CN111629572B - Self-adaptive flow adjusting method and device for liquid cooling cold plate of electronic equipment - Google Patents
Self-adaptive flow adjusting method and device for liquid cooling cold plate of electronic equipment Download PDFInfo
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- CN111629572B CN111629572B CN202010630992.1A CN202010630992A CN111629572B CN 111629572 B CN111629572 B CN 111629572B CN 202010630992 A CN202010630992 A CN 202010630992A CN 111629572 B CN111629572 B CN 111629572B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a flow self-adaptive adjusting device of a liquid cooling cold plate of electronic equipment, which relates to the technical field of cooling of the electronic equipment and specifically comprises the liquid cooling cold plate, a thermal expansion part and a flow channel, wherein the flow channel is formed in the liquid cooling cold plate, a liquid inlet is formed in the top of the flow channel on the upper surface of the liquid cooling cold plate, the bottom in the liquid inlet is provided with a throttling part, the thermal expansion part is arranged in the liquid cooling cold plate, the middle part of the side surface of the liquid inlet is communicated with the thermal expansion part through a second bypass branch pipe, the side surface of the flow channel is communicated with the thermal expansion part through a first bypass branch pipe, a temperature sensing cavity is formed in the liquid cooling cold plate, and the temperature sensing cavity is communicated with the thermal expansion part through the flow channel. When the liquid cooling plate is applied to a large-scale liquid cooling system, components such as an electric regulating valve and a temperature sensor do not need to be additionally arranged, only a thermal expansion component is added on the conventional cold plate structure, the self-adaptive change of the cross section area of a flow passage of the liquid cooling plate along with the temperature of an electronic device is realized, and the stability and the safety of the phase change cooling system are improved.
Description
Technical Field
The invention relates to the technical field of electronic equipment cooling, in particular to a self-adaptive flow adjusting method and device for a liquid cooling plate of electronic equipment.
Background
With the development of electronic technology and the increasing application demand, the integration level and power density of electronic devices have increased significantly, and in many applications, the heat dissipation capability of electronic devices has become one of the bottlenecks that restrict the performance of electronic devices. At present, the common cooling means is mainly forced air cooling heat dissipation, and the heat dissipation efficiency is low, so that the increasingly severe heat dissipation requirements of electronic equipment are difficult to meet. Liquid cooling technology, especially phase change cooling technology, has recently been rapidly developed and applied because of its advantages of high heat dissipation efficiency, compact heat dissipation structure, high energy efficiency ratio, no noise pollution, etc.
For large liquid cooling systems, the cooling pipe network is typically made up of multiple parallel branches. When the thermal load on each branch is different, the proper cooling flow needs to be matched according to the heating value of the branch in the design process of the pipe network, so that the heat dissipation requirement is met, and the utilization efficiency of the liquid cooling resource is improved. However, in some application scenarios, the branch heat load of the cooling system fluctuates greatly, and after the heat load changes, the cooling system is required to be capable of rapidly adjusting the flow of each branch so as to meet new heat dissipation requirements.
For a phase change cooling system, when a multi-parallel branch system is in operation, particularly when the thermal load of electronic equipment is changed, the phenomenon of flow distribution fluctuation is very easy to occur, when the cooling flow of a certain branch is reduced, a heating device is not fully cooled, the temperature of the device is rapidly increased, and temperature runaway can cause the drying by distillation of a cooling medium in a cooling channel or even form an air plug, so that the inflow of a subsequent cooling medium is blocked, the heat transfer deterioration of the branch is further aggravated, and the safety of the electronic equipment is seriously harmed.
Above two kinds of condition all need when the branch road state changes, in time adjust the branch road flow and satisfy the heat dissipation demand. At present, a common flow regulation mode is that a flow regulation valve (usually an electric regulation valve) is arranged on a branch, and the flow of each branch is redistributed by regulating the opening of the valve. The principle of the method is simple, but the system is complex in equipment, a plurality of actuating mechanisms are arranged, and the economy and the reliability of the cooling system are reduced.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a method and a device for adaptively adjusting the flow of a liquid cooling cold plate of electronic equipment, which realize the adaptive adjustment of the flow of the cold plate along with the temperature through a thermal expansion part, meet the dynamic flow adjustment requirement when the heat load of a local branch changes in a large liquid cooling system, particularly solve the problem of heat transfer deterioration caused by branch flow distribution fluctuation in a phase-change cooling system, ensure the effective cooling of the electronic equipment of each branch, and improve the stability and the safety of the cooling system.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a flow self-adaptation adjusting device of electronic equipment liquid cooling cold plate, includes liquid cooling cold plate, thermal expansion part and runner, set up the runner in the liquid cooling cold plate, the inlet has been seted up at the upper surface of liquid cooling cold plate at the top of runner, and the bottom sets up the throttling component in the inlet, and thermal expansion part installs in the liquid cooling cold plate, and the side middle part of inlet passes through second bypass branch pipe and thermal expansion part intercommunication, and the side of runner is through first bypass branch pipe and thermal expansion part intercommunication, and the temperature sensing chamber is seted up to liquid cooling cold plate inside, and the temperature sensing chamber passes through passageway and thermal expansion part intercommunication.
As a further scheme of the invention: the throttling component is a circular plate with a round hole in the middle.
As a further scheme of the invention: the top of the channel is provided with a flushing port, and a valve is arranged at the flushing port.
As a further scheme of the invention: the thermal expansion part comprises an expander main body, a metal membrane, a pushing cushion block, a connecting through hole, a transmission rod, a sealing ring, a valve block, a spring and a partition plate, wherein a plurality of sealing rings are uniformly arranged between the outside of the expander main body and a liquid cooling cold plate, the metal membrane is fixed in the expander main body, a cavity is formed in the part of the expander main body above the metal membrane, the connecting through hole is formed in the side surface of the cavity and communicated with a channel through the connecting through hole, an inner cavity is formed in the bottom of the expander main body, the partition plate integrally formed with the expander main body is arranged in the middle of the inner cavity, the circular truncated cone-shaped valve block is slidably mounted in the middle of the partition plate, the bottom surface of the valve block is fixedly connected with the top end of the spring, the bottom end of the spring is fixedly connected with the bottom surface of the cavity in the expander main body, the bottom of the metal membrane is fixedly connected with the pushing cushion block, and the transmission rod is fixed at the bottom of the pushing cushion block, the bottom end of the transmission rod is fixedly connected with the top surface of the valve plate.
As a further scheme of the invention: and the cavity above the isolating plate is communicated with the liquid inlet through a second bypass branch pipe, and the cavity below the isolating plate is communicated with the flow channel through a first bypass branch pipe.
A working method of a flow self-adaptive adjusting device of a liquid cooling plate of electronic equipment is provided, when the heat productivity of an electronic device arranged on the liquid cooling plate is increased, the temperature of a temperature sensing cavity is increased, the pressure inside the thermal expansion part is increased, the metal diaphragm in the thermal expansion part is subjected to downward pressure, the metal diaphragm finally enables the valve block to move downwards by pushing the cushion block and the transmission rod, a gap is formed between the valve block and the isolating plate after the valve block moves downwards, so that cooling media can enter the flow channel through the first bypass branch and the second bypass branch, the flow area between the flow channel and the liquid inlet is increased, the flow of the cooling media of the liquid cooling plate is supplemented at the moment, the cooling capacity is enhanced, the temperature of a heating device is reduced along with the temperature, the pressure in the temperature sensing cavity is reduced, the valve block moves upwards under the action of the spring force to reset, the valve block and the isolating plate are closed, and the flow of the cooling plate is recovered to be normal.
Compared with the prior art, the invention has the beneficial effects that: when using in large-scale liquid cooling system, need not additionally to increase parts such as electrical control valve, temperature sensor, only increase thermal expansion part on current conventional cold drawing structure, can realize following effect:
1) the cross section area of a flow passage of the liquid cooling plate is adaptively changed along with the temperature of the electronic device, so that the flow distribution requirement when the branch heat load of the liquid cooling system is dynamically changed is met;
2) the temperature fly-up caused by the unstable local branch flow of the phase change cooling system is effectively avoided, the cooling flow of the branch is increased when the branch has a heat transfer deterioration trend, and the stability and the safety of the phase change cooling system are improved.
Drawings
Fig. 1 is a schematic structural diagram of a flow adaptive regulator of a liquid cooling plate of an electronic device.
Fig. 2 is a cross-sectional view of a flow adaptive regulator of a liquid cooling plate of an electronic device.
Fig. 3 is a schematic structural diagram of a thermal expansion part in a flow adaptive regulator of a liquid cooling cold plate of an electronic device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, in the embodiment of the present invention, a flow adaptive regulator of a liquid cooling plate of an electronic device includes a liquid cooling plate 1, a thermal expansion unit 3 and a flow channel 7, a flow channel 7 is formed in the liquid cooling plate 1, a liquid inlet 10 is formed in the top of the flow channel 7 on the upper surface of the liquid cooling plate 1, a throttling unit 2 is arranged at the bottom in the liquid inlet 10, the throttling unit 2 is a circular plate with a circular hole in the middle, the thermal expansion unit 3 is installed in the liquid cooling plate 1, the middle of the side surface of the liquid inlet 10 is communicated with the thermal expansion unit 3 through a second bypass branch pipe 9, the side surface of the flow channel 7 is communicated with the thermal expansion unit 3 through a first bypass branch pipe 8, a temperature sensing cavity 6 is formed in the liquid cooling plate 1, the temperature sensing cavity 6 is located near a heating device installed on the liquid cooling plate 1, the temperature sensing cavity 6 is communicated with the thermal expansion unit 3 through a channel 5, the top of the channel 5 is provided with an injection port 4, a valve is arranged at the flushing port 4, and a refrigerant is conveniently injected into the channel 5 and the temperature sensing cavity 6 through the flushing port 4, so that the conversion effect between temperature and pressure is realized;
the thermal expansion part 3 consists of an expander main body 3-1, a metal diaphragm 3-2, a pushing cushion block 3-3, a connecting through hole 3-4, a transmission rod 3-5, a sealing ring 3-6, a valve block 3-7, a spring 3-8 and an isolating plate 3-9, wherein a plurality of sealing rings 3-6 are uniformly arranged between the outside of the expander main body 3-1 and the liquid cooling plate 1, the metal diaphragm 3-2 is fixed inside the expander main body 3-1, a cavity is arranged at the part of the expander main body 3-1 above the metal diaphragm 3-2, the connecting through hole 3-4 is arranged on the side surface of the cavity and is communicated with the channel 5 through the connecting through hole 3-4, an inner cavity is arranged at the bottom of the expander main body 3-1, the isolating plate 3-9 which is integrally formed with the expander main body 3-1 is arranged in the middle of the inner cavity, the cavity above the isolation plate 3-9 is communicated with the liquid inlet 10 through a second bypass branch pipe 9, the cavity below the isolation plate 3-9 is communicated with the flow passage 7 through a first bypass branch pipe 8, the middle part of the isolation plate 3-9 is slidably provided with a circular truncated cone-shaped valve block 3-7, the bottom surface of the valve block 3-7 is fixedly connected with the top end of the spring 3-8, the bottom end of the spring 3-8 is fixedly connected with the bottom surface of the cavity in the expander main body 3-1, the middle part of the partition plate 3-9 is blocked and sealed by the valve plate 3-7 through the elasticity of the spring 3-8, the bottom of the metal diaphragm 3-2 is fixedly connected with the pushing cushion block 3-3, the bottom of the pushing cushion block 3-3 is fixedly provided with the transmission rod 3-5, and the bottom end of the transmission rod 3-5 is fixedly connected with the top surface of the valve plate 3-7.
The working method of the flow self-adaptive adjusting device of the liquid cooling cold plate of the electronic equipment is as follows: when the heat productivity of an electronic device arranged on the liquid cooling cold plate 1 is increased, the temperature of the temperature sensing cavity 6 is increased, the pressure in the temperature sensing cavity is increased, the metal diaphragm 3-2 in the thermal expansion part 3 is subjected to downward pressure, the metal diaphragm 3-2 finally enables the valve block 3-7 to move downwards by pushing the cushion block 3-3 and the transmission rod 3-5, a gap is generated between the valve block 3-7 and the isolation plate 3-9 after moving downwards, so that a cooling medium can enter the flow channel 7 through the first bypass branch 8 and the second bypass branch 9, which is equivalent to increasing the flow area between the flow channel 7 and the liquid inlet 10, at the moment, the flow of the cooling medium of the liquid cooling cold plate 1 is supplemented, the cooling capacity is enhanced, the temperature of the heating device is reduced, the pressure in the temperature sensing cavity 6 is reduced, and the valve block 3-7 moves upwards to reset under the action of the spring 3-8, the valve plates 3-7 and the partition plates 3-9 are closed, and the flow of the cold plate is recovered to be normal.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof.
Claims (6)
1. A flow self-adaptive regulator of a liquid cooling plate of electronic equipment comprises the liquid cooling plate (1), a thermodynamic expansion part (3) and a flow passage (7), it is characterized in that a flow channel (7) is arranged in the liquid cooling cold plate (1), a liquid inlet (10) is arranged at the top of the flow channel (7) and on the upper surface of the liquid cooling cold plate (1), a throttling part (2) is arranged at the bottom in the liquid inlet (10), a thermal expansion part (3) is arranged in the liquid cooling cold plate (1), and the middle part of the side surface of the liquid inlet (10) is communicated with the thermal expansion part (3) through a second bypass branch pipe (9), the side surface of the flow channel (7) is communicated with the thermal expansion part (3) through a first bypass branch pipe (8), a temperature sensing cavity (6) is formed in the liquid cooling cold plate (1), and the temperature sensing cavity (6) is communicated with the thermal expansion part (3) through a channel (5).
2. The adaptive flow regulator for liquid cooling plates of electronic equipment as claimed in claim 1, wherein said throttling member (2) is a circular plate with a circular hole in the middle.
3. The self-adaptive flow regulator for liquid-cooled cold plates of electronic equipment according to claim 1, wherein the top of the channel (5) is provided with a flushing port (4), and a valve is arranged at the flushing port (4).
4. The self-adaptive flow regulating device of the liquid cooling plate of the electronic equipment according to claim 1, characterized in that the thermal expansion part (3) is composed of an expander main body (3-1), a metal membrane (3-2), a pushing cushion block (3-3), a connecting through hole (3-4), a transmission rod (3-5), a sealing ring (3-6), a valve plate (3-7), a spring (3-8) and a separation plate (3-9), wherein a plurality of sealing rings (3-6) are uniformly arranged between the outside of the expander main body (3-1) and the liquid cooling plate (1), the metal membrane (3-2) is fixed inside the expander main body (3-1), and a cavity is formed in the part of the expander main body (3-1) above the metal membrane (3-2), the side surface of the cavity is provided with a connecting through hole (3-4) and is communicated with the channel (5) through the connecting through hole (3-4), the bottom of the expander main body (3-1) is provided with an inner cavity, the middle of the inner cavity is provided with a separation plate (3-9) which is integrally formed with the expander main body (3-1), the middle of the separation plate (3-9) is provided with a circular truncated cone-shaped valve plate (3-7) in a sliding mode, the bottom surface of the valve plate (3-7) is fixedly connected with the top end of a spring (3-8), the bottom end of the spring (3-8) is fixedly connected with the bottom surface of the cavity in the expander main body (3-1), the bottom of the metal membrane (3-2) is fixedly connected with a pushing cushion block (3-3), the bottom of the pushing cushion block (3-3) is fixedly connected with a transmission rod (3-5), and the bottom end of the transmission rod (3-5) is fixedly connected with the top surface of the valve plate (3-7).
5. The adaptive flow regulator for liquid cooling plates of electronic equipment as claimed in claim 4, wherein the cavity above the partition plate (3-9) is connected to the liquid inlet (10) through a second bypass branch pipe (9), and the cavity below the partition plate (3-9) is connected to the flow channel (7) through a first bypass branch pipe (8).
6. A working method of a flow self-adaptive adjusting device of a liquid cooling cold plate of electronic equipment is characterized in that when the heat productivity of an electronic device arranged on the liquid cooling cold plate (1) is increased, the temperature of a temperature sensing cavity (6) is increased, the pressure in the temperature sensing cavity is increased, a metal membrane (3-2) in a thermal expansion part (3) is subjected to downward pressure, the metal membrane (3-2) finally enables a valve plate (3-7) to move downwards by pushing a cushion block (3-3) and a transmission rod (3-5), a gap is generated between the valve plate (3-7) and an isolating plate (3-9) after the valve plate (3-7) moves downwards, so that cooling media can enter a flow channel (7) through a first bypass branch (8) and a second bypass branch (9) to increase the flow area between the flow channel (7) and a liquid inlet (10), and the flow of the cooling media of the liquid cooling cold plate (1) is supplemented at the moment, the cooling capacity is enhanced, the temperature of the heating device is reduced along with the temperature reduction, the pressure in the temperature sensing cavity (6) is reduced, the valve plates (3-7) move upwards to reset under the action of the springs (3-8), the valve plates (3-7) and the partition plates (3-9) are closed, and the flow of the cold plate is recovered to be normal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010630992.1A CN111629572B (en) | 2020-07-03 | 2020-07-03 | Self-adaptive flow adjusting method and device for liquid cooling cold plate of electronic equipment |
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| CN202010630992.1A CN111629572B (en) | 2020-07-03 | 2020-07-03 | Self-adaptive flow adjusting method and device for liquid cooling cold plate of electronic equipment |
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| CN111629572B true CN111629572B (en) | 2022-08-05 |
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| CN113359090B (en) * | 2021-05-21 | 2024-02-09 | 中国电子科技集团公司第十四研究所 | Accurate flow distribution device for large-size liquid cooling panel |
| TWI808532B (en) * | 2021-11-10 | 2023-07-11 | 英業達股份有限公司 | Cooling liquid flow control device |
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| CN106973550B (en) * | 2017-04-11 | 2023-07-25 | 中国科学院理化技术研究所 | Open type controllable flow phase-change cooling system and control method thereof |
| CN109041537B (en) * | 2018-08-30 | 2019-06-14 | 西安电子科技大学 | A kind of the self-regulation runner cold plate and self-adjusting method of marmem driving |
| CN110113913B (en) * | 2019-04-09 | 2020-11-13 | 惠州市德赛西威智能交通技术研究院有限公司 | Liquid cooling structure and liquid cooling system of heat source device in car |
| CN109888436A (en) * | 2019-04-12 | 2019-06-14 | 中国电子科技集团公司第三十八研究所 | In conjunction with the integrated cold plate battery heat control system of phase-change material |
| CN210051018U (en) * | 2019-05-07 | 2020-02-11 | 百尔制冷(无锡)有限公司 | Double-stage compressor refrigerating system sharing intercooler |
| CN110351980A (en) * | 2019-06-21 | 2019-10-18 | 加弘科技咨询(上海)有限公司 | A kind of liquid cold plate device |
| CN111010846B (en) * | 2019-11-13 | 2021-01-29 | 珠海格力电器股份有限公司 | Heat exchanger substrate of plate-type frequency converter, heat exchanger, frequency converter and automatic temperature adjusting method of frequency converter |
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