CN111654242A

CN111654242A - Method and system for detecting a breach in a solar wafer

Info

Publication number: CN111654242A
Application number: CN202010417595.6A
Authority: CN
Inventors: 韩白权
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2015-10-26
Filing date: 2016-09-20
Publication date: 2020-09-11
Anticipated expiration: 2036-09-20
Also published as: SG10201508830PA; CN108604880B; WO2017074256A1; CN111654242B; CN108604880A

Abstract

An breach defect detection system for detecting a breach defect at a chamfered edge of a solar wafer, the solar wafer being of a substantially rectangular or square shape having a straight edge and a chamfered edge, the breach defect detection system comprising: (a) a plurality of imaging devices for picking up images of the position of the solar wafer and horizontally positioned such that a focal plane of the imaging devices is parallel to a chamfered edge of the solar wafer; (b) a plurality of illumination devices for providing light to the imaging device when the imaging device is in operation; (c) a conveyor belt for horizontally transporting the solar wafers during the notch detection operation; (d) a sensing device that provides a signal to trigger the imaging device to begin image capture; and (e) a strobe driver triggered by the imaging device to drive the illumination device such that the imaging device provides an exposure time consistent with the illumination device whereby the chamfered edge is located at an out-of-focus position at the same position as being sensed by the sensing device and an image captured by the imaging device is unclear as a breach on the chamfered edge of the solar wafer. The invention also discloses a method for detecting the notch defect on the solar wafer.

Description

Method and system for detecting a breach in a solar wafer

The present application is a divisional application of the invention patent application having application number 201680070827.7 filed 2016, 9, 20 and entitled "method and system for detecting a breach in a solar wafer".

Technical Field

The present invention relates to a system and method for detecting a notch (chipping) on a chamfered sidewall of a solar wafer, and more particularly to a notch detection system and method suitable for detecting a notch on any edge of a solar wafer that may cause cracking and wafer breakage.

Background

As part of the solar cell manufacturing process, solar cell manufacturers often perform inspection of solar wafers. This is to ensure that any defects on the solar wafer are identified in the initial stage and that the subsequently produced solar wafers are of high quality.

Solar wafers are very thin silicon wafers commonly used in the manufacture of solar cells. In the manufacture of solar cells, solar wafers undergo numerous processes, such as deposition, etching, and patterning, to serve as a substrate for the solar cells before they become functional solar cells during the manufacturing process. Due to the brittle nature of solar wafers, very small breaches on any edge of a solar wafer can cause cracks and ultimately wafer breakage when used in the manufacture of solar cells. Therefore, in order to improve the production yield and keep the production cost low, it is very critical to maintain the quality of the solar wafer from the beginning of the manufacturing process.

Breach defects may occur on the top and/or bottom surfaces along the straight and chamfered edges of the solar wafer (as shown in fig. 1). This type of breach can be detected by using two cameras that directly view the top and bottom surfaces of the solar wafer, and taking an image as the wafer moves (i.e., instant image capture) (as shown in fig. 2). Gaps along both straight and chamfered edges can be detected.

Notch defects can also occur on the sidewall surface along the straight edge of the solar wafer (as shown in figure 3). This type of breach is not visible from the top and/or bottom surface and therefore an additional camera must be used. Typically, two additional cameras are placed horizontally along the wafer movement direction to view the sidewalls, and the images are taken in a live manner (as shown in FIG. 4). To detect a breach in the leading/trailing edge sidewall, the solar wafer is rotated 90 degrees using a mechanical rotator and then passed through two additional cameras arranged similarly to the cameras before rotation.

In addition, notch defects may also occur on the sidewall surfaces along the chamfered edge of the solar wafer (as shown in FIG. 5). This type of gap is unique in that it only occurs on the side walls of the chamfered edge at only 45 degrees to the straight edge. In addition, this type of gap is not visible from the top and bottom surfaces. Although the typical depth of focus of a camera is about 2mm, the chamfer size of some single crystal solar wafers can be as high as 25mm (depending on wafer size and diameter) (as shown in fig. 6). Currently, even if positioned horizontally, the camera cannot detect the breach.

U.S. patent No. 5,157,735 entitled "breach detection system and method" discloses a system and method of detecting a breach in a track portion of a slider of a thin-film magnetic head by tracking a boundary of a detected object from an image to obtain an image of the detected object and its boundary coordinates. The size of the notch is obtained from the coordinates of the point on the boundary, and the presence or absence of the notch is judged from the size of the notch, thereby enabling the detection of the notch defect generated on the boundary portion of the detection object with high accuracy using a simple structure.

Us patent No. 8400630 relates to a method for detecting defects in an object, the method comprising: locally illuminating the object by illuminating the object with incident light having a wavelength transparent to the object; detecting a plurality of reflected components of the incident light while also at least partially avoiding detecting a directly transmitted component of the incident light and at least partially avoiding detecting a single reflected component of the incident light; and identifying the defect by estimating a difference in intensity of the detected components of the incident light.

U.S. patent No. 8428337 discloses a method for wafer inspection, the method comprising: directing light substantially along a first axis toward a first surface of a wafer, thereby obtaining light emanating from a second surface of the wafer along the first axis, wherein the first surface and the second surface of the wafer are substantially outwardly opposed and extend substantially parallel to a plane; and directing light substantially along a second axis toward the first surface of the wafer to obtain light emanating from the second surface of the wafer along the second axis, the first axis being angularly distant from the second axis about a reference axis extending along a plane, wherein an orthogonal projection of the first axis onto the plane is substantially parallel to an orthogonal projection of the second axis onto the plane, and each of the orthogonal projections of the first axis and the second axis onto the plane is substantially orthogonal to the reference axis.

Another breach detection method is conventionally performed by the human eye, but as an alternative to such detection, various techniques for automatically detecting breaches have been proposed.

Some conventional techniques related to such systems are disclosed in, for example, japanese patent laid-open publication No. 255484/1986 and japanese patent laid-open publication No. 13617/1987. In the former method, a straight line is applied to the boundary of a straight line portion of a binary image obtained by detection of a TV camera or the like by a least squares method, and the value of the binary image is checked along the straight line. And judging the existence or non-existence of the gap according to the result. In the latter method, the scattered light produced by the breach is detected and for this purpose the angle of incidence and the setting of the scattered light receptor are optimized.

Disclosure of Invention

Accordingly, it is an object of the present invention to obviate the above-mentioned problems of the prior art and to provide a method of instantly detecting a notch on a chamfered side wall of a solar wafer, which is capable of detecting the notch at a high speed without fail-safe.

It is another object of the present invention to provide a system for the real-time inspection of a notch in a chamfered sidewall of a solar wafer, which is capable of detecting the notch at high speed without error and leakage.

An object of the present invention is to provide a notch defect detecting system for detecting a notch defect at a chamfered edge of a solar wafer, the solar wafer being substantially rectangular or square in shape having a straight edge and a chamfered edge, the notch defect detecting system comprising:

(a) a plurality of imaging devices for picking up images of the position of the solar wafer and horizontally positioned such that a focal plane of the imaging devices is parallel to a chamfered edge of the solar wafer;

(b) a plurality of illumination devices for providing light to the imaging device when the imaging device is in operation;

(c) a conveyor belt for horizontally transporting the solar wafers during the notch detection operation;

(d) a sensing device that provides a signal to trigger the imaging device to begin image capture; and

(e) a strobe driver (strobe light driver) triggered by the imaging device to drive the illumination device such that the imaging device provides an exposure time consistent with the illumination device,

whereby the chamfered edge is located at an out-of-focus position at the same position being sensed by the sensing device and an image captured by the imaging device is unclear as a breach on the chamfered edge of the solar wafer.

Accordingly, an object of the present invention is to eliminate the above-mentioned problems of the prior art and to provide a breach detection system and method having a simple structure and capable of detecting a breach at a high speed without fail and affected by the position or condition of a detection object.

It is another object of the present invention to provide a breach detection system and method that can detect square shaped or textured solar wafers.

The invention aims to provide a method for detecting the notch defect of a solar wafer by using the detection system, which comprises the following steps:

(a) positioning a plurality of cameras horizontally, wherein a camera focal plane of the cameras is parallel to the chamfered edge of the solar wafer;

(b) installing a presence sensor along the conveyor belt to detect a solar wafer presence such that the solar wafer is detected by the presence sensor before the chamfered edge enters a depth of focus (DOF) range of the camera;

(c) transporting the solar wafer horizontally by the conveyor belt at a constant speed;

(d) detecting, by the presence sensor, the solar wafer to output a true signal;

(e) triggering the camera to capture a plurality of images of the chamfered edge at constant intervals with a signal generated by the presence sensor and also triggering a strobe driver to provide illumination consistent with the camera exposure time;

(f) transmitting the image that has been captured by the camera to a computer linked to the detection system;

(g) receiving, by the computer, a series of chamfered edge images beginning outside the DOF range, within the DOF range, out of the DOF range, and again outside the DOF range;

(h) locating, by the computer, an image in which the chamfered edge is within the DOF range by selecting the image with the greatest image sharpness; and

(i) the sharpest image is analyzed to perform image analysis to detect any existing gaps.

The above and other objects, features and advantages of the present invention will become apparent from the following description of the preferred embodiments of the present invention, which is to be read in connection with the accompanying drawings.

Drawings

FIG. 1 shows a breach in a surface along an edge of a solar wafer;

FIG. 2 illustrates a conventional system for detecting a breach as in FIG. 1, wherein a top camera and a bottom camera are placed over a solar wafer;

FIG. 3 illustrates a typical solar wafer having notch defects on the sidewall surface along the straight edge of the solar wafer;

FIG. 4 illustrates a system for detecting a breach as in FIG. 3;

FIG. 5 illustrates a breach defect on a sidewall surface along a chamfered edge of a solar wafer;

FIG. 6 schematically illustrates a breach in a sidewall surface of a chamfered edge of a solar wafer, wherein the chamfer is up to 25mm in size and the camera is in a horizontal position;

FIG. 7 schematically illustrates a system for detecting a breach in a solar wafer in accordance with the present invention;

FIG. 8 schematically illustrates the positioning of a camera relative to the location of a chamfered edge in accordance with the present invention;

FIG. 9 schematically illustrates the positioning of a camera with respect to the position of a chamfered edge, where a solar wafer has a change in position Δ x on a conveyor belt, in accordance with the present invention;

FIG. 10 schematically illustrates a case where the chamfered edge according to the present invention falls within the camera focal plane even if the solar wafer position variation is Δ x.

FIG. 11 shows up to a number N of solar wafer 103 positions captured by the camera 101 in burst mode (burst mode) in accordance with the present invention;

FIG. 12 illustrates an example of chamfered sidewalls with notch images taken in burst mode and their calculated edge definition in accordance with the present invention; and

fig. 13A and 13B schematically show another preferred embodiment of the present invention.

Detailed Description

Referring to the drawings, embodiments of the invention described below relate to a method and system for the real-time detection of a notch on a chamfered sidewall of a solar wafer.

As shown, fig. 1 schematically illustrates a notch formed in a solar wafer during the fabrication of a solar cell. These common defects include a notch on the top and bottom surfaces along the chamfered edge 93, a notch on the top or bottom surface only along the straight edge 92 of the solar wafer, notches on the top and bottom surfaces along the straight edge 91 of the solar wafer, and notches on the top or bottom surface along the chamfered edge 90 of the solar wafer. Figures 2-4 illustrate a notch formed in the solar wafer but not on the chamfered edge. In the drawing, reference numeral 101 denotes a camera, 103 denotes a solar wafer, and a conveyor belt is denoted by 104.

Referring to fig. 5, a cutout formed in the sidewall along the chamfered edge 202 of the solar wafer is shown. The conventional approach to notch detection for this situation cannot be used because this type of notch is not visible from the top and bottom surfaces of the solar wafer, and appears on the sidewall surface at 45 degrees to the straight edge on the chamfered edge. Although the typical depth of focus of the camera is about 2mm, the chamfer size of some single crystal silicon solar wafers can be as high as 25mm, depending on the wafer size and diameter, and therefore, the camera cannot detect a breach even if the solar wafer is positioned horizontally. Figure 6 schematically shows a breach in the sidewall surface of a chamfered edge of a solar wafer, where the chamfer is up to 25mm in size and the camera is in a horizontal position.

Exemplary embodiments of the present invention are described in more detail below with reference to the legends provided in fig. 7 through 13, where like elements are identified with like reference numerals.

FIG. 7 schematically illustrates a system for detecting a notch defect at a chamfered edge of a solar wafer according to the present invention. In a preferred embodiment of the present invention, a notch defect detection system for detecting a notch defect at a chamfered edge of a solar wafer comprises a plurality of imaging devices, such as cameras 101, for picking up images of the position of the solar wafer 103. Generally, the solar wafer 103 is substantially rectangular or square in shape with straight and chamfered edges. In this case, a total of four cameras 101 are used for notch detection at the chamfered edge of the solar wafer 103. The system further comprises a plurality of lighting means 102 for providing light to the imaging means 101 when operating in breach detection. The breach detection system further comprises a conveyor belt 104 for horizontally transporting the solar wafers during the breach detection operation and a sensing device 105 (presence sensor) for providing a signal to trigger the imaging device 101 to start image capture. A strobe driver 107 is provided in the system to trigger the imaging device 101 to drive the illumination device 102 such that the imaging device 101 provides an exposure time consistent with the illumination device 102. In other words, the breach detection system of the present preferred embodiment provides a plurality of cameras, for example, four cameras in this case, each equipped with a lens 101(lens), and 4 sets of lighting devices (illuminators) 102. The camera 101 is horizontally positioned and oriented such that the camera focal plane 201 is parallel to and coincident with each chamfered edge 202 of the solar wafer 103. The solar wafer 103 is loaded on the conveyor belt 104 and, as the solar wafer 103 is transported by the conveyor belt 104, sensed by the presence sensor 105 mounted around the conveyor belt 104 or at any suitable location so that the presence of the solar wafer can be detected at some time (t0), the presence sensor 105 triggers the camera 101 to start image capture. Camera 101 also triggers strobe driver 107, which drives illuminator 102 so that the camera exposure time coincides with the illumination.

In the present preferred embodiment, the chamfered edge 202 of the solar wafer 103 and the camera focal plane 201 are parallel to each other in view of the orientation of the camera, and it is thus possible to obtain a sharp image of the chamfered side wall and thereby detect a breach in the chamfered side wall of the solar wafer 103.

Figure 8 schematically illustrates one corner of a breach detection system in accordance with a preferred embodiment of the present invention. As shown, the camera focal plane 201 is directly parallel to the chamfered edge of the solar wafer 103. In order to obtain a sharp image of the chamfered sidewalls, the position of the solar wafer 103 on the conveyor belt 104 needs to be controlled with high precision. Fig. 9 schematically illustrates the positional change Δ X of the solar wafer 103 on the conveyor belt 104. When the solar wafer 103 has a change in position Δ X on the conveyor belt 104, the chamfered edge 202 may be located at an out-of-focus position at the same position being sensed by the presence sensor 105. Therefore, the image captured by the camera 101 is unclear and the gap detection performance is affected.

Fig. 10 schematically illustrates a captured sharp chamfered edge 202 according to the present invention. In other words, even if the solar wafer 103 position change is Δ X, the chamfered edge 202 image should fall within the camera focal plane 201. To accomplish this, the presence sensor 105 is moved forward so that camera image capture begins earlier. Once the camera is triggered by the presence sensor 105, it will capture images in burst mode at a fixed number of Frames Per Second (FPS) as the solar wafer 103 moves at speed v. The chamfered edge 202 need not be at the camera focal plane 201 when the camera 101 starts burst mode image capture.

Fig. 11 schematically shows the positions of up to a number N of solar wafer 103 positions captured by the camera 101 in burst mode. The first position P1 of the solar wafer 103 is the position where the presence sensor 105 triggers the camera 101 and the next image is triggered after the interval ρ, and the interval ρ may be calculated as follows:

ρ＝v/FPS

where ρ is the interval, v is the velocity of the moving solar wafer, and the FPS is the fixed number of frames per second of the burst mode.

Referring to fig. 11, since the camera capture is continuous while the solar wafer 103 is being transported, it is possible to obtain an image Pn in which the chamfered edge 202 is positioned within the depth of focus (DOF) range of the camera 101, provided that the interval ρ is at least 1/2 of DOF. Therefore, it is calculated that the camera 101 must have a minimum FPS based on the following equation in order to ensure that the chamfered edge 202 is captured within the DOF range:

〖FPS〗_min＝(2×v×cos45°)/DOF

where FPS is a fixed number of frames per second, v is the speed of the moving solar wafer, and DOF is the depth of focus range of the camera.

For example, given a typical conveyor belt travel speed of 200mm/s and a camera 101 depth of focus (DOF) of 2mm, the minimum FPS required to obtain a sharp chamfered sidewall image is calculated to be about 141 frames per second. This can be achieved by using a modern CMOS sensor camera with an Area-Of-Interest (AOI) set to a thin window sufficient to cover the thickness Of the solar wafer 103 plus some margin.

In a preferred embodiment of the present invention, it is also important to calculate the number of images N required in burst mode to ensure that the chamfered edge 202 of the solar wafer 103 has passed through the camera focal plane 201 regardless of the positional change Δ X.

N_min＝(ΔX×FPS)/(v×cos45°)

Where N is the number of images, Δ X is the position change, FPS is a fixed number of frames per second, and v is the velocity of the moving solar wafer.

For example, given a typical position change Δ X of ± 5mm, the minimum number of images to be captured in burst mode will be found to be 10. The actual number should be larger after taking into account the position of the presence sensor 105.

It has been previously mentioned that when the presence sensor 105 senses the solar wafer 103, the camera 101 starts burst mode image capture. This results in a number N of images being sent to the computer 106 connected to the breach detection system. It will be noted that only one of the N images collected need be selected for gap detection.

FIG. 12 shows a series of chamfered sidewalls with notch images taken in burst mode with calculated edge definition according to the present invention. As shown, image 7 in the series of images has the highest edge definition, and is therefore selected for gap detection. Note that the chamfered edge 202 has transitioned from out-of-focus to in-focus, and then from in-focus to out-of-focus. In addition, it will be noted that the chamfered edge 202 does not stay at the same position since the camera is oriented at 45 degrees relative to the direction of solar wafer movement.

Accordingly, the present invention provides a method of breach defect detection of a solar wafer using the detection system disclosed above. The method comprises the following steps: the plurality of cameras are positioned horizontally with their camera focal planes parallel to the chamfered edge of the solar wafer. A presence sensor is mounted along the conveyor belt to detect the presence of the solar wafer and is positioned such that when the presence sensor detects the solar wafer, the chamfered edge of the solar wafer is detected before the chamfered edge enters a depth of focus (DOF) range of the camera. The solar wafer is transported by the conveyor 104 at a constant speed. When the solar wafer 103 is transported and reaches the presence sensor 105, the presence sensor 105 detects the solar wafer 103 and thus sets the output signal of the system to true. The output signal is connected to the camera 101 and the signal triggers the camera 101 to capture multiple images (or burst mode) of the chamfered edge at constant intervals. While the camera 101 is capturing an image, the camera 101 also triggers the strobe driver 107 to provide illumination consistent with the camera exposure time. The image captured by the camera is transmitted to a computer. At the end of the multiple image captures, the computer 106 receives a series of chamfered edge images, starting outside the DOF range, entering the DOF range, inside the DOF range, exiting the DOF range, and again outside the DOF range.

According to the present invention, the software is loaded into the computer 106, which will locate the image in which the chamfered edge is within the DOF range by selecting the image with the greatest image sharpness. The software will then perform image analysis using the sharpest image to detect the presence of the breach.

Figures 13A and 13B schematically illustrate a possible modification of the breach detection system in another preferred embodiment of the present invention. It will be noted that the number of cameras employed can be reduced to two. This can be achieved by placing two beam splitters 301 on each side of the conveyor belt 104. The beam splitter 301 allows the camera 101 to first capture a leading chamfered edge (leading chamfer edge)302 and then a trailing chamfered edge (trailing chamfer edge)303 as long as the leading and trailing chamfered edges are not simultaneously present on the camera focal plane, which can be done by controlling the gap between solar wafers.

While there has been described what are presently considered to be the preferred embodiments of the present invention, it will be understood that various modifications may be made thereto, and it is intended by the appended claims to cover all such modifications which fall within the true spirit and scope of the invention.

Claims

1. An opening detection system comprising:

a conveyor belt configured to transport a wafer; and

a plurality of cameras for imaging a chamfered edge of the wafer, the plurality of cameras positioned such that a focal plane of each camera is parallel to at least one chamfered edge of the wafer when the wafer is transported on the conveyor belt.

2. The system of claim 1, further comprising:

a presence sensor configured to trigger image capture by the plurality of cameras.

3. The system of claim 1, wherein the plurality of cameras comprises four cameras.

4. The system of claim 3, wherein each camera is positioned to obtain an image of a different one of the chamfered edges.

5. The system of claim 1, further comprising:

a plurality of illuminators configured to illuminate the wafer while the camera captures an image of the chamfered edge.

6. The system of claim 5, further comprising:

a lamp driver configured to drive the plurality of luminaires.

7. The system of claim 6, wherein the light driver is configured to trigger the plurality of cameras to drive the plurality of illuminators.

8. The system of claim 6, wherein the light driver is configured to drive the plurality of illuminators in response to signals provided by the plurality of cameras.

9. The system of claim 8, further comprising:

10. The system of claim 9, wherein exposure times of the plurality of cameras coincide with illumination from the illuminator.

11. The system of claim 1, wherein the plurality of cameras are configured to capture images in a burst mode.

12. The system of claim 11, wherein the burst mode captures images at a fixed number of frames per second of at least (2 x v x cos45 °) per depth of focus (DOF), wherein v is a speed at which the wafer moves in a first direction and DOF is a depth of focus of the plurality of cameras.

13. The system of claim 1, further comprising:

a computer that receives a series of chamfered edge images from the plurality of cameras, including (a) images from outside one side of a depth of focus range, (b) images entering the depth of focus range, (c) images within the depth of focus range, (d) images leaving the depth of focus range, and (e) images outside the other side of the depth of focus range.

14. The system of claim 13, wherein the computer selects an image with maximum sharpness from the series of chamfered edge images.

15. The system of claim 13, wherein the computer analyzes the series of chamfer edge images to detect the presence of a wafer notch.

16. An opening detection system comprising:

a conveyor belt configured to transport a wafer;

a presence sensor configured to detect a presence of the wafer;

a plurality of cameras having a focal plane, the plurality of cameras oriented to capture images of a chamfered edge of the wafer in response to signals provided by the presence sensor when the wafer is positioned on the conveyor belt; and

a plurality of illuminators positioned to provide light to the camera when capturing an image.

17. The system of claim 16, wherein the plurality of cameras comprises four cameras positioned and oriented horizontally to capture an image of each of the chamfered edges of the wafer.

18. The system of claim 16, further comprising:

a light driver configured to trigger the plurality of cameras and drive the plurality of illuminators.

19. The system of claim 16, wherein exposure times of the plurality of cameras coincide with illumination from the illuminator.

20. The system of claim 16, further comprising:

21. The system of claim 20, wherein the computer selects an image with maximum sharpness from the series of chamfered edge images.

22. The system of claim 20, wherein said computer analyzes said series of chamfer edge images to detect the presence of a wafer notch.

23. A method for detecting a wafer breach defect, the method comprising:

transporting the wafer on a conveyor belt;

capturing an image of a chamfered edge of the wafer transported on the conveyor belt; and

illuminating the bevel edge of the wafer while capturing an image of the bevel edge.

24. The method of claim 23, wherein capturing an image of a chamfered edge of the wafer transported on the conveyor belt further comprises:

the acquisition of images is started before the wafer enters the depth of focus range of the plurality of cameras.

25. The method of claim 23, wherein capturing an image of a chamfered edge of the wafer transported on the conveyor belt further comprises:

a burst image is captured.

26. The method of claim 23, further comprising:

receiving, by a computer, a series of chamfered edge images from a plurality of cameras, including (a) an image from outside one side of a focal depth range, (b) an image into the focal depth range, (c) an image within the focal depth range, (d) an image out of the focal depth range, and (e) an image outside the other side of the focal depth range.

27. The method of claim 26, further comprising:

selecting an image having a maximum image sharpness from the series of chamfered edge images.

28. The method of claim 27, further comprising:

wafer breach defects are detected from the selected images.