KR20140140206A - Laser processing apparatus and laser processing method - Google Patents

Laser processing apparatus and laser processing method Download PDF

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Publication number
KR20140140206A
KR20140140206A KR20130060601A KR20130060601A KR20140140206A KR 20140140206 A KR20140140206 A KR 20140140206A KR 20130060601 A KR20130060601 A KR 20130060601A KR 20130060601 A KR20130060601 A KR 20130060601A KR 20140140206 A KR20140140206 A KR 20140140206A
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KR
South Korea
Prior art keywords
camera
processed
laser
illumination beam
wavelength filter
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Application number
KR20130060601A
Other languages
Korean (ko)
Inventor
권혁준
이동준
현동원
Original Assignee
주식회사 이오테크닉스
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Priority to KR20130060601A priority Critical patent/KR20140140206A/en
Publication of KR20140140206A publication Critical patent/KR20140140206A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)

Abstract

Disclosed are a laser processing apparatus and a laser processing method. The disclosed laser processing apparatus comprises: a laser light source condensed in an object to be processed for emitting processing laser beam forming a modified area; an illumination unit for radiating illumination beam to the object to be processed; a camera for receiving illumination beam coming from the object to be processed and forming an image of the internal of the object; and a wavelength filter which is arranged between the object and the camera to allow the illumination beam incident towards the camera by selectively transmitting the only illumination beam among the illumination beam coming therefrom in a specific wavelength range.

Description

[0001] The present invention relates to a laser processing apparatus and a laser processing method,

More particularly, the present invention relates to a laser processing apparatus and a laser processing method capable of grasping in advance whether or not the object to be processed is capable of laser processing when laser light is focused on the object to be processed.

The laser processing apparatus irradiates an object to be processed with a laser beam emitted from a laser oscillator by using an optical system. The object to be processed is exposed by such a laser beam to perform marking, exposure, etching, punching, scribing, Laser processing such as dicing is performed.

Recently, in order to prevent the surface of the object to be damaged, a method of processing the object by focusing the laser beam in the transmissive object to form a modified region has attracted attention. For such laser processing, a laser beam having a high output or a very short initial pulse may be used. When a high-power laser beam is focused on an object to be processed such as a semiconductor wafer or the like, a modified region is formed near the light-converging point. Then, cracks are generated from the modified region thus formed, and cracks thus generated are naturally or externally expanded to the surface of the object to be processed, thereby dicing the object to be processed.

On the other hand, when a dicing process is performed on an object to be processed after forming a modified region by focusing a laser beam inside the object, various types of objects can be used. Also, The object to be processed may be used. Conventionally, however, it is difficult to determine whether or not the object to be processed can be diced, and the laser beam is focused on the object to be processed to perform a laser processing operation. Due to the object to be processed, May not be able to proceed.

There is provided a laser processing apparatus and a laser processing method capable of grasping beforehand a laser processing operation whether or not the object to be processed is capable of dicing in the case of performing laser processing by focusing a laser beam inside the object.

In one aspect,

A laser light source that emits a machining laser beam that is condensed in the object to be processed to form a modified region;

An illumination unit for irradiating an illumination beam onto the object to be processed;

A camera for receiving an illumination beam emitted from the object to pick up an image of the object; And

And a wavelength filter disposed between the object and the camera and selectively transmitting only an illumination beam of a specific wavelength range among the illumination beams emitted from the object to be incident on the camera.

The object to be processed may comprise a material that is transmissive to the processing laser beam and the illumination beam.

A condensing lens may be disposed between the laser light source and the object to focus the processing laser beam inside the object and to receive the light beam coming from the inside of the object and to enter the wavelength filter. A laser beam emitted from the laser light source is transmitted through the laser light source and the focusing lens to be incident on the focusing lens side and reflected from an object to be processed through the focusing lens to be incident on the wavelength filter side A beam splitter may be disposed. An image focusing lens may be disposed between the wavelength filter and the camera to focus the illumination beam of the specific wavelength range passed through the wavelength filter onto the camera.

A light source is disposed between the laser light source and the object to be processed, and a focusing lens for focusing the processing laser beam inside the object is disposed between the laser light source and the object. And a first image focusing lens for receiving the light beam and making the light incident on the wavelength filter can be disposed. A second image focusing lens may be disposed between the wavelength filter and the camera to focus the illumination beam of the specific wavelength range passing through the wavelength filter onto the camera.

Whether or not the object to be processed has been processed or the processing condition can be determined according to the image of the object to be processed obtained by the camera.

In another aspect,

Irradiating an illumination beam inside the object to be processed by the illumination unit;

Selectively transmitting only an illumination beam of a specific wavelength range through an illumination beam emitted from the inside of the object using a wavelength filter;

Capturing an image of the inside of the object by the camera; And

And determining a machining condition and a machining condition from the image of the inside of the object obtained from the camera.

A focusing lens is provided on the object to focus a processing laser beam inside the object. An illumination beam emitted from the inside of the object can be received by the focusing lens and incident on the wavelength filter. A beam splitter for reflecting the light beam received by the focusing lens toward the wavelength filter may be disposed between the focusing lens and the wavelength filter. An illumination beam of a specific wavelength range transmitted through the wavelength filter may be converged by an image focusing lens and incident on the camera.

The illumination beam coming from the inside of the object to be processed can be received by the first image focusing lens and incident on the wavelength filter side and the illumination beam in the specific wavelength range passing through the wavelength filter is focused by the second image focusing lens And may be incident on the camera side.

In the laser processing apparatus according to the embodiments, the camera obtains an image of the inside of the object by using the illumination beam in a specific wavelength range by the wavelength filter, so that the laser processing operation is performed before the laser processing operation inside the object in advance It is possible to determine whether or not it is possible.

FIG. 1 shows a state in which a laser beam is focused into a processing object to form a modified region, thereby laser processing the processing object.
Fig. 2 shows a laser machining apparatus according to an exemplary embodiment.
3 shows a laser machining apparatus according to another exemplary embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. The embodiments illustrated below are not intended to limit the scope of the invention, but rather are provided to illustrate the invention to those skilled in the art. In the drawings, like reference numerals refer to like elements, and the size and thickness of each element may be exaggerated for clarity of explanation.

A laser processing apparatus according to embodiments of the present invention performs a laser processing operation on an object to be processed by forming a modified region by focusing a laser beam inside the object. FIG. 1 shows a state in which the laser beam 30 is focussed inside the object to be processed 10 to form a modified region, thereby forming the crack line 40. Referring to FIG. 1, a laser beam 30 of a first-stage or second-stage pulse emitted from a laser light source (not shown) is focused on the interior of the object to be processed 10 using a focusing lens 20 to form a light- A modified region is formed around the light-converging point, and a crack is generated from the modified region. Then, when the laser beam 30 is moved along a line to be machined of the object 10, a crack line 40 is formed in the object 10. Thereafter, when the cracks are expanded to the surface of the object 10 by natural or external force by the dicing process, the object 10 can be cut along the line to be cut by braking. On the other hand, when the object to be processed 10 has a large thickness, a plurality of cracked columns 40 may be formed in the thickness direction of the object 10.

In order to perform a laser processing operation inside the object to be processed, the object to be processed may be made of a material which is transparent to the laser beam. As the object to be processed, various substrates such as a silicon substrate, a sapphire substrate, or a glass substrate may be used. Also, even if the same silicon substrate is used, it may be doped with impurities, Silicon substrates having different properties may be used as objects to be processed. In this way, when the characteristics of the objects to be processed are varied, it is necessary to perform the machining operation with the laser processing operation being impossible or the laser processing conditions being different depending on the characteristics of the object.

However, in the conventional art, the characteristics of the object to be used are grasped, and it is determined whether or not the object to be processed is capable of focusing and processing the laser beam, or whether or not other laser processing conditions are required, The laser machining operation was performed. As a result, defects may occur in the object to be processed, and the subsequent process can not proceed due to such defects. In order to solve such a problem, the present invention can grasp whether or not the object to be processed is capable of laser processing in a specific processing condition through a camera before laser processing.

Fig. 2 shows a laser machining apparatus 100 according to an exemplary embodiment.

2, the laser machining apparatus 100 includes a laser light source 110 that emits a machining laser beam S1 and irradiates the machining target W with an illumination beam S2 A camera 170 for picking up an image of the inside of the object W and an illumination unit 150 disposed between the object W and the camera 170 to illuminate the object And a wavelength filter 160 selectively transmitting only the illumination beam S1 in the wavelength range. The object W to be processed using the laser machining apparatus 100 according to the present embodiment may include a material that is transparent to the machining laser beam S1 and the illumination beam S2. For example, the object W may be a silicon substrate, a sapphire substrate, a glass substrate, or the like, but is not limited thereto.

The laser light source 110 oscillates a machining laser beam S1 for forming a modified region inside the object W. The machining laser beam S1 emitted from the laser beam source 110 passes through a predetermined optical system (not shown) and then is focused on the object W by the focusing lens 130. Here, the position where the machining laser beam S1 is focused can be adjusted by the vertical movement of the focusing lens 130. As described above, when the machining laser beam S1 is focused on the object W to form a light-converging point, a modified region is formed around the light-converging point. A crack is generated from the modified region. When the processed laser beam S1 is moved, cracks are formed in the object W.

The focusing lens 130 also concentrates the machining laser beam S1 inside the object W and also serves to receive the illumination beam S1 emitted from the inside of the object W as described later. A beam splitter 120 may be provided between the laser light source 110 and the focusing lens 130. The beam splitter 120 transmits the machining laser beam S1 emitted from the laser beam source 110 and enters the focusing lens 130 side. The beam splitter 120 reflects the illumination beam S2 transmitted through the focusing lens 130 from the object W to the camera 170 as described later.

 The illumination unit 150 irradiates the object W with the illumination beam S2. As described above, since the object W includes a substance which is transparent to the illumination beam S2, the illumination beam S2 can be irradiated to the interior of the object W to be processed. As the illumination beam S2, for example, infrared rays having a wavelength range of approximately 400 nm to 1800 nm may be used, but the present invention is not limited thereto, and an illumination beam S2 having various wavelength ranges may be used. The illumination unit 150 may be installed around the focusing lens 130 provided on the object W. [ However, the present invention is not limited thereto, and the illumination unit 150 may be installed at various positions. The camera 170 picks up an image of the interior of the object W using the illumination beam S2 emitted from the inside of the object W. [ More specifically, the illumination beam S2 emitted from a predetermined position in the object W is received by the focusing lens 130, and the received illumination beam S2 is reflected by the beam splitter 120, (170).

A wavelength filter 160 and an image focusing lens 180 may be disposed between the beam splitter 120 and the camera 170. Here, the wavelength filter 160 selectively transmits only the illumination beam S2 'of a specific wavelength range out of the illumination beams S2 reflected by the beam splitter 120. The illumination beam S2 'in the specific wavelength range transmitted through the wavelength filter 160 is condensed by the image condensing lens 180 and is incident on the camera 170. [ Accordingly, the camera 170 can capture an image at a predetermined position inside the object W. [ Here, the position inside the object W obtained by the camera 170 can be adjusted by moving the focusing lens 130 up and down.

A method of determining whether or not a laser processing operation on a workpiece W is possible under a specific processing condition before a laser processing operation using the laser processing apparatus 100 having the above-described structure is as follows. First, the object W is irradiated with the illumination beam S2 from the illumination unit 150. [ Then, the illumination beam S2 emitted from the inside of the object W is received by the focusing lens 130, reflected by the beam splitter 120, and incident on the wavelength filter 160 side. The wavelength filter 160 selectively transmits only the illumination beam S2 'within a specific wavelength range of the illumination beam S2 and then is focused on the camera 170 through the image focusing lens 180. [ For example, the wavelength filter 160 may selectively transmit only an infrared illumination beam having a wavelength range of approximately 1500 nm or more among infrared illumination beams in a wavelength range of approximately 400 nm to 1800 nm. However, the present invention is not limited thereto. Accordingly, an image at a predetermined position inside the object W can be picked up in the camera 170. [ Here, it is possible to grasp whether or not the laser processing operation for the inside of the object W can be performed under the specific processing conditions through the image of the object W obtained by the camera 70. FIG.

In this embodiment, whether or not the object W can perform the laser processing operation in accordance with the set processing condition is determined from the image of the object W obtained from the camera 170 in the inside of the object W, It can be grasped in advance before the machining operation is carried out. For example, a silicon substrate which is not doped under a specific processing condition can be subjected to a laser processing operation. However, in the case of a silicon substrate doped with an impurity, the laser processing operation can not be performed under the above- shall. In this case, if an image of the inside of the object W is obtained by the camera 170 using the illumination beam S2 having a specific wavelength range transmitted through the wavelength filter 160, It is possible to know in advance whether or not the laser machining operation is possible.

For example, the illumination unit 150 irradiates an object to be processed with an infrared ray in a wavelength range of approximately 400 nm to 1800 nm, and a wavelength range of approximately 1500 nm or more of the illumination beam S2 emitted from the object W by the wavelength filter 160 Only the infrared wavelength beam S2 'having the infrared wavelength beam S2' selectively focused on the camera 170 and picking up an image of the inside of the object W allows laser processing to be performed inside the object W under specific processing conditions Can be determined. In this case, when the object W is a silicon substrate which is not doped with impurities, a clear image of the object W is captured in the camera 170, and the object W is doped with impurities In the case of a silicon substrate, a blurred image of the object W is photographed on the camera 170. Accordingly, it is possible to determine whether or not the laser processing operation is possible under specific processing conditions through the image in the object W to be imaged by the camera 170. [

When the image inside the object W obtained by the camera 170 is clear, it means that the laser processing can be performed under specific processing conditions. Therefore, the laser beam can be irradiated to the inside of the object W from the laser light source 110 to perform the laser machining operation. On the other hand, when the image inside the object W obtained by the camera 170 is blurred, it is impossible to perform the laser processing operation under the specific processing condition. Therefore, the laser processing operation is not performed or the laser processing operation is performed by changing the processing condition shall. Thus, in the laser machining apparatus 100 according to the present embodiment, the camera 170 obtains an image of the inside of the object W using the illumination beam S2 'in a specific wavelength range by the wavelength filter 160 It is possible to grasp whether or not a laser machining operation can be performed in advance under a specific machining condition before the laser machining operation for the inside of the object W. [

Fig. 3 shows a laser machining apparatus 200 according to another exemplary embodiment. Hereinafter, differences from the above-described embodiment will be mainly described.

3, the laser processing apparatus 200 includes a laser light source 210 that emits a machining laser beam S1 and irradiates the machining target W with an illumination beam S2 A camera 270 for picking up an image of the object W and a camera 270 disposed between the object W and the camera 270 to detect a specific wavelength of the illumination beam S2 And a wavelength filter 260 selectively transmitting only the illumination beam S2 'in the range. The object W may include a material that is transmissive to the machining laser beam S1 and the illumination beam S2.

The laser light source 210 oscillates a machining laser beam S1 for forming a modified region inside the object W. The machining laser beam S1 emitted from the laser beam source 210 passes through a predetermined optical system (not shown) and then is focused inside the object W by the focusing lens 230 for machining. Here, the position where the machining laser beam S1 is focused can be adjusted by the upward and downward movement of the focusing lens 230 for machining. As described above, when the machining laser beam S1 is focused on the object W to form a light-converging point, a modified region is formed around the light-converging point. A crack is generated from the modified region. When the processed laser beam S1 is moved, cracks are formed in the object W.

 The illumination unit 250 irradiates the object W with the illumination beam S2. The illumination unit 250 may be installed around the first image focusing lens 235 provided on the object W. [ However, the present invention is not limited thereto, and the illumination unit 250 may be installed at various positions. The first image focusing lens 235 receives the illumination beam S2 emitted from the inside of the object W and advances it toward the camera 270.

The camera 270 picks up an image of the inside of the object W using the illumination beam S2 emitted from the inside of the object W. [ A wavelength filter 260 and a second image focusing lens 280 may be disposed between the first image focusing lens 235 and the camera 270. Here, the wavelength filter 260 selectively transmits only the illumination beam S2 'of a specific wavelength range from the illumination beam S2 emitted from the object W. The illumination beam S2 'in the specific wavelength range transmitted through the wavelength filter 260 is focused by the second image focusing lens 280 and is incident on the camera 270. Accordingly, the camera 270 can capture an image at a predetermined position inside the object W. Here, the position inside the object W obtained by the camera 270 can be adjusted by moving the first image focusing lens 235 up and down.

A method of determining whether or not the object W can perform a laser machining operation under specific processing conditions before the laser machining operation using the laser machining apparatus 200 having the above-described structure is similar to the above-described method. First, the object W is irradiated with the illumination beam S2 from the illumination unit 250. [ Then, the illumination beam S2 emitted from the inside of the object W is received by the first image focusing lens 235 and then incident on the wavelength filter 260 side. The wavelength filter 260 selectively transmits only the illumination beam S1 in a specific wavelength range of the illumination beam S2 and then is focused on the camera through the second image focusing lens 280. [ Accordingly, an image at a predetermined position inside the object W can be picked up in the camera 270. [ Here, it is possible to grasp whether or not the laser processing work for the inside of the object W can be performed under a specific processing condition through the image of the object W obtained by the camera 270. [ Since this has been described above, a detailed description thereof will be omitted.

As described above, in the present embodiment, whether or not the object W can perform a laser machining operation according to a specific machining condition can be determined from the image of the object W obtained from the camera 170, It can be grasped in advance before performing laser machining work inside. That is, when the image of the object W obtained by the camera 170 is clear, it means that the laser processing can be performed under specific processing conditions. Therefore, the laser beam source S1 can be irradiated from the laser light source 210 to the inside of the object W to perform the laser machining operation. On the other hand, when the image inside the object W obtained by the camera 270 is blurred, it is impossible to perform the laser machining operation under the specific machining condition. Therefore, the laser machining operation is not performed or the laser machining operation is performed shall. As described above, in the laser processing apparatus 200 according to the present embodiment, the camera 270 obtains an image of the inside of the object W using the illumination beam S2 'in a specific wavelength range by the wavelength filter 260 It is possible to grasp whether or not a laser machining operation can be performed in advance under a specific machining condition before the laser machining operation for the inside of the object W. [

While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.

100, 200 ... laser processing apparatus 110, 210 ... laser light source
120 ... beam separator 130 ... focusing lens
150, 250 ... illumination unit 160, 260 ... wavelength filter
170,270 ... camera 180 ... image focusing lens
230 ... working focusing lens 235 ... first image focusing lens
280 ... 2nd image focusing lens S1 ... machining laser beam
S2, S2 '... Illumination beam W ... Object to be processed

Claims (14)

A laser light source that emits a machining laser beam that is condensed in the object to be processed to form a modified region;
An illumination unit for irradiating an illumination beam onto the object to be processed;
A camera for receiving an illumination beam emitted from the object to pick up an image of the object; And
And a wavelength filter arranged between the object to be processed and the camera for selectively transmitting only an illumination beam in a specific wavelength range of the illumination beams emitted from the object to be incident on the camera. The method according to claim 1,
Wherein the object to be processed comprises a material that is transmissive to the processing laser beam and the illumination beam. The method according to claim 1,
And a focusing lens disposed between the laser light source and the object to focus the laser beam on the object and to receive the light beam coming from the inside of the object and to enter the wavelength filter side, Laser processing apparatus. The method of claim 3,
And a condensing lens which is disposed between the laser light source and the condensing lens and transmits a machining laser beam emitted from the laser beam source and enters the condensing lens side to reflect an illumination beam passing through the condensing lens, And a beam separator for causing the laser beam to enter the filter. 5. The method of claim 4,
And an image focusing lens disposed between the wavelength filter and the camera for focusing an illumination beam in a specific wavelength range passed through the wavelength filter to the camera. The method according to claim 1,
A focusing lens disposed between the laser light source and the object to be processed for focusing the object to be processed in the object; And
And a first image focusing lens arranged between the object to be processed and the wavelength filter to receive the illumination beam coming from the inside of the object and to enter the wavelength filter side. The method according to claim 6,
And a second image focusing lens disposed between the wavelength filter and the camera for focusing an illumination beam in a specific wavelength range passed through the wavelength filter to the camera. The method according to claim 1,
Wherein whether the object to be processed is processed or the processing condition is determined according to an image of the object to be processed obtained by the camera. Irradiating an illumination beam inside the object to be processed by the illumination unit;
Selectively transmitting only an illumination beam of a specific wavelength range through an illumination beam emitted from the inside of the object using a wavelength filter;
Capturing an image of the inside of the object by the camera; And
And determining a machining condition and a machining condition from the image of the inside of the object obtained from the camera. 10. The method of claim 9,
Wherein a converging lens for converging a machining laser beam inside the object is provided on the object to be processed and an illumination beam emitted from the inside of the object is received by the converging lens and incident on the wavelength filter. 11. The method of claim 10,
And a beam splitter is disposed between the focusing lens and the wavelength filter to reflect the beam of light received by the focusing lens toward the wavelength filter. 11. The method of claim 10,
Wherein an illumination beam of a specific wavelength range transmitted through said wavelength filter is focused by an image focusing lens and is incident on said camera. 10. The method of claim 9,
Wherein the illumination beam emitted from the inside of the object to be processed is received by the first image focusing lens and incident on the wavelength filter side. 14. The method of claim 13,
And an illumination beam of a specific wavelength range transmitted through the wavelength filter is focused by the second image focusing lens and is incident on the camera.
KR20130060601A 2013-05-28 2013-05-28 Laser processing apparatus and laser processing method KR20140140206A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017039171A1 (en) * 2015-09-03 2017-03-09 (주)이오테크닉스 Laser processing device and laser processing method
KR101716369B1 (en) * 2015-10-19 2017-03-27 주식회사 이오테크닉스 Auto inspection apparatus and method of laser processing apparatus
KR20190123825A (en) * 2018-04-24 2019-11-04 (주)엔피에스 Laser nozzle assemebly and laser apparatus having the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017039171A1 (en) * 2015-09-03 2017-03-09 (주)이오테크닉스 Laser processing device and laser processing method
CN108025393A (en) * 2015-09-03 2018-05-11 Eo科技股份有限公司 Laser processing device and laser processing
US10286485B2 (en) 2015-09-03 2019-05-14 Eo Technics Co., Ltd. Laser processing device and laser processing method
KR101716369B1 (en) * 2015-10-19 2017-03-27 주식회사 이오테크닉스 Auto inspection apparatus and method of laser processing apparatus
WO2017069388A1 (en) * 2015-10-19 2017-04-27 (주)이오테크닉스 Automatic inspection device and method of laser processing equipment
CN108140589A (en) * 2015-10-19 2018-06-08 Eo科技股份有限公司 Laser machine the automatic checking device and method of equipment
US10770298B2 (en) 2015-10-19 2020-09-08 Eo Technics Co., Ltd. Automatic inspection device and method of laser processing equipment
CN108140589B (en) * 2015-10-19 2022-04-29 Eo科技股份有限公司 Automatic inspection device and method for laser processing equipment
KR20190123825A (en) * 2018-04-24 2019-11-04 (주)엔피에스 Laser nozzle assemebly and laser apparatus having the same

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