CN111085387A

CN111085387A - Wafer gluing equipment

Info

Publication number: CN111085387A
Application number: CN202010035867.6A
Authority: CN
Inventors: 商帅
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-01-14
Filing date: 2020-01-14
Publication date: 2020-05-01

Abstract

The invention discloses wafer gluing equipment which structurally comprises a control panel, a case, a clamping table, a smearing mechanism, a fixing frame, a lifting rod, a lifting cylinder and a fixing table, wherein the control panel is arranged on the front surface of the case, the fixing frame is connected to the rear end of the top of the case, the fixing table is welded on the fixing frame, and the lifting cylinder is vertically arranged on the top of the fixing table; has the advantages that: two groups of symmetrical bulk spreaders are arranged on the rotating disc, a discharging roller is arranged in each bulk spreader, eight groups of material containing grooves are formed in each discharging roller, and the material containing grooves can control the amount of the sizing materials so that the sizing materials are uniformly distributed on the wafer; two smoothing plates are arranged at the two sides of the bottom of the sizing material groove, and the smoothing plates can scrape redundant sizing material on the material containing groove to prevent too much material from being discharged at one time; two groups of flatly laying devices are arranged on the rotating disc, and the rollers on the flatly laying devices can be used for flatly laying the rubber material on the wafer.

Description

Wafer gluing equipment

Technical Field

The invention discloses wafer gluing equipment, and belongs to the technical field of wafer gluing processing.

Background

Wafers are the basic material for manufacturing semiconductor chips, the most important raw material of semiconductor integrated circuits is silicon, which is widely found in rocks and gravels in the form of silicate or silicon dioxide in nature, and the manufacturing of silicon wafers can be summarized into three basic steps: silicon extraction and purification, monocrystalline silicon growth and wafer forming, wherein when the wafer is coated with glue, glue is spread on the wafer, the wafer rotates at a high speed, and the glue is spread, so that the phenomena of uneven glue distribution on the surface of the wafer, partial thick glue and partial thin glue are easily caused.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide wafer gluing equipment to solve the problems.

In order to achieve the purpose, the invention is realized by the following technical scheme: a wafer gluing device structurally comprises a control panel, a case, a clamping table, a smearing mechanism, a fixing frame, lifting rods, lifting cylinders and a fixing table, wherein the front side of the case is provided with the control panel, the rear end of the top of the case is connected with the fixing frame, the fixing frame is welded with the fixing table, the lifting cylinders are vertically installed on the top of the fixing table, the smearing mechanism is arranged below the fixing table and is movably connected with the fixing table through three groups of lifting rods, the clamping table is installed right below the smearing mechanism and is located in the middle of the top of the case;

preferably, the smearing mechanism comprises a circular ring frame, a rotating disc, two material spreaders and two flatting devices, wherein the two symmetrical material spreaders and the two symmetrical flatting devices are distributed on the rotating disc, and the rotating disc and the material spreaders on the rotating disc are distributed in a staggered manner.

Preferably, the clamping table consists of a collecting groove and a wafer placing table, the wafer placing table is arranged in the middle of the clamping table, and the collecting groove is formed in the periphery of the wafer placing table.

As preferred, the tripper comprises charge door, glue groove, through-hole, blowing roller and smooths the flat board, it has the through-hole to open on the roof of glue groove and glue groove top to scatter the inside glue groove of opening, the charge door is installed to the top of through-hole, the bottom movable mounting of glue groove has the blowing roller, glue tank bottom opening part both sides all are equipped with smooths the flat board.

Preferably, the smoothing plate has an arc-shaped structure and is attached to both sides of the smoothing plate.

Preferably, eight groups of material containing grooves are uniformly and equidistantly formed in the strike plate, and the bottom of each material containing groove is of a circular arc structure.

As preferred, the tiling ware comprises knob, gyro wheel, lead screw, crane, rotation axis, cover circle, the inside hollow structure and the inside gyro wheel that is equipped with of tiling ware, all install two lead screws on the frame on the gyro wheel both sides, rotation axis on the gyro wheel cooperatees with the cover circle on the crane, the gyro wheel passes through the lead screw threaded connection of crane and both sides, the lead screw runs through the top of tiling ware and is connected with the knob.

Preferably, the rotating disc is composed of a rotating ring, a gear and a motor, the motor is connected with the gear, and the gear is meshed with teeth on the inner side of the rotating ring.

Preferably, the rotating ring is connected with the material scattering device and the spreading device.

Preferably, the diameter of the ring frame is smaller than the outer diameter of the collecting groove, and the ring frame and the collecting groove are in clearance fit.

Preferably, a valve is arranged on the feed inlet.

Advantageous effects

The invention relates to a wafer gluing device, which has the following effects:

the rotary disc is provided with two groups of symmetrical bulk spreaders, the bulk spreaders are internally provided with the discharging rollers, the discharging rollers are provided with eight groups of material containing grooves, and the material containing grooves can control the amount of the sizing materials so that the sizing materials are uniformly distributed on the wafer;

according to the invention, two smoothing plates are arranged on two sides of the bottom of the sizing material groove, and the smoothing plates can scrape redundant sizing material on the material containing groove, so that too much material can be prevented from being discharged at one time;

according to the invention, two groups of flatting devices are arranged on the rotating disc, the rollers on the flatting devices can flatly flatten the glue on the wafer, the screw rods are arranged in the flatting devices, the height between the rollers and the bottom opening of the flatting devices can be adjusted, and the flatting thickness of the glue on the wafer can be adjusted.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural diagram of a wafer coating apparatus according to the present invention;

FIG. 2 is a schematic top view of an applying mechanism according to the present invention;

FIG. 3 is a schematic bottom view of an applying mechanism according to the present invention;

FIG. 4 is a schematic view of the interior of a bulk spreader according to the present invention;

fig. 5 is a schematic diagram of an internal structure of a tiling apparatus according to the present invention.

In the figure: the device comprises a control panel-1, a case-2, a clamping table-3, a smearing mechanism-4, a fixing frame-5, a lifting rod-6, a lifting cylinder-7, a fixing table-8, a circular ring frame-41, a rotating disc-42, a bulk spreader-43, a flatting device-44, a collecting tank-31, a wafer placing table-32, a charging opening-a 1, a glue material tank-a 2, a through hole-a 3, a discharging roller-a 4, a smoothing plate-a 5, a material containing tank-e, a rotating button-b 1, a roller-b 2, a screw rod-b 3, a lifting frame-b 4, a rotating shaft-b 5, a round sleeve-b 6, a rotating ring-c 1, a gear-c 2 and a motor-c 3.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

Example 1

Referring to fig. 1-4, the present invention provides a wafer gluing apparatus, comprising: the structure of the machine comprises a control panel 1, a case 2, a clamping table 3, a smearing mechanism 4, a fixing frame 5, lifting rods 6, lifting cylinders 7 and a fixing table 8, wherein the front surface of the case 2 is provided with the control panel 1, the rear end of the top of the case 2 is connected with the fixing frame 5, the fixing frame 5 is welded with the fixing table 8, the lifting cylinders 7 are vertically arranged on the top of the fixing table 8, the smearing mechanism 4 is arranged below the fixing table 8, the smearing mechanism 4 is movably connected with the fixing table 8 through the three groups of lifting rods 6, the clamping table 3 is arranged right below the smearing mechanism 4, and the clamping table 3 is positioned in the middle of the top of the case 2; the smearing mechanism 4 comprises a circular ring frame 41, a rotating disk 42, a material scattering device 43 and a flat spreading device 44, wherein the rotating disk 42 is provided with two symmetrical material scattering devices 43 and two symmetrical flat spreading devices 44, the rotating disk 42 and the material scattering devices 43 on the rotating disk 42 are distributed in a staggered manner, the clamping table 3 comprises a collecting tank 31 and a wafer placing table 32, the wafer placing table 32 is arranged in the middle of the clamping table 3, the collecting tank 31 is arranged on the periphery of the wafer placing table 32, the material scattering device 43 comprises a feeding port a1, a sizing material tank a2, a through hole a3, a discharging roller a4 and a flatting plate a5, the material scattering device 43 is internally provided with a sizing material tank a2, a through hole a3 is arranged on a top plate above the sizing material tank a2, a feeding port a1 is arranged above the through hole a3, a discharging roller a4 is movably arranged at the bottom of the sizing material tank a2, the opening of the sizing material tank a2 is provided with flatting plates a, the pacifying plate a5 is of an arc-shaped structure and is attached to two sides of the pacifying plate a5, eight groups of material containing grooves e are uniformly and equidistantly formed in the pacifying plate a5, and the bottoms of the material containing grooves e are of an arc-shaped structure.

Placing a wafer to be smeared on a wafer placing table 32, adding glue into a feeding port a1 on a material scattering device 43 until a glue groove a2 is filled, driving an annular frame 41 to move downwards by the operation of a lifting cylinder 7 until the material scattering device 43 is close to the surface of the wafer, driving the material scattering device 43 to rotate by a rotating disc 42, rolling a discharging roller a4 on the material scattering device 43 on the wafer, filling a material containing groove e on a discharging roller a4 in a glue groove a2 to be filled with the glue, and scraping the redundant glue on the material containing groove e by a smoothing plate a5 when rotating to the position of a smoothing plate a5 so as to prevent too much one-time blanking; the discharging roller a4 continuously rolls, the filled rubber materials on the material containing grooves e are inverted on the wafer, eight groups of material containing grooves e on the discharging roller a4 can uniformly distribute the rubber materials on the wafer at equal intervals, the flatting device 44 on the rotating disc 42 flatly distributes the rubber materials, and the redundant rubber materials fall into the collecting groove 31 to be collected.

Example 2

Referring to fig. 5, based on embodiment 1, the spreader 44 further includes a rotating button b1, a roller b2, a screw b3, a lifting frame b4, a rotating shaft b5, and a round sleeve b6, the interior of the spreader 44 is hollow and is provided with a roller b2, two screws b3 are mounted on frames on both sides of the roller b2, the rotating shaft b5 on the roller b2 is matched with the round sleeve b6 on the lifting frame b4, the roller b2 is in threaded connection with the screws b3 on both sides through the lifting frame b4, the screw b3 penetrates through the top of the spreader 44 and is connected with the rotating button b1, the rotating disc 42 includes a rotating ring c1, a gear c2 and a motor c3, the motor c3 is connected with the gear c2, the gear c2 is engaged with teeth on the inner side of the c1, and the rotating ring 1 is connected with the balk spreader 43 and the spreader 44.

The screw rod b3 and the rotary button b1 are arranged in the flatting device 44, the roller b2 on the lifting frame-b 4 can be adjusted to lift up and down on the screw rod b3 by operating the rotary button b1, the height between the roller b and the bottom opening of the flatting device 44 can be adjusted, and further the flatting thickness of glue on the wafer can be adjusted.

The foregoing merely illustrates the principles and preferred embodiments of the invention and many variations and modifications may be made by those skilled in the art in light of the foregoing disclosure, which are intended to be within the scope of the invention.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a wafer rubber coating equipment which characterized in that: the structure of the machine comprises a control panel (1), a case (2), a clamping table (3), a painting mechanism (4), a fixing frame (5), lifting rods (6), a lifting cylinder (7) and a fixing table (8), wherein the front side of the case (2) is provided with the control panel (1), the rear end of the top of the case is connected with the fixing frame (5), the fixing frame (5) is welded with the fixing table (8), the lifting cylinder (7) is vertically arranged on the top of the fixing table (8), the painting mechanism (4) is arranged below the fixing table (8) and is movably connected with the fixing table (8) through three groups of lifting rods (6), the clamping table (3) is arranged right below the painting mechanism (4), and the clamping table (3) is positioned in the middle of the top of the case (2);

the smearing mechanism (4) is composed of a circular ring frame (41), a rotating disk (42), two material scattering devices (43) and two spreading devices (44), wherein the rotating disk (42) is provided with the two symmetrical material scattering devices (43) and the two symmetrical spreading devices (44), and the rotating disk (42) and the material scattering devices (43) on the rotating disk (42) are distributed in a staggered mode.

2. A wafer gumming apparatus as in claim 1, wherein: the wafer clamping device is characterized in that the clamping table (3) is composed of a collecting groove (31) and a wafer placing table (32), the wafer placing table (32) is arranged in the middle of the clamping table (3), and the collecting groove (31) is formed in the periphery of the wafer placing table (32).

3. A wafer gumming apparatus as in claim 1, wherein: scatterer (43) comprise charge door (a1), sizing material groove (a2), through-hole (a3), blowing roller (a4) and stroll dull and stereotyped (a5), it has through-hole (a3) to open on the roof of sizing material groove (a2) and sizing material groove (a2) top scattered glassware (43) inside open, charge door (a1) are installed to the top of through-hole (a3), the bottom movable mounting of sizing material groove (a2) has blowing roller (a4), sizing material groove (a2) bottom opening part both sides all are equipped with and stroll dull and stereotyped (a 5).

4. A wafer gumming apparatus as in claim 3, wherein: the placard plate (a5) is of an arc-shaped structure and is attached to both sides of the placard plate (a 5).

5. A wafer gumming apparatus as in claim 4, wherein: eight groups of material containing grooves (e) are uniformly and equidistantly formed in the stroking plate (a5), and the bottom of each material containing groove (e) is of a circular arc-shaped structure.

6. A wafer gumming apparatus as in claim 1, wherein: tiling ware (44) comprises knob (b1), gyro wheel (b2), lead screw (b3), crane (b4), rotation axis (b5), circle cover (b6), tiling ware (44) is inside to be hollow structure and inside to be equipped with gyro wheel (b2), all install lead screw (b3) of two on the frame on gyro wheel (b2) both sides, rotation axis (b5) on gyro wheel (b2) cooperatees with circle cover (b6) on crane (b4), gyro wheel (b2) are through crane (b4) and lead screw (b3) threaded connection of both sides, lead screw (b3) run through the top of tiling ware (44) and are connected with knob (b 1).

7. A wafer gumming apparatus as in claim 1, wherein: the rotating disk (42) is composed of a rotating ring (c1), a gear (c2) and a motor (c3), the motor (c3) is connected with the gear (c2), and the gear (c2) is meshed with teeth on the inner side of the rotating ring (c 1).

8. A wafer gumming apparatus as in claim 7, wherein: the rotating ring (c1) is connected with the material scattering device (43) and the flat laying device (44).