CN111584697A - Preparation method of segmented printing type LED display template - Google Patents
Preparation method of segmented printing type LED display template Download PDFInfo
- Publication number
- CN111584697A CN111584697A CN202010421820.3A CN202010421820A CN111584697A CN 111584697 A CN111584697 A CN 111584697A CN 202010421820 A CN202010421820 A CN 202010421820A CN 111584697 A CN111584697 A CN 111584697A
- Authority
- CN
- China
- Prior art keywords
- led light
- light source
- circuit board
- blue
- source array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007639 printing Methods 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title description 6
- 238000005096 rolling process Methods 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000013078 crystal Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 238000003491 array Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000003292 glue Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Images
Classifications
-
- H01L33/48—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H01L33/62—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a method for preparing a sectional printing type LED display template, which comprises the following steps: adopting a reverse molding machine to reverse the three primary color LED light sources respectively stuck on the three original blue films once, respectively sticking R, G, B three primary color LED light source arrays on three new blue films, wherein the light emitting surfaces of the LED light sources are stuck to the front surfaces of the new blue films, and the back surfaces of the LED light sources are outward; carrying out crystal expansion through a crystal expansion machine; the back surfaces of the three new blue films adhered with the red, green and blue LED light sources face the rolling brushes respectively, and are adhered and wound on the three rolling brushes; dispensing conductive adhesive at the position of the circuit board for die bonding by using a dispenser, then sequentially and rapidly rolling the three rolling brushes from the starting end to the terminal end of the circuit board, and printing a red LED light source array, a green LED light source array and a blue LED light source array on corresponding positions of the circuit board; and finally, die bonding and routing are carried out to obtain the LED template. The invention saves time and improves production efficiency.
Description
Technical Field
The invention belongs to the technical field of LED display, and relates to a method for preparing a segmented printed LED display template.
Background
With the continuous improvement of the LED display technology, the variety of products is diversified, and meanwhile, the preparation process flow is more and more complicated. The traditional LED display template preparation process flow comprises the necessary links of SMT, die bonding, baking, wire bonding, glue pouring, polishing, cutting and the like. The die bonding process is the most important process, the LED light source is fixed on the corresponding PCB substrate point-to-point through the swing arm of the die bonding machine, 100ms is needed for fixing one light source, and the LED light source is fixed on a block with the area of 1m as the gap of the PCB typesetting LED light sources reaches 1mm at most2The PCB substrate needs millions of light sources, 27 hours and time for production; in order to match the types of the LED light sources with different structures, programs of specific die bonder are needed, for example, the LED light sources with vertical structures, the LED light sources with flip structures, the LED light sources with forward mounting structures and the like are provided with fixed die bonder programs. And because the white light emitted by the LED display template consists of three primary colors of R G B, 2-3 die bonder are used as a production line to sequentially bond the R G B monochromatic LED light source. If a plurality of LED display templates are produced, thousands of die bonder (2-3 die bonder are one) are needed to be used simultaneously, so that the production requirement can be met, and the problems of limited die bonder, high cost and the like are caused.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for preparing a segmented printing type LED display template, wherein R, G, B tricolor LED light-emitting chips are fixed on a circuit board by adopting a segmented printing method, so that the cost can be greatly reduced, and the production efficiency is improved.
In order to solve the problems, the preparation method of the segmented printing type LED display template comprises the following steps: the preparation method of the segmented printing type LED display template comprises the following steps:
the method comprises the following steps: adopting a reverse molding machine to reverse the R, G, B tricolor LED light sources respectively stuck on the three original blue films once, respectively sticking the R, G, B tricolor LED light source arrays on the three new blue films, wherein the light emitting surfaces of the LED light sources are stuck to the front surfaces of the new blue films, and the back surfaces of the LED light sources are outward;
step two: carrying out crystal expansion through a crystal expansion machine;
step three: respectively sticking and winding three new blue film back surfaces, which are stuck with a red LED light source, a green LED light source and a blue LED light source, to the three rolling brushes with the back surfaces facing the rolling brushes;
step four: dispensing conductive adhesive at the position of the circuit board for die bonding by using a dispenser, then sequentially and rapidly rolling the three rolling brushes from the starting end to the terminal end of the circuit board, and printing a red LED light source array, a green LED light source array and a blue LED light source array on corresponding positions of the circuit board; and finally, die bonding and routing are carried out to obtain the LED template.
In the fourth step, the conductive adhesive is silver adhesive or tin paste.
And in the fourth step, the circuit board printed with the red LED light source array, the green LED light source array and the blue LED light source array is placed into an oven for die bonding.
The circuit board is made of hard materials.
The circuit board is made of flexible materials.
The section of the rolling brush is cylindrical.
The section of the rolling brush is in a shape of a plurality of rhombus columns.
Further, the invention also comprises the following steps:
step five: and encapsulating the packaging layer on the front side of the circuit board.
Step six: and polishing and cutting redundant margins of the circuit board and the packaging layer.
The invention fixes the tricolor LED light source on the circuit by a sectional printing method, and divides the tricolor LED light source into three sections according to R, G, B to be printed, each section is formed at one time, and three sections of printing and crystal fixing are realized, thereby saving time and improving production efficiency.
The LED light source typesetting in the die bonding groove of the circuit board can be in an array type, a triangular type, a round type and the like.
Considering the factors of the soft and hard material properties of the printed material, whether the stress is uniform, the printing wedging degree and the like, in order to improve the printing efficiency, the cylindrical roller brush is recommended to be matched with the circuit board made of the hard material, the printing success rate reaches 100 percent, and the circuit board is formed in one step; the circuit board with multiple rhombuses and irregular roll printing matched with flexible materials can be printed similarly to edges, corners and corners.
The LED light source is fixed on the circuit board by adopting a printing method, replaces the traditional point-to-point mode, is molded at one time, greatly reduces the cost and improves the production efficiency. The invention is suitable for preparing the LED display template and also suitable for preparing the LED lamp panel of an illumination product.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic diagram of hard material circuit board layout.
Fig. 2a, 2b, 2c are schematic diagrams of cylindrical roll brushes with R, G, B tricolor LED light sources on the surface, respectively.
Fig. 3 is a schematic diagram of flexible material circuit board layout.
Fig. 4a, b and c are schematic diagrams of hexagonal prism-shaped roll brushes with R, G, B three-primary-color LED light sources on the surfaces respectively.
In the figure: 100. a hard material circuit board;
101. a die bonding groove;
101-R. die bonding position of a red LED light source;
101-G, green LED light source die bonding position;
101-B, die bonding position of a blue LED light source;
105-r. a roller brush with a red LED light source;
105-g. a roller brush with a green LED light source;
105-b. a roller brush with a blue LED light source;
200. a circuit board of flexible material.
Detailed Description
Example 1: in the embodiment, a hard material circuit board is adopted, crystal is distributed in an array mode, and a cylindrical rolling brush is matched.
As shown in fig. 1 and fig. 2a to 2c, the method for manufacturing a segment-printed LED display template according to the present invention comprises the steps of:
the method comprises the following steps: and adopting a reverse molding machine to reversely mold the R, G, B tricolor LED light sources respectively stuck on the three original blue films once, respectively sticking the R, G, B tricolor LED light source arrays on the three new blue films, wherein the light emitting surfaces of the LED light sources are attached to the front surfaces of the new blue films, and the back surfaces of the LED light sources face outwards. The shape and size of the new blue film are consistent with those of the circuit board.
Step two: carrying out crystal expansion through a crystal expansion machine, so that the distance between adjacent LED light sources on the new blue film meets the design requirement; in the embodiment, the longitudinal and transverse distances between the adjacent red LED light sources are both 1mm, the longitudinal and transverse distances between the adjacent green LED light sources are both 11mm, and the longitudinal and transverse distances between the adjacent blue LED light sources are both 21 mm.
Step three: coating glue (any glue with viscosity) on the three cylindrical rolling brushes, respectively sticking and winding the back surfaces of the new blue films, which are stuck with the red LED light source, the green LED light source and the blue LED light source, to the corresponding cylindrical rolling brushes clockwise or anticlockwise; wherein the length of the cylindrical roller brush is required to be larger than the length or width of the circuit board.
Step four: printing a circuit board matched with a red LED light source array, a green LED light source array and a blue LED light source array on three new blue films by using the existing printing technology, wherein the longitudinal and transverse spacing between the die bonding positions of adjacent red LED light sources is 1mm, the longitudinal and transverse spacing between the die bonding positions of adjacent green LED light sources is 11mm, and the longitudinal and transverse spacing between the die bonding positions of adjacent blue LED light sources is 21 mm; dispensing conductive and sticky glue (such as silver glue and tin paste) at the position of the circuit board for die bonding by using a dispenser, then quickly rolling the cylindrical roller brush pasted with the red LED light source from the starting end of the red light source die bonding position of the circuit board to the terminal, quickly rolling the cylindrical roller brush pasted with the green LED light source from the starting end of the green light source die bonding position of the circuit board to the terminal, finally quickly rolling the cylindrical roller brush pasted with the blue LED light source from the starting end of the blue LED light source die bonding position of the circuit board to the terminal, and printing the red LED light source array, the green LED light source array and the blue LED light source array on corresponding positions of the circuit board; placing the circuit board printed with the red LED light source array, the green LED light source array and the blue LED light source array into an oven at 120 ℃, and baking for 2 hours to solidify crystals; and after the circuit board is cooled, routing by using a wire bonding machine, and respectively communicating the red LED light source, the green LED light source and the blue LED light source with the circuit of the circuit board.
Example 2: the embodiment is implemented by adopting a flexible material circuit board and triangular crystal distribution in combination with a hexagonal prism-shaped rolling brush.
As shown in fig. 3 and fig. 4a to 4c, the method for manufacturing a segment-printed LED display template according to the present invention comprises the steps of:
the method comprises the following steps: and adopting a reverse molding machine to reversely mold the R, G, B tricolor LED light sources respectively stuck on the three original blue films once, respectively sticking the R, G, B tricolor LED light source arrays on the three new blue films, wherein the light emitting surfaces of the LED light sources are attached to the front surfaces of the new blue films, and the back surfaces of the LED light sources face outwards. The shape and size of the new blue film are consistent with those of the circuit board.
Step two: carrying out crystal expansion through a crystal expansion machine, so that the distance between adjacent LED light sources on the new blue film meets the design requirement; in the embodiment, the distance between the adjacent red, green and blue LED light sources in the longitudinal direction and the transverse direction is 50 mm.
Step three: coating glue (any glue with viscosity) on the three hexagonal prism-shaped rolling brushes, respectively sticking and winding the back surfaces of the new blue films adhered with the red LED light source, the green LED light source and the blue LED light source to the corresponding hexagonal prism-shaped rolling brushes clockwise or anticlockwise; wherein the length of the hexagonal prism-shaped roller brush is required to be larger than the length or width of the circuit board.
Step four: printing a circuit board matched with a red LED light source array, a green LED light source array and a blue LED light source array on three new blue films by using the existing printing technology, wherein the die bonding positions of the red LED light source, the green LED light source and the blue LED light source form a triangle with the side length of 20 mm; dispensing conductive and sticky glue (such as silver glue and tin paste) at the position of the circuit board for die bonding by using a dispenser, then quickly rolling the cylindrical roller brush pasted with the red LED light source from the starting end of the position of the circuit board for die bonding of the red LED light source to the terminal, quickly rolling the cylindrical roller brush pasted with the green LED light source from the starting end of the position of the circuit board for die bonding of the green LED light source to the terminal, finally quickly rolling the cylindrical roller brush pasted with the blue LED light source from the starting end of the position of the circuit board for die bonding of the blue LED light source to the terminal, and printing the red LED light source array, the green LED light source array and the blue LED light source array at corresponding positions of the circuit board; placing the circuit board printed with the red LED light source array, the green LED light source array and the blue LED light source array into an oven at 120 ℃, and baking for 2 hours to solidify crystals; and after the circuit board is cooled, routing by using a wire bonding machine, and respectively communicating the red LED light source, the green LED light source and the blue LED light source with the circuit of the circuit board.
The circuit board can be made of glass fiber, cloth fabric, plastic board and other hard materials, and can also be made of polyimide, polyester film and other flexible materials. The roller brush can be cylindrical, polygonal prism, and other irregular shapes. The circuit board made of hard materials is preferably matched with the cylindrical rolling brush; the flexible material circuit board is preferably matched with a plurality of prismatic or other irregular-shaped rolling brushes.
The invention is not limited to the above embodiment, and the rolling sequence of the three rolling brushes is not limited when the rolling brushes are rolled from the starting end to the terminal end of the circuit board and the LED light source is printed on the circuit board.
Claims (8)
1. A method for preparing a segmented printing type LED display template is characterized by comprising the following steps:
the method comprises the following steps: adopting a reverse molding machine to reverse the R, G, B tricolor LED light sources respectively stuck on the three original blue films once, respectively sticking the R, G, B tricolor LED light source arrays on the three new blue films, wherein the light emitting surfaces of the LED light sources are stuck to the front surfaces of the new blue films, and the back surfaces of the LED light sources are outward;
step two: carrying out crystal expansion through a crystal expansion machine;
step three: respectively sticking and winding three new blue film back surfaces, which are stuck with a red LED light source, a green LED light source and a blue LED light source, to the three rolling brushes with the back surfaces facing the rolling brushes;
step four: dispensing conductive adhesive at the position of the circuit board for die bonding by using a dispenser, then sequentially and rapidly rolling the three rolling brushes from the starting end to the terminal end of the circuit board, and printing a red LED light source array, a green LED light source array and a blue LED light source array on corresponding positions of the circuit board; and finally, die bonding and routing are carried out to obtain the LED template.
2. The method according to claim 1, wherein in the fourth step, the conductive adhesive is silver paste or solder paste.
3. The method for manufacturing the segmented printed LED display template according to claim 2, wherein in the fourth step, the circuit board printed with the red LED light source array, the green LED light source array and the blue LED light source array is placed in an oven for die bonding.
4. The method according to claim 1, wherein the circuit board is made of a rigid material.
5. The method according to claim 1, wherein the circuit board is made of flexible material.
6. The method according to claim 4, wherein the roller brush has a cylindrical cross-section.
7. The method according to claim 5, wherein the cross-section of the rolling brush is a multi-prism shape.
8. The method of claim 1, further comprising the steps of:
step five: and encapsulating the packaging layer on the front side of the circuit board.
Step six: and polishing and cutting redundant margins of the circuit board and the packaging layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421820.3A CN111584697A (en) | 2020-05-18 | 2020-05-18 | Preparation method of segmented printing type LED display template |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010421820.3A CN111584697A (en) | 2020-05-18 | 2020-05-18 | Preparation method of segmented printing type LED display template |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111584697A true CN111584697A (en) | 2020-08-25 |
Family
ID=72117523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010421820.3A Withdrawn CN111584697A (en) | 2020-05-18 | 2020-05-18 | Preparation method of segmented printing type LED display template |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111584697A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068593A (en) * | 2017-03-30 | 2017-08-18 | 京东方科技集团股份有限公司 | Chip transfer method and equipment |
| CN207705223U (en) * | 2017-12-11 | 2018-08-07 | 上海九山电子科技有限公司 | A kind of miniature LED chip and its transfer equipment |
| CN108538878A (en) * | 2018-07-11 | 2018-09-14 | 大连德豪光电科技有限公司 | Micro- light emitting diode base plate and preparation method thereof, display device |
| CN110137318A (en) * | 2018-10-26 | 2019-08-16 | 友达光电股份有限公司 | Transposition method and transposition device |
| CN110323162A (en) * | 2019-05-08 | 2019-10-11 | 京东方科技集团股份有限公司 | A kind of flood tide transfer device and flood tide transfer method |
| CN110429051A (en) * | 2019-08-12 | 2019-11-08 | 深圳市思坦科技有限公司 | Chip transfer method |
| CN110534621A (en) * | 2019-08-26 | 2019-12-03 | 武汉大学 | Drum-type three primary colours Micro-LED chip transfer method |
-
2020
- 2020-05-18 CN CN202010421820.3A patent/CN111584697A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068593A (en) * | 2017-03-30 | 2017-08-18 | 京东方科技集团股份有限公司 | Chip transfer method and equipment |
| CN207705223U (en) * | 2017-12-11 | 2018-08-07 | 上海九山电子科技有限公司 | A kind of miniature LED chip and its transfer equipment |
| CN108538878A (en) * | 2018-07-11 | 2018-09-14 | 大连德豪光电科技有限公司 | Micro- light emitting diode base plate and preparation method thereof, display device |
| CN110137318A (en) * | 2018-10-26 | 2019-08-16 | 友达光电股份有限公司 | Transposition method and transposition device |
| CN110323162A (en) * | 2019-05-08 | 2019-10-11 | 京东方科技集团股份有限公司 | A kind of flood tide transfer device and flood tide transfer method |
| CN110429051A (en) * | 2019-08-12 | 2019-11-08 | 深圳市思坦科技有限公司 | Chip transfer method |
| CN110534621A (en) * | 2019-08-26 | 2019-12-03 | 武汉大学 | Drum-type three primary colours Micro-LED chip transfer method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101230959B (en) | Flexible water-proof LED lamp belt and embedding technique thereof | |
| CN105161608A (en) | LED lamp filament illuminating strip and preparation method therefor | |
| CN101440941A (en) | Multiple-in-one LED display screen module surface paste and display screen module | |
| CN103972369B (en) | LED (Light Emitting Diode) lamp bar and manufacturing method thereof | |
| WO2017177779A1 (en) | Preparation method for large-area electrode led array | |
| CN111653556B (en) | Visible colored line transparent luminous component | |
| CN109817104A (en) | A kind of LED array of display mould group of thin-film package | |
| CN116363971A (en) | Luminous layer, transparent display screen and preparation method of transparent display screen | |
| WO2017028417A1 (en) | Process method using thermoplastic resin photoconverter to bond-package led by rolling | |
| CN110164855B (en) | Surface-mounted LED lamp bead capable of emitting polarized light and batch manufacturing method thereof | |
| CN113183566B (en) | Photoelectric glass with film-pasted circuit and production process | |
| CN111584697A (en) | Preparation method of segmented printing type LED display template | |
| TWI426480B (en) | Display apparatus and manufacturing method thereof | |
| CN110958745A (en) | Method for manufacturing LED transparent display screen and LED transparent display screen | |
| CN103939810A (en) | Backlight module and manufacturing technology thereof | |
| CN103904071A (en) | Manufacturing technology of transparent substrate LED lamp strip | |
| CN207366891U (en) | High-precision Flexible Displays module | |
| CN111584703A (en) | Preparation method of printed LED template | |
| CN110242881A (en) | The preparation method and COB light bar of COB light bar | |
| CN105444034A (en) | Circuit board type net lamp and manufacturing method thereof | |
| CN213935483U (en) | Display panel formed by splicing COB modules | |
| CN204638464U (en) | LED die bond Glue dripping head | |
| CN210073839U (en) | Mini LED with normally installed chip | |
| CN203617344U (en) | Surface mount type LED lead frame | |
| CN207852220U (en) | A kind of LED transparent display screens structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200825 |
|
| WW01 | Invention patent application withdrawn after publication |