TWI808532B - Cooling liquid flow control device - Google Patents

Abstract

A cooling liquid flow control device includes a heat dissipation bottom plate, a fixing holder, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with a heating element on a substrate. The fixing holder is connected to the heat dissipation bottom plate and configured to be fixed with the substrate. The cooling module is connected to a top surface of the heat dissipation bottom plate to form a cavity. The cavity is configured to circulate a cooling liquid. The temperature control element is disposed in the cavity and is configured to cause a deformation based on a temperature of the cooling liquid in the cavity, thereby adjusting a flow rate of the cooling liquid in and out of the cavity.

Description

Coolant flow control device

The present disclosure relates to a coolant flow control device.

The water-cooling module of the existing electronic components (such as: CPU) is based on the heat-conducting substrate of the electronic components, and cooperates with the water inlet side and the water outlet side to do the internal circulation circuit for heat exchange to achieve the effect of heat dissipation of the electronic components.

However, the existing water-cooling modules do not have the function of controlling the flow rate (for example, the flow rate of cooling water). Since the water-cooling module cannot control the flow rate, it cannot optimize the heat dissipation of electronic components under idle or full-load conditions, and thus cannot adjust the power load of the CDU (Cooling Distribution Unit; cooling distribution unit) on the system.

Therefore, how to propose a cooling fluid flow control device to control the cooling fluid flow and achieve the effect of saving energy is one of the problems that the industry is eager to devote research and development resources to solve.

In view of this, one purpose of the present disclosure is to provide a coolant flow control device that can solve the above problems.

In order to achieve the above object, according to an embodiment of the present disclosure, a coolant flow control device includes a heat dissipation base plate, a fixing seat, a cooling module, and a temperature control element. The heat dissipation bottom plate has a bottom surface configured to be in contact with the heating element on the substrate. The fixing base is connected with the heat dissipation bottom plate and configured to be fixed with the base plate. The cooling module is connected with the top surface of the heat dissipation bottom plate to form a chamber. The chamber is configured to circulate coolant. The temperature control element is arranged in the chamber and configured to generate deformation based on the temperature of the cooling liquid in the chamber, thereby adjusting the flow of the cooling liquid entering and leaving the chamber.

In one or more embodiments of the present disclosure, the cooling module includes a liquid inlet pipe and a liquid outlet pipe. The chamber also includes a first subchamber and a second subchamber. The first subchamber is configured to receive cooling liquid from the liquid inlet pipe. The second sub-chamber surrounds the first sub-chamber and is configured to deliver the cooling liquid from the first sub-chamber to the liquid outlet pipe.

In one or more embodiments of the present disclosure, there is an opening between the first sub-chamber and the second sub-chamber, and the opening allows the cooling liquid to circulate between the first sub-chamber and the second sub-chamber.

In one or more embodiments of the present disclosure, the cooling module further includes a top plate, an outer ring wall, and an inner ring wall. The top plate has a liquid inlet hole and a liquid outlet hole, wherein the liquid inlet hole is connected to the liquid inlet pipe and the first sub-chamber, and the liquid outlet hole is connected to the liquid outlet pipe and the second sub-chamber. The outer ring wall vertically extends from the edge of the top plate and surrounds the edge of the top plate, wherein the outer ring wall is connected to the heat dissipation bottom plate. The inner ring wall vertically extends from the top plate and is surrounded by the outer ring wall, wherein the inner ring wall is connected to the heat dissipation bottom plate.

In one or more embodiments of the present disclosure, the opening is located on the inner ring wall.

In one or more embodiments of the present disclosure, the temperature control element includes a first metal sheet and a second metal sheet. The first metal sheet has a first coefficient of thermal expansion. The second metal sheet is attached to the first metal sheet and has a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is smaller than the second coefficient of thermal expansion.

In one or more embodiments of the present disclosure, the temperature control element further includes a stopper disposed on the second metal sheet, and the stopper is configured to stop and disengage from the liquid inlet hole.

In one or more embodiments of the present disclosure, the end of the temperature control element away from the stopper is connected to the inner surface of the chamber.

In one or more embodiments of the present disclosure, the temperature control element is configured to bend toward one side of the second metal sheet when the temperature of the cooling liquid is lower than the temperature threshold, so that the stopper blocks the liquid inlet hole so as not to connect the liquid inlet pipe and the first sub-chamber.

In one or more embodiments of the present disclosure, the temperature control element is configured to bend toward one side of the first metal sheet when the temperature of the cooling liquid is higher than a temperature threshold, so that the stopper part is separated from the liquid inlet hole to connect the liquid inlet pipe and the first sub-chamber.

To sum up, in the coolant flow control device disclosed in the present disclosure, since the temperature control element utilizes the characteristic that the bimetal sheet can be deformed based on the temperature of the coolant, the stop portion of the temperature control element can stop, partially stop, or disengage from the liquid inlet hole to achieve the purpose of controlling the coolant flow. In the coolant flow control device disclosed in the present disclosure, since the bimetal sheet is used as the material of the temperature control element, not only can the power saving effect of the coolant flow control device be achieved, but also the construction space of the liquid cooling device can be effectively reduced.

The above description is only used to explain the problems to be solved by the present disclosure, the technical means to solve the problems, and the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation methods and related drawings.

The following will disclose multiple implementations of the present disclosure with diagrams, and for the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. That is to say, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings. The same reference numbers will be used throughout the drawings to refer to the same or similar elements.

The structure, function and connection relationship between the components included in the coolant flow control device 100 of the present embodiment will be described in detail below.

Please refer to Figure 1 and Figure 2. FIG. 1 and FIG. 2 are schematic diagrams of different viewing angles of the coolant flow control device 100 according to an embodiment of the present disclosure. In this embodiment, the coolant flow control device 100 includes a heat dissipation bottom plate 110 , a fixing base 120 , a cooling module 130 and a temperature control element 140 . The heat dissipation bottom plate 110 has a top surface 110 a and a bottom surface 110 b. The bottom surface 110b is configured to be in contact with a heating element (not shown; for example: CPU) on a substrate (not shown; for example: PCB). The fixing seat 120 is connected to the heat dissipation bottom plate 110 and configured to be fixed with the substrate. Specifically, as shown in FIG. 1 and FIG. 2 , the heat dissipation bottom plate 110 is connected to the fixing base 120 by the fixing member S1, the heating element is in contact with the bottom surface 110b of the heat dissipation bottom plate 110, and the heating element is located between the heat dissipation bottom plate 110 and the substrate. When the fixing seat 120 is fixed toward the substrate by the fixing member S2, the heat dissipation bottom plate 110 is pressed against the heating element. The cooling module 130 is connected to the top surface 110a of the heat dissipation bottom plate 110 to form the chamber C. As shown in FIG. The cooling module 130 also includes a liquid inlet tube IT and a liquid outlet tube OT. Chamber C is configured to circulate cooling fluid. The temperature control element 140 is disposed in the chamber C and is configured to deform based on the temperature of the cooling liquid in the chamber C, thereby adjusting the flow rate of the cooling liquid entering and exiting the chamber C.

Please refer to FIG. 1 , FIG. 3A and FIG. 3B , in this embodiment, the cooling module 130 includes a top plate 132 , an outer ring wall 134 , an inner ring wall 136 and a pressing block 138 . The top plate 132 has a liquid inlet hole 132A and a liquid outlet hole 132B, the liquid inlet hole 132A is connected to the liquid inlet tube IT, and the liquid outlet hole 132B is connected to the liquid outlet tube OT. The outer ring wall 134 vertically extends from the edge of the top plate 132 and surrounds the edge of the top plate 132 . The inner ring wall 136 vertically extends from the top plate 132 and is surrounded by the outer ring wall 134 . The inner ring wall 136 also has an opening O. The pressing block 138 extends from the top plate 132 and is configured to press against the temperature control element 140 disposed in the chamber C. As shown in FIG.

Please refer to FIG. 1 and FIG. 4 , in this embodiment, the temperature control element 140 includes a first metal piece 142 , a second metal piece 144 and a stopper 146 . The first metal sheet 142 and the second metal sheet 144 are attached to each other. In FIG. 4 , the size of the first metal sheet 142 is substantially the same as that of the second metal sheet 144 . Since the first metal sheet 142 is located at the back of the temperature control element 140 in FIG. 4 , the first metal sheet 142 is not fully exposed. The first metal sheet 142 has a first coefficient of thermal expansion, and the second metal sheet 144 has a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first coefficient of thermal expansion is less than the second coefficient of thermal expansion. The stop portion 146 is disposed on one end of the temperature control element 140 , and the stop portion 146 protrudes toward one side of the second metal sheet 144 . The stop portion 146 is configured to stop and disengage from the liquid inlet hole 132A.

Please refer to FIG. 1 , FIG. 5 and FIG. 6 , in this embodiment, the chamber C further includes a first sub-chamber C1 and a second sub-chamber C2 . Specifically, as shown in FIG. 5 and FIG. 6, when the cooling module 130 is connected to the heat dissipation bottom plate 110, the outer ring wall 134 and the inner ring wall 136 are connected to the heat dissipation bottom plate 110, so that the top plate 132, the inner ring wall 136, and the heat dissipation bottom plate 110 jointly define the first sub-chamber C1, and the top plate 132, the outer ring wall 134, the inner ring wall 136, and the heat dissipation bottom plate 110 jointly define the second sub-chamber C2, and the second sub-cavity Chamber C2 surrounds the first sub-chamber C1. The first sub-chamber C1 is configured to receive the cooling liquid from the inlet pipe IT, the opening O is configured to allow the cooling liquid to circulate between the first sub-chamber C1 and the second sub-chamber C2, and the second sub-chamber C2 is configured to deliver the cooling liquid from the first sub-chamber C1 to the liquid outlet pipe OT. Therefore, the liquid inlet hole 132A is connected to the liquid inlet tube IT and the first sub-chamber C1, and the liquid outlet hole 132B is connected to the liquid outlet tube OT and the second sub-chamber C2.

In some embodiments, as shown in FIG. 4 , the stop portion 146 is substantially disposed on the second metal sheet 144 .

In some embodiments, the end of the temperature control element 140 away from the stop portion 146 is substantially connected to the inner surface of the chamber C. As shown in FIG. For example, as shown in FIG. 4 and FIG. 6 , the heat dissipation bottom plate 110 may include a positioning post 112 , and the temperature control element 140 may include a positioning hole 148 , and the positioning hole 148 is located at an end of the temperature control element 140 away from the stop portion 146 . Thereby, the temperature control element 140 can be positioned on the positioning post 112 through the positioning hole 148 , and can be disposed in the chamber C by being pressed against by the pressing block 138 .

Please continue to refer to Figure 5 and Figure 6. FIG. 5 and FIG. 6 illustrate how the cooling liquid circulates in the cooling liquid flow control device 100 , wherein the black arrow represents the path of the cooling liquid flowing in the cooling liquid flow control device 100 . With the aforementioned structural configuration, when the cooling liquid flows into the first sub-chamber C1 from the liquid inlet pipe IT, the cooling liquid enters the first sub-chamber C1 through the liquid inlet hole 132A. Next, the cooling liquid flows into the second sub-chamber C2 located outside the first sub-chamber C1 through the opening O. Next, when the cooling liquid flows into the liquid outlet pipe OT from the second sub-chamber C2, the cooling liquid enters the liquid outlet pipe OT through the liquid outlet hole 132B.

In some embodiments, the opening O and the liquid outlet hole 132B are respectively located near opposite sides of the chamber C, so that the cooling liquid can flow through every part of the top plate 132 evenly, so as to improve the heat dissipation efficiency. Compared with the situation where the opening O and the liquid outlet hole 132B are located on the same side of the chamber C, the cooling liquid flows directly from the liquid outlet hole 132B into the liquid outlet pipe OT through the opening O, and the cooling liquid may not flow through some parts of the top plate 132, resulting in poor heat dissipation efficiency.

Next, how the coolant flow control device 100 controls the flow of the coolant will be described.

Please refer to Figure 7 and Figure 8. FIG. 7 and FIG. 8 illustrate how the temperature control element 140 operates to control the flow of the cooling liquid in the cooling liquid flow control device 100 . Since the temperature control element 140 is substantially composed of two metal sheets (for example, a bimetallic sheet) closely attached to each other, and the temperature control element 140 is substantially immersed in the cooling liquid, the temperature control element 140 can be deformed based on the temperature of the cooling liquid. In more detail, when the temperature of the coolant is lower than the temperature threshold, the temperature control element 140 will bend toward one side of the metal sheet with a larger thermal expansion coefficient, and when the temperature of the coolant is higher than the temperature threshold, the temperature control element 140 will bend toward one side of the metal sheet with a smaller thermal expansion coefficient. Through such characteristics, the temperature control element 140 can stop and disengage from the liquid inlet hole 132A through the stop portion 146 provided on the temperature control element 140 based on the deformation of the temperature of the coolant, so as to achieve the purpose of controlling the flow of the coolant.

In the cooling liquid flow control device 100 of the present disclosure, as shown in FIG. 7, when the temperature of the cooling liquid is lower than the temperature threshold, the temperature control element 140 is bent toward one side of the second metal sheet 144, so that the stopper portion 146 blocks the liquid inlet hole 132A so as not to connect the liquid inlet pipe IT and the first sub-chamber C1. In a usage scenario, when the heating element located under the heat dissipation bottom plate 110 and in contact with the bottom surface 110b generates relatively little waste heat due to the idle state, the temperature of the coolant is lower than the temperature threshold, and then the temperature control element 140 is bent upward (as shown in FIG. 7 ) to stop the liquid inlet hole 132A. Since the stop portion 146 blocks the entire liquid inlet hole 132A, the coolant from the liquid inlet pipe IT cannot enter the first sub-chamber C1 through the liquid inlet hole 132A temporarily.

In the coolant flow control device 100 of the present disclosure, as shown in FIG. 8, when the temperature of the coolant is higher than the temperature threshold, the temperature control element 140 is bent toward one side of the first metal sheet 142, so that the stopper 146 is separated from the inlet hole 132A to connect the inlet tube IT and the first sub-chamber C1. In a usage scenario, when the heat-generating element under the heat dissipation bottom plate 110 generates a relatively large amount of waste heat due to a full load state, the temperature of the cooling liquid is higher than the temperature threshold, and then the temperature control element 140 is bent downward (as shown in FIG. 8 ) to escape from the liquid inlet hole 132A. Since the stopper 146 is separated from the liquid inlet hole 132A, the cooling liquid from the liquid inlet pipe IT can enter the first sub-chamber C1 through the liquid inlet hole 132A. As shown in FIG. 8, the temperature control element 140 is bent toward one side of the first metal sheet 142 to the maximum extent that the extension direction of the temperature control element 140 is parallel to the extension direction of the heat dissipation bottom plate 110 (that is, the temperature control element 140 contacts and is parallel to the top surface 110a of the heat dissipation bottom plate 110).

In the cooling liquid flow control device 100 of the present disclosure, when the temperature of the cooling liquid is between the temperature of the cooling liquid in the embodiment of FIG. 7 and the temperature of the cooling liquid in the embodiment of FIG. In a usage scenario, when the heat-generating element under the heat dissipation base plate 110 does not generate so much waste heat compared with the full-load state due to the part-load state, the temperature of the cooling liquid is lower than the temperature of the cooling liquid under the full-load state, so that the stopper 146 blocks the part of the liquid inlet hole 132A. Since the stopper portion 146 blocks part of the liquid inlet hole 132A, the coolant from the liquid inlet pipe IT can enter the first sub-chamber C1 through the liquid inlet hole 132A with a relatively small flow rate.

Through the above operations, the coolant flow control device 100 can control the flow of the coolant based on the temperature of the coolant in the chamber C, so as to save power.

In some embodiments, the temperature control element 140 is substantially disposed in the first sub-chamber C1, but the present disclosure is not limited thereto. In some embodiments, the temperature control element 140 may also be disposed in the second sub-chamber C2.

In some embodiments, the stop portion 146 is disposed near the liquid inlet hole 132A to stop and disengage from the liquid inlet hole 132A, but the present disclosure is not limited thereto. In some embodiments, the stop portion 146 can also be disposed near the liquid outlet hole 132B to stop and break away from the liquid inlet hole 132A.

In some embodiments, as shown in FIG. 1 , FIG. 2 , FIG. 6 , FIG. 7 and FIG. 8 , the fixing member S2 includes elements such as springs and screws, but the disclosure is not limited thereto. In some embodiments, the fixing member S2 may not include a spring. Although the disclosure discloses that the fixing base 120 is connected to the substrate by means of locking, the disclosure is not intended to limit the structure, method or means of connecting the fixing base 120 to the substrate.

In some embodiments, as shown in FIG. 1 , FIG. 2 , FIG. 5 , FIG. 7 and FIG. 8 , the fixing member S1 is substantially screwed. Although the present disclosure discloses that the heat dissipation bottom plate 110 and the fixing seat 120 are connected to each other by means of locking (for example, the heat dissipation bottom plate 110 and the fixing seat 120 are locked to each other through the fixing member S1), the present disclosure is not intended to limit the structure, method or means for connecting the heat dissipation bottom plate 110 and the fixing seat 120 to each other.

In some embodiments, the component of the cooling liquid may be liquid water (H ₂ O), but the present disclosure is not limited thereto. In some embodiments, the composition of the cooling liquid may be ethylene glycol (C ₂ H ₆ O ₂ ) or propylene glycol (C ₃ H ₈ O ₂ ). The above is just an example for simple description, and the present disclosure is not intended to limit the components of the cooling liquid.

In some implementations, the heat dissipation bottom plate 110 and the cooling module 130 are substantially separated, but the present disclosure is not limited thereto. In some implementations, the heat dissipation bottom plate 110 and the cooling module 130 may be formed integrally rather than separately. For example, the heat dissipation bottom plate 110 and the cooling module 130 can be integrally formed as a water-cooled box with a cavity C. As shown in FIG.

In some embodiments, the heat dissipation bottom plate 110 and the cooling module 130 are substantially tightly connected. Alternatively, in some embodiments, the heat dissipation bottom plate 110 and the cooling module 130 may be adhesively connected to each other. Alternatively, in some implementations, the heat dissipation bottom plate 110 and the cooling module 130 may be snap-fit connected to each other. The above is just an example for simple description, and the present disclosure is not intended to limit the structure, method or means of connecting the heat dissipation bottom plate 110 and the cooling module 130 to each other.

In some embodiments, the first metal sheet 142 and the second metal sheet 144 may be a combination of metal materials such as copper/aluminum or copper/stainless steel. The present disclosure is not intended to limit the material combination of the first metal sheet 142 and the second metal sheet 144 . It should be noted that the material combination of the first metal sheet 142 and the second metal sheet 144 must also consider whether it will chemically react with the cooling liquid to cause corrosion or damage to the temperature control element 140 .

In some embodiments, the temperature control element 140 may include at least two metal sheets with different thermal expansion coefficients.

In some embodiments, the stop portion 146 may be a flexible material such as plastic, rubber or cork, so as to stop the liquid inlet hole 132A more tightly. The above is just an example for simple description, and the present disclosure is not intended to limit the material of the stopper portion 146 .

In some embodiments, one end of the temperature control element 140 can be fixed to the pressing block 138 . For example, the pressing block 138 may have a protrusion extending downward through the positioning hole 148 to position the temperature control element 140 . In the embodiment where the pressing block 138 has a protrusion, the heat dissipation bottom plate 110 does not include the positioning post 112 . The present disclosure is not intended to limit the position of the temperature control element 140 disposed in the inner surface of the chamber C. Referring to FIG.

In some embodiments, the temperature control element 140 can be locked on the inner surface of the chamber C. As shown in FIG. Alternatively, in some embodiments, the temperature control element 140 can be glued to the inner surface of the chamber C. Or, in some embodiments, the temperature control element 140 can be snap-fitted on the inner surface of the chamber C. As shown in FIG. The present disclosure is not intended to limit the structure, method or means of connecting the temperature control element 140 to the inner surface of the chamber C.

From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the coolant flow control device of the present disclosure, since the temperature control element utilizes the characteristic that the bimetal sheet can be deformed based on the temperature of the coolant, the stop portion of the temperature control element can stop, partially stop, or break away from the liquid inlet hole to achieve the purpose of controlling the coolant flow. In the coolant flow control device disclosed in the present disclosure, since the bimetal sheet is used as the material of the temperature control element, not only can the power saving effect of the coolant flow control device be achieved, but also the construction space of the liquid cooling device can be effectively reduced.

In an embodiment of the present disclosure, the coolant flow control device disclosed in the present disclosure can be applied to a server, and the server can be used for artificial intelligence (AI) computing, edge computing, and can also be used as a 5G server, cloud server, or Internet of Vehicles server.

Although this disclosure has been disclosed as above in terms of implementation, it is not intended to limit this disclosure. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be defined by the scope of the appended patent application.

100: Coolant flow control device 110: heat dissipation bottom plate 110a: top surface 110b: bottom surface 112: positioning column 120: fixed seat 130: cooling module 132: top plate 132A: Inlet hole 132B: liquid outlet 134: outer ring wall 136: inner ring wall 138: Briquetting 140: temperature control element 142: The first metal sheet 144: Second metal sheet 146: stop part 148: positioning hole C: chamber C1: first subchamber C2: second subchamber IT: inlet pipe O: open OT: Outlet tube S1, S2: Fixing parts

In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more comprehensible, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram of a coolant flow control device according to an embodiment of the present disclosure. FIG. 2 is another schematic diagram of a coolant flow control device according to an embodiment of the present disclosure. FIG. 3A shows a partial schematic diagram of a cooling module according to an embodiment of the present disclosure. FIG. 3B shows another partial schematic diagram of the cooling module according to an embodiment of the present disclosure. FIG. 4 is a schematic diagram of a temperature control element according to an embodiment of the present disclosure. FIG. 5 shows a partial top view of a coolant flow control device according to an embodiment of the present disclosure. FIG. 6 is a cross-sectional view of a coolant flow control device according to an embodiment of the present disclosure. FIG. 7 is a schematic diagram of a stopper blocking a liquid inlet hole according to an embodiment of the present disclosure. FIG. 8 is a schematic diagram of a stopper disengaging from a liquid inlet hole according to an embodiment of the present disclosure.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

100: Coolant flow control device 110: heat dissipation bottom plate 110a: top surface 120: fixed seat 130: cooling module 140: temperature control element C: chamber IT: inlet pipe OT: Outlet tube S1, S2: Fixing parts

Claims (9)

A coolant flow control device, comprising: a heat dissipation bottom plate configured to contact a heating element on a substrate; a fixing seat connected to the heat dissipation bottom plate and configured to be fixed to the substrate; a cooling module connected to a top surface of the heat dissipation bottom plate to form a cavity configured to circulate a cooling liquid; Adjusting the flow rate of the coolant entering and leaving the chamber, wherein the temperature control element further includes: a first metal sheet having a first coefficient of thermal expansion; and a second metal sheet attached to the first metal sheet and having a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is smaller than the second coefficient of thermal expansion. The coolant flow control device according to claim 1, wherein the cooling module includes a liquid inlet pipe and a liquid outlet pipe, and the chamber further includes: a first subchamber configured to receive the coolant from the liquid inlet pipe; and a second subchamber surrounding the first subchamber and configured to deliver the coolant from the first subchamber to the liquid outlet pipe. The cooling liquid flow control device according to claim 2, wherein there is an opening between the first sub-chamber and the second sub-chamber, and the opening allows the cooling liquid to flow between the first sub-chamber and the second sub-chamber. The coolant flow control device according to claim 3, wherein the cooling module further comprises: a top plate having a liquid inlet hole and a liquid outlet hole, wherein the liquid inlet hole is connected to the liquid inlet pipe and the first sub-chamber, and the liquid outlet hole is connected to the liquid outlet pipe and the second sub-chamber; an outer ring wall extends vertically from the edge of the top board and surrounds the edge of the top board, wherein the outer ring wall is connected to the heat dissipation bottom plate; and an inner ring wall extends vertically from the top plate and is surrounded by the outer ring wall, wherein The inner ring wall is connected to the heat dissipation bottom plate, so that the top plate, the inner ring wall, and the heat dissipation bottom plate jointly define the first subchamber, and the top plate, the outer ring wall, the inner ring wall, and the heat dissipation bottom plate jointly define the second subchamber, and the second subchamber surrounds the first subchamber. The coolant flow control device according to claim 4, wherein the opening is located on the inner ring wall, so that the coolant flows into the second sub-chamber outside the first sub-chamber through the opening. The coolant flow control device as described in Claim 4, Wherein the temperature control element further includes a stop part disposed on the second metal sheet, and the stop part is configured to stop and disengage from the liquid inlet hole. The coolant flow control device according to claim 6, wherein the end of the temperature control element away from the stopper portion is connected to the inner surface of the chamber. The coolant flow control device as claimed in claim 6, wherein the temperature control element is configured to: bend toward one side of the second metal sheet when the temperature of the coolant is lower than a temperature threshold, so that the stopper stops the liquid inlet hole so as not to communicate with the liquid inlet pipe and the first sub-chamber. The coolant flow control device according to claim 6, wherein the temperature control element is configured to: bend toward one side of the first metal sheet when the temperature of the coolant is higher than a temperature threshold, so that the stopper part is separated from the liquid inlet hole to connect the liquid inlet pipe and the first sub-chamber.

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