CN111584703A - Preparation method of printed LED template - Google Patents
Preparation method of printed LED template Download PDFInfo
- Publication number
- CN111584703A CN111584703A CN202010421201.4A CN202010421201A CN111584703A CN 111584703 A CN111584703 A CN 111584703A CN 202010421201 A CN202010421201 A CN 202010421201A CN 111584703 A CN111584703 A CN 111584703A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- light source
- led
- led light
- blue film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002360 preparation method Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000005096 rolling process Methods 0.000 claims abstract description 19
- 238000007639 printing Methods 0.000 claims abstract description 16
- 239000013078 crystal Substances 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000003292 glue Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H01L33/62—
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- H01L33/48—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a method for preparing a printed LED template, which comprises the following steps: the LED light source array on the original blue film is subjected to reverse molding once, so that the light emitting surface of each LED light source is attached to the front surface of the new blue film; carrying out crystal expansion through a crystal expansion machine; the back surface of the new blue film faces the rolling brush, and the new blue film with the LED light source array is stuck and wound on the rolling brush; using a dispenser to dispense conductive adhesive at the position of the circuit board for die bonding, then rolling the roller brush from the starting end to the terminal of the circuit board, and printing the LED light source array on the corresponding position of the circuit board; and finally, die bonding and routing are carried out to obtain the LED template. The LED light source is fixed on the circuit board by adopting a printing method, replaces the traditional point-to-point mode, is molded at one time, greatly reduces the cost and improves the production efficiency. The method is suitable for preparing the LED display template and also suitable for preparing the LED lamp panel of the lighting equipment.
Description
Technical Field
The invention belongs to the technical field of LED template manufacturing, and relates to a method for manufacturing a printed LED template.
Background
With the continuous improvement of the LED display technology, the variety of products is diversified, and meanwhile, the preparation process flow is more and more complicated. The traditional LED display template preparation process flow comprises the necessary links of die bonding, baking, wire welding, glue pouring, polishing, cutting and the like. The die bonding process is the most important process, the LED light source is fixed on a corresponding circuit board in a point-to-point mode through a die bonding machine, and because the size of a single LED light source reaches the micron level, the time for fixing the LED light source on a circuit board with the length multiplied by the width of 20 multiplied by 15cm is nearly 1 hour, so that the time is consumed; in order to match the types of the LED light sources with different structures, programs of specific die bonder are needed, such as the LED light source with a vertical structure, the LED light source with a flip structure, the LED light source with a forward mounting structure and the like, and fixed die bonder programs are needed. If a plurality of die bonder machines are simultaneously processed, the production needs can be met only by using hundreds of die bonder machines simultaneously, so that the problems of limited die bonder machines, high cost and the like are caused.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for manufacturing a printed LED template, wherein the method adopts a printing method to fix an LED light source on a circuit board, so that the cost can be greatly reduced, and the production efficiency can be improved.
In order to solve the problems, the preparation method of the printing type LED template comprises the following steps:
the method comprises the following steps: the LED light source array on the original blue film is subjected to reverse molding once, so that the light emitting surface of each LED light source is attached to the front surface of the new blue film;
step two: carrying out crystal expansion through a crystal expansion machine;
step three: the back surface of the new blue film faces the rolling brush, and the new blue film with the LED light source array is stuck and wound on the rolling brush;
step four: using a dispenser to dispense conductive adhesive at the position of the circuit board for die bonding, then rolling the roller brush from the starting end to the terminal of the circuit board, and printing the LED light source array on the corresponding position of the circuit board; and finally, die bonding and routing are carried out to obtain the LED template.
In the fourth step, the conductive adhesive is silver adhesive or tin paste.
And in the fourth step, the circuit board printed with the LED light source array is placed into an oven for die bonding.
The circuit board is made of hard materials.
The circuit board is made of flexible materials.
The section of the rolling brush is cylindrical.
The section of the rolling brush is in a shape of a plurality of rhombus columns.
Further, the invention also comprises the following steps:
step five: and encapsulating the packaging layer on the front side of the circuit board.
Step six: and polishing and cutting redundant margins of the circuit board and the packaging layer.
Considering the factors of the soft and hard material of the printed circuit board, whether the stress is uniform, the printing wedging degree and the like, in order to improve the printing efficiency, the cylindrical roller brush is preferably matched with the circuit board made of the hard material, the printing success rate can reach 100 percent, and the printed circuit board is formed at one time; the circuit board with the rhombus shape and the irregular shape is preferably matched with a flexible material in a roll printing mode, and the circuit board can be printed similarly to the edge corner.
The LED light source is fixed on the circuit board by adopting a printing method, replaces the traditional point-to-point mode, is molded at one time, greatly reduces the cost and improves the production efficiency. The method is suitable for preparing the LED display template and also suitable for preparing the LED lamp panel of the lighting equipment.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic view of a hard material wiring board.
Fig. 2 is a schematic view of a cylindrical roll brush.
Fig. 3 is a schematic diagram of a flexible material wiring board.
Fig. 4 is a schematic view of a hexagonal prism shaped roll brush.
In the figure: 100. a circuit board of a hard material; 101, welding positions of the LED light sources; 105. rolling and brushing; an LED light source 106; 200. a circuit board of flexible material.
Detailed Description
The preparation method of the printing type LED template comprises the following steps:
the method comprises the following steps: and (3) adopting a reverse molding machine to reverse the LED light source array adhered on the original blue film once, adhering the LED light source array on a new blue film, and adhering the light emitting surface of each LED light source to the front surface of the new blue film with the back surface outward. The shape and size of the new blue film are consistent with those of the circuit board.
Step two: and carrying out crystal expansion through a crystal expansion machine, so that the distance between the adjacent LED light sources on the new blue film meets the design requirement.
Step three: coating glue (any glue with viscosity) on the rolling brush, facing the back of the new blue film to the rolling brush, and pasting and winding the new blue film with the LED light source array on the rolling brush clockwise or anticlockwise; wherein the length of the rolling brush is required to be larger than the length or width of the circuit board.
Step four: printing a circuit board matched with the LED light source array on the new blue film by the existing printing technology; dispensing conductive and viscous glue (such as silver glue and tin paste) at the position where the circuit board is subjected to die bonding by using a dispenser, then quickly rolling the roller brush from the starting end to the terminal end of the circuit board, and printing the LED light source array on the corresponding position of the circuit board; placing the circuit board printed with the LED light source array into an oven at 120 ℃, and baking for 2 hours to solidify the crystal; and after the circuit board is cooled, routing by using a wire bonding machine, and communicating each LED light source with the circuit of the circuit board.
Step five: and encapsulating an epoxy resin layer as an encapsulation layer on the front side of the circuit board.
Step six: and polishing and cutting redundant margins of the circuit board and the epoxy resin layer to obtain the LED template.
The circuit board can be made of glass fiber, cloth fabric, plastic board and other hard materials, and can also be made of polyimide, polyester film and other flexible materials. The roller brush can be cylindrical, polygonal prism, and other irregular shapes. The circuit board made of hard materials is preferably matched with the cylindrical rolling brush; the flexible material circuit board is preferably matched with a plurality of prismatic or other irregular-shaped rolling brushes.
Claims (9)
1. A preparation method of a printing type LED template is characterized by comprising the following steps:
the method comprises the following steps: the LED light source array on the original blue film is subjected to reverse molding once, so that the light emitting surface of each LED light source is attached to the front surface of the new blue film;
step two: carrying out crystal expansion through a crystal expansion machine;
step three: the back surface of the new blue film faces the rolling brush, and the new blue film with the LED light source array is stuck and wound on the rolling brush;
step four: using a dispenser to dispense conductive adhesive at the position of the circuit board for die bonding, then rolling the roller brush from the starting end to the terminal of the circuit board, and printing the LED light source array on the corresponding position of the circuit board; and finally, die bonding and routing are carried out to obtain the LED template.
2. The method for preparing the printed LED template according to claim 1, wherein in the fourth step, the conductive adhesive is silver adhesive or solder paste.
3. The method for preparing the printed LED template according to claim 1 or 2, wherein in the fourth step, the circuit board printed with the LED light source array is placed in an oven for die bonding.
4. The method of claim 1, wherein the circuit board is made of a rigid material.
5. The method of claim 1, wherein the circuit board is made of a flexible material.
6. The method according to claim 4, wherein the roller brush has a cylindrical cross section.
7. The method according to claim 5, wherein the cross section of the roll brush is a polygonal prism.
8. The method of making a printed LED stencil as claimed in claim 1, further comprising the steps of:
step five: and encapsulating the packaging layer on the front side of the circuit board.
9. The method of making a printed LED stencil as claimed in claim 8, further comprising the steps of:
step six: and polishing and cutting redundant margins of the circuit board and the packaging layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421201.4A CN111584703A (en) | 2020-05-18 | 2020-05-18 | Preparation method of printed LED template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421201.4A CN111584703A (en) | 2020-05-18 | 2020-05-18 | Preparation method of printed LED template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111584703A true CN111584703A (en) | 2020-08-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010421201.4A Withdrawn CN111584703A (en) | 2020-05-18 | 2020-05-18 | Preparation method of printed LED template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111584703A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068593A (en) * | 2017-03-30 | 2017-08-18 | 京东方科技集团股份有限公司 | Chip transfer method and equipment |
| CN207705223U (en) * | 2017-12-11 | 2018-08-07 | 上海九山电子科技有限公司 | A kind of miniature LED chip and its transfer equipment |
| CN108538878A (en) * | 2018-07-11 | 2018-09-14 | 大连德豪光电科技有限公司 | Micro- light emitting diode base plate and preparation method thereof, display device |
| CN110137318A (en) * | 2018-10-26 | 2019-08-16 | 友达光电股份有限公司 | Transposition method and transposition device |
| CN110323162A (en) * | 2019-05-08 | 2019-10-11 | 京东方科技集团股份有限公司 | A kind of flood tide transfer device and flood tide transfer method |
| CN110429051A (en) * | 2019-08-12 | 2019-11-08 | 深圳市思坦科技有限公司 | Chip transfer method |
| CN110534621A (en) * | 2019-08-26 | 2019-12-03 | 武汉大学 | Drum-type three primary colours Micro-LED chip transfer method |
-
2020
- 2020-05-18 CN CN202010421201.4A patent/CN111584703A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068593A (en) * | 2017-03-30 | 2017-08-18 | 京东方科技集团股份有限公司 | Chip transfer method and equipment |
| CN207705223U (en) * | 2017-12-11 | 2018-08-07 | 上海九山电子科技有限公司 | A kind of miniature LED chip and its transfer equipment |
| CN108538878A (en) * | 2018-07-11 | 2018-09-14 | 大连德豪光电科技有限公司 | Micro- light emitting diode base plate and preparation method thereof, display device |
| CN110137318A (en) * | 2018-10-26 | 2019-08-16 | 友达光电股份有限公司 | Transposition method and transposition device |
| CN110323162A (en) * | 2019-05-08 | 2019-10-11 | 京东方科技集团股份有限公司 | A kind of flood tide transfer device and flood tide transfer method |
| CN110429051A (en) * | 2019-08-12 | 2019-11-08 | 深圳市思坦科技有限公司 | Chip transfer method |
| CN110534621A (en) * | 2019-08-26 | 2019-12-03 | 武汉大学 | Drum-type three primary colours Micro-LED chip transfer method |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200825 |
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| WW01 | Invention patent application withdrawn after publication |