CN111654202A - Bridge arm module, power conversion circuit and power conversion system - Google Patents

Abstract

The present application relates to the technical field of power electronics, and in particular, to a bridge arm module, a power conversion circuit and a power conversion system. The topology structure of the bridge arm module includes a plurality of power devices; and each power device is packaged in at least two encapsulation modules respectively; compared with the prior art, the topology structure of the bridge arm module no longer has to be arranged according to the circuit structure or The power is divided equally in parallel, so the bridge arm module provided by the present application can maximize the use of the power of the packaged module when encapsulating multiple power devices, and there is no problem of margin design, thus solving the problem of multiple power devices in the prior art. The problem of margin design is difficult when the packaged modules are connected in parallel. In addition, since each packaged module adopts at least two different packaging methods, the difficulty of designing the wiring is reduced and the parasitic parameter between each packaged module is reduced.

Description

Bridge arm module, power conversion circuit and power conversion system

technical field

The invention relates to the technical field of power electronics, in particular to a bridge arm module, a power conversion circuit and a power conversion system.

Background technique

At present, in consideration of the cost and volume of the inverter unit, when designing the inverter unit, a packaged power module, that is, a packaged module, is usually used to construct the inverter unit.

When the constructed inverter unit is a larger power inverter unit, due to the packaging limitations of the packaged modules in the prior art, the inverter unit needs to be composed of multiple packaged modules in parallel, that is, the larger power of the inverter unit is composed of Shared by multiple encapsulation modules.

However, in the design of the inverter unit, it is difficult to achieve a complete equal division of the circuit or power, which makes the design of the parallel packaged modules or the margin too large, causing waste, or the design of the margin is not enough; The packaging method of each packaged module is the same, so it is more difficult to design the wiring and the stray inductance of each packaged module is large.

SUMMARY OF THE INVENTION

In view of this, the present invention provides a bridge arm module, a power conversion circuit and a power conversion system, so as to solve the difficulty in designing the margin, the difficulty in designing the wiring and the stray noise when multiple packaging modules are connected in parallel in the prior art. Larger inductance problem.

To achieve the above purpose, the embodiments of the present invention provide the following technical solutions:

A first aspect of the present application provides a bridge arm module, the topology of which includes a plurality of power devices;

Each power device is packaged in at least two package modules respectively;

Each packaging module adopts at least two different packaging methods.

Optionally, the topology structure of the bridge arm module includes: a single bridge arm;

The single bridge arm includes a plurality of power devices, which are respectively packaged in at least two packaging modules with different packaging methods.

Optionally, the topology structure of the bridge arm module includes: a first bridge arm and a second bridge arm connected in parallel;

The first bridge arm includes a single power device, and the second bridge arm includes a plurality of power devices;

The first bridge arm and the second bridge arm are respectively packaged in at least two packaging modules with different packaging methods.

Optionally, the topology structure of the bridge arm module is any one of a full-bridge topology, a half-bridge topology, a three-phase four-bridge-arm inverter topology, a boost topology, a buck topology, and a buck-boost topology.

Optionally, the different packaging methods include: different packaging materials, and/or different packaging structures.

Optionally, the packaging materials include: packaging materials with auxiliary heat dissipation parts, and packaging materials without auxiliary heat dissipation parts.

Optionally, the auxiliary heat dissipation part is: a copper substrate or an aluminum substrate.

Optionally, each of the encapsulation modules includes: at least one first encapsulation module and at least one second encapsulation module; wherein:

The heat generation amount of the first packaging module is greater than the heat dissipation amount of the second packaging module.

Optionally, the packaging material of the first packaging module is a packaging material with an auxiliary heat dissipation part; the packaging material of the second packaging module is a packaging material without an auxiliary heat dissipation part.

Optionally, the power device packaged in the first packaging module is a power device with high-frequency commutation, and the power device packaged in the second packaging module is a power device without high-frequency commutation.

Optionally, the power device packaged in the first packaging module is a high frequency power device, and the power device packaged in the second packaging module is a power frequency power device.

Optionally, the power device packaged in the first packaging module is a power device through which active current flows, and the power device packaged in the second packaging module is a power device through which reactive current flows.

Optionally, if the topology of the bridge arm module is an ANPC three-level topology, the power device packaged in the first package module includes: four switch tubes connected to the DC side and their anti-parallel connections. diode;

The power device packaged in the second package module includes: two switch tubes and their anti-parallel diodes that are connected to the AC side.

Optionally, the anti-parallel diode is: the body diode of the corresponding switch; or,

The anti-parallel diode is: an external diode connected in anti-parallel with the corresponding switch tube; and the switch tube is: a switch tube with a body diode, or a switch tube without a body diode.

Optionally, if the topology of the bridge arm module is an NPC three-level topology, the power device packaged in the first package module includes: two switch tubes connected to the positive and negative poles of the DC side and their reverse Parallel diodes, and, two diodes connected to the midpoint of the DC side;

The power device packaged in the second package module includes: two switch tubes and their anti-parallel diodes that are connected to the AC side.

Optionally, the anti-parallel diode is: the body diode of the corresponding switch; or,

The anti-parallel diode is: an external diode connected in anti-parallel with the corresponding switch tube; and the switch tube is: a switch tube with a body diode, or a switch tube without a body diode.

Optionally, if the topology of the bridge arm module is an ANPC three-level topology, the power device packaged in the first package module includes: two switch tubes connected to the positive and negative electrodes of the DC side, and connected to the AC side. The two switch tubes connected to the side, and the anti-parallel diodes of the two switch tubes connected to the midpoint of the DC side;

The power device packaged in the second package module includes: anti-parallel diodes of two switch tubes connected to the positive and negative poles of the DC side, anti-parallel diodes of the two switch tubes connected to the AC side, and an anti-parallel diode of the two switch tubes connected to the DC side. The two switches connected to each other.

Optionally, the anti-parallel diode is: an external diode in anti-parallel with the corresponding switch;

The switch tube is a switch tube with a body diode, or a switch tube without a body diode.

A second aspect of the present application also provides a power conversion circuit, comprising: a first bridge arm module and a second bridge arm module connected in series; wherein:

The calorific value of the first bridge arm module is greater than the calorific value of the second bridge arm module;

The packaging methods of the first bridge arm module and the second bridge arm module are different.

Optionally, the different packaging methods include: different packaging materials, and/or different packaging structures.

Optionally, the packaging material of the first bridge arm module is a packaging material with an auxiliary heat dissipation part; the packaging material of the second bridge arm module is a packaging material without an auxiliary heat dissipation part.

Optionally, both the first bridge arm module and the second bridge arm module include a single power device.

Optionally, at least one of the first bridge arm module and the second bridge arm module is the bridge arm module according to any one of the first aspect of the present application.

A third aspect of the present application further provides a power conversion system, comprising: the bridge arm module according to any one of the first aspect of the present application, or the power conversion circuit according to any one of the second aspect of the present application.

It can be known from the above technical solutions that the present invention provides a bridge arm module. The topology structure of the bridge arm module includes a plurality of power devices; and each power device is packaged in at least two encapsulation modules respectively; compared with the prior art, the topology structure of the bridge arm module no longer has to be arranged according to the circuit structure or The power is divided equally in parallel, so the bridge arm module provided by the present application can maximize the utilization of the power of the packaged module when packaging multiple power devices, and there is no problem of margin design, thus solving the problem of multiple power devices in the prior art. The problem of margin design is difficult when the packaged modules are connected in parallel. In addition, since each packaged module adopts at least two different packaging methods, the difficulty of designing wiring is reduced and the parasitic parameters between each packaged module are reduced.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

FIG. 1a and FIG. 1b are two package schematic diagrams of each bridge arm in the bridge arm module provided by the embodiment of the application;

2a and 2b are schematic diagrams of a packaging method with a copper substrate;

2c and 2d are schematic diagrams of a packaging method without a copper substrate;

3 is a schematic structural diagram of an ANPC three-level circuit provided by an embodiment of the present application;

4a-4d are schematic diagrams of four operating modes of the ANPC three-level circuit when the output voltage of the AC output side of the ANPC three-level circuit is in a positive half cycle according to an embodiment of the present application;

FIGS. 5 a to 6 are schematic diagrams of three packaging solutions for multiple power devices in each bridge arm of the bridge arm module according to the embodiments of the present application.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In this application, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a list of elements includes not only those elements, but also no Other elements expressly listed, or which are also inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

In order to solve the problems in the prior art that the margin design is difficult, the wiring design is difficult, and its own stray inductance is relatively large when multiple package modules are connected in parallel, the embodiment of the present application provides a bridge arm module, the bridge arm module is The topology is not limited, such as any one of full-bridge topology, half-bridge topology, three-phase four-bridge inverter topology, boost topology, buck topology and buck-boost topology.

The topology of the bridge arm module includes multiple power devices. As shown in FIG. 1a, in the bridge arm module 10, each power device is packaged in at least two packaging modules 20, and each packaging module 20 adopts at least two different packaging methods.

In practical applications, the bridge arm module 10 may include only a single bridge arm, and the single bridge arm includes a plurality of power devices, which are respectively packaged in at least two packaging modules with different packaging methods. It can also be that the bridge arm module 10 includes a first bridge arm and a second bridge arm connected in parallel; the first bridge arm includes a single power device, such as a bypass device, etc.; the second bridge arm includes a plurality of power A device, such as a boost topology, a buck topology, or a buck-boost topology, etc.; the first bridge arm and the second bridge arm are respectively packaged in at least two packaging modules with different packaging methods.

In addition, each package module 20 adopts at least two different packaging methods. Specifically, the packaging materials of each package module 20 are different. For example, some package modules 20 use packaging materials with auxiliary heat dissipation parts, while some package modules 20 use A package material without an auxiliary heat dissipation part; the auxiliary heat dissipation part can be a copper substrate or an aluminum substrate, which is not limited here, and is not limited to this. Each packaging module 20 adopts at least two different packaging methods, which may also be: the packaging materials of each packaging module 20 are the same, but the packaging structure of each packaging module 20 is different; it may also be that the packaging materials and packaging structures of each packaging module 20 are different. ; depending on its specific application environment, it is all within the protection scope of this application.

For example, if multiple power devices included in the bridge arm module 10 are packaged in two package modules 20 in practical applications, the two package modules 20 may be packaged with copper substrates as shown in FIG. 2a and FIG. 2b respectively. method, or, as shown in Figure 2c or Figure 2d, a packaging method without a copper substrate.

However, in consideration of the rational use of the two packaging methods, as shown in FIG. 1b, the packaging module with the larger heat generation, that is, the first packaging module 21, is usually packaged in a packaging method with a copper substrate to enhance the Its heat dissipation capability enables it to quickly dissipate heat to ensure its normal operation; and generally, the packaged module with less heat generation, that is, the second packaged module 22, is packaged in a packaging method without a copper substrate, so as to ensure its normal operation. Under the premise of operation, in order to reduce its packaging cost, the volume of the packaging is also reduced accordingly.

In practical applications, in the bridge arm module 10, the power devices can be divided into two categories, one is a power device with high-frequency commutation, the other is a power device without high-frequency commutation, and there is a high-frequency commutation. The calorific value of the power device is larger than that of the power device without high-frequency commutation. Therefore, the power device packaged in the first packaging module 21 is a power device with high-frequency commutation, such as a high-frequency power device; The power device packaged in the packaging module 22 is a power device without high frequency commutation, such as a power frequency power device.

The above is only a packaging solution for multiple power devices in the bridge arm module 10, and in the packaging process of the bridge arm module 10, another packaging solution for multiple power devices can actually be used, specifically:

In the bridge arm module 10, the power devices are also divided into two categories, but one is the power device through which the active current flows, the other is the power device through which the reactive current flows, and the power device through which the active current flows. The heat is larger than that of the power device through which the reactive current flows. Therefore, the power device packaged in the first packaging module 21 is a power device through which active current flows, and the power device packaged in the second packaging module 22 is a reactive current. flow through the power device.

The above two packaging solutions for multiple power devices are only the preferred solutions in the packaging solutions for multiple power devices, because they are divided according to device functions, so that circuit power devices that work for a long time and generate large amounts of heat are placed on a copper substrate. In the module, it can give full play to the advantages of heat dissipation. In practical applications, the packaging schemes of multiple power devices include but are not limited to the above two packaging schemes, which are not specifically limited here, and can be selected according to specific conditions, as long as the longitudinal cutting of all power devices in the topology of the bridge arm module 10 is performed. The solutions of encapsulating all the power devices in the topology of the bridge arm module 10 into a plurality of encapsulation modules respectively, and then connecting the encapsulation modules according to the topology structure, so that each encapsulation module meets the requirements of the encapsulation scale limit, are all described in this application. within the scope of protection.

As can be seen from the above solution, since each power device of the bridge arm module 10 provided by the present application is packaged in at least two package modules 20 respectively, that is, the package modules that are cut longitudinally are connected according to the topological structure, instead of the parallel method in the prior art. The scheme of paralleling the split encapsulation modules makes the topology structure of the bridge arm module 10 no longer need to be equally divided according to the circuit structure or power. Therefore, when encapsulating multiple power devices in the bridge arm module 10 in the present application, The power of the packaged modules 20 can be maximized, and there is no problem of margin design, thereby solving the problem of difficulty in margin design in the prior art when multiple packaged modules 20 are connected in parallel. In addition, when the present application encapsulates multiple power devices in each bridge arm module 10, each encapsulation module 20 of the bridge arm module 10 may be composed of different types of power devices, and its power can be maximized and the size can be minimized. Excellent, no waste.

In addition, since each packaged module in each bridge arm adopts at least two different packaging methods, the difficulty of designing wiring is reduced and the parasitic parameter between each packaged module is reduced. In addition, the different packaging methods are more conducive to the distinction of multiple packaged modules 20 , thereby making the layout of the busbars more convenient and not limited by the same pin positions of the same package.

The above embodiments describe in detail the packaging scheme of multiple power devices included in the topology structure of the bridge arm module 10 .

Among them, the ANPC three-level circuit is a relatively mature conversion circuit in the prior art, and its structure is usually shown in FIG. 3, which specifically includes: a first switch tube Q1, a first anti-parallel diode D1, and a second switch tube Q2 , the second anti-parallel diode D2, the third switch tube Q3, the third anti-parallel diode D3, the fourth switch tube Q4, the fourth anti-parallel diode D4, the fifth switch tube Q5, the fifth anti-parallel diode D5, the sixth switch tube Q6 and the sixth anti-parallel diode D6.

In the ANPC three-level circuit, the input terminal of the first switch tube Q1 is used as the positive pole P+ of the DC side of the ANPC three-level circuit, and the output terminal of the first switch tube Q1 is connected to the input terminal of the second switch tube Q2. The output end of the tube Q2 is connected with the input end of the third switch tube Q3, the output end of the third switch tube Q3 is connected with the input end of the fourth switch tube Q4, and the output end of the fourth switch tube Q4 is used as the output end of the ANPC three-level circuit. The negative pole of the DC side is N-; the input end of the fifth switch tube Q5 is connected to the output end of the first switch tube Q1, the output end of the fifth switch tube Q5 is connected to the input end of the sixth switch tube Q6, and the output end of the sixth switch tube Q6 is connected The output end is connected to the input end of the fourth switch tube Q4, the connection point between the output end of the second switch tube Q2 and the input end of the third switch tube Q3 is used as the DC side midpoint Ne of the ANPC three-level circuit, and the fifth switch tube The connection point between the output end of Q5 and the input end of the sixth switch tube Q6 serves as the AC side AC of the ANPC three-level circuit.

The first anti-parallel diode D1 is connected in anti-parallel to both ends of the first switch tube Q1, the second anti-parallel diode D2 is connected in anti-parallel to both ends of the second switch tube Q2, and the third anti-parallel diode D3 is connected in anti-parallel to the third Both ends of the switch tube Q3, the fourth anti-parallel diode D4 is connected in anti-parallel to both ends of the fourth switch tube Q4.

It should be noted that when each switch tube in FIG. 3 is a switch tube with a body diode, each reverse diode is the body diode of each switch tube; when each anti-parallel diode in FIG. 3 is an external diode, each switch tube is It can be a switch tube with a body diode (the body diode is not shown in the figure), or it can be a switch tube without a body diode, which is not specifically limited here. Inside.

When the ANPC three-level circuit works when the voltage output by its AC output side is in a positive half cycle, according to the control method of the ANPC three-level circuit, it can be known that if the voltage output by the AC side of the ANPC three-level circuit is a positive voltage and a positive current As shown in Figure 4a, the first switch Q1 and the fifth switch Q5 are turned on, the current flows in from P+, and then flows through the first switch Q1 and the fifth switch Q5, and then flows out from AC.

If the voltage output by the AC side of the ANPC three-level circuit is a positive voltage and the current is zero current, as shown in Figure 4b, the second anti-parallel diode D2 and the fifth switch Q5 are turned on, and the current direction is from Ne to flow, and then After flowing through the second anti-parallel diode D2 and the fifth switch tube Q5, it flows out from AC.

If the voltage output by the AC side of the ANPC three-level circuit is zero voltage and the current is negative current, as shown in Figure 4c, the fifth anti-parallel diode D5 and the first anti-parallel diode D1 are turned on, and the current direction is from the AC inflow, It flows through the fifth anti-parallel diode D5 and the first anti-parallel diode D1 and then flows out from P+.

If the voltage output by the AC side of the ANPC three-level circuit is a positive voltage and the current is a negative current, as shown in Figure 4d, the fifth anti-parallel diode D5 and the second switch tube Q2 are turned on, and the current flows in from the AC, and then After flowing through the fifth anti-parallel diode D5 and the second switch tube Q2, it flows out from Ne.

When the ANPC three-level circuit works when the voltage output by the AC output side is in a negative half cycle, the process is similar to the above process, and the above description can be referred to, and details are not repeated here.

For the first packaging scheme of the multiple power devices in the bridge arm module 10 in the above embodiment, according to the above description, when the output voltage of the AC output side is in the positive half cycle, as shown in FIG. 5a, there is a high The power devices with high frequency commutation are the first switch tube Q1 and the first anti-parallel diode D1 and the second switch tube Q2 and the second anti-parallel diode D2, and the power devices without high frequency commutation are the fifth switch tube Q5 and the fifth Anti-parallel diode D5; when the output voltage on the AC side is in the negative half cycle, as shown in Figure 5a, the power devices with high-frequency commutation are the third switch Q3, the third anti-parallel diode D3 and the fourth switch Q4 and the fourth anti-parallel diode D4, the power device without high-frequency commutation is the sixth switch tube Q6 and the sixth anti-parallel diode D6.

It should be noted that, since the first switch tube Q1 in FIG. 5a cannot accurately refer to the switch tube at the corresponding position in the ANPC three-level circuit in practical application, the first switch tube Q1 in FIG. The diode D1, the second switch tube Q2 and the second anti-parallel diode D2, the third switch tube Q3 and the third anti-parallel diode D3, and the fourth switch tube Q4 and the fourth anti-parallel diode D4 are described as: there is a connection relationship with the DC side The fourth switch tube and its parallel diodes; and the fifth switch tube Q5 and the fifth anti-parallel diode D5 and the sixth switch tube Q6 and the sixth anti-parallel diode D6 are described as: two switches that are connected to the AC side tube and its anti-parallel diode.

To sum up, as shown in the two dashed boxes in FIG. 5a, the power device packaged in the first package module 21 with larger heat generation includes: four switch tubes and their anti-parallel diodes that are connected to the DC side ; The power device packaged in the second package module 22 with less heat generation includes: two switch tubes and their anti-parallel diodes that are connected to the AC side.

Similarly, if the topology of each bridge arm is the NPC three-level topology shown in FIG. 5b, the power devices packaged in the first package module 21 with a large heat generation include: Two switch tubes (Q1 and Q4) and their anti-parallel diodes, and two diodes (D2 and D3) connected to the midpoint of the DC side; the power devices packaged in the second package module 22 with less heat generation include: There are two switch tubes (Q2 and Q3) connected with the AC side and their anti-parallel diodes.

It should be noted that, for the first packaging scheme of multiple power devices in the bridge arm module 10 in the above embodiment, taking the ANPC three-level topology shown in FIG. 5a as an example, if each anti-parallel diode in the is the body diode of each switch tube, then each switch tube is a switch tube with a body diode; if each of the anti-parallel diodes is an external diode in anti-parallel with the corresponding switch tube, then each switch tube is a body diode. The switch tube or the switch tube without body diode.

For the second packaging scheme of multiple power devices in the bridge arm module 10 in the above embodiment, according to the above description, when the output voltage on the AC output side is in the positive half cycle, as shown in FIG. 6 , the active current The power devices flowing through are the first switch tube Q1, the second anti-parallel diode D2 and the fifth switch tube Q5, and the power devices flowing through the reactive current are the first anti-parallel diode D1, the second switch tube Q2 and the fifth anti-parallel diode D1. Parallel diode D5; when the output voltage on the AC side is in the negative half cycle, as shown in Figure 6, the power devices through which the active current flows are the third anti-parallel diode D3, the fourth switch Q4 and the sixth switch Q6, The power devices through which the reactive current flows are the third switch tube Q3, the fourth anti-parallel diode D4 and the sixth anti-parallel diode D6.

It should be noted that, since the first switch tube Q1 in FIG. 6 cannot accurately refer to the switch tube at the corresponding position in the ANPC three-level circuit in practical application, the first switch tube Q1 and the fourth switch tube in FIG. Q4 is described as: two switch tubes connected to the positive and negative poles of the DC side; the second anti-parallel diode D2 and the third anti-parallel diode D3 in FIG. 6 are described as: the two switch tubes connected to the midpoint of the DC side Anti-parallel diode; the fifth switch Q5 and the sixth switch Q6 in FIG. 6 are described as: two switches connected to the AC side; the first anti-parallel diode D1 and the fourth anti-parallel diode D4 in FIG. 6 Described as: the anti-parallel diodes of the two switch tubes connected to the positive and negative poles of the DC side; the fifth anti-parallel diode D5 and the sixth anti-parallel diode D6 in FIG. 6 are described as: two switch tubes connected to the AC side The second switch tube Q2 and the third switch tube Q3 in FIG. 6 are described as: two switch tubes connected to the midpoint of the DC side.

To sum up, as shown by the two dotted boxes in FIG. 6 , the power device packaged in the first package module 21 with a large heat generation includes: two switch tubes connected to the positive and negative electrodes of the DC side, and two switch tubes connected to the positive and negative electrodes of the DC side, The two connected switch tubes, and the anti-parallel diodes of the two switch tubes connected to the midpoint of the DC side; the power devices packaged in the second packaging module 22 with a smaller heat generation include: Anti-parallel diodes of the two switch tubes, anti-parallel diodes of the two switch tubes connected to the AC side, and two switch tubes connected to the midpoint of the DC side.

It should be noted that, for the second packaging scheme of the plurality of power devices in the bridge arm module 10 in the above-mentioned embodiment, each anti-parallel diode in FIG. Each switch tube can be a switch tube with a body diode (as shown in Figure 6) or a switch tube without a body diode (not shown in the figure). One more elaboration.

Optionally, all the above-mentioned switch tubes may be MOS transistors or IGBTs, which are not specifically limited here, and may be determined according to specific circumstances, which are all within the protection scope of the present application.

It can be seen from the above content that the one-phase bridge arm of the three-phase inverter part given in this embodiment is composed of one inverter unit, and each inverter unit contains at least two longitudinally split power modules. The power modules in the package are different, and at least one is a module without a copper base plate. In practical applications, the circuit connected to the positive and negative poles of the DC bus (P+, N-) can be placed in a module with a copper substrate. This part of the circuit also has high-frequency commutation, and the circuit connected to the AC side is placed in another. A module, this part of the circuit has no high-frequency commutation; alternatively, the wafer through which the active current flows can be placed in a module with a copper substrate, and the wafer through which the reactive current flows can be placed in a module without a copper substrate Inside. The calorific value of the chip in the module with the copper substrate is greater than the calorific value of the chip in the module without the copper substrate, which is conducive to the heat dissipation of the power device with a large amount of heat.

For bridge arm modules with other topologies, different encapsulation materials can also be encapsulated according to the difference in heat generation, and the specific principles thereof will not be repeated one by one, and are all within the protection scope of the present application.

Another embodiment of the present invention also provides a power conversion circuit, comprising: a first bridge arm module and a second bridge arm module connected in series; wherein:

The heat generation of the first bridge arm module is greater than the heat generation of the second bridge arm module; the packaging methods of the first bridge arm module and the second bridge arm module are different, which may be different in the packaging structure or packaging material. The packaging material of the first bridge arm module is the packaging material with the auxiliary heat dissipation part; the packaging material of the second bridge arm module is the packaging material without the auxiliary heat dissipation part.

The two bridge arm modules are encapsulated with different encapsulation materials according to the difference in heat generation. The specific principles can be found in the above-mentioned embodiments, which are not repeated here, and are all within the protection scope of the present application.

It is worth noting that, in the power conversion circuit, both the first bridge arm module and the second bridge arm module may include a single power device, or at least one of the first bridge arm module and the second bridge arm module may be included. One is the bridge arm module described in any of the above embodiments, and the specific principle is not repeated here.

Another embodiment of the present invention further provides a power conversion system, the main circuit of which includes: the bridge arm module described in any of the foregoing embodiments, or the power conversion circuit described in the foregoing embodiments.

The specific structures and principles of the bridge arm module and the power conversion circuit may be referred to in the above-mentioned embodiments, which will not be repeated here.

Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the various embodiments may be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and reference may be made to the partial description of the method embodiment for related parts. The systems and system embodiments described above are only illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, It can be located in one place, or it can be distributed over multiple network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment. Those of ordinary skill in the art can understand and implement it without creative effort.

Professionals may further realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two, in order to clearly illustrate the possibilities of hardware and software. Interchangeability, the above description has generally described the components and steps of each example in terms of functionality. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of the present invention.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (24)

1. A bridge arm module is characterized in that a topological structure of the bridge arm module comprises a plurality of power devices;

each power device is respectively packaged in at least two packaging modules;

each packaging module adopts at least two different packaging modes.

2. The bridge leg module of claim 1, wherein the topology of the bridge leg module comprises: a single bridge arm;

the single bridge arm comprises a plurality of power devices which are respectively packaged in at least two packaging modules with different packaging modes.

3. The bridge leg module of claim 1, wherein the topology of the bridge leg module comprises: the first bridge arm and the second bridge arm are connected in parallel;

the first bridge arm comprises a single power device, and the second bridge arm comprises a plurality of power devices;

and the first bridge arm and the second bridge arm are respectively packaged in at least two packaging modules with different packaging modes.

4. The bridge leg module of claim 1, wherein the topology of the bridge leg module is: any one of full-bridge topology, half-bridge topology, three-phase four-leg inverter topology, boost topology, buck topology and buck-boost topology.

5. The bridge arm module of any one of claims 1 to 4, wherein the different packaging modes comprise: the encapsulation material is different and/or the encapsulation structure is different.

6. The bridge arm module of claim 5, wherein the encapsulating material comprises: an encapsulating material with an auxiliary heat dissipating portion, and an encapsulating material without an auxiliary heat dissipating portion.

7. The bridge arm module of claim 6, wherein the auxiliary heat sink portion is: a copper substrate or an aluminum substrate.

8. The bridge leg module of any one of claims 1-4, wherein each of the encapsulated modules comprises: at least one first package module and at least one second package module; wherein:

the heat productivity of the first packaging module is larger than the heat dissipation capacity of the second packaging module.

9. The bridge arm module of claim 8, wherein the encapsulant of the first encapsulant module is an encapsulant with an auxiliary heat dissipation portion; the packaging material of the second packaging module is the packaging material without the auxiliary heat dissipation part.

10. The bridge arm module of claim 8 or 9, wherein the power devices packaged in the first packaging module are power devices with high frequency commutation, and the power devices packaged in the second packaging module are power devices without high frequency commutation.

11. The bridge arm module of claim 10, wherein the power devices packaged in the first packaging module are high-frequency power devices, and the power devices packaged in the second packaging module are power frequency power devices.

12. The bridge arm module of claim 8 or 9, wherein the power devices packaged in the first packaged module are power devices through which active current flows, and the power devices packaged in the second packaged module are power devices through which reactive current flows.

13. The bridge leg module of claim 10, wherein if the topology of the bridge leg module is an ANPC three-level topology, the power devices packaged in the first packaged module comprise: four switching tubes and anti-parallel diodes thereof, wherein the four switching tubes are connected with the direct current side;

the power device packaged in the second package module includes: two switching tubes connected with the AC side and anti-parallel diodes thereof.

14. The bridge arm module of claim 13, wherein the anti-parallel diodes are: a body diode of the corresponding switch tube; or,

the anti-parallel diode is: the external diodes are connected with the corresponding switch tubes in reverse parallel; and, the switch tube is: a switch tube with a body diode, or a switch tube without a body diode.

15. The bridge leg module of claim 10, wherein if the topology of the bridge leg module is an NPC three-level topology, the power devices packaged in the first packaged module comprise: two switching tubes connected with the positive electrode and the negative electrode of the direct current side, anti-parallel diodes of the switching tubes, and two diodes connected with the midpoint of the direct current side;

the power device packaged in the second package module includes: two switching tubes connected with the AC side and anti-parallel diodes thereof.

16. The bridge arm module of claim 15, wherein the anti-parallel diodes are: a body diode of the corresponding switch tube; or,

the anti-parallel diode is: the external diodes are connected with the corresponding switch tubes in reverse parallel; and, the switch tube is: a switch tube with a body diode, or a switch tube without a body diode.

17. The bridge leg module of claim 12, wherein if the topology of the bridge leg module is an ANPC three-level topology, the power devices packaged in the first packaged module comprise: the two switching tubes are connected with the positive electrode and the negative electrode of the direct current side, the two switching tubes are connected with the alternating current side, and the anti-parallel diodes of the two switching tubes are connected with the midpoint of the direct current side;

the power device packaged in the second package module includes: the reverse parallel diodes of the two switch tubes connected with the positive electrode and the negative electrode of the direct current side, the reverse parallel diodes of the two switch tubes connected with the alternating current side and the two switch tubes connected with the midpoint of the direct current side.

18. The bridge arm module of claim 17, wherein the anti-parallel diodes are: the external diodes are connected with the corresponding switch tubes in reverse parallel;

the switch tube is as follows: a switch tube with a body diode, or a switch tube without a body diode.

19. A power conversion circuit, comprising: the bridge arm comprises a first bridge arm module and a second bridge arm module which are connected in series; wherein:

the calorific value of the first bridge arm module is larger than that of the second bridge arm module;

and the first bridge arm module and the second bridge arm module are packaged in different modes.

20. The power conversion circuit of claim 19, wherein the different packaging schemes comprise: the encapsulation material is different and/or the encapsulation structure is different.

21. The power conversion circuit according to claim 20, wherein the encapsulating material of the first leg module is an encapsulating material with an auxiliary heat dissipation portion; and the packaging material of the second bridge arm module is the packaging material without the auxiliary heat dissipation part.

22. The power conversion circuit of any of claims 19-21, wherein each of the first leg module and the second leg module comprises a single power device.

23. The power conversion circuit of any of claims 19-21, wherein at least one of the first leg module and the second leg module is: the bridge arm module of any one of claims 1 to 18.

24. A power conversion system, comprising: the bridge arm module of any one of claims 1 to 18, or the power conversion circuit of any one of claims 19 to 23.

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