CN216354154U

CN216354154U - High-temperature-resistant high-back-voltage transistor

Info

Publication number: CN216354154U
Application number: CN202122771259.4U
Authority: CN
Inventors: 涂家礼
Original assignee: Shenzhen Longjing Micro Electronics Co ltd
Current assignee: Shenzhen Longjing Micro Electronics Co ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2022-04-19
Anticipated expiration: 2031-11-12

Abstract

The utility model discloses a high-temperature-resistant high-back-pressure transistor which comprises a plastic package shell, wherein a containing groove is formed in the plastic package shell, a substrate is arranged in the containing groove, a chip is arranged at one end in the substrate, a mounting groove is formed in the bottom of one end of the plastic package shell, and grooves are uniformly formed in the plastic package shell at one end of the mounting groove. According to the utility model, when the pin is broken carelessly, the threaded rod is driven to rotate by twisting the knob, the threaded rod drives the fixing pin to be separated from the fixing groove through the threaded connection between the threaded rod and the threaded sleeve, so that the limit fixing effect on the connecting block is cancelled, and the pin and the pipe sleeve connecting part are exposed independently by sliding the mounting block outwards, so that the pin can be maintained and checked conveniently under the condition that the plastic package shell is not dismounted, the operation is simple, the use is convenient, and the maintenance speed and the convenience of the high back pressure transistor are further improved.

Description

High-temperature-resistant high-back-voltage transistor

Technical Field

The utility model relates to the technical field of high-back-voltage transistors, in particular to a high-temperature-resistant high-back-voltage transistor.

Background

The transistor is a solid semiconductor device, has multiple functions such as detection, rectification, amplification, switching, voltage stabilization, signal modulation and the like, is used as a variable current switch, can control output current based on input voltage, is different from a common mechanical switch, controls the opening and closing of the transistor by using an electric signal, and has very high switching speed, and the high-back-voltage transistor is one of the transistors;

the existing high back pressure transistor is generally packaged by a plastic package shell, the problem of complex disassembly and assembly can exist after the packaging is completed, and when a pin of the high back pressure transistor is damaged and broken, the maintenance operation is inconvenient, and the maintenance efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-temperature-resistant high-back-voltage transistor to solve the problem of inconvenient assembly and disassembly in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high temperature resistance high back pressure transistor, includes the plastic envelope casing, the inside of plastic envelope casing is provided with the holding tank, and the internally mounted of holding tank has the base plate, the chip is installed to the inside one end of base plate, the bottom of plastic envelope casing one end is provided with the mounting groove, and the inside of the plastic envelope casing of mounting groove one end evenly is provided with the recess, the pipe box is all installed to the inside of recess, and the bottom of pipe box all installs the pin, the top of pipe box all is connected with the chip through the welding wire, the internally mounted of mounting groove has the installation piece.

Preferably, radiating fins are uniformly arranged at one end, close to the mounting block, of the plastic package shell, radiating holes are uniformly formed in one end, far away from the radiating fins, of the plastic package shell, and a heat conducting plate is arranged at one end, close to the radiating holes, of the inner portion of the base plate.

Preferably, the inside of the plastic envelope casing of recess both sides all is provided with sealing mechanism, sealing mechanism includes the activity groove, and the activity groove all sets up the inside at the plastic envelope casing, the inside movable mounting in activity groove has the movable block, and one side that the movable block is close to the pin installs sealed the pad, one side that sealed pad was kept away from to the movable block evenly installs compression spring, and compression spring keeps away from the one end of movable block and all is connected with the inner wall in activity groove.

Preferably, the one end that the installation piece was kept away from to the mounting groove evenly is provided with the constant head tank, the locating piece is evenly installed to the one end that the installation piece is close to the constant head tank, the locating piece all with constant head tank swing joint.

Preferably, the size of the positioning groove is equal to that of the positioning block, and the profiles of the positioning groove and the positioning block are both in a trapezoidal design.

Preferably, the mounting groove is kept away from the inside of the plastic envelope casing of installation piece one end and evenly is provided with the spread groove, the installation piece is close to the both sides of spread groove one end and all installs the connecting block, the connecting block all with spread groove swing joint, the outside of connecting block all evenly is provided with the fixed slot, the inside of the plastic envelope casing in the spread groove outside all is provided with fixed establishment. The connecting blocks and the connecting grooves are arranged on two sides of the plastic package shell and play a role in limiting and fixing the mounting plate.

Preferably, fixed establishment includes built-in groove, and built-in groove all sets up the inside at the plastic envelope casing, the internally mounted of built-in groove has the threaded rod, and the outside of threaded rod installs the thread bush, the thread bush is close to one side of connecting block and evenly installs the fixed pin, and the fixed pin all with fixed slot swing joint, the knob is all installed to one side that the fixed pin was kept away from to the threaded rod. The knob drives the threaded rod to rotate, the threaded rod and the threaded sleeve are in threaded connection, and the threaded sleeve is driven to move back and forth in the horizontal direction.

Compared with the prior art, the utility model has the beneficial effects that: the high-temperature-resistant high-back-pressure transistor not only realizes the function of convenient maintenance, but also realizes the function of sealing protection, and simultaneously realizes the function of high temperature resistance;

(1) the mounting block and the mounting groove are arranged, the mounting groove is formed in the joint of the pin and the pipe sleeve, when the pin is broken carelessly, the threaded rod is driven to rotate by twisting the knob, the threaded rod drives the fixing pin to be separated from the fixing groove through the threaded connection effect between the threaded rod and the threaded sleeve, so that the limiting fixing effect on the connecting block is cancelled, the pin and the pipe sleeve connecting part are exposed independently by sliding the mounting block outwards, the maintenance and the inspection on the pin can be conveniently carried out under the condition that the plastic package shell is not dismounted, the operation is simple, the use is convenient, and the maintenance speed and the convenience of the high back pressure transistor are further improved;

(2) by arranging the sealing mechanism, in the installation process of the pipe sleeve and the groove, the pipe sleeve is in contact with the sealing gasket and is stressed to drive the movable block to move in the movable groove, and the movable block drives the compression spring to stretch so as to push the sealing gasket to be attached to the outer wall of the pipe sleeve under the elastic action of the compression spring, so that the sealing performance between the pipe sleeve and the groove is improved, and dust is prevented from entering the plastic package shell to influence elements in the use process;

(3) the heat-conducting plate is arranged at the rear of the base plate and directly acts on the chip, so that the heat conduction effect on the chip is facilitated, the contact area between the heat dissipation holes and the air is increased conveniently due to the cooperation of the front heat dissipation holes and the back heat dissipation fins, the diffusion speed of heat after conduction is accelerated, the high-temperature resistance of the heat dissipation holes is improved, internal elements of the heat dissipation holes cannot be damaged due to high temperature, and the service life of the heat dissipation holes is further prolonged.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic front sectional view of the present invention;

FIG. 2 is a schematic side view of the cross-sectional structure of the present invention;

FIG. 3 is a schematic bottom sectional view of the present invention;

FIG. 4 is a schematic bottom sectional view of the fixing mechanism of the present invention;

fig. 5 is a schematic front view of the present invention.

The reference numerals in the figures illustrate: 1. plastic packaging the shell; 2. a substrate; 3. welding wires; 4. a pin; 5. a groove; 6. positioning a groove; 7. mounting grooves; 8. pipe sleeve; 9. connecting grooves; 10. accommodating grooves; 11. a chip; 12. a heat conducting plate; 13. heat dissipation holes; 14. mounting blocks; 15. a heat dissipating fin; 16. a fixing mechanism; 1601. a built-in groove; 1602. a threaded rod; 1603. a knob; 1604. a threaded sleeve; 1605. a fixing pin; 17. a sealing mechanism; 1701. a movable groove; 1702. a gasket; 1703. a movable block; 1704. a compression spring; 18. positioning blocks; 19. connecting blocks; 20. and fixing the grooves.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, are within the scope of the present invention.

Referring to fig. 1-5, an embodiment of the present invention is shown: a high-temperature-resistant high-back-pressure transistor comprises a plastic package shell 1;

radiating fins 15 are uniformly arranged at one end, close to the mounting block 14, of the plastic package shell 1, radiating holes 13 are uniformly arranged at one end, far away from the radiating fins 15, of the plastic package shell 1, and a heat-conducting plate 12 is arranged at one end, close to the radiating holes 13, in the substrate 2;

specifically, as shown in fig. 2, when in use, the heat conducting plate 12 is arranged behind the substrate 2, and the heat conducting plate 12 directly acts on the chip 11, so as to facilitate the heat conduction of the chip 11, and meanwhile, the heat conducting plate 12 is matched with the front and rear heat dissipation holes 13 and the heat dissipation fins 15, so as to facilitate the increase of the contact area with air, thereby accelerating the diffusion speed of the conducted heat, so as to improve the high temperature resistance of the heat conducting plate, so that the internal elements of the heat conducting plate are not damaged due to high temperature, and the service life of the heat conducting plate is further prolonged;

an accommodating groove 10 is formed in the plastic package shell 1, a substrate 2 is arranged in the accommodating groove 10, a chip 11 is arranged at one end in the substrate 2, and an installation groove 7 is formed in the bottom of one end of the plastic package shell 1;

positioning grooves 6 are uniformly formed in one end, far away from the mounting block 14, of the mounting groove 7, positioning blocks 18 are uniformly mounted at one end, close to the positioning grooves 6, of the mounting block 14, the positioning blocks 18 are movably connected with the positioning grooves 6, the size of each positioning groove 6 is equal to that of each positioning block 18, and the sections of the positioning grooves 6 and the positioning blocks 18 are in a trapezoidal design;

specifically, as shown in fig. 1, 3 and 4, in use, the positioning groove 6 and the positioning block 18 function to fix the mounting block 14;

connecting grooves 9 are uniformly arranged in the plastic package shell 1, which is far away from one end of the mounting block 14, of the mounting groove 7, connecting blocks 19 are arranged on two sides, which are close to one end of the connecting grooves 9, of the mounting block 14, connecting blocks 19 are movably connected with the connecting grooves 9, fixing grooves 20 are uniformly arranged on the outer sides of the connecting blocks 19, fixing mechanisms 16 are arranged in the plastic package shell 1, each fixing mechanism 16 comprises a built-in groove 1601, the built-in grooves 1601 are arranged in the plastic package shell 1, a threaded rod 1602 is arranged in the built-in groove 1601, a threaded sleeve 1604 is arranged on the outer side of the threaded rod 1602, fixing pins 1605 are uniformly arranged on one side, which is close to the connecting blocks 19, of the threaded sleeve 1604, the fixing pins 1605 are movably connected with the fixing grooves 20, and knobs 1603 are arranged on one side, which is far away from the fixing pins 1605, of the threaded rod 1602;

specifically, as shown in fig. 1, 3 and 4, when in use, the mounting block 14 and the mounting groove 7 are arranged, and the mounting groove 7 is arranged at the joint of the pin 4 and the tube sleeve 8, when the pin 4 is broken carelessly, the threaded rod 1602 is driven to rotate by twisting the knob 1603, the threaded rod 1602 drives the fixing pin 1605 to separate from the fixing groove 20 through the threaded connection between the threaded rod 1602 and the threaded sleeve 1604, so as to cancel the limiting fixing effect on the connecting block 19, and thus the connecting part of the pin 4 and the tube sleeve 8 is exposed independently by sliding the mounting block 14 outwards, so that the pin 4 can be maintained and checked conveniently without removing the plastic package housing 1, the operation is simple and convenient, and the maintenance rate and convenience of the high back pressure transistor are further improved;

grooves 5 are uniformly arranged in the plastic package shell 1 at one end of the mounting groove 7;

sealing mechanisms 17 are arranged inside the plastic package shell 1 on two sides of the groove 5, each sealing mechanism 17 comprises a movable groove 1701, each movable groove 1701 is arranged inside the plastic package shell 1, a movable block 1703 is movably arranged inside each movable groove 1701, a sealing gasket 1702 is arranged on one side, close to the pins 4, of each movable block 1703, compression springs 1704 are uniformly arranged on one side, far away from the sealing gaskets 1702, of each movable block 1703, and one ends, far away from the movable blocks 1703, of the compression springs 1704 are connected with the inner wall of each movable groove 1701;

specifically, as shown in fig. 3, when in use, by providing the sealing mechanism 17, in the process of mounting the pipe sleeve 8 and the groove 5, the pipe sleeve 8 is in contact with the sealing gasket 1702 and is forced to drive the movable block 1703 to move in the movable groove 1701, and the movable block 1703 drives the compression spring 1704 to stretch and contract, so that the sealing gasket 1702 is pushed to be attached to the outer wall of the pipe sleeve 8 by the elastic action of the compression spring 1704, and further, the sealing performance between the pipe sleeve 8 and the groove 5 is improved, so that dust is prevented from entering the plastic package housing 1 to affect elements in the use process;

pipe sleeve 8 is all installed to the inside of recess 5, and pin 4 is all installed to the bottom of pipe sleeve 8, and the top of pipe sleeve 8 all is connected with chip 11 through welding wire 3, and the internally mounted of mounting groove 7 has installation piece 14.

The working principle is as follows: when the plastic package shell is used, firstly, when the pin 4 is broken carelessly, the knob 1603 is twisted to drive the threaded rod 1602 to rotate, the threaded sleeve 1604 drives the fixing pin 1605 to be separated from the fixing groove 20 under the threaded connection effect, so that the limiting fixing effect on the connecting block 19 is cancelled, and the connecting part of the pin 4 and the pipe sleeve 8 is exposed independently by sliding the mounting block 14 outwards, so that the pin 4 can be maintained and checked conveniently under the condition that the plastic package shell 1 is not dismounted;

secondly, in the process of mounting the pipe sleeve 8 and the groove 5, the pipe sleeve 8 is in contact with the sealing gasket 1702 and is stressed to drive the movable block 1703 to extrude the compression spring 1704, the elastic action of the compression spring 1704 is convenient for pushing the sealing gasket 1702 to be attached to the outer wall of the pipe sleeve 8, and further the sealing performance between the pipe sleeve 8 and the groove 5 is improved, so that dust is prevented from entering the plastic package shell 1 to affect elements;

finally, the heat of the chip 11 is conducted conveniently through the action of the heat conducting plate 12, and meanwhile, the contact area with air is increased conveniently through the action of the front heat dissipation hole 13 and the rear heat dissipation hole 15, so that the diffusion speed of the conducted heat is increased, and the high-temperature resistance of the heat conduction plate is improved.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a high temperature resistance high back pressure transistor, includes plastic envelope casing (1), its characterized in that: the plastic package casing is characterized in that an accommodating groove (10) is formed in the plastic package casing (1), a base plate (2) is installed inside the accommodating groove (10), a chip (11) is installed at one end of the base plate (2), a mounting groove (7) is formed in the bottom of one end of the plastic package casing (1), a groove (5) is evenly formed in the plastic package casing (1) of one end of the mounting groove (7), a pipe sleeve (8) is installed inside the groove (5), a pin (4) is installed at the bottom end of the pipe sleeve (8), the top end of the pipe sleeve (8) is connected with the chip (11) through a welding wire (3), and an installation block (14) is installed inside the mounting groove (7).

2. The high temperature resistant high back-voltage transistor of claim 1, wherein: radiating fins (15) are evenly installed to the one end that plastic envelope casing (1) is close to installation piece (14), the one end that radiating fins (15) were kept away from in plastic envelope casing (1) evenly is provided with louvre (13), heat-conducting plate (12) are installed to the inside one end that is close to louvre (13) of base plate (2).

3. The high temperature resistant high back-voltage transistor of claim 1, wherein: the inside of the plastic envelope casing (1) of recess (5) both sides all is provided with sealing mechanism (17), sealing mechanism (17) are including activity groove (1701), and activity groove (1701) all sets up the inside at plastic envelope casing (1), the inside movable mounting of activity groove (1701) has movable block (1703), and movable block (1703) are close to one side of pin (4) and install sealed pad (1702), one side that sealed pad (1702) were kept away from in movable block (1703) evenly installs compression spring (1704), and compression spring (1704) keep away from the one end of movable block (1703) and all are connected with the inner wall in activity groove (1701).

4. The high temperature resistant high back-voltage transistor of claim 1, wherein: the one end of installation piece (14) is kept away from in mounting groove (7) evenly is provided with constant head tank (6), locating piece (18) are evenly installed to the one end that installation piece (14) are close to constant head tank (6), locating piece (18) all with constant head tank (6) swing joint.

5. The high temperature-resistant high back-voltage transistor according to claim 4, wherein: the size of the positioning groove (6) is equal to that of the positioning block (18), and the sections of the positioning groove (6) and the positioning block (18) are both in a trapezoidal design.

6. The high temperature resistant high back-voltage transistor of claim 1, wherein: mounting groove (7) are kept away from the inside of plastic envelope casing (1) of installation piece (14) one end and evenly are provided with spread groove (9), connecting block (19) are all installed to the both sides that installation piece (14) are close to spread groove (9) one end, connecting block (19) all with spread groove (9) swing joint, the outside of connecting block (19) all evenly is provided with fixed slot (20), the inside of the plastic envelope casing (1) in the spread groove (9) outside all is provided with fixed establishment (16).

7. The high temperature resistant high back-voltage transistor according to claim 6, wherein: fixed establishment (16) are including built-in groove (1601), and built-in groove (1601) all sets up the inside at plastic envelope casing (1), the internally mounted of built-in groove (1601) has threaded rod (1602), and threaded bush (1604) is installed in the outside of threaded rod (1602), fixed pin (1605) are evenly installed to one side that threaded bush (1604) are close to connecting block (19), and fixed pin (1605) all with fixed slot (20) swing joint, knob (1603) are all installed to one side that fixed pin (1605) were kept away from in threaded rod (1602).