CN218809121U - Silicon chip receiving agencies - Google Patents
Silicon chip receiving agencies Download PDFInfo
- Publication number
- CN218809121U CN218809121U CN202223108251.0U CN202223108251U CN218809121U CN 218809121 U CN218809121 U CN 218809121U CN 202223108251 U CN202223108251 U CN 202223108251U CN 218809121 U CN218809121 U CN 218809121U
- Authority
- CN
- China
- Prior art keywords
- module
- material box
- jacking
- box assembly
- magazine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 53
- 239000010703 silicon Substances 0.000 title claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 109
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 210000001503 joint Anatomy 0.000 claims abstract description 29
- 238000003032 molecular docking Methods 0.000 claims description 14
- 230000001174 ascending effect Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 5
- 230000006698 induction Effects 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 29
- 238000009434 installation Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a silicon wafer receiving mechanism which comprises a first material box assembly, a second material box assembly, a first lifting module, a transverse moving module and a base; the first material box assembly and the second material box assembly are arranged on the same side of the conveying line, the first material box assembly and the second material box assembly are arranged side by side along the direction perpendicular to the conveying direction of the conveying line, the first material box assembly is arranged on the first lifting module in a sliding mode, and the first lifting module is configured to drive the first material box assembly to ascend to a first material receiving position parallel to the second material box assembly and descend to a connecting position in butt joint with the transverse moving module; the traverse module is arranged on the base and is configured to drive the first magazine assembly to traverse back and forth between the first sheet taking position and the connecting position below the second magazine assembly, and the sheet taking efficiency can be greatly improved.
Description
Technical Field
The application belongs to the field of silicon chip is selected separately, specifically speaking relates to a silicon chip receiving agencies.
Background
After the silicon wafers are sorted and detected by the sorting machine, the silicon wafers are sorted according to the sorted grades and collected, and the silicon wafers with different grades are collected into different material boxes. At present, in a silicon wafer receiving area shown in fig. 1 in an invention patent with an application number of CN201210587669.6, when two material boxes are arranged at intervals along two sides of a conveying line perpendicular to the conveying line, when a silicon wafer in the material box close to the conveying line is received, the wafer taking is inconvenient, and the wafer taking efficiency is low.
Therefore, how to solve the problem of low efficiency of taking silicon chips is a technical problem that needs to be solved at present.
Disclosure of Invention
To the problem that the current silicon wafer taking efficiency is low, the silicon wafer receiving mechanism of the silicon wafer receiving mechanism is provided.
The silicon wafer receiving mechanism comprises a first material box assembly, a second material box assembly, a first lifting module, a transverse moving module and a base; the first material box assembly and the second material box assembly are arranged on the same side of the conveying line, the first material box assembly and the second material box assembly are arranged side by side along the direction perpendicular to the conveying direction of the conveying line, the first material box assembly is arranged on the first lifting module in a sliding mode, and the first lifting module is configured to drive the first material box assembly to ascend to a first material receiving position parallel to the second material box assembly and descend to a connecting position in butt joint with the transverse moving module; the traversing module is arranged on the base and is configured to drive the first magazine component to traverse back and forth between the first sheet taking position and the connecting position below the second magazine component.
The utility model discloses a set up first lifting module and sideslip module, when the silicon chip in need taking out, only need descend first magazine subassembly to the position of connecing through first lifting module earlier, by the sideslip module the position of connecing plug into with first magazine subassembly drive to first get the piece position get the piece can, convenient and fast can improve by a wide margin and get piece efficiency.
Optionally, the first lifting module comprises a first linear module, a first slider, a lifting support plate, a first sensor, a second sensor and a first sensing member for sensing the first sensor and the second sensor, the lifting support plate is fixedly arranged on the first slider, and the first slider is slidably arranged on the first linear module; first response piece is fixed to be set up on first slider, and first sensor and second sensor interval setting are on first sharp module from top to bottom, correspond first material receiving position and connect the position respectively.
The first induction part is fixedly arranged on the first sliding block, the first sensor and the second sensor respectively correspond to the first material receiving position and the second material receiving position, and the first material box assembly can be flexibly controlled to move between the first material receiving position and the connection position along with the lifting motion of the first sliding block on the first linear module.
Optionally, the lifting support plate is provided with a first locating pin for locating the first magazine assembly.
Through set up first locating pin in the lift backup pad, fix a position the first magazine subassembly in the lift backup pad, prevent that first magazine subassembly from appearing the skew in the lift in-process, lead to the silicon chip in the magazine to scatter in disorder or even damage.
Optionally, the first magazine assembly comprises a first bottom plate, at least one first magazine, a positioning hole and a butt joint block, the first magazine is obliquely arranged on the first bottom plate, and the positioning hole is arranged below the first bottom plate;
the butt joint block is fixedly arranged below the first base plate, when the first material box assembly descends to the butt joint position, the driving end of the transverse moving module is in butt joint with the butt joint block, and the first material box assembly is driven to transversely move to the first sheet taking position from the butt joint position.
A positioning hole is formed below the first base plate, so that the first material box assembly is conveniently positioned when the first material box assembly is transversely moved from the connection position to the first sheet taking position, and the stability of the transverse moving process is ensured; set up butt joint piece in the below of first bottom plate, under the installation condition that does not influence first magazine subassembly, the drive end of the sideslip module of being convenient for carries out good butt joint with first magazine subassembly to realize first magazine subassembly simply conveniently and in the position of plugging into and the first reciprocating motion of getting between the piece position.
Optionally, a transverse sliding rail is arranged on the base, and the transverse sliding rail extends from the connection position to the first sheet taking position; the first material box assembly further comprises a guide mechanism, and the guide mechanism is matched with the transverse sliding rail.
Set up the sideslip slide rail on the base, the guiding mechanism on the first magazine subassembly of cooperation realizes that first magazine subassembly is from connecing to refute the first stable removal of getting the piece position, can improve the efficiency that the position of first magazine subassembly switched, can guarantee again that the silicon chip in the magazine is under quick and stable switching, and it is not influenced to receive the piece quality.
Optionally, the guide mechanism includes a vertical plate, a plurality of first guide wheels and a plurality of second guide wheels, the extending direction of the vertical plate is parallel to the extending direction of the transverse sliding rail, the plurality of first guide wheels are uniformly installed on the first installation surface of the vertical plate, the plurality of second guide wheels are uniformly installed on the second installation surface of the vertical plate, and the rolling contact surfaces of the first guide wheels and the second guide wheels are perpendicular to each other;
the sideslip slide rail includes mutually perpendicular's first spigot surface and second spigot surface, and first spigot surface cooperatees with first leading wheel, and the second spigot surface cooperatees with the second leading wheel.
Through setting up installation face mutually perpendicular's first leading wheel and second leading wheel, respectively with first leading wheel and the first spigot surface of second leading wheel complex and second spigot surface, when first magazine subassembly carries out the sideslip, lead to first magazine subassembly from two different directions for the direction effect is more steady, and flexibility when first magazine subassembly sideslip is higher.
Optionally, the transverse moving module comprises a first cylinder and a second cylinder, the first cylinder is fixedly arranged on the base, a driving block of the first cylinder transversely moves along the extending direction from the connection position to the first sheet taking position, the second cylinder is fixedly arranged on the driving block, and the driving end of the second cylinder is connected with or separated from the connection block through stretching.
The second cylinder controls the external driving source to be in butt joint with or separated from the butt joint block, and the structure is simple and reliable; the first cylinder drives the first material box assembly to transversely move between the connection position and the first sheet taking position, the transverse movement of the first material box assembly is realized by adopting a mode of combining two cylinders, and the device is simple in structure and controllable in cost.
Optionally, be provided with first limit switch on the base, first limit switch is located and connects one side of position for judge whether first magazine subassembly is located and connects the position.
Through set up first limit switch on the base, whether judgement that can be accurate first magazine subassembly is located connects the position to whether the drive end that the cross-sliding module of rapid judgement needs to be controlled makes it and butt joint piece butt joint, accomplishes the sideslip of first magazine subassembly, and then guarantees material collecting device's receipts piece efficiency.
Optionally, the first film taking position is provided with a drawing module for drawing the first material box assembly which moves to the first film taking position to stagger with the second material box assembly.
After the first material box assembly transversely moves to the first piece taking position, the first material box assembly can be pulled and staggered with the second material box assembly through the pulling module, and after the pulling module is staggered, quick piece taking is convenient for a silicon chip in the first material box assembly.
Optionally, the pull module includes jacking backup pad, jacking cylinder, first connecting plate and first pull slide rail, and the jacking cylinder is installed on the base, and the drive end fixed connection of jacking cylinder is in the jacking backup pad, and first pull slide rail sets up on the base, be provided with in the jacking backup pad with first pull slide rail complex first connecting plate.
Optionally, the pull module is still including installation curb plate, jacking bottom plate and guiding axle, and the installation curb plate is fixed to be set up in the both sides of jacking bottom plate, and first pull slide rail fixed mounting is in the both sides of installation curb plate, and the jacking bottom plate sets up between jacking backup pad and base, and the base, jacking bottom plate and jacking backup pad setting are located to the guiding axle wearing, and jacking cylinder drive jacking backup pad goes up and down along the guiding axle.
Set up the guiding axle between base, jacking bottom plate and jacking backup pad, lead to jacking backup pad, increase first magazine subassembly lift stability.
Optionally, the pull module still includes second locating pin and pull handle, and the second locating pin sets up the upper surface at the jacking backup pad, and the pull handle sets up the avris at the jacking backup pad.
The second positioning pin is arranged on the upper surface of the jacking support plate, so that the first material box assembly is conveniently limited on the jacking support plate, and the stability of the first material box assembly is kept in the lifting and pulling processes of the jacking support plate; the side of the jacking supporting plate is provided with a drawing handle, so that an operator can draw the jacking supporting plate conveniently.
Optionally, a second proximity switch is arranged on the base, and the second proximity switch is located below the jacking support plate and used for limiting the descending stroke of the jacking support plate; and/or the presence of a gas in the gas,
the base is provided with a jacking limiting block for limiting the ascending and descending stroke of the jacking supporting plate.
The ascending and/or descending stroke of the jacking supporting plate is limited, so that the ascending and/or descending of the jacking supporting plate can be effectively avoided from being excessive, and the normal material receiving of the first material box assembly is influenced.
Optionally, the silicon wafer receiving mechanism further comprises a second lifting module, the second material box assembly is slidably arranged on the second lifting module, and the second lifting module is configured to drive the second material box assembly to ascend to a second receiving position parallel to the first receiving position and descend to a second wafer taking position below the second receiving position;
the second lifting module comprises a second linear module, a second sliding block, a third sensor, a fourth sensor and a second sensing piece for sensing the third sensor and the fourth sensor, the second material box assembly is fixedly arranged on the second sliding block, and the second sliding block is arranged on the second linear module in a sliding manner; the second induction piece is fixedly arranged on the second sliding block, and the third sensor and the fourth sensor are arranged on the second linear module at an upper and lower interval and respectively correspond to the second material receiving position and the second sheet taking position.
Set the form that can follow the second lifting module and go up and down with second magazine subassembly, receive the back full with the silicon chip in the second magazine subassembly, can descend it to suitable height, accomplish to collect the silicon chip in the second magazine subassembly, be favorable to promoting user's use and experience.
Optionally, the second magazine assembly comprises a second base plate, second magazines, a second connecting plate and second drawing slide rails, the second magazines are the same in number as the first magazines in number, the second magazines are obliquely arranged on the second base plate, the second drawing slide rails are fixedly arranged on the second base plate, the first surfaces of the second connecting plate are fixedly connected to the second slide blocks, and the second surfaces of the second connecting plate are slidably connected to the second drawing slide rails.
The quantity of the second material boxes is designed to be the same as that of the first material boxes, the quantity of the material boxes for receiving the sheets can be realized to the maximum extent, the quantity of the received sheets of the material receiving device is further increased, and the requirement of the material receiving device on the quantity of the material boxes under high productivity is met.
Drawings
FIG. 1 is a schematic view of an embodiment of a silicon wafer receiving mechanism;
FIG. 2 is a schematic view of the first magazine assembly of FIG. 1 descending from a first receiving position to a docking position;
FIG. 3 is a schematic view of the first magazine assembly of FIG. 1 lowered to an interface position;
FIG. 4 is a schematic view of the first magazine assembly of FIG. 1 traversing from the docking position to the first cassette receiving position;
FIG. 5 is a schematic view of one embodiment of a first lift module;
FIG. 6 is a schematic view of an embodiment of the first cartridge assembly;
FIG. 7 is an enlarged schematic view of the first cartridge lowered to the docking station;
FIG. 8 is a schematic view of the pull module in a first view;
FIG. 9 is a schematic view of the pull module shown in a second view;
fig. 10 is a schematic view of the second magazine assembly and the second lifting module.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. The embodiments described are some, but not all embodiments of the present application. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.
The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict.
When the current sorting machine discharges materials, the silicon wafers arranged in the material box on the inner side are taken out more complexly, and the problem of wafer taking efficiency is influenced.
As shown in fig. 1, the silicon wafer receiving mechanism of the present application includes a first magazine assembly 1, a second magazine assembly 2, a first lifting module 3, a traverse module 5 and a base 6; the first material box assembly 1 and the second material box assembly 2 are arranged on the same side of the conveying line, the first material box assembly 1 and the second material box assembly 2 are arranged side by side along the conveying direction perpendicular to the conveying direction of the conveying line, the first material box assembly 1 is arranged on the first lifting module 3 in a sliding mode, and the first lifting module 3 is configured to drive the first material box assembly 1 to ascend to a first material receiving position A parallel to the second material box assembly 2 and descend to a connection position B in butt joint with the transverse moving module 5; the traversing module 5 is arranged on the base 6 and is configured to drive the first magazine assembly 1 to traverse back and forth between a first tablet taking position C and a connection position B below the second magazine assembly 2.
The following will describe how to rapidly collect the silicon wafers in the first magazine assembly 1 in detail with reference to fig. 1 to 4:
as shown in fig. 1, in this state, the first magazine assembly 1 is located at a first receiving position a, and at the first receiving position a, the first magazine assembly 1 is mainly used for receiving silicon wafers conveyed from the conveying line and storing the silicon wafers in the first magazine assembly 1, and when the first magazine assembly 1 is full of silicon wafers, the first magazine assembly 1 needs to be taken out in time.
As shown in fig. 2, the first lifting module 3 controls the first magazine assembly 1 to descend toward the receiving position B (i.e. downward in the direction of the arrow).
As shown in fig. 3, the first magazine assembly 1 is lowered to the receiving position B, and the traverse module 5 traverses the first magazine assembly 1 at the receiving position B to the first disk taking position C.
As shown in fig. 4, the first magazine assembly 1 traverses to the first tablet taking position C.
The first material box assembly at the first sheet taking position C is transferred to the first receiving position A only by reverse operation according to the steps.
It should be noted that, in the process that the first material box assembly 1 is transferred from the first material receiving position a to the first material taking position C, the second material box assembly 2 can still be located at the second material receiving position to receive the material, and the material receiving efficiency of the whole silicon wafer receiving mechanism is not affected by the transfer of the first material box assembly 1, i.e., the transfer of the first material box assembly 1.
The utility model discloses a set up first lifting module 3 and sideslip module 5, when the silicon chip in need taking out, only need drop first magazine subassembly 1 to connect through first lifting module 3 earlier and refute position B, by sideslip module 5 with first magazine subassembly 1 drive to first get piece position C get the piece can, convenient and fast can improve by a wide margin and get piece efficiency connecting to refute position B.
As shown in fig. 5, which is an embodiment of the first lifting module 3, the first lifting module 3 includes a first linear module 31, a first slide block 32, a lifting support plate 33, a first sensor 34, a second sensor 35, and a first sensing member 36 for sensing the first sensor 34 and the second sensor 35, the lifting support plate 33 is fixedly disposed on the first slide block 32, and the first slide block 32 is slidably disposed on the first linear module 31; the first sensing member 36 is fixedly arranged on the first sliding block 32, and the first sensor 34 and the second sensor 35 are arranged on the first linear module 31 at intervals up and down and respectively correspond to the first receiving position a and the connection position B.
Along with the lifting of the first slider 32 on the first linear module 31, the lifting support plate 33, i.e. the first magazine assembly 1, can also be lifted and lowered synchronously on the first linear module 31, and in addition, the first sensing part 36 fixed on the first slider 32 can also be lifted and lowered synchronously, so that the lifting stroke of the first magazine assembly 1 is limited.
The first sensing piece 36 is fixedly arranged on the first sliding block 32, the first sensor 34 and the second sensor 35 are respectively arranged corresponding to the first receiving position A and the second receiving position, and the first material box assembly 1 can be flexibly controlled to move between the first receiving position A and the connection position B along with the lifting motion of the first sliding block 32 on the first linear module 31.
In order to prevent the first magazine assembly 1 from shifting in the lifting process, the silicon wafers in the magazine can be scattered or even damaged, and a first positioning pin 37 for positioning the first magazine assembly 1 can be arranged on the lifting support plate 33.
As shown in fig. 6, which is a schematic view of an embodiment of the first magazine assembly 1, the first magazine assembly 1 includes a first bottom plate 11, at least one first magazine 12, a positioning hole 13 and a butt block 14, the first magazine 12 is obliquely disposed on the first bottom plate 11, and the positioning hole 13 is disposed below the first bottom plate 11. Set up locating hole 13 below first bottom plate 11, be convenient for fix a position it when first magazine subassembly 1 moves from the position of plugging into B sideslip to first piece position C, guarantee the stability of sideslip process.
The butt joint block 14 is fixedly arranged below the first base plate 11, when the first material box assembly 1 descends to the joint position B, the driving end of the traverse module 5 is in butt joint with the butt joint block 14 to drive the first material box assembly 1 to traverse to the first sheet taking position C from the joint position B. Set up butt joint piece 14 in the below of first bottom plate 11, under the installation condition that does not influence first magazine subassembly 1, the drive end of the sideslip module 5 of being convenient for carries out good butt joint with first magazine subassembly 1 to realize first magazine subassembly 1 in the reciprocating motion of the position of plugging into B and first piece position C of getting simply conveniently.
Optionally, a transverse sliding rail 61 is arranged on the base 6, and the transverse sliding rail 61 extends from the connection position B to the first sheet taking position C; the first magazine assembly 1 further comprises a guide mechanism 15, and the guide mechanism 15 is matched with the cross sliding rail 61.
Set up sideslip slide rail 61 on base 6, the guiding mechanism 15 on the first magazine subassembly 1 of cooperation realizes that first magazine subassembly 1 is from the stable removal of the position B of plugging into to first piece position C, can improve the efficiency that the position of first magazine subassembly 1 was switched, can guarantee again that the silicon chip in the magazine is under quick and stable switching, and it is not influenced to receive the piece quality.
Optionally, the guide mechanism 15 includes a vertical plate 151, a plurality of first guide wheels 152 and a plurality of second guide wheels 153, an extending direction of the vertical plate 151 is parallel to an extending direction of the traverse slide rail 61, the plurality of first guide wheels 152 are uniformly installed on a first installation surface 1511 of the vertical plate 151, the plurality of second guide wheels 153 are uniformly installed on a second installation surface 1512 of the vertical plate 151, and a rolling contact surface of the first guide wheel 152 is perpendicular to a rolling contact surface of the second guide wheels 153;
the lateral sliding rail 61 includes a first guide surface 611 and a second guide surface 612 perpendicular to each other, the first guide surface 611 is engaged with the first guide wheel 152, and the second guide surface 612 is engaged with the second guide wheel 153.
Through setting up first leading wheel 152 and second leading wheel 153 of installation face mutually perpendicular, respectively with first leading wheel 152 and the first guide surface 611 and the second guide surface 612 of second leading wheel 153 cooperation, when first magazine subassembly 1 carries out the sideslip, lead to first magazine subassembly 1 from two different directions for the direction effect is more steady, and the flexibility when first magazine subassembly 1 sideslip is higher.
Optionally, the traverse module 5 includes a first cylinder 51 and a second cylinder 52, the first cylinder 51 is fixedly disposed on the base 6, a driving block 511 of the first cylinder 51 is transversely moved along the extending direction from the docking station B to the first sheet taking station C, the second cylinder 52 is fixedly mounted on the driving block 511, and the driving end of the second cylinder 52 is docked with or separated from the docking block 14 by telescoping.
For how the traverse module 5 drives the first magazine assembly 1 to traverse, please refer to fig. 7, when the first magazine assembly 1 descends to the docking position B, the driving end of the second cylinder 52 extends out and can dock with the docking block 14, the docking block 14 illustrated in fig. 7 is provided with a docking hole that is plugged with the driving end of the second cylinder 52, the driving end of the second cylinder 52 extends out and is plugged into the docking hole, so as to realize the connection between the traverse module 5 and the first magazine assembly 1. Next, the first cylinder 51 drives the driving block 511 thereon to traverse along the extending direction from the docking station B to the first film taking station C, and the driving block 511 drives the first cylinder 51, that is, the first magazine assembly 1, to traverse to the first film taking station C.
The second cylinder 52 controls the external driving source to be in butt joint or separated with the butt joint block 14, and the structure is simple and reliable; the first air cylinder 51 drives the first material box assembly 1 to transversely move between the connection position B and the first sheet taking position C, the transverse movement of the first material box assembly 1 is realized by adopting a mode of combining two air cylinders, and the device is simple in structure and controllable in cost.
In one embodiment of the silicon wafer receiving mechanism, as shown in fig. 1, 8 and 9, a first limit switch 62 is disposed on the base 6, and the first limit switch 62 is located on one side of the connection position B and used for determining whether the first magazine assembly 1 is located at the connection position B.
Through set up first limit switch 62 on base 6, whether first magazine subassembly 1 of judgement that can be accurate is located and connects a position B to whether the quick judgement need control sideslip module 5's drive end make it dock with butt joint piece 14, accomplish the sideslip of first magazine subassembly 1, and then guarantee material collecting device's receipts piece efficiency.
In one embodiment of the silicon wafer receiving mechanism, as shown in fig. 8 and 9, the first wafer taking position C is provided with a drawing module 7 for drawing the first magazine assembly 1 traversing to the first wafer taking position C to be staggered with the second magazine assembly 2.
After first magazine subassembly 1 sidestep to first piece position C of getting, can stagger first magazine subassembly 1 pull with second magazine subassembly 2 through pull module 7, staggered back is convenient for get the piece fast to the silicon chip in the first magazine subassembly 1.
Optionally, the drawing module 7 includes a jacking support plate 71, a jacking cylinder 72, a first connection plate 73 and a first drawing slide rail 74, the jacking cylinder 72 is installed on the base 6, a driving end of the jacking cylinder 72 is fixedly connected to the jacking support plate 71, the first drawing slide rail 74 is arranged on the base 6, and the jacking support plate 71 is provided with the first connection plate 73 engaged with the first drawing slide rail 74.
It should be noted that the embodiment of "the first drawing slide 74 is disposed on the base 6" is not limited to a specific manner, for example, the first drawing slide 74 is directly fixed on the base 6, and when the first connecting plate 73 can be drawn relative to the first drawing slide 74, the drawing action of the jacking supporting plate 71, i.e. the first magazine assembly 1 thereon, is realized. Of course, the first drawing slide 74 may be disposed on the base 6 by other structures as long as the drawing of the jacking support plate 71 can be realized.
Further, pull module 7 is still including installing curb plate 75, jacking bottom plate 76 and guiding axle 77, and installation curb plate 75 is fixed to be set up in the both sides of jacking bottom plate 76, and first pull slide rail 74 fixed mounting is in the both sides of installing curb plate 75, and jacking bottom plate 76 sets up between jacking backup pad 71 and base 6, jacking bottom plate 76 and the setting of jacking backup pad 71 are worn to locate by guiding axle 77, and jacking cylinder 72 drives jacking backup pad 71 and goes up and down along guiding axle 77.
The transfer of the first magazine assembly 1 onto the drawing module 7 by the traversing module 5 will be explained in detail below:
as shown in fig. 3, the traverse module 5 shifts the first magazine assembly 1 located at the connection position B toward the first film receiving position, and when the traverse module 5 drives the first magazine assembly 1 to the position above the pull module 7, the jacking cylinder 72 jacks upwards to insert the two positioning pins on the jacking support plate 71 into the positioning holes 13 in the first magazine assembly 1, so as to position the first magazine assembly 1 on the jacking support plate 71.
Set up guiding axle 77 between base 6, jacking bottom plate 76 and jacking backup pad 71, lead to jacking backup pad 71, increase first magazine subassembly 1 lift stability.
Optionally, the drawing module 7 further includes a second positioning pin 78 and a drawing handle, the second positioning pin 78 is disposed on the upper surface of the lifting support plate 71, and the drawing handle is disposed at the side of the lifting support plate 71.
The second positioning pin 78 is arranged on the upper surface of the jacking support plate 71, so that the first material box assembly 1 is conveniently limited on the jacking support plate 71, and the stability of the first material box assembly 1 is kept in the lifting and pulling processes of the jacking support plate 71; the side of the jacking support plate 71 is provided with a drawing handle, so that an operator can draw the jacking support plate 71 conveniently.
As shown in fig. 8 and 9, when the jacking cylinder 72 jacks up the jacking support plate 71, the guide shaft 77 guides the jacking support plate 71 to perform a part of jacking travel, and after the jacking support plate 71 is jacked to exceed the guide shaft 77, the jacking support plate 71 is not limited in position relative to the jacking bottom plate 76, and at the moment, the jacking support plate 71 can be pulled out through the pulling handle, so that the first magazine assembly 1 and the second magazine assembly 2 on the jacking support plate are staggered.
Optionally, a second proximity switch 63 is arranged on the base 6, and the second proximity switch 63 is located below the jacking support plate 71 and used for limiting the descending stroke of the jacking support plate 71; and/or the presence of a gas in the gas,
the base 6 is provided with a jacking limiting block 64 for limiting the ascending and descending stroke of the jacking supporting plate 71.
The ascending and/or descending stroke of the jacking support plate 71 is limited, so that the jacking support plate 71 is effectively prevented from being excessively ascended and/or excessively descended, and the normal material receiving of the first material box assembly 1 is influenced.
As shown in fig. 10, the silicon wafer receiving mechanism further includes a second lifting module 4, the second magazine assembly 2 is slidably disposed on the second lifting module 4, and the second lifting module 4 is configured to drive the second magazine assembly 2 to ascend to a second receiving position parallel to the first receiving position a and descend to a second wafer taking position below the second receiving position;
the second lifting module 4 comprises a second linear module 41, a second sliding block 42, a third sensor 43, a fourth sensor 44 and a second sensing piece for sensing the third sensor 43 and the fourth sensor 44, the second magazine component 2 is fixedly arranged on the second sliding block 42, and the second sliding block 42 is slidably arranged on the second linear module 41; the second sensing member is fixedly arranged on the second sliding block 42, and the third sensor 43 and the fourth sensor 44 are arranged on the second linear module 41 at intervals up and down and respectively correspond to the second material receiving position and the second sheet taking position.
Set second magazine subassembly 2 to the form that can follow second lifting module 4 and go up and down, after the silicon chip in second magazine subassembly 2 was packed to capacity, can descend it to suitable height, accomplish to collect the silicon chip in second magazine subassembly 2, be favorable to promoting user's use and experience.
Optionally, the second magazine assembly 2 includes a second bottom plate 21, second magazines 22 having the same number as the first magazines, a second connecting plate 23, and second drawer slides 24, the second magazines 22 are obliquely disposed on the second bottom plate 21, the second drawer slides 24 are fixedly disposed on the second bottom plate 21, a first surface of the second connecting plate 23 is fixedly connected to the second slider 42, and a second surface of the second connecting plate 23 is slidably connected to the second drawer slides 24.
The quantity of the second material boxes is designed to be the same as that of the first material boxes, the quantity of the material boxes for receiving the sheets can be realized to the maximum extent, the quantity of the received sheets of the material receiving device is further increased, and the requirement of the material receiving device on the quantity of the material boxes under high productivity is met.
The present invention and its embodiments have been described above in an illustrative and non-limiting manner, and the embodiments shown in the drawings are only one of the embodiments of the present invention and the actual structure is not limited thereto. Therefore, without departing from the spirit of the present invention, a person of ordinary skill in the art should also understand that the present invention shall not be limited to the embodiments and the similar structural modes of the present invention.
Claims (15)
1. The silicon wafer receiving mechanism is characterized by comprising a first material box assembly, a second material box assembly, a first lifting module, a transverse moving module and a base; the first material box assembly and the second material box assembly are arranged on the same side of the conveying line, the first material box assembly and the second material box assembly are arranged side by side along the direction perpendicular to the conveying direction of the conveying line, the first material box assembly is arranged on the first lifting module in a sliding mode, and the first lifting module is configured to drive the first material box assembly to ascend to a first material receiving position parallel to the second material box assembly and descend to a connection position in butt joint with the transverse moving module; the traverse module is arranged on the base and is configured to drive the first magazine component to traverse back and forth between a first tablet taking position and the connection position below the second magazine component.
2. The silicon wafer receiving mechanism as claimed in claim 1, wherein the first lifting module comprises a first linear module, a first slide block, a lifting support plate, a first sensor, a second sensor and a first sensing member for sensing the first sensor and the second sensor, the lifting support plate is fixedly disposed on the first slide block, and the first slide block is slidably disposed on the first linear module; first response piece is fixed to be set up on the first slider, first sensor with the interval sets up about the second sensor on the first sharp module, correspond respectively first material level of receiving with connect the position.
3. The silicon wafer receiving mechanism as claimed in claim 2, wherein the lifting support plate is provided with a first positioning pin for positioning the first magazine assembly.
4. The silicon wafer collecting mechanism as claimed in claim 1, wherein the first magazine assembly comprises a first base plate, at least one first magazine, a positioning hole and a docking block, the first magazine is disposed on the first base plate in an inclined manner, and the positioning hole is disposed below the first base plate;
the butt joint block is fixedly arranged below the first base plate, when the first material box assembly descends to the butt joint position, the driving end of the transverse moving module is in butt joint with the butt joint block to drive the first material box assembly to transversely move to the first sheet taking position from the butt joint position.
5. The silicon wafer collecting mechanism as claimed in claim 4, wherein the base is provided with a traverse slide rail extending from the receiving position to the first wafer taking position;
the first material box assembly further comprises a guide mechanism, and the guide mechanism is matched with the sideslip slide rail.
6. The silicon wafer collecting mechanism as claimed in claim 5, wherein the guiding mechanism comprises a vertical plate, a plurality of first guiding wheels and a plurality of second guiding wheels, the extending direction of the vertical plate is parallel to the extending direction of the traverse sliding rail, the plurality of first guiding wheels are uniformly arranged on the first mounting surface of the vertical plate, the plurality of second guiding wheels are uniformly arranged on the second mounting surface of the vertical plate, and the rolling contact surface of the first guiding wheels is perpendicular to the rolling contact surface of the second guiding wheels;
the transverse moving slide rail comprises a first guide surface and a second guide surface which are perpendicular to each other, the first guide surface is matched with the first guide wheel, and the second guide surface is matched with the second guide wheel.
7. The silicon wafer collecting mechanism as claimed in claim 4, wherein the traverse module comprises a first cylinder and a second cylinder, the first cylinder is fixedly disposed on the base, a driving block of the first cylinder is transversely moved along the extending direction from the docking station to the first wafer taking station, the second cylinder is fixedly disposed on the driving block, and the driving end of the second cylinder is connected with or separated from the docking station by telescoping.
8. The silicon wafer collecting mechanism as claimed in claim 4, wherein the base is provided with a first limit switch, and the first limit switch is located at one side of the connection position and used for judging whether the first magazine assembly is located at the connection position.
9. The silicon wafer collecting mechanism as claimed in claim 1, wherein the first wafer taking position is provided with a drawing module for drawing the first magazine assembly laterally moving to the first wafer taking position to be staggered with respect to the second magazine assembly.
10. The silicon wafer collecting mechanism as claimed in claim 9, wherein the pulling module comprises a jacking support plate, a jacking cylinder, a first connecting plate and a first pulling slide rail, the jacking cylinder is mounted on the base, the driving end of the jacking cylinder is fixedly connected to the jacking support plate, the first pulling slide rail is disposed on the base, and the jacking support plate is provided with the first connecting plate engaged with the first pulling slide rail.
11. The silicon wafer collecting mechanism as claimed in claim 10, wherein the pulling module further comprises a mounting side plate, a jacking bottom plate and a guiding shaft, the mounting side plate is fixedly disposed on two sides of the jacking bottom plate, the first pulling slide rail is fixedly disposed on two sides of the mounting side plate, the jacking bottom plate is disposed between the jacking support plate and the base, the guiding shaft is disposed through the base, the jacking bottom plate and the jacking support plate, and the jacking cylinder drives the jacking support plate to move up and down along the guiding shaft.
12. The silicon wafer collecting mechanism as claimed in claim 11, wherein the pulling module further comprises a second positioning pin and a pulling handle, the second positioning pin is disposed on the upper surface of the jacking support plate, and the pulling handle is disposed at the side of the jacking support plate.
13. The silicon wafer collecting mechanism as claimed in claim 10, wherein a second proximity switch is disposed on the base, and the second proximity switch is located below the jacking support plate and used for limiting a descending stroke of the jacking support plate; and/or the presence of a gas in the gas,
and the base is provided with a jacking limiting block for limiting the ascending and descending stroke of the jacking supporting plate.
14. The silicon wafer receiving mechanism of claim 4, further comprising a second lifting module on which the second magazine assembly is slidably disposed, the second lifting module being configured to drive the second magazine assembly to ascend to a second receiving position parallel to the first receiving position and descend to a second wafer taking position below the second receiving position;
the second lifting module comprises a second linear module, a second sliding block, a third sensor, a fourth sensor and a second induction piece for inducing the third sensor and the fourth sensor, the second material box assembly is fixedly arranged on the second sliding block, and the second sliding block is arranged on the second linear module in a sliding manner; the second induction part is fixedly arranged on the second sliding block, and the third sensor and the fourth sensor are arranged on the second linear module at intervals up and down and respectively correspond to the second material receiving position and the second sheet taking position.
15. The silicon wafer collecting mechanism as claimed in claim 14, wherein the second magazine assembly comprises a second base plate, a plurality of second magazines, a second connecting plate and a second pull slide rail, the number of the second magazines is equal to that of the first magazines, the second magazines are obliquely arranged on the second base plate, the second pull slide rail is fixedly arranged on the second base plate, the first surface of the second connecting plate is fixedly connected to the second slide block, and the second surface of the second connecting plate is slidably connected to the second pull slide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223108251.0U CN218809121U (en) | 2022-11-23 | 2022-11-23 | Silicon chip receiving agencies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223108251.0U CN218809121U (en) | 2022-11-23 | 2022-11-23 | Silicon chip receiving agencies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218809121U true CN218809121U (en) | 2023-04-07 |
Family
ID=87278077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223108251.0U Active CN218809121U (en) | 2022-11-23 | 2022-11-23 | Silicon chip receiving agencies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218809121U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116274007A (en) * | 2023-04-27 | 2023-06-23 | 苏州天准科技股份有限公司 | Double-magazine receiving device and discharging and sorting equipment |
| CN116371751A (en) * | 2023-04-27 | 2023-07-04 | 苏州天准科技股份有限公司 | Energy level expansion blanking separation equipment and method |
-
2022
- 2022-11-23 CN CN202223108251.0U patent/CN218809121U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116274007A (en) * | 2023-04-27 | 2023-06-23 | 苏州天准科技股份有限公司 | Double-magazine receiving device and discharging and sorting equipment |
| CN116371751A (en) * | 2023-04-27 | 2023-07-04 | 苏州天准科技股份有限公司 | Energy level expansion blanking separation equipment and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218809121U (en) | Silicon chip receiving agencies | |
| CN104960326A (en) | Full-automatic glass panel printing machine | |
| CN110646724A (en) | Feeding and conveying device of semiconductor chip sorting and testing device and working method thereof | |
| CN115008007A (en) | Needling type PCB welding crystal discharging machine | |
| CN111942846B (en) | Automatic feeding equipment for automobile body pipe fittings | |
| CN108792621A (en) | A kind of full-automatic LCD feeders | |
| CN211034342U (en) | Horizontal movement grabbing mechanism | |
| CN209998582U (en) | board conveying and welding platform for laser welding of elevator boards | |
| CN115849084B (en) | Electronic paper burning and detecting integrated machine and use method thereof | |
| CN208471031U (en) | A kind of full-automatic LCD feeder | |
| CN108225245B (en) | Automatic thickness measuring device for flexible porous thin sheet | |
| CN207222839U (en) | Riveting set | |
| CN115547915A (en) | Wafer exposure clamp and exposure device | |
| CN212372675U (en) | Raceway cooling system of oil tank | |
| CN214718500U (en) | Intelligent sorting and feeding device for rotating shafts | |
| CN213058897U (en) | Automatic supply mechanism for empty tray of blanking machine | |
| CN106240898A (en) | High speed and precision film sticking equipment | |
| CN216882567U (en) | Stopper wheel rubber circle transfer device | |
| CN210824287U (en) | Flexible conveyer | |
| CN219608318U (en) | Dynamic balance bracket device | |
| CN201703888U (en) | Feeding device | |
| CN220663943U (en) | Display panel loading attachment | |
| CN219372218U (en) | Iron core pressurizing machine | |
| CN216072110U (en) | Glass sheet unloading inserted sheet loading line | |
| CN210995346U (en) | Tray taking device of semiconductor chip sorting testing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |