CN111613557A - Wafer processing equipment - Google Patents
Wafer processing equipment Download PDFInfo
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- CN111613557A CN111613557A CN202010486214.XA CN202010486214A CN111613557A CN 111613557 A CN111613557 A CN 111613557A CN 202010486214 A CN202010486214 A CN 202010486214A CN 111613557 A CN111613557 A CN 111613557A
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- 230000005540 biological transmission Effects 0.000 claims abstract description 72
- 235000012431 wafers Nutrition 0.000 claims description 214
- 239000000463 material Substances 0.000 claims description 99
- 238000001816 cooling Methods 0.000 claims description 27
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 38
- 238000000034 method Methods 0.000 abstract description 25
- 230000008569 process Effects 0.000 abstract description 18
- 230000002787 reinforcement Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000032258 transport Effects 0.000 description 9
- 230000003014 reinforcing effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000001174 ascending effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005273 aeration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The application discloses wafer treatment facility includes: the device comprises a first transmission unit, a baking unit and an exposure adding unit; the first transmission unit is at least used for transmitting the wafer from the baking unit to the exposure unit; the wafer processing equipment provided by the application comprises two functions of baking and adding exposure, and the wafer is transported between the baking unit and the adding exposure unit through the first transmission unit, so that at least two processes of baking and adding exposure can be automatically completed through one piece of equipment, and the reinforcement requirement on the photoresist on the surface of the wafer is met; thereby the risk of manual operation has been avoided, has promoted production efficiency, has reduced the board cost.
Description
Technical Field
The present invention relates generally to the field of semiconductor manufacturing, and more particularly to a wafer processing apparatus.
Background
In the field of semiconductor manufacturing, due to the fact that the number of the bumps designed on a Drive IC chip is large, the distance between the bumps is small, in order to guarantee the appearance of the bumps in the packaging process of AU (automatic wiring control) Bumping, photoresist needs to be reinforced in a baking and exposure mode in the hole opening process of yellow light resistance, Bump deformation and adhesion caused by erosion of electroplating liquid in the electroplating process are prevented, negative photoresist is generally used in the Bumping industry, baking and exposure of the photoresist are aimed at, the industry is generally achieved through at least two procedures in the three procedures and two machines, and in the first step (baking), the photoresist is baked by using an oven, and the bonding force of the photoresist is increased; step two (adding exposure), using an adding exposure machine to irradiate the whole surface of the photoresist so as to make the molecular bonding of the photoresist better; step three (baking), baking the photoresist by using an oven to increase the binding force of the photoresist, namely, at least performing the treatment by the first step and the second step; or through the second and third steps; or the processing is carried out through three processes, and the chip processing by using the machine table has at least the following problems that the oven is generally operated manually, the material box needs to be converted in the midway, and higher operation risk exists; the process uses more machines, the flow is complicated, and the machine cost is high.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a wafer processing apparatus.
In a first aspect, the present invention provides a wafer processing apparatus, which can satisfy the requirements of using one apparatus and performing at least one baking and one exposure processing on a photoresist on a wafer surface, and satisfying the exposure requirements of the photoresist on the wafer surface; the wafer processing apparatus includes: the device comprises a first transmission unit, a baking unit and an exposure adding unit; the first transmission unit is at least used for transmitting the wafer from the baking unit to the exposure unit; and/or the first transmission unit is at least used for transmitting the wafer from the exposure unit to the baking unit.
Specifically, when the wafer processing equipment provided by the application is used for reinforcing the photoresist on the surface of the wafer, the wafer to be processed can be firstly transported to a baking unit for baking, and then the baked wafer is transported to an exposure unit for exposure processing through a first transmission unit, so that the photoresist on the surface of the wafer is baked and exposed for one time, the reinforcing requirement on the photoresist on the surface of the wafer is met, and then the processed wafer is transported to the outside of the equipment through the first transmission unit, so that the photoresist on the surface of the wafer is reinforced; in order to guarantee reinforced reliability, can also transport the wafer through adding exposure processing to the unit of toasting once more through first transmission unit, accomplish the second time to wafer surface photoresist and toast the processing, guarantee the reinforcement effect, then transport the wafer outside equipment through first transmission unit, accomplish the wafer surface photoresist: reinforcement treatment of three procedures of baking, exposure and baking; in addition, the wafer can be conveyed to the exposure adding unit firstly, the photoresist on the surface of the wafer is subjected to exposure adding treatment, then the wafer subjected to exposure adding treatment is conveyed to the baking unit through the first transmission unit for baking treatment, so that the one-time exposure adding treatment and the one-time baking treatment of the photoresist on the surface of the wafer are completed, the reinforcement requirement is met, and then the wafer is conveyed out of the equipment through the first transmission unit; the wafer processing equipment can finish the reinforcement work of at least one baking treatment and one exposure treatment on the surface of the wafer by one equipment, thereby reducing the working procedures and the cost of the machine.
Furthermore, the baking unit is provided with a first material inlet and outlet, the exposure adding unit is provided with a second material inlet and outlet, the first material inlet and outlet and the second material inlet and outlet are oppositely arranged, and the first transmission unit is arranged between the first material inlet and outlet and the second material inlet and outlet.
Specifically, when the wafer is processed, the equipment enters and exits the baking unit and the exposure adding unit through the first material inlet and outlet and the second material inlet and outlet, the first material inlet and outlet and the second material inlet and outlet are oppositely arranged, and the first transmission unit is arranged between the first material inlet and outlet and the second material inlet and outlet, so that the distance for carrying the wafer by the first transmission unit is reduced, and the working efficiency of the equipment is improved.
Furthermore, an oven, a pre-alignment platform and a second transmission unit are arranged in the baking unit, and the wafer is transported to the oven through the second transmission unit by the pre-alignment platform.
Specifically, an oven is arranged in the baking unit, the wafer is baked through the oven, a pre-alignment platform is further arranged in the baking unit, and when the wafer is conveyed into the baking unit through a first conveying unit or manually, the wafer is placed on the pre-alignment platform to be centered and positioned; because generally be provided with the first work or material rest of high temperature resistance in the oven, first work or material rest is the multilayer setting, toast the wafer and handle and generally place the wafer in proper order and carry out the multichip centralized processing on first work or material rest, carry out the prepositioning through the counterpoint platform to the wafer in advance, then carry the wafer to the oven on the counterpoint platform in advance through second transmission unit, place in proper order on first work or material rest, can guarantee through the counterpoint platform in advance that second transmission unit can accurately place on the work or material rest, reduce the risk of collision.
Further, the baking unit further comprises a cooling unit, and the wafer is transported to the cooling unit through the second transmission unit by the baking oven.
Specifically, a cooling unit is further arranged in the baking unit and used for cooling the baked wafer, so that the cooling time of the wafer is shortened, the time for reinforcing the photoresist on the surface of the wafer by equipment is shortened, and the working efficiency of the equipment is improved.
Further, the oven is provided with a third material inlet and outlet, the cooling unit is provided with a fourth material inlet and outlet, the third material inlet and outlet and the fourth material inlet and outlet are oppositely arranged, and the second transmission unit is arranged between the third material inlet and outlet and the fourth material inlet and outlet.
Specifically, the third material inlet and outlet and the fourth material inlet and outlet are oppositely arranged, so that the conveying distance of the second conveying unit for conveying the wafers can be reduced, and the working efficiency of the equipment is improved.
Furthermore, the oven and the cooling unit are internally provided with a liftable material bearing platform.
Further, the pre-alignment platform comprises a table plate and at least two clamping pieces oppositely arranged around the table plate, and the at least two clamping pieces can slide along the radial direction of the table plate.
Further, the platform disc is arranged in a lifting mode.
Further, the device also comprises a wafer loading platform for placing the wafer to be processed; and the wafer is transported to the baking unit or the exposure unit through the first transmission unit by the wafer loading platform.
Specifically, the equipment is also provided with a wafer loading table, and the wafer to be processed is placed on the wafer loading table and is conveyed to the baking unit or the exposure unit through the first conveying unit, so that the equipment can fully automatically complete the reinforcement work on the photoresist on the surface of the wafer.
Further, a third material rack is arranged between the baking unit and the adding and exposing unit, the third material rack is arranged in a multi-layer mode, and the first transmission unit can convey the wafers in the adding and exposing unit to the third material rack; and the wafers on the third material rack can be conveyed to the baking unit.
Specifically, as a plurality of wafers are generally processed in the baking unit at one time, and the exposure adding unit can only process one wafer at one time, when the wafers are baked, exposed and baked, the waiting time is too long, the wafers in the baking unit can be conveyed to the exposure adding unit to be uniformly placed on the third material frame after being subjected to exposure adding treatment by arranging the third material frame, and after the wafers in the baking unit are all subjected to exposure adding treatment, the wafers are conveyed to the baking unit by the first conveying unit to be baked, so that the waiting time is reduced, and the working efficiency of the equipment is further improved.
Advantageous effects
The invention provides a wafer processing apparatus, comprising: the device comprises a first transmission unit, a baking unit and an exposure adding unit; the first transmission unit is at least used for transmitting the wafer from the baking unit to the exposure unit; or/and the first transmission unit is at least used for transporting the wafer from the exposure adding unit to the baking unit, the wafer processing equipment provided by the equipment comprises baking and exposure adding functions, and the wafer is transported between the baking unit and the exposure adding unit through the first transmission unit, so that at least two processes of baking and exposure adding of the photoresist on the surface of the wafer can be completed through one piece of equipment, the reinforcement requirement on the photoresist on the surface of the wafer is met, the risk of manual operation is avoided, the production efficiency is improved, and the machine cost is reduced.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic overall structure diagram of an embodiment of the present invention;
FIG. 2 is a schematic structural view of an oven according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first transmission unit according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an exposure unit according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an internal structure of an exposure unit according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a pre-alignment stage according to an embodiment of the present invention.
Reference numerals: the apparatus comprises a first transmission unit 10, a base 110, a rotating shaft 112, an inserting and taking arm 120, an exposure unit 20, a lamp chamber 210, a mercury lamp chamber 211, a first reflective mirror 212, a shutter 213, a second reflective mirror 214, a condenser 215, a first bearing table 220, a second material inlet/outlet 21, a baking unit 30, a first material inlet/outlet 31, a pre-alignment platform 310, a table plate 311, a clamping piece 312, a power device 313, an oven 300, a second bearing table 301, a first material rack 302, a third material inlet/outlet 301, a cooling unit 320, a fourth material inlet/outlet 321, a wafer loading table 40, a third material rack 50, a power supply system 60, a control system 70 and a wafer 90.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1, in a first aspect, the present invention provides a wafer processing apparatus, which can satisfy the requirements of using one apparatus and performing at least one baking and one exposure process on a photoresist on a wafer surface, and satisfying the exposure requirements of the photoresist on the wafer surface; the wafer processing apparatus includes: the first transmission unit 10, the baking unit 30 and the adding and exposing unit 20; the first conveying unit 10 is at least used for conveying the wafer from the baking unit 30 to the exposure unit 20; or/and the first transmission unit 10 is at least used for transmitting the wafer from the adding and exposing unit 20 to the baking unit 30.
Specifically, when the wafer processing equipment provided by the application is used for reinforcing the photoresist on the surface of the wafer, the wafer to be processed can be firstly transported to the baking unit 30 for baking, and then the baked wafer is transported to the exposure unit 20 for exposure processing through the first transmission unit 10, so that the photoresist on the surface of the wafer is baked and exposed for one time, the reinforcing requirement on the photoresist on the surface of the wafer is met, and then the processed wafer is transported to the outside of the equipment through the first transmission unit 10, so that the photoresist on the surface of the wafer is reinforced; in order to guarantee the reliability of reinforcement, can also transport the wafer that will add the exposure processing to toasting unit 30 once more through first transmission unit 10, accomplish the second time to wafer surface photoresist and toast the processing, guarantee the reinforcing effect, then transport the wafer outside equipment through first transmission unit 10, accomplish to wafer surface photoresist: baking, adding exposure, baking and reinforcing treatment in three processes; in addition, the wafer can be transported to the exposure adding unit 20, the photoresist on the surface of the wafer is subjected to exposure adding treatment, then the wafer subjected to exposure adding treatment is transported to the baking unit 30 through the first transmission unit 10 to be baked, so that the one-time exposure adding treatment and the one-time baking treatment of the photoresist on the surface of the wafer are completed, the reinforcement requirement is met, and then the wafer is transported to the outside of the equipment through the first transmission unit 10; the wafer processing equipment can finish the reinforcement work of at least one baking treatment and one exposure treatment on the surface of the wafer by one equipment, thereby reducing the working procedures and the cost of the machine.
Referring to fig. 1, 4 and 5, the baking unit 30 is provided with a first material inlet and outlet 31, the aeration unit 20 is provided with a second material inlet and outlet 21, the first material inlet and outlet 31 and the second material inlet and outlet 21 are oppositely arranged, and the first conveying unit 30 is arranged between the first material inlet and outlet 31 and the second material inlet and outlet 21.
Specifically, referring to fig. 1, 4 and 5, the exposure adding unit 20 includes a lamp chamber 210 and a first stage 220 disposed below the lamp chamber 210, the first stage 220 is disposed near the second material inlet/outlet 21 to facilitate transportation of a subsequent wafer, the lamp chamber 210 includes a mercury lamp chamber 211 and a first reflecting mirror 212, the lamp chamber 210 is provided with an optical path assembly 230, the optical path assembly 230 is configured to irradiate light emitted from the mercury lamp chamber 211 to the first stage 220 in a certain direction, the optical path assembly 230 includes a second reflecting mirror 214 and a condensing mirror 215, and is provided with an outlet 231 facing the first stage 220, the light from the lamp chamber 210 is emitted from the outlet 231 through the second reflecting mirror 214 and the condensing mirror 215, a shutter 213 is disposed between the lamp chamber 210 and the optical path assembly 230, and the time for irradiating a wafer disposed on the first stage 220 is controlled by the shutter 213.
Specifically, when the equipment processes the wafer, the equipment enters and exits the baking unit 30 and the adding and exposing unit 20 through the first material inlet and outlet 31 and the second material inlet and outlet 21, the first material inlet and outlet 31 and the second material inlet and outlet 21 are respectively arranged on the side walls of the baking unit 30 and the adding and exposing unit 20, the first material inlet and outlet 31 and the second material inlet and outlet 21 are oppositely arranged, and the first conveying unit 10 is arranged between the first material inlet and outlet 31 and the second material inlet and outlet 21, so that the arrangement mode has a compact structure, the volume of the equipment is reduced, and the conveying of the wafer between the baking unit 30 and the adding and exposing unit 20 can be met without sliding in the horizontal direction of the first conveying unit 10, so that unnecessary actions are reduced, the distance for conveying the wafer by the first conveying unit 10 is reduced, and the working efficiency of the equipment is improved.
Specifically, referring to fig. 3, the specific structure of the first conveying unit 10 includes a liftable base 110 disposed between the first material inlet/outlet 31 and the second material inlet/outlet 21, a rotating shaft 112 vertically disposed above the base 110 and capable of rotating on the base 110, a retractable arm 120 fixed above the rotating shaft 112, and a process of the first conveying unit 10 transferring the wafer to the baking unit is as follows: the rotating shaft 112 rotates to enable the telescopic arm to point to the position of the wafer, the telescopic arm 120 extends out of the position below the wafer, when the liftable base 110 rises upwards, the telescopic arm 120 lifts the wafer, the telescopic arm 120 retracts to take out the wafer, then the rotating shaft 112 rotates to enable the wafer to rotate to the first material inlet/outlet 31 of the baking unit 30, the first material inlet/outlet 31 is opened, the telescopic arm 120 extends out to enter the first material inlet/outlet 31, then the base 110 descends to place the wafer in the baking unit, and the telescopic arm 120 retracts to finish the carrying of the wafer of the baking unit; specifically, a jacking device may be arranged below the base 110 to drive the base to perform a lifting motion, the jacking device may be a hydraulic cylinder, an air cylinder or other telescopic mechanism vertically arranged below the base 110, the base 110 is arranged on a telescopic rod of the telescopic mechanism, and it is understood that the base 110 may also be a telescopic rod body of the telescopic device; the jacking device can also be including the lead screw of vertical setting, and rotate the slider of setting on the lead screw, base 110 can with slider fixed connection, but make base 110 reciprocating lift in vertical direction through lead screw and slider relative rotation, can understand that base 110 can also be designed to can follow the horizontal direction and slide under some needs's circumstances, and the accessible sets up the slide rail in the below of jacking device, supplies the jacking device to slide on the horizontal direction.
The telescopic arm 120 may be a first rod and a second rod which are connected in a relative sliding manner, the sliding direction of the telescopic arm 120 slides along the length direction of the first rod and the second rod, the end of the first rod away from the second rod is fixedly connected with the rotating shaft 112, so that the second rod can slide on the first rod along the length direction of the first rod, so that the telescopic arm 120 performs telescopic action, the end of the second rod away from the first rod is a material taking end, the material taking end can be connected with a material taking part 121, and the specific structure of the material taking part 121 may be a U-shaped structure as shown in fig. 1; the rotating shaft 112 is vertically and rotatably arranged on the base 110, the rotating shaft 112 can be connected with the servo motor through a coupler, power is provided by the servo motor, and the rotating shaft 112 can also be an output shaft of the servo motor.
The operation of the first transfer unit 10 for transferring the wafer to the loading and exposure unit 20 or transferring the wafer from the baking unit 30 to the loading and exposure unit 20 is similar to that described above, and the description thereof is omitted.
Referring to fig. 1, an oven 300, a pre-alignment stage 310 and a second transfer unit 330 are disposed in the baking unit 30, and a wafer is transported from the pre-alignment stage 310 to the oven 300 through the second transfer unit 330.
Specifically, an oven 300 is disposed in the baking unit 30, the wafer is baked by the oven 300, a pre-alignment platform 310 is further disposed in the baking unit 30, and when the wafer is transported into the baking unit 30 by the first transmission unit 10 or manually, the wafer is placed on the pre-alignment platform 310 for alignment and positioning, and then the wafer on the pre-alignment platform 310 is transported to the oven 300 by the second transmission unit 330; specifically, referring to fig. 2, since the oven 300 is generally provided with the first rack 302 with high temperature resistance, the first rack 302 is provided in multiple layers, the wafer baking process generally includes sequentially placing the wafers on the first rack 302 for centralized processing, pre-positioning the wafers by the pre-alignment platform 310, then transporting the wafers on the pre-alignment platform 310 to the oven 300 by the second transmission unit 330, sequentially placing the wafers on the first rack 302, and pre-positioning the wafers by the pre-alignment platform 310, which can ensure that the wafers can be accurately inserted into the first rack 302 by the second transmission unit 330, so as to reduce the risk of collision, specifically, the first rack 302 is made of a high temperature resistant material, for example, metal.
Referring to fig. 1, the bake unit 30 further includes a cooling unit 321, and the wafer is transported from the oven 300 to the cooling unit 321 through the second transfer unit 330.
Specifically, the baking unit 30 is further provided with a cooling unit 321 for cooling the baked wafer, so as to shorten the cooling time of the wafer, thereby reducing the time for the equipment to reinforce the photoresist on the surface of the wafer, and improving the working efficiency of the equipment.
The specific work flow in the baking unit is as follows: the second transmission unit 330 transports the wafer from the pre-positioning platform 310 to the oven, the wafer is sequentially placed on the first material rack 302 in the oven 300, then the oven 300 performs baking processing on the wafer, after the baking processing, the wafer is transported to the cooling unit by the second transmission unit 302, the cold area unit 321 can be internally provided with a second material rack which is the same as the one in the oven 300, the wafer is sequentially placed on the second material rack, the wafer is intensively cooled by the cooling unit 321, the cooled wafer is sequentially taken out and placed on the pre-alignment platform 310 by the second transmission unit 330, and the wafer on the pre-alignment platform 310 is transported to the exposure unit 20 or outside the device by the first transmission unit 10; the specific structure of the second transmission unit 330 is similar to that of the first transmission unit 10, and the operation mode thereof is also the same as that of the first transmission unit 10, and therefore, the detailed description thereof is omitted.
The pre-alignment platform 310 is disposed near the first material inlet/outlet 31 and between the second transfer unit 330 and the first material inlet/outlet 31, and the pre-alignment platform 310 is disposed near the first material inlet/outlet 31 to facilitate the wafer to enter and exit the baking unit 30.
Referring to fig. 1, further, the oven 300 is provided with a third material inlet and outlet 301, the cooling unit 320 is provided with a fourth material inlet and outlet 321, the third material inlet and outlet 301 and the fourth material inlet and outlet 321 are oppositely arranged, and the second transfer unit 330 is arranged between the third material inlet and outlet 301 and the fourth material inlet and outlet 321.
Specifically, the third material inlet 301 and the fourth material inlet 321 are oppositely arranged, so that the conveying distance of the second conveying unit 330 for conveying the wafer can be reduced, and the working efficiency of the equipment can be increased.
Referring to fig. 2, further, a material loading platform 301 capable of ascending and descending is disposed in each of the oven 300 and the cooling unit 320, specifically, a first rack 302 in the oven 300 is disposed above the material loading platform 301, the ascending and descending of the first rack 302 can be controlled by the ascending and descending of the material loading platform 301, when the second conveying unit 330 conveys wafers into the oven 300 and the cooling unit 320, the ascending and descending of the material loading platform 301 is controlled to align the highest layer of the first rack 302 with the wafer to be placed in the oven by the second conveying unit 330, the second conveying unit 330 places the wafer on the first rack 302, then the material loading platform 301 ascends by a layer height, so that the next layer of the first rack 302 can align with the wafer to be placed in the oven by the second conveying unit 330, so that the second conveying unit 330 can accurately place the wafer on the next layer of the first rack 302, such that the second transfer unit 330 sequentially places the wafers on the first stacks 302.
The structure and operation of the cooling unit 320 are the same as those of the oven 300, and thus, the detailed description thereof is omitted.
Referring to fig. 6, further, the pre-alignment stage 310 includes a stage plate 311 and at least two clamping members 312 oppositely disposed around the stage plate 311, the at least two clamping members are slidable along a radial direction of the stage plate 311, specifically, the wafer 90 is placed on the stage plate 311, the wafer 90 is aligned by sliding the clamping members 312 along the radial direction of the stage plate 311, and the at least two clamping members 312 are located at equal distances from a center of the stage plate 311; the clamping piece is connected with a power device 313, the power device 313 provides sliding power for the clamping piece 312, and the power device 313 can be a hydraulic oil cylinder or an air cylinder or a motor and provides power for the clamping piece 312 through driving a screw rod.
Referring to fig. 6, the table 311 is arranged in a lifting manner, and when the first transmission unit 10 and the second transmission unit 330 take the wafer off from the table 311, the table 311 descends to separate the wafer from the upper surface of the table 311, so that the wafer is prevented from deviating due to the friction force between the taking part of the telescopic arm 120 and the wafer, and the taking accuracy of the first transmission unit 10 and the second transmission unit 330 is ensured; when the first transmission unit 10 and the second transmission unit 330 take away and place the wafer on the platen 311, the platen 311 jacks up the wafer, so that the wafer is separated from the material taking part of the telescopic arm 120 of the first transmission unit 10 and the second transmission unit 330, and then the telescopic arm 120 retracts and withdraws, thereby avoiding the wafer from deviating due to the friction force between the material taking part of the telescopic arm 120 and the wafer.
Referring to fig. 1, further, the wafer processing apparatus further includes a wafer loading table 40 for placing a wafer to be processed; the wafer is transported from the wafer loading table 40 to the baking unit 30 or the exposure unit 20 through the first transporting unit 10.
Specifically, the equipment is further provided with a wafer loading table 40, and the wafer to be processed is placed on the wafer loading table 40 and is conveyed to the baking unit 30 or the exposure adding unit 20 through the first conveying unit 10, so that the equipment can fully automatically complete the strengthening work of the photoresist on the surface of the wafer.
Referring to fig. 1, further, a third rack 50 is disposed between the baking unit 30 and the loading and exposing unit 20, the third rack 50 is disposed in multiple layers, and the first conveying unit 10 can convey the wafers in the loading and exposing unit 20 to the third rack 50; and the wafers on the third rack 50 can be carried to the baking unit 30.
Specifically, since the baking unit 30 generally performs the baking process on a plurality of wafers at a time, and the exposure adding unit 20 can only process one wafer at a time, when the wafers are simultaneously subjected to the three processes of baking, exposure adding and baking, the whole work flow of the apparatus is as follows: the wafer is first transported from the wafer loading platform 40 to the pre-alignment platform 310 by the first transporting unit 10, then transported from the pre-alignment platform 310 to the oven 300 by the second transporting unit 310, placed in the first rack 302 of the oven 300, and the first rack 302 is filled with wafers (generally, the first rack 302 can place 25 wafers at most at one time), then the oven 300 performs the baking operation on the wafer, after the baking operation is completed, the wafer in the oven is transported to the cold area unit 320 by the second transporting unit 330 for the cooling operation, after the cooling operation is completed, the wafer in the cold area unit 320 is taken out by the second transporting unit 320 and placed on the pre-alignment platform 310, then the wafer on the pre-alignment platform 310 is transported to the adding unit 20 by the first transporting unit 10 for the adding exposure, because the wafer is transported to the oven for the baking again after the adding exposure, therefore, the first transmission unit 10 and the second transmission unit are both waiting during the process of wafer exposure, and only after the wafer is exposed, the first transmission unit 10 transports the wafer in the exposure unit 20 to the pre-alignment platform 310, and then the second transmission unit 310 transports the wafer from the pre-alignment platform 310 to the oven 300, the wafer in the cooling unit 320 can be transported to the exposure unit 20 for exposure;
by arranging the third rack 50 between the baking unit 30 and the adding and exposing unit 20, the second transmission unit 310 can transport the wafer from the cooling unit 320 to the pre-alignment platform 310 during the process of adding and exposing the wafer, the first transmission unit 10 can place the exposed wafer on the third rack 50 after the wafer adding and exposing is completed, then the wafer can be taken out from the pre-alignment platform 310 and transported to the adding and exposing unit 20, the operations are repeated to carry out the adding and exposing of all the wafers in the cooling unit 320, and then the first transmission unit 10 and the second and transmission unit 310 transport the wafers on the third rack 50 to the oven 300 in sequence, and the wafer is baked for the second time, so that the waiting time is reduced, and the working efficiency of the equipment is further improved.
Specifically, the wafer processing apparatus provided by the present application can also be used for photoresist baking operation only on the wafer surface or photoresist exposure operation only on the wafer surface, and referring to fig. 1, the wafer processing apparatus provided by the present application is provided with a power supply system 60, the system is used for supplying power to electric equipment in the equipment, and further comprises a control system 70, wherein the control system 70 is respectively electrically connected with the oven 300, the cooling unit 320, the pre-alignment platform 310, the second transmission unit 330, the exposure adding unit 20 and the first transmission unit 10, corresponding parameters and programs are set according to needs through the control system 70 in the working process, the wafer processing equipment can automatically perform corresponding operations on the wafer, such as only baking operation and only exposure adding operation are performed on the wafer, or performing the operations of two procedures of adding exposure and baking, or performing the operations of three procedures of baking, adding exposure and baking.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A wafer processing apparatus, comprising:
the device comprises a first transmission unit, a baking unit and an exposure adding unit;
the first transmission unit is at least used for transmitting the wafer from the baking unit to the exposure unit; and/or the first transmission unit is at least used for transmitting the wafer from the exposure unit to the baking unit.
2. The wafer processing apparatus according to claim 1, wherein the baking unit is provided with a first material inlet and outlet, the exposure adding unit is provided with a second material inlet and outlet, the first material inlet and outlet and the second material inlet and outlet are oppositely arranged, and the first conveying unit is arranged between the first material inlet and outlet and the second material inlet and outlet.
3. The wafer processing apparatus as claimed in claim 2, wherein an oven, a pre-alignment platform and a second transmission unit are disposed in the baking unit, and the wafer is transported from the pre-alignment platform to the oven through the second transmission unit.
4. The wafer processing apparatus of claim 3, wherein the bake unit further comprises a chill unit to which wafers are transported by the oven through the second transfer unit.
5. The wafer processing apparatus of claim 4, wherein the oven is provided with a third material inlet/outlet, the cooling unit is provided with a fourth material inlet/outlet, the third material inlet/outlet and the fourth material inlet/outlet are oppositely disposed, and the second transfer unit is disposed between the third material inlet/outlet and the fourth material inlet/outlet.
6. The wafer processing apparatus of claim 4, wherein a liftable material stage is disposed in each of the oven and the cooling unit.
7. The wafer processing apparatus of claim 3, wherein the pre-alignment stage comprises a platen and at least two clamps oppositely disposed around the platen, the at least two clamps being slidable in a radial direction of the platen.
8. The wafer processing apparatus of claim 7, wherein the platen is elevationally disposed.
9. The wafer processing apparatus according to any of claims 1 to 8, further comprising a wafer loading table for placing a wafer to be processed; and the wafer is transported to the baking unit or the exposure unit through the first transmission unit by the wafer loading platform.
10. The wafer processing apparatus according to claim 9, wherein a third rack is further disposed between the baking unit and the exposure unit, the third rack is disposed in multiple layers, and the first conveying unit can convey the wafer in the exposure unit to the third rack; and the wafers on the third material rack can be conveyed to the baking unit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010486214.XA CN111613557A (en) | 2020-06-01 | 2020-06-01 | Wafer processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010486214.XA CN111613557A (en) | 2020-06-01 | 2020-06-01 | Wafer processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112987505A (en) * | 2021-02-23 | 2021-06-18 | 陈祎雯 | Wafer lithography apparatus |
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