CN111599788B - Test method of high-frequency leadless ceramic shell with 0.5mm pitch - Google Patents
Test method of high-frequency leadless ceramic shell with 0.5mm pitch Download PDFInfo
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- CN111599788B CN111599788B CN202010387515.7A CN202010387515A CN111599788B CN 111599788 B CN111599788 B CN 111599788B CN 202010387515 A CN202010387515 A CN 202010387515A CN 111599788 B CN111599788 B CN 111599788B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
- H01L23/49506—Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The invention provides a test method of a 0.5 mm-pitch high-frequency leadless ceramic shell, which belongs to the technical field of ceramic packaging, wherein the outer side surface of a shell is provided with a metalized hollow hole, the diameter of the metalized hollow hole is 0.2mm, the metalized hollow hole comprises a grounding hollow hole and a radio frequency lead-out hollow hole, and the grounding hollow hole is arranged in a penetrating way along the height direction of the outer side surface of the shell; the radio frequency lead-out hollow hole extends into the cavity of the shell; the back of the shell is also provided with a through bonding pad connected with the grounding bonding pad, and the sealing area is connected with the grounding bonding pad through the grounding hollow hole and the through bonding pad; the pitch between the through pads and the radio frequency pads is 0.5 mm. The high-frequency leadless ceramic shell with the pitch of 0.5mm and the testing method can ensure that the hollow hole can achieve good impedance matching; and the metalized hollow holes on the side surfaces are directly connected with the sealing area, so that the good grounding of the sealing area is ensured, and the resonance is inhibited.
Description
Technical Field
The invention belongs to the technical field of ceramic packaging, and particularly relates to a test method of a high-frequency leadless ceramic shell with a 0.5mm pitch.
Background
A typical foreign plastic-encapsulated leadless package has a pitch of 0.50mm, and is exemplified by QFNs (Quad Flat No-lead packages) arranged uniformly around square terminals, as shown in table 1.
TABLE 1 common dimensions and pin counts for foreign plastic-encapsulated QFN devices
| Overall dimension | Total number of lead-out ends | Number of single-sided outlet ends | Pitch of | |
| |
3×3 | 16 | 4 | 0.50mm |
| QFN24 | 4×4 | 24 | 6 | 0.50 |
| QFN32 | ||||
| 5×5 | 32 | 8 | 0.50mm | |
| QFN40 | 6×6 | 40 | 10 | 0.50mm |
If the pads are replaced in situ, the ceramic package pads must still maintain a 0.50mm pitch, whereas the conventional hollow holes have a diameter of 0.25mm, see fig. 8-10, due to the high dielectric constant of the ceramic, about 9.8, and the large diameter of the side hollow holes, which results in low impedance at the side hollow holes, and impedance mismatch which results in reduced microwave performance.
In order to ensure the air tightness of the package, it is necessary to add a seal area metallization, see fig. 8 to 10, the metallization is generally in a suspended or single-point grounding state, and is in a poor grounding state, and under a high frequency condition, the seal area metallization may couple with a signal line to generate resonance, and the microwave performance is seriously deteriorated.
Disclosure of Invention
The invention aims to provide a high-frequency leadless ceramic shell with a 0.5mm pitch, and aims to solve the problems of low impedance at a side hollow hole and microwave performance deterioration caused by resonance.
In order to achieve the purpose, the invention adopts the technical scheme that: the high-frequency leadless ceramic shell with the pitch of 0.5mm is provided, and comprises a shell, wherein the outer side surface of the shell is provided with a metalized hollow hole, the back surface of the shell is provided with a grounding pad and a radio frequency pad, the front surface of the shell is provided with a sealing area, the diameter of the metalized hollow hole is 0.2mm, the metalized hollow hole comprises a grounding hollow hole and a radio frequency leading-out hollow hole, and the grounding hollow hole is arranged in a penetrating manner along the height direction of the outer side surface of the shell and is used for connecting the sealing area with the grounding pad; the radio frequency lead-out hollow hole extends into the cavity of the shell and is used for leading out a bonding chip; the back of the shell is also provided with a through bonding pad connected with the grounding bonding pad, and the sealing area is connected with the grounding bonding pad through the grounding hollow hole and the through bonding pad; the pitch between the through bonding pads and the radio frequency bonding pads is 0.5mm, and the pitch between the radio frequency bonding pads is 0.5 mm.
As another embodiment of the present application, the grounding hollow hole is disposed on each of four outer side surfaces of the housing.
As another embodiment of this application, four lateral surfaces of casing are equipped with at least two respectively the hollow hole of ground connection, two all be equipped with between the hollow hole of ground connection the hollow hole is drawn forth to the radio frequency, every the hollow hole of ground connection respectively correspond be equipped with the through pad that the ground connection pad is connected.
As another embodiment of the present application, a width of the rf pad is equal to a diameter of the metalized hollow hole, and a width of the through pad is equal to the diameter of the metalized hollow hole.
As another embodiment of the present application, the ground hollow holes of the opposite outer sides of the housing are symmetrically disposed.
The invention also provides a test method of the high-frequency leadless ceramic shell with the pitch of 0.5mm, which comprises the following steps:
fixing a leadless ceramic shell to be tested on a test board;
arranging a microstrip straight-through line in a chip mounting area of a leadless ceramic shell to be tested, wherein two ends of the microstrip straight-through line are connected with a test port through a radio frequency lead-out hollow hole and a radio frequency bonding pad to form a test passage;
connecting a vector network analyzer with a probe station;
setting a test frequency and a power level of an input signal, and calibrating the whole test system by adopting a ceramic calibration piece matched with the probe station;
and taking down the calibration piece, placing the leadless ceramic shell to be tested on a probe station, and testing and recording the return loss and the insertion loss of the leadless ceramic shell.
As another embodiment of the present application, the resistance of the microstrip through line is 45 Ω -50 Ω.
As another embodiment of the application, the radio frequency pad is led out to a test port through a test outgoing line.
As another embodiment of the application, two ends of the microstrip straight-through line are respectively bonded through two gold wires, and the diameter of each gold wire is 20-25 mm.
The high-frequency leadless ceramic shell with 0.5mm pitch provided by the invention has the beneficial effects that: compared with the prior art, the high-frequency leadless ceramic shell with 0.5mm pitch is compatible with a 0.50mm pitch plastic package device, and the scheme that the metalized hollow holes are small hollow holes with the diameter of 0.2mm is adopted, so that the hollow holes achieve good impedance matching; in the back radio frequency bonding pad, one part of the radio frequency bonding pads is directly communicated with the grounding bonding pad to realize forced grounding, and the radio frequency bonding pads are directly connected with the sealing area through the metalized hollow holes on the side surface, so that the good grounding of the sealing area is ensured, and the resonance is inhibited.
The leadless ceramic shell provided by the invention achieves impedance matching, inhibits resonance, achieves high frequency and can cover a Ka frequency band.
The invention can make the pitch and the position of the welding pad consistent with the shell of the plastic package device, so the invention is compatible with the plastic package device, and is not only suitable for the square CQFN shell with 0.50mm pitch, but also suitable for the LCC ceramic shell with 0.50mm pitch and rectangle.
The testing method of the high-frequency leadless ceramic shell with the pitch of 0.5mm provided by the invention provides a test basis for the reliability of the leadless ceramic shell provided by the invention through testing the return loss and the insertion loss of the shell.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a first schematic perspective view of a 0.5mm pitch high frequency leadless ceramic package according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a 0.5mm pitch high frequency leadless ceramic package according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a 0.5mm pitch high frequency leadless ceramic package according to an embodiment of the present invention;
FIG. 4 is a schematic bottom view of the 0.5mm pitch high frequency leadless ceramic package shown in FIG. 3;
FIG. 5 is a schematic side view of the 0.5mm pitch high frequency leadless ceramic package shown in FIG. 3;
FIG. 6 is a schematic structural diagram of a test fixture for a high-frequency leadless ceramic package with a pitch of 0.5mm according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a 0.5mm pitch high frequency leadless ceramic package test provided by an embodiment of the present invention;
FIG. 8 is a graph of a test of a 0.5mm pitch high frequency leadless ceramic package provided by an embodiment of the present invention;
FIG. 9 is a schematic structural view of a leadless ceramic package provided by the prior art;
FIG. 10 is a side view of the structure of FIG. 9;
fig. 11 is a bottom view of the structure of fig. 9.
In the figure: 1. a housing; 2. a radio frequency lead-out hollow hole; 3. a ground hollow bore; 4. a chip mounting area; 5. a seal area; 6. a ground pad; 7. a radio frequency pad; 8. a through pad; 9. a test board; 10. gold wire; 11. a microstrip straight line; 12. and testing the outgoing line.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 5, a 0.5mm pitch high frequency leadless ceramic package provided by the present invention will now be described. The high-frequency leadless ceramic shell with the pitch of 0.5mm comprises a shell 1, wherein the outer side surface of the shell 1 is provided with a metalized hollow hole, the back surface of the shell 1 is provided with a grounding pad 6 and a radio frequency pad 7, the front surface of the shell 1 is provided with a sealing area 5, the diameter of the metalized hollow hole is 0.2mm, the metalized hollow hole comprises a grounding hollow hole 3 and a radio frequency leading-out hollow hole 2, and the grounding hollow hole 3 is arranged in a penetrating manner along the height direction of the outer side surface of the shell 1 and is used for connecting the sealing area 5 with the grounding pad 6; the radio frequency lead-out hollow hole 2 extends into the cavity of the shell 1 and is used for leading out a bonding chip; the back surface of the shell 1 is also provided with a through pad 8 connected with the grounding pad 6, and the sealing area 5 is connected with the grounding pad 6 through the grounding hollow hole 3 and the through pad 8; the pitch between the through bonding pads 8 and the radio frequency bonding pads 7 is 0.5mm, and the pitch between the radio frequency bonding pads 7 is 0.5 mm.
The high-frequency leadless ceramic shell with 0.5mm pitch provided by the invention is compatible with a plastic package device with 0.50mm pitch, compared with the prior art, the scheme that the diameter of a small hollow hole with 0.2mm is selected for a metalized hollow hole is adopted, so that the hollow hole achieves good impedance matching; in the back radio frequency bonding pad 7, a part of the radio frequency bonding pad 7 is directly communicated with the grounding bonding pad 6 to realize forced grounding, and the sealing area 5 is directly connected through a part of metalized hollow holes on the side surface, so that good grounding of the sealing area 5 is ensured, and resonance is inhibited. According to the function of the conventional radio frequency bonding pad 7 and convenience in description, a part of the radio frequency bonding pad 7 is named as a through bonding pad 8, the through bonding pad 8 is connected with a grounding bonding pad 6 through a gold wire 10, and direct grounding is achieved, so that the sealing area 5 can be well grounded, resonance is inhibited, and the working performance of microwaves is improved.
The leadless ceramic shell provided by the invention achieves impedance matching, inhibits resonance, achieves high frequency and can cover a Ka frequency band.
The invention can make the pitch and the position of the welding pad consistent with the shell of the plastic package device, so the invention is compatible with the plastic package device, and is not only suitable for the square CQFN shell with 0.50mm pitch, but also suitable for the LCC ceramic shell with 0.50mm pitch and rectangle.
Referring to fig. 1 to 5, as a specific embodiment of the high-frequency leadless ceramic package with 0.5mm pitch provided by the present invention, the grounding hollow holes 3 are disposed on four outer side surfaces of the housing 1. By providing a plurality of ground hollow holes 3, the grounding performance of the seal area 5 is improved, and the effect of suppressing resonance is improved.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 1 to 5, at least two grounding hollow holes 3 are respectively disposed on four outer side surfaces of the housing 1, the radio frequency outgoing hollow hole 2 is disposed between the two grounding hollow holes 3, and each grounding hollow hole 3 is correspondingly disposed with a through pad 8 connected to the grounding pad 6.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 1 to 5, the grounding hollow holes 3 on the opposite outer sides of the housing 1 are symmetrically disposed. The symmetrical arrangement of the grounding hollow holes 3 also serves to inhibit resonance and improve the working performance of the microwave device.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 1 to 5, the width of the rf pad 7 is equal to the diameter of the metalized hollow hole, and the width of the through pad 8 is equal to the diameter of the metalized hollow hole. As mentioned above, the through pad 8 is actually a function of grounding a part of the rf pad 7, so that the sealing region 5 can be directly connected to the grounding pad 6, thereby achieving a good effect of suppressing resonance.
The invention also provides a test method of the high-frequency leadless ceramic shell with 0.5mm pitch, referring to fig. 6 and 7, the requirements of the test instrument and the tool are as follows:
a) vector network analyzer: the frequency range and precision of the device meet the test requirements;
b) probe platform, probe, calibration piece, test board 9, radio frequency cable: the working frequency of the device is covered with the testing frequency of the device to be tested;
the remarks are as follows:
A) before testing, the probe table top is ensured to be clean and free from foreign matters so as to avoid influencing the grounding effect of the bottom surface of the piece to be tested;
B) before testing, the piece to be tested is ensured to be clean and free from foreign matters so as to avoid the influence of unknown electromagnetic interference on the test result;
C) when the probes contact the piece to be tested, the pressure balance of the probes on the two sides on the piece to be tested is ensured so as to prevent the unbalanced pressure from causing the tilting of one side of the piece to be tested and influencing the test result.
The samples were prepared as follows:
and mounting a 50-ohm microstrip straight-through line 11 on the chip mounting area 4 of the tested piece, bonding two 25-micron gold wires 10 at each position, and then welding the tested piece on the test board 9, wherein the welding ensures that the leading-out end of the shell is well connected with the test board 9 and has no short circuit or insufficient welding phenomenon.
Referring to fig. 7, the present invention provides a specific test method comprising the steps of:
s1, welding the leadless ceramic shell to be tested on the test board 9;
s2, arranging a microstrip straight-through line 11 in a chip mounting area 4 of the leadless ceramic shell to be tested, wherein two ends of the microstrip straight-through line 11 are connected with a test port through a radio frequency lead-out hollow hole 2 and a radio frequency pad 7 to form a test path; wherein. The chip mounting region 4 is connected with the radio frequency bonding pad 7 through a gold wire 10;
s3, connecting the vector network analyzer with a probe station;
s4, setting the test frequency and the power level of the input signal, and calibrating the whole test system by adopting a ceramic calibration piece matched with the probe station;
and S5, taking down the calibration piece, placing the leadless ceramic shell to be tested on a probe station, and testing and recording the return loss and the insertion loss of the leadless ceramic shell.
The invention relates to a vector network analysis instrument, which is a test device for electromagnetic wave energy. The vector network analyzer can measure various parameter amplitudes of a single-port network or a two-port network, can also measure phases, and can display test data by using a Smith chart. The vector network analyzer adopts the prior art.
The probe station is mainly applied to the testing of semiconductor industry, photoelectric industry, integrated circuits and packaging. The method is widely applied to the research and development of precise electrical measurement of complex and high-speed devices, and aims to ensure quality and reliability and reduce research and development time and cost of device manufacturing processes. The prior art is adopted.
As a specific implementation manner of the embodiment of the present invention, the resistance of the microstrip through line 11 is 45 Ω to 50 Ω.
As a specific implementation manner of the embodiment of the present invention, referring to fig. 6, the rf pad 7 is led out to the test port through the test lead 12. Arrows at two ends of the test board 9 are test ports, wherein the test outgoing lines 12 welded on the test board 9 are connected with the radio frequency bonding pads 7, and signals of the chip mounting area 4 are led out to the test ports.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 6, two ends of the microstrip through line 11 are respectively bonded through two gold wires 10, and a diameter of the gold wire 10 is 20mm to 25 mm.
The test aim of the invention is to test the return loss and the insertion loss of the shell under the specified conditions, and the test curve chart 8 can show that S11 and S21 respectively correspond to the return loss and the insertion loss of the high-frequency leadless ceramic shell with the 0.5mm pitch and the test method of the test method, and the return loss and the insertion loss indexes are good within 40G through testing the return loss and the insertion loss of the shell, thereby providing test basis for the reliability of the leadless ceramic shell provided by the invention.
The requirements of the test instrument and the tooling are as follows:
the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A test method of a high-frequency leadless ceramic shell with 0.5mm pitch is characterized by comprising the following steps:
fixing a leadless ceramic shell to be tested on a test board;
arranging a microstrip straight-through line in a chip mounting area of a leadless ceramic shell to be tested, wherein two ends of the microstrip straight-through line are connected with a test port through a radio frequency lead-out hollow hole and a radio frequency bonding pad of the leadless ceramic shell to form a test path;
connecting a vector network analyzer with a probe station;
setting a test frequency and a power level of an input signal, and calibrating the whole test system by adopting a ceramic calibration piece matched with the probe station;
and taking down the calibration piece, placing the leadless ceramic shell to be tested on a probe station, and testing and recording the return loss and the insertion loss of the leadless ceramic shell.
2. The method for testing a 0.5mm pitch high frequency leadless ceramic package according to claim 1, wherein the resistance of said microstrip through line is 45 Ω -50 Ω.
3. The method for testing a 0.5mm pitch high frequency leadless ceramic package of claim 1, wherein said radio frequency pads are brought out to a test port through test pinouts.
4. The method for testing a 0.5mm pitch high frequency leadless ceramic package according to claim 1, wherein two ends of said microstrip through line are respectively passed through two gold wires, and said gold wires have a diameter of 20mm to 25 mm.
5. The method for testing a 0.5mm pitch high frequency leadless ceramic package, according to claim 1, wherein the leadless ceramic package comprises a housing, the outer side of the housing is provided with a metalized hollow hole, the back of the housing is provided with a ground pad and a radio frequency pad, the front of the housing is provided with a sealed area, the diameter of the metalized hollow hole is 0.2mm, the metalized hollow hole comprises a ground hollow hole and a radio frequency outgoing hollow hole, and the ground hollow hole is arranged in a penetrating manner along the height direction of the outer side of the housing for connecting the sealed area with the ground pad; the radio frequency lead-out hollow hole extends into the cavity of the shell and is used for leading out a bonding chip; the back of the shell is also provided with a through bonding pad connected with the grounding bonding pad, and the sealing area is connected with the grounding bonding pad through the grounding hollow hole and the through bonding pad; the pitch between the through bonding pads and the radio frequency bonding pads is 0.5mm, and the pitch between the radio frequency bonding pads is 0.5 mm.
6. The method for testing a 0.5mm pitch high frequency leadless ceramic package according to claim 5, wherein said ground hollow hole is provided on each of four outer sides of said case.
7. The method for testing a 0.5 mm-pitch high-frequency leadless ceramic package according to claim 5, wherein at least two grounding hollow holes are respectively formed on four outer side surfaces of the case, the radio frequency outgoing hollow hole is formed between the two grounding hollow holes, and each grounding hollow hole is correspondingly provided with a through pad connected with the grounding pad.
8. The method for testing a 0.5mm pitch high frequency leadless ceramic package according to claim 5, wherein said ground hollow holes of opposite outer sides of said case are symmetrically disposed.
9. The method of testing a 0.5mm pitch high frequency leadless ceramic package of claim 5, wherein a width of said RF pad is equal to a diameter of said metallized hollow hole, and a width of said through pad is equal to a diameter of said metallized hollow hole.
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| CN114496969B (en) * | 2021-12-07 | 2022-09-23 | 合肥圣达电子科技实业有限公司 | Double-cavity ceramic packaging shell and preparation method thereof |
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| CN105977215A (en) * | 2016-06-30 | 2016-09-28 | 中国电子科技集团公司第十三研究所 | High-frequency and high-speed ceramic leadless shell for parallel seam welding |
| CN110783276A (en) * | 2019-11-12 | 2020-02-11 | 中国电子科技集团公司第十三研究所 | 0.4 mm-pitch main lead ceramic small-outline shell and power device |
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| JP2000323617A (en) * | 1999-05-12 | 2000-11-24 | Mitsubishi Electric Corp | High frequency semiconductor package |
| CN105870085B (en) * | 2016-06-28 | 2018-09-14 | 中国电子科技集团公司第十三研究所 | A kind of aluminium nitride multi-layer ceramics is without lead chip carrier encapsulation shell |
| CN106129029A (en) * | 2016-07-14 | 2016-11-16 | 中国电子科技集团公司第五十五研究所 | It is applied to the pottery four limit flat non-pin type shell of Ku wave band |
| CN107426923A (en) * | 2017-07-27 | 2017-12-01 | 上海斐讯数据通信技术有限公司 | A kind of printed circuit board (PCB) and its radio frequency test method |
| CN107658270B (en) * | 2017-10-13 | 2020-06-30 | 中国电子科技集团公司第十三研究所 | Ceramic shell for power converter |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105977215A (en) * | 2016-06-30 | 2016-09-28 | 中国电子科技集团公司第十三研究所 | High-frequency and high-speed ceramic leadless shell for parallel seam welding |
| CN110783276A (en) * | 2019-11-12 | 2020-02-11 | 中国电子科技集团公司第十三研究所 | 0.4 mm-pitch main lead ceramic small-outline shell and power device |
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