CN112987505B - Wafer lithography apparatus - Google Patents
Wafer lithography apparatus Download PDFInfo
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- CN112987505B CN112987505B CN202110201454.5A CN202110201454A CN112987505B CN 112987505 B CN112987505 B CN 112987505B CN 202110201454 A CN202110201454 A CN 202110201454A CN 112987505 B CN112987505 B CN 112987505B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer photoetching device, which structurally comprises a processing block, a heat dissipation port, a photoetching block and a control console, wherein the bottom of the side end of the processing block is provided with the heat dissipation port, the photoetching block is connected with the right end of the processing block, the control console is clamped on the right side of the front end of the photoetching block, the photoetching block comprises a photoetching machine, a conveyor belt, a photoetching platform and a wafer collecting box, the photoetching platform comprises a support plate, a chain, a photoetching platform, a sliding groove and a tray, the tray comprises a material carrying disc, a clamping block, a side sliding groove, a material guiding block, a reset spring and a placing plate, the material guiding block comprises a mounting groove, a rubber ring and a buffer cushion, the buffer cushion comprises a guide strip, a hollow groove, a lower top block and a support pad, the invention utilizes the material guiding block to slide in the side sliding groove, so that the height of the material guiding block can be reduced while moving rightwards, thereby the wafer is flatly placed on the placing plate, and the inner end of the placing plate can be clamped, the condition that the wafer deflects because of inertial whipping when the tray moves is avoided.
Description
Technical Field
The invention relates to the field of wafer photoetching development, in particular to wafer photoetching equipment.
Background
The wafer needs to be subjected to processes of photoetching, developing, slicing and the like during processing, the photoetching is one of the most important links in the wafer processing, a wafer needs to be flatly placed in a supporting panel during photoetching of the wafer, and the end face of the wafer is subjected to photoetching by utilizing laser, so that the whole photoetching process is completed.
Based on the above findings, the present inventors found that the existing wafer lithography apparatus mainly has the following disadvantages, for example: the tray needs to be moved in the photoetching process of the wafer so that laser can conveniently carry out photoetching on another area of the wafer, and the wafer can be shifted forwards through inertia on the end face of the tray at the moment when the tray stops moving, so that the photoetching position of the wafer by the laser is deviated.
Disclosure of Invention
In view of the above problems, the present invention provides a wafer lithography apparatus.
In order to achieve the purpose, the invention is realized by the following technical scheme: a wafer photoetching device structurally comprises a processing block, a heat dissipation port, a photoetching block and a control console, wherein the heat dissipation port is formed in the bottom of the side end of the processing block, the photoetching block is connected to the right end of the processing block, the control console is clamped on the right side of the front end of the photoetching block, the photoetching block comprises a photoetching machine, a conveying belt, a photoetching platform and a wafer collecting box, the photoetching machine is arranged at the top end of the interior of the photoetching machine, the conveying belt is transversely installed at the side end of the interior of the photoetching block, the photoetching platform is located below the conveying belt, and the wafer collecting box is arranged at the bottom end of the interior of the photoetching block.
Further, the photoetching platform comprises a supporting plate, a chain, a photoetching platform, a sliding groove and a tray, wherein the chain is arranged at the upper end of the supporting plate, the photoetching platform is arranged at the top end of the photoetching platform, the sliding groove is arranged at the upper end of the photoetching platform, the tray is clamped in the sliding groove, and the tray is movably matched with the chain.
Further, the tray is including carrying charging tray, block, side spout, guide block, reset spring, placing the board, the upper end of carrying the charging tray is for cutting open empty form, the block is equipped with two, and inlays the bottom side of carrying the charging tray admittedly to with chain clearance fit, the inside both ends at carrying the charging tray are installed to the groove symmetry that sideslips, the guide block is in the side spout, reset spring installs the bottom side at the guide block, place the board setting at the inside positive centre of carrying the charging tray, the side spout is 15 degrees with the contained angle that carries the charging tray terminal surface to form.
Further, the guide block includes mounting groove, rubber circle, blotter, the mounting groove sets up the up end at the guide block, the rubber circle is equipped with two, and inlays respectively at the inside both ends of mounting groove, the blotter tiling is at the up end of guide block, the guide block covers the terminal surface of mounting groove, and the bottom is connected with the rubber circle.
Further, the blotter includes gib block, dead slot, kicking block, supporting pad down, the gib block is equipped with more than five, and transversely inlays the up end in the blotter, the dead slot sets up the inside at the blotter, the kicking block is equipped with more than three down, and transverse arrangement in the top of dead slot, the supporting pad is equipped with more than three, and transverse arrangement under the kicking block, the gib block is the plastics material, the inside of supporting pad is for cuing open the empty form.
Further, the placing plate comprises a rolling groove, a roller and a clamping device, the rolling groove is formed in the placing plate, the roller is clamped in the rolling groove, the clamping device is installed at the upper end of the roller, and the roller is in sliding fit with the rolling groove.
Further, clamping device includes movable groove, pull rod, clutch blocks, extension spring, presss from both sides tight pad, the movable groove sets up in clamping device's inside, the pull rod block is in the inside of movable groove, the clutch blocks is inlayed in the bottom of pull rod, and with gyro wheel clearance fit, extension spring installs the bottom at the pull rod, press from both sides tight pad and inlay solid at clamping device's up end, the clutch blocks is the carbon steel material, has certain elasticity.
Further, press from both sides tight pad and include rubber piece, deformation groove, elasticity strip, the inside of rubber piece is equipped with the deformation groove, the terminal surface in deformation groove is circular-arcly, the elasticity strip is connected in the top both ends in deformation groove, the distance of deformation groove and rubber piece up end is dwindled by the upper end to the lower extreme gradually.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the guide block slides in the side sliding groove, so that the height of the guide block can be reduced while the guide block moves rightwards, the wafer is flatly placed on the placing plate, the inner end of the wafer can be placed on the placing plate to be clamped, and the condition that the wafer deviates due to inertial swing when the tray moves is avoided.
2. The invention utilizes the roller to slide in the rolling groove to adjust the distance between the clamping devices, thereby clamping wafers with different sizes and avoiding the condition of deviation when the wafers are moved.
Drawings
FIG. 1 is a schematic front view of a wafer lithography apparatus according to the present invention.
FIG. 2 is a schematic diagram of a front view structure of a lithography block according to the present invention.
FIG. 3 is a schematic diagram of a front view of a photolithography platform according to the present invention.
Fig. 4 is a front view structure diagram of the tray of the present invention.
Fig. 5 is a front view of the material guiding block according to the present invention.
FIG. 6 is a side cross-sectional view of the cushion of the present invention.
Fig. 7 is a front view of the placement board of the present invention.
Fig. 8 is a front view of the clamping device of the present invention.
Fig. 9 is a front view of the clamping pad of the present invention.
In the figure: the device comprises a processing block 1, a heat dissipation port 2, a photoetching block 3, a control console 4, a photoetching machine 31, a conveyor belt 32, a photoetching platform 33, a wafer collection box 34, a support plate 331, a chain 332, a photoetching platform 333, a sliding groove 334, a tray 335, a material loading tray a1, a clamping block a2, a lateral sliding groove a3, a material guiding block a4, a return spring a5, a placing plate a6, a mounting groove a41, a rubber ring a42, a cushion a43, a guide strip b1, an empty groove b2, a lower top block b3, a support pad b4, a rolling groove c1, a roller c2, a clamping device c3, a movable groove c31, a pull rod c32, a friction block c33, a tension spring c34, a clamping pad c35, a rubber block d1, a deformation groove d2 and an elastic strip d 3.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows: referring to fig. 1-6, the embodiments of the present invention are as follows:
the structure of the device comprises a processing block 1, a heat dissipation port 2, a photoetching block 3 and a control console 4, wherein the heat dissipation port 2 is arranged at the bottom of the side end of the processing block 1, the photoetching block 3 is connected to the right end of the processing block 1, the control console 4 is clamped at the right side of the front end of the photoetching block 3, the photoetching block 3 comprises a photoetching machine 31, a conveying belt 32, a photoetching platform 33 and a wafer collection box 34, the photoetching machine 31 is arranged at the top end inside the photoetching machine 31, the conveying belt 32 is transversely arranged at the side end inside the photoetching block 3, the photoetching platform 33 is positioned below the conveying belt 32, and the wafer collection box 34 is arranged at the bottom end inside the photoetching block 3.
The photoetching platform 33 comprises a supporting plate 331, a chain 332, a photoetching platform 333, a sliding groove 334 and a tray 335, wherein the chain 332 is arranged at the upper end of the supporting plate 331, the photoetching platform 333 is arranged at the top end of the photoetching platform 33, the sliding groove 334 is arranged at the upper end of the photoetching platform 333, the tray 335 is clamped in the sliding groove 334, the tray 335 is movably matched with the chain 332, and the movement of the chain 332 is favorable for driving the tray 335 to move left and right in the sliding groove 334.
Tray 335 is including carrying charging tray a1, block a2, sideslip groove a3, guide block a4, reset spring a5, place board a6, the upper end of carrying charging tray a1 is for cutting open the form, block a2 is equipped with two, and inlays the bottom side at year charging tray a1 to with chain 332 clearance fit, side sliding groove a3 symmetry is installed at the inside both ends of carrying charging tray a1, guide block a4 block is in side sliding groove a3, reset spring a5 installs the bottom side at guide block a4, it sets up at the inside centre of carrying charging tray a1 to place board a6, side sliding groove a3 is 15 degrees with the contained angle that carries charging tray a1 terminal surface to form, is favorable to letting guide block a4 to reduce the height in the time of moving to the right.
The material guide block a4 comprises a mounting groove a41, two rubber rings a42 and a buffering cushion a43, the mounting groove a41 is arranged on the upper end face of the material guide block a4, the two rubber rings a42 are respectively embedded at two ends of the inside of the mounting groove a41, the buffering cushion a43 is flatly laid on the upper end face of the material guide block a4, the material guide block a4 covers the end face of the mounting groove a41, and the bottom end of the material guide block a4 is connected with the rubber ring a42, so that when a wafer falls on the upper end of the buffering cushion a43, the buffering cushion a43 can squeeze the rubber ring a42 to deform.
The buffer pad a43 includes gib b1, dead slot b2, lower kicking block b3, supporting pad b4, gib b1 is equipped with more than five, and transversely inlays in the up end of buffer pad a43, dead slot b2 sets up the inside at buffer pad a43, lower kicking block b3 is equipped with more than three, and transversely arranges in the top of dead slot b2, supporting pad b4 is equipped with more than three, and transversely arranges under lower kicking block b3, gib b1 is the plastics material, the inside of supporting pad b4 is the cut open type, is favorable to through the contact of gib b1 with the terminal surface of wafer, reduces the frictional force of wafer and buffer pad a43 terminal surface, thereby lets the wafer can more smoothly drop at the terminal surface of placing board a 6.
Based on the above embodiment, the specific working principle is as follows: the wafer is conveyed to the upper end of the photoetching platform 33 through the conveyor belt 32, photoetching is carried out by the photoetching machine 31, then the tray 335 is driven to move left and right in the sliding groove 334 by the movement of the chain 332, then the guide block a4 slides in the side sliding groove a3, so that the guide block a4 can reduce the height while moving right, the wafer is flatly placed on the placing plate a6, when the wafer falls on the upper end of the cushion a43, the cushion a43 extrudes and deforms the rubber ring a42, so that the wafer is buffered, finally the guide strip b1 is contacted with the end face of the wafer, the friction force between the wafer and the end face of the cushion a43 is reduced, so that the wafer can more smoothly fall on the end face of the placing plate a6, the lower top block b3 is contacted with the cushion a43 when being stressed, the wafer can be buffered, and the wafer can be placed on the inner end of the placing plate a6 to be clamped, the situation that the wafer deflects due to the swinging of inertia when the tray 335 moves is avoided.
Example two: referring to fig. 7-9, the embodiment of the present invention is as follows:
the placing plate a6 comprises a rolling groove c1, a roller c2 and a clamping device c3, wherein the rolling groove c1 is arranged inside the placing plate a6, the roller c2 is clamped inside the rolling groove c1, the clamping device c3 is mounted at the upper end of the roller c2, the roller c2 is in sliding fit with the rolling groove c1, and the distance between the clamping devices c3 is adjusted by the fact that the roller c2 slides in the rolling groove c 1.
Clamping device c3 includes activity groove c31, pull rod c32, clutch block c33, extension spring c34, presss from both sides tight pad c35, activity groove c31 sets up the inside at clamping device c3, pull rod c32 block is in the inside of activity groove c31, clutch block c33 inlays in pull rod c 32's bottom, and with gyro wheel c2 clearance fit, extension spring c34 installs the bottom at pull rod c32, clamp pad c35 inlays the up end at clamping device c3, clutch block c33 is the carbon steel material, has certain elasticity, is favorable to through the terminal surface contact of clutch block c33 with gyro wheel c 2.
The clamping pad c35 includes rubber block d1, deformation groove d2, elasticity strip d3, the inside of rubber block d1 is equipped with deformation groove d2, the terminal surface of deformation groove d2 is circular-arcly, elasticity strip d3 is connected in deformation groove d 2's top both ends, the distance of deformation groove d2 and rubber block d1 up end is dwindled gradually by the upper end to the lower extreme, is favorable to letting the wafer when dropping at rubber block d1 terminal surface, lets the wafer more towards the radian that rubber block d 1's lower extreme removed the deformation the arch and is bigger.
Based on the above embodiment, the specific working principle is as follows: utilize gyro wheel c2 to slide in rolling groove c1, adjust the distance between clamping device c3, thereby can press from both sides tight the wafer of variation in size, avoid the condition that the wafer goes out the skew when moving the position, push down pull rod c32 again, let pull rod c32 card in activity groove c31, make the terminal surface contact of clutch blocks c33 and gyro wheel c2 fix gyro wheel c2, avoid appearing the circumstances to the wafer unstable, let the wafer at the time of the rubber block d1 terminal surface at last, let the wafer move toward the lower extreme of rubber block d1 more, the radian that rubber block d1 warp is big more, thereby let the wafer slowly fall and carry out the photoetching at the up end that places board a6, the condition that can not let the wafer appear damaging, can also press from both sides tight the wafer, avoid tray 335 to lead to the condition that the wafer appears the skew when moving.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (1)
1. The utility model provides a wafer lithography apparatus, its structure includes processing block (1), thermovent (2), photoetching piece (3), control cabinet (4), the side bottom of processing block (1) is equipped with thermovent (2), photoetching piece (3) are connected in the right-hand member of processing block (1), control cabinet (4) block in the front end right side of photoetching piece (3), its characterized in that:
the photoetching block (3) comprises a photoetching machine (31), a conveying belt (32), a photoetching platform (33) and a wafer collecting box (34), wherein the photoetching machine (31) is arranged at the top end of the interior of the photoetching machine (31), the conveying belt (32) is transversely arranged at the side end of the interior of the photoetching block (3), the photoetching platform (33) is positioned below the conveying belt (32), and the wafer collecting box (34) is arranged at the bottom end of the interior of the photoetching block (3);
the photoetching platform (33) comprises a supporting plate (331), a chain (332), a photoetching platform (333), a sliding groove (334) and a tray (335), wherein the chain (332) is arranged at the upper end of the supporting plate (331), the photoetching platform (333) is installed at the top end of the photoetching platform (33), the sliding groove (334) is arranged at the upper end of the photoetching platform (333), and the tray (335) is clamped in the sliding groove (334);
the tray (335) comprises a material carrying plate (a 1), a clamping block (a 2), side sliding grooves (a 3), a material guiding block (a 4), a return spring (a 5) and a placing plate (a 6), wherein the upper end of the material carrying plate (a 1) is cut open, the clamping block (a 2) is provided with two clamping blocks, the clamping blocks are embedded at the bottom side end of the material carrying plate (a 1) and movably matched with a chain (332), the side sliding grooves (a 3) are symmetrically arranged at two ends of the interior of the material carrying plate (a 1), the material guiding block (a 4) is clamped in the side sliding grooves (a 3), the return spring (a 5) is arranged at the bottom side end of the material guiding block (a 4), and the placing plate (a 6) is arranged in the middle of the interior of the material carrying plate (a 1);
the material guide block (a 4) comprises mounting grooves (a 41), two rubber rings (a 42) and two buffering cushions (a 43), the mounting grooves (a 41) are formed in the upper end face of the material guide block (a 4), the two rubber rings (a 42) are embedded in the two ends of the inside of the mounting grooves (a 41) respectively, and the buffering cushions (a 43) are tiled on the upper end face of the material guide block (a 4);
the buffer pad (a 43) comprises guide strips (b 1), empty grooves (b 2), a lower top block (b 3) and a supporting pad (b 4), wherein the guide strips (b 1) are more than five and are transversely embedded in the upper end face of the buffer pad (a 43), the empty grooves (b 2) are formed in the buffer pad (a 43), the lower top block (b 3) is more than three and is transversely arranged at the top end of the empty grooves (b 2), and the supporting pad (b 4) is more than three and is transversely arranged right below the lower top block (b 3);
the placing plate (a 6) comprises a rolling groove (c 1), a roller (c 2) and a clamping device (c 3), wherein the rolling groove (c 1) is arranged inside the placing plate (a 6), the roller (c 2) is clamped inside the rolling groove (c 1), and the clamping device (c 3) is installed at the upper end of the roller (c 2);
the clamping device (c 3) comprises a movable groove (c 31), a pull rod (c 32), a friction block (c 33), an extension spring (c 34) and a clamping pad (c 35), wherein the movable groove (c 31) is arranged inside the clamping device (c 3), the pull rod (c 32) is clamped inside the movable groove (c 31), the friction block (c 33) is embedded at the bottom end of the pull rod (c 32) and movably matched with a roller (c 2), the extension spring (c 34) is installed at the bottom end of the pull rod (c 32), and the clamping pad (c 35) is embedded at the upper end face of the clamping device (c 3);
the clamping pad (c 35) comprises a rubber block (d 1), a deformation groove (d 2) and an elastic strip (d 3), wherein the deformation groove (d 2) is formed in the rubber block (d 1), the end face of the deformation groove (d 2) is arc-shaped, and the elastic strip (d 3) is connected to two ends of the top of the deformation groove (d 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110201454.5A CN112987505B (en) | 2021-02-23 | 2021-02-23 | Wafer lithography apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110201454.5A CN112987505B (en) | 2021-02-23 | 2021-02-23 | Wafer lithography apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN112987505A CN112987505A (en) | 2021-06-18 |
| CN112987505B true CN112987505B (en) | 2022-07-01 |
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| CN202110201454.5A Active CN112987505B (en) | 2021-02-23 | 2021-02-23 | Wafer lithography apparatus |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005340315A (en) * | 2004-05-25 | 2005-12-08 | Nikon Corp | Alignment device, exposure apparatus, alignment method and exposure method, and device manufacturing method and (tool) reticle for calibration |
| WO2016124399A1 (en) * | 2015-02-06 | 2016-08-11 | Asml Netherlands B.V. | A method and apparatus for improving measurement accuracy |
| CN107111251A (en) * | 2014-11-14 | 2017-08-29 | 迈普尔平版印刷Ip有限公司 | Loading for transfer substrate in a lithography system locks system and method |
| CN107111227A (en) * | 2014-12-23 | 2017-08-29 | Asml荷兰有限公司 | Lithographic patterning technique and the resist used wherein |
| CN107250915A (en) * | 2015-02-23 | 2017-10-13 | 株式会社尼康 | Measurement apparatus, etching system and exposure device and management method, overlapping measuring method and assembly manufacture method |
| CN110632830A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江泰润机械科技有限公司 | Wafer lithography apparatus |
| CN110750033A (en) * | 2018-07-24 | 2020-02-04 | 长鑫存储技术有限公司 | Wafer carrying platform of photoetching machine |
| CN111562727A (en) * | 2020-06-28 | 2020-08-21 | 广东万合新材料科技有限公司 | Semiconductor silicon wafer rotary photoetching machine |
| CN111613557A (en) * | 2020-06-01 | 2020-09-01 | 厦门通富微电子有限公司 | Wafer processing equipment |
| CN111624859A (en) * | 2020-06-29 | 2020-09-04 | 广东万合新材料科技有限公司 | Proximity lithography machine for semiconductor chip production |
| CN111722478A (en) * | 2020-06-30 | 2020-09-29 | 广州聪慧青贸易有限公司 | Wafer lithography apparatus |
| CN112304269A (en) * | 2020-11-27 | 2021-02-02 | 张娟 | Wafer slice thickness detection equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005150533A (en) * | 2003-11-18 | 2005-06-09 | Canon Inc | Aligner |
| CN102012638B (en) * | 2009-09-04 | 2012-11-14 | 上海微电子装备有限公司 | Photoetching machine worktable with driving device capable of balancing torque |
| CN102751223B (en) * | 2012-07-26 | 2017-05-17 | 上海华虹宏力半导体制造有限公司 | Control circuit of wafer transmission device, wafer transmission device and lithography equipment |
| CN104503209A (en) * | 2014-12-19 | 2015-04-08 | 中国科学院长春光学精密机械与物理研究所 | Thick-layer photoresist coating device |
-
2021
- 2021-02-23 CN CN202110201454.5A patent/CN112987505B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005340315A (en) * | 2004-05-25 | 2005-12-08 | Nikon Corp | Alignment device, exposure apparatus, alignment method and exposure method, and device manufacturing method and (tool) reticle for calibration |
| CN107111251A (en) * | 2014-11-14 | 2017-08-29 | 迈普尔平版印刷Ip有限公司 | Loading for transfer substrate in a lithography system locks system and method |
| CN107111227A (en) * | 2014-12-23 | 2017-08-29 | Asml荷兰有限公司 | Lithographic patterning technique and the resist used wherein |
| WO2016124399A1 (en) * | 2015-02-06 | 2016-08-11 | Asml Netherlands B.V. | A method and apparatus for improving measurement accuracy |
| CN107250915A (en) * | 2015-02-23 | 2017-10-13 | 株式会社尼康 | Measurement apparatus, etching system and exposure device and management method, overlapping measuring method and assembly manufacture method |
| CN110750033A (en) * | 2018-07-24 | 2020-02-04 | 长鑫存储技术有限公司 | Wafer carrying platform of photoetching machine |
| CN110632830A (en) * | 2019-08-26 | 2019-12-31 | 泉州洛江泰润机械科技有限公司 | Wafer lithography apparatus |
| CN111613557A (en) * | 2020-06-01 | 2020-09-01 | 厦门通富微电子有限公司 | Wafer processing equipment |
| CN111562727A (en) * | 2020-06-28 | 2020-08-21 | 广东万合新材料科技有限公司 | Semiconductor silicon wafer rotary photoetching machine |
| CN111624859A (en) * | 2020-06-29 | 2020-09-04 | 广东万合新材料科技有限公司 | Proximity lithography machine for semiconductor chip production |
| CN111722478A (en) * | 2020-06-30 | 2020-09-29 | 广州聪慧青贸易有限公司 | Wafer lithography apparatus |
| CN112304269A (en) * | 2020-11-27 | 2021-02-02 | 张娟 | Wafer slice thickness detection equipment |
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