CN111579956A

CN111579956A - Adjustable surface-mounted packaged semiconductor device clamp and testing method

Info

Publication number: CN111579956A
Application number: CN202010267509.8A
Authority: CN
Inventors: 廉鹏飞; 张辉; 李娟�; 刘楠; 刘伟鑫; 王茜茜; 孔泽斌; 楼建设; 王昆黍
Original assignee: SHANGHAI PRECISION METROLOGY AND TEST RESEARCH INSTITUTE
Current assignee: SHANGHAI PRECISION METROLOGY AND TEST RESEARCH INSTITUTE
Priority date: 2020-04-08
Filing date: 2020-04-08
Publication date: 2020-08-25
Anticipated expiration: 2040-04-08
Also published as: CN111579956B

Abstract

The invention relates to an adjustable surface-mounted packaged semiconductor device clamp and a testing method, wherein the clamp comprises a first PCB (printed circuit board) substrate, a second PCB substrate, an adjustable connecting assembly, a base, a reed, a base contact pin, a contact pin and an elastic band; microstrip lines are arranged on the first PCB substrate and the second PCB substrate; the first PCB substrate and the second PCB substrate are respectively provided with a base; the two bases are respectively provided with a reed which is connected with the microstrip line through a base pin, and the microstrip line is connected with a pin; the first PCB substrate is connected with the second PCB substrate through the adjustable connecting assembly, and the adjustable connecting assembly is adjusted to change the relative position between the first PCB substrate and the second PCB substrate so as to change the relative position between the two bases; pins on two sides of the surface mount packaged semiconductor device to be tested are respectively contacted with the reeds on the two bases, and the surface mount packaged semiconductor device to be tested is bound on the two bases through the elastic band, so that the pins and the reeds are tightly pressed.

Description

Adjustable surface-mounted packaged semiconductor device clamp and testing method

Technical Field

The invention relates to the technical field of semiconductor test analysis, in particular to an adjustable surface-mounted packaged semiconductor device clamp and a test method.

Background

The development level of semiconductor device testing technology is directly related to various performance indexes thereof, and therefore, is very important for the overall development of semiconductor devices. With the rapid development of large-scale integrated circuits and the continuous expansion of application fields, not only the integration level of integrated circuits is rapidly improved, the scale and the density are rapidly increased, but also the number of pins of devices is increased, but on the other hand, with the continuous improvement of the integration level requirements of circuits and systems, the requirements on the volume of semiconductor devices are more and more demanding, so that the packaging forms of semiconductor devices are more and more endless. Among various package forms, the surface mount package, which is a typical package of a semiconductor device, has advantages of a large number of pins, a small footprint on a printed circuit board, and easy integration, and thus has been widely used. Surface mount packaged semiconductor devices include a variety of packaging forms, such as: small Outline Package (SOP), Shrink Small Outline Package (SSOP), Thin Shrink Small Outline Package (TSSOP), and the like. Due to the characteristics of the surface mount package, a specific clamp is required to be used when a device is tested, and the surface mount package is converted into a package form which is easy to test, such as dual in-line package.

There is a difference in package size (the number of pins, the distance between pins on the same side, and the distance between arrays of pins on different sides) of surface mount packaged semiconductor devices. According to the standards of the solid state technology association (JEDEC) and the japan Electronics Industry Association (EIAJ): the pitch of pins on the same side of the SOP package is 1.27mm, and the distance between the pin arrays on different sides and the number of the pins are not specified clearly; the pitch of the pins on the same side of the SSOP package is 0.635mm, and the distance between the pin arrays on the opposite sides and the number of the pins are not specified explicitly. At present, when the surface mount packaged semiconductor device is tested, a clamp is customized for each type of surface mount packaged semiconductor device, and the cost is considerable.

Disclosure of Invention

The invention aims to provide an adjustable surface-mounted package semiconductor device clamp and a test method, so that one clamp is suitable for testing surface-mounted package semiconductor devices with different package sizes, and the test cost is reduced.

In order to achieve the above object, the present invention provides an adjustable surface mount package semiconductor device clamp, which includes a first PCB substrate, a second PCB substrate, an adjustable connecting assembly, a base, a spring, a base pin, a pin and an elastic band; microstrip lines are arranged on the first PCB substrate and the second PCB substrate; the first PCB substrate and the second PCB substrate are respectively provided with a base; the reeds are arranged on the two bases and are connected with microstrip lines on the corresponding PCB substrates through base pins, and the microstrip lines are connected with the pins; the first PCB substrate is connected with the second PCB substrate through the adjustable connecting assembly, and the adjustable connecting assembly is adjusted to change the relative position between the first PCB substrate and the second PCB substrate so as to change the relative position between the two bases; the pins on two sides of the surface mount packaged semiconductor device to be tested are respectively contacted with the reeds on the two bases, and the surface mount packaged semiconductor device to be tested is bound on the two bases through the elastic band, so that the pins and the reeds are tightly pressed.

In the above adjustable surface mount package semiconductor device clamp, the adjustable connecting assembly includes an adjustable slider, and the adjustable slider is provided with a strip-shaped groove; one end of the adjustable sliding block is fixedly connected with the first PCB substrate; the other end of the adjustable sliding block is connected with the second PCB substrate through a combination of a screw and a nut, and the screw is arranged in the strip-shaped groove.

According to the adjustable surface-mounted packaged semiconductor device clamp, the specific position of the screw in the strip-shaped groove is changed, so that the distance between the first PCB substrate and the second PCB substrate can be adjusted, and the adjusting range is determined by the length of the strip-shaped groove.

The adjustable surface mount package semiconductor device clamp is characterized in that the spring piece has an upward inclination angle and elasticity.

In the adjustable surface mount package semiconductor device clamp, two hooks are respectively arranged at two ends of the elastic band; a semicircular ring is arranged on the base; and hooks at two ends of the elastic band are respectively hooked on the semicircular rings of the two bases, so that the surface-mounted packaged semiconductor device to be tested is bound.

Above-mentioned adjustable table pastes encapsulation semiconductor device anchor clamps, wherein, first PCB base plate with all be equipped with the support column on the second PCB base plate, support adjustable table pastes encapsulation semiconductor device anchor clamps.

The adjustable surface mount packaged semiconductor device clamp is characterized in that a base is provided with a plurality of reeds, the reeds form a reed array, and the reed array is matched with a pin array on the same side of a surface mount packaged semiconductor device to be tested; one reed corresponds to one base pin, one base pin corresponds to one microstrip line, and one microstrip line corresponds to one pin.

Above-mentioned adjustable table pastes encapsulation semiconductor device anchor clamps, wherein, be equipped with 24 reeds on a base, the width of reed is 0.31mm, and the distance between two adjacent reeds is 0.635 mm.

The invention provides another technical scheme, which is a testing method using the adjustable surface-mounted packaged semiconductor device clamp, and the testing method comprises the following steps: measuring the packaging size of the surface mount packaged semiconductor device to be measured; adjusting the distance between the first PCB substrate and the second PCB substrate by using the adjustable connecting assembly according to the distance between the pin arrays on the different sides of the surface mount packaged semiconductor device to be tested, so that the surface mount packaged semiconductor device to be tested can be installed on the spring pieces of the two bases; fixing the first PCB substrate and the second PCB substrate together by using an adjustable connecting assembly; the pins at two sides of the surface mount packaged semiconductor device to be tested are respectively positioned on the reeds of the two fixed bases; fixing the surface-mounted packaged semiconductor device to be tested by using an elastic band; observing the reed pressed by each pin of the surface mount packaged semiconductor device to be tested, thereby determining the contact pin corresponding to each pin of the surface mount packaged semiconductor device to be tested; and testing the surface-mounted packaged semiconductor device to be tested through the contact pin.

Compared with the prior art, the invention can obtain the following beneficial effects:

1) the distance between the two PCB substrates can be adjusted through the adjustable connecting assembly (the adjustable sliding block), so that the distance between different side pin arrays of the surface-mounted packaged semiconductor device is adapted, one clamp is suitable for testing the surface-mounted packaged semiconductor devices with different packaging sizes, and the testing cost is reduced;

2) by observing the contact pin corresponding to each pin of the surface-mount packaged semiconductor device, the SOP and SSOP packaged device can be tested at different pin distances, and the test is convenient, the measurable range is wide, and the use reliability is high.

Drawings

The adjustable surface mount package semiconductor device clamp and the testing method of the invention are provided by the following embodiments and the attached drawings.

Fig. 1 is a perspective view of an adjustable surface mount package semiconductor device clamp according to a preferred embodiment of the invention.

Fig. 2 is a schematic side view of an adjustable surface mount package semiconductor device clamp according to a preferred embodiment of the invention.

FIG. 3 is a schematic view of a base in a preferred embodiment of the invention.

Fig. 4 is a schematic structural view of the elastic band in the preferred embodiment of the invention.

Detailed Description

The adjustable surface mount package semiconductor device clamp and the testing method of the present invention will be described in further detail with reference to fig. 1 to 4.

FIG. 1 is a perspective view of an adjustable surface mount package semiconductor device clamp according to a preferred embodiment of the present invention; fig. 2 is a schematic side view of an adjustable surface mount package semiconductor device clamp according to a preferred embodiment of the invention.

Referring to fig. 1 and 2, the adjustable surface mount package semiconductor device clamp of the present embodiment includes a first PCB substrate 1, a second PCB substrate 12, an adjustable connection assembly, a base 5, a spring 6, a base pin 13, a pin 8, and an elastic band 9;

microstrip lines 15 are arranged on the first PCB substrate 1 and the second PCB substrate 12;

the first PCB substrate 1 and the second PCB substrate 12 are respectively provided with a base 5;

the reeds 6 are arranged on the two bases 5, the reeds 6 are connected with microstrip lines 15 on the corresponding PCB substrates through the base pins 13, and the microstrip lines 15 are connected with the pins 8; a reed 6 corresponds to a microstrip line 15, a microstrip line 15 corresponds to a pin 8, and the reed 6, the base pin 13, the microstrip line 15 and the pin 8 convert the surface mount package into a dual in-line package form so as to conveniently test the semiconductor device;

the first PCB substrate 1 is connected with the second PCB substrate 12 through the adjustable connection assembly, and the relative position between the first PCB substrate 1 and the second PCB substrate 12 can be changed by adjusting the adjustable connection assembly, so that the relative position between the two bases 5 can be changed;

pins on two sides of the surface mount packaged semiconductor device to be tested are respectively contacted with the spring pieces 6 on the two bases 5, and the surface mount packaged semiconductor device to be tested is bound on the two bases 5 through the elastic band 9, so that the pins are tightly pressed with the spring pieces 6.

Aiming at the surface-mounted packaged semiconductor devices to be tested with different packaging sizes, the adjustable connecting assembly is adjusted to enable the distance between the first PCB substrate 1 and the second PCB substrate 12 to meet the requirement of the distance between the pins on the different sides of the surface-mounted packaged semiconductor devices to be tested, so that the adjustable surface-mounted packaged semiconductor device clamp can be suitable for testing the surface-mounted packaged semiconductor devices with different packaging sizes.

With continued reference to fig. 1 and 2, in this embodiment, the adjustable connection assembly includes an adjustable slider 2, and the adjustable slider 2 is provided with a strip-shaped groove 3; one end of the adjustable sliding block 2 is fixedly connected with the first PCB substrate 1 through a combination of a screw and a nut; the other end of the adjustable sliding block 2 is also connected with the second PCB substrate 12 through the combination of a screw 11 and a nut 14, the screw is arranged in the strip-shaped groove 3, and the distance between the first PCB substrate 1 and the second PCB substrate 12 can be adjusted by changing the specific position of the screw in the strip-shaped groove 3. The adjustable range of the distance between the first PCB substrate 1 and the second PCB substrate 12 is determined by the length of the strip-shaped groove 3.

Referring to fig. 3, a plurality of reeds 6 are arranged on a base 5, and the reeds 6 form a reed array, and the reed array is matched with a pin array on the same side of the surface mount packaged semiconductor device to be tested. On the base 5, a base pin 13 is configured for each reed 6, and the base pin 13 is welded with the reed 6 and used for electrically connecting the reed 6 with a microstrip line on the PCB substrate. Referring to fig. 1, microstrip lines 15 are arranged on one surface of a first PCB substrate 1, one microstrip line 15 corresponds to one reed 6, and a base 5 is arranged on the surface on which the microstrip lines 15 are arranged; a contact pin 8 is arranged on the other surface of the first PCB substrate 1, the surface provided with the contact pin 8 is opposite to the surface on which the microstrip lines 15 are arranged, one contact pin 8 corresponds to one microstrip line 15, and the contact pin 8 is electrically connected with the corresponding microstrip line 15 through a metal column in the first PCB substrate 1; during testing, the pin of the surface mount packaged semiconductor device to be tested is extended to the pin 8 through the reed 6, the base pin 13, the microstrip line 15 and the pin 8, and the distance between every two adjacent pins 8 can be larger than that between every two adjacent pins, so that the testing equipment can be conveniently connected; the pins 8 can be pins of a pin header, and the space between two adjacent pins is matched with the pins of a standard dual-in-line pin. The structure of the second PCB substrate 12 is the same as that of the first PCB substrate 1, and will not be described herein.

Referring to fig. 2, spring 6 has an upward inclination and elasticity, so as to ensure that the pin of the surface mount package semiconductor device to be tested can form good contact with spring 6 when pressed against spring 6.

Fig. 4 is a schematic structural view of the elastic band in the preferred embodiment of the present invention.

Referring to fig. 4, two ends of the elastic band 9 are respectively provided with a hook 10; referring to fig. 3, a semicircular ring 7 is arranged on the base 5; and hooks 10 at two ends of the elastic band 9 are respectively hooked on the semicircular rings 7 of the two bases 5, so that the surface mount packaged semiconductor device to be tested is bound. In this embodiment, each end of the elastic band 9 is provided with two hooks 10, and correspondingly, a base 5 is provided with two semicircular rings 7; the elastic band 9 is made of elastic material.

Referring to fig. 1 and 2, the adjustable surface mount package semiconductor device clamp of the present embodiment further includes support posts 4; the first PCB substrate 1 and the second PCB substrate 12 are provided with two support columns 4, and the adjustable surface-mounted semiconductor device clamp is supported by the 4 support columns 4. The support column 4 is arranged on the surface provided with the contact pin 8.

In this embodiment, 24 springs 6 are provided on one base 5, and theoretically, a surface mount packaged semiconductor device having a maximum of 48 pins is supported. The width of the reeds 6 is 0.31mm, the distance between two adjacent reeds 6 is 0.635mm, and the reed is suitable for SOP and SSOP with different packaging sizes.

The embodiment also provides a testing method using the adjustable surface mount package semiconductor device clamp, which comprises the following steps:

1) adjusting the nuts 14 corresponding to the screws 11 in the strip-shaped grooves 3 to be loose;

3) measuring the packaging size of the surface mount packaged semiconductor device to be measured;

the packaging size comprises the distance between the pins on different sides, the distance between each pin on the same side, the number of the pins and the like;

3) adjusting the distance between the first PCB substrate 1 and the second PCB substrate 12 according to the distance between the pins of the different sides of the surface mount packaged semiconductor device to be tested, so that the surface mount packaged semiconductor device to be tested can be installed on the spring pieces 6 of the two bases 5;

4) tightening nuts 14 corresponding to the screws 11 in the strip-shaped grooves 3 to fix the first PCB substrate 1 and the second PCB substrate 12 together;

after the nut 14 is tightened, the distance between the first PCB substrate 1 and the second PCB substrate 12 is fixed;

5) the pins at two sides of the surface mount packaged semiconductor device to be tested are respectively positioned on the spring leaves 6 of the two fixed bases 5;

if the device is an SSOP device, 1 reed 6 corresponds to 1 pin; if the device is an SOP device, each 2 reeds 6 correspond to 1 pin, namely the pin is contacted with 1 of the reeds 6, and the other reed 6 is suspended among the 2 pins;

6) 4 hooks 10 on the elastic band 9 are respectively hooked on 4 semicircular rings 7 on the two bases 5, and the surface mount packaged semiconductor device to be tested is fixed;

7) observing the reed 6 pressed by each pin of the surface mount packaged semiconductor device to be tested, thereby determining the contact pin 8 corresponding to each pin of the surface mount packaged semiconductor device to be tested;

8) after the pins 8 of all the pins are determined, the surface mount packaged semiconductor device to be tested is tested through the pins 8.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The adjustable surface-mounted packaged semiconductor device clamp is characterized by comprising a first PCB substrate, a second PCB substrate, an adjustable connecting assembly, a base, a reed, a base pin, a pin and an elastic band;

microstrip lines are arranged on the first PCB substrate and the second PCB substrate;

the first PCB substrate and the second PCB substrate are respectively provided with a base;

the reeds are arranged on the two bases and are connected with microstrip lines on the corresponding PCB substrates through base pins, and the microstrip lines are connected with the pins;

the first PCB substrate is connected with the second PCB substrate through the adjustable connecting assembly, and the adjustable connecting assembly is adjusted to change the relative position between the first PCB substrate and the second PCB substrate so as to change the relative position between the two bases;

the pins on two sides of the surface mount packaged semiconductor device to be tested are respectively contacted with the reeds on the two bases, and the surface mount packaged semiconductor device to be tested is bound on the two bases through the elastic band, so that the pins and the reeds are tightly pressed.

2. The adjustable surface mount package semiconductor device clip of claim 1, wherein the adjustable connection assembly comprises an adjustable slider having a strip-shaped slot; one end of the adjustable sliding block is fixedly connected with the first PCB substrate; the other end of the adjustable sliding block is connected with the second PCB substrate through a combination of a screw and a nut, and the screw is arranged in the strip-shaped groove.

3. The adjustable surface-mount package semiconductor device clamp of claim 2, wherein the distance between the first PCB substrate and the second PCB substrate can be adjusted by changing the specific position of a screw in the strip-shaped groove, and the adjustment range is determined by the length of the strip-shaped groove.

4. The adjustable surface mount package semiconductor device holder of claim 1, wherein the spring plate has an upward slope and elasticity.

5. The adjustable surface mount package semiconductor device clip of claim 1, wherein a hook is provided at each end of the elastic band; a semicircular ring is arranged on the base; and hooks at two ends of the elastic band are respectively hooked on the semicircular rings of the two bases, so that the surface-mounted packaged semiconductor device to be tested is bound.

6. The adjustable surface mount package semiconductor device clamp of claim 1, wherein support posts are disposed on both the first PCB substrate and the second PCB substrate to support the adjustable surface mount package semiconductor device clamp.

7. The adjustable surface mount package semiconductor device holder of claim 1, wherein a base is provided with a plurality of springs, the plurality of springs forming a spring array, the spring array matching a same side pin array of the surface mount package semiconductor device to be tested; one reed corresponds to one base pin, one base pin corresponds to one microstrip line, and one microstrip line corresponds to one pin.

8. The adjustable surface mount package semiconductor device holder of claim 7, wherein 24 spring plates are provided on one base, the width of each spring plate is 0.31mm, and the distance between two adjacent spring plates is 0.635 mm.

9. A method of testing using the adjustable surface mount package semiconductor device clamp of any of claims 1-8, comprising the steps of:

measuring the packaging size of the surface mount packaged semiconductor device to be measured;

adjusting the distance between the first PCB substrate and the second PCB substrate by using the adjustable connecting assembly according to the distance between the pin arrays on the different sides of the surface mount packaged semiconductor device to be tested, so that the surface mount packaged semiconductor device to be tested can be installed on the spring pieces of the two bases;

fixing the first PCB substrate and the second PCB substrate together by using an adjustable connecting assembly;

the pins at two sides of the surface mount packaged semiconductor device to be tested are respectively positioned on the reeds of the two fixed bases;

fixing the surface-mounted packaged semiconductor device to be tested by using an elastic band;

observing the reed pressed by each pin of the surface mount packaged semiconductor device to be tested, thereby determining the contact pin corresponding to each pin of the surface mount packaged semiconductor device to be tested;

and testing the surface-mounted packaged semiconductor device to be tested through the contact pin.