CN111630646A - 焊料接合部 - Google Patents
焊料接合部 Download PDFInfo
- Publication number
- CN111630646A CN111630646A CN201980003606.1A CN201980003606A CN111630646A CN 111630646 A CN111630646 A CN 111630646A CN 201980003606 A CN201980003606 A CN 201980003606A CN 111630646 A CN111630646 A CN 111630646A
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- CN
- China
- Prior art keywords
- layer
- alloy layer
- boundary
- content
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 62
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 187
- 239000000956 alloy Substances 0.000 claims abstract description 187
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 139
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 134
- 229910052802 copper Inorganic materials 0.000 claims abstract description 133
- 229910005887 NiSn Inorganic materials 0.000 claims abstract description 108
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 83
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 260
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 161
- 239000010949 copper Substances 0.000 claims description 129
- 239000011135 tin Substances 0.000 claims description 67
- 229910052718 tin Inorganic materials 0.000 claims description 14
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 16
- 238000005259 measurement Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 239000000843 powder Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000009545 invasion Effects 0.000 description 3
- 238000013507 mapping Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000905 alloy phase Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 description 1
- 229910017927 Cu—Sn Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000013213 extrapolation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- -1 hypophosphite ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018248474 | 2018-12-28 | ||
JP2018-248474 | 2018-12-28 | ||
PCT/JP2019/031255 WO2020136979A1 (ja) | 2018-12-28 | 2019-08-07 | はんだ接合部 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111630646A true CN111630646A (zh) | 2020-09-04 |
Family
ID=71127139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980003606.1A Pending CN111630646A (zh) | 2018-12-28 | 2019-08-07 | 焊料接合部 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2020136979A1 (ja) |
CN (1) | CN111630646A (ja) |
TW (1) | TWI717833B (ja) |
WO (1) | WO2020136979A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630251B1 (en) * | 2002-09-23 | 2003-10-07 | Delphi Technologies, Inc. | Leach-resistant solder alloys for silver-based thick-film conductors |
US20100213608A1 (en) * | 2009-02-24 | 2010-08-26 | Unisem Advanced Technologies Sdn. Bhd., a company incorporated in Malaysia | Solder bump UBM structure |
TW201222691A (en) * | 2011-08-04 | 2012-06-01 | Nippon Steel Materials Co Ltd | Solder ball for semiconductor packaging and electronic member |
CN103123916A (zh) * | 2011-10-05 | 2013-05-29 | 富士通株式会社 | 半导体器件、电子器件以及半导体器件制造方法 |
TW201438124A (zh) * | 2013-01-28 | 2014-10-01 | Murata Manufacturing Co | 焊劑凸塊之形成方法及焊劑凸塊 |
US20150091162A1 (en) * | 2013-10-02 | 2015-04-02 | Shinko Electric Industries Co., Ltd. | Semiconductor device |
CN105121677A (zh) * | 2013-04-18 | 2015-12-02 | 千住金属工业株式会社 | 无铅软钎料合金 |
JP2018047497A (ja) * | 2016-09-23 | 2018-03-29 | 住友金属鉱山株式会社 | Bi基はんだ合金及びその製造方法、並びに、そのはんだ合金を用いた電子部品及び電子部品実装基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101076446A (zh) * | 2003-08-06 | 2007-11-21 | 密执安州立大学 | 复合金属基体铸件和焊料组合物与方法 |
JP2011014705A (ja) * | 2009-07-01 | 2011-01-20 | Hitachi Ltd | 半導体装置および半導体装置の製造方法 |
US10376997B2 (en) * | 2016-06-23 | 2019-08-13 | Purdue Research Foundation | Transient liquid phase bonding process and assemblies formed thereby |
-
2019
- 2019-08-07 CN CN201980003606.1A patent/CN111630646A/zh active Pending
- 2019-08-07 JP JP2020502503A patent/JPWO2020136979A1/ja active Pending
- 2019-08-07 WO PCT/JP2019/031255 patent/WO2020136979A1/ja active Application Filing
- 2019-09-16 TW TW108133219A patent/TWI717833B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630251B1 (en) * | 2002-09-23 | 2003-10-07 | Delphi Technologies, Inc. | Leach-resistant solder alloys for silver-based thick-film conductors |
US20100213608A1 (en) * | 2009-02-24 | 2010-08-26 | Unisem Advanced Technologies Sdn. Bhd., a company incorporated in Malaysia | Solder bump UBM structure |
TW201222691A (en) * | 2011-08-04 | 2012-06-01 | Nippon Steel Materials Co Ltd | Solder ball for semiconductor packaging and electronic member |
CN103123916A (zh) * | 2011-10-05 | 2013-05-29 | 富士通株式会社 | 半导体器件、电子器件以及半导体器件制造方法 |
TW201438124A (zh) * | 2013-01-28 | 2014-10-01 | Murata Manufacturing Co | 焊劑凸塊之形成方法及焊劑凸塊 |
US20150333027A1 (en) * | 2013-01-28 | 2015-11-19 | Murata Manufacturing Co., Ltd. | Method of Forming Solder Bump, and Solder Bump |
CN105121677A (zh) * | 2013-04-18 | 2015-12-02 | 千住金属工业株式会社 | 无铅软钎料合金 |
US20150091162A1 (en) * | 2013-10-02 | 2015-04-02 | Shinko Electric Industries Co., Ltd. | Semiconductor device |
JP2018047497A (ja) * | 2016-09-23 | 2018-03-29 | 住友金属鉱山株式会社 | Bi基はんだ合金及びその製造方法、並びに、そのはんだ合金を用いた電子部品及び電子部品実装基板 |
Also Published As
Publication number | Publication date |
---|---|
TWI717833B (zh) | 2021-02-01 |
TW202039241A (zh) | 2020-11-01 |
JPWO2020136979A1 (ja) | 2021-09-09 |
WO2020136979A1 (ja) | 2020-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200904 |