CN213482726U - Thermal control structure of space application servo controller - Google Patents

Thermal control structure of space application servo controller Download PDF

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CN213482726U
CN213482726U CN202022685590.XU CN202022685590U CN213482726U CN 213482726 U CN213482726 U CN 213482726U CN 202022685590 U CN202022685590 U CN 202022685590U CN 213482726 U CN213482726 U CN 213482726U
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base
heat
servo controller
apron
mounting
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陈叶
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Beijing Gaokong Technology Co ltd
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Beijing Gaokong Technology Co ltd
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Abstract

The utility model discloses a servo controller's thermal control structure is used in space, including apron and base, the heater strip is all installed at the both ends of the inside bottom of base, and the inside orifice plate that transversely installs of base of heater strip top, the intermediate position department on orifice plate top installs the elastic frame, and the top of elastic frame transversely installs the circuit board, heat radiation structure evenly sets up the upper end in the base both sides, the top of base transversely is provided with the apron, and the mounting structure all sets up four corners in the apron bottom, the singlechip is installed to one side on the inside top of apron, and the opposite side on the inside top of apron installs temperature sensor, thermal-insulated structure all sets up the surface at apron and base. The utility model discloses a set up heater strip and thermovent, utilize the two to be convenient for heat or dispel the heat to base inside, guarantee the inside constancy of temperature of base, and then guarantee the suitable operating temperature of circuit board.

Description

Thermal control structure of space application servo controller
Technical Field
The utility model relates to an electronic circuit temperature control technical field specifically is a servo controller's thermal control structure is used in space.
Background
With the development of society and the continuous progress of science and technology in China, the understanding of outer space is deeper and deeper, and a servo controller is very important in the space exploration process, but because the environment of the outer space is severe, the servo controller is not ideal in work, so a thermal control structure is needed to improve a proper temperature environment for the servo controller, but the thermal control structure of the traditional space application servo controller has many problems or defects:
first, servo controller's thermal control structure is used in traditional space does not have the easy access structure during the use, and the structure is opened comparatively inconveniently, and is inconvenient overhauld its inside device.
Second, the thermal control structure of the conventional spatial application servo controller has no thermal insulation structure during use, and the temperature inside and outside the structure cannot be well isolated.
Thirdly, the traditional thermal control structure of the space application servo controller is inconvenient to regulate and control temperature during use, and the temperature inside the structure cannot be well regulated, so that the service life of the servo controller is prolonged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a servo controller's thermal control structure is used in space to solve the inconvenient problem of overhauing, inconvenient thermal-insulated and inconvenient regulation and control temperature that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a thermal control structure of a space application servo controller comprises a cover plate, a base, a heat insulation structure for isolating the temperature difference between the inside and the outside, an installation structure for facilitating the maintenance of internal devices and a heat dissipation structure for facilitating the rapid regulation and control;
heating wires are mounted at two ends of the bottom end inside the base, a pore plate is transversely mounted inside the base above the heating wires, an elastic frame is mounted in the middle of the top end of the pore plate, a circuit board is transversely mounted at the top end of the elastic frame, and the heat dissipation structures are uniformly arranged at the upper ends of two sides of the base;
a cover plate is transversely arranged at the top end of the base, and the mounting structures are arranged at four corners of the bottom end of the cover plate;
the single-chip microcomputer is installed to one side on the inside top of apron, and the opposite side on the inside top of apron installs temperature sensor, thermal-insulated structure all sets up the surface at apron and base.
Preferably, heat radiation structure includes the thermovent, the thermovent is evenly seted up in the upper end of base both sides, and the inside regulation and control case that all installs of base of thermovent one side upper end and lower extreme, reset spring is all installed at the inside both ends that are close to thermovent one side of regulation and control case, and the inside fly leaf that all installs of regulation and control case of reset spring one side, the expansion piece is all installed to the regulation and control incasement portion of fly leaf one side, and all installs on one side of the fly leaf and extend to the inside connecting rod of thermovent, the inside equal sliding connection of thermovent of connecting rod one side has sealed piece, and one side of sealed piece all installs the baffle.
Preferably, thermal-insulated structure includes heated board, heat insulating board, arc arch and arc recess, the arc recess is all installed on the surface of apron and base, and the arc arch is evenly installed to the inside one end of arc recess, the heated board is all installed on the surface of arc recess, and the inside one end of heated board evenly seted up with the protruding matched with arc recess of arc.
Preferably, a sealing ring is installed around the bottom end of the cover plate, and the coverage area of the cross section of the sealing ring is equal to the area of the cross section of the base.
Preferably, the mounting structure includes pull rod, tongue, installation spring, installation piece, mounting hole, draw-in groove and fixture block, the fixture block is all installed to four corners of apron bottom, and the mounting hole has all been seted up to the upper end of the inside one side of fixture block, four corners on the inside top of base all seted up with fixture block matched with draw-in groove, and the inside tongue of having all seted up of base of draw-in groove one side, the tongue is inside all to be provided with to extend to the outside pull rod of base, and the tongue on pull rod surface is inside all to be twined there is the installation spring, the installation piece with mounting hole matched with is all installed to pull rod one side.
Preferably, the heating wires are all in a U-shaped tube structure, and are symmetrically distributed around the transverse central axis of the base.
Preferably, the top and the bottom of the inside one side of regulation and control case have all transversely seted up the spout, and the equal sliding connection in inside of spout has the slider, slider one end all welds with the both ends of fly leaf.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) by arranging the cover plate, the sealing ring and the mounting structure, when the circuit board needs to be overhauled, the pull rod can be pulled to drive the mounting block to move to be completely separated from the mounting hole, then the cover plate is pulled to enable the mounting block and the mounting hole to be separated from each other, so that the cover plate is quickly opened, the interior of the circuit board is convenient to overhaul, the trouble of opening in the traditional mode is avoided, the overhauling difficulty of workers is reduced, the working efficiency is convenient to improve, and meanwhile, the sealing performance between the cover plate and the base can be improved by utilizing the sealing ring during mounting, and the leakage of heat inside the base is reduced;
(2) by arranging the heat insulation structure, when cold and heat are transmitted to the device, the heat insulation plate can well isolate the cold and heat transmission effect, and the arc-shaped bulge and the arc-shaped groove are arranged, so that the transmitted cold and heat are irregularly reflected to be mutually interfered, the cold and heat isolation effect of the device is further improved, the influence of the outside on the internal temperature of the base is reduced, the interference resistance of the device is improved, the energy loss of temperature to be regulated is reduced, and the normal working temperature of the circuit board is ensured;
(3) by arranging the heating wires and the heat dissipation ports, when the temperature is lower than the set value of the temperature sensor, the temperature sensor transmits signals to the singlechip, further controlling the heating wire to work, so as to be convenient for increasing the temperature in the base, and controlling the heating wire to stop working when the temperature is higher than the set value of the temperature sensor, at the same time, the temperature will make the expansion piece expand by heating, and then drive the movable plate to move until the connecting rod pushes the sealing block for a distance, then the heat in the temperature sensor can be discharged out through the heat dissipation port, thereby facilitating the rapid heat dissipation, after the temperature is recovered, the sealing block is recovered to the original position under the action of the elastic force of the return spring to block the heat dissipation port, therefore, the sealing of the device is realized, the proper working temperature of the circuit board is ensured, the normal work of the circuit board is further ensured, and safety accidents caused by temperature change are avoided.
Drawings
Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;
fig. 2 is a schematic side view of the cross-sectional structure of the present invention;
fig. 3 is a schematic top view of the cross-sectional structure of the present invention;
fig. 4 is an enlarged schematic view of a portion a of fig. 1 according to the present invention;
fig. 5 is an enlarged schematic structural view of the mounting structure of the present invention.
In the figure: 1. a thermally insulating structure; 101. a thermal insulation board; 102. a heat insulation plate; 103. an arc-shaped bulge; 104. an arc-shaped groove; 2. a cover plate; 3. a temperature sensor; 4. a single chip microcomputer; 5. a seal ring; 6. a mounting structure; 601. A pull rod; 602. a convex groove; 603. installing a spring; 604. mounting blocks; 605. mounting holes; 606. a card slot; 607. a clamping block; 7. an elastic frame; 8. heating wires; 9. a base; 10. an orifice plate; 11. a circuit board; 12. A heat dissipation port; 13. a baffle plate; 14. a sealing block; 15. a return spring; 16. a connecting rod; 17. a movable plate; 18. an expansion member; 19. a slider; 20. a chute; 21. and a regulating and controlling box.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1: referring to fig. 1-5, a thermal control structure of a space application servo controller includes a cover plate 2 and a base 9, and further includes a thermal insulation structure 1 for isolating the temperature difference between the inside and the outside, an installation structure 6 for facilitating maintenance of internal devices, and a heat dissipation structure for facilitating rapid regulation and control;
heating wires 8 are mounted at two ends of the bottom end inside the base 9, the type of the heating wires 8 can be TXW-DRX, a pore plate 10 is transversely mounted inside the base 9 above the heating wires 8, an elastic frame 7 is mounted in the middle of the top end of the pore plate 10, a circuit board 11 is transversely mounted at the top end of the elastic frame 7, and heat dissipation structures are uniformly arranged at the upper ends of two sides of the base 9;
the top end of the base 9 is transversely provided with a cover plate 2, and the mounting structures 6 are arranged at four corners of the bottom end of the cover plate 2;
a single chip microcomputer 4 is installed on one side of the top end inside the cover plate 2, the type of the single chip microcomputer 4 can be STM32F103RCT6, a temperature sensor 3 is installed on the other side of the top end inside the cover plate 2, the type of the temperature sensor 3 can be TS200, and the heat insulation structures 1 are all arranged on the surfaces of the cover plate 2 and the base 9;
referring to fig. 1-5, a thermal control structure of a space application servo controller further includes a heat dissipation structure, the heat dissipation structure includes a heat dissipation port 12, the heat dissipation port 12 is uniformly formed at the upper ends of two sides of a base 9, a control box 21 is mounted inside the base 9 at the upper end and the lower end of one side of the heat dissipation port 12, a return spring 15 is mounted at each end of one side of the control box 21 close to the heat dissipation port 12, a movable plate 17 is mounted inside the control box 21 at one side of the return spring 15, an expansion member 18 is mounted inside the control box 21 at one side of the movable plate 17, a connecting rod 16 extending to the inside of the heat dissipation port 12 is mounted at one side of the movable plate 17, a sealing block 14 is slidably connected inside the heat dissipation port 12 at one side of the connecting rod 16, and a baffle 13 is mounted;
the heating wires 8 are all in a U-shaped pipe structure, and the heating wires 8 are symmetrically distributed around the transverse central axis of the base 9;
the top end and the bottom end of one side inside the regulating and controlling box 21 are both transversely provided with sliding grooves 20, the insides of the sliding grooves 20 are both connected with sliding blocks 19 in a sliding manner, and one ends of the sliding blocks 19 are both welded with the two ends of the movable plate 17;
specifically, as shown in fig. 1, 2 and 4, when the temperature is lower than the set value of the temperature sensor 3, the temperature sensor 3 transmits a signal to the single chip 4 to control the operation of the heating wire 8, and the U-shaped heating wire 8 can increase the heating area to facilitate the temperature rise inside the base 9, and when the temperature is higher than the set value of the temperature sensor 3, the heating wire 8 is controlled to stop operating, and the temperature can cause the expansion member 18 to expand by heating, and then the movable plate 17 is driven to move until the connecting rod 16 pushes the sealing block 14 for a distance, and then the heat inside the temperature sensor 3 can be discharged through the heat dissipating port 12, thereby facilitating the rapid heat dissipation, and when the temperature recovers, the sealing block 14 recovers to the original position under the elastic force of the reset spring 15, and the heat dissipating port 12 is blocked, thereby achieving the sealing of the device and ensuring the proper operating temperature of the circuit board 11, and at the same time, the sliding of the sliding block 19 in the sliding groove 20 ensures the smooth movement of the movable plate 17.
Example 2: the heat insulation structure 1 comprises a heat insulation plate 101, a heat insulation plate 102, arc-shaped protrusions 103 and arc-shaped grooves 104, wherein the arc-shaped grooves 104 are all arranged on the surfaces of the cover plate 2 and the base 9, the arc-shaped protrusions 103 are evenly arranged at one end inside the arc-shaped grooves 104, the heat insulation plate 101 is arranged on the surface of the arc-shaped grooves 104, and the arc-shaped grooves 104 matched with the arc-shaped protrusions 103 are evenly arranged at one end inside the heat insulation plate 101;
specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 5, when cold and heat are transferred to the device, the heat insulation plate 102 can isolate the cold and heat transfer effect well, and the arc protrusion 103 and the arc groove 104 are arranged at the same time, so that the cold and heat transferred are reflected irregularly, and are interfered with each other, thereby further improving the isolated cold and heat transfer effect of the device, reducing the external influence on the internal temperature of the base 9, and improving the anti-interference performance of the device.
Example 3: a sealing ring 5 is arranged on the periphery of the bottom end of the cover plate 2, and the coverage area of the cross section of the sealing ring 5 is equal to the area of the cross section of the base 9;
the mounting structure 6 comprises a pull rod 601, convex grooves 602, mounting springs 603, mounting blocks 604, mounting holes 605, clamping grooves 606 and clamping blocks 607, the clamping blocks 607 are mounted at four corners of the bottom end of the cover plate 2, the mounting holes 605 are formed in the upper ends of one side inside the clamping blocks 607, the clamping grooves 606 matched with the clamping blocks 607 are formed in four corners of the top end inside the base 9, the convex grooves 602 are formed in the base 9 on one side of the clamping grooves 606, the pull rod 601 extending to the outside of the base 9 is arranged inside the convex grooves 602, the mounting springs 603 are wound inside the convex grooves 602 on the surface of the pull rod 601, and the mounting blocks 604 matched with the mounting holes 605 are mounted on one side of the pull rod 601;
specifically, as shown in fig. 1, 2 and 5, the pull rod 601 is pulled to drive the mounting block 604 to move to completely separate from the mounting hole 605, and then the cover plate 2 is pulled, so that the mounting block 604 and the mounting hole 605 are separated from each other, and the cover plate 2 is rapidly opened, thereby facilitating the maintenance of the interior of the cover plate 2, and during installation, the sealing ring 5 is utilized to improve the sealing performance between the cover plate 2 and the base 9 and reduce the leakage of heat inside the base 9.
The output end of the singlechip 4 is electrically connected with the input end of the heating wire 8 through a wire, and the output end of the singlechip 4 is electrically connected with the input end of the temperature sensor 3.
The working principle is as follows: when the device is used, the device is installed, the heat insulation performance of the device is improved by the aid of the heat insulation plate 101, and meanwhile, when cold and heat are transmitted to the device, the heat insulation plate 102 can well isolate the cold and heat transmission effect, and meanwhile, the arc-shaped protrusions 103 and the arc-shaped grooves 104 are arranged, so that the transmitted cold and heat are irregularly reflected to interfere with each other, the isolated cold and heat transmission effect of the device is further improved, and the influence of the outside on the internal temperature of the base 9 is reduced;
meanwhile, the temperature sensor 3 is arranged to monitor the temperature inside the base 9 in real time, when the temperature is lower than the set value of the temperature sensor 3, the temperature sensor 3 transmits a signal to the single chip microcomputer 4 to control the heating wire 8 to work, meanwhile, the heating wire 8 of the U-shaped pipe can increase the heating area to facilitate rapid heating, when the temperature is higher than the set value of the temperature sensor 3, the heating wire 8 is controlled to stop working, meanwhile, the temperature can cause the expansion piece 18 to expand by heating and then drive the movable plate 17 to move to compress the return spring 15, when the expansion piece 18 expands to a certain degree, the connecting rod 16 can move to push the sealing block 14 for a certain distance through the movable plate 17, then the heat inside the temperature sensor 3 can be discharged outwards through the heat-dissipating port 12 to facilitate rapid heat dissipation, and when the temperature is restored, the sealing block 14 is restored to the, the heat dissipation port 12 is blocked, so that the device is sealed, and the proper working temperature of the circuit board 11 is ensured;
when circuit board 11 needs to be overhauled, pull rod 601 can be pulled, installation piece 604 removes compression installation spring 603 and breaks away from mounting hole 605 completely, pulls apron 2 again, makes installation piece 604 and mounting hole 605 alternate segregation, and then opens apron 2 fast, is convenient for overhaul its inside, and during the installation, utilizes sealing washer 5, can improve the leakproofness between apron 2 and the base 9, reduces the inside thermal leakage of base 9.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. A thermal control structure of a space application servo controller comprises a cover plate (2) and a base (9), and is characterized in that: the heat-insulation structure also comprises a heat-insulation structure (1) for isolating the temperature difference between the inside and the outside, an installation structure (6) for facilitating the maintenance of internal devices and a heat-dissipation structure for facilitating the rapid regulation and control;
heating wires (8) are mounted at two ends of the bottom end inside the base (9), a pore plate (10) is transversely mounted inside the base (9) above the heating wires (8), an elastic frame (7) is mounted in the middle of the top end of the pore plate (10), a circuit board (11) is transversely mounted at the top end of the elastic frame (7), and the heat dissipation structures are uniformly arranged at the upper ends of two sides of the base (9);
the top end of the base (9) is transversely provided with a cover plate (2), and the mounting structures (6) are arranged at four corners of the bottom end of the cover plate (2);
singlechip (4) are installed to one side on the inside top of apron (2), and temperature sensor (3) are installed to the opposite side on the inside top of apron (2), thermal-insulated structure (1) all sets up the surface at apron (2) and base (9).
2. The thermal control structure of a space application servo controller according to claim 1, wherein: the heat radiation structure comprises a heat radiation port (12), the upper end of both sides of a base (9) is uniformly arranged at the heat radiation port (12), a regulation and control box (21) is arranged inside the base (9) at the upper end of one side of the heat radiation port (12) and at the lower end of the one side of the heat radiation port (12), a reset spring (15) is arranged at each of two ends of one side of the heat radiation port (12) inside the regulation and control box (21), a movable plate (17) is arranged inside the regulation and control box (21) on one side of the reset spring (15), an expansion piece (18) is arranged inside the regulation and control box (21) on one side of the movable plate (17), a connecting rod (16) extending to the inside of the heat radiation port (12) is arranged on one side of the movable plate (17), a sealing block (14) is connected inside the heat radiation port (12) on one side of the connecting.
3. The thermal control structure of a space application servo controller according to claim 1, wherein: thermal-insulated structure (1) is including heated board (101), heat insulating board (102), arc arch (103) and arc recess (104), arc recess (104) are all installed on the surface of apron (2) and base (9), and arc arch (103) are evenly installed to the inside one end of arc recess (104), heated board (101) are all installed on the surface of arc recess (104), and heated board (101) inside one end evenly seted up with arc arch (103) matched with arc recess (104).
4. The thermal control structure of a space application servo controller according to claim 1, wherein: and sealing rings (5) are arranged around the bottom end of the cover plate (2), and the coverage area of the cross section of each sealing ring (5) is equal to the area of the cross section of the base (9).
5. The thermal control structure of a space application servo controller according to claim 1, wherein: the mounting structure (6) comprises a pull rod (601), a convex groove (602), a mounting spring (603), a mounting block (604), a mounting hole (605), a clamping groove (606) and a clamping block (607), clamping blocks (607) are arranged at four corners of the bottom end of the cover plate (2), the upper end of one side inside the clamping block (607) is provided with a mounting hole (605), four corners of the top end inside the base (9) are provided with clamping grooves (606) matched with the clamping block (607), and the inner parts of the bases (9) at one side of the clamping grooves (606) are all provided with convex grooves (602), the insides of the convex grooves (602) are respectively provided with a pull rod (601) extending to the outside of the base (9), and the inner parts of the convex grooves (602) on the surface of the pull rod (601) are wound with mounting springs (603), and mounting blocks (604) matched with the mounting holes (605) are mounted on one sides of the pull rods (601).
6. The thermal control structure of a space application servo controller according to claim 1, wherein: the heating wires (8) are all in a U-shaped pipe structure, and the heating wires (8) are symmetrically distributed around the transverse central axis of the base (9).
7. The thermal control structure of a space application servo controller according to claim 2, wherein: the top and the bottom of the inside one side of regulation and control case (21) have all transversely seted up spout (20), and the equal sliding connection in inside of spout (20) has slider (19), slider (19) one end all welds with the both ends of fly leaf (17).
CN202022685590.XU 2020-11-19 2020-11-19 Thermal control structure of space application servo controller Active CN213482726U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022685590.XU CN213482726U (en) 2020-11-19 2020-11-19 Thermal control structure of space application servo controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022685590.XU CN213482726U (en) 2020-11-19 2020-11-19 Thermal control structure of space application servo controller

Publications (1)

Publication Number Publication Date
CN213482726U true CN213482726U (en) 2021-06-18

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CN202022685590.XU Active CN213482726U (en) 2020-11-19 2020-11-19 Thermal control structure of space application servo controller

Country Status (1)

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