CN111640726A - Laser exposure process for lead frame - Google Patents
Laser exposure process for lead frame Download PDFInfo
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- CN111640726A CN111640726A CN202010723079.6A CN202010723079A CN111640726A CN 111640726 A CN111640726 A CN 111640726A CN 202010723079 A CN202010723079 A CN 202010723079A CN 111640726 A CN111640726 A CN 111640726A
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- lead frame
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- exposure process
- dry film
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 48
- 230000003287 optical effect Effects 0.000 claims abstract description 45
- 238000013519 translation Methods 0.000 claims abstract description 18
- 238000004804 winding Methods 0.000 claims abstract description 15
- 239000000428 dust Substances 0.000 claims description 38
- 238000004140 cleaning Methods 0.000 claims description 11
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000010792 warming Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 208000034699 Vitreous floaters Diseases 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
An exposure process of lead frame laser belongs to the technical field of film pressing equipment. The method is characterized in that: the method comprises the following steps: step 1), pressing dry films (11) on two sides of a lead frame (9) through a film pressing device; step 2), the input roller (3) is matched with the winding roller (5), so that the lead frame (9) maintains 10-20 kg of tension, the translation device drives the optical engines (2) on two sides of the lead frame (9) to move, and dry films (11) on two sides of the lead frame (9) are exposed; and step 3) the translation device drives the optical engine (2) to expose the next position of the lead frame (9) until the exposure of the whole roll of lead frame (9) is completed. The exposure process input roller of the lead frame laser is matched with the winding roller to enable the lead frame to maintain 10-20 kg of tension, so that the lead frame can be ensured to be straight, and the lead frame can be prevented from being damaged.
Description
Technical Field
An exposure process of lead frame laser belongs to the technical field of film pressing equipment.
Background
The lead frame is a basic material for semiconductor packaging and is a carrier of an integrated circuit chip, the main material for producing the lead frame is copper alloy, the lead frame is mainly produced in a stamping mode, and the lead frame needs to be etched after stamping is completed so as to realize production of the high-density and multi-pin-count lead frame.
The basic principle of the etching process is to form an anti-etching mask on the copper strip by utilizing the photosensitive characteristic of the chemical photosensitive material, and etch away part of metal by using an etching solution to obtain a required product. The mask divide into dry film and wet membrane, the dry film is usually pressed on the copper strap through the film pressing machine when using, current film pressing machine is usually through a pair of press mold roller of mutual extruded with the dry film pressure on the copper strap, but because copper strips and dry film need be under certain temperature, and it can combine firmly to reach certain suppression time, reach the assigned temperature in order to guarantee between dry film and the copper strips, extrude certain time between dry film and the circular telegram, need reduce the conveying speed of copper strips, if the conveying speed of copper strips is too fast, the insecure problem of combining between dry film and the copper strips will appear. The working efficiency of the existing film pressing machine is very low, and the qualification rate of products is low.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, and the exposure process of the lead frame laser of the lead frame, which can tension the lead frame and avoid the influence on the exposure of the lead frame, is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: the laser exposure process of the lead frame is characterized in that: the laser exposure equipment comprises an input roller, a winding roller, optical engines and translation devices, wherein the input roller and the winding roller are respectively arranged on two sides of the optical engines, two groups of the optical engines are symmetrically arranged on two sides of a lead frame, the translation devices are simultaneously connected with the two groups of the optical engines, and tension rollers are respectively arranged between the input roller and the optical engines and between the winding roller and the optical engines;
the exposure process comprises the following steps:
step 1) pressing dry films on two sides of a lead frame through a film pressing device, and winding the lead frame on an input roller;
step 2), matching an input roller with a winding roller to enable the lead frame to maintain 10-20 kg of tension; the translation device drives the optical engines on the two sides of the lead frame to move and exposes the dry films on the two sides of the lead frame;
and 3) releasing the lead frame by the input roller, simultaneously winding the lead frame by the winding roller, maintaining the tension of 10-20 kg for the lead frame, and driving the optical engine to expose the next position of the lead frame by the translation device until the exposure of the whole lead frame is completed.
Preferably, the width of the lead frame in the step 1) is 100-350 mm. The width of the lead frame is moderate, and the lead frame can be ensured to be tightened.
Preferably, the offset value of the alignment of the optical engines on the two sides of the lead frame in step 2) is less than or equal to 7 um. The alignment deviation value of the optical engines on the two sides of the lead frame is less than or equal to 7um, so that the exposure precision of the lead frame is ensured.
Preferably, a dry film dust removing roller is arranged between the input roller and the optical engine, and a dust removing paper roll is arranged outside the dry film dust removing roller. The dry film dust removing roller can remove sundries on a dry film of the lead frame, and the exposure of the lead frame is prevented from being hindered.
Preferably, step 1) the film pressing device include film pressing roller, dry film roller and preheating device, preheating device and film pressing roller set gradually along the direction of delivery of lead frame, and the film pressing roller is provided with a plurality of pairs side by side along the direction of delivery of lead frame, and the film pressing roller is the warming mill, dry film roller and film pressing roller set up preheating device with one side, the dry film roller has two that set up in the lead frame both sides. The preheating device of film pressing device can preheat the lead frame, make the lead frame temperature rise before getting into the film pressing roller, the film pressing roller is the warming mill, can continue to heat lead frame and dry film, and make it reach appointed temperature fast, the film pressing roller is provided with a plurality of pairs side by side, can press the dry film on the lead frame in succession, it is equal to the extrusion time that has increased dry film and lead frame to set up a plurality of film pressing rollers, the condition is provided for the quick transport of lead frame, the film pressing speed of lead frame has been improved under the condition that does not influence the film pressing quality.
Preferably, the lead frame in step 1) is cleaned by a cleaning device and then a dry film is pressed.
Preferably, cleaning device include the lead frame dust removal roller, the lead frame dust removal roller has two that set up in the lead frame both sides, and two lead frame dust removal rollers cooperate and compress tightly the lead frame, be provided with the dust removal scroll on the lead frame dust removal roller. The dust particle and the air floater adsorbed on the surface of the lead frame can be removed by the dust removing roller of the lead frame, the adhesion of a dry film on the surface of the lead frame is favorably improved by the clean surface of the lead frame, the over-etching caused by low adhesion and the bad falling of feet are reduced, and the product yield is improved.
Preferably, cleaning device still include ionic wind machine, ionic wind machine's air outlet sets up towards the lead frame, ionic wind machine sets up the one side of keeping away from preheating device at lead frame dust removal roller. The ion fan can remove static attached to the lead frame, reduces dust particles and foreign matters adsorbed on the surface of the lead frame due to the static, avoids poor photopolymerization caused by shielding of the foreign matters during exposure, and improves the yield of products.
Compared with the prior art, the invention has the beneficial effects that:
this input roller and wind-up roll of the exposure technology of lead frame laser all cooperate with the tension roller, carry out the tensioning to the lead frame, make the lead frame need not the bearing can keep the level, avoid debris on the layer board to cause the hindrance to the exposure of lead frame downside, guarantee that the both sides exposure accuracy of lead frame is high, and then improved the qualification rate of lead frame. The optical engines are symmetrically arranged on two groups of two sides of the lead frame, so that two sides of the lead frame can be exposed simultaneously, the exposure speed is high, the translation device is connected with the two groups of optical engines simultaneously and drives the two groups of optical engines to move synchronously, the exposure of different lines on two sides of the lead frame can be realized by controlling the optical engines, the input roller and the winding roller are matched to enable the lead frame to maintain 10-20 kg of tension, the lead frame can be ensured to be stretched straight, and the lead frame can be prevented from being damaged.
Drawings
Fig. 1 is a schematic structural view of a laser exposure apparatus for a lead frame.
Fig. 2 is a schematic structural diagram of a film pressing device.
Fig. 3 is a schematic structural view of the cleaning device.
In the figure: 1. translation device 2, optical engine 3, input roller 4, transition roller 5, wind-up roll 6, bearing roller 7, tension roller 8, guide roll 9, lead frame 10, dry film dust removal roller 11, dry film 12, press mold roller 13, dry film roller 14, preheat oven 15, stoving case 16, ion fan 17, lead frame dust removal roller.
Detailed Description
FIGS. 1 to 3 illustrate preferred embodiments of the present invention, and the present invention will be further described with reference to FIGS. 1 to 3.
Laser exposure equipment of lead frame, including input roller 3, wind-up roll 5, optical engine 2 and translation device, input roller 3 and wind-up roll 5 set up respectively in optical engine 2's both sides, and optical engine 2 has the symmetry to set up two sets of in lead frame 9 both sides, and translation device links to each other with two sets of optical engine 2 simultaneously, all is provided with tension roller 7 between input roller 3 and optical engine 2 and between wind-up roll 5 and optical engine 2. This laser exposure equipment of lead frame's input roller 3 and wind-up roll 5 all cooperate with tension roller 7, carry out the tensioning to lead frame 9, make lead frame 9 not need the bearing can keep the level, avoid the debris on the layer board to cause the hindrance to the exposure of lead frame 9 downside, guarantee that the both sides exposure accuracy of lead frame 9 is high, and then improved lead frame 9's qualification rate. Optical engine 2 has the symmetry to set up two sets ofly in lead frame 9 both sides to can expose the both sides of lead frame 9 simultaneously, the exposure speed is fast, and translation device links to each other with two sets of optical engine 2 simultaneously, and drives its synchronous motion, through the control to optical engine 2, can realize the exposure of the different circuits in lead frame 9 both sides.
The present invention is further described with reference to the following detailed description, however, it should be understood by those skilled in the art that the detailed description given herein with respect to the accompanying drawings is for better explanation and the present invention is not necessarily limited to the specific embodiments, but rather, for equivalent alternatives or common practices, which are not described in detail herein, but are still within the scope of the present application
Specifically, the method comprises the following steps: as shown in fig. 1: a guide roller 8, a dry film dust removing roller 10, a transition roller 4, a tension roller 7 and a carrier roller 6 are sequentially arranged between the input roller 3 and the optical engine 2 along the conveying direction of the lead frame 9, wherein the carrier roller 6, the tension roller 7, the dry film dust removing roller 10 and the guide roller 8 are positioned on the same horizontal plane, the transition roller 4 is positioned on the lower side of the guide roller 8, and the input roller 3 is also positioned on the lower side of the guide roller 8.
A carrier roller 6, a tension roller 7, a transition roller 4 and a guide roller 8 are sequentially arranged between the wind-up roller 5 and the optical engine 2 along the conveying direction of the lead frame 9, wherein the carrier roller 6, the tension roller 7 and the guide roller 8 are positioned on the same horizontal plane, the transition roller 4 is positioned on the lower side of the guide roller 8, and the wind-up roller 5 is also positioned on the lower side of the guide roller 8. Two guide rollers 8 are provided side by side.
In this embodiment, the input roller 3 and the wind-up roller 5 are both connected with a motor, thereby realizing tensioning of the lead frame 9.
The optical engines 2 are symmetrically arranged on two sides of the lead frame 9, and each group of optical engines 2 comprises a plurality of optical engines arranged side by side. The translation device (not shown) is connected to the two optical engines 2 and drives them to translate.
The translation device comprises a horizontal linear module and a vertical linear module which are horizontally arranged, the horizontal linear module is arranged in parallel to the conveying direction of the lead frame 9, the vertical linear module is arranged in the conveying direction perpendicular to the lead frame 9, the vertical linear module is arranged on the horizontal linear module, and the optical engine 2 is arranged on the vertical linear module. During the movement of the optical engine 2, the exposure of different patterns is realized by controlling the operation of the optical engine 2 to meet the design of the circuit on the lead frame 9.
As shown in fig. 2: the invention also provides a high-speed film pressing device for the lead frame, which comprises two film pressing rollers 12, two dry film rollers 13 and a preheating device, wherein the film pressing rollers 12 are arranged on the output side of the lead frame 9 of the preheating device, the film pressing rollers 12 are arranged in pairs in parallel along the conveying direction of the lead frame 9, the film pressing rollers 12 are heating rollers, the dry film rollers 13 are also arranged on the output side of the lead frame 9 of the preheating device, and the dry film rollers 13 are arranged on the lead frame 9. This high-speed press mold device of lead frame's preheating device can preheat lead frame 9, make lead frame 9 temperature rise before getting into press mold roller 12, press mold roller 12 is the warming mill, can continue to heat lead frame 9 and dry film 11, and make it reach appointed temperature fast, press mold roller 12 is provided with a plurality of pairs side by side, can press dry film 11 on lead frame 9 in succession, it is equivalent to the extrusion time that has increased dry film 11 and lead frame 9 to set up a plurality of press mold roller 12, the condition is provided for the quick transport of lead frame 9, the press mold speed of lead frame 9 has been improved under the condition that does not influence the press mold quality. The lead frame 9 is exposed after lamination. The preheating means is a preheating oven 14.
The lamination rollers 12 have pairs arranged side by side in the conveying direction of the lead frame 9, and in the present embodiment, the lamination rollers 12 are arranged two pairs side by side in the conveying direction of the lead frame 9. The film pressing roller 12 is a heating roller, so that the heating effect can be achieved during film pressing, the temperature between the lead frame 9 and the dry film 11 reaches the specified temperature, and the dry film 11 is reliably combined with the lead frame 9.
The dry film rollers 13 are symmetrically arranged on two sides of the lead frame 9, and dry film rolls are arranged on the two dry film rollers 13, so that dry films 11 can be respectively provided for two sides of the lead frame 9. The dry film roller 13 is parallel to the arrangement of the film pressing roller 12, the dry film roller 13 is positioned in the middle of the two pairs of film pressing rollers 12, so that the dry film 11 and the film pressing roller 12 on the front side along the conveying direction of the lead frame 9 have certain wrap angles, enough heating time is reserved for the dry film 11, the specified temperature can be reached when the dry film 11 is in contact with the lead frame 9, and the dry film 11 is firmly combined with the lead frame 9.
As shown in fig. 3: the high-speed film pressing device for the lead frame further comprises a cleaning device and a drying box 15, the drying box 15 is arranged on one side of the input of the preheating oven 14, the cleaning device is arranged between the drying box 15 and the preheating oven 14 and cleans the lead frame 9 after drying, dust particles or floaters are prevented from being adsorbed on the surface of the lead frame 9, film pressing quality is prevented from being influenced, and production yield of the lead frame 9 is improved.
The cleaning device comprises an ion fan 16 and a lead frame dust removing roller 17 which are sequentially arranged along the conveying direction of the lead frame 9, the ion fan 16 is arranged on the upper side of the lead frame 9, an air outlet of the ion fan 16 is arranged towards the lead frame 9, static electricity attached to the lead frame 9 can be removed, and dust particles or floating objects in the air are prevented from being adsorbed by the lead frame 9 due to the static electricity. Lead frame dust removal roller 17 has the symmetry to set up two in lead frame 9 both sides, lead frame dust removal roller 17 level sets up, two lead frame dust removal rollers 17 cooperate and compress tightly lead frame 9, be provided with the dust removal scroll on lead frame dust removal roller 17, thereby can detach the dirt grain or the floater on lead frame 9 surface, clean lead frame 9 surface is favorable to promoting dry film 11 at the adhesive force on lead frame 9 surface, the etching of crossing that has reduced to lead to because of the adhesive force is low, fall the young bad of foot, improve the product yield. The ion fan 16 and the lead frame dust removing roller 17 are sequentially arranged along the conveying direction of the lead frame 9, so that the phenomenon that static electricity on the lead frame 9 adsorbs dust particles or floating objects in the air again after dust removal can be avoided.
The laser exposure process of the lead frame comprises the following steps:
step 1) pressing dry films 11 on two sides of a lead frame 9 through a film pressing device, and winding the lead frame 9 on an input roller 3;
the lead frame 9 is cleaned first, and the cleaned lead frame 9 is dried in the drying box 15. The dried lead frame 9 sequentially passes through an ion fan 16 and a lead frame dust removing roller 17 and then enters a preheating oven 14 for preheating and temperature rise.
The two sides of the lead frame 9 after preheating and temperature rising are both attached to the dry film 11, and then the dry film 11 is extruded by the film pressing roller 12 to be attached to the two sides of the lead frame 9. And the lead frame 9 is rolled after film pressing, and the rolled lead frame 9 is used as the input roller 3. The width of the lead frame 9 is 100-350 mm.
Step 2), the input roller 3 is matched with the winding roller 5, so that the lead frame 9 maintains 10-20 kg of tension, the translation device drives the optical engines 2 on two sides of the lead frame 9 to move, and dry films 11 on two sides of the lead frame 9 are exposed;
input roller 3 and wind-up roll 5 all drive through the motor and realize rotating to make lead frame 9 maintain 10~20 kg's pressure, in order to guarantee that lead frame 9 is taut, thereby make lead frame 9 need not the bearing can keep the level. And the translation device drives the optical engines 2 on the two sides of the lead frame 9 to move, and exposes the dry films 11 on the two sides of the lead frame 9. The offset value of the alignment of the optical engines 2 on both sides of the lead frame 9 is less than or equal to 7 um.
And step 3), releasing the lead frame 9 by the input roller 3, simultaneously rolling the lead frame 9 by the rolling roller 5, maintaining the tension of 10-20 kg on the lead frame 9, and driving the optical engine 2 to expose the next position of the lead frame 9 by the translation device until the exposure of the whole roll of the lead frame 9 is completed.
After exposure of the dry films 11 on the two sides of the lead frame 9 is completed, the input roller 3 rotates and releases the lead frame 9, meanwhile, the winding roller 5 rotates and winds the lead frame 9, so that the lead frame 9 maintains 10-20 kg of tension, and the next position of the lead frame 9 is aligned with the optical engine 2 and exposed until exposure of the whole roll of the lead frame 9 is completed.
The foregoing is directed to preferred embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. However, any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the protection scope of the technical solution of the present invention.
Claims (8)
1. The laser exposure process of the lead frame is characterized in that: the method comprises the following steps:
step 1), pressing dry films (11) on two sides of a lead frame (9) through a film pressing device, and winding the lead frame (9) on an input roller (3);
step 2), the input roller (3) is matched with the winding roller (5), so that the lead frame (9) maintains 10-20 kg of tension, the translation device drives the optical engines (2) on two sides of the lead frame (9) to move, and dry films (11) on two sides of the lead frame (9) are exposed;
and step 3), releasing the lead frame (9) by the input roller (3), rolling the lead frame (9) by the rolling roller (5) at the same time, maintaining the tension of 10-20 kg for the lead frame (9), and driving the optical engine (2) to expose the next position of the lead frame (9) by the translation device until the exposure of the whole roll of the lead frame (9) is completed.
2. The lead frame laser exposure process according to claim 1, wherein: the width of the lead frame (9) in the step 1) is 100-350 mm.
3. The lead frame laser exposure process according to claim 1, wherein: and 2), the alignment deviation value of the optical engines (2) on the two sides of the lead frame (9) is less than or equal to 7 um.
4. The lead frame laser exposure process according to claim 1, wherein: a dry film dust removing roller (10) is arranged between the input roller (3) and the optical engine (2), and a dust removing paper roll is arranged outside the dry film dust removing roller (10).
5. The lead frame laser exposure process according to claim 1, wherein: step 1) the film pressing device include film pressing roller (12), dry film roller (13) and preheating device, preheating device and film pressing roller (12) set gradually along the direction of delivery of lead frame (9), film pressing roller (12) are provided with a plurality of pairs side by side along the direction of delivery of lead frame (9), and film pressing roller (12) are the warming mill, dry film roller (13) set up preheating device with one side with film pressing roller (12), dry film roller (13) have two that set up in lead frame (9) both sides.
6. The lead frame laser exposure process according to claim 1, wherein: cleaning the lead frame (9) in the step 1) by using a cleaning device, and pressing a dry film (11).
7. The lead frame laser exposure process according to claim 6, wherein: cleaning device include lead frame dust removal roller (17), lead frame dust removal roller (17) have two that set up in lead frame (9) both sides, and two lead frame dust removal rollers (17) cooperate and compress tightly lead frame (9), be provided with the dust removal scroll on lead frame dust removal roller (17).
8. The lead frame laser exposure process according to claim 7, wherein: cleaning device still include ionic wind machine (16), ionic wind machine's (16) air outlet sets up towards lead frame (9), ionic wind machine (16) set up and keep away from preheating device's one side in lead frame dust removal roller (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010723079.6A CN111640726A (en) | 2020-07-24 | 2020-07-24 | Laser exposure process for lead frame |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010723079.6A CN111640726A (en) | 2020-07-24 | 2020-07-24 | Laser exposure process for lead frame |
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| CN111640726A true CN111640726A (en) | 2020-09-08 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114334750A (en) * | 2022-03-09 | 2022-04-12 | 宁波德洲精密电子有限公司 | Packaging structure of lead frame and packaging process thereof |
| CN116646278A (en) * | 2023-05-29 | 2023-08-25 | 天水华洋电子科技股份有限公司 | Lead frame roll-type etching equipment |
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| CN114334750A (en) * | 2022-03-09 | 2022-04-12 | 宁波德洲精密电子有限公司 | Packaging structure of lead frame and packaging process thereof |
| CN116646278A (en) * | 2023-05-29 | 2023-08-25 | 天水华洋电子科技股份有限公司 | Lead frame roll-type etching equipment |
| CN116646278B (en) * | 2023-05-29 | 2023-10-20 | 天水华洋电子科技股份有限公司 | Lead frame roll-type etching equipment |
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Address after: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Applicant after: New Henghui Electronics Co.,Ltd. Address before: 255088 No. 187 middle run road, hi tech Zone, Zibo, Shandong Applicant before: SHANDONG XINHENGHUI ELECTRONICS TECHNOLOGY Co.,Ltd. |
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Application publication date: 20200908 |