CN111599776A - A multi-layer composite nanoporous evaporator - Google Patents

A multi-layer composite nanoporous evaporator Download PDF

Info

Publication number
CN111599776A
CN111599776A CN202010498862.7A CN202010498862A CN111599776A CN 111599776 A CN111599776 A CN 111599776A CN 202010498862 A CN202010498862 A CN 202010498862A CN 111599776 A CN111599776 A CN 111599776A
Authority
CN
China
Prior art keywords
liquid
layer
nanoporous
storage tank
liquid storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010498862.7A
Other languages
Chinese (zh)
Other versions
CN111599776B (en
Inventor
夏国栋
樊润东
王佳豪
马丹丹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing University of Technology
Original Assignee
Beijing University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing University of Technology filed Critical Beijing University of Technology
Priority to CN202010498862.7A priority Critical patent/CN111599776B/en
Publication of CN111599776A publication Critical patent/CN111599776A/en
Application granted granted Critical
Publication of CN111599776B publication Critical patent/CN111599776B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

A multi-layer composite nano porous evaporator belongs to the technical field of microelectronic device cooling. Generally consisting of an upper silicon structure, a middle nanoporous structure and a lower silicon structure. The upper silicon structure includes seven manifold channels, an inlet reservoir, an outlet reservoir, and a plurality of vapor channels. The middle layer nano porous structure is obtained by etching processing on the upper layer silicon surface, and the nano hole arrays are uniformly distributed on the film. The lower silicon structure comprises a liquid inlet, a liquid outlet, parallel ribs and micro-channels among the ribs, and is connected with the upper layer by a bonding technology. The device utilizes the thin film evaporation heat dissipation of liquid in the nanometer holes, has the characteristics of stable operation, uniform temperature distribution, high strength of the nanometer film, less required working medium, low pumping power consumption and the like, and solves the problems of high heat flow density and multi-heat-area distribution of microelectronic devices.

Description

一种多层复合式纳米多孔蒸发器A multi-layer composite nanoporous evaporator

技术领域technical field

本发明涉及一种新型多层复合式纳米多孔蒸发器,属于微电子器件冷却技术领域。The invention relates to a novel multi-layer composite nano-porous evaporator, which belongs to the technical field of cooling of microelectronic devices.

技术背景technical background

近年来随着电子芯片制造业、军事工业、新能源应用技术和航空航天领域的高速发展,工程应用中对电子器件提出了“微型化”“高集成”“高功率”的新要求,由此氮化镓(GaN)高电子迁移率晶体管(HEMT)等微电子器件在各个领域得到广泛应用。然而局部热点上的散热问题极大限制了微电子器件的输出功率,研究发现在GaN基HEMT器件的部分亚毫米区域上,产生的热流密度高达5kW/cm2。因此如何有效散热以提高微电子器件的功率,延长其工作寿命成为急需解决的问题。目前,国内外对高热流密度电子器件的传统散热方案主要包括:高导热系数固体均热材料(铜、钨铜和金刚石等)或热界面材料(焊锡、导热硅脂和环氧树脂等)再结合空气冷却或液冷冷板,以此达到散热的目的。但由于接触热阻的存在,使得传统的散热方式并不能有效地降低结温,进而严重威胁器件的安全稳定运行。为解决此问题,研究者提出一种新型电子器件嵌入式冷却方案,热量由电子器件的基板直接散去,而不是在电子器件封装水平上,减少了界面材料的使用,大大降低了器件的结温。再利用绝缘介电液作为冷却工质,确保器件工作区域不产生磁场,进而保障了电子器件的运行性能。In recent years, with the rapid development of electronic chip manufacturing, military industry, new energy application technology and aerospace fields, new requirements for "miniaturization", "high integration" and "high power" have been put forward for electronic devices in engineering applications. Microelectronic devices such as Gallium Nitride (GaN) High Electron Mobility Transistors (HEMTs) are widely used in various fields. However, the heat dissipation problem on the local hot spot greatly limits the output power of microelectronic devices. It is found that the heat flux density generated is as high as 5kW/cm 2 in some sub-millimeter regions of GaN-based HEMT devices. Therefore, how to effectively dissipate heat to improve the power of microelectronic devices and prolong their working life has become an urgent problem to be solved. At present, the traditional heat dissipation solutions for high heat flux density electronic devices at home and abroad mainly include: high thermal conductivity solid soaking materials (copper, tungsten copper and diamond, etc.) or thermal interface materials (solder, thermal grease and epoxy resin, etc.) Combined with air cooling or liquid cooling cold plate to achieve the purpose of heat dissipation. However, due to the existence of contact thermal resistance, the traditional heat dissipation method cannot effectively reduce the junction temperature, which seriously threatens the safe and stable operation of the device. In order to solve this problem, the researchers proposed a new type of embedded cooling scheme for electronic devices. The heat is directly dissipated from the substrate of the electronic device, rather than at the packaging level of the electronic device. temperature. The insulating dielectric liquid is then used as a cooling medium to ensure that no magnetic field is generated in the working area of the device, thereby ensuring the operation performance of the electronic device.

近年来NEMS(Nano-Electromechanical System)技术飞速发展,纳米尺度内的传热问题成为传热学领域的前沿科学。大量研究证明纳米多孔膜上的相变可以消耗大量热量,因此利用纳米多孔膜对高热流密度微电子器件进行嵌入式散热获得了众多研究者的肯定。深层次的研究结果为高性能纳米多孔蒸发设备提出了以下标准:(1)从基底到液-气界面的低传热热阻;(2)能够产生较大的毛细力以输运蒸发所需工质;(3)有效的液体供应结构,可使压降最小化;(4)高效的蒸汽输运通道。然而在设计层面上如何达到以上标准困扰着人们,目前国内外的纳米多孔散热设备面临的问题主要有:纳米膜的机械强度差;利用流动通道进行供液易导致纳米孔堵塞;没有独立的蒸汽通道使得气液分离不能有效进行等。In recent years, NEMS (Nano-Electromechanical System) technology has developed rapidly, and the heat transfer problem in the nanoscale has become a frontier science in the field of heat transfer. A large number of studies have proved that the phase transition on the nanoporous membrane can consume a lot of heat, so the use of nanoporous membranes for embedded heat dissipation of high heat flux microelectronic devices has been affirmed by many researchers. The in-depth research results propose the following criteria for high-performance nanoporous evaporation devices: (1) low thermal resistance for heat transfer from the substrate to the liquid-air interface; (2) capable of generating large capillary forces to transport the required evaporation Working fluid; (3) Effective liquid supply structure, which can minimize pressure drop; (4) Efficient steam transport channel. However, at the design level, how to achieve the above standards has troubled people. At present, the main problems faced by nano-porous heat dissipation equipment at home and abroad are: poor mechanical strength of nano-membranes; using flow channels for liquid supply can easily lead to clogging of nano-pores; no independent steam The channel makes the gas-liquid separation ineffective, etc.

发明内容SUMMARY OF THE INVENTION

本发明要解决的技术问题是针对上述现有技术的不足,提供一种新型多层复合式纳米多孔蒸发器。The technical problem to be solved by the present invention is to provide a novel multi-layer composite nanoporous evaporator in view of the above-mentioned deficiencies of the prior art.

为解决上述技术问题,本发明所采取的技术方案是:一种多层复合式纳米多孔蒸发器,总体上由三层结构组成,分别为上层硅结构(1)、中层纳米多孔膜结构(2)和下层硅结构(3);其中中层纳米多孔膜结构(2)在上层硅结构(1)下表面直接加工得到,下层硅结构(3)则通过键合与中层纳米多孔膜结构(2)连接。In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a multi-layer composite nanoporous evaporator, which is generally composed of three-layer structures, which are an upper-layer silicon structure (1) and a middle-layer nanoporous membrane structure (2). ) and the lower layer silicon structure (3); wherein the middle layer nanoporous membrane structure (2) is directly processed on the lower surface of the upper layer silicon structure (1), and the lower layer silicon structure (3) is bonded to the middle layer nanoporous membrane structure (2) by bonding connect.

上层硅结构包括N个蒸汽通道(1.1)、N+1条歧管通道(1.2)、进口储液池(1.3)、出口储液池(1.4);N个蒸汽通道(1.1)为多道平行独立的长方形体通道,长方形体通道的长度方向两端封闭;N个蒸汽通道(1.1)之间以及最外两蒸汽通道(1.1)的两侧面共形成N+1条歧管通道(1.2);在N个蒸汽通道(1.1)长度方向的两端对应的为进口储液池(1.3)、出口储液池(1.4);歧管通道(1.2)分别与进口储液池(1.3)、出口储液池(1.4)连通,使得液体工质能够从进口储液池(1.3)经由歧管通道(1.2)流至出口储液池(1.4);多个蒸汽通道(1.1)则平行分布于N+1条歧管通道(1.2)之间,保证由蒸发产生的蒸汽能够得到高效运输;上层硅结构的上表面只有N个蒸汽通道(1.1)露出,N+1条歧管通道(1.2)、进口储液池(1.3)、出口储液池(1.4)均封闭;The upper layer silicon structure includes N steam channels (1.1), N+1 manifold channels (1.2), an inlet liquid storage pool (1.3), and an outlet liquid storage pool (1.4); the N steam channels (1.1) are multi-channel parallel An independent rectangular channel, and both ends of the rectangular channel are closed in the length direction; N+1 manifold channels (1.2) are formed between the N steam channels (1.1) and the two sides of the outermost two steam channels (1.1); The two ends in the length direction of the N steam passages (1.1) correspond to the inlet liquid storage tank (1.3) and the outlet liquid storage tank (1.4); the manifold channel (1.2) is respectively connected with the inlet liquid storage tank (1.3) and the outlet liquid storage tank The liquid pool (1.4) is connected so that the liquid working medium can flow from the inlet liquid storage tank (1.3) to the outlet liquid storage tank (1.4) through the manifold channel (1.2); a plurality of steam channels (1.1) are distributed in parallel to the N+ Between 1 manifold channel (1.2), the steam generated by evaporation can be transported efficiently; only N steam channels (1.1) are exposed on the upper surface of the upper silicon structure, N+1 manifold channels (1.2), inlet The liquid storage tank (1.3) and the outlet liquid storage tank (1.4) are closed;

中层纳米多孔膜结构(2)在上层硅(1)下表面通过刻蚀加工得到,在每个蒸汽通道(1.1)下端口设有一块独立的具有纳米孔(2.2)的纳米多孔膜(2.1);N块纳米多孔膜(2.1)的位置与上层硅结构(1)中的N个蒸汽通道(1.1)对应,从而形成的纳米孔(2.2)阵列在N块纳米多孔膜(2.1)上均匀排布,单个纳米孔孔径约为200nm。The middle-layer nanoporous membrane structure (2) is obtained by etching the lower surface of the upper silicon layer (1), and an independent nanoporous membrane (2.1) with nanopores (2.2) is provided at the lower port of each vapor channel (1.1). ; The position of the N-block nanoporous membrane (2.1) corresponds to the N vapor channels (1.1) in the upper silicon structure (1), so that the formed nanopore (2.2) array is uniformly arranged on the N-block nanoporous membrane (2.1) The pore size of a single nanopore is about 200 nm.

优选每块纳米多孔膜(2.1)与对应的蒸汽通道(1.1)下端口大小一致;在中层纳米多孔膜结构(2)中对应的进口储液池(1.3)、出口储液池(1.4)、歧管通道(1.2)位置均为空缺没有对应的膜;Preferably, each nanoporous membrane (2.1) has the same size as the lower port of the corresponding steam channel (1.1); the corresponding inlet liquid storage pool (1.3), outlet liquid storage pool (1.4), The positions of the manifold channels (1.2) are all vacant without corresponding membranes;

下层硅结构(3)包括平行排列的肋(3.2)、肋间的微通道(3.1)、液体进口(3.3)和液体出口(3.4);液体进口(3.3)与液体出口(3.4)为对称结构,对应与上层硅结构(1)中的进口储液池(1.3)、出口储液池(1.4)连通,使得液体工质能够从液体进口(3.3)与液体出口(3.4)进出进口储液池(1.3)、出口储液池(1.4);在下层硅结构(3)的上表面设有肋(3.2)和肋间的微通道(3.1);在平行的肋(3.2)之间形成的平行排列的微通道(3.1),肋(3.2)顶部与中层的纳米多孔膜(2.1)相接触,为纳米多孔膜(2.1)提供支撑作用,同时微通道(3.1)中的液体利用纳米孔(2.2)内的强毛细力为蒸发过程供液。The lower silicon structure (3) comprises ribs (3.2) arranged in parallel, microchannels (3.1) between the ribs, a liquid inlet (3.3) and a liquid outlet (3.4); the liquid inlet (3.3) and the liquid outlet (3.4) are symmetrical structures , corresponding to the inlet liquid storage tank (1.3) and the outlet liquid storage tank (1.4) in the upper layer silicon structure (1), so that the liquid working medium can enter and exit the inlet liquid storage tank from the liquid inlet (3.3) and the liquid outlet (3.4). (1.3), outlet reservoir (1.4); ribs (3.2) and microchannels (3.1) between ribs are provided on the upper surface of the lower silicon structure (3); parallel ribs (3.2) are formed between parallel ribs (3.2). Arranged microchannels (3.1), the tops of ribs (3.2) are in contact with the nanoporous membrane (2.1) in the middle layer, providing support for the nanoporous membrane (2.1), while the liquid in the microchannels (3.1) utilizes the nanopores (2.2 The strong capillary force in ) supplies the liquid for the evaporation process.

肋(3.2)的长度方向与纳米多孔膜(2.1)的长度方向垂直。The length direction of the ribs (3.2) is perpendicular to the length direction of the nanoporous membrane (2.1).

每块纳米多孔膜(2.1)上设有两排纳米孔(2.2)。Each nanoporous membrane (2.1) is provided with two rows of nanopores (2.2).

进口储液池(1.3)、出口储液池(1.4)的截面均为梯形结构空腔,所述的截面平行中层纳米多孔膜结构(2);梯形结构的长底面平行对应蒸汽通道(1.1)的端部,另一短底面远离蒸汽通道(1.1)的端部。The cross-sections of the inlet liquid storage tank (1.3) and the outlet liquid storage tank (1.4) are both trapezoidal structure cavities, and the cross-section is parallel to the middle-layer nanoporous membrane structure (2); the long bottom surface of the trapezoidal structure is parallel to the corresponding steam channel (1.1) the end of the other short bottom face away from the end of the steam channel (1.1).

N为4-10的数。N is a number from 4-10.

在下层硅结构(3)的下表面对应的肋(3.2)和肋间的微通道(3.1)部位对应热区(3.5),肋间的微通道(3.1)没有贯穿下层硅结构(3)的下表面,使得下层硅结构(3)的下表面对应的热区为一平面结构。The ribs (3.2) on the lower surface of the underlying silicon structure (3) and the microchannels (3.1) between the ribs correspond to the hot zone (3.5). The microchannels (3.1) between the ribs do not penetrate through the underlying silicon structure (3). the lower surface, so that the hot zone corresponding to the lower surface of the lower silicon structure (3) is a planar structure.

本发明的有益效果是:The beneficial effects of the present invention are:

在新型多层复合式纳米多孔蒸发器中,热源位于蒸发器底部使得热量可以在电子器件的基板上直接散去,属于嵌入式冷却方案。与传统外接散热器的散热方式相比,由于减少了界面材料的使用使得接触热阻大大减小,进而大幅度降低了器件的结温,保障电子器件安全稳定运行。多个纳米多孔膜(2.1)与歧管(1.2)交错平行排列的设计在最大化蒸发面积的同时也保证了单个纳米多孔膜(2.1)的机械强度。歧管(1.2)作为流动通道与微通道(3.1)作为供液通道的分离式设计既保证了液体的流动性,同时也避免了因液体流动带来的纳米孔(2.2)堵塞等问题。结构中的微通道(3.1)既为纳米多孔膜(2.1)提供机械支撑作用以再次提高膜的强度,其肋(3.2)也可将热量传导至相变界面。同时利用纳米孔(2.2)的毛细力吸液作用,实现充足的液体供应,大大减小了传统液冷方案中的泵功消耗,并将蒸发过程限制在薄膜蒸发区域,通过多个蒸汽通道(1.1)有效地完成气液分离。设备内各流动通道的分层结构也有助于减小流动阻力。在这种结构内液体的相变方式结合了池沸腾和流动沸腾的优点,即可满足高热流密度的散热冷却需求,又避免了不稳定性的出现,是一种理想的冷却方式。In the new multi-layer composite nanoporous evaporator, the heat source is located at the bottom of the evaporator so that the heat can be dissipated directly on the substrate of the electronic device, which belongs to the embedded cooling scheme. Compared with the traditional heat dissipation method of external heat sink, the contact thermal resistance is greatly reduced due to the reduction of the use of interface materials, which in turn greatly reduces the junction temperature of the device and ensures the safe and stable operation of the electronic device. The design of a plurality of nanoporous membranes (2.1) staggered and arranged in parallel with the manifolds (1.2) ensures the mechanical strength of a single nanoporous membrane (2.1) while maximizing the evaporation area. The separate design of the manifold (1.2) as the flow channel and the microchannel (3.1) as the liquid supply channel not only ensures the fluidity of the liquid, but also avoids problems such as clogging of the nanopores (2.2) caused by the liquid flow. The microchannels (3.1) in the structure both provide mechanical support for the nanoporous membrane (2.1) to increase the strength of the membrane again, and its ribs (3.2) also conduct heat to the phase transition interface. At the same time, the capillary suction effect of the nanopore (2.2) is used to achieve sufficient liquid supply, which greatly reduces the pump power consumption in the traditional liquid cooling scheme, and limits the evaporation process to the thin film evaporation area. 1.1) Effectively complete gas-liquid separation. The layered structure of the flow channels within the device also helps reduce flow resistance. In this structure, the liquid phase change method combines the advantages of pool boiling and flow boiling, which can meet the heat dissipation and cooling requirements of high heat flux density, and avoid the appearance of instability, which is an ideal cooling method.

附图说明Description of drawings

图1为本发明的整体结构示意图。FIG. 1 is a schematic diagram of the overall structure of the present invention.

图2为本发明的整体结构正面爆炸示意图。FIG. 2 is a schematic diagram of a frontal explosion of the overall structure of the present invention.

图3为本发明的整体结构背面爆炸示意图。FIG. 3 is a schematic diagram of the backside explosion of the overall structure of the present invention.

图4为本发明的上层硅结构正面示意图。FIG. 4 is a schematic front view of the upper layer silicon structure of the present invention.

图5为本发明的上层硅结构背面示意图。FIG. 5 is a schematic diagram of the backside of the upper layer silicon structure of the present invention.

图6为本发明的中层纳米多孔结构示意图。FIG. 6 is a schematic diagram of the middle-layer nanoporous structure of the present invention.

图7为本发明的下层硅结构正面示意图。FIG. 7 is a schematic front view of the underlying silicon structure of the present invention.

图8为本发明的下层硅结构背面示意图。FIG. 8 is a schematic diagram of the backside of the underlying silicon structure of the present invention.

图9为本发明的工作流程演示图。FIG. 9 is a work flow demonstration diagram of the present invention.

图中,1、上层硅结构;1.1、蒸汽通道;1.2、歧管通道;1.3、进口储液槽;1.4、出口储液槽;2、中层纳米多孔结构;2.1、纳米多孔膜;2.2、纳米孔;3、下层硅结构;3.1、微通道;3.2、肋;3.3、液体进口;3.4、液体出口;3.5、热区。In the figure, 1. upper layer silicon structure; 1.1, steam channel; 1.2, manifold channel; 1.3, inlet liquid storage tank; 1.4, outlet liquid storage tank; 2, middle layer nanoporous structure; 2.1, nanoporous membrane; 2.2, nanometer hole; 3. lower silicon structure; 3.1, microchannel; 3.2, rib; 3.3, liquid inlet; 3.4, liquid outlet; 3.5, hot zone.

具体实施方式Detailed ways

下面结合附图对本发明作进一步详细的说明,但本发明并不限于以下实施例。The present invention will be described in further detail below with reference to the accompanying drawings, but the present invention is not limited to the following examples.

实施例1Example 1

如图1、2、3、4、5、6、7、8所示,一种新型多层复合式纳米多孔蒸发器,包括上层硅结构(1)、中层纳米多孔膜结构(2)和下层硅结构(3)。上层硅结构为流动模块,由六个蒸汽通道(1.1)、七条歧管通道(1.2)、进口储液池(1.3)和出口储液池(1.4)组成。中层纳米多孔结构为蒸发模块,由六块纳米孔(2.2)阵列均匀排布的纳米多孔膜(2.1)组成。下层硅结构为液体供应模块,由液体进口(3.3)、液体出口(3.4)以及肋(3.2)和微通道(3.1)交错排布构成。As shown in Figures 1, 2, 3, 4, 5, 6, 7, and 8, a novel multi-layer composite nanoporous evaporator includes an upper layer silicon structure (1), a middle layer nanoporous membrane structure (2) and a lower layer Silicon structure (3). The upper silicon structure is a flow module consisting of six vapor channels (1.1), seven manifold channels (1.2), an inlet liquid reservoir (1.3) and an outlet liquid reservoir (1.4). The middle-layer nanoporous structure is an evaporation module, which is composed of six nanoporous membranes (2.1) with uniformly arranged arrays of nanopores (2.2). The lower silicon structure is a liquid supply module, which is composed of a liquid inlet (3.3), a liquid outlet (3.4), and a staggered arrangement of ribs (3.2) and microchannels (3.1).

多个蒸汽通道(1.1)与歧管通道(1.2)交错排列,歧管通道(1.2)两侧与呈对称结构的进口储液池、出口储液池连通;中层纳米多孔结构(2)为蒸发模块,纳米孔(2.2)阵列在多个纳米多孔膜(2.1)上均匀分布,每块膜的位置都分别与上层的每条蒸汽通道(1.1)所对应;下层硅结构(3)为供液模块,液体进口(3.3)与上层的进口储液池(1.3)连通,液体出口(3.4)与上层的出口储液池(1.4)连通,中心区域内部平行分布的肋(3.2)之间形成体积相同的微通道(3.1)。中层纳米多孔膜结构(2)直接在上层硅结构(1)表面刻蚀得到,再通过键合与下层硅结构(3)相连。A plurality of steam passages (1.1) are staggered with the manifold passages (1.2), and both sides of the manifold passages (1.2) are communicated with the inlet liquid storage tank and the outlet liquid storage tank in a symmetrical structure; the nanoporous structure (2) in the middle layer is for evaporation Module, the array of nanopores (2.2) is evenly distributed on a plurality of nanoporous membranes (2.1), and the position of each membrane corresponds to each vapor channel (1.1) of the upper layer; the lower silicon structure (3) is the liquid supply Module, the liquid inlet (3.3) is communicated with the upper inlet liquid storage tank (1.3), the liquid outlet (3.4) is connected with the upper outlet liquid storage tank (1.4), and a volume is formed between the parallel ribs (3.2) in the central area The same microchannel (3.1). The middle-layer nanoporous membrane structure (2) is directly etched on the surface of the upper-layer silicon structure (1), and then connected to the lower-layer silicon structure (3) by bonding.

由三层职能不同的结构即上层硅结构(1)、中层纳米多孔膜结构(2)和下层硅结构(3)复合而成,每层之间接触面的外边形状和大小相同。It is composed of three layers with different functions, that is, an upper layer silicon structure (1), a middle layer nanoporous membrane structure (2) and a lower layer silicon structure (3), and the outer shape and size of the contact surface between each layer are the same.

在中心区域六个蒸汽通道(1.1)与七条歧管(1.2)交错平行排布,蒸汽通道(1.1)贯通上层硅结构(1)且水平面积与单个纳米多孔膜(2.1)面积相等。In the central area, six steam channels (1.1) and seven manifolds (1.2) are alternately arranged in parallel. The steam channels (1.1) pass through the upper silicon structure (1) and have a horizontal area equal to that of a single nanoporous membrane (2.1).

纳米孔(2.2)阵列分别在六块膜上均匀排列,单个纳米孔直径在200nm左右。The nanopore (2.2) arrays are uniformly arranged on the six membranes, and the diameter of a single nanopore is about 200 nm.

整个微通道区域的面积与中层整个纳米多孔膜区域面积以及上层蒸汽通道和歧管区域的面积向对应且相等。The area of the entire microchannel area corresponds to and is equal to the area of the entire nanoporous membrane area of the middle layer and the area of the vapor channel and manifold area of the upper layer.

六块纳米多孔膜(2.1)的位置在垂直方向上分别与六个蒸汽通道(1.1)相对应,使得每块纳米多孔膜(2.1)都有一条独立的蒸汽通道(1.1)。The positions of the six nanoporous membranes (2.1) correspond to the six vapor channels (1.1) respectively in the vertical direction, so that each nanoporous membrane (2.1) has an independent vapor channel (1.1).

液体进出口位于下层,进出口储液池及歧管通道(1.2)位于上层,使得流体可以完成自下至上再从下流出的流动过程。The liquid inlet and outlet are located in the lower layer, and the inlet and outlet liquid storage tanks and manifold channels (1.2) are located in the upper layer, so that the fluid can complete the flow process from bottom to top and then outflow from bottom.

歧管通道(1.2)与微通道(3.1)拥有不同职能相互独立存在,实现了流动通道与供液通道的分离式设计。The manifold channel (1.2) and the microchannel (3.1) have different functions and exist independently of each other, realizing the separate design of the flow channel and the liquid supply channel.

从俯视角度看,歧管通道(1.2)与微通道(3.1)呈垂直排布而非水平排布,这有利于微通道(3.1)内液体的均匀分配。From a top view, the manifold channels (1.2) and the microchannels (3.1) are arranged vertically rather than horizontally, which is beneficial to the uniform distribution of the liquid in the microchannels (3.1).

假设将本新型多层复合式纳米多孔蒸发器安装于微电子器件上,使得蒸发器底部与热区(3.5)接触。如图9所示,液体工质通过外接供液管从液体进口(1.3)流入进口储液池(3.3),通过七条歧管通道(1.2)时一部分液体进入到下层硅结构(3)的微通道(3.1)中,另一部分液体流入出口储液池(1.4)并从液体出口(3.4)流出。It is assumed that the novel multi-layer composite nanoporous evaporator is mounted on a microelectronic device such that the bottom of the evaporator is in contact with the hot zone (3.5). As shown in Fig. 9, the liquid working medium flows from the liquid inlet (1.3) into the inlet liquid storage tank (3.3) through the external liquid supply pipe, and a part of the liquid enters the microstructure of the lower silicon structure (3) when passing through the seven manifold channels (1.2). In the channel (3.1), another part of the liquid flows into the outlet reservoir (1.4) and flows out from the liquid outlet (3.4).

纳米多孔膜(2.1)位于微通道(3.1)上方,纳米孔(2.2)内的强毛细力作用可以使微通道(3.1)内的液体工质稳定供应至纳米孔(2.2)内,同时肋(3.2)将底面微电子器件热区(3.5)产生的热量传导至六块纳米多孔膜(2.1),使得液体可以在纳米孔(2.2)内实现稳定的薄膜蒸发,再通过六个独立的蒸汽通道(1.1)有效地完成气液分离。The nanoporous membrane (2.1) is located above the microchannel (3.1), and the strong capillary force in the nanopore (2.2) can stably supply the liquid working medium in the microchannel (3.1) to the nanopore (2.2), while the ribs ( 3.2) Conducting the heat generated by the hot zone (3.5) of the microelectronic device on the bottom surface to the six nanoporous membranes (2.1), so that the liquid can achieve stable thin film evaporation in the nanopores (2.2), and then pass through six independent vapor channels (1.1) Complete gas-liquid separation effectively.

Claims (9)

1.一种多层复合式纳米多孔蒸发器,其特征在于,总体上由三层结构组成,分别为上层硅结构(1)、中层纳米多孔膜结构(2)和下层硅结构(3);其中中层纳米多孔膜结构(2)在上层硅结构(1)下表面直接加工得到,下层硅结构(3)则通过键合与中层纳米多孔膜结构(2)连接;1. a multilayer composite nanoporous evaporator, is characterized in that, generally consists of three-layer structure, is respectively upper layer silicon structure (1), middle layer nanoporous membrane structure (2) and lower layer silicon structure (3); The middle-layer nanoporous membrane structure (2) is directly processed on the lower surface of the upper-layer silicon structure (1), and the lower-layer silicon structure (3) is connected to the middle-layer nanoporous membrane structure (2) by bonding; 层硅结构包括N个蒸汽通道(1.1)、N+1条歧管通道(1.2)、进口储液池(1.3)、出口储液池(1.4);N个蒸汽通道(1.1)为多道平行独立的长方形体通道,长方形体通道的长度方向两端封闭;N个蒸汽通道(1.1)之间以及最外两蒸汽通道(1.1)的两侧面共形成N+1条歧管通道(1.2);在N个蒸汽通道(1.1)长度方向的两端对应的为进口储液池(1.3)、出口储液池(1.4);歧管通道(1.2)分别与进口储液池(1.3)、出口储液池(1.4)连通,使得液体工质能够从进口储液池(1.3)经由歧管通道(1.2)流至出口储液池(1.4);多个蒸汽通道(1.1)则平行分布于N+1条歧管通道(1.2)之间,保证由蒸发产生的蒸汽能够得到高效运输;上层硅结构的上表面只有N个蒸汽通道(1.1)露出,N+1条歧管通道(1.2)、进口储液池(1.3)、出口储液池(1.4)均封闭;The layered silicon structure includes N steam channels (1.1), N+1 manifold channels (1.2), an inlet liquid storage pool (1.3), and an outlet liquid storage pool (1.4); the N steam channels (1.1) are multi-channel parallel An independent rectangular channel, and both ends of the rectangular channel are closed in the length direction; N+1 manifold channels (1.2) are formed between the N steam channels (1.1) and the two sides of the outermost two steam channels (1.1); The two ends in the length direction of the N steam passages (1.1) correspond to the inlet liquid storage tank (1.3) and the outlet liquid storage tank (1.4); the manifold channel (1.2) is respectively connected with the inlet liquid storage tank (1.3) and the outlet liquid storage tank The liquid pool (1.4) is connected so that the liquid working medium can flow from the inlet liquid storage tank (1.3) to the outlet liquid storage tank (1.4) through the manifold channel (1.2); a plurality of steam channels (1.1) are distributed in parallel to the N+ Between 1 manifold channel (1.2), the steam generated by evaporation can be transported efficiently; only N steam channels (1.1) are exposed on the upper surface of the upper silicon structure, N+1 manifold channels (1.2), inlet The liquid storage tank (1.3) and the outlet liquid storage tank (1.4) are closed; 中层纳米多孔膜结构(2)在上层硅(1)下表面通过刻蚀加工得到,在每个蒸汽通道(1.1)下端口设有一块独立的具有纳米孔(2.2)的纳米多孔膜(2.1);N块纳米多孔膜(2.1)的位置与上层硅结构(1)中的N个蒸汽通道(1.1)对应,从而形成的纳米孔(2.2)阵列在N块纳米多孔膜(2.1)上均匀排布;The middle-layer nanoporous membrane structure (2) is obtained by etching the lower surface of the upper silicon layer (1), and an independent nanoporous membrane (2.1) with nanopores (2.2) is provided at the lower port of each vapor channel (1.1). ; The position of the N-block nanoporous membrane (2.1) corresponds to the N vapor channels (1.1) in the upper silicon structure (1), so that the formed nanopore (2.2) array is uniformly arranged on the N-block nanoporous membrane (2.1) cloth; 下层硅结构(3)包括平行排列的肋(3.2)、肋间的微通道(3.1)、液体进口(3.3)和液体出口(3.4);液体进口(3.3)与液体出口(3.4)为对称结构,对应与上层硅结构(1)中的进口储液池(1.3)、出口储液池(1.4)连通,使得液体工质能够从液体进口(3.3)与液体出口(3.4)进出进口储液池(1.3)、出口储液池(1.4);在下层硅结构(3)的上表面设有肋(3.2)和肋间的微通道(3.1);在平行的肋(3.2)之间形成的平行排列的微通道(3.1),肋(3.2)顶部与中层的纳米多孔膜(2.1)相接触,为纳米多孔膜(2.1)提供支撑作用,同时微通道(3.1)中的液体利用纳米孔(2.2)内的强毛细力为蒸发过程供液;The lower silicon structure (3) comprises ribs (3.2) arranged in parallel, microchannels (3.1) between the ribs, a liquid inlet (3.3) and a liquid outlet (3.4); the liquid inlet (3.3) and the liquid outlet (3.4) are symmetrical structures , corresponding to the inlet liquid storage tank (1.3) and the outlet liquid storage tank (1.4) in the upper layer silicon structure (1), so that the liquid working medium can enter and exit the inlet liquid storage tank from the liquid inlet (3.3) and the liquid outlet (3.4). (1.3), outlet reservoir (1.4); ribs (3.2) and microchannels (3.1) between ribs are provided on the upper surface of the lower silicon structure (3); parallel ribs (3.2) are formed between parallel ribs (3.2). Arranged microchannels (3.1), the tops of ribs (3.2) are in contact with the nanoporous membrane (2.1) in the middle layer, providing support for the nanoporous membrane (2.1), while the liquid in the microchannels (3.1) utilizes the nanopores (2.2 The strong capillary force in ) supplies liquid for the evaporation process; N为4-10的数。N is a number from 4-10. 2.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,每块纳米多孔膜(2.1)与对应的蒸汽通道(1.1)下端口大小一致;在中层纳米多孔膜结构(2)中对应的进口储液池(1.3)、出口储液池(1.4)、歧管通道(1.2)位置均为空缺没有对应的膜。2. A kind of multi-layer composite nanoporous evaporator according to claim 1 is characterized in that, each nanoporous membrane (2.1) is consistent with the lower port size of the corresponding steam channel (1.1); in the middle nanoporous membrane The positions of the corresponding inlet liquid storage tank (1.3), outlet liquid storage tank (1.4), and manifold channel (1.2) in the structure (2) are all vacant without corresponding membranes. 3.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,肋(3.2)的长度方向与纳米多孔膜(2.1)的长度方向垂直。3. A multi-layer composite nanoporous evaporator according to claim 1, characterized in that the length direction of the ribs (3.2) is perpendicular to the length direction of the nanoporous membrane (2.1). 4.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,每块纳米多孔膜(2.1)上设有两排纳米孔(2.2)。4. A multi-layer composite nanoporous evaporator according to claim 1, characterized in that, each nanoporous membrane (2.1) is provided with two rows of nanopores (2.2). 5.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,在下层硅结构(3)的下表面对应的肋(3.2)和肋间的微通道(3.1)部位对应热区(3.5),肋间的微通道(3.1)没有贯穿下层硅结构(3)的下表面,使得下层硅结构(3)的下表面对应的热区为一平面结构。5. A multi-layer composite nanoporous evaporator according to claim 1, characterized in that, the corresponding ribs (3.2) and the microchannels (3.1) between the ribs on the lower surface of the lower silicon structure (3) Corresponding to the hot zone (3.5), the microchannels (3.1) between the ribs do not penetrate the lower surface of the lower silicon structure (3), so that the hot zone corresponding to the lower surface of the lower silicon structure (3) is a planar structure. 6.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,进口储液池(1.3)、出口储液池(1.4)的截面均为梯形结构空腔,所述的截面平行中层纳米多孔膜结构(2);梯形结构的长底面平行对应蒸汽通道(1.1)的端部,另一短底面远离蒸汽通道(1.1)的端部。6. The multi-layer composite nanoporous evaporator according to claim 1, wherein the cross-sections of the inlet liquid storage tank (1.3) and the outlet liquid storage tank (1.4) are trapezoidal structure cavities, and the The cross section is parallel to the middle-layer nanoporous membrane structure (2); the long bottom surface of the trapezoidal structure is parallel to the end of the steam channel (1.1), and the other short bottom surface is away from the end of the steam channel (1.1). 7.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,多个蒸汽通道(1.1)为六蒸汽通道(1.1),单个纳米孔孔径为200nm。7 . The multi-layer composite nanoporous evaporator according to claim 1 , wherein the plurality of vapor channels ( 1.1 ) are six vapor channels ( 1.1 ), and the diameter of a single nanopore is 200 nm. 8 . 8.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,上层硅结构(1)、中层纳米多孔膜结构(2)和下层硅结构(3),每层之间接触面的外边形状和大小相同;8. A multi-layer composite nanoporous evaporator according to claim 1, characterized in that, the upper layer silicon structure (1), the middle layer nanoporous membrane structure (2) and the lower layer silicon structure (3), each layer of The outer shape and size of the indirect contact surface are the same; 在中心区域蒸汽通道(1.1)与歧管(1.2)交错平行排布,蒸汽通道(1.1)贯通上层硅结构(1)且水平面积与单个纳米多孔膜(2.1)面积相等;The steam channel (1.1) and the manifold (1.2) are alternately arranged in parallel in the central area, the steam channel (1.1) penetrates the upper silicon structure (1) and the horizontal area is equal to that of a single nanoporous membrane (2.1); 整个微通道区域的面积与中层整个纳米多孔膜区域面积以及上层蒸汽通道和歧管区域的面积向对应且相等;The area of the entire microchannel area corresponds to and is equal to the area of the entire nanoporous membrane area of the middle layer and the area of the vapor channel and manifold area of the upper layer; 纳米多孔膜(2.1)的位置在垂直方向上分别与蒸汽通道(1.1)相对应,使得每块纳米多孔膜(2.1)都有一条独立的蒸汽通道(1.1);The positions of the nanoporous membranes (2.1) are respectively corresponding to the steam channels (1.1) in the vertical direction, so that each nanoporous membrane (2.1) has an independent steam channel (1.1); 从俯视角度看,歧管通道(1.2)与微通道(3.1)呈垂直排布而非水平排布,这有利于微通道(3.1)内液体的均匀分配。From a top view, the manifold channels (1.2) and the microchannels (3.1) are arranged vertically rather than horizontally, which is beneficial to the uniform distribution of the liquid in the microchannels (3.1). 9.按照权利要求1所述的一种多层复合式纳米多孔蒸发器,其特征在于,应用时:使得蒸发器底部与热区(3.5)接触,液体工质通过外接供液管从液体进口(1.3)流入进口储液池(3.3),通过歧管通道(1.2)时一部分液体进入到下层硅结构(3)的微通道(3.1)中,另一部分液体流入出口储液池(1.4)并从液体出口(3.4)流出;9. A multi-layer composite nanoporous evaporator according to claim 1, characterized in that, during application: the bottom of the evaporator is made to contact the hot zone (3.5), and the liquid working medium passes through the external liquid supply pipe from the liquid inlet (1.3) flows into the inlet liquid storage tank (3.3), a part of the liquid enters the microchannel (3.1) of the lower silicon structure (3) when passing through the manifold channel (1.2), and another part of the liquid flows into the outlet liquid storage tank (1.4) and from the liquid outlet (3.4); 纳米多孔膜(2.1)位于微通道(3.1)上方,纳米孔(2.2)内的强毛细力作用可以使微通道(3.1)内的液体工质稳定供应至纳米孔(2.2)内,同时肋(3.2)将底面微电子器件热区(3.5)产生的热量传导至纳米多孔膜(2.1),使得液体可以在纳米孔(2.2)内实现稳定的薄膜蒸发,再通过独立的蒸汽通道(1.1)有效地完成气液分离。The nanoporous membrane (2.1) is located above the microchannel (3.1), and the strong capillary force in the nanopore (2.2) can stably supply the liquid working medium in the microchannel (3.1) to the nanopore (2.2), while the ribs ( 3.2) Conduct the heat generated by the hot zone (3.5) of the microelectronic device on the bottom surface to the nanoporous membrane (2.1), so that the liquid can achieve stable thin film evaporation in the nanopore (2.2), and then effectively pass through the independent vapor channel (1.1) complete gas-liquid separation.
CN202010498862.7A 2020-06-04 2020-06-04 Multilayer combined type nano porous evaporator Active CN111599776B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010498862.7A CN111599776B (en) 2020-06-04 2020-06-04 Multilayer combined type nano porous evaporator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010498862.7A CN111599776B (en) 2020-06-04 2020-06-04 Multilayer combined type nano porous evaporator

Publications (2)

Publication Number Publication Date
CN111599776A true CN111599776A (en) 2020-08-28
CN111599776B CN111599776B (en) 2024-08-16

Family

ID=72192430

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010498862.7A Active CN111599776B (en) 2020-06-04 2020-06-04 Multilayer combined type nano porous evaporator

Country Status (1)

Country Link
CN (1) CN111599776B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112135498A (en) * 2020-10-12 2020-12-25 上海海事大学 Variable-aperture multi-hole fin double-layer tapered micro-channel radiator
CN112161499A (en) * 2020-10-09 2021-01-01 北京计算机技术及应用研究所 Gas-liquid phase separation type micro-channel phase change cooler
CN112203476A (en) * 2020-10-12 2021-01-08 上海海事大学 A porous medium liquid film small channel cooling device
CN112888264A (en) * 2021-02-02 2021-06-01 西安交通大学 Double-deck microchannel heat abstractor based on gas-liquid separation
CN113611675A (en) * 2021-06-18 2021-11-05 北京大学 Heat radiator
CN113629030A (en) * 2021-06-18 2021-11-09 北京大学 Cooling device
CN115763405A (en) * 2022-11-15 2023-03-07 之江实验室 A 3D stacked chip with embedded microchannel cooling structure
WO2024164803A1 (en) * 2023-02-10 2024-08-15 中兴通讯股份有限公司 Heat dissipation assembly and electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130027883A1 (en) * 2011-07-25 2013-01-31 International Business Machines Corporation Flow boiling heat sink structure with vapor venting and condensing
CN108444325A (en) * 2018-03-19 2018-08-24 桂林电子科技大学 A kind of cooling device that nano thin-film is combined with microchannel
CN109890177A (en) * 2019-03-07 2019-06-14 东南大学 An electronic device thermal management microstructure
CN213304108U (en) * 2020-06-04 2021-05-28 北京工业大学 Multi-layer composite nano-porous evaporator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130027883A1 (en) * 2011-07-25 2013-01-31 International Business Machines Corporation Flow boiling heat sink structure with vapor venting and condensing
CN108444325A (en) * 2018-03-19 2018-08-24 桂林电子科技大学 A kind of cooling device that nano thin-film is combined with microchannel
CN109890177A (en) * 2019-03-07 2019-06-14 东南大学 An electronic device thermal management microstructure
CN213304108U (en) * 2020-06-04 2021-05-28 北京工业大学 Multi-layer composite nano-porous evaporator

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112161499A (en) * 2020-10-09 2021-01-01 北京计算机技术及应用研究所 Gas-liquid phase separation type micro-channel phase change cooler
CN112161499B (en) * 2020-10-09 2021-09-28 北京计算机技术及应用研究所 Gas-liquid phase separation type micro-channel phase change cooler
CN112135498A (en) * 2020-10-12 2020-12-25 上海海事大学 Variable-aperture multi-hole fin double-layer tapered micro-channel radiator
CN112203476A (en) * 2020-10-12 2021-01-08 上海海事大学 A porous medium liquid film small channel cooling device
CN112135498B (en) * 2020-10-12 2022-09-16 上海海事大学 Variable-aperture porous fin double-layer tapered micro-channel radiator
CN112888264A (en) * 2021-02-02 2021-06-01 西安交通大学 Double-deck microchannel heat abstractor based on gas-liquid separation
CN113611675A (en) * 2021-06-18 2021-11-05 北京大学 Heat radiator
CN113629030A (en) * 2021-06-18 2021-11-09 北京大学 Cooling device
CN113611675B (en) * 2021-06-18 2023-12-15 北京大学 a heat dissipation device
CN115763405A (en) * 2022-11-15 2023-03-07 之江实验室 A 3D stacked chip with embedded microchannel cooling structure
CN115763405B (en) * 2022-11-15 2025-05-13 之江实验室 A 3D stacked chip with embedded microchannel cooling structure
WO2024164803A1 (en) * 2023-02-10 2024-08-15 中兴通讯股份有限公司 Heat dissipation assembly and electronic device

Also Published As

Publication number Publication date
CN111599776B (en) 2024-08-16

Similar Documents

Publication Publication Date Title
CN111599776A (en) A multi-layer composite nanoporous evaporator
CN110610911B (en) Novel three-dimensional uniform distribution manifold type microchannel
CN213304108U (en) Multi-layer composite nano-porous evaporator
CN103594430B (en) Micro-channel radiator for dissipating heat of power electronic device
CN209822624U (en) Microchannel-nano porous composite structure evaporator
CN109979900B (en) Micro-channel-nano porous composite structure evaporator of GaN HEMT device substrate level
CN104051952B (en) A kind of interior microchannel cooling heat sink
CN113056087B (en) Printed circuit board embedded with micro-channel and preparation method thereof
CN108735693B (en) High heat dissipation silicon/glass composite interposer board and manufacturing method thereof
CN113611675B (en) a heat dissipation device
CN105470810B (en) A kind of macro channel liquid cooling high-power semiconductor laser and device
CN206657955U (en) A kind of new semiconductor laser microchannel cooling heat sink
CN113260138B (en) Printed circuit board with embedded array micro-channel and preparation method
CN112340694B (en) Preparation method of glass micro-channel radiator for gallium nitride power amplifier chip
CN113053840B (en) Bionic double-loop three-dimensional micro-channel heat dissipation device
CN115241734A (en) A uniform temperature lightweight heat sink and fiber-coupled semiconductor laser for a single-tube laser chip
CN109768020A (en) A new type of microchannel cold plate
CN101635432B (en) A liquid cooling chip for semiconductor laser and its preparation method
CN108650848B (en) Micro-channel radiator with uniform temperature
CN114783970A (en) A high-power radio frequency array three-dimensional heterogeneous microfluidic cooling device
CN106643243A (en) Silicon-based micro pulse heat pipe with micro/nano composite structures
CN1794444A (en) Micropassage type radiator based on diamond film
CN113594112A (en) Laminated liquid cooling heat dissipation module structure with double-sided chip
KR20220165054A (en) Semiconductor device thermal management module and manufacturing method thereof
CN204349207U (en) Stack-up array liquid refrigeration type high-power semiconductor laser

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant