CN210427710U

CN210427710U - LED chip service life detection device with higher speed

Info

Publication number: CN210427710U
Application number: CN201920891917.3U
Authority: CN
Inventors: 何明
Original assignee: Huian Yongheng Machinery Co ltd
Current assignee: Chengdu Lingke Microelectronics Co ltd
Priority date: 2019-06-14
Filing date: 2019-06-14
Publication date: 2020-04-28
Anticipated expiration: 2029-06-14

Abstract

The utility model discloses a LED chip accelerated life detection device, which comprises a heating assembly, a fixing assembly and a heat dissipation assembly, wherein the heating assembly comprises a shell, a door body, a first plate body, a first heating plate, a second plate body and a second heating plate, the fixing assembly comprises a chute, springs, a sliding block, a fixing plate and a contact, the chute is uniformly and symmetrically arranged on the upper side and the lower side of the first plate body, two springs are symmetrically arranged in the chute, and one ends of the two springs adjacent to each other are fixedly connected with the sliding block; when carrying out the life-span to the LED chip and examining, open the door body, to a fixed plate of direction promotion of spring, make the fixed plate extrusion spring, then aim at the anodal negative pole contact on a fixed plate with the LED chip, then promote another fixed plate, aim at the anodal contact on another fixed plate with the negative pole of LED chip, loosen the fixed plate, the fixed plate can be fixed the LED chip, is convenient for fix the LED chip.

Description

LED chip service life detection device with higher speed

Technical Field

The utility model relates to a LED chip life-span detection device technical field specifically is a LED chip life-span detection device with higher speed.

Background

The LED chip is a solid semiconductor device, the core of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, the other end of the wafer is connected with an anode of a power supply, the whole wafer is packaged by epoxy resin, and the LED chip has the functions that: the electric energy is converted into light energy, and the main material of the chip is monocrystalline silicon. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. However, when the two semiconductors are connected, a P-N junction is formed between the two semiconductors, when current acts on the wafer through a wire, electrons are pushed to a P region, the electrons are compounded with holes in the P region, and then energy is emitted in the form of photons, which is the principle of LED light emission.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED chip life-span detection device with higher speed to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED chip life-span detection device with higher speed, includes heating element, fixed subassembly and radiator unit, heating element includes casing, the door body, first plate body, first hot plate, second plate body and second hot plate, fixed subassembly includes spout, spring, slider, fixed plate and contact, the even symmetry in upper and lower both sides of first plate body has been seted up the spout, the symmetry is installed two in the spout the spring, two the equal fixedly connected with of one end that the spring is adjacent the slider, two install at the top of slider the fixed plate, two one side that the fixed plate is adjacent is all installed the contact, two one side that the contact is adjacent is equipped with the LED chip.

As further preferable in the present technical solution: one side of casing articulates there is the door body, the even fixedly connected with of inside wall of casing the first plate body, install the inside wall of casing the first hot plate, the inside wall of the door body is evenly installed the second plate body.

As further preferable in the present technical solution: the first plate body is internally provided with the second heating plate.

As further preferable in the present technical solution: the heat dissipation assembly comprises a first through hole, a temperature detector, a third plate body, a second through hole, a baffle and a protruding portion, the first through hole is formed in the front surface of the door body, the third plate body is installed in the first through hole, the rear surface of the third plate body is hinged to the baffle, and the second through hole is formed in the front surface of the third plate body evenly.

As further preferable in the present technical solution: the rear surface of the baffle is fixedly connected with the lug boss.

As further preferable in the present technical solution: the rear surface of the door body is provided with the temperature detector.

As further preferable in the present technical solution: the baffle is semicircular in shape.

Compared with the prior art, the beneficial effects of the utility model are that: when carrying out the life-span to the LED chip and examining, open the door body, to a fixed plate of direction promotion of spring, make fixed plate extrusion spring, then aim at the anodal negative pole contact on a fixed plate with the LED chip, then promote another fixed plate, aim at the anodal contact on another fixed plate with the negative pole of LED chip, loosen the fixed plate, the fixed plate can be fixed the LED chip, is convenient for fix the LED chip of different specifications size.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the door body of the present invention;

FIG. 3 is an enlarged view of the structure of region A of FIG. 1;

fig. 4 is a schematic structural view of the middle heat dissipation assembly of the present invention.

In the figure: 10. a heating assembly; 11. a housing; 12. a door body; 13. a first plate body; 14. a first heating plate; 15. a second plate body; 16. a second heating plate; 20. a fixing assembly; 21. a chute; 22. a spring; 23. a slider; 24. a fixing plate; 25. a contact; 26. an LED chip; 30. a heat dissipating component; 31. a first through hole; 32. a temperature detector; 33. a third plate body; 34. a second through hole; 35. a baffle plate; 36. a raised portion.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a LED chip is life-span detection device with higher speed, includes heating element 10, fixed subassembly 20 and radiator unit 30, heating element 10 includes casing 11, door body 12, first plate body 13, first hot plate 14, second plate body 15 and second hot plate 16, fixed subassembly 20 includes spout 21, spring 22, slider 23, fixed plate 24 and contact 25, the even symmetry in upper and lower both sides of first plate body 13 has been seted up spout 21, two are installed to the symmetry in the spout 21 spring 22, two the equal fixedly connected with of the adjacent one end of spring 22 slider 23, two the top of slider 23 is all installed fixed plate 24, two one side that fixed plate 24 is adjacent is all installed contact 25, two one side that contact 25 is adjacent is equipped with LED chip 26.

In this embodiment, specifically: a door body 12 is hinged to one side of the shell 11, the first plate body 13 is uniformly and fixedly connected to the inner side wall of the shell 11, the first heating plate 14 is mounted on the inner side wall of the shell 11, and the second plate body 15 is uniformly mounted on the inner side wall of the door body 12; through setting up the door body 12, can seal casing 11, through setting up first plate body 13, can classify casing 11 inside, through setting up first hot plate 14, can heat casing 11 inside for can accelerate LED chip 26 life-span and age, through setting up second plate body 15, can be when closing door body 12, second plate body 15 can withstand first plate body 13, makes the temperature transmission that can reduce both sides about first plate body 13.

In this embodiment, specifically: the second heating plate 16 is installed inside the first plate body 13; by providing the second heating plate 16, the speed of heating the inside of the housing 11 can be increased.

In this embodiment, specifically: the heat dissipation assembly 30 comprises a first through hole 31, a temperature detector 32, a third plate body 33, a second through hole 34, a baffle 35 and a boss 36, the first through hole 31 is formed in the front surface of the door body 12, the third plate body 33 is installed in the first through hole 31, the baffle 35 is hinged to the rear surface of the third plate body 33, and the second through hole 34 is uniformly formed in the front surface of the third plate body 33; in order to control the temperature inside the casing 11 at a proper temperature, while the inside of the casing 11 is heated, the heat dissipation is also required to be performed inside the housing 11, so as to ensure that the temperature inside the housing 11 can meet the requirement of accelerated loss of the service life of the LED chip 26, and will not exceed the load capacity of the LED chip 26, by providing the first through hole 31, can be covered with a third plate 33, which can partially dissipate the heat inside the housing 11 by opening the second through holes 34, and by providing a baffle 35, the blocking of a part of the second through holes 34 formed in the third plate 33 can be performed, the amount of the second through holes 34 blocked by the blocking plate 35 can be controlled by rotating the blocking plate 35, the speed of heat dissipation inside the housing 11 can be adjusted, the temperature in the housing 11 is controlled, so as to accelerate the life loss of the LED chip 26, and facilitate the detection of the LED chip 26.

In this embodiment, specifically: the rear surface of the baffle 35 is fixedly connected with the boss 36; by providing the projection 36, the worker can rotate the baffle 35 conveniently.

In this embodiment, specifically: the temperature detector 32 is mounted on the rear surface of the door body 12; the temperature detector 32 is provided to detect the temperature inside the casing 11.

In this embodiment, specifically: the baffle 35 is semicircular in shape; by providing the baffle 35 in a semicircular shape, it is possible to complete the operation of completely blocking the second through hole 34 when necessary, and it is also possible to complete the operation of completely not blocking the second through hole 34.

In this embodiment: one of the contacts 25 on the two fixing plates 24 is a positive contact, and the other contact is a negative contact, and the contacts 25 are electrically connected with an external power supply after being connected with a switch through a lead.

In this embodiment: the models of the first heating plate 14 and the second heating plate 16 are AL-DRD, and the first heating plate 14 and the second heating plate 16 are electrically connected with an external power supply after being connected with a switch through a lead.

In this embodiment: the temperature detector 32 is HT605C, and the temperature detector 32 is electrically connected to an external power source after being connected to a switch through a wire.

Working principle or structural principle: when the service life of the LED chip 26 is detected, the door 12 is opened, one fixing plate 24 is pushed towards the spring 22, the fixing plate 24 presses the spring 22 through the slider 23, the spring 22 deforms, then the anode of the LED chip 26 is aligned with the cathode contact on one fixing plate 24, then the other fixing plate 24 is pushed, the cathode of the LED chip 26 is aligned with the anode contact on the other fixing plate 24, the fixing plate 24 is released, because the spring 22 deforms, the slider 23 is pushed by the spring 22, the slider 23 drives the fixing plate 24 to move, the LED chip 26 can be fixed by the fixing plate 24, the LED chip 26 can be fixed conveniently, the slider 23 can slide in the sliding groove 21 by arranging the sliding groove 21, the position of the spring 22 can be limited, and then the first heating plate 14, the second heating plate 16 and the temperature detector 32 are started, the service life of the LED chip 26 is detected in an accelerated manner, the shell 11 can be sealed by arranging the door body 12, the interior of the shell 11 can be classified by arranging the first plate body 13, the interior of the shell 11 can be heated by arranging the first heating plate 14, so that the service life of the LED chip 26 can be accelerated, the interior of the shell 11 can be aged by arranging the second plate body 15, when the door body 12 is closed, the second plate body 15 can be abutted against the first plate body 13, so that the temperature transmission of the upper side and the lower side of the first plate body 13 can be reduced, in order to control the temperature in the shell 11 to be at a proper temperature, the interior of the shell 11 is heated and simultaneously needs to be radiated, the temperature meeting the aging condition of the LED chip 26 in the shell 11 is ensured to be maintained and not exceed the aging environment temperature of the LED chip 26, the third plate body 33 can be coated by arranging the first through hole 31, through seting up second through-hole 34, enable the heat in the casing 11 and can distribute away, through setting up baffle 35, can block the part second through-hole 34 that third plate body 33 seted up, through rotating baffle 35, control baffle 35 blocks the quantity of second through-hole 34, adjust the speed that the inside heat of casing 11 gived off, make the temperature in the casing 11 be in a controllable state, reach the effect of accelerating the loss of LED chip 26 life-span, so that detect LED chip 26, through setting up bellying 36, the staff that can be convenient for rotates baffle 35, through setting up temperature detector 32, can detect the temperature in the casing 11.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An accelerated life detection device for LED chips comprises a heating component (10), a fixing component (20) and a heat dissipation component (30), and is characterized in that: heating element (10) are including casing (11), the door body (12), first plate body (13), first hot plate (14), second plate body (15) and second hot plate (16), fixed subassembly (20) are including spout (21), spring (22), slider (23), fixed plate (24) and contact (25), the even symmetry in upper and lower both sides of first plate body (13) has been seted up spout (21), two are installed to spout (21) internal symmetry spring (22), two the equal fixedly connected with of the adjacent one end of spring (22) slider (23), two the top of slider (23) is all installed fixed plate (24), two one side that fixed plate (24) are adjacent is all installed contact (25), two one side that contact (25) are adjacent is equipped with LED chip (26).

2. The accelerated lifetime detection apparatus of an LED chip according to claim 1, wherein: one side of casing (11) articulates there is the door body (12), the even fixedly connected with of inside wall of casing (11) first plate body (13), install the inside wall of casing (11) first hot plate (14), the inside wall of the door body (12) is evenly installed second plate body (15).

3. The accelerated lifetime detection apparatus of an LED chip according to claim 1, wherein: the second heating plate (16) is installed inside the first plate body (13).

4. The accelerated lifetime detection apparatus of an LED chip according to claim 1, wherein: radiator unit (30) include first through-hole (31), temperature-detecting appearance (32), third plate body (33), second through-hole (34), baffle (35) and bellying (36), seted up on the front surface of the door body (12) first through-hole (31), install in first through-hole (31) third plate body (33), the rear surface of third plate body (33) articulates there is baffle (35), the front surface of third plate body (33) has evenly been seted up second through-hole (34).

5. The accelerated lifetime detection apparatus of an LED chip according to claim 4, wherein: the rear surface of the baffle plate (35) is fixedly connected with the bulge part (36).

6. The accelerated lifetime detection apparatus of an LED chip according to claim 4, wherein: the rear surface of the door body (12) is provided with the temperature detector (32).

7. The accelerated lifetime detection apparatus of an LED chip according to claim 4, wherein: the baffle (35) is semicircular in shape.