CN111587066B

CN111587066B - Method for tracing information of each layer of core board after PCB manufacturing and laminating

Info

Publication number: CN111587066B
Application number: CN202010463348.XA
Authority: CN
Inventors: 徐祖峰; 丁小果; 张永健
Original assignee: Jiangsu Taizhi Technology Co Ltd
Current assignee: Jiangsu Taizhi Technology Co Ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2021-01-26
Anticipated expiration: 2040-05-27
Also published as: CN111587066A

Abstract

The invention discloses a method for tracing information of each layer of core board after PCB manufacturing and laminating, which comprises the following steps: (1) after the PCB is manufactured and cut, laser code carving is carried out on the inner-layer core plate; (2) in the feeding procedure, reading the inner layer codes by plain codes, and binding and associating the inner layer codes; (3) after the plate is disassembled, spraying temporary bar codes on the edge of the plate; entering a routing program, reading the bar code, associating the bar code with the inner layer code, and finally associating the bar code with the outer layer code; (4) reading the inner layer code by adopting X-Ray, and transferring the inner layer code to the outer layer code after identifying the inner layer code; (5) and reading the outer layer code after lamination, thereby obtaining the inner layer information after lamination. The invention combines the production process, adopts special scheme design, adopts a method for correlating the inner core board with the outer layer information, and verifies the whole process tracing process through practice.

Description

Method for tracing information of each layer of core board after PCB manufacturing and laminating

Technical Field

The invention relates to the field of PCB manufacturing, in particular to a method for tracing information of each layer of core board after PCB manufacturing and laminating.

Background

With the increasing requirements of various electronic appliances on product quality, the PCB is used as a core part of the electronic appliance, and the production process tracing back becomes the core of quality management. In the multilayer circuit board, the relevance of tracing the information of the inner layer and the outer layer of the circuit often cannot adopt the traditional code reader to finish the identification due to the characteristics of the manufacturing process.

Disclosure of Invention

The purpose of the invention is as follows: aiming at the problems, the invention provides a method for tracing the information of each layer of core board after PCB manufacturing and laminating, which associates the information of the inner layer of core board with the information of the outer layer of core board and realizes the whole-process tracing process.

The technical scheme is as follows: in order to realize the purpose of the invention, the technical scheme adopted by the invention is as follows: a method for tracing information of each layer of core board after PCB manufacture lamination comprises the following steps:

(1) after the PCB is manufactured and cut, laser code carving is carried out on the inner-layer core plate;

(2) in the feeding procedure, reading the inner layer codes by plain codes, and binding and associating the inner layer codes;

(3) after the plate is disassembled, spraying temporary bar codes on the edge of the plate; entering a routing program, reading the bar code, associating the bar code with the inner layer code, and finally associating the bar code with the outer layer code;

(4) reading the inner layer code by adopting X-Ray, and transferring the inner layer code to the outer layer code after identifying the inner layer code;

(5) and reading the outer layer code after lamination, thereby obtaining the inner layer information after lamination.

Further, in step 1, a DM code is used as the identification code.

Further, in step 1, all the inner core boards may be provided with at least two inner codes of different inner layers.

Further, in the step 1, the positions of all the inner layer codes are set at least to meet the condition that one of the inner layer codes is dislocated with other different inner layer codes in the vertical direction.

Further, in the step 1, at least a 2mm gap needs to be reserved between the edge of the inner layer code and the edge of the copper foil.

Further, in step 1, when the inner layer is laser-coded, all the copper overlapped with each layer in the direction perpendicular to the code region is etched away.

Further, in the step 3, the barcode is a water-soluble barcode.

Further, in the step 4, the setting of the outer layer code includes laser code carving, code spraying and code drilling.

Has the advantages that: the invention combines the production process, adopts special scheme design, adopts a method for correlating the inner core board with the outer layer information, and verifies the whole process tracing process through practice.

Drawings

FIG. 1 is a flow chart of a method for tracing back information of each layer of core board after PCB manufacture and lamination according to the present invention;

FIG. 2 is a schematic diagram of inner layer code bit setting;

FIG. 3 is a schematic diagram of multi-layer board code bit setting;

FIG. 4 is a schematic view of a fixed code reader;

FIG. 5 is a schematic diagram of X-Ray online code reading.

Detailed Description

The technical solution of the present invention is further described below with reference to the accompanying drawings and examples.

As shown in fig. 1, the method for tracing back the information of each layer of core board after PCB manufacture lamination according to the present invention comprises the steps of:

(1) in the PCB manufacturing and laminating process, after cutting, off-line laser code scribing is carried out, and DM codes are used as identification codes;

since the Data Matrix two-dimensional code can be accurately read only by reading 20% of the Data, the Data Matrix two-dimensional code is suitable for being applied to places where the code is easily damaged, such as parts exposed to special environments of high heat, chemical cleaning agents, mechanical degradation and the like.

The size of the Data Matrix two-dimensional code can be adjusted at will, and can be up to 14 square inches at most, and can be up to 0.0002 square inches at least, and the size is also the smallest of the current one-dimensional and two-dimensional codes. On the other hand, most of the numbers have an absolute relationship with the amount of Data to be encoded, but the size of the Data Matrix two-dimensional code is independent of the amount of Data to be encoded, and thus the size is flexible.

The laser code carving machine is adopted for carving codes, and the method is suitable for marking information such as two-dimensional codes, plain codes and the like on the copper-clad plate. The laser code carving machine is provided with a transmission track and can be directly butted with an automatic production line. The breadth of the single processing of the galvanometer is generally 100 multiplied by 100mm and can be increased according to the requirement; the machining size is up to 24 x 28 inches, and can be customized. Possess the automatic focusing function, adapt to the product of different thickness. And an automatic gear stop function is configured, and the machining position can be adjusted according to requirements. Possess the clamp plate function, prevent that the product warpage from causing the processingquality problem. Possess and prevent coincident code database, guarantee the uniqueness of product code. The UPS power supply can be configured, and data loss during sudden power failure is avoided.

Considering the layout design of the PCB, the board margin area is limited, and comprehensively considering the influence factors such as the identification area of the code reader, the code making efficiency, the code reading mode and the like, the size of the identification code in the scheme is designed to be 6mm by 6 mm.

When laser code carving is carried out, a gap of not less than 2mm is required to be reserved between the edge of the code and the edge of the copper foil, and the code carving position of the inner layer at least ensures that one inner layer code is staggered with other different inner layer codes in the vertical direction; in order to ensure the stability and accuracy of code reading, the position dislocation of different inner layer codes is not less than 5 mm.

All the inner layer core boards are subjected to plain code association before lamination, and all the inner layers can be associated by identifying one of the inner layer core boards. As shown in fig. 2, in order to reduce the occupation of the board edge area, all the core boards of the inner layers only need two code bits of different inner layers.

As shown in fig. 3, according to the X-Ray code reading principle, the more the difference of the reflective layers is, the clearer the code is, when the multilayer board (more than 6 layers) is dominant, each layer has copper reserved for the code carving area, 2-3 mm copper around the area is etched away, and simultaneously, all copper overlapped in the vertical direction of each layer and the code area is etched away, and the code carving area is only left by the film design. The size of the code area is related to the size of the free area of the plate edge, and 8mm by 8mm is generally recommended. And the copper foil burns through to the resin layer during laser code carving.

in the automatic feeding process, automatic code reading is adopted, a stop and error prevention device for misreading and missing reading is arranged, and meanwhile, the stop control is carried out on the feeding mechanism; in the manual material loading process, adopt and hand the mode of sweeping yard rifle and scan, sweep yard rifle and also can fix.

As shown in fig. 4, the code is read by fixing the code reader at the entrance of the device, the entrance of the device positions the PCB by the side, and the code reader identification range is 100mm by 100 mm.

(3) After the plate is disassembled, temporary codes, namely water-soluble bar codes, are sprayed on the edges of the plate by adopting code spraying equipment; entering a routing program, reading the bar code, associating the bar code with the inner layer code information, and finally associating the information to the outer layer code;

the pressfitting is completed until the inner and outer layer codes are read and associated, key production processes such as drilling target measurement expansion and shrinkage need to be traced, in order to enable the tracing process to be continuous, the identity needs to be given to a product in time, therefore, after the plate is manually disassembled, code spraying equipment is adopted, and water-soluble bar codes are sprayed on the plate edges for data acquisition and recording. The code spraying can also be fixed at the entrance of the target drilling machine, and the code spraying is automatically finished when the product is manually put into the target drilling machine. The water-soluble bar code can be dissolved by water washing during the pretreatment of the outer layer circuit, and the quality of the outer layer circuit is not influenced.

(4) Reading the inner layer code on line by adopting X-Ray; after the inner layer code information is identified, the inner layer code information is converted into an outer layer code;

the outer layer code can be selected from laser engraving, and can also adopt a code spraying mode from the cost perspective; or a new two-dimensional code, namely a drilling code, is punched in a drilling mode;

as shown in FIG. 5, the principle of X-Ray code reading is planar penetration scanning and inner layer code dot matrix imaging. In order to increase the sharpness of the X-Ray photograph, there are other ways to enhance: selecting a high-quality flat panel detector and a light pipe by the X-Ray equipment; the contrast of imaging is improved through image processing; the inner layer plate is punched by laser, the scheme requires that the plate thickness is not more than 0.7mm, but the method greatly reduces the code manufacturing efficiency.

(5) The outer layer codes on the PNL board can be read at the feeding line inlet, so that the inner layer information can be read on the laminated PCB.

Claims

1. A method for tracing information of each layer of core board after PCB manufacture lamination is characterized by comprising the following steps:

(1) after the PCB is manufactured and cut, laser code carving is carried out on the inner-layer core plate; when the inner layer is subjected to laser code etching, all copper overlapped in the direction vertical to the code area of each layer is etched;

(2) in the feeding procedure, reading the inner layer codes by plain codes, and binding and associating the inner layer codes; all the inner layer core plates are subjected to plain code association before lamination, and all the inner layers can be associated by identifying one of the inner layer core plates;

(4) after lamination, reading the inner layer code by adopting X-Ray, and converting the inner layer information into the outer layer code after identifying the inner layer information;

2. The method for tracing information of each layer of core board after PCB manufacturing lamination as claimed in claim 1, wherein in said step (1), DM code is used as identification code.

3. The method for tracing information of each layer of core board after PCB manufacturing lamination as recited in claim 1, wherein in the step (1), all the inner layer core boards can be provided with at least two inner layer codes of different inner layers, and the positions of all the inner layer codes are set at least to satisfy the condition that one of the inner layer codes is dislocated with the other different inner layer codes in the vertical direction.

4. The method for tracing information of each layer of core board after PCB manufacturing lamination according to claim 1, wherein in the step (1), at least 2mm of clearance is required to be reserved between the edge of the inner layer code and the edge of the copper foil.

5. The method for tracing information about each layer of core board after PCB manufacturing lamination as claimed in claim 1, wherein in said step (3), the bar code is a water-soluble bar code.

6. The method for tracing information of each layer of core board after PCB manufacturing lamination according to claim 1, wherein in the step (4), the outer layer code setting comprises laser code carving, code spraying and drill code.