CN111589616A - Semiconductor surface insulation film processing device - Google Patents
Semiconductor surface insulation film processing device Download PDFInfo
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- CN111589616A CN111589616A CN202010492808.1A CN202010492808A CN111589616A CN 111589616 A CN111589616 A CN 111589616A CN 202010492808 A CN202010492808 A CN 202010492808A CN 111589616 A CN111589616 A CN 111589616A
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- spraying
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- holding strip
- semicircle holding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0285—Stands for supporting individual articles to be sprayed, e.g. doors, vehicle body parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0271—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the object or work standing still during the spraying operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
- B05B14/40—Arrangements for collecting, re-using or eliminating excess spraying material for use in spray booths
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semiconductor surface insulating film processing device, which structurally comprises a film spraying processing machine, an operation panel, a spraying sealing device, a spraying machine head and a lifting groove, wherein the spraying sealing device can carry out limit clamping on a semiconductor wafer through a semiconductor clamping structure to avoid the deviation of the semiconductor wafer during spraying, the semiconductor wafer with a square structure can be clamped by utilizing an included angle groove, the clamping and spraying efficiency of the semiconductor wafers with different shapes is improved, the clamping by mechanical power is not needed, the semiconductor wafer is prevented from being damaged due to the failure of the mechanical power, through the rotation of semiconductor clamping structure for the spraying aircraft nose can carry out the spraying to the semiconductor piece surface in succession, and spraying sealing device strikes off the semiconductor piece excessive spraying layer on the surface through strickleing the mechanism, avoids the waste of material, lets the semiconductor piece surface can not be coarse, improves the quality and the pleasing to the eye of its outward appearance.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a semiconductor surface insulating film processing device.
Background
At present, the surface of a conductive part is insulated without affecting the original conductive function, the surface is covered with a high-resistance electrical insulating coating mainly by means of a spraying method, and the thickness of the coating is from 0.00127 to 0.0127 mm. The base material of the insulating paint mainly comprises synthetic resins such as acetal resin, chloroprene rubber, polyvinyl chloride, polybutylene, styrene-butadiene rubber, silicone resin and the like, and the resins have good electrical insulation. And the self-drying insulating paint can be self-dried to form a film after being coated.
However, the resistive thin film is produced by the prior art, the effect of the resistive thin film is influenced by the fact that the thickness of the resistive thin film is too thick sometimes after the insulating paint is sprayed, materials are wasted, the surface of the resistive thin film is rough without being treated after the insulating paint is sprayed, the appearance quality is influenced, and the manufacturing efficiency is influenced by spraying the other surface of the resistive thin film after the resistive thin film is dried to form a film in the prior art only after one surface of the resistive thin film is sprayed.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: a semiconductor surface insulation film processing device structurally comprises a film spraying processing machine, an operation panel, a spraying sealing device, a spraying machine head and a lifting groove, wherein the operation panel is installed on the surface of the front end of the film spraying processing machine;
spraying sealing device by base, semiconductor clamping structure, strickle mechanism, the dust cover body, guide ring, electro-magnet and constitute, the base inboard on be equipped with semiconductor clamping structure, base and semiconductor clamping structure swing joint, semiconductor clamping structure top be equipped with and strickle the mechanism, the base with strickle mechanism sliding fit, the base top on be equipped with the dust cover body, base and dust cover body threaded connection, dust cover body top intermediate position on install the guide ring, the inboard left wall of base on be equipped with the electro-magnet, base and electro-magnet be connected.
As the further optimization of this technical scheme, the base still include radius platform collecting vat, flexible axle sleeve, the spacing slide rail of arc, the inboard bottom of base under be equipped with radius platform collecting vat, the inboard left wall mounting of base have flexible axle sleeve, the inboard front and back both ends of base on all be equipped with the spacing slide rail of arc, base and the spacing slide rail of arc be connected.
As a further optimization of the technical scheme, the semiconductor clamping structure comprises a first semicircular clamping strip, a shaft rod, a second semicircular clamping strip, a rotating shaft and a bearing seat, the shaft rod is arranged on the surface of the first semicircular clamping strip, the first semicircular clamping strip is fixedly connected with the shaft rod, the second semicircular clamping strip is arranged on the right side of the first semicircular clamping strip, the first semicircular clamping strip is movably attached to the second semicircular clamping strip, the rotating shaft is arranged on the right end of the second semicircular clamping strip, the second semicircular clamping strip is fixedly connected with the rotating shaft, and the bearing seat is arranged on the surface of the rotating shaft.
As a further optimization of the technical scheme, one end of the first semicircular holding strip is provided with a pull rod, the first semicircular holding strip and the pull rod are of an integrated structure, the surface of the pull rod is provided with a compression spring, one end of the pull rod is provided with a limiting piece, and the pull rod is connected with the limiting piece.
As a further optimization of the technical scheme, the inner sides of the first semicircular holding strip and the second semicircular holding strip are respectively provided with a wire slot, and the inner sides of the first semicircular holding strip and the second semicircular holding strip are respectively provided with an included angle slot.
As this technical scheme's further optimization, strickle mechanism by support, telescopic link, traveller, accomodate the groove, soft strike off the strip and constitute, the support about all be equipped with on the both ends inboard and accomodate the groove, accomodate and be equipped with the telescopic link on the groove, accomodate groove and telescopic link one end sliding fit, the telescopic link other end on be equipped with the traveller, telescopic link and traveller fixed connection, the support bottom have soft strip of striking off, support and soft strip of striking off glue and connect.
As a further optimization of the technical scheme, the front end of the bracket is provided with the armature, the bracket is fixedly connected with the armature, and the rear end of the bracket is provided with the extension spring.
As a further optimization of the technical scheme, a spraying guide cover is arranged below the bottom end of the inner side of the dustproof cover body, the dustproof cover body is in threaded connection with the spraying guide cover, and a guide groove is formed in the inner side of the spraying guide cover.
As a further optimization of the technical scheme, the telescopic shaft sleeve is in sliding fit with the shaft rod.
As a further optimization of the technical scheme, the dustproof cover body is arranged right above the semiconductor clamping structure and is parallel to the semiconductor clamping structure.
As a further optimization of the technical scheme, the first semicircular clamping strip and the second semicircular clamping strip are positioned on the same horizontal plane.
As a further optimization of the technical scheme, the electromagnet and the armature are parallel to each other and are positioned on the same horizontal plane.
Advantageous effects
The invention relates to a semiconductor surface insulating film processing device, which is characterized in that a semiconductor wafer is placed between a first semicircular clamping strip and a second semicircular clamping strip, a compression spring pushes a limiting piece, the limiting piece pulls the first semicircular clamping strip through a pull rod to clamp the semiconductor wafer in an overhead manner, the first semicircular clamping strip and the second semicircular clamping strip can limit and clamp the semiconductor wafer through a wire groove to avoid deviation during spraying, the semiconductor wafer with a square structure can be clamped by utilizing an angle clamping groove, the clamping and spraying efficiency of the semiconductor wafer with different shapes is improved, the clamping by mechanical power is not needed, the semiconductor wafer is prevented from being damaged due to the failure of the mechanical power, an insulating coating is sprayed onto the surface of the semiconductor wafer from a spraying guide cover through a spraying machine head, and some splashed liquid drops onto the surface of the semiconductor wafer along a guide groove, the design is used for avoiding that the spraying machine head sprays, too much waste of materials appears in the too large spraying range, after the spraying of semiconductor wafer one side is accomplished, the rotating shaft is rotated, the rotating shaft drives the second semicircle holding strip and the first semicircle holding strip is rotatory, make the spraying aircraft nose can continue to spray the semiconductor wafer, spraying sealing device utilizes the collection vat of the round platform of falling to carry out recycle to the liquid that the spraying drips, after the spraying of semiconductor wafer one side is accomplished, the electro-magnet is electrified to the electric energy, the electro-magnet produces the electromagnetic field and attracts armature displacement, armature drives the support and moves toward the electro-magnet direction, the support utilizes telescopic link cooperation traveller can slide on the base inner wall, the support drives soft strip of striking off and strikes off unnecessary spraying layer on the semiconductor wafer surface, avoid the waste of materials, let the semiconductor wafer surface can not be coarse, improve the quality of its outward appearance and pleasing.
Compared with the prior art, the invention has the beneficial effects that: the spraying sealing device can carry out limiting clamping on a semiconductor wafer through the semiconductor clamping structure, the semiconductor wafer is prevented from deviating when being sprayed, the semiconductor wafer with a square structure can be clamped by utilizing the included angle groove, the clamping and spraying efficiency of the semiconductor wafers with different shapes is improved, the clamping with the help of mechanical power is not needed, the semiconductor wafer is prevented from being damaged when mechanical power breaks down, the semiconductor clamping structure is rotated, the spraying machine head can continuously spray the surface of the semiconductor wafer, the spraying sealing device scrapes off redundant spraying layers on the surface of the semiconductor wafer through the scraping mechanism, the waste of materials is avoided, the surface of the semiconductor wafer is prevented from being rough, and the quality and the attractiveness of the appearance of the semiconductor wafer are improved.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a semiconductor surface insulating film processing apparatus according to the present invention.
Fig. 2 is a schematic front sectional view of the spray sealing device of the present invention.
FIG. 3 is a top sectional view of the spray seal assembly of the present invention.
FIG. 4 is a top sectional view of the spray seal apparatus of the present invention.
Fig. 5 is a schematic structural view of the strickle mechanism of the present invention.
In the figure: the film spraying processing machine comprises a film spraying processing machine-1, an operation panel-2, a spraying sealing device-3, a spraying machine head-4, a lifting groove-5, a base-3 a, a semiconductor clamping structure-3 b, a strickling mechanism-3 c, a dustproof cover body-3 d, a guide ring-3 e, an electromagnet-3 f, an inverted circular table collecting groove-3 a1, a telescopic shaft sleeve-3 a2, an arc-shaped limit slide rail-3 a3, a first semicircular clamping strip-3 b1, a shaft rod-3 b2, a second semicircular clamping strip-3 b3, a rotating shaft-3 b4, a bearing seat-3 b5, a pull rod-3 b11, a compression spring-3 b12, a limiting sheet-3 b13, a wire groove-h 1, an included angle groove-h 2, a bracket-3 c1, a telescopic rod-3 c2, a sliding column-3 c3, a sliding column-3, A receiving groove-3 c4, a soft scraping strip-3 c5, an armature iron-3 c11, an extension spring-3 c12, a spraying guide cover-3 d1 and a guide groove-3 d 2.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example 1
Referring to fig. 1-3, the present invention provides a semiconductor surface insulation film processing apparatus, which comprises a film spraying processor 1, an operation panel 2, a spraying sealing device 3, a spraying machine head 4, and a lifting groove 5, wherein the operation panel 2 is installed on the front end surface of the film spraying processor 1, the spraying machine head 4 is installed on the top end of the film spraying processor 1, the film spraying processor 1 is connected with the spraying machine head 4, the lifting groove 5 is installed on the left and right sides of the film spraying processor 1, the spraying sealing device 3 is installed on the middle position of the top end of the film spraying processor 1, and the film spraying processor 1 is movably connected with the spraying sealing device 3;
spraying sealing device 3 constitute by base 3a, semiconductor clamping structure 3b, strickle mechanism 3c, the dust cover body 3d, guide ring 3e, electro-magnet 3f, base 3a inboard on be equipped with semiconductor clamping structure 3b, base 3a and semiconductor clamping structure 3b swing joint, semiconductor clamping structure 3b top be equipped with and strickle mechanism 3c, base 3a and strickle mechanism 3c sliding fit, base 3a top on be equipped with the dust cover body 3d, base 3a and dust cover body 3d threaded connection, dust cover body 3d top intermediate position on install guide ring 3e, base 3a inboard left side wall on be equipped with electro-magnet 3f, base 3a and electro-magnet 3f be connected.
Base 3a still include the spacing slide rail 3a3 of chamfer platform collecting vat 3a1, telescopic shaft sleeve 3a2, arc, the inboard bottom of base 3a have chamfer platform collecting vat 3a1, the inboard left wall mounting of base 3a have telescopic shaft sleeve 3a2, base 3a inboard front and back both ends on all be equipped with the spacing slide rail 3a3 of arc, base 3a and the spacing slide rail 3a3 of arc be connected.
The semiconductor clamping structure 3b comprises a first semicircular clamping strip 3b1, a shaft rod 3b2, a second semicircular clamping strip 3b3, a rotating shaft 3b4 and a bearing seat 3b5, wherein the surface of the first semicircular clamping strip 3b1 is provided with the shaft rod 3b2, the first semicircular clamping strip 3b1 is fixedly connected with the shaft rod 3b2, the right side of the first semicircular clamping strip 3b1 is provided with the second semicircular clamping strip 3b3, the first semicircular clamping strip 3b1 is movably attached to the second semicircular clamping strip 3b3, the right end of the second semicircular clamping strip 3b3 is provided with a rotating shaft 3b4, the second semicircular clamping strip 3b3 is fixedly connected with the rotating shaft 3b4, and the surface of the rotating shaft 3b4 is provided with the bearing seat 3b 5.
First semicircle holding strip 3b1 one end on be equipped with pull rod 3b11, first semicircle holding strip 3b1 and pull rod 3b11 be the integral structure, pull rod 3b11 on the surface install compression spring 3b12, pull rod 3b11 one end on be equipped with spacing piece 3b13, pull rod 3b11 and spacing piece 3b13 be connected.
All be equipped with wire casing h1 on first semicircle holding strip 3b1 and the second semicircle holding strip 3b3 inboard, first semicircle holding strip 3b1 and second semicircle holding strip 3b3 inboard on all be equipped with contained angle groove h 2.
The principle of the embodiment: the semiconductor wafer is placed between the first semicircular clamping strip 3b1 and the second semicircular clamping strip 3b3, the compression spring 3b12 pushes the limiting piece 3b13, the limiting piece 3b13 pulls the first semicircular clamping strip 3b1 through the pull rod 3b11 to clamp the semiconductor wafer in an overhead manner, the first semicircular clamping strip 3b1 and the second semicircular clamping strip 3b3 can limit and clamp the semiconductor wafer through the wire groove h1 to avoid the deviation of the semiconductor wafer during spraying, the square semiconductor wafer can be clamped by the corner groove h2, the clamping and spraying efficiency of the semiconductor wafer with different shapes is improved, the clamping by mechanical power is not needed, the semiconductor wafer is prevented from being damaged due to the failure of the mechanical power, the insulating coating is sprayed on the surface of the semiconductor wafer from the spraying guide hood 3d1 through the spraying machine head 4, and some splashed liquid drops on the surface of the semiconductor wafer along the guide groove 3d2, and the design is used for avoiding that the spraying machine head 4 sprays, too big the too much waste of material of emergence of spraying scope, when the one side spraying of semiconductor wafer is accomplished the back, rotatory pivot 3b4, pivot 3b4 drive second semicircle holding strip 3b3 and first semicircle holding strip 3b1 are rotatory for spraying aircraft nose 4 can continue the spraying semiconductor wafer, and spraying sealing device 3 utilizes the round platform collecting vat 3a1 of falling can carry out recycle to the liquid that the spraying drips.
The method for solving the problems in the embodiment is as follows: the spraying sealing device 3 can carry out limiting clamping on the semiconductor wafer through the semiconductor clamping structure 3b, the deviation of the semiconductor wafer when the spraying is avoided, the semiconductor wafer with the square structure can be clamped by utilizing the included angle groove h2, the clamping and spraying efficiency of the semiconductor wafers with different shapes is improved, the clamping with the help of mechanical power is not needed, the semiconductor wafer is prevented from being damaged due to the fact that the mechanical power breaks down, the semiconductor clamping structure 3b rotates, and the spraying machine head 4 can continuously spray the surface of the semiconductor wafer.
Example 2
Referring to fig. 1 to 5, the invention provides a semiconductor surface insulating film processing apparatus, wherein the leveling mechanism 3c comprises a support 3c1, an expansion link 3c2, a sliding column 3c3, an accommodating groove 3c4 and a soft scraping strip 3c5, the inner sides of the left and right ends of the support 3c1 are respectively provided with an accommodating groove 3c4, the accommodating groove 3c4 is provided with an expansion link 3c2, the accommodating groove 3c4 is in sliding fit with one end of the expansion link 3c2, the other end of the expansion link 3c2 is provided with the sliding column 3c3, the expansion link 3c2 is fixedly connected with the sliding column 3c3, the bottom end of the support 3c1 is provided with the soft scraping strip 3c5, and the support 3c1 is connected with the soft scraping strip 3c5 by glue.
An armature 3c11 is arranged at the front end of the bracket 3c1, the bracket 3c1 is fixedly connected with the armature 3c11, and an extension spring 3c12 is arranged at the rear end of the bracket 3c 1.
The inboard bottom of dustproof cover body 3d have spraying guide cover 3d1, dustproof cover body 3d and spraying guide cover 3d1 threaded connection, spraying guide cover 3d1 inboard on be equipped with guide groove 3d 2.
The telescopic shaft sleeve 3a2 is in sliding fit with the shaft rod 3b2, the dustproof cover body 3d is arranged right above the semiconductor clamping structure 3b and is parallel to the semiconductor clamping structure 3b, the first semicircular clamping strip 3b1 and the second semicircular clamping strip 3b3 are positioned on the same horizontal plane, and the electromagnet 3f and the armature 3c11 are parallel to each other and are positioned on the same horizontal plane.
The principle of the embodiment: after one side of the semiconductor wafer is coated, the electromagnet 3f is powered on, the electromagnet 3f generates an electromagnetic field to attract the armature 3c11 to displace, the armature 3c11 drives the support 3c1 to move towards the direction of the electromagnet 3f, the support 3c1 can slide on the inner wall of the base 3a by utilizing the telescopic rod 3c2 and the sliding column 3c3, and the support 3c1 drives the soft scraping strip 3c5 to scrape the redundant coating on the surface of the semiconductor wafer, so that the waste of materials is avoided, the surface of the semiconductor wafer is not rough, and the quality and the attractiveness of the appearance of the semiconductor wafer are improved.
The method for solving the problems in the embodiment is as follows: the spraying sealing device 3 scrapes off redundant spraying layer on the surface of the semiconductor wafer through the scraping mechanism 3c, so that the waste of materials is avoided, the surface of the semiconductor wafer is not rough, and the appearance quality and the attractiveness of the semiconductor wafer are improved.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The utility model provides a semiconductor surface insulation film processingequipment, its structure includes film coating processing machine (1), operating panel (2), spraying sealing device (3), spraying aircraft nose (4), lifts groove (5), film coating processing machine (1) front end install operating panel (2) on the surface, film coating processing machine (1) top on be equipped with spraying aircraft nose (4), film coating processing machine (1) and spraying aircraft nose (4) be connected, film coating processing machine (1) left and right sides on all be equipped with and lift groove (5), film coating processing machine (1) top intermediate position on be equipped with spraying sealing device (3), film coating processing machine (1) and spraying sealing device (3) swing joint, its characterized in that:
the spraying sealing device (3) consists of a base (3a), a semiconductor clamping structure (3b), a scraping mechanism (3c), a dustproof cover body (3d), a guide ring (3e) and an electromagnet (3f), wherein the semiconductor clamping structure (3b) is arranged on the inner side of the base (3a), the base (3a) is movably connected with the semiconductor clamping structure (3b), the scraping mechanism (3c) is arranged above the semiconductor clamping structure (3b), the base (3a) is in sliding fit with the scraping mechanism (3c), the dustproof cover body (3d) is arranged on the top end of the base (3a), the base (3a) is in threaded connection with the dustproof cover body (3d), the guide ring (3e) is arranged at the middle position of the top end of the dustproof cover body (3d), the electromagnet (3f) is arranged on the left wall of the inner side of the base (3a), the base (3a) is connected with the electromagnet (3 f).
2. The apparatus for processing a semiconductor surface insulating film according to claim 1, wherein: base (3a) still include the round platform collecting vat that falls (3a1), flexible axle sleeve (3a2), the spacing slide rail of arc (3a3), base (3a) inboard bottom have round platform collecting vat that falls (3a1), base (3a) inboard left side wall mounting have flexible axle sleeve (3a2), base (3a) inboard around all be equipped with the spacing slide rail of arc (3a3) on both ends, base (3a) and the spacing slide rail of arc (3a3) be connected.
3. The apparatus for processing a semiconductor surface insulating film according to claim 1, wherein: semiconductor clamping structure (3b) by first semicircle holding strip (3b1), axostylus axostyle (3b2), second semicircle holding strip (3b3), pivot (3b4), bearing frame (3b5) constitute, first semicircle holding strip (3b1) on the surface be equipped with axostylus axostyle (3b2), first semicircle holding strip (3b1) and axostylus axostyle (3b2) fixed connection, first semicircle holding strip (3b1) right side on be equipped with second semicircle holding strip (3b3), first semicircle holding strip (3b1) and second semicircle holding strip (3b3) activity laminating, second semicircle holding strip (3b3) right-hand member on be equipped with pivot (3b4), second semicircle holding strip (3b3) and pivot (3b4) fixed connection, pivot (3b4) surface on install bearing frame (3b 5).
4. The apparatus for processing a semiconductor surface insulating film according to claim 3, wherein: first semicircle holding strip (3b1) one end on be equipped with pull rod (3b11), first semicircle holding strip (3b1) and pull rod (3b11) structure as an organic whole, pull rod (3b11) install compression spring (3b12) on the surface, pull rod (3b11) serve and be equipped with spacing piece (3b13), pull rod (3b11) and spacing piece (3b13) be connected.
5. The semiconductor surface insulating film processing apparatus according to claim 3 or 4, wherein: first semicircle holding strip (3b1) and second semicircle holding strip (3b3) inboard on all be equipped with wire casing (h1), first semicircle holding strip (3b1) and second semicircle holding strip (3b3) inboard on all be equipped with contained angle groove (h 2).
6. The apparatus for processing a semiconductor surface insulating film according to claim 1, wherein: strickle mechanism (3c) constitute by support (3c1), telescopic link (3c2), traveller (3c3), accomodate groove (3c4), soft strip (3c5) of striking off, support (3c1) all be equipped with on the both ends inboard and accomodate groove (3c4), accomodate and be equipped with telescopic link (3c2) on groove (3c4), accomodate groove (3c4) and telescopic link (3c2) one end sliding fit, telescopic link (3c2) other end on be equipped with traveller (3c3), telescopic link (3c2) and traveller (3c3) fixed connection, support (3c1) bottom have soft strip (3c5) of striking off, support (3c1) and soft strip (3c5) glue connection.
7. The apparatus for processing a semiconductor surface insulating film according to claim 6, wherein: support (3c1) front end on be equipped with armature (3c11), support (3c1) and armature (3c11) fixed connection, support (3c1) rear end on install extension spring (3c 12).
8. The apparatus for processing a semiconductor surface insulating film according to claim 1, wherein: the dustproof cover body (3d) inboard bottom have spraying guide cover (3d1), the dustproof cover body (3d) and spraying guide cover (3d1) threaded connection, spraying guide cover (3d1) inboard on be equipped with guiding groove (3d 2).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010492808.1A CN111589616B (en) | 2020-06-03 | 2020-06-03 | Semiconductor surface insulation film processing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010492808.1A CN111589616B (en) | 2020-06-03 | 2020-06-03 | Semiconductor surface insulation film processing device |
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| CN111589616A true CN111589616A (en) | 2020-08-28 |
| CN111589616B CN111589616B (en) | 2021-08-10 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112892927A (en) * | 2021-01-20 | 2021-06-04 | 程建国 | Semiconductor surface insulation film processing device |
| CN113600363A (en) * | 2021-08-05 | 2021-11-05 | 广德瓯科达电子有限公司 | Uniform spraying device for solder mask insulation circuit board |
| CN115365034A (en) * | 2022-10-09 | 2022-11-22 | 山东金润源法兰机械有限公司 | Anticorrosive spraying equipment for two-way helping hand centre gripping type flange |
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| CN113600363A (en) * | 2021-08-05 | 2021-11-05 | 广德瓯科达电子有限公司 | Uniform spraying device for solder mask insulation circuit board |
| CN115365034A (en) * | 2022-10-09 | 2022-11-22 | 山东金润源法兰机械有限公司 | Anticorrosive spraying equipment for two-way helping hand centre gripping type flange |
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