SG10201508830PA - Method and system to detect chippings on solar wafer - Google Patents

Method and system to detect chippings on solar wafer

Info

Publication number
SG10201508830PA
SG10201508830PA SG10201508830PA SG10201508830PA SG10201508830PA SG 10201508830P A SG10201508830P A SG 10201508830PA SG 10201508830P A SG10201508830P A SG 10201508830PA SG 10201508830P A SG10201508830P A SG 10201508830PA SG 10201508830P A SG10201508830P A SG 10201508830PA
Authority
SG
Singapore
Prior art keywords
chippings
detect
solar wafer
wafer
solar
Prior art date
Application number
SG10201508830PA
Inventor
Peh Kwan Han
Original Assignee
Bluplanet Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bluplanet Pte Ltd filed Critical Bluplanet Pte Ltd
Priority to SG10201508830PA priority Critical patent/SG10201508830PA/en
Priority to PCT/SG2016/050457 priority patent/WO2017074256A1/en
Priority to CN202010417595.6A priority patent/CN111654242B/en
Priority to CN201680070827.7A priority patent/CN108604880B/en
Publication of SG10201508830PA publication Critical patent/SG10201508830PA/en

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
    • H02S50/10—Testing of PV devices, e.g. of PV modules or single PV cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S50/00—Monitoring or testing of PV systems, e.g. load balancing or fault identification
    • H02S50/10—Testing of PV devices, e.g. of PV modules or single PV cells
    • H02S50/15—Testing of PV devices, e.g. of PV modules or single PV cells using optical means, e.g. using electroluminescence
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201508830PA 2015-10-26 2015-10-26 Method and system to detect chippings on solar wafer SG10201508830PA (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SG10201508830PA SG10201508830PA (en) 2015-10-26 2015-10-26 Method and system to detect chippings on solar wafer
PCT/SG2016/050457 WO2017074256A1 (en) 2015-10-26 2016-09-20 Method and system to detect chippings on solar wafer
CN202010417595.6A CN111654242B (en) 2015-10-26 2016-09-20 Method and system for detecting notch on solar wafer
CN201680070827.7A CN108604880B (en) 2015-10-26 2016-09-20 Method and system for detecting a breach in a solar wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201508830PA SG10201508830PA (en) 2015-10-26 2015-10-26 Method and system to detect chippings on solar wafer

Publications (1)

Publication Number Publication Date
SG10201508830PA true SG10201508830PA (en) 2017-05-30

Family

ID=58631952

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201508830PA SG10201508830PA (en) 2015-10-26 2015-10-26 Method and system to detect chippings on solar wafer

Country Status (3)

Country Link
CN (2) CN111654242B (en)
SG (1) SG10201508830PA (en)
WO (1) WO2017074256A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108389808B (en) * 2018-04-23 2024-03-01 无锡奥特维科技股份有限公司 Silicon chip sorting machine
CN109194871A (en) * 2018-10-18 2019-01-11 广东德尔智慧工厂科技有限公司 A kind of device and method of lithium electrode piece burr detection auto-focusing
CN112129244B (en) * 2020-09-21 2022-05-06 北京石晶光电科技股份有限公司 Wafer chamfering detection method
US20230349838A1 (en) * 2022-04-29 2023-11-02 Applied Materials, Inc. Edge inspection of silicon wafers by image stacking

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2999712B2 (en) * 1996-03-29 2000-01-17 住友金属工業株式会社 Edge defect inspection method and apparatus
JP2000046537A (en) * 1998-07-24 2000-02-18 Kobe Steel Ltd Defect inspection equipment
KR100537684B1 (en) * 2001-09-19 2005-12-20 올림푸스 가부시키가이샤 Semiconductor wafer inspection system
JP3744408B2 (en) * 2001-11-13 2006-02-08 信越半導体株式会社 Chamfer analysis method, chamfer analysis holding jig and holder
JP3629244B2 (en) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 Wafer inspection equipment
US7968859B2 (en) * 2003-07-28 2011-06-28 Lsi Corporation Wafer edge defect inspection using captured image analysis
US7227628B1 (en) * 2003-10-10 2007-06-05 Kla-Tencor Technologies Corp. Wafer inspection systems and methods for analyzing inspection data
JP2006064975A (en) * 2004-08-26 2006-03-09 Olympus Corp Microscope and thin plate edge inspection apparatus
JP2007218889A (en) * 2006-02-15 2007-08-30 Nippon Electro Sensari Device Kk Surface defect detection method and surface defect detecting device
WO2007120491A2 (en) * 2006-04-03 2007-10-25 Rudolph Technologies, Inc. Wafer bevel inspection mechanism
JP2008096188A (en) * 2006-10-10 2008-04-24 Reitetsukusu:Kk End shape inspection device
DE102007024525B4 (en) * 2007-03-19 2009-05-28 Vistec Semiconductor Systems Gmbh Apparatus and method for evaluating defects at the edge area of a wafer
JP2009042202A (en) * 2007-08-08 2009-02-26 Taniguchi Consulting Engineers Co Ltd Wafer inspection equipment and wafer inspection method
JP5144401B2 (en) * 2008-07-01 2013-02-13 直江津電子工業株式会社 Wafer inspection equipment
TWI393878B (en) * 2008-08-18 2013-04-21 Chunghwa Picture Tubes Ltd Panel inspection device and inspection method of panel
TWI512865B (en) * 2008-09-08 2015-12-11 Rudolph Technologies Inc Wafer edge inspection
JP2010122145A (en) * 2008-11-21 2010-06-03 Takano Co Ltd Silicon wafer defect inspection device
JP2011163852A (en) * 2010-02-08 2011-08-25 Kobe Steel Ltd Visual inspection device
KR20120015172A (en) * 2010-08-11 2012-02-21 엘지디스플레이 주식회사 Apparatus and method of inspecting display device
EP2781912B1 (en) * 2013-03-19 2021-05-05 Hennecke Systems GmbH Inspection system

Also Published As

Publication number Publication date
CN111654242B (en) 2023-12-29
CN108604880A (en) 2018-09-28
WO2017074256A1 (en) 2017-05-04
CN111654242A (en) 2020-09-11
CN108604880B (en) 2020-06-12

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