CN111636051B - Device of amorphous InGaN/Si heterojunction solar cell and preparation method thereof - Google Patents
Device of amorphous InGaN/Si heterojunction solar cell and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 238000000151 deposition Methods 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 230000008021 deposition Effects 0.000 claims abstract description 52
- 239000013077 target material Substances 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 20
- 229910000807 Ga alloy Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000010408 film Substances 0.000 claims description 22
- 238000004544 sputter deposition Methods 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 5
- 230000001276 controlling effect Effects 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000012153 distilled water Substances 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 239000003344 environmental pollutant Substances 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 231100000719 pollutant Toxicity 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 238000005070 sampling Methods 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000004880 explosion Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- 230000009977 dual effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000002210 silicon-based material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 229910001199 N alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The invention discloses a device of an amorphous InGaN/Si heterojunction solar cell and a preparation method thereof, wherein a high-energy laser beam emitted by a pulse laser In the device is divided into two beams by a spectroscope, the two beams respectively enter a deposition chamber from a window through two focusing lenses and irradiate an In/GaN double target material, the irradiated area on the surface of the target material is instantaneously ablated to generate plasma plume, the plasma plume is transported to a p-Si substrate In a micro-area explosion mode to be deposited to form an amorphous InGaN film, an Au metal ohmic electrode is sputtered on the surface of the amorphous InGaN film, and an In-Ga alloy ohmic electrode is sputtered on the back of the p-Si substrate, so that the preparation of the amorphous InGaN/Si heterojunction solar cell is completed. The device is simple and convenient to operate and flexible to adjust, the preparation method does not need a buffer layer, the method is simple and easy to implement, the growth temperature of the film is low, the process is simplified, the production cost is reduced, and the prepared amorphous InGaN/Si heterojunction solar cell has better photoelectric conversion efficiency.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to a device of an amorphous InGaN/Si heterojunction solar cell and a preparation method thereof.
Background
With the global energy shortage and the aggravation of the environmental pollution degree, the importance of the solar photovoltaic power generation technology is increasingly shown, and the solar photovoltaic industry develops very rapidly and becomes a high and new technology industry which is concerned with much attention. In order to further utilize the solar spectrum and improve the photoelectric conversion efficiency of the solar cell, researchers have proposed a plurality of new concepts, new materials and new-structure solar cells. InGaN alloy is a novel photovoltaic material, is a wide-bandgap semiconductor material which is currently researched and compared, and has high light absorption coefficient (10) 5 cm -1 ) The solar cell has the characteristics of strong radiation resistance, high temperature resistance, ultrahigh hardness and the like, and the forbidden bandwidth is continuously adjustable within the range of 0.7eV to 3.4eV by adjusting the components of the In element, so that the solar cell is suitable for being made into various solar cells with different forbidden bandwidths.
InGaN materials are widely applied to the fields of light emitting diodes, ultraviolet detectors, semiconductor lasers, semiconductor photovoltaic devices and the like, but the preparation of high-quality and high-In-component InGaN thin films still has more technical problems, such as the problems of uneven In components, phase separation, high dislocation density and the like. Compared with a single crystal InGaN material, the crystal structure of the amorphous InGaN material has disorder, the production process is simple, the preparation and growth are easier, and the production cost can be reduced. Therefore, the amorphous InGaN material has obvious advantages in the field of preparing large-area InGaN-based devices.
On the other hand, the substrate for epitaxial growth of the III-N alloy mainly comprises silicon, sapphire, silicon carbide and the like, the silicon material is used as the most commonly used photovoltaic material, the research on the silicon material is very mature, the silicon material is applied to large scale in an integrated circuit, the silicon material has low price, high quality, low resistivity and mature processing technology, and the band gap (1.12eV) of the silicon is particularly suitable for the bottom junction of a high-efficiency solar cell, so that InGaN and the silicon are combined to construct an amorphous InGaN/Si heterojunction solar cell which can be used for solar photovoltaic power generation.
The rapidly developing solar photovoltaic industry has promoted new photovoltaic materials, new device structures, new preparation processes and the like, and InGaN solar cells have been reported in recent years, but have been developed very slowly. While the research reports of the amorphous InGaN solar cell are extremely rare at present, the research of the amorphous InGaN/Si heterojunction solar cell is valuable both from the basic research and from the practical application.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides a method for preparing an amorphous InGaN film and an amorphous InGaN/Si heterojunction solar cell by adopting a double-optical-path double-target pulse laser deposition device, is simple and feasible, does not need a buffer layer, has low film growth temperature, and reduces the process complexity and the production cost. The amorphous InGaN/Si heterojunction solar cell prepared by the method has better photoelectric conversion efficiency.
The technical scheme of the invention is as follows:
an amorphous InGaN/Si heterojunction solar cell device comprises a laser system, a double-optical-path system and a deposition system;
the laser system comprises a pulse laser for emitting a high-energy laser beam;
the dual-optical-path system comprises a spectroscope, a first reflector, a first focusing lens, a first laser window, a second reflector, a second focusing lens and a second laser window; a high-energy laser beam emitted by the pulse laser is divided into two laser paths through a spectroscope, wherein the two laser paths are a first laser path and a second laser path; the first laser light path irradiates on the In target material through a first reflector, a first focusing lens and a first laser window respectively; the second laser light path is irradiated on the GaN target material through a second reflector, a second focusing lens and a second laser window respectively; the In target material and the GaN target material form an In/GaN double target material, and the irradiated area of the surface of the In/GaN double target material is instantaneously ablated to generate plasma plume;
the deposition system comprises a deposition chamber, a sample introduction chamber, a target disc for mounting an In/GaN double target material and a heater for heating a p-Si substrate; a first laser window, a second laser window, an observation window, a motor, a vacuum system and a sample chamber are arranged around the deposition chamber; the motor and the vacuum system are arranged oppositely in parallel, and the observation window and the sampling chamber are arranged oppositely in parallel; the motor is located the intermediate position of first laser window and second laser window, and motor shaft connection heater.
Preferably, the target plate comprises a plate body, an annular vent pipe and an air inlet pipe; the In/GaN double-target material is arranged on the disc body and is surrounded by the annular vent pipe; the annular breather pipe is communicated with the air inlet pipe, and a plurality of vent holes are uniformly formed in the periphery of the annular breather pipe.
Preferably, the In/GaN dual target consists of an annular GaN target sleeved outside a circular In target.
Preferably, a vacuum valve is arranged in the sample chamber.
Preferably, the pulsed laser is a KrF excimer laser.
A preparation method of an amorphous InGaN/Si heterojunction solar cell comprises the following steps:
firstly, cleaning a substrate;
sequentially ultrasonically cleaning the p-Si substrate for 4-10 min by using distilled water, HF solution, acetone, absolute ethyl alcohol and deionized water respectively, and then quickly drying by using nitrogen;
secondly, mounting the substrate and the In/GaN double target material;
mounting a GaN target material and an In target material on a target disc, placing the target disc at a fixed position In a deposition chamber, mounting the processed substrate on a sample disc of a sample chamber, and regulating and controlling the vacuum degree of the sample chamber and the deposition chamber to 10 -5 Pa magnitude order or above, pushing the sample disc into a deposition chamber;
thirdly, setting deposition parameters;
setting N 2 The partial pressure is 5-20 Pa, the distance between the target and the substrate is 40-100 mm, the laser pulse energy is 50-400 mJ/Pluse, and the pulse frequency is adjusted within 1-20 Hz;
fourthly, pre-sputtering the target material;
blocking the substrate by a baffle plate, opening a pulse laser, dividing a high-energy laser beam emitted by the pulse laser into two laser light paths through a spectroscope, and respectively irradiating the laser light paths on the In target material and the GaN target material; pre-sputtering two targets for 4-10 min to remove residual pollutants on the surfaces of the targets;
fifthly, depositing an amorphous InGaN film;
heating the substrate to 20-600 ℃, opening the baffle, and introducing N into the deposition chamber 2 Setting N 2 The partial pressure is 5-20 Pa, the distance between the target and the substrate is 40-100 mm, the laser pulse energy is 50-400 mJ/Pluse, the pulse frequency is adjusted within 1-20 Hz, and the deposition time is 1-4 h;
sixthly, finishing the deposition;
closing the system, and taking out the amorphous InGaN film according to the reverse process of sample loading after the amorphous InGaN film is cooled to room temperature;
preparing an amorphous InGaN/Si heterojunction solar cell;
and sputtering an Au metal ohmic electrode on the surface of the amorphous InGaN thin film, and sputtering an In-Ga alloy ohmic electrode on the back of the p-Si substrate to finish the preparation of the amorphous InGaN/Si heterojunction solar cell.
Preferably, the purity of the In/GaN double target material is 5N grade.
Preferably, the thickness of the amorphous InGaN thin film is 50-500 nm.
Preferably, the Au metal ohmic electrode is prepared on the surface of the amorphous InGaN film by an ion sputtering method, and the In-Ga alloy ohmic electrode is prepared on the back of the p-Si substrate by a magnetron sputtering method.
Preferably, the preparation method of the amorphous InGaN/Si heterojunction solar cell adopts the device of the amorphous InGaN/Si heterojunction solar cell.
The invention has the beneficial effects that:
1. the amorphous n-InGaN layer grown by the method is low in growth temperature, and the process difficulty of thin film growth is reduced.
2. The amorphous n-InGaN layer is directly grown on the p-Si substrate, a buffer layer is not needed, the preparation method is simple and easy to implement, the process is simplified, and the production cost is reduced.
3. The device required by the double-light-path double-target material pulse laser deposition technology designed by reforming the pulse laser light path is simple and easy to operate, and each state in the device can be flexibly adjusted and controlled.
4. At present, research on the amorphous InGaN/Si heterojunction solar cell provided by the invention is hardly reported, and the solar cell has better photoelectric conversion efficiency.
Drawings
FIG. 1 is a schematic structural diagram of the device of the amorphous InGaN/Si heterojunction solar cell of the present invention.
Fig. 2 is a schematic structural diagram of a dual target formed by combining an In target and a GaN target.
FIG. 3 is a schematic structural diagram of an amorphous InGaN/Si heterojunction solar cell prepared by the present invention.
Fig. 4 is an XRD pattern of the amorphous InGaN thin film of example 1 of the present invention.
FIG. 5 is a graph of current density-voltage characteristics of an amorphous InGaN/Si heterojunction solar cell in accordance with example 1 of the present invention.
Fig. 6 is an XRD pattern of the amorphous InGaN thin film of example 2 of the present invention.
FIG. 7 is a graph of current density-voltage characteristics of the amorphous InGaN/Si heterojunction solar cell of example 2 of the present invention.
Fig. 8 is an XRD pattern of the amorphous InGaN thin film of example 3 of the present invention.
FIG. 9 is a graph of current density-voltage characteristics of the amorphous InGaN/Si heterojunction solar cell of example 3 of the present invention.
In the figure, a pulse laser 1, a spectroscope 2, a first laser light path 3, a first reflector 4, a first focusing lens 5, a first laser window 6, a second laser light path 7, a second reflector 8, a second focusing lens 9, a second laser window 10, an observation window 11, a motor 12, a vacuum system 13, a vacuum valve 14, a sample chamber 15, an In/GaN double target material 16, a p-Si substrate 17, a plasma plume 18, a heater 19, a deposition chamber 20, a GaN target material 21, an In target material 22, an annular vent pipe 23, an air inlet pipe 24, an Au metal ohmic electrode 25, an amorphous InGaN thin film 26 and an In-Ga alloy ohmic electrode 27.
Detailed Description
The present invention is further described with reference to the following specific examples, but the scope of the present invention is not limited thereto.
As shown in fig. 1 to 3, an apparatus of an amorphous InGaN/Si heterojunction solar cell includes a laser system, a dual optical path system, and a deposition system;
the laser system comprises a pulse laser 1 for emitting a high-energy laser beam;
the dual-optical-path system comprises a spectroscope 2, a first reflector 4, a first focusing lens 5, a first laser window 6, a second reflector 8, a second focusing lens 9 and a second laser window 10; a high-energy laser beam emitted by the pulse laser 1 is divided into two laser paths, namely a first laser path 3 and a second laser path 7, by a spectroscope 2; the first laser light path 3 irradiates an In target 22 through a first reflector 4, a first focusing lens 5 and a first laser window 6 respectively; the second laser light path 7 is irradiated on the GaN target 21 through a second reflector 8, a second focusing lens 9 and a second laser window 10 respectively; the In target 22 and the GaN target 21 form an In/GaN double target 16, and the irradiated area of the surface of the In target is instantaneously ablated to generate plasma plume 18;
the deposition system comprises a deposition chamber 20, a sample introduction chamber 15, a target disc for mounting an In/GaN double target material 16 and a heater 19 for heating a p-Si substrate 17; a first laser window 6, a second laser window 10, an observation window 11, a motor 12, a vacuum system 13 and a sampling chamber 15 are arranged around the deposition chamber 20; the motor 12 and the vacuum system 13 are arranged oppositely in parallel, and the observation window 11 and the sampling chamber 15 are arranged oppositely in parallel; the motor 12 is positioned intermediate the first laser window 6 and the second laser window 10 and the motor 12 is journaled to the heater 19.
Further, the target plate comprises a plate body, an annular vent pipe 23 and an air inlet pipe 24; the In/GaN double target 16 is arranged on the disc body and is surrounded by an annular vent pipe 23; the annular vent pipe 23 is communicated with the air inlet pipe 24, and a plurality of vent holes are uniformly formed in the periphery of the annular vent pipe 23.
Further, the In/GaN dual target 16 is formed by sleeving the annular GaN target 21 outside the circular In target 22, which is beneficial to instantly ablating the irradiated area on the surface of the In/GaN dual target 16 to generate the plasma plume 18.
Further, a vacuum valve 14 is disposed in the sample chamber 15 for changing the direction of the air flow and adjusting the amount of the air flow.
Further, the pulse laser 1 is a KrF excimer laser, and the output laser wavelength is mainly in the ultraviolet to visible light range, and has the advantages of short wavelength, high frequency, large energy, small focal spot, and high processing resolution.
As shown in fig. 3, the device of the amorphous InGaN/Si heterojunction solar cell of the present invention operates according to the following principle: high-energy laser beams emitted by a pulse laser are divided into two beams by a spectroscope, the two beams respectively enter a deposition chamber from a window through two focusing lenses to be irradiated on an In/GaN double target material, the irradiated area on the surface of the target material is instantaneously ablated to generate plasma plume, the plasma plume is transported to a p-Si substrate 17 In a micro-area explosion mode to deposit and form an amorphous InGaN film 26, an Au metal ohmic electrode 25 is sputtered on the surface of the amorphous InGaN film 26, an In-Ga alloy ohmic electrode 27 is sputtered on the back of the p-Si substrate 17, and then the preparation of the amorphous InGaN/Si heterojunction solar cell is completed.
Example 1
A preparation method of an amorphous InGaN/Si heterojunction solar cell comprises the following steps:
firstly, cleaning a substrate;
sequentially ultrasonically cleaning the p-Si substrate for 6min by using distilled water, HF solution, acetone, absolute ethyl alcohol and deionized water respectively, and then quickly drying by using nitrogen;
secondly, mounting the substrate and the In/GaN double target material;
mounting a GaN target material and an In target material on a target disc, placing the target disc at a fixed position In a deposition chamber, mounting the processed substrate on a sample disc of a sample chamber, and regulating and controlling the vacuum degree of the sample chamber and the deposition chamber to 10 -5 After the vacuum degree of Pa magnitude order or above is the same, the sample disc is pushed into a deposition chamber;
thirdly, setting deposition parameters;
setting N 2 The partial pressure is 10Pa, the distance between the target and the substrate is 60mm, the laser pulse energy is 175mJ/Pluse, and the pulse frequency is adjusted within 5 Hz;
fourthly, pre-sputtering the target material;
blocking the substrate by a baffle, opening a KrF excimer laser, dividing a pulse laser beam (lambda is 248nm) emitted by the KrF excimer laser into two laser light paths through a spectroscope, and respectively irradiating the laser light paths onto the In target material and the GaN target material; pre-sputtering two targets for 6min to remove residual pollutants on the surfaces of the targets;
fifthly, depositing an amorphous InGaN film;
heating the substrate to 50 deg.C, opening the baffle, and introducing N into the deposition chamber 2 Setting N 2 The partial pressure is 10Pa, the distance between the target and the substrate is 60mm, the laser pulse energy is 175mJ/Pluse, the pulse frequency is adjusted within 5Hz, and the deposition time is 2 h;
sixthly, finishing the deposition;
closing the system, and taking out the amorphous InGaN film according to the reverse process of sample loading after the amorphous InGaN film is cooled to room temperature;
preparing an amorphous InGaN/Si heterojunction solar cell;
and sputtering an Au metal ohmic electrode on the surface of the amorphous InGaN thin film, and sputtering an In-Ga alloy ohmic electrode on the back of the p-Si substrate to finish the preparation of the amorphous InGaN/Si heterojunction solar cell.
The InGaN thin film prepared in embodiment 1 of the present invention is amorphous, an XRD spectrogram thereof is shown in fig. 4, a current density-voltage characteristic curve of the amorphous InGaN/Si heterojunction solar cell prepared in this example is shown in fig. 5, and an analysis result shows that an open-circuit voltage is: 2.41V, short-circuit current density: 0.69mA/cm 2 (ii) a The fill factor is: 43.3 percent; the photoelectric conversion efficiency is: 0.72 percent.
Example 2
A preparation method of an amorphous InGaN/Si heterojunction solar cell comprises the following steps:
firstly, cleaning a substrate;
sequentially ultrasonically cleaning the p-Si substrate for 6min by using distilled water, HF solution, acetone, absolute ethyl alcohol and deionized water respectively, and then quickly drying by using nitrogen;
secondly, mounting the substrate and the In/GaN double target material;
mounting a GaN target material and an In target material on a target disc, placing the target disc at a fixed position In a deposition chamber, mounting the processed substrate on a sample disc of a sample chamber, and regulating and controlling the vacuum degree of the sample chamber and the deposition chamber to 10 -5 After the vacuum degree of Pa magnitude order or above is the same, the sample disk is pushedFeeding into a deposition chamber;
thirdly, setting deposition parameters;
setting N 2 The partial pressure is 10Pa, the distance between the target and the substrate is 60mm, the laser pulse energy is 100mJ/Pluse, and the pulse frequency is adjusted within 5 Hz;
fourthly, pre-sputtering the target material;
blocking the substrate by using a baffle, opening a KrF excimer laser, dividing a pulse laser beam (lambda is 248nm) emitted by the KrF excimer laser into two laser light paths by a spectroscope, and respectively irradiating the laser light paths onto the In target material and the GaN target material; pre-sputtering two targets for 6min to remove residual pollutants on the surfaces of the targets;
depositing an amorphous InGaN film;
heating the substrate to 80 deg.C, opening the baffle, and introducing N into the deposition chamber 2 Setting N 2 The partial pressure is 10Pa, the distance between the target and the substrate is 60mm, the laser pulse energy is 100mJ/Pluse, the pulse frequency is adjusted within 5Hz, and the deposition time is 3 h;
sixthly, finishing the deposition;
closing the system, and taking out the amorphous InGaN film according to the reverse process of sample loading after the amorphous InGaN film is cooled to room temperature;
preparing an amorphous InGaN/Si heterojunction solar cell;
and sputtering an Au metal ohmic electrode on the surface of the amorphous InGaN thin film, and sputtering an In-Ga alloy ohmic electrode on the back of the p-Si substrate to finish the preparation of the amorphous InGaN/Si heterojunction solar cell.
The InGaN thin film prepared in embodiment 3 of the invention is of an amorphous structure, an XRD spectrogram is shown in figure 8, and a diffraction wave packet of amorphous InGaN is formed. The current density-voltage characteristic curve of the amorphous InGaN/Si heterojunction solar cell prepared in the example is shown in FIG. 9, and the analysis result shows that the open-circuit voltage is as follows: the 3.37V short circuit current density is: 0.63mA/cm 2 (ii) a The fill factor is: 39.1 percent; the photoelectric conversion efficiency is: 0.83 percent.
Example 3
A preparation method of an amorphous InGaN/Si heterojunction solar cell comprises the following steps:
firstly, cleaning a substrate;
sequentially ultrasonically cleaning the p-Si substrate for 6min by using distilled water, HF solution, acetone, absolute ethyl alcohol and deionized water respectively, and then quickly drying by using nitrogen;
secondly, mounting the substrate and the In/GaN double target material;
mounting a GaN target material and an In target material on a target disc, placing the target disc at a fixed position In a deposition chamber, mounting the processed substrate on a sample disc of a sample chamber, and regulating and controlling the vacuum degree of the sample chamber and the deposition chamber to 10 -5 After the vacuum degree of Pa magnitude order or above is the same, the sample disc is pushed into a deposition chamber;
thirdly, setting deposition parameters;
set N 2 The partial pressure is 10Pa, the distance between the target and the substrate is 60mm, the laser pulse energy is 100mJ/Pluse, and the pulse frequency is adjusted within 5 Hz;
fourthly, pre-sputtering the target material;
blocking the substrate by a baffle, opening a KrF excimer laser, dividing a pulse laser beam (lambda is 248nm) emitted by the KrF excimer laser into two laser light paths through a spectroscope, and respectively irradiating the laser light paths onto the In target material and the GaN target material; pre-sputtering two targets for 6min to remove residual pollutants on the surfaces of the targets;
fifthly, depositing an amorphous InGaN film;
heating the substrate to 280 deg.C, opening the baffle, and introducing N into the deposition chamber 2 Setting N 2 The partial pressure is 10Pa, the distance between the target and the substrate is 60mm, the laser pulse energy is 100mJ/Pluse, the pulse frequency is adjusted within 5Hz, and the deposition time is 3 h;
sixthly, finishing the deposition;
closing the system, and taking out the amorphous InGaN film according to the reverse process of sample loading after the amorphous InGaN film is cooled to room temperature;
preparing an amorphous InGaN/Si heterojunction solar cell;
and sputtering an Au metal ohmic electrode on the surface of the amorphous InGaN thin film, and sputtering an In-Ga alloy ohmic electrode on the back of the p-Si substrate to finish the preparation of the amorphous InGaN/Si heterojunction solar cell.
The InGaN thin film prepared in embodiment 3 of the present invention is amorphous, and its XRD spectrogram is shown in FIG. 8, which is an example of the present inventionThe current density-voltage characteristic curve of the prepared amorphous InGaN/Si heterojunction solar cell is shown in figure 9, and the analysis result shows that the open-circuit voltage is as follows: the 3.31V short circuit current density is: 1.28mA/cm 2 (ii) a The fill factor is: 43.6 percent; the photoelectric conversion efficiency is: 1.86 percent.
The above description is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or simple substitutions which are not thought of through the inventive work should be included in the scope of the present invention.
Claims (4)
1. A preparation method of an amorphous InGaN/Si heterojunction solar cell is characterized by comprising the following steps:
firstly, cleaning a substrate;
sequentially ultrasonically cleaning the p-Si substrate for 4-10 min by using distilled water, HF solution, acetone, absolute ethyl alcohol and deionized water respectively, and then quickly drying by using nitrogen;
secondly, mounting the substrate and the In/GaN double target material;
mounting a GaN target material and an In target material on a target disc, placing the target disc at a fixed position In a deposition chamber, mounting the processed substrate on a sample disc of a sample chamber, and regulating and controlling the vacuum degree of the sample chamber and the deposition chamber to 10 -5 Pa magnitude order or above, pushing the sample disc into a deposition chamber;
thirdly, setting deposition parameters;
set N 2 The partial pressure is 5-20 Pa, the distance between the target and the substrate is 40-100 mm, the laser pulse energy is 50-400 mJ/Pluse, and the pulse frequency is adjusted within 1-20 Hz;
fourthly, pre-sputtering the target material;
blocking the substrate by a baffle plate, opening a pulse laser, dividing a high-energy laser beam emitted by the pulse laser into two laser light paths through a spectroscope, and respectively irradiating the laser light paths on the In target material and the GaN target material; pre-sputtering two targets for 4-10 min to remove residual pollutants on the surfaces of the targets;
fifthly, depositing an amorphous InGaN film;
heating the substrate to 20-600 ℃, opening a baffle, and introducing N into the deposition chamber 2 Setting N 2 The partial pressure is 5-20 Pa, the distance between the target and the substrate is 40-100 mm, the laser pulse energy is 50-400 mJ/Pluse, the pulse frequency is adjusted within 1-20 Hz, and the deposition time is 1-4 h;
sixthly, finishing the deposition;
closing the system, and taking out the amorphous InGaN film according to the reverse process of sample loading after the amorphous InGaN film is cooled to room temperature;
preparing an amorphous InGaN/Si heterojunction solar cell;
sputtering an Au metal ohmic electrode (25) on the surface of the amorphous InGaN thin film (26), and sputtering an In-Ga alloy ohmic electrode (27) on the back surface of the p-Si substrate (17), thereby completing the preparation of the amorphous InGaN/Si heterojunction solar cell;
the purity of the In/GaN double target material is 5N grade;
the thickness of the amorphous InGaN film is 50-500 nm;
the surface of the amorphous InGaN film is provided with an Au metal ohmic electrode by an ion sputtering method, and the back of the p-Si substrate is provided with an In-Ga alloy ohmic electrode by a magnetron sputtering method.
2. The method of claim 1 for fabricating an amorphous InGaN/Si heterojunction solar cell, characterized in that: a device employing an amorphous InGaN/Si heterojunction solar cell as follows; the device comprises a laser system, a double optical path system and a deposition system;
the laser system comprises a pulsed laser (1) for emitting a high-energy laser beam;
the dual-optical-path system comprises a spectroscope (2), a first reflector (4), a first focusing lens (5), a first laser window (6), a second reflector (8), a second focusing lens (9) and a second laser window (10); a high-energy laser beam emitted by the pulse laser (1) is divided into two laser paths, namely a first laser path (3) and a second laser path (7), by the spectroscope (2); the first laser light path (3) is irradiated on the In target (22) through a first reflector (4), a first focusing lens (5) and a first laser window (6) respectively; the second laser light path (7) is irradiated on the GaN target (21) through a second reflector (8), a second focusing lens (9) and a second laser window (10) respectively; the In target (22) and the GaN target (21) form an In/GaN double target (16), and the irradiated area of the surface of the In target is instantaneously ablated to generate plasma plume (18);
the deposition system comprises a deposition chamber (20), a sample introduction chamber (15), a target disc for mounting an In/GaN double target material (16) and a heater (19) for heating a p-Si substrate (17); a first laser window (6), a second laser window (10), an observation window (11), a motor (12), a vacuum system (13) and a sample inlet chamber (15) are arranged around the deposition chamber (20); wherein the motor (12) and the vacuum system (13) are arranged oppositely in parallel, and the observation window (11) and the sampling chamber (15) are arranged oppositely in parallel; the motor (12) is positioned in the middle of the first laser window (6) and the second laser window (10), and the shaft of the motor (12) is connected with the heater (19);
the target plate comprises a plate body, an annular vent pipe (23) and an air inlet pipe (24); the In/GaN double target (16) is arranged on the disc body and is surrounded by an annular vent pipe (23); the annular vent pipe (23) is communicated with the air inlet pipe (24), and a plurality of vent holes are uniformly formed in the periphery of the annular vent pipe (23);
the In/GaN double target (16) is formed by sleeving an annular GaN target (21) outside a circular In target (22).
3. The method of claim 2, wherein the method comprises: and a vacuum valve (14) is arranged in the sample inlet chamber (15).
4. The method of claim 2, wherein the method comprises: the pulse laser (1) is a KrF excimer laser.
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