CN111630646A - 焊料接合部 - Google Patents

焊料接合部 Download PDF

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Publication number
CN111630646A
CN111630646A CN201980003606.1A CN201980003606A CN111630646A CN 111630646 A CN111630646 A CN 111630646A CN 201980003606 A CN201980003606 A CN 201980003606A CN 111630646 A CN111630646 A CN 111630646A
Authority
CN
China
Prior art keywords
layer
alloy layer
boundary
content
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980003606.1A
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English (en)
Chinese (zh)
Inventor
日野英治
泽渡広信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN111630646A publication Critical patent/CN111630646A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201980003606.1A 2018-12-28 2019-08-07 焊料接合部 Pending CN111630646A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018248474 2018-12-28
JP2018-248474 2018-12-28
PCT/JP2019/031255 WO2020136979A1 (ja) 2018-12-28 2019-08-07 はんだ接合部

Publications (1)

Publication Number Publication Date
CN111630646A true CN111630646A (zh) 2020-09-04

Family

ID=71127139

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980003606.1A Pending CN111630646A (zh) 2018-12-28 2019-08-07 焊料接合部

Country Status (4)

Country Link
JP (1) JPWO2020136979A1 (ja)
CN (1) CN111630646A (ja)
TW (1) TWI717833B (ja)
WO (1) WO2020136979A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630251B1 (en) * 2002-09-23 2003-10-07 Delphi Technologies, Inc. Leach-resistant solder alloys for silver-based thick-film conductors
US20100213608A1 (en) * 2009-02-24 2010-08-26 Unisem Advanced Technologies Sdn. Bhd., a company incorporated in Malaysia Solder bump UBM structure
TW201222691A (en) * 2011-08-04 2012-06-01 Nippon Steel Materials Co Ltd Solder ball for semiconductor packaging and electronic member
CN103123916A (zh) * 2011-10-05 2013-05-29 富士通株式会社 半导体器件、电子器件以及半导体器件制造方法
TW201438124A (zh) * 2013-01-28 2014-10-01 Murata Manufacturing Co 焊劑凸塊之形成方法及焊劑凸塊
US20150091162A1 (en) * 2013-10-02 2015-04-02 Shinko Electric Industries Co., Ltd. Semiconductor device
CN105121677A (zh) * 2013-04-18 2015-12-02 千住金属工业株式会社 无铅软钎料合金
JP2018047497A (ja) * 2016-09-23 2018-03-29 住友金属鉱山株式会社 Ｂｉ基はんだ合金及びその製造方法、並びに、そのはんだ合金を用いた電子部品及び電子部品実装基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101076446A (zh) * 2003-08-06 2007-11-21 密执安州立大学 复合金属基体铸件和焊料组合物与方法
JP2011014705A (ja) * 2009-07-01 2011-01-20 Hitachi Ltd 半導体装置および半導体装置の製造方法
US10376997B2 (en) * 2016-06-23 2019-08-13 Purdue Research Foundation Transient liquid phase bonding process and assemblies formed thereby

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6630251B1 (en) * 2002-09-23 2003-10-07 Delphi Technologies, Inc. Leach-resistant solder alloys for silver-based thick-film conductors
US20100213608A1 (en) * 2009-02-24 2010-08-26 Unisem Advanced Technologies Sdn. Bhd., a company incorporated in Malaysia Solder bump UBM structure
TW201222691A (en) * 2011-08-04 2012-06-01 Nippon Steel Materials Co Ltd Solder ball for semiconductor packaging and electronic member
CN103123916A (zh) * 2011-10-05 2013-05-29 富士通株式会社 半导体器件、电子器件以及半导体器件制造方法
TW201438124A (zh) * 2013-01-28 2014-10-01 Murata Manufacturing Co 焊劑凸塊之形成方法及焊劑凸塊
US20150333027A1 (en) * 2013-01-28 2015-11-19 Murata Manufacturing Co., Ltd. Method of Forming Solder Bump, and Solder Bump
CN105121677A (zh) * 2013-04-18 2015-12-02 千住金属工业株式会社 无铅软钎料合金
US20150091162A1 (en) * 2013-10-02 2015-04-02 Shinko Electric Industries Co., Ltd. Semiconductor device
JP2018047497A (ja) * 2016-09-23 2018-03-29 住友金属鉱山株式会社 Ｂｉ基はんだ合金及びその製造方法、並びに、そのはんだ合金を用いた電子部品及び電子部品実装基板

Also Published As

Publication number Publication date
TWI717833B (zh) 2021-02-01
TW202039241A (zh) 2020-11-01
JPWO2020136979A1 (ja) 2021-09-09
WO2020136979A1 (ja) 2020-07-02

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Application publication date: 20200904