments, so that the target material and the substrate work in a vacuum environment, and the magnetic control assembly influencing etching sputtering can rotate or move in an atmospheric environment;

compared with the prior art, in the prior art, the target is arranged on the oxygen-free copper substrate; the oxygen-free copper substrate and the target gun base are sealed by a sealing ring, the space wrapped by the oxygen-free copper substrate and the target gun base is not in a vacuum environment, and the oxygen-free copper substrate and the target material are positioned in a high-vacuum target gun cavity; a permanent magnet is arranged below the oxygen-free copper substrate to form a magnetic field required by magnetron sputtering; a cooling water tank is arranged below the oxygen-free copper substrate, and cooling water is introduced in the sputtering process and used for cooling the target material during sputtering of the target material so as to maintain the low-temperature state of the target material; the sputtering voltage was applied to the target through an oxygen-free copper substrate. Under the structure, the magnet, the oxygen-free copper substrate and the target are all static, but the most effective method for solving the problems of the circular sputtering cathode at present is to rotate a magnetic field in the sputtering process, the method is generally designed to enable a sputtering ring to be in an irregular elliptical shape, the magnet is rotated at a constant speed in the sputtering process, so that different areas of the target obtain more uniform average etching rates, but the improvement of the magnetic field rotating target gun is carried out based on the structure, the water sealing problem is not easy to solve, and cooling water blocks the rotation of the magnet, but the oxygen-free copper substrate is improved, the oxygen-free copper and the cavity base of the target gun are sealed, the rotating mechanism and the sputtering mechanism are respectively arranged under the atmospheric environment and the vacuum environment, the difficult problem caused by the water sealing of the rotating target gun is avoided, the change of the magnetic field is continuous, the sputtering effect is more uniform and comprehensive, the problem of utilize rotating magnetic field to promote target utilization ratio but water-stop seal is difficult among the prior art is solved.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a first schematic structural diagram of the present invention;

FIG. 3 is a second schematic structural view of the present invention;

FIG. 4 is a first schematic structural diagram of the magnetic control assembly of the present invention;

FIG. 5 is a schematic diagram of a sputtering trajectory of the circular target according to the present invention;

FIG. 6 is a schematic diagram of the sputtering trajectory of the rectangular target according to the present invention;

in the figure: 1. the device comprises a target material, 2, an outer ring magnet, 3, a central magnet, 4, a coating layer, 5, a driving device, 6, an upper plate, 7, a lower plate, 8, a cooling cavity, 9, a first sealing ring, 10, a second sealing ring, 11, an outer contour part, 12, an inner concave part, 13, a target gun cavity, a, an oxygen-free copper substrate, b, a base, c, an anode, d and a sealing ring.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive work, are related to the scope of the present invention.

As shown in fig. 1 to 6, the present embodiment provides a magnet rotary target gun, including a target 1, a substrate, and a magnetic control assembly, which are sequentially disposed in a target gun cavity 13 from top to bottom, where the magnetic control assembly includes an outer ring magnet 2, a central magnet 3 disposed inside the outer ring magnet 2, and a coating layer 4 coating the outer ring magnet 2 and the central magnet 3, and a driving device 5 connected to the magnetic control assembly is added, the driving device 5 drives the magnetic control assembly to rotate or reciprocate, the substrate includes an upper plate 6 and a lower plate 7, a sealed cooling cavity 8 is formed between the upper plate 6 and the lower plate 7, and a sealed connection is formed between the lower portion of the substrate and the target gun cavity 13 by means of a first sealing ring 9.

In the embodiment, a magnet rotating target gun is disclosed, a main body of the magnet rotating target gun is composed of a target material 1, a substrate and a magnetic control assembly which are sequentially arranged in a target gun cavity 13 from top to bottom, the substrate is divided into an upper plate 6 and a lower plate 7, the upper plate 6 and the lower plate 7 are hermetically connected, a sealed cooling cavity 8 is formed between the upper plate 6 and the lower plate 7, the magnetic control assembly is composed of an outer ring magnet 2 and a central magnet 3 positioned on the inner side of the outer ring magnet 2, a driving device 5 is additionally arranged by wrapping through a coating layer 4, and the driving device 5 drives the magnetic control assembly to rotate or move; its theory of operation, when carrying out magnetron sputtering, magnetic field can influence the speed that target surface different positions were etched by the ion, the utility model discloses well magnetic field is formed between outer lane magnet 2 and central magnet 3, drive arrangement 5 drive magnetic control subassembly rotates or removes, target surface different positions obtain very close average etching rate, thereby realize that the whole even sculpture of target surface, in addition, as an organic whole to target 1 refrigerated cooling cavity 8 and base plate in the etching process, and base plate and target gun cavity 13 form sealedly with the help of first sealing washer 9, cut apart target gun cavity 13, form two environments, target 1 like this, the base plate just works under vacuum environment, and influence the magnetron sputtering subassembly of sculpture just can rotate or remove under atmospheric environment;

compared with the prior art, in the prior art, the target 1 is arranged on an oxygen-free copper substrate a; an electric field is formed between the anode c and the target 1, the oxygen-free copper substrate a and the target gun base are sealed by a sealing ring d, the space wrapped by the oxygen-free copper substrate a and the target gun base b is not in a vacuum environment, and the oxygen-free copper substrate a and the target are positioned in a high-vacuum target gun cavity 13; a permanent magnet is arranged below the oxygen-free copper substrate a to form a magnetic field required by magnetron sputtering; a cooling cavity 8 is arranged below the oxygen-free copper substrate a, and cooling water is introduced in the sputtering process and used for cooling the target 1 during sputtering of the target 1 so as to keep the target 1 in a low-temperature state; the sputtering voltage was applied to the target through an oxygen-free copper substrate a. In this structure, the central magnet 3, the outer ring magnet 2, the oxygen-free copper substrate a and the target 1 are all static, and the corresponding magnetic field is static, so that the sputtering ring is formed on the surface of the target. The most effective method for solving the problems of the circular sputtering cathode is to rotate the magnetic field in the sputtering process, the sputtering ring is generally designed to be in an irregular elliptical shape by the method, and the magnet is rotated at a constant speed in the sputtering process, so that different areas on the surface of the target material obtain relatively consistent average ion etching rates, and the target material is etched relatively uniformly. However, the magnetic field rotary target gun is improved based on the above structure, because the magnet needs to move, the dynamic sealing problem of the cooling water is troublesome and the movement of the magnet is hindered by the cooling water sealing. And the utility model discloses, improve the anaerobic copper base plate, inside is provided with the cavity to take between anaerobic copper base plate and the target gun cavity base sealedly, set up rotary mechanism and sputtering mechanism respectively under atmospheric environment and under the vacuum environment, solved among the prior art and utilized rotating magnetic field to promote the problem that the target utilization ratio is but the water-stop difficulty.

A second sealing ring 10 is additionally arranged between the upper plate 6 and the lower plate 7, and a coolant is introduced into the cooling cavity 8.

In this embodiment, utilize second sealing washer 10 to seal between the upper plate 6 of base plate and hypoplastron 7, further promoted the leakproofness of cooling cavity 8 to promote the life of target gun, let in the coolant in cooling cavity 8, the heat that target 1 was brought by the sculpture can be taken away with the help of the heat conduction of upper plate 6 to the coolant, thereby guarantees the stability and the life-span of target gun during operation, avoids breaking down.

The upper plate 6 is made of oxygen-free copper, and the lower plate 7 is made of non-magnetic conductive metal.

In this embodiment, the upper plate 6 is made of oxygen-free copper, the lower plate 7 is made of non-magnetic metal, the upper plate 6 made of oxygen-free copper is in contact with the target 1, so that efficient thermal conductivity can be maintained, high temperature caused by etching of the target 1 is taken away, the etching efficiency of the target 1 is prevented from being affected by the high temperature, the lower plate 7 is made of non-magnetic metal, the substrate needs to be as thin as possible for covering the magnetic field of magnetron sputtering, and meanwhile, the substrate cannot be magnetic-conductive, so that the distribution of the magnetic field is prevented from being affected.

In this embodiment, there is a gap between the magnetron assembly and the substrate, and the gap is set to 1 to 2mm in order to distribute the magnetic field formed between the outer ring magnet and the center magnet 3 over the target 1.

The target 1 and the substrate are circular or rectangular, the outer ring magnet 2 comprises an outer contour part 11 and an inner concave part 12, and the inner concave part 12 is close to the central magnet 3.

In this embodiment, the substrate and the target 1 may be circular or rectangular according to a practical application scenario, the outer ring magnet 2 is divided into an outer contour portion 11 and an inner concave portion 12, wherein the inner concave portion 12 is close to the central magnet 3, the magnetic field formed at this time is a closed special-shaped magnetic field, and under the driving of the driving device 5, no matter the inner concave portion rotates or reciprocates, the magnetic field can cover the etching surface of the whole target 1, so that the area of the etched target 1 is greatly increased, the corresponding etching efficiency is also increased, the inner concave portion 12 of the outer ring magnet 2 may be a plurality of inner concave portions 12 distributed circumferentially, and the circumferences are distributed at equal intervals.

The driving device 5 is a motor or an electric cylinder.

In this embodiment, the driving device 5 may be one of a motor or an electric cylinder, and is a vacuum device to avoid pollution, and preferably, the electric cylinder is electrically driven, the motor can drive the magnetic control assembly to rotate, and the electric cylinder can drive the magnetic control assembly to reciprocate, so that when the rectangular target 1 and the substrate are used, the sputter etching area of the target 1 can be increased, and the utilization rate of the target 1 can be increased.

The coating layer 4 is an insulating layer.

In this embodiment, the coating layer 4 is an insulating layer, and the coating layer 4 protects the magnet and prolongs the service life of the magnet.

The coating layer 4 is made of polytetrafluoroethylene.

In this embodiment, the coating layer 4 is made of polytetrafluoroethylene, which can play both an insulating role and a protecting role, and has low cost and a good magnetic field dispersion effect.

The coating layer 4 is a metal layer having an insulating film.

In this embodiment, the coating layer 4 is a metal layer, and the surface of the metal layer is further coated with an insulating film of silicon oxide or silicon nitride, so that the insulating effect is achieved, the metal protection effect is more durable, and the service life is long.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a rotatory target gun of magnet, is including setting up target (1), base plate and the magnetic control subassembly that sets gradually from top to bottom in the target gun cavity, the magnetic control subassembly includes outer lane magnet (2), sets up outer lane magnet (2) inboard central magnet (3) and cladding outer lane magnet (2) with coating (4) of central magnet (3), its characterized in that, add with drive arrangement (5) that the magnetic control subassembly is connected, drive arrangement (5) drive the magnetic control subassembly rotates or reciprocating motion, the base plate includes upper plate (6) and hypoplastron (7), upper plate (6) with form sealed cooling cavity (8) between hypoplastron (7), the base plate below forms sealing connection with the target gun cavity with the help of first sealing washer (9).

2. The magnet-rotating target gun according to claim 1, characterized in that a second sealing ring (10) is added between the upper plate (6) and the lower plate (7), and a coolant is introduced into the cooling cavity (8).

3. The magnet rotating target gun of claim 2, wherein the upper plate (6) is oxygen free copper and the lower plate (7) is a non-magnetically conductive metal.

4. The magnet rotary target gun of claim 1 or 3, wherein the magnetron assembly is spaced from the substrate by a distance of 1-2 mm.

5. The magnet rotating target gun according to claim 1, wherein the target (1) and the substrate are circular or rectangular, the outer ring magnet (2) comprising an outer contour (11) and an inner recess (12), the inner recess (12) being close to the central magnet (3).

6. A magnet-rotating target gun according to claim 5, characterized in that the driving means (5) is an electric motor or an electric cylinder.

7. The magnet rotating target gun of claim 6, wherein the coating (4) is an insulating layer.

8. The magnet rotating target gun of claim 7, wherein the coating (4) is polytetrafluoroethylene.

9. The magnet rotary target gun according to claim 7, wherein the coating layer (4) is a metal layer having an insulating film.