CN111601462A - High-temperature-resistant and high-dielectric-property copper-clad plate and preparation method thereof and circuit board - Google Patents

High-temperature-resistant and high-dielectric-property copper-clad plate and preparation method thereof and circuit board Download PDF

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Publication number
CN111601462A
CN111601462A CN202010417853.0A CN202010417853A CN111601462A CN 111601462 A CN111601462 A CN 111601462A CN 202010417853 A CN202010417853 A CN 202010417853A CN 111601462 A CN111601462 A CN 111601462A
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temperature
thickness
copper
plate
pressure
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CN111601462B (en
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周蜜
唐缨
赵寒
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Sichuan Jiuzhou Electric Group Co Ltd
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Sichuan Jiuzhou Electric Group Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a high-temperature-resistant high-dielectric-property copper-clad plate, a preparation method thereof and a circuit board. The preparation method has the advantages of strong practicability, easy operation and strong manufacturability, and has obvious benefits through practical application.

Description

High-temperature-resistant and high-dielectric-property copper-clad plate and preparation method thereof and circuit board
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a high-temperature-resistant and high-dielectric-property copper-clad plate, a preparation method thereof and a circuit board.
Background
Cyanate ester generally refers to phenol derivatives containing two or more cyanate ester functional groups. The cyanate ester resin has the advantages of low dielectric constant, extremely small dielectric loss tangent value, high glass transition temperature, low shrinkage rate, moisture absorption rate, low air release property, high glass transition temperature, cohesiveness and the like, and can be used as a printed circuit board for high-speed digital and high-frequency use, a high-performance wave-transmitting material and a high-performance structural composite material resin matrix.
The quartz fiber has excellent dielectric property, thermal property, mechanical property and chemical property due to high purity, is applied to aerospace, industrial or civil projects, and particularly shows outstanding performance when used under the condition that the material is required to have extremely high technical property and high reliability.
The composite material prepared by taking cyanate ester as a matrix and quartz fiber as a reinforcing material is more remarkable by excellent dielectric property and heat resistance, and one important application aspect is the high-wave-transmission radome in aerospace.
With the development of the electronic industry, the traditional printed board material cannot meet the requirements of partial electronic products, for example, the epoxy glass fiber FR-4 material has relatively high dielectric constant and dielectric loss, the polytetrafluoroethylene glass fiber material has poor compatibility with an adhesive, and the polyimide material has high requirements on molding manufacturability. Therefore, the demand for cyanate ester quartz material system copper clad laminate with excellent dielectric property, heat resistance, processability and good adhesive compatibility is increasing. However, the cyanate quartz composite material is expensive and has harsh manufacturability, and no cyanate quartz cloth is applied to electronic circuits in the industry at present.
Disclosure of Invention
The invention aims to provide a high-temperature-resistant and high-dielectric-property copper-clad plate, a preparation method thereof and a circuit board, and the high-temperature-resistant and high-dielectric-property cyanate quartz cloth copper-clad plate can be produced.
In order to solve the technical problems, the invention adopts a technical scheme that: the preparation method of the high-temperature-resistant and high-dielectric-property copper-clad plate comprises the following steps: s1: taking a small amount of cyanate ester quartz cloth base material as a sample, heating the sample, and determining the temperature of resin during drawing as a pressurizing temperature in the heating process; s2: determining the number of paving layers of the cyanate quartz cloth base material according to the thickness of the cyanate quartz cloth base material and the required thickness of the copper-clad plate, determining the number of stacking layers according to the required number of the copper-clad plate, and sequentially stacking a lower steel supporting plate, a lower buffer felt, a pre-laid layer with the number of stacking layers, an upper steel plate, an upper buffer felt and an upper steel supporting plate from bottom to top to obtain a material to be cured, wherein the pre-laid layer comprises a lower steel plate, a lower copper foil, the cyanate quartz cloth base material with the number of paving layers and an upper copper foil which are sequentially stacked from bottom to top; s3: placing the material to be solidified in a vacuum press, sealing the vacuum press, vacuumizing, and keeping the vacuum degree at a preset vacuum degree; s4: heating a vacuum press from room temperature, keeping a first time length for pre-curing when the temperature is raised to a first temperature, then raising the temperature from the first temperature to a second temperature, gradually applying a first pressure before the temperature is raised to the pressurizing temperature, rapidly applying the pressure to the second pressure and keeping the pressure unchanged when the temperature is raised to the pressurizing temperature, keeping a second time length for curing when the temperature is raised to the second temperature, finally raising the temperature from the second temperature to a third temperature, keeping the third time length for curing when the temperature is raised to the third temperature until the curing is completed to obtain a cured material, wherein the pressurizing temperature is between the first temperature and the second temperature; s5: keeping the second pressure and the preset vacuum degree unchanged, gradually cooling to a fourth temperature, then unloading the vacuum and the pressure, and demoulding to obtain the copper-clad plate.
Preferably, before step S1, the method further includes the steps of: s6: cutting the cyanate quartz cloth substrate according to the required size; after step S5, the method further includes the steps of: s7: the copper-clad plate is inspected, and the inspection items comprise the following contents: appearance detection, plate thickness and thickness deviation detection, copper foil thickness detection, peeling strength test, thermal stress test, weldability test, water absorption test and Tg test, wherein the specific indexes of the test are as follows: 1. and (3) appearance detection: the surface of the copper foil is smooth and has no wrinkles, offset printing, pits and scratches; 2. detection of plate thickness and thickness deviation: measuring the thickness of the plate 20mm away from the edge of the plate, wherein the thickness deviation is within an error range; 3. and (3) detecting the thickness of the copper foil: the thickness error is within +/-10%; 4. and (3) testing the peel strength: the cross-harvesting state and the thermal stress are more than or equal to 1.0N/mm; 5. and (3) testing thermal stress: no delamination and no bubbling are caused after the thermal stress, and the slice analysis is carried out after the thermal stress is tested for three times, so that no delamination and bubbling are caused; 6. and (3) testing the weldability: the surface of the copper foil cannot be unwetted or the wetting proportion is not less than 95 percent; 7. water absorption test: the water absorption rate is not more than 0.3%; tg test: measured by DSC method or TMA method, not less than 180 ℃.
Preferably, the cyanate quartz cloth substrate is in the form of a prepreg or prepreg.
Preferably, in the step S1, the temperature increase rate of the sample does not exceed 1.5 ℃/min, and the pressurizing temperature is determined by a viscosity filament picking method.
Preferably, in the step S2, the lower copper foil and the upper copper foil are electrolytic copper foils with a thickness of half ounce or one ounce; the lower buffer felt and the upper buffer felt are composite felts or multi-layer kraft paper, and the thickness is within 3-8 mm; the lower steel plate and the upper steel plate are stainless steel plates, the thickness of the lower steel plate and the upper steel plate is 2mm, and the surface roughness of the lower steel plate and the upper steel plate is less than Ra0.8.
Preferably, in the step S3, the predetermined vacuum degree is-0.07 MPa or less.
Preferably, in the step S4, the temperature rising rate between the room temperature and the first temperature is 0.5 to 1.5 ℃/min, the first time period is 0.5 to 2 hours, the temperature rising rate between the first temperature and the second temperature is 0.5 to 1.5 ℃/min, the first pressure is less than 1.5MPa, the second pressure is 3 to 5MPa, the second time period is 0.5 to 2 hours, the temperature rising rate between the second temperature and the third temperature is 0.5 to 1.5 ℃/min, and the third time period is 0.5 to 2 hours.
Preferably, in the step S5, the fourth temperature is 60 ℃, and the cooling rate is 0.5 to 1.5 ℃/min.
In order to solve the technical problem, the invention adopts another technical scheme that: the copper-clad plate is prepared according to any one of the preparation methods.
In order to solve the technical problem, the invention adopts another technical scheme that: a circuit board is provided, and the circuit board comprises the copper-clad plate.
Different from the prior art, the invention has the beneficial effects that: the prepared copper-clad plate has excellent dielectric property, heat resistance, processability and good adhesive compatibility, can be manufactured into a single-layer or multi-layer printed circuit board according to design requirements and applied to electronic circuits.
Drawings
Fig. 1 is a flow chart of a preparation method of a high-temperature-resistant and high-dielectric-property copper-clad plate provided by the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the preparation method of the high temperature resistant and high dielectric property copper-clad plate of the embodiment of the invention comprises the following steps:
s1: taking a small amount of cyanate ester quartz cloth base material as a sample, heating the sample, and determining the temperature of resin during drawing as a pressurizing temperature in the heating process.
In step S1, the temperature rise rate of the sample is not more than 1.5 ℃/min, and the pressurizing temperature is determined by adopting a viscosity filament picking method.
In this embodiment, before step S1, the method further includes the steps of: s6: and cutting the cyanate quartz cloth substrate according to the required size.
The cyanate quartz cloth substrate is made of prepreg or prepreg. For example, the cyanate ester quartz fiber fabric prepreg with the brand QW120/5528A can be in various forms such as plain weave, twill weave and the like, the gram weight of the fabric can be in various specifications such as 220 or 280 and the cyanate ester can be cyanate ester resin with other brands.
S2: the layer number of paving of cyanate quartz cloth substrate is confirmed according to the thickness of cyanate quartz cloth substrate and the demand thickness of copper-clad plate to and confirm the range upon range of layer number according to the demand quantity of copper-clad plate, range upon range of lower steel layer board, lower cushion felt, the pre-spread layer of range upon range of layer number, go up the steel sheet, go up the cushion felt, go up steel layer board according to from up order in proper order down, obtain and treat the cured material, the pre-spread layer includes from up lower steel sheet, lower copper foil that range upon range of in proper order down, lay the cyanate quartz cloth substrate of the layer number, go.
In step S2, the lower copper foil and the upper copper foil may be electrolytic copper foils of half ounce or one ounce thickness; the lower buffer felt and the upper buffer felt can be composite felts or multi-layer kraft paper, and the thickness is within 3-8 mm; the lower steel plate and the upper steel plate can be stainless steel plates, the thickness is 2mm, and the surface roughness reaches Ra0.8 or below.
Wherein, assuming that the thickness of the cyanate quartz cloth substrate is 0.1mm and the required thickness of the copper-clad plate is 0.5mm, the number of the laid layers of the cyanate quartz cloth substrate is 5, that is, 5 layers of cyanate quartz cloth substrates need to be stacked between the lower copper foil and the upper copper foil. And assuming that the required number of copper-clad plates is 5, the number of laminated layers is 5, that is, 5 pre-laminated layers need to be stacked between the lower buffer felt and the upper steel plate.
S3: and (3) placing the material to be solidified in a vacuum press, sealing the vacuum press, vacuumizing, and keeping the preset vacuum degree.
In step S3, the preset vacuum degree is below-0.07 MPa. The material to be solidified may be fed into the vacuum press by means of a crawler.
S4: heating the vacuum press from room temperature, maintaining a first time length for pre-curing when the temperature is raised to a first temperature, then raising the temperature to a second temperature from the first temperature, gradually applying a first pressure before the temperature is raised to a pressurizing temperature, rapidly applying the pressure to the second pressure and keeping the pressure unchanged when the temperature is raised to the pressurizing temperature, maintaining the second time length for curing when the temperature is raised to the second temperature, finally raising the temperature to a third temperature from the second temperature, and maintaining the third time length for curing when the temperature is raised to the third temperature until the curing is completed to obtain a cured material, wherein the pressurizing temperature is between the first temperature and the second temperature.
In step S4, the temperature rising rate between the room temperature and the first temperature is 0.5-1.5 ℃/min, the first time is 0.5-2 hours, the temperature rising rate between the first temperature and the second temperature is 0.5-1.5 ℃/min, the first pressure is below 1.5MPa, the second pressure is 3-5 MPa, the second time is 0.5-2 hours, the temperature rising rate between the second temperature and the third temperature is 0.5-1.5 ℃/min, and the third time is 0.5-2 hours. The specific temperature values of the first temperature, the second temperature and the third temperature are determined according to the mark of the cyanate ester quartz fiber fabric prepreg.
S5: keeping the second pressure and the preset vacuum degree unchanged, gradually cooling to a fourth temperature, then unloading the vacuum and the pressure, and demoulding to obtain the copper-clad plate.
After the copper-clad plate is prepared, the copper-clad plate needs to be inspected, and in this embodiment, after step S5, the method further includes the steps of:
s7: the copper-clad plate is inspected, and the inspection items comprise the following contents: appearance detection, plate thickness and thickness deviation detection, copper foil thickness detection, peeling strength test, thermal stress test, weldability test, water absorption test and Tg test, wherein the specific indexes of the test are as follows: 1. and (3) appearance detection: the surface of the copper foil is smooth and has no wrinkles, offset printing, pits and scratches; 2. detection of plate thickness and thickness deviation: measuring the thickness of the plate 20mm away from the edge of the plate, wherein the thickness deviation is within an error range; 3. and (3) detecting the thickness of the copper foil: the thickness error is within +/-10%; 4. and (3) testing the peel strength: the cross-harvesting state and the thermal stress are more than or equal to 1.0N/mm; 5. and (3) testing thermal stress: no delamination and no bubbling are caused after the thermal stress, and the slice analysis is carried out after the thermal stress is tested for three times, so that no delamination and bubbling are caused; 6. and (3) testing the weldability: the surface of the copper foil cannot be unwetted or the wetting proportion is not less than 95 percent; 7. water absorption test: the water absorption rate is not more than 0.3%; tg test: measured by DSC method or TMA method, not less than 180 ℃.
In step S5, the fourth temperature is 60 ℃ and the cooling rate is 0.5-1.5 ℃/min.
Step S4 in the manufacturing method of this embodiment is described in detail below by taking an example of a QW120/5528A cyanate ester quartz fiber fabric prepreg, in which the pressing temperature is 140 ℃ to 160 ℃ and the first temperature is 120 ℃ to 140 ℃. The second temperature is 180-200 ℃, the third temperature is 210-230 ℃, and the step S4 specifically comprises the following steps:
heating the vacuum press from room temperature at a heating rate of 1.5 ℃/min, keeping for 1 hour (namely the first time length) for precuring when the temperature is raised to the first temperature, wherein the pressure is the contact pressure of the vacuum press, namely no pressurization. And then the temperature is increased to a second temperature from the first temperature at the heating rate of 1.0 ℃/min, and the pressure is gradually increased to 1MPa (namely the first pressure) before the temperature is increased to the pressurizing temperature, at the moment, the resin is gradually softened, and the gas between layers can be exhausted by adding smaller pressure, so that the glue solution cannot be extruded out to cause poor glue. When the temperature is raised to the pressurizing temperature, the gel point is reached at the moment, the resin starts to crosslink, the pressure is quickly applied to 3MPa (namely the second pressure) to keep the pressure unchanged, and the larger pressure is applied at the moment to ensure that the interlayer is compact and has no pores or holes, so that the plate has better performance. If the pressure is started after the gel point, the effect cannot be achieved, resulting in high porosity and void ratio. And (3) keeping the temperature for 1 hour (namely the second time period) for curing when the temperature is raised to the second temperature, finally raising the temperature from the second temperature to the third temperature at the temperature raising rate of 1.0 ℃/min, and keeping the temperature for 3 hours (namely the third time period) for curing when the temperature is raised to the third temperature until the curing is finished to obtain the cured material.
Through inspection and verification, the cyanate quartz cloth copper clad laminate prepared by the preparation method provided by the embodiment of the invention has good dielectric property (about 3.4), low dielectric loss (less than or equal to 0.006), high Tg value (about 220 ℃), excellent printed board processing property (similar to FR-4) and good compatibility with epoxy adhesives (the shear strength is greater than the material body strength), can be used for manufacturing single-layer or multi-layer printed boards, and meets the requirements of electronic circuits.
The invention also discloses the copper-clad plate prepared by the preparation method according to the embodiment and a circuit board comprising the copper-clad plate.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A preparation method of a high-temperature-resistant and high-dielectric-property copper-clad plate is characterized by comprising the following steps:
s1: taking a small amount of cyanate ester quartz cloth base material as a sample, heating the sample, and determining the temperature of resin during drawing as a pressurizing temperature in the heating process;
s2: determining the number of paving layers of the cyanate quartz cloth base material according to the thickness of the cyanate quartz cloth base material and the required thickness of the copper-clad plate, determining the number of stacking layers according to the required number of the copper-clad plate, and sequentially stacking a lower steel supporting plate, a lower buffer felt, a pre-laid layer with the number of stacking layers, an upper steel plate, an upper buffer felt and an upper steel supporting plate from bottom to top to obtain a material to be cured, wherein the pre-laid layer comprises a lower steel plate, a lower copper foil, the cyanate quartz cloth base material with the number of paving layers and an upper copper foil which are sequentially stacked from bottom to top;
s3: placing the material to be solidified in a vacuum press, sealing the vacuum press, vacuumizing, and keeping the vacuum degree at a preset vacuum degree;
s4: heating a vacuum press from room temperature, keeping a first time length for pre-curing when the temperature is raised to a first temperature, then raising the temperature from the first temperature to a second temperature, gradually applying a first pressure before the temperature is raised to the pressurizing temperature, rapidly applying the pressure to the second pressure and keeping the pressure unchanged when the temperature is raised to the pressurizing temperature, keeping a second time length for curing when the temperature is raised to the second temperature, finally raising the temperature from the second temperature to a third temperature, keeping the third time length for curing when the temperature is raised to the third temperature until the curing is completed to obtain a cured material, wherein the pressurizing temperature is between the first temperature and the second temperature;
s5: keeping the second pressure and the preset vacuum degree unchanged, gradually cooling to a fourth temperature, then unloading the vacuum and the pressure, and demoulding to obtain the copper-clad plate.
2. The method according to claim 1, further comprising, before step S1, the steps of:
s6: cutting the cyanate quartz cloth substrate according to the required size;
after step S5, the method further includes the steps of:
s7: the copper-clad plate is inspected, and the inspection items comprise the following contents: appearance detection, plate thickness and thickness deviation detection, copper foil thickness detection, peeling strength test, thermal stress test, weldability test, water absorption test and Tg test, wherein the specific indexes of the test are as follows: 1. and (3) appearance detection: the surface of the copper foil is smooth and has no wrinkles, offset printing, pits and scratches; 2. detection of plate thickness and thickness deviation: measuring the thickness of the plate 20mm away from the edge of the plate, wherein the thickness deviation is within an error range; 3. and (3) detecting the thickness of the copper foil: the thickness error is within +/-10%; 4. and (3) testing the peel strength: the cross-harvesting state and the thermal stress are more than or equal to 1.0N/mm; 5. and (3) testing thermal stress: no delamination and no bubbling are caused after the thermal stress, and the slice analysis is carried out after the thermal stress is tested for three times, so that no delamination and bubbling are caused; 6. and (3) testing the weldability: the surface of the copper foil cannot be unwetted or the wetting proportion is not less than 95 percent; 7. water absorption test: the water absorption rate is not more than 0.3%; tg test: measured by DSC method or TMA method, not less than 180 ℃.
3. The preparation method according to claim 1 or 2, wherein the cyanate quartz cloth substrate is in the form of a prepreg or prepreg.
4. The method according to claim 3, wherein in step S1, the sample temperature is raised at a rate not exceeding 1.5 ℃/min, and the pressing temperature is determined by a viscosity-picking method.
5. The method of manufacturing according to claim 4, wherein in the step S2, the lower copper foil and the upper copper foil are electrolytic copper foils of a thickness of one-half ounce or one ounce; the lower buffer felt and the upper buffer felt are composite felts or multi-layer kraft paper, and the thickness is within 3-8 mm; the lower steel plate and the upper steel plate are stainless steel plates, the thickness of the lower steel plate and the upper steel plate is 2mm, and the surface roughness of the lower steel plate and the upper steel plate is less than Ra0.8.
6. The production method according to claim 5, wherein in the step S3, the preset vacuum degree is-0.07 MPa or less.
7. The method according to claim 6, wherein in step S4, the temperature rising rate from room temperature to the first temperature is 0.5-1.5 ℃/min, the first time period is 0.5-2 hours, the temperature rising rate from the first temperature to the second temperature is 0.5-1.5 ℃/min, the first pressure is less than 1.5MPa, the second pressure is 3-5 MPa, the second time period is 0.5-2 hours, the temperature rising rate from the second temperature to the third temperature is 0.5-1.5 ℃/min, and the third time period is 0.5-2 hours.
8. The method according to claim 7, wherein in step S5, the fourth temperature is 60 ℃ and the temperature reduction rate is 0.5-1.5 ℃/min.
9. A copper-clad plate, characterized in that the copper-clad plate is prepared according to the preparation method of any one of claims 1 to 8.
10. A circuit board, characterized in that the circuit board comprises the copper-clad plate of claim 9.
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