CN111550687A - LED bulb lamp - Google Patents

Abstract

The application discloses LED ball bubble lamp, it includes lamp body and connection the lamp holder of lamp body, LED ball bubble lamp still includes: the core column comprises a core column bottom and a core column top which are opposite, and the core column bottom is connected with the lamp holder; at least two conductive brackets connected with the core column; the LED filament comprises a filament body and two filament electrodes, the two filament electrodes are positioned at two opposite ends of the filament body, the two filament electrodes are respectively connected with the two conductive supports, and the filament body surrounds the core column; and one end of the cantilever is connected with the core column, and the other end of the cantilever is connected with the filament body. The LED lamp has excellent light-emitting effect and good bending property.

Description

LED bulb lamp

The invention relates to a divisional application of Chinese patent office, application number 201710086839.5 and invention name LED bulb lamp filed on 17.02.2017.

Technical Field

The invention relates to the field of illumination, in particular to an LED bulb lamp applying an LED soft filament.

Background

The LED has the advantages of environmental protection, energy conservation, high efficiency and long service life, so the LED generally receives attention in recent years and gradually replaces the status of the traditional lighting lamp. However, the light emitted by the conventional LED light source has directivity, unlike the conventional lamp, which can illuminate in a wide angle range, so that the application of the LED to the conventional lamp has a corresponding challenge depending on the kind of the lamp.

In recent years, an LED filament capable of making an LED light source emit light similar to a traditional tungsten filament bulb lamp and achieving 360-degree full-angle illumination is increasingly emphasized in the industry. The LED filament is manufactured by connecting a plurality of LED chips in series and fixing the LED chips on a narrow and long glass substrate, wrapping the whole glass substrate with silica gel doped with fluorescent powder, and then electrically connecting. However, when such filaments are welded to the vertical rod in the bulb, they must be welded individually, and the manufacturing process is complicated. Moreover, due to the adoption of the spot welding mode, the requirements on the performance and the size of the material are strict, and the risk of insufficient welding exists.

In addition, the LED soft filament is similar to the filament structure, and the glass substrate is partially changed into a flexible substrate, so that the filament can have a certain bending degree. However, how to achieve the 360 ° full-angle illumination effect of the LED bulb lamp by using the soft filament is not found yet.

The present application is a further optimization of the above prior art.

Disclosure of Invention

The invention aims to provide an improved filament lamp to achieve the effects of simple manufacture, large light-emitting angle and the like.

In order to achieve the above object, the present invention provides an LED bulb lamp, including a lamp housing and a lamp cap connected to the lamp housing, the LED bulb lamp further including:

the core column comprises a core column bottom and a core column top which are opposite, and the core column bottom is connected with the lamp holder;

at least two conductive brackets connected with the core column;

an LED filament, including filament body and two filament electrodes, two filament electrodes are located the relative of filament body

The two filament electrodes are respectively connected with the two conductive supports, and the filament body surrounds the core column; and

at least one cantilever, one end is connected with the core column, and the other end is connected with the filament body;

the LED filament includes:

the LED chips are electrically connected with each other;

the two electrodes are arranged corresponding to the LED chip and electrically connected with the LED chip; and

the light conversion layer comprises a top layer and a base layer which are respectively positioned at two sides of the LED chip, the top layer covers the LED chip and the electrodes, and parts of the two electrodes are respectively exposed; the base layer is provided with a chip accommodating groove located in the axial direction of the LED filament, and the width of the chip accommodating groove is larger than that of the LED chip.

Further, the base layer comprises phosphor and glue, and the phosphor in the base layer accounts for 40-65% WT.

Furthermore, the top layer is provided with a heat dissipation channel which is axially arranged along the LED filament and penetrates through the LED filament.

Further, the heat dissipation channel comprises at least one heat dissipation hole, and the heat dissipation hole is perpendicular to the axial direction of the LED filament.

Furthermore, one end of each heat dissipation hole is communicated with the heat dissipation channel, and the other end of each heat dissipation hole penetrates through the top layer and is far away from the base layer.

Furthermore, the LED filament is provided with an upper surface and a lower surface opposite to the upper surface, and the heat dissipation holes are opened on the upper surface of the LED filament.

The utility model provides a LED ball bubble lamp, includes the lamp body and connects the lamp holder of lamp body, LED ball bubble lamp still includes:

the core column comprises a core column bottom and a core column top which are opposite, and the core column bottom is connected with the lamp holder;

at least two conductive brackets connected with the core column;

the LED filament comprises a filament body and two filament electrodes, wherein the two filament electrodes are positioned opposite to the filament body

The two filament electrodes are respectively connected with the two conductive supports, and the filament body surrounds the core column; and

at least one cantilever, one end is connected with the core column, and the other end is connected with the filament body;

the LED filament includes:

the LED chips are electrically connected with each other;

the two electrodes are arranged corresponding to the LED chip and electrically connected with the LED chip; and

the light conversion layer comprises a top layer and a base layer, the base layer covers six sides of the LED chip, and the top layer covers the base layer and the two electrodes and respectively exposes one part of the two electrodes.

Further, the base layer is a first fluorescent glue layer, and the first fluorescent glue layer is in a linear connection series and is in a two-by-two tangent spherical structure.

Further, the top layer comprises a second fluorescent glue layer and a transparent layer, and the second fluorescent glue layer fills up the gap between the transparent layer and the first fluorescent glue layer.

Further, the amount of the fluorescent powder in the first fluorescent glue layer is larger than that of the fluorescent powder in the second fluorescent glue layer.

Has the advantages that: the LED bulb lamp provided by the invention has the advantages of good light-emitting effect, simplicity in manufacturing and good bending property.

Drawings

Fig. 1A shows a structure diagram of a bulb lamp manufactured by applying the LED filament of the present invention;

FIG. 1B shows a block diagram of the lamp housing heat sink attachment of FIG. 1A;

fig. 1C is a schematic perspective view of an LED bulb according to an embodiment of the invention, wherein a plurality of filaments are assembled in a modular manner;

FIG. 2 is an enlarged view of the region A in FIG. 1B;

FIG. 3 is an exploded view of the filament assembly of the embodiment shown in FIG. 1C;

FIG. 4 is an expanded schematic view of another embodiment of a filament assembly;

FIG. 5 is an expanded schematic view of another embodiment of a filament assembly;

FIG. 6 is a perspective view of a shaping jig according to the present invention;

fig. 7 is a schematic view of a state that the filament assembly is molded on the shaping jig;

FIG. 8 is a schematic view of another embodiment of a filament assembly in which the filaments are not equally spaced;

FIG. 9 is a schematic illustration of a single LED filament primary and secondary light emitting surfaces, wherein (a) is a schematic illustration of a single LED filament primary light emitting surface and (b) is a schematic illustration of a single LED filament secondary light emitting surface;

fig. 10 is a schematic perspective view of the LED bulb lamp with the positive and negative leads at the lower end of the filament assembly according to an embodiment of the invention;

fig. 11 is a schematic perspective view of an LED bulb lamp according to another embodiment of the invention, with the positive and negative electrodes at the upper end of the filament assembly;

fig. 12 is a cross-sectional view of the LED bulb of the invention shown in fig. 1C taken along the X-X direction, wherein the auxiliary support is assembled with the filament assembly in a hook manner;

FIG. 13 is an enlarged view of a portion of one embodiment of the LED filament assembly of FIG. 12 in combination with an auxiliary support;

fig. 14 is a front expanded schematic view of an embodiment of the filament support of the present invention;

fig. 15 is a schematic view of the back side of an embodiment of the filament support of fig. 14 when the filament support is a conductive body;

fig. 16 is a schematic view of the back side of an embodiment of the filament support of fig. 14 when the filament support is an electrical conductor;

fig. 17 is an expanded schematic view of an embodiment of the filament support of the present invention;

fig. 18 is a schematic circuit diagram of the filament support of fig. 17;

FIG. 19 is a perspective view of a filament lamp having the present filament mount according to an embodiment of the present invention;

FIG. 20 is a perspective view of a filament lamp having the present filament mount according to an embodiment of the present invention;

FIG. 21 is a schematic perspective, partially cross-sectional view of a first embodiment of an LED filament of the present invention;

FIG. 22 is a schematic partial cross-sectional view taken at the location 2-2 in FIG. 21;

fig. 23 and 24 are schematic diagrams of other embodiments of the corresponding arrangement of the electrodes and the LED chip of the first embodiment of the LED filament according to the present invention;

FIG. 25 is a schematic perspective, partially cross-sectional view of a second embodiment of an LED filament of the present invention;

FIG. 26 is a schematic view, partly in section, taken at the position 5-5 in FIG. 25;

FIG. 27A is a schematic view of a first embodiment of an uncut circuit film of a second embodiment of an LED filament according to the present invention;

FIG. 27B is a schematic view of an uncut circuit film of an LED filament according to the present invention attached to an LED chip;

FIG. 28A is a schematic view of a second embodiment of an uncut circuit film of an LED filament according to the present invention;

FIG. 28B is a schematic view of an uncut circuit film of an LED filament according to a second embodiment of the present invention attached to an LED chip;

FIG. 29A is a schematic view of a third embodiment of an uncut circuit film of an LED filament of the present invention;

FIG. 29B is a schematic view of a third embodiment of an uncut circuit film of an LED filament of the present invention attached to an LED chip;

FIGS. 30A to 30E are schematic views of a first embodiment of a method for manufacturing an LED filament according to the present invention;

FIG. 31 is a schematic view of a second embodiment of a method for manufacturing an LED filament according to the present invention;

fig. 32A to 32E are schematic views illustrating a method for manufacturing an LED filament according to a third embodiment of the present invention;

fig. 33 is a schematic structural view of a first embodiment of an LED bulb lamp according to the present invention;

fig. 34 is a schematic structural view of a second embodiment of the LED bulb lamp of the present invention;

fig. 35A is a schematic perspective view of a third embodiment of an LED bulb lamp of the present invention;

FIG. 35B is a top projection view illustrating one embodiment of the filament shape of the bulb lamp of the present invention;

FIG. 36A is an enlarged partial cross-sectional view of the dotted circle portion of FIG. 35A;

36B-36D are schematic diagrams illustrating various embodiments of electrode portions of filaments according to the present invention;

fig. 36E is a schematic perspective view of a fourth embodiment of an LED bulb lamp of the present invention; FIGS. 36F and 36G are side elevation views and side elevation views thereof; FIG. 36H is a top view thereof;

FIGS. 36I-36K are enlarged, partial cross-sectional views of three different embodiments of the lamp envelope of the present invention;

fig. 36L is a schematic perspective view of a fifth embodiment of an LED bulb lamp of the present invention;

fig. 36M is a schematic perspective view of an embodiment of an LED lamp housing of the invention;

fig. 36N is a schematic perspective view of a sixth embodiment of an LED bulb lamp of the present invention; fig. 37 is a schematic perspective view of a seventh embodiment of the LED bulb lamp of the present invention;

fig. 38 is a schematic top view of a circuit board of a driving circuit of a seventh embodiment of the LED bulb lamp according to the invention;

FIGS. 39A-39E, 40-46 are each a schematic cross-sectional view of different embodiments of the layered filament structure of the present invention; wherein FIG. 39B is a schematic cross-sectional view of a layered structure of a filament for increasing bonding strength; fig. 39C to 39E are perspective views showing only a base layer, fig. 39C is a perspective view showing a top layer and a base layer, and fig. 39E is a cross-sectional view of line E1 to E2 in fig. 39D, illustrating an embodiment of a filament layered structure for increasing bonding strength;

FIG. 40 shows a schematic cross-sectional view of an embodiment of an LED filament layered structure, wherein a base layer is located intermediate two top layers;

FIG. 41 is a schematic cross-sectional view of another embodiment of an LED filament layered structure wherein the base layer is a phosphor film and a transparent layer;

fig. 42 shows a schematic cross-sectional view of another embodiment of the present filament lamination, wherein the base layer of the filament has only glue;

fig. 43 shows a schematic cross-sectional view of a layered structure of a filament in an embodiment of the present disclosure, wherein the base layer is divided into a hard segment and a soft segment;

fig. 44 shows a schematic cross-sectional view of another embodiment of the present filament layer structure, where each side of the LED chip is in direct contact with the top layer, while the base layer is not in contact with the LED chip;

FIG. 45 is a schematic cross-sectional view of another embodiment of a layered filament structure, in which the top and base layers are each a two-layer structure comprising a phosphor glue layer and a glue layer;

FIG. 46 shows a schematic cross-sectional view of another embodiment of a layered filament construction wherein the base layer of the filament has an undulating surface;

FIG. 47A is a schematic perspective view of a layered filament structure in accordance with one embodiment of the present invention;

FIG. 47B is a cross-sectional view of one embodiment of a layered structure of the present invention;

fig. 48-50 are each cross-sectional views of different embodiments of filament encapsulation constructions of the present invention;

fig. 51A to 51D are perspective views of a filament provided with first to fourth embodiments of the filament auxiliary strip of the present invention;

FIGS. 51E-51F are schematic diagrams of filament assist strips implemented in a bulb lamp in accordance with the present invention;

FIG. 52 is a schematic cross-sectional view of one embodiment of an LED filament of the present invention;

FIG. 53 is a schematic cross-sectional view of another embodiment of an LED filament of the present invention;

FIGS. 54A-54F are schematic diagrams of linear arrays of LED chips according to various embodiments of the present invention;

fig. 55A to 55C are schematic transverse cross-sectional views of LED filaments according to various embodiments of the present invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

In the manufacturing process of the traditional bulb lamp, in order to avoid oxidation fracture failure caused by combustion of tungsten filaments in air, a glass structure sleeve of a horn core column is designed to be sintered and sealed at an opening of a glass lamp housing, then the inside air of the lamp housing is pumped into nitrogen by a port connection vacuum pump of the horn core column, the combustion oxidation of the tungsten filaments inside the lamp housing is avoided, and finally the port of the horn core column is sintered and sealed. In addition, the water mist dispersed in the air inside the lamp housing can be removed at the same time by the replacement of the gas. Further, referring to fig. 1A, fig. 1A shows an LED bulb 1 using LED filaments 11, where the LED bulb 1 includes a lamp housing 12, a plurality of LED filaments 11, an auxiliary support 13 for connecting and supporting the LED filaments 11, a metal stem 14 for exhausting and exchanging gas in the LED bulb 1 and providing a heat conduction function, a heat sink 157 connected to the metal stem 14 and conducting heat from the metal stem 14 to the outside of the LED bulb, a plastic lamp base 17, a lamp cap 16, and a driving circuit (not shown) disposed in the lamp cap 16. In order to improve the light efficiency performance of the LED bulb lamp 1, the lamp housing 12 must have better transparency and heat conduction effect, therefore, the embodiment adopts a glass lamp housing as a good material, and in addition, a plastic lamp housing with high light transmittance and high heat conduction effect is also selectable, and considering the requirements of part of markets for low color temperature bulb lamps, a material with golden yellow color can be properly doped in the lamp housing, or a layer of golden yellow film is plated on the inner surface of the lamp housing, and a proper trace amount of blue light emitted by part of the LED chips is absorbed, so as to lower the color temperature performance of the LED bulb lamp 1. Or the lamp shell can also be a lamp shell with a fog surface or a mirror surface. As mentioned above, the vacuum pump can change the air inside the lamp housing into full nitrogen or mix nitrogen and helium in a proper ratio through the metal stem 14 to improve the thermal conductivity of the gas inside the lamp housing and remove the water mist hidden in the air. In addition, the heat generated by the LED filament 11 is not easily conducted to the outside of the lamp envelope directly without the aid of the metal support, but the heat source radiated from the LED filament 11 is absorbed by the metal stem 14, so that the heat can be rapidly conducted to the heat sink 157 to be discharged to the outside of the lamp envelope. In addition, if the problem of improving the light effect performance is considered, a traditional non-light-absorbing glass core column can be adopted, and a layer of graphene which is light-permeable and has high heat conduction characteristic is plated on the surface of the glass core column, so that the heat dissipation problem can be improved. The heat sink 157 is a hollow cylinder surrounding the open end of the lamp housing 12, and the driving circuit of the LED filament 11 can be placed inside, and the material of the heat sink 157 can be metal, ceramic or high thermal conductivity plastic with good thermal conductivity, and when a metal material (e.g. Al aluminum) is selected as the heat sink 157, the metal material has good thermal conductivity but poor thermal radiation property (e.g. the emissivity of aluminum is only about 0.1), so the surface needs to be coated to enhance the thermal radiation effect, for example, alumina (emissivity is about 0.4) has good thermal radiation effect. The heat sink 157 is preferably provided with a cover plate 1501 on the end surface near the opening of the lamp housing 12, and the surface of the cover plate can be coated with aluminum oxide or white reflective paint, so that the heat conduction area of the heat sink 157 can be increased and the heat radiation characteristic can be improved, the heat generated by the LED filament 11 can be fully absorbed and conducted to the outside of the spherical shell, and the light emitted by the LED filament 11 can be reflected out of the lamp housing to improve the luminous efficiency. In addition, the cover plate 1501 is provided with a hole for the metal stem 14 and the auxiliary bracket 13 to pass through. The driving circuit can be electrically connected with the plurality of LED filaments 11 through the auxiliary support 13 to provide a power supply for lighting the LED chips on the LED filaments 11, and the input lead at the other end of the driving circuit is electrically connected with the lamp cap 17 at the tail end of the LED bulb lamp 1.

As mentioned above, in the manufacturing process of the conventional bulb lamp, the horn core column is sleeved at the opening of the glass lamp housing for sintering and sealing, and both are made of glass, so that the horn core column and the glass lamp housing can be mutually fused after being sintered at high temperature to achieve the purpose of sealing. However, in the embodiment, after the metal stem 14 is adopted, the sintering sealing effect of the metal and the glass cannot achieve the effect like a glass horn stem, so the embodiment adjusts the structure of the heat sink 157 connected with the metal stem 14 to achieve the purpose of sealing the lamp shell of the bulb lamp. As shown in fig. 1B, the heat sink 157 is shaped like a bottle cap covering the open end of the lamp housing 12, and has a bending portion 1572 at its edge to connect with the open end glass of the lamp housing 12, please refer to fig. 2, fig. 2 is an enlarged structure diagram of the area a in fig. 1B, the middle of the port of the bending portion 1572 has an inward concave portion 1573, its width is slightly larger than the thickness of the open end glass of the lamp housing 12, so that the whole open end of the lamp housing 12 can be completely covered by the concave portion 1573. The recess 1573 can be filled with a sealant with good sealing property, so that the connection between the heat sink 157 and the lamp housing 12 is more stable. A plastic lamp holder 17 can be additionally arranged between the radiator 157 and the lamp head 16 so as to ensure the safety of maintenance personnel when the bulb lamp is installed or removed.

The plurality of LED filaments 11 may be arranged in a vertically symmetrical pattern around the metal stem 14, however, in view of the requirement of full-circle lighting, the filaments are preferably arranged in a tilted manner rather than parallel to the metal stem 14. The LED chip in the LED filament 11 can be properly selected to be a large chip and driven by a small current to shine, so that the purpose of low heating is achieved, the luminous efficiency of the LED filament 11 can exceed 180lm/W, and the brightness of the whole LED bulb lamp 1 can easily exceed 700 lm. In addition, for the whole bulb lamp, the best position for arranging the lamp source is near the center of the sphere of the lamp housing, and the overlong filament cannot be arranged in the area, so that a better full-period effect can be achieved by selecting a plurality of shorter LED filaments, the length of the LED chip in the embodiment is preferably less than 20mm, and 15-10 mm is the best choice, but the LED chips with the sizes of 10x20mm, 14x34mm, 14x28mm and the like can also be used. In addition, the light source is dispersed into a plurality of short filaments, so that the heat source can be dispersed, the overall heat dissipation effect of the LED bulb lamp can be improved, and even at the topmost position of the lamp housing 12, the light variation rate can be far lower than 50%, namely the brightness of the topmost position of the lamp housing can not be lower than 50% of the brightness of the brightest position of the LED bulb lamp.

In this embodiment, the metal core column may be replaced with a ceramic core column, and the preferred material of the ceramic material is alumina or aluminum nitride, which has a far higher thermal radiation absorption rate than glass, so that the heat emitted by the LED filament can be absorbed more effectively, and the heat is LED out of the LED bulb. In other embodiments, the heat sink (together with the screw of the LED bulb) may also be made of a ceramic material with a good heat conduction effect, and may be integrally formed with the ceramic stem, so that the heat resistance of the heat dissipation path of the LED filament due to the fact that the screw of the LED bulb needs to be glued with the heat sink is avoided, and a better heat dissipation effect is achieved.

In the embodiment, the light emitting efficiency of the LED bulb lamp is, for example, 30 to 400lm/W, preferably 50 to 250 lm/W. The whole brightness of the LED bulb lamp can reach 800lm for example. The color temperature of the LED bulb lamp is 2200K-6500K, preferably 2500K-4000K. In addition, the shape of the silica gel coated LED chip can be square or rectangular, and the vertical to horizontal ratio of the silica gel coated LED chip is 1: 1-1: 100, for example.

The LED filaments 11 of the LED bulb lamps shown in fig. 1A and 1B are usually welded to the auxiliary supports 13 by a plurality of filaments 11 during processing, the welding process is complicated, and due to the spot welding mode, the requirements on the performance and size of the material are strict, and the risk of cold joint exists. In order to simplify the process, save the processing time of the LED filament, and simultaneously improve the reliability of the welding and reduce the dependence on materials, the present invention provides another LED bulb 5 as shown in fig. 1C, where the LED bulb 5 includes: the lamp housing 52, the LED filament assembly 51, the auxiliary support 53, the metal stem 54, the lamp cap 57, and a driving circuit (not shown) provided in the lamp cap 57. The auxiliary support 53 is used to connect and support the LED filament assembly 51. The metal stem 54 is used for pumping the gas in the LED bulb 5 and providing a heat conducting function. Upright post 541 extends from metal stem 54; and the auxiliary bracket 53 extends from the upright 541.

Fig. 3 is an expanded schematic view of the filament assembly 51 of the LED bulb 5 shown in fig. 1C. The LED filament assembly 51 is an integrally formed module, the LED filament assembly 51 comprises a plurality of LED filaments 511, and the LED filaments 511 can be soft or hard. The plurality of LED filaments 511 are integrally connected by first and second connection portions 512 and 513 at both ends thereof. In the processing process, the plurality of LED filaments 511, the first connecting portion 512 and the second connecting portion 513 can be combined into a whole on a plane, and it is not necessary to spot-weld each individual LED filament 511 with the auxiliary support 53, which not only has simple process and saves processing time, but also has no problem of cold joint.

In the above embodiment, the first connection portion 512 and the second connection portion 513 are each in a plurality of T-shaped connection shapes. Wherein the vertical portions of the T form the electrodes 511A and 511B of the LED filament 511. The first connection portion 512 including the electrode 511A and the second connection portion 512 including the electrode 511B are integrally formed. In another embodiment, the electrodes 511A and 511B may be formed on two ends of the LED filament 511, and then respectively connected to the first connection portion 512 and the second connection portion 513. The connection may be by welding, male-female shape bonding, riveting, or the like.

The LED filament assembly 51 may be shaped as a fan as shown in fig. 3 or may be generally rectangular as shown in fig. 4 before being bent. In the fan-shaped structure, the length of the first connecting member 320 is smaller than that of the second connecting member 322, i.e., the radius of the approximate circle surrounded by the first connecting member 320 is smaller than that of the circle surrounded by the second connecting member 322. The LED filament assembly 51 is designed to be more stable when hung on the auxiliary support 53 in a hook form. When the rectangular structure shown in fig. 4 is adopted, the LED filament assembly 61 includes a plurality of LED filaments 611 and first and second connection members 612 and 613 connected to both ends of the plurality of LED filaments 611, and the length of the first connection member 612 is equal to the length of the second connection member 613. The LED filament assembly 61 formed by such an arrangement is more regular and has less error. The two LED filament assemblies 51, 61 of fig. 3 and 4 have in common that the LED filaments are substantially equally spaced apart, which is more advantageous for uniform light extraction.

Fig. 8 shows another embodiment when multiple LED filaments are arranged at unequal spacing, where the spacing between LED filament 5111 and LED filament 5112 is significantly greater than the spacing between the other LED filaments. When light is required to be emitted in the important direction, the structural embodiment can be adopted, the LED filaments can be arranged densely where the light is required to be emitted in the important direction, and the LED filaments can be arranged sparsely in the secondary light emitting direction. Of course, fig. 8 only illustrates the LED filament assembly as a fan shape, and in other embodiments, the unequal-pitch arrangement of the LED filaments may be suitable for the case where the LED filament assembly is in a rectangular regular pattern or other irregular patterns.

The LED filament assembly 71 may also be implemented as shown in fig. 5, and the LED filament assembly 71 of this embodiment is different from the embodiment shown in fig. 3 in that the LED filament assembly 71 includes two LED filament subassemblies 71A and 71B, and the two filament subassemblies 71A and 71B are symmetrically disposed, so that the manufacturing is facilitated, the processing efficiency is improved, and the overall structure is more beautiful, although the two filament subassemblies 71A and 71B may also be asymmetric structures. Each filament subassembly 71A, 71B includes at least two, and preferably three, LED filaments 711. The LED filament 711 has first and second connection members 712 and 713 connected to both ends thereof, respectively. In actual processing, each of the filament subassemblies 71A and 71B is formed by integral molding. The design not only has the advantages of easy processing and simple process, but also can be used for a user to arbitrarily remove one of the filament subassemblies according to the actual requirement and only leave one filament subassembly.

In order to shape the LED filament assembly into a predetermined shape structure, as shown in fig. 6, the invention further provides a filament shaping jig 109, where the filament shaping jig 109 includes a filament shaping portion 1011, and the filament shaping portion 1011 may be a cylindrical shape or an irregular conical shape. In this example, the filament shaping portion 1011 is a cylindrical structure with a small upper part and a large lower part, a first limit cover 1021 is formed at the top of the filament shaping portion 1011, a second limit cover 1031 is formed at the other end (lower end in this embodiment) of the first limit cover 1021 relative to the filament shaping portion 1011, the first limit cover 1021 and the second limit cover 1031 are used for limiting a first connecting member 512 and a second connecting member 513 of the LED filament assembly, and the LED filament 511 is attached to the filament shaping portion 1011 and is pressed by external force to be bent along the surface of the filament shaping portion 1011, so as to form a curved surface. As shown in fig. 7, the LED filament assembly 51 is in a state of being pressed and molded before leaving the filament shaping jig 109. As can be seen from fig. 6, the diameter of the first limit cover 1021 is smaller than that of the second limit cover 1031, and the diameters of the first limit cover 1021 and the second limit cover 1031 may be respectively slightly larger than that of the filament shaping part 101 connected thereto. Such a structure would make the spacing effect better.

In order to adjust the light emitting effect of the LED bulb lamp of the present invention, as shown in fig. 9, the LED filament 511 may be designed as a main light emitting surface 511A and a sub light emitting surface 511B, and the LED filament 511 is provided with a light transmitting hole 5113 penetrating through the main light emitting surface 511A and the sub light emitting surface 511B. As shown in fig. 9(a), the LED chips 111 are placed at intervals on the primary light emitting surface 511A, whereas in fig. 9(B), the LED chips 111 are not provided on the secondary light emitting surface 511B. Therefore, the light emission luminance of the primary light emitting surface 511A is much stronger than that of the secondary light emitting surface 511B. As required, the main light emitting surface 511A may be disposed inward (toward the stem 54), or the main light emitting surface 511A may be disposed outward (away from the stem 54), or even a part of the main light emitting surface 511A may be disposed inward and a part of the main light emitting surface 511A may be disposed outward. The light emission luminance effect can be freely adjusted by these designs.

In the LED bulb lamp 1 shown in fig. 1A, positive and negative leads (not numbered) are respectively connected to the upper end and the lower end of the auxiliary support 13, so as to facilitate welding of the LED filament to the positive and negative leads, and in fig. 10, the positive lead 1A and the negative lead 1b are respectively connected to the lower end of the LED filament assembly 51, that is, one end of the second connecting member 513. Because the length of positive pole wire 1a and negative pole wire 1b has shorter length for the wire is difficult to rock when the welding, promotes the welding reliability. Alternatively, the second connecting member 513 of the LED filament assembly 51 may also be connected and fixed with a stem or other support extending from the inner side of the bulb, and at this time, the positive electrode lead 1a and the negative electrode lead 1b may be flexibly configured, as long as the purpose of electrically connecting the lamp holder and the LED filament assembly 51 is achieved.

Of course, in other embodiments, as shown in fig. 11, the positive electrode lead 2a and the negative electrode lead 2b may be respectively welded to the upper end of the LED filament assembly 51, i.e., the first connecting member 512. The design has the advantage that the lengthened positive lead 2a and the lengthened negative lead 2b can prevent the lead from being broken due to shaking of the lamp cap during welding.

Fig. 12 is a cross-sectional view of the LED bulb lamp of the invention shown in fig. 1C along the X-X direction, and fig. 13 is a partially enlarged view of an embodiment of the LED filament assembly and the auxiliary support in fig. 12. In an embodiment, the auxiliary support 53 may be a metal (i.e., a metal conductive support), and the auxiliary support 53 is assembled with the LED filament assembly 51 in a hook manner; in particular, because the auxiliary support and each LED filament of the existing product generally adopt a spot welding mode, not only efficiency is low, but also cold welding is easily caused, and the use performance of the lamp is affected. In order to solve these problems, in the embodiment of the present invention, the auxiliary support 53 has a hook 531, and the LED filament assembly 51 is hung on the hook 531 of the auxiliary support 53 through the first connecting member 512 at the upper end. So as to realize the connection of the two, thereby effectively solving the problems of low spot welding efficiency and connection reliability.

In the embodiment shown in fig. 13, the auxiliary frame 53 is made of metal, and the middle of the auxiliary frame 53 is broken to form a gap 532, (the conductive auxiliary frames in the prior art are all conductive structures and are easy to be corroded electrically), so that the auxiliary frame 53 does not pass through current and only plays a role of fixing and supporting to prevent the auxiliary frame 53 from being corroded electrically for a long time.

In addition, the auxiliary support 53 may be metal, plastic, glass, or ceramic material or a combination thereof. In one embodiment, the auxiliary support 53 is not disposed between the upright 541 and the first connecting member 512 of the filament assembly, and the top of the upright 541 has a horizontally extending hook shape to be coupled with the first connecting member 531. Alternatively, the top of the vertical rod 541 and the first connecting member 541 may have a structure in which the top and the bottom are connected to each other for easy assembly.

In the above embodiments, the first connection member 512 and the second connection member 513 are connected by the LED filament 511. However, the first connecting member and the second connecting member may be initially integrated, for example, as shown in fig. 14, the LED filament assembly 30d may include a support 324, the supports 324 are connected between the first connecting member 320 and the second connecting member 322, and in fig. 15, the supports 324 are located below the filaments 300. In one embodiment, the first connecting member 320, the bracket 324 and the second connecting member 322 may be integrated insulators, and the electrode structures on the first connecting member 320 and the second connecting member 322, the electrodes 310 and 312 may be formed by conventional circuits (such as printing), or by metal embedding, and combined with the first connecting member 320, the bracket 324 and the second connecting member 32.

In one embodiment, the first connecting member 320, the bracket 324 and the second connecting structure 322 shown in fig. 14 can be an integrated conductor. In this case, the front view can be illustrated in fig. 14, and fig. 15 is a rear view of the LED filament assembly. In fig. 14, a plurality of filaments 300 including electrodes 310, 312 are formed over a support 324; in order to avoid short circuit, as shown in fig. 15, an insulating segment 324i is disposed in the bracket 324, and the insulating segment 324i may be integrated with the bracket of other parts by two-material molding, metal embedding, metal-plastic heterogeneous joint molding or other similar manners. In other embodiments, the insulating segment 324i can also be bonded to the upper and lower portions of the frame by an adhesive or the like. In one embodiment, when the first connecting member 320, the support 324 and the second connecting structure 322 are all conductive bodies, the back surface of the LED filament assembly can also be broken into an upper support 324t and a lower support 324b as shown in fig. 16, so as to avoid short circuit.

The LED filaments of the LED filament assembly can be electrically connected in series. The filament assembly 30g in fig. 17 is similar to the filament assembly 51 of fig. 3, but the filament assembly 51 is fan-shaped and the filament assembly 30g is rectangular. The filament assembly 30g has a linear shape of the first connecting member 320 and the second connecting member 322, and includes an insulating portion 320i and an insulating portion 322i, respectively. The insulating portion 320i of the first connecting member 320 and the insulating portion 322i of the second connecting member 322 are not opposed to each other with a shift. For example, as shown in fig. 17, when the first connecting member 320 between every two first electrodes 310 is used as a connecting segment, the first, third and fifth connecting segments from the left are conductive, and the rest are insulating portions 322 i. At this time, the first, third and fifth connection segments of the second connection member 322 are the insulation portions 322i, and the rest are conductive. In this way, the current is conducted in one direction, and a plurality of filaments are connected in series. The resulting circuit is shown in fig. 18, with the anode of the filament assembly located below the right end and the cathode below the left end. Positive charge flows from the electrode 312 below the left end through each filament and the conductive path consisting of the filament electrode and the first/second connecting member to the negative electrode of the leftmost filament. The filament series connection of fig. 18 may be formed by providing an insulating part in the connection member or by breaking a circuit, or may be formed by providing a diode in the filament to restrict the current from flowing in a single direction.

Fig. 19 and 20 show that the high-low configuration of the openings or/and the leads made in the first/second connecting members is used to adjust the avoidance of short circuits after forming a lamp using the filament assembly of fig. 3. In fig. 19 and 20, the vertical rod 19a can be an insulating and connecting auxiliary support 315, and the filament assembly is hung on the auxiliary support 315. The first connecting member has two openings at the front and the rear, respectively, so that the first connecting member is divided into a first portion 320l and a second portion 320 r. The second connecting member 322 has an opening. The wires 14a, 14b extending from the stem extend upwardly to be connected to the first and second portions 320l, 320r of the first connecting member, respectively. In fig. 20, the first connecting member 320 has one opening and the second connecting member has two openings such that the second connecting member is divided into a first portion 322l and a second portion 322 r. The lead wires 14a and 14b extending from the stem are connected to the first portion 322l and the second portion 322r of the second connecting member, respectively.

Next, an LED filament applicable to the above-described filament assembly is described. Referring to fig. 21 to 22, fig. 21 is a perspective partial cross-sectional view of a first embodiment of an LED filament according to the present invention, and fig. 22 is a partial cross-sectional view of a position 2-2 in fig. 21. According to the first embodiment, the LED filament 100 includes a plurality of LED chips 102,104, at least two electrodes 110,112, and a light conversion layer 120 (in a specific embodiment, the light conversion layer may be referred to as a glue layer or a silicone layer), and the phosphor 124 in the light conversion layer 120 can absorb some radiation (e.g., light) to emit light.

The LED filament 100 emits light when the electrodes 110 and 112 are powered on (voltage source or current source), for example, the emitted light may be substantially 360 degrees of light near a point light source; when the LED filament according to the embodiment of the present invention is applied to a bulb lamp (for example, but not limited to, fig. 33 and 34), it can emit omni-directional light (omni-directional), which will be described in detail later.

As shown in fig. 21, the cross-sectional shape of the LED filament 100 of the present invention is rectangular, but the cross-sectional shape of the LED filament 100 is not limited thereto, and may also be triangular, circular, elliptical, polygonal, or rhombic, or even square, but the corners may be chamfered or rounded.

The LED chips 102 and 104 may be a single LED chip, two LED chips, or multiple LED chips, that is, equal to or greater than three LED chips. The shape of the LED chip may be, but is not limited to, a long strip shape, and the long strip shape may have fewer electrodes, so as to reduce the chance of shielding the light emitted from the LED. In addition, a layer of conductive transparent Indium Tin Oxide (ITO) may be plated on the surfaces of the LED chips 102 and 104, and the ITO layer facilitates uniform current diffusion and distribution of the LED chips and improves light emitting efficiency. Specifically, the ratio of the length to the width of the LED chips 102,104 may be set to 2:1 to 10:1, such as, but not limited to, 14x28 or 10x 20. In addition, the LED chips 102 and 104 may be high-power LED chips and then operated at a low current, so that the LED chips 102 and 104 can maintain sufficient brightness even though the current density is kept low, and the LED chips do not generate a large amount of heat sources, resulting in good overall light emitting efficiency.

The LED chips 102 and 104 may be sapphire substrates or transparent substrates, so that the substrates of the LED chips 102 and 104 do not shield the light emitted from the LED chips 102 and 104, i.e., the LED chips 102 and 104 can emit light from their peripheral surfaces.

The two or more LED chips 102,104 are electrically connected to each other, and in this embodiment, the LED chips 102,104 are electrically connected in series, but the electrical connection is not limited thereto, and may also be electrically connected in series after parallel, for example, but not limited to, each two LED chips 102,104 are connected in parallel before each other, and then the two chips 102,104 connected in parallel are connected in series.

The electrodes 110,112 are disposed corresponding to the LED chips 102,104 and electrically connected to the LED chips 102, 104. According to the present embodiment, the electrodes 110 and 112 are disposed at two ends of the LED chips 102 and 104 connected in series, and a portion of each of the electrodes 110 and 112 is exposed outside the light conversion layer 120. The manner of disposing the electrodes 110 and 112 corresponding to the LED chips 102 and 104 is not limited thereto, please refer to fig. 23 and 24, and fig. 23 and 24 are schematic diagrams of other embodiments of the corresponding disposition of the electrodes and the LED chips of the first embodiment of the LED filament according to the present invention. In fig. 23, it can be seen that the LED chips 102 and 104 are arranged in an inverted U shape, and the adjacent LED chips 102 and 104 are electrically connected in series, and the electrodes 110 and 112 are arranged at two ends of the U shape and are respectively electrically connected to the adjacent LED chips 102 and 104. Fig. 24 shows that the LED chips 102 and 104 are arranged in two parallel lines, and are electrically connected in series, respectively, and the electrodes 110 and 112 are disposed at two ends of the two parallel lines and are electrically connected to the adjacent LED chips 102 and 104, so as to form a series-connection-followed-by-parallel electrical connection. In the embodiment of fig. 24, two electrodes 110 and 112 are taken as an example, but not limited thereto, and 3 or 4 electrodes 110 and 112 may be adopted, for example, one of the electrodes 110 and 112 in the figure is replaced by two separate sub-electrodes, each of the two sub-electrodes is a positive electrode of a power supply, and the remaining electrodes 110 and 112 are grounded together. Alternatively, both electrodes 110,112 may be replaced by two sub-electrodes for different applications.

Referring to fig. 33, the electrodes 110 and 112 may have a through hole 111 and 113 (see fig. 21) in the exposed area thereof for providing electrical connection between the conductive brackets 14a and 14b when assembled in the LED bulb 10a, as will be described in detail later.

Referring to fig. 21 to 22, according to the present embodiment, the electrical connection is electrically connected to the adjacent LED chips 102 and 104 and the electrodes 110 and 112 through a wire 140, the wire 140 may be a gold wire, and the wire 140 may be connected to the adjacent LED chips 102 and 104 and the electrodes 110 and 112 by using a wire bonding process of LED packaging. The wire bonding process can be performed in a Q-type manner, as shown in fig. 22, the shape of the lead 140 is M-shaped, the M-shaped lead 140 makes the lead 140 in a non-tight state to provide a buffering effect, and when the LED filament 100 is bent, the lead 140 is not broken. The shape of the conductive wire 140 is not limited to M-shape, and any shape capable of alleviating tension can be used, such as S-shape. The M-shape is not intended to limit the shape of the conductive wire 140 to be M-shaped, but is intended to mean any shape that can provide a buffering effect, for example, when the length of the conductive wire 140 is longer than the length of the naturally arched bonding wire between two adjacent electrodes 110,112, i.e., the buffering effect can be provided, in which case the conductive wire 140 may have a shape with a plurality of wavy bends in the arched portion.

The light conversion layer 120 includes a gel and wavelength conversion particles, which are a silica gel 122 and a phosphor 124 in one embodiment, and the light conversion layer 120 covers the LED chips 102 and 104 and the electrodes 110 and 112, and exposes a portion of the two electrodes 110 and 112, respectively. In this embodiment, each of the six surfaces of the LED chips 102 and 104 is covered with the light conversion layer 120, i.e. the six surfaces are covered by the light conversion layer 120 and may be referred to as the light conversion layer 120 to wrap the LED chips 102 and 104, and this covering or wrapping may be, but is not limited to, direct contact, and preferably, in this embodiment, each of the six surfaces of the LED chips 102 and 104 is in direct contact with the light conversion layer 120. However, in practice, the light conversion layer 120 may cover only two surfaces of the six surfaces of each LED chip 102,104, i.e. the light conversion layer 120 directly contacts the two surfaces, and the two directly contacting surfaces may be, but are not limited to, the top surface or the bottom surface in fig. 22. Likewise, the light conversion layer 120 may directly contact both surfaces of the two electrodes 110, 112. The phosphor 124 may be a metal oxide phosphor 124, and the phosphor 124 has better thermal conductivity. The phosphor 124 may be harder than the silica gel 122, the particle size of the phosphor 124 may be about 1 to 30 micrometers (μm), or the phosphor 124 with a particle size of about 5 to 20 μm may be used, the same phosphor 124 has substantially the same size, and the cross-sectional area of the cross-section is different according to the position of the phosphor 124 dissected by the cross-sectional relationship shown in fig. 22. In other embodiments, the silicone rubber 122 may be a Polyimide resin, or a resin material instead of or in addition to a part of the Polyimide resin, or an additive to improve toughness and reduce cracking or embrittlement probability. It should be added that at least a portion of each of the six surfaces of the LED chips 102 and 104 directly contacts the light conversion layer 120 and/or one to two surfaces of the LED chips 102 and 104 are bonded to the light conversion layer through the die attach adhesive, which also belongs to the equivalent concept that the six surfaces are covered by the light conversion layer and/or the LED chips directly contact the light conversion layer. The solid crystal glue can be doped with fluorescent powder in other embodiments to increase the overall light conversion efficiency, and the solid crystal glue is also generally silica gel, which is different from silica gel used for mixing fluorescent powder in that the solid crystal glue is often mixed with silver powder or heat dissipation powder to improve the heat conduction effect.

The phosphors 124 in the light conversion layer 120 can absorb some form of radiation and emit light, e.g., the phosphors 124 absorb shorter wavelength light and emit longer wavelength light. In one embodiment, the phosphor 124 absorbs blue light and emits yellow light, and the yellow light is mixed with the unabsorbed blue light to form white light. In the embodiment where the light conversion layer 120 covers six surfaces of the LED chips 102 and 104, the phosphor 124 absorbs the shorter wavelength light emitted from each surface and emits the longer wavelength light, and since the phosphor 124 surrounds each outer surface of the LED chips 102 and 104 to form the body of the LED filament 100, each outer surface of the LED filament 100 can emit mixed light.

The composition ratio (composition ratio) of the phosphor 124 and the silica gel 122 is 1:1 to 99:1, preferably 1:1 to 50:1, and the ratio may be a weight ratio or a volume ratio. Referring to fig. 22, in this embodiment, the ratio of the phosphor 124 is greater than that of the silicone 122, so that the phosphor 124 density is increased and the phosphors 124 are in contact with each other, as shown by the straight line in fig. 22, the phosphors 124 arranged in contact with each other form a heat conduction path (as shown by the arrow in fig. 22), and further, the light conversion layer 120 has a heat conduction path formed by the adjacent and contacting phosphors 124, and the heat conduction path extends from the surface of the LED chips 102 and 104 to the outer surface of the LED filament 100, so that the heat generated by the LED chips 102 and 104 can be conducted to the outside of the light conversion layer 120, so that the LED filament 100 has a better heat dissipation effect, and the problem of yellowing is delayed by the light conversion layer 120. And the color-light conversion rate of the fluorescent powder 124 can reach 30% to 70%, so that the overall lighting effect of the LED bulb lamp can be improved, the hardness of the LED filament 100 can be increased, the flexibility of the LED filament 100 is improved, and the LED filament does not need to be supported by a frame additionally. In addition, after the general silicone rubber is formed, the surface of the silicone rubber is smooth, which is not conducive to the light generated by the LED chips 102 and 104 and the phosphor 124 to penetrate out. In this embodiment, since the ratio of the fluorescent powder 124 in the silica gel 122 is increased, the surface roughness of the LED filament 100 and the overall surface area of the filament can be effectively increased, that is, the overall heat dissipation area of the LED filament 100 is effectively increased, so that the LED filament 100 has a better heat dissipation effect. In addition, because the surface area of the whole LED filament 100 is increased, point light sources for light conversion of the fluorescent powder 124 on the surface of the filament are increased, and the whole luminous efficiency of the LED bulb lamp is further improved. In addition, the surface of the light conversion layer can be in various lens shapes to have different optical effects; or a gap is properly reserved in the light conversion layer, so that the heat dissipation can be improved.

Further, in the present embodiment, the LED chips 102 and 104 can be LED chips emitting blue light, the phosphor 124 may be a yellow phosphor (e.g., a Garnet series phosphor, YAG phosphor) to emit white light from the LED filament 100, and in practice, the ratio of the phosphor 124 to the silica gel 122 can be properly adjusted to make the spectrum of the white light more conform to the spectrum of the conventional incandescent lamp, and in addition, the phosphor 124 can also be a phosphor 124 capable of absorbing blue light and converting the blue light into yellow-green light or further matching red light, by having a large amount of phosphor 124 to adequately absorb the blue light emitted by the LED chips 102,104, the ratio of the different phosphors 124 can be adjusted to convert most of the blue light into yellow-green light, and a small portion of the blue light into red light, so that the overall luminous color temperature of the LED filament 100 is expected to be closer to 2400 to 2600K (the spectrum of a conventional incandescent lamp).

By properly adjusting the ratio of the phosphor 124 to the silica gel 122, the flexibility (deflections) of the LED filament 100 can be adjusted, i.e., the young's coefficient (Y) of the LED filament 100 can be in the range of 0.1 to 0.3 × 10¹⁰The Young's modulus of the LED filament 100 can be adjusted to 0.15-0.25 x10 between Pa (Pa) and considering the application of the bulb lamp¹⁰Pa (Pa), thereby improving the problem that the filament of the traditional LED bulb is easy to break, but still having enough rigidity and flexibility.

Please refer to fig. 25-26, fig. 25 is a schematic perspective partial cross-sectional view of a second embodiment of the LED filament according to the present invention; fig. 26 is a schematic partial cross-sectional view taken at the position 5-5 in fig. 25.

According to a second embodiment of the LED filament, the LED filament 200 comprises a plurality of LED chips 202, 204, at least two electrodes 210, 212, and a light conversion layer 220. The LED chips 202 and 204 are electrically connected to each other, and the electrodes 210 and 212 are disposed corresponding to the LED chips 202 and 204 and electrically connected to the LED chips 202 and 204. The light conversion layer 220 covers the LED chips 202 and 204 and the electrodes 210 and 212, and exposes a portion of each of the two electrodes 210 and 212, wherein the light conversion layer 220 includes a silica gel 222, nanoparticles (nanoparticles) 226, and a phosphor 224.

The oxide nanoparticles 226 may be (e.g., inorganic oxide nanoparticles) with a size of nanometer-scale particles smaller than the phosphor 224, and the material of the oxide nanoparticles may be, but not limited to, the oxide nanoparticles 226 with thermal conductivity, such as, but not limited to, aluminum oxide (Al) or aluminum oxide (Al) with thermal conductivity₂O₃) Silicon oxide (SiO)₂) Zirconium oxide (ZrO)₂) Titanium oxide (TiO)₂) And nano particles formed by materials such as calcium oxide (CaO), strontium oxide (SrO), barium oxide (BaO) and the like. These oxidic nanoparticles have an average size of about 10 to 300nm, with the majority of the particle sizes falling between 20 and 100 nm.

As can be seen in fig. 26, the addition of the nano-oxide particles 226 and the phosphor 224 to the silica gel 222, because the hardness and cost of the nano-oxide particles 226 are different from those of the phosphor 224, the proportions of the nano-oxide particles 226, the phosphor 224 and the silica gel 222 may vary depending on the cost, thermal conductivity and overall flexibility. Secondly, since the size of the oxidized nanoparticles 226 is smaller than that of the phosphor 224, the oxidized nanoparticles 226 can fill up the gaps between the phosphor 224 particles, increase the contact area between the phosphor particles, and form more heat conduction paths, as shown by the straight lines in fig. 26, thereby improving the overall heat conduction effect of the LED filament 200. Meanwhile, the oxidized nanoparticles 226 can also deflect and scatter light, thereby improving the color light conversion efficiency of the phosphor 224 and sufficiently and uniformly mixing light, so that the light emitting characteristics of the LED filament 200 are better.

In other embodiments, the phosphors are uniformly distributed in the Polyimide, or resin material, and in the best case, each phosphor is covered by the Polyimide, or resin material, so as to solve the problem of cracking or embrittlement of the phosphor layer. In practical applications, it is difficult to achieve that each phosphor is coated and/or a portion of the silica gel is still doped in the Polyimide or other resin material. In such a case, it should still be considered as under the equivalent concept that the phosphor is coated with Polyimide, or otherwise referred to as a resin material.

The LED filament 200 further includes a plurality of circuit films 240 (also referred to as light-transmitting circuit films), the LED chips 202 and 204 and the electrodes 210 and 212 are electrically connected to each other through the circuit films 240, and the light-converting layer 220 covers the circuit films 240.

The LED filament may be a hard filament (e.g., shore hardness may be greater than D50, young's modulus may be between 0.02 and 20x10⁹Between pa) or soft filament (e.g., shore hardness may be less than D50, and young's modulus may be between 0.1 and 0.3x10¹⁰Between pascals). When applying the filament to the filament assembly in fig. 3, the two electrodes 110 and 112 in fig. 21 can be replaced by the first connection portion 512 and the second connection portion 513, in which case the electrode 511A and the electrode 511B are electrically connected to the filament, and preferably, at least a portion of the electrode 511A and the electrode 511B can be embedded in the filament. In this case, since the requirement for the support property is higher than the flexibility, it is preferable that the hardness of the filament is higher than D50 by the selection of the glue or by the baking process.

Referring to fig. 27A, fig. 27A is a schematic view of a circuit film of an LED filament according to a first embodiment of the present invention. The circuit film 240 includes a first film 242 and a conductive trace 244 on a surface of the first film. The first film 242 may be, but is not limited to, a thin film, and for convenience of description, the first film 242 will be described as an example, but the first film 242 of the present invention is not limited to only a thin film. In this embodiment, the conductive traces 244 are in the form of strips and are respectively arranged in parallel. The conductive lines 244 may also be in different forms, for example, as shown in the second embodiment of the circuit film in fig. 28A, the circuit film 240a includes a thin film 242a and conductive lines 244a, wherein the conductive lines 244a are distributed on the thin film 242a in a diagonal parallel line mode, and the distance between each two adjacent conductive lines may be smaller than or equal to 70 μm, so as to have better electrical characteristics. In the third embodiment of the circuit film shown in fig. 29A, the circuit film 240b includes a thin film 242b and conductive traces 244b, wherein the conductive traces 244b are distributed on the thin film 242b in a staggered grid pattern, and have a line width of about 10 μm and a thickness of about 2 μm. The shape of the conductive traces 244, 244a, 244b is not limited as long as electrical connection between the LED chips 202, 204 or between the LED chips 202, 204 and the electrodes 210, 212 can be achieved.

The material of the Film 242 may be, but is not limited to, a Polyimide Film (PI Film) having a transmittance of about 92% or more. The conductive traces 244 on the film 242 can be made of, but not limited to, Indium Tin Oxide (ITO), nano-silver wire circuit, metal mesh, or carbon nanotube. For the light emission of the LED chip, silver (Au) itself has a very good reflection effect and does not absorb light, and the nano silver wire forms a network-shaped subsection with a nanometer-scale line width and has both low resistance and high light transmission characteristics, so the nano silver wire is very suitable for the conductive lines 244, 244a, and 244 b. In order to increase the adhesion effect between the silver nanowires and the electrodes of the LED chip, the silver nanowires can be doped with gold (Au).

The circuit film 240 can be fabricated by forming a conductive trace 244 on a film 242; next, a slot 246 is formed on the film 242 having the conductive trace 244.

Referring to fig. 27A, since the conductive traces 244 on the circuit film 240 do not cover the entire surface of the circuit film 240, the light emitted from the LED chips 202 and 204 is not shielded or absorbed by the conductive traces 244. The LED filament 100 of the first embodiment is electrically connected by gold wires, while the LED filament 200 of the second embodiment is electrically connected by the circuit film 240, and the circuit film 240 has the advantages of wider line width, better flexibility, and less breakage compared with the conductive wires 140.

The electrical connection between the circuit film 240 and the LED chips 202 and 204 and the electrodes 210 and 212 can be achieved by pre-coating a conductive adhesive, such as silver paste, solder paste or conductive adhesive doped with conductive metal particles, on the positions of the chips 202 and 204 and the electrodes 210 and 212 to be electrically connected, and heating or irradiating with UV light after the circuit film 240 is disposed.

Please refer to fig. 30A to 30E, which are schematic diagrams illustrating a method for manufacturing an LED filament 200 according to a first embodiment of the present invention. The manufacturing method of the LED filament comprises the following steps:

s20: disposing the LED chips 202 and 204 and the at least two electrodes 210 and 212 on the carrier 280 (see fig. 30A);

s22: electrically connecting the LED chips 202 and 204 and the electrodes 210 and 212 (see fig. 30B); and

s24: a light conversion layer 220 is disposed on the LED chips 202 and 204 and the electrodes 210 and 212, wherein the light conversion layer 220 covers the LED chips 202 and 204 and the electrodes 210 and 212 and exposes a portion of at least two of the electrodes 210 and 212, and the light conversion layer 220 includes a silicon gel 222 and a phosphor 224 (see fig. 30C to 30E).

In step S20, the LED chips 202 and 204 are arranged in a rectangular array (as shown in fig. 30A), so that after the manufacturing process is completed, the single LED filament 200 can be formed separately. When configuring the LED chips 202 and 204, the corresponding serial-parallel connection configuration of the positive and negative electrodes is considered in the subsequent electrical connection. The carrier 280 may be, but not limited to, a glass substrate or a metal substrate. The carrier may be shaped as a flat plate as shown in fig. 30A, or as a plate with grooves as shown in fig. 31, which can be used to dispose the base layer 120 b.

In the electrical connection of step S22 (see fig. 30B), in this embodiment, the uncut circuit film 240a in fig. 28A is taken as an example to electrically connect the LED chips 202 and 204 and the electrodes 210 and 212. In addition, the uncut circuit films 240 and 240b shown in fig. 27A or 29A may be used for electrical connection, or the wires 140 shown in fig. 24 may be used for electrical connection.

In step S24, the light conversion layer is disposed on the LED chips 202 and 204 and the electrodes 210 and 212, and the actual operation can be performed in a variety of different manners, which is first described with reference to fig. 30C to 30E, and includes:

s240: coating a light conversion layer (top layer 220a) on the side of the LED chips 202 and 204 and the electrodes 210 and 212 not contacting the carrier 280;

s242: turning over the LED chips 202 and 204 and the electrodes 210 and 212 coated with the light conversion layer (top layer 220 a); and

s244: a light conversion layer (base layer 220b) is coated on the other side of the LED chip and the electrode not coated with the light conversion layer.

Here, for convenience of description and distinction, the light conversion layer 220 at step S240 is named as a top layer 220a, and the light conversion layer 220 at step S244 is named as a base layer 220 b.

In step S240, after the top layer 220a is coated on the LED chips 202 and 204 and the electrodes 210 and 212, the silicone 222 and the phosphor 224 fill the gaps between the LED chips 202 and 204 and the electrodes 210 and 212, and then the LED chips 202 and 204 and the electrodes 210 and 212 coated with the top layer 220a are cured (or solidified) to solidify the top layer and coat the LED chips 202 and 204 and the electrodes 210 and 212 above the carrier, and at least two of the electrodes 210 and 212 are exposed. Such as, but not limited to, heat, or Ultraviolet (UV) radiation.

In the step S242, there are several ways to flip the LED chips 202 and 204 and the electrodes 210 and 212 coated with the light conversion layer (top layer 220a), one of which is that the LED chips 202 and 204 and the electrodes 210 and 212 are only disposed on the carrier 280 without adhesion, and the LED chips can be directly flipped over, and the flipped over semi-finished product can be placed on the carrier.

Alternatively, a glue material, such as a photoresist used in semiconductor manufacturing or a die attach adhesive that is easily removed, may be provided between the carrier 280 and the LED chips 202 and 204 and the electrodes 210 and 212, and the glue material may be baked to temporarily fix the LED chips 202 and 204 and the electrodes 210 and 212 on the carrier 280. Therefore, before or after the LED chips 202 and 204 and the electrodes 210 and 212 coated with the top layer 220a are turned over, the photoresist coated on the substrate may be cleaned with acetone, or the die attach adhesive on the substrate may be removed with a corresponding solvent, so that the LED chips 202 and 204, the electrodes 210 and 212 coated with the top layer 220a and the carrier 280 may be separated to form a semi-finished LED filament (see fig. 30D). In addition, the LED filament semi-finished product can be further cleaned to remove residual photoresist or die bond glue.

Finally, in step S244, a light conversion layer (base layer 220b) is coated on the other side of the LED chips 202 and 204 and the electrodes 210 and 212 not coated with the light conversion layer 220a, and the base layer 220b is cured (see fig. 30E).

The top layer 220a in fig. 30C is slightly larger than the uncut circuit film 240a, but the implementation is not limited thereto. While the top layer 220a and the base layer 220b in fig. 30E are slightly the same size (due to the overlapping relationship), the implementation is not limited thereto, and the sizes thereof may be different according to the needs.

After step S24, step S26 of cutting the LED chips 202 and 204 and the electrodes 210 and 212 covering the light conversion layer may be further included, i.e., at the cutting positions as drawn by the dashed lines in fig. 30E, so that the cut strip assembly is the LED filament 200. The cutting method of step S24 is not limited to fig. 30E, and each two adjacent columns of LED chips 202 and 204 may be cut into a single LED filament.

The corresponding relationship between the uncut circuit films 240, 240a, 240B attached to the LED chips 202, 204 and the electrodes 210, 212 in fig. 27A, 28A and 29A can be seen in fig. 27B, 28B and 29B, respectively, where the dotted lines are cut lines for the following detailed description.

In the processes of fig. 30A to 30E, the LED chips 202 and 204 are arranged in a rectangular array, but the manufacturing method is not limited thereto, and the LED chips 202 and 204 may be arranged in a single column in the step S20, so that the cutting process of the step S26 is not required.

Referring to fig. 31, a method for manufacturing the LED filament 200 according to a second embodiment includes:

S20A: coating a light conversion layer (base layer 120b) on the carrier 180;

S20B: disposing the LED chips 102 and 104 and the electrodes 110 and 112 on the light conversion layer (the base layer 120b) on the carrier 180;

s22: electrically connecting the LED chips 102,104 with the electrodes 110, 112; and

s24: a light conversion layer (top layer 120a) is coated on the LED chips 102 and 104 and the electrodes 110 and 112 at a side not contacting the light conversion layer (base layer 120b), wherein the light conversion layer 120 covers the LED chips 102 and 104 and the electrodes 110 and 112 and respectively exposes a portion of the two electrodes 110 and 112, and the light conversion layer 120 comprises a silica gel 122 and a phosphor powder 124.

As can be seen from fig. 31, a base layer 120b is first disposed on the carrier 180, and the base layer 120b is also a part of the light conversion layer, i.e. includes the silica gel 122 and the phosphor 124, in the manufacturing method, although the base layer 120b is first disposed on the carrier 180, this is not a limitation, and in the implementation, the LED chips 102 and 104 and the electrodes 110 and 112 of the step S20B can be directly disposed on the base layer 120b without using the carrier 180.

The thickness of the base layer 120b may be 50 to 100 micrometers (μm), and the thickness may be 60 to 80 μm depending on the ratio of the phosphor 124 to the silica gel 122. After step S20, the base layer 120b may be slightly cured by heating or UV light irradiation, and after cooling and condensation, the LED chips 102 and 104 and the electrodes 110 and 112 are adhered and fixed on the base layer 120 b. In addition, die attach adhesives may be used to attach the LED chips 102 and 104 and the electrodes 110 and 112 to the base layer 120 b.

After completing the electrical connection of S22, S24 may be directly performed to dispose the top layer 120a on the side of the LED chips 102 and 104 and the electrodes 110 and 112 not contacting the base layer 120b, and the top layer 120a is cured. In this way, the flipping step or the step of removing the colloidal material adhering the carrier 180, the LED chips 102 and 104, and the electrodes 110 and 112 can be omitted.

According to the embodiment of FIG. 31, after step S24, step S26 may be performed to cut the LED chips 102,104 and the electrodes 110,112 covering the light-converting layer.

The base layer 120b is used to carry the LED chips 102 and 104 and the electrodes 110 and 112, and has a thickness of 0.5 to 3mm (millimeter) or 1 to 2mm, and after the configuration is completed, the base layer can be heated appropriately to slightly melt the surface of the base layer 120b, so that the LED chips 102 and 104 and the electrodes 110 and 112 can be adhered and fixed after the base layer 120b is cooled and condensed.

Next, the doping ratio of the phosphor 124 and the silica gel 122 of the base layer 120b may be appropriately adjusted so that the hardness thereof is suitable for the subsequent electrical connection process, for example, but not limited to, the hardness after doping and curing may be above shore Hardness (HS)60 HD. Therefore, in addition to making the entire LED filaments 100,200 have appropriate hardness, the stability of the wire (gold wire) bonding process can be improved, and after the finished product is completed, the LED filaments 100,200 can maintain good electrical connection no matter whether pressed or bent.

In the embodiment of fig. 31, the base layer 120b is required to carry the LED chips 102 and 104 and the electrodes 110 and 122, and thus the hardness after curing or before curing is required to be properly designed to facilitate the subsequent electrical connection (for example, during wire bonding, the harder base layer 120b is required to support the LED chips 102 and 104 and the electrodes 110 and 122), while the top layer 120a is not required to be designed to be so that the ratio of the silica gel 122 to the phosphor 124 of the top layer 120a and the base layer 120b can be different, and can be changed according to the overall design requirements. Of course, in the embodiment of fig. 31, the light conversion layer 120 may also include the aforementioned nano-oxide particles 224 (not shown).

Next, please refer to fig. 32A to 32E, which are schematic diagrams illustrating a method for manufacturing an LED filament according to a third embodiment of the present invention.

The third embodiment of the LED filament manufacturing method comprises the following steps:

s202: disposing the conductive foil 130 on the light conversion layer (the base layer 120b) (as shown in fig. 32A);

s204: disposing the LED chips 102 and 104 and the electrodes 110 and 112 on the conductive foil 130 (as shown in fig. 32B);

s22: electrically connecting the LED chips 102 and 104 with the electrodes 110 and 112 (as shown in fig. 32C); and

s24: a light conversion layer (top layer 120a) is coated on the LED chips 102 and 104 and the electrodes 110 and 112 without contacting the conductive foil 130, wherein the light conversion layer 120 covers the LED chips 102 and 104 and the electrodes 110 and 112 and respectively exposes a portion of the two electrodes 110 and 112, and the light conversion layer 120 includes a silica gel 122 and a phosphor 124.

Referring to fig. 32A, in step S202, as mentioned above, the light conversion layer may be referred to as a base layer 120b, and the conductive foil 130 may have a plurality of openings (132), the width of the openings 132 is smaller than the length of the LED chips 102 and 104, and the openings 132 respectively correspond to the light emitting areas of the LED chips 102 and 104, so that the LED chips 102 and 104 are not shielded by the conductive foil 130 when being driven to emit light.

The conductive foil 130 may be a copper foil with a silver-plated surface, but not limited thereto, and the opening 132 may be formed by stamping on the conductive foil 130.

Before step S202, a step may be added, that is, the base layer 120b is disposed on a carrier, or the base layer 120b is directly disposed on a workbench.

In step S204, please refer to fig. 32B, in which the LED chips 102 and 104 and the electrodes 110 and 112 are disposed on the conductive foil 130, as described above, the light emitting regions of the LED chips 102 and 104 can be corresponding to the openings 132 of the conductive foil 130.

Referring to fig. 32C, the electrical connection of step S22 is performed by wire bonding in the present embodiment, and two ends of each conductive wire (e.g., gold wire) are connected to the conductive foil 130 and the adjacent LED chips 102 and 104 or the adjacent electrodes 110 and 112 to form an electrical connection, in the present embodiment, the electrical connection is performed in series.

Please refer to fig. 32D. As in the embodiment of fig. 31, the light conversion layer in step S24 is referred to as the top layer 120a, and when the top layer 120a is disposed on the LED chips 102 and 104 and the electrodes 110 and 112, the material of the top layer 120a (the silicone 122 and the phosphor 124) can be filled into the gap under the chips.

The top layer 120a may be configured by directly coating the LED chips 102 and 104 and the electrodes 110 and 112 with the phosphor powder 124 and the silica gel 122 in a well-proportioned ratio, or by coating a phosphor powder layer on the LED chips 102 and 104 and the electrodes 110 and 112, then coating the silica gel, and then performing a curing process. In another way, the phosphor and the silica gel are alternatively coated (or sprayed) on the LED chips 102 and 104 and the electrodes 110 and 112 in multiple layers, so that a more uniform distribution effect can be obtained.

After step S24 is completed, a cutting procedure may be performed to cut off each LED filament 100, as shown in fig. 32E.

In the embodiment shown in fig. 32A to 32E, the electrical connection between the LED chips 102 and 104 and the electrodes 110 and 112 is completed by the metal foil 130 and the wires 140, so that the connection relationship between the LED chips 102 and 104 and the electrodes 110 and 112 is more flexible, and the electrical connection relationship is not easily broken when the entire LED filament 100 is bent.

Finally, please refer to fig. 33 and 34, which are schematic structural diagrams of the first and second embodiments of the LED bulbs 10a and 10b using the LED filament. As can be seen, the LED bulb 10a, 10b includes a lamp housing 12, a base 16, at least two conductive supports 14a, 14b disposed in the lamp housing 12, a driving circuit 18 disposed in the base, and a single LED filament 100.

The conductive supports 14a and 14b are used to electrically connect the two electrodes 110 and 112 of the LED filament 100, and also can be used to support the weight of the LED filament 100. The driving circuit 18 is electrically connected to the conductive brackets 14a and 14b and the lamp head 16, when the lamp head 16 is connected to a lamp socket of a conventional bulb lamp, the lamp socket provides power to the lamp head 16, and the driving circuit 18 is used for driving the LED filament 100 to emit light after receiving power from the lamp head 16. Since the LED filament 100 can emit light over the entire circumference, the entire LED bulbs 10a and 10b can generate the above-described light over the entire circumference.

The definition of full-circle light as described herein may vary over time depending on the country's specifications for a particular light bulb, and thus, the examples of full-circle light described in this disclosure are not intended to limit the scope of the present invention. The definition of full-circle light, such as the light shape of a bulb (full-circle light bulb) according to the american Energy Star Program for Lamps (LightBulbs), is defined by arranging the bulb with the base up and the bulb down, vertically up at 180 degrees and vertically down at 0 degrees, which requires that the luminance (cd) at each angular position between 0 and 135 degrees should not differ from the average luminance by more than 25%, while the total luminous flux (lm) between 135 and 180 degrees should account for at least 5% of the total light. For another example, JEL 801 specifications in japan require LED lamps in the 120 degree range, which require less than 70% of the total luminous flux.

In the present embodiment, two conductive supports 14a and 14b are illustrated, but not limited to this, and the number of the conductive supports can be increased according to the conductive or supporting requirement of the LED filament 100.

The lamp envelope 12 may be a lamp envelope with improved light transmission or improved thermal conductivity, such as, but not limited to, a glass or plastic lamp envelope. In practice, the lamp housing 12 may be doped with a golden yellow material or the surface of the lamp housing is plated with a yellow film to absorb a proper amount of blue light emitted from the LED chips 102 and 104, so as to adjust the color temperature of light emitted from the LED bulbs 10a and 10 b. In production, the gas in the lamp housing 12 can be replaced by nitrogen, or a mixture of nitrogen and helium, or hydrogen and helium (in a proper mixing ratio) by a vacuum pump, so that the heat conduction of the air in the lamp housing 12 is better, and the moisture in the air in the lamp housing is removed. The air filled in the lamp housing 12 may be at least one selected from the group consisting of helium and hydrogen, the volume percentage of hydrogen in the total volume of the lamp housing 12 may be 5% to 50%, and the gas pressure in the lamp housing 12 may be 0.4 to 1.0 atm.

In the embodiment of fig. 33 and 34, the LED bulb 10a and 10b further include a stem 19 and a heat dissipation assembly 17, the stem 19 is disposed in the envelope 12, the heat dissipation assembly 17 is located between the base 16 and the envelope 12 and connects the stem 19, and the LED filament 100 is connected to the stem 19 via the conductive brackets 14a and 14 b. The stem 19 can be used for exhausting the gas in the LED bulb 10b and providing a heat conducting function, and the heat dissipation assembly 17 connects the stem 19 and the base 16 and conducts the heat conducted by the stem 19 and the base to the outside of the LED bulb 10 b. The heat dissipation assembly 17 is located between the lamp cap 16 and the lamp housing 12 and is connected with the stem 19, and the LED filament 100 is connected with the stem 19.

The stem 19 of the LED bulb 10a, 10b can be made of metal or ceramic with good heat conduction effect, the ceramic material can be alumina or aluminum nitride, and the thermal radiation absorption rate is far higher than that of glass, so that the heat emitted by the LED filament 100 can be more effectively absorbed, when the heat is conducted out of the LED bulb 10b for practical operation, the air inside the lamp housing 12 can be pumped and changed into full nitrogen or mixed with nitrogen and helium or mixed with hydrogen and helium at a proper ratio by the vacuum pump through the stem 74, so as to improve the heat conductivity of the gas in the lamp housing 12, and meanwhile, the water mist hidden in the air is also removed. The heat dissipation assembly 17 may be a hollow cylinder surrounding the open end of the lamp housing 12, and the material of the heat dissipation assembly may be metal, ceramic or high thermal conductivity plastic with good thermal conductivity. The heat dissipation assembly 17 (together with the screw of the LED bulb) may also be made of a ceramic material with a good heat conduction effect, and the heat dissipation assembly 17 may also be an integrally formed assembly with the ceramic stem 19, so that the screw of the LED bulb 10b needs to be glued with the heat dissipation assembly 17 to increase the thermal resistance of the heat dissipation path of the LED filament 100, and a better heat dissipation effect is achieved.

Referring to fig. 33, the height of the heat dissipation assembly 17 is L1, the height from the bottom of the heat dissipation assembly 17 to the top of the lamp housing 12 is L2, and the ratio of L1 to L2 (L1/L2) ranges from 1/30 to 1/3. The smaller the ratio, the larger the light-emitting angle of the LED bulb lamps 10a and 10b is, the less the light emitted by the LED bulb lamps 10a and 10b is shielded by the heat dissipation assembly 17 is, and the closer the distribution of the light emitted by the LED bulb lamps 10a and 10b is to the total light.

In the embodiment of fig. 33, the LED filament 100 is bent to form a 270 degree circle, and the body of the LED filament 100 is raised and recessed in a wave shape, so as to maintain the wave shape, the LED bulb 10b further includes a cantilever 15 to support the wave-shaped body peaks and valleys of the LED filament 100, so that the LED bulb 10b can provide full-wave illumination more easily through the LED filament that is bent properly, and in addition, the integrated LED filament structure is simpler and more convenient in processing and assembling process, and the cost is also reduced greatly. In the embodiment of fig. 34, the arc angle of the arc formed by the LED filament 100 is about 270 degrees, but in other embodiments, the arc angle formed by the LED filament 100 may be approximately 360 degrees, or a single LED bulb 10b may comprise at least two LED filaments 100, with each LED filament 100 bent to form an arc angle of about 180 degrees, such that the two LED filaments 100, when properly configured, form an arc angle of about 360 degrees.

In some embodiments, the cantilever 15 and/or the stem 19 may be coated with a material of a highly reflective nature, such as, but not limited to, a white material. In addition, in consideration of heat dissipation characteristics, the material with high reflection property may be selected from materials with high heat radiation absorption characteristics, such as but not limited to Graphene (Graphene), in other words, the surface of the cantilever 15 and/or the stem 19 may be coated with a Graphene film.

Referring to fig. 35A and 37, fig. 35A is a schematic perspective view of a third embodiment of an LED bulb; fig. 36E, 36L and 36N are schematic perspective views of a fourth, fifth and sixth embodiment of an LED bulb, respectively; fig. 37 is a schematic perspective view of a seventh embodiment of an LED bulb. According to the third embodiment, the LED bulb 10c includes a lamp housing 12, a base 16 connected to the lamp housing 12, at least two conductive brackets 14a and 14b disposed in the lamp housing 12, a driving circuit 18, a cantilever 15, a stem 19, and a single LED filament 100. The driving circuit 18 is electrically connected to the conductive brackets 14a, 14b and the lamp head 16. The LED bulb lamp of the fourth to sixth embodiments is similar to the third embodiment, and the LED bulb lamp 10d of the seventh embodiment includes two LED filaments 100a and 100b, wherein the two LED filaments 100a and 100b are bent to be approximately circular (complete or ring-shaped with a gap) when viewed from the top, and the two LED filaments 100a and 100b are located at different vertical heights when viewed from the side.

The cross-sectional area of the LED filaments 100, 100a, 100b is smaller than the cross-sectional area of the filament 100 in the embodiment of fig. 33,34, the electrodes 110,112 of the LED filaments 100, 100a, 100b are electrically connected to the conductive legs 14a, 14b, to receive power from the driving circuit 18,

similar to the second embodiment of fig. 33 and 34, the LED filaments 100, 100a, 100b of fig. 35 and 37 are bent to be circular when viewed from the top, and the LED filaments 100, 100a, 100b can also be bent to be wavy (when viewed from the side), so that the wavy structure not only has novel appearance, but also ensures the LED filaments 100, 100a, 100b to emit light uniformly. Meanwhile, compared with a plurality of LED filaments connected with the conductive supports 14a and 14b, the single LED filament 100 needs fewer joint points, and in practice, the single LED filament 100 only needs two joint points as shown in FIG. 35, so that the risk of poor welding is effectively reduced or the process of mechanical compression connection is reduced. In one embodiment (see fig. 35B), the LED filament may be bent to have a wave shape when viewed from above to surround the center or stem of the bulb. In various embodiments, the LED filament, viewed from above in plan, may be circular-like or U-like. The stem 19 further has a vertical rod 19a extending vertically to the center of the lamp housing 12, a first end of each cantilever 15 is connected to the vertical rod 19a, and a second end of each cantilever 15 is connected to the LED filament 100, 100a, 100b, referring to fig. 36A, fig. 36A is a cross-sectional partial enlarged schematic view of a dotted circle portion in fig. 35A, the second end of each cantilever 15 has a clamp portion 15A, the clamp portion 15A fixes the LED filament 100, 100a, 100b, the clamp portion 15A can be used to fix the wavy peaks or valleys of the LED filament 100, 100a, 100b, but not limited thereto, that is, the clamp portion 15A can also be used to fix the portions between the wavy peaks and valleys of the LED filament. The shape of the pincer 15a may match the profile of the cross-section of the LED filament 100, 100a, 100b, and the size of the inner hole of the pincer 15a may be slightly smaller than the size of the profile of the cross-section of the LED filament 100, 100a, 100b, so that the LED filament 100, 100a, 100b may be inserted through the inner hole (not numbered) of the pincer 15a to form a tight fit during manufacturing. The other fixing method is to form the pincer portion through a bending procedure, and further, the LED filaments 100, 100a, 100b are firstly placed at the free ends of the cantilevers 15, and then the free ends are bent around the LED filaments 100, 100a, 100b by using a jig to form the pincer portion 15 a. In various embodiments, the second end of the cantilever 15 may extend directly into the interior of the LED filament 100 and become an auxiliary strip in the LED filament 100 to enhance the mechanical strength of the LED filament 100, as described later.

The cantilever 15 may be made of, but not limited to, carbon spring steel to provide suitable rigidity and elasticity, so as to reduce the impact of external vibration on the LED filament and ensure that the LED filament is not easily deformed. Because the vertical rod 19a extends to the center of the lamp housing 12, and the cantilever 15 is connected to the vicinity of the top end of the vertical rod 19a, the vertical height of the LED filament 100 is close to the center of the lamp housing 12, so the light-emitting characteristic of the LED bulb lamp 10c is close to the light-emitting characteristic of the conventional bulb lamp, the light emission is more uniform, and meanwhile, the light-emitting brightness can also reach the brightness level of the conventional bulb lamp. In addition, in this embodiment, the first end of the cantilever 15 of the LED filament 100 is connected to the vertical rod 19a of the stem 19, and the second end of the cantilever 15 is connected to the outer insulating surfaces of the LED filaments 100, 100a, and 100b through the clamp portion 15a, so that the cantilever 15 is not conductive, thereby avoiding thermal expansion and contraction of the metal wire in the cantilever 15 caused by heat generation of the passing current when the cantilever is conductive, and avoiding burst of the glass stem 19.

The connection between the electrodes 110,112 and the conductive brackets 14a, 14b may be a mechanical press connection or a welding connection, and the mechanical connection may be made by passing the conductive brackets 14a, 14b through the through holes 111, 113 of the electrodes 110,112 and then bending the free ends of the conductive brackets 14a, 14b such that the conductive brackets 14a, 14b clamp the electrodes 110,112 and form an electrical connection. The solder connections may be made by soldering the conductive brackets 14a, 14b to the electrodes 110,112 using silver-based solder, silver solder, or the like. In addition, similar to the relationship between the suspension arm 15 and the filament 100 in fig. 36A, the electrode of the filament and the conductive support and the filament may also be fixed by forming a clamp portion on one of the conductive support (not shown) or the electrode (as shown in fig. 36C) in the manner of fig. 36A. Further, as shown in fig. 36B, the electrode 5061 may be hook-shaped to facilitate bonding to a conductive support. In one embodiment, as shown in fig. 36D, the filament has a groove 5066 for receiving an electrode to receive an electrode 5064, so that the electrode is hidden in the filament body but not exposed, thereby achieving a better light emitting effect.

In one embodiment, the lamp shown in fig. 35A may be an a-size lamp. The distance between two contact points of the two conductive supports and the LED filament 100, i.e. the two end electrodes of the filament, on the horizontal projection plane can be within 3 cm, preferably within 2 cm. Due to the wavy surrounding of the filament, the filament lamp can achieve the effect of full-circle light, and can also achieve the effect that two contact points are close to each other, so that the conductive support is substantially positioned below the filament, and is not too glaring visually and can form a beautiful curve with the filament integrally. The distance between the highest point and the lowest point of the filament wave is 2.2-3.8 cm, preferably 2.2-2.8 cm when viewed from the side. Thereby ensuring a certain heat dissipation space above the filament.

As shown in fig. 35A, the filament shape can be roughly regarded as a curve equation: the filament spatial position is in the cartesian coordinate system shown in fig. 35A; the x-y plane is located at the top plane of the stem 19a (when the bulb has no stem/stem, the origin can be considered as the center point of the spherical portion of the spherical bulb), and is perpendicular to the height direction of the LED bulb 10 c. Two filament electrodes (namely welding points, namely the contact points or the welding points) are symmetrically distributed on two sides of the y axis; the z-axis is coaxial with the stem (or the planar central axis of the LED bulb 10 c). The shape of the LED filament 100 varies in the x, y and z directions according to t (t is a variable between 0 and 1), i.e. the position of any point of the LED filament in the x, y, z coordinate system is X, Y, Z and satisfies the curve equation as follows:

X＝m1*cos(t*360)；

Y＝m2*sin(t*360)；

Z＝n*cos(t*360*k)；

the LED filament 100 varies in X, Y and Z directions as a function of t, when X is 0, i.y | max (maximum value of | Y |) -m 2, i.z | max (maximum value of | Z |) -n; when Y is 0, X max (maximum value of X) is m1, Z max is n; when Z is 0, X is m1, Y is m 2; m1 represents the length in the X direction, 24. ltoreq. m 1. ltoreq.27 (unit mm); m2 represents the length in the Y direction, 24. ltoreq. m 2. ltoreq.27 (unit mm); so that the filament is in an environment in the bulb shell and has good luminous flux, n represents the height of the filament from the highest point to an x-y plane in the z direction, n is more than 0 and less than or equal to 14 and is unit mm; under the condition, the filament turning point is less prone to generate the condition of gold wire fracture; k represents the number of the highest points, and in order to avoid that the more the support rods (or the cantilevers/transverse auxiliary strips) are, the processing is not facilitated, the value of K is set to be more than or equal to 2 and less than or equal to 8. The curve described by the above equation can be regarded as the basis of the spatial distribution of the filament. Under certain process and equipment conditions, the actual filament configuration will have a spatial difference of 0 to 25% from that described by the curve equation. And in the filament region with the pivot point, it can be the relative highest or relative lowest value of the Z-axis, and its relative spatial difference is small, perhaps considered to be 0 to 20%. Or when the radius of the lamp shell is r, the r is the value when the radius of the circular cross section formed by continuously cutting from the bottom of the lamp shell upwards is the maximum, and the values of m1, m2 and n are set to be 0.8r to 0.9 r; m2 is more than or equal to 0.8r and less than or equal to 0.9 r; n is more than 0 and less than or equal to 0.47 r. And furthermore, when the radius of the lamp holder interface is a value p and the filament length G is used, the filament length is between 1.2 x p and G and 5.6 r. By this setting, the filament length/LED chip required can be kept within the minimum range while maintaining the above-described effects, and not only filament material is saved, but also temperature rise in the bulb is suppressed.

In another embodiment, as shown in fig. 35B, the projection of the filament on the x-y plane can be regarded as a quasi-circle, if the distance from the center point to the plane projection point of the filament can be regarded as the filament projection distance r, the included angle of the arc formed by the filament plane projection can be regarded as θ, and the projection point of one end of the filament (i.e., the projection point of one of the filament electrodes) can be regarded as θ ═ 0. The arc angle theta is about 180-360 deg., and in some embodiments, the filament can be adjusted through the Z-axis height to form an arc of >360 deg.. The filament projection radius r may vary by + -20% depending on different process and equipment, and can be roughly regarded as a circle if the projection points are connected. Furthermore, the variation of the filament in the Z-axis and its relation to θ can be roughly considered as the function Z ═ nXcos (k θ + pi), n represents the height of the filament vertex from the x-y plane in the Z direction; n is more than 0 and less than or equal to 14 and the unit mm; k represents the number of the highest point positions, K is more than or equal to 2 and less than or equal to 8, and the variation of +/-20 percent can be caused according to different processes and equipment manufacturing processes.

Furthermore, since the inner shape (hole shape) of the pincer portion 15a is matched with the outer shape of the cross section of the LED filament 100, the cross section of the LED filament 100 can be oriented to a specific orientation by proper design, and as shown in fig. 36A, the top layer 120a of the LED filament 100 is fixed to be oriented to about 10 o' clock direction of the drawing, so as to ensure that the light emitting surfaces of the entire LED filament 100 are along the same direction, and ensure that the light emitting surfaces of the LED filament 100 are visually consistent. If the LED chips in the LED filament 100 are arranged in a straight line, a surface of the top layer 120a away from the base layer 120b is a primary light emitting surface, and a surface of the base layer 120b away from the top layer 120a is a secondary light emitting surface, and the primary light emitting surface and the secondary light emitting surface are opposite to each other. The main light-emitting surface is the surface with the most light passing through when the LED filament 100 emits light; the secondary light emitting surface is a surface through which light passes more times when the LED filament 100 emits light. In the present embodiment, a conductive foil 130 is formed between the top layer 120a and the base layer 120b for electrically connecting the plurality of LED chips, but is not limited thereto. In the present embodiment, the LED filament 100 meanders but its main light emitting surface is kept outward, that is, any section of the main light emitting surface faces the lamp housing 12 or the lamp cap 16 at any angle, and the secondary light emitting surface faces the stem 19 (or faces the top end of the stem 19, that is, the secondary light emitting surface is kept inward), so that when the LED filament 100 emits light, the LED bulb 10c can generate a full-cycle light with a light emitting effect close to 360 degrees as a whole.

Referring to fig. 36E, fig. 36E is a schematic perspective view of an LED bulb lamp according to a fourth embodiment of the invention. The LED bulb 10d of fig. 36E is substantially the same as the LED bulb 10c of fig. 35A, with the main difference being in the filament portion. As shown in fig. 36E, the LED bulb 10d includes a lamp housing 12, a base 16 connected to the lamp housing 12, at least two conductive brackets 14a and 14b disposed in the lamp housing 12, a cantilever 15, a stem 19, and a single LED filament 100 d. The stem 19 comprises a stem bottom portion and a stem top portion, wherein the stem bottom portion is connected with the lamp head 16, and the stem top portion extends into the lamp housing 12, for example, the stem top portion may be located at about the center inside the lamp housing 12. In this embodiment the stem 19 comprises a stem 19a, where the stem 19a is considered as an integral part of the stem 19, and thus the top end of the stem 19 is the top end of the stem 19 a. The conductive legs 14a, 14b connect the stems 19. The LED filament 100d includes a filament body and two filament electrodes 110 and 112, the two filament electrodes 110 and 112 are located at two opposite ends of the filament body, and the filament body is the other part of the LED filament 100d excluding the filament electrodes 110 and 112. The two filament electrodes 110,112 are connected to two conductive legs 14a, 14b, respectively, and the filament body surrounds the stem 19. One end of the cantilever 15 is connected to the stem 19 and the other end is connected to the filament body.

Referring to fig. 36E and fig. 36F to 36H at the same time, fig. 36F is a schematic front view of a side surface of a fourth embodiment of the LED bulb lamp of the present invention, fig. 36G is a schematic side view of the side surface of the fourth embodiment of the LED bulb lamp of the present invention, and fig. 36H is a schematic top view of the fourth embodiment of the LED bulb lamp of the present invention. In the height direction (i.e., z direction) of the LED bulb 10d, the distance from the bottom end of the lamp housing 12 to the top end of the lamp housing 12 is H, the two filament electrodes 110 and 112 have a first height difference Δ H1, and the first height difference Δ H1 may be 0 to 1/10H. In other words, the height difference between the filament electrodes 110,112 may be 0 at the minimum, that is, both filament electrodes 110,112 are located at the same horizontal plane, and the height difference between the filament electrodes 110,112 may be 1/10H at the maximum. Preferably, the first height difference Δ H1 ranges between 0 and 1/20H. In one embodiment, the first height difference Δ H1 ranges from 0mm to 5 mm. Further, the first height difference Δ H1 ranges between 1 mm and 5 mm. Still further, the first height difference Δ H1 ranges between 1 millimeter and 2 millimeters.

In one embodiment, the shortest linear distance between the two filament electrodes 110,112 is less than 3 cm. In addition, the two filament electrodes 110 and 112 are located between 1/2 and 3/4H from the bottom end of the lamp envelope 12 in the height direction.

As shown in fig. 36F, the filament body is bent and undulated to have a highest point and a lowest point, and a second height difference Δ H2 is provided between the highest point and the lowest point. In the present embodiment, the lowest point of the filament body is the end position adjacent to the filament electrode 110; in other embodiments, if the downward bend of the filament body (the portion bent toward the burner 16) is lower than the filament electrodes 110,112 in the z-direction, the lowest point is the downward bend of the filament body. Wherein the first height difference Δ H1 is less than the second height difference Δ H2, and the second height difference Δ H2 ranges from 2/10H to 4/10H. In one embodiment, the second height difference Δ H2 is in a range of 2.2 cm to 3.8 cm, and preferably, the second height difference Δ H2 is in a range of 2.2 cm to 2.8 cm. The LED lamp with the structure has the advantages of good light emitting effect, simple manufacture and large light emitting angle.

In one embodiment, the highest point and the lowest point of the filament body in the height direction (i.e., z direction) are located between 1/3 and 4/5H from the bottom end of the lamp housing 12. The filament body between the two filament electrodes 110 and 112 is a light emitting section, and more than 50% of the light emitting section is higher than the positions of the two filament electrodes 110 and 112 in the height direction. Preferably, more than 30% of the light emitting segments are located higher in height than the top of the stem 19 (i.e. the top end of the upright 19 a).

In an embodiment, the filament body forms a filament side projection (refer to the LED filament 100d shown in fig. 36F and 36G) on a side projection plane of the LED bulb 10d, the side projection plane is parallel to a height direction (z direction) of the LED bulb 10d, the filament side projection has a highest point and a lowest point, and a height difference exists between the highest point and the lowest point in the height direction, and the height difference is 1/8 to 3/8 of the height H of the lamp housing 12.

In an embodiment, the filament body is in a horizontal projection of the filament on a horizontal projection plane of the LED bulb (see fig. 36H, a top view of the filament body), and the horizontal projection of the filament may be in a shape similar to a circle or a shape similar to a U. The horizontal projection plane is perpendicular to the z-direction and parallel to the x-y plane. In this embodiment, as shown in fig. 36H, the filament body is U-like on the horizontal projection plane. In addition, the shortest distance between the two ends of the horizontal projection of the filament (i.e., the two filament electrodes 110, 112) can be 0 to 3 cm.

In one embodiment, the angle of the filament body surrounding the stem is greater than 270 degrees. For example, as shown in fig. 35B and fig. 36H, the arc angle θ of the projection of the filament body on the x-y plane is greater than 270 degrees, so that a better illumination effect can be achieved. In a different embodiment, as shown in fig. 35B, a distance from a central point of the filament horizontal projection to the filament horizontal projection is r, an arc angle formed by the filament horizontal projection is θ, and the range of the arc angle θ is greater than or equal to 30 degrees and less than or equal to 360 degrees. In one embodiment (see fig. 36G), the number of the filament bodies is one, and on a projection plane (i.e., a side view) of the LED bulb 10d at a specific angle, the two conductive legs 14a and 14b overlap (the conductive legs 14a and 14b shown in fig. 36G overlap to show only the conductive leg 14a), and the filament body spans two sides of the stem 19, and the two conductive legs 14a and 14b are located on one side of the stem 19. Since the conductive legs 14a, 14b are only located on the same side of the stem 19, i.e. the other side of the stem 19 does not have any conductive legs, the light emitted by the LED filament 100d is less obstructed and the positions of the two conductive legs are also easily corrected.

In an embodiment, the filament body includes a plurality of LED chips (not shown) arranged in a straight line, and the filament body defines a primary light emitting surface and a secondary light emitting surface opposite to the plurality of LED chips. As shown in fig. 36A, a surface of the top layer 120a away from the base layer 120b is a primary light emitting surface, and a surface of the base layer 120b away from the top layer 120a is a secondary light emitting surface, and the primary light emitting surface and the secondary light emitting surface are opposite to each other. The main light-emitting surface is the surface with the most light passing through when the LED filament 100 emits light; the secondary light emitting surface is a surface through which light passes more times when the LED filament 100 emits light. As shown in fig. 36E and fig. 36F to 36H, the filament body includes a primary light emitting surface 1001 and a secondary light emitting surface 1002. Any section of the primary light emitting surface 1001 faces the lamp housing 12 or the lamp head 16 at any angle, i.e., faces the LED bulb 10d or faces the outside of the lamp housing 12, and any section of the secondary light emitting surface 1002 faces the stem 19 or the top of the stem 19 at any angle, i.e., faces the inside of the LED bulb 10d or faces the center of the lamp housing 12. In other words, when the user observes the LED bulb 10d from the outside, the main light emitting surface 1001 of the LED filament 100d is mainly seen preferentially, so that the lighting effect can be enhanced.

In the present embodiment, as shown in fig. 36E and fig. 36F to 36H, the shape of the LED filament 100d satisfies the curve equation: x m1 cos (t 360); y m2 sin (t 360); z is n cos (t 360 k). For the curve equation, reference may be made to the above description, and details thereof are not repeated herein.

In addition, the LED filament 100d is defined by an appearance, as shown in fig. 36E, a filament body of the LED filament 100d includes at least one first bending section (not labeled) and at least two second bending sections (not labeled), the first bending section is located between the two second bending sections, and the two filament electrodes 110 and 112 are respectively located at ends of the two second bending sections far away from the first bending section. In the present embodiment, the cantilevers 15 are respectively connected to the bending points of the first bending section and the second bending section, so as to better support different bending sections of the filament body. The first bending section bends towards the first direction, the second bending section bends towards the second direction, and the first bending section and the second bending section form a wavy annular structure.

As shown in fig. 36E, in the present embodiment, the first direction is a direction toward the lamp cap 16, and the second direction is a direction away from the lamp cap 16, that is, when viewed from the direction of fig. 36E, the first bending section bends downward (i.e., the bending position is closer to the lamp cap 16), and the second bending section bends upward (i.e., the bending position is farther from the lamp cap 16). In various embodiments, the first direction may be a direction away from the base 16, and the second direction may be a direction toward the base 16, i.e., the first curved segment may also curve upward, and the second curved segment may curve downward.

In this embodiment, the first bending section and the second bending section are inverted U-shaped on a first side projection plane of the LED bulb 10d, the first bending section and the second bending section are U-shaped or M-shaped on a second side projection plane of the LED bulb 10d, the first side projection plane and the second side projection plane are parallel to a height direction (z direction) of the LED bulb 10d, and the first side projection plane and the second side projection plane are perpendicular to each other. The first side projection plane can refer to the side view shown in fig. 36G, and the filament body in fig. 36G is in an inverted U shape; and the second side projection plane can be seen in the front view shown in fig. 36F, in which the filament body in fig. 36F is M-shaped. If the lowest point of the first bending section 1003 of the filament body is close to the height of the filament electrodes 110 and 112, the filament body in fig. 36F may be U-shaped. In the present embodiment, as shown in fig. 36H, the first curved section and the second curved section may be U-shaped or inverted U-shaped (depending on the viewing direction, the first curved section and the second curved section are inverted U-shaped in fig. 36H) on a horizontal projection plane of the LED bulb 10d, the horizontal projection plane is perpendicular to the height direction (z direction) of the LED bulb 10d and is parallel to the x-y plane.

Referring to fig. 38, fig. 38 is a schematic top view of a circuit board of a driving circuit of a fourth embodiment of an LED bulb lamp according to the invention. The driving circuit 18 includes a circuit board 18a fixed to the lamp base 16, the conductive brackets 14a, 14b are electrically connected to the circuit board 18a, and are electrically connected to the electrodes 110,112 of the LED filaments 100a, 100b through the vertical rods 19a, the circuit board 18a includes L-shaped slots 18b, the L-shaped slots 18b are hook-shaped, and the size of the hook-shaped tip portion of the L-shaped slots 18b is slightly smaller than the size of the cross-sectional area of the conductive brackets 14a, 14b, so that the L-shaped slots 18b can easily fix the conductive brackets 14a, 14b when the conductive brackets 14a, 14b are placed along the L-shaped slots 18b, and the structure is more favorable for the circuit board 18a and the conductive brackets 14a, 14b to be welded to each other. It should be noted that, in the embodiment shown in fig. 35 and 37, the lengths L of the conductive brackets 14a and 14b are set reasonably so as not to cause the two conductive brackets 14a and 14b to be too long to be short-circuited or too short to be electrically connected to the circuit board 18a, respectively. The length L (unit is mm) of the conductive bracket meets scientific requirements:

the constant 3.2 is the safety electrical spacing in this equation. Wherein a is a vertical thickness of the circuit board 18a and a length of a portion of the conductive brackets 14a, 14b exposed from the circuit board 18 a; b is the distance between the parallel portions of the two conductive supports 14a, 14B; the H is the length between the position where the conductive brackets 14a, 14b are cast into the stem 19 and the insertion of the circuit board 18 a. In the present invention, the length L of the conductive support may be in the range of 0.5L to 2L, preferably 0.75L to 1.5L. The value of L obtained by the above formula is only one embodiment and does not constitute the only limitation on the size of the conductive support of the present invention.

Specifically referring to fig. 37, in the case of fig. 37 having two LED filaments along the vertical direction, the length Z of the conductive support of the uppermost LED filament is L + Y, and the length unit of Z is mm. And Y is the distance between the two conductive supports of the LED filaments.

The silica gel used for mixing the phosphor in the foregoing embodiments is only one embodiment, and other gels, such as Polyimide, or other resin materials may be used to replace or replace a portion of the silica gel, so as to improve the cracking or brittle fracture of the light conversion layer.

Further, the top layer and the base layer of the LED filament can have different structures and compositions so as to combine a plurality of LED filaments with different properties. The layered structure of the LED filament of the present disclosure is described below. Fig. 39A is a schematic cross-sectional view of an embodiment of an LED filament layered structure of the present invention, the LED filament 400a having: a light conversion layer 420; LED chips 402, 404; the electrodes 410, 412; and a gold wire 440 for electrically connecting the LED chip and the LED chip (or electrode). A light conversion layer 420 is coated on at least two sides of the LED chip/electrode. The light conversion layer 420 exposes a portion of the electrodes 410, 412. The light conversion layer 420 may have at least a top layer 420a and a base layer 420b as the upper layer and the lower layer of the filament, respectively, in this embodiment, the top layer 420a and the base layer 420b are located on two sides of the LED chip/electrode, respectively. In the manufacturing process, the base layer 420b may be formed in advance, and then the LED chips 402 and 404 and the electrodes 410 and 412 are connected to the base layer 420b through the die attach adhesive 450. Gold wires 440 may be formed between the LED chips; or between the LED chip and the electrode. The gold wire 440 may have a bent shape (e.g., a substantially M-shape in fig. 39A) to reduce the impact force, or may have a more generally arc-like or linear shape. The top layer 420a is then coated over the LED chip and electrodes. The top layer 420a need not have the same area size as the base layer 420 b. In one embodiment, the top layer 420a has a slightly smaller area than the base layer 420 b. In one embodiment, a top surface of the base layer; namely the ten-point average roughness (Rz) of the contact surface with the top layer is 1nm-200 μm; while the upper surface roughness of the top layer, i.e. the Rz of the opposite side of the contact base layer side, may be 1 μm-2 mm.

When the top layer and the base layer are in contact with each other only in a single plane, the bonding strength between the top layer and the base layer is limited. In order to increase the bonding strength between the top layer and the base layer, the contact area between the top layer and the base layer can be moderately increased; or the shapes of the two are adjusted moderately; or the interface between the two is adjusted appropriately so that there is no obvious interface between the two.

The contact area between the top layer and the base layer is increased, and the shapes of the top layer and the base layer are adjusted as follows. For example, as shown in fig. 39B (the LED chip and the electrodes are omitted), the filament 420 includes a top layer 420a and a bottom layer 420B. In this embodiment, the top layer 420a and the base layer 420b of the LED chip disposed in the middle region in the filament width direction are joined in a planar manner, but the side regions on both sides of the middle region are joined in an embedded manner. Such as the mutually corresponding wavy interfaces 420i shown in fig. 39B. Compared with the situation that the top layer and the base layer are only in plane joint, the area of the joint interface is increased, and the joint strength between the top layer and the base layer is improved. However, the middle region where the LED chip is disposed does not need to be limited to be a plane, and may have undulations (as shown in fig. 46), and the surface between the top layer and the base layer for increasing the bonding area does not need to be undulated, and may have a saw-toothed shape. In one embodiment, a greater roughness is provided on the top surface of the base layer (i.e., the interface with the top layer) to achieve a similar effect.

Alternatively, for example, in an embodiment, as shown in fig. 39C (the LED chip and the electrodes are omitted), the base layer 420b has a plurality of through holes 466, so that the top layer 420a penetrates into the base layer 420b to increase the contact area between the top layer 420a and the base layer 420 b; the phosphor paste used to form top layer 420a penetrates through holes 466 of base layer 420b and then further extends to the other side of base layer 420a, as shown in FIG. 39E, and FIG. 30E is a cross-sectional view taken along line E1-E2 of FIG. 39D. At this time, the top layer 420a is sandwiched between at least the upper and lower substrates so as to have a rivet-like relationship therebetween.

In one embodiment, the top layer and the bottom layer do not have a distinct interface therebetween. The manufacturing method is not limited, but for example, when the curing process of curing the base layer 120b slightly by heating or irradiating UV light after performing the step S20 is performed, only one side of the base layer is cured and then placed on the LED chip, and then the top layer is disposed on the LED chip and then cured again, so that a mutually fused transition zone is formed between the top layer and the bottom layer, and the top layer and the bottom layer have the same composition in the transition zone. For example, when applied to the filament layered structure shown in fig. 39B, the interface 420i of the top layer 420a and the bottom layer 420B in fig. 39B will not be apparent, but instead will have a transition zone of both top and bottom layer composition.

The top layer 420a and the base layer 420b of the light conversion layer 420 may each be a layered structure of at least one layer. The layered structure may be selected from: fluorescent powder glue with high plasticity, fluorescent powder film with low plasticity, transparent layer or any layered combination of the three. The fluorescent powder glue/fluorescent powder film comprises the following components: glue 422/422 ', phosphor 424/424 ', inorganic oxide nanoparticles 426/426 '. The glue 422/422' may be, but is not limited to, silicone. In one embodiment, the glue 422/422' may include Polyimide (PI) with a weight percentage of 10 Wt% or less to increase the overall hardness, insulation, thermal stability and mechanical strength of the filament, the PI solid content may be 5-40 Wt%, and the rotational viscosity may be 5-20 pa.s. The glue 422' in fig. 39A can have a higher hardness for die bonding and wire bonding. The inorganic oxide nanoparticles 426/426' can be, but are not limited to, alumina particles, and the particles can be 100nm and 600 nm, which function to promote heat dissipation from the filament. The top layer 420a and the base layer 420b may be the same or may be adjusted to differ in hardness (e.g., by the encapsulant composition or phosphor ratio), wavelength of conversion, particle size of the composition, thickness, and transparency, as desired. Also, for example, the phosphor films and phosphor pastes can be adjusted to greater than 20%, 50%, or 70% as desired. The Shore hardness of the fluorescent powder adhesive can be D40-70; and the Shore hardness of the phosphor film can be D20-70. The thickness of the fluorescent powder film can be 0.1-0.5 mm; a refractive index of 1.4 or higher; the light transmittance is 40-95%. The transparent layer (adhesive layer, insulating layer) may be made of a high light-transmitting resin such as silicone, Polyimide (PI), or a combination thereof. In one embodiment, the transparent layer can be used as an index matching layer for adjusting the light extraction efficiency of the filament.

Fig. 40 shows another embodiment of an LED filament layered structure. In this embodiment, the LED chips 402 and 404, the gold wires 440, and the top layer 420a are disposed on two sides of the base layer 420b, that is, the base layer 420b is located between the two top layers 420 a. The electrodes 410,412 are disposed at two ends of the base layer 420b, respectively. The LED chips 402 and 404 in the top two layers 420a are connected to the same electrode 410/412 by gold wires. Thus, the light emission can be more uniform.

Fig. 41 shows another embodiment of an LED filament layered structure. In this embodiment, the base layer 420b of the filament 400c is further divided into phosphor films 4201b and transparent layers 4202b having different hardness. The harder phosphor film 4201b is located between the softer transparent layer 4202b and the top layer 420 a. The LED chips 402 and the electrodes 410 and 412 are disposed on the hard phosphor film 4201 b. Since the phosphor film 4201b has a higher hardness, the LED chips 402 and 404, the electrodes 410 and 412, and the gold wire 440 have a more stable configuration base. And the transparent layer 4202b has greater softness, so that the light conversion layer 420 has better flexibility as a whole. In this embodiment, the phosphor film 4201b has a glue 422' mixed with PI. Film layer 4202b has only glue 422 ". The glue 422 "is a silica gel. The transparent layer 4202b has the highest transmittance. Preferably, the transparent layer 4202b may have a shore hardness value D20-40, and the phosphor film layer 4201b may have a shore hardness value about 40 higher than that of the transparent layer 4202 b. Alternatively, the transparent layer 4202b may be used as an index matching layer to adjust the light-emitting angle of the filament. For example, the thickness of the transparent layer 4202b is 1/4 optical thickness, the thickness of the transparent layer 4202b may be different according to the actual wavelength of light, so that light is reflected by multiple interfaces such as LED chip/phosphor film, phosphor film/transparent layer, transparent layer/air, etc., thereby generating interference phenomenon and reducing the reflected light. In other embodiments, the transparent layer is not limited to only one layer, for example, if two or three transparent layers are provided, the reflectivity is lower. For example, three transparent layers with 1/4, 1/2, 1/4 wavelength optics thickness can achieve a broad band low reflectivity effect. In the embodiment of the invention, the thickness of the transparent layer can be adjusted according to the LED chips/phosphor films/phosphor pastes with different wavelengths, as long as the ratio of reducing reflection according to the interference phenomenon can be met, for example, the thickness of the transparent layer is an integral multiple of positive and negative 20% of the optical thickness of 1/2 and 1/4 wavelengths. The thickness of the transparent layer can be adjusted according to the LED chip/fluorescent powder film/fluorescent powder glue in the inner layer, which means that the emitted light intensity is mainly adjusted in the wave band with the proportion of the emitted light intensity to the all wavelength light intensity being more than 60%, preferably more than 80%. The transparent layer may be made of a material with a refractive index of plus or minus 20% of the refractive index of the inner layer, for example, in fig. 41, when the refractive index of the phosphor film 4201b inside the transparent layer 4202b is 2, the refractive index of the transparent layer 4202b is about 1.414 ± 20%. Thus, the light reflection loss can be effectively reduced.

In one embodiment (not shown), the base layer 420b is divided into two layers, which may have different hardness/thickness/converted wavelength characteristics.

Fig. 42 shows another embodiment of the present filament layered structure. In this embodiment, the base layer 420b of the filament 400d has only the glue 422'. The glue 422' is a silicone glue mixed with PI to have a higher hardness to facilitate the component mounting configuration. Here, the base layer 420b has higher transmittance than other layers.

Fig. 43 shows a layered structure diagram of the filament in an embodiment of the present invention, in which the base layer 420b is divided into a hard segment 4203b and a soft segment 4204b, and the hard segment 4203b and the soft segment 4204b are alternately arranged. The hard section 4203b and the soft section 4204b may have the same phosphor 424 ' and organic oxide particles 426 ', and the glue 422 ' of the hard section 4203b is a PI-mixed silica gel; the gel 422 "of the soft segment 4204b is silica gel without PI added. Thus, hard section 4203b has a higher hardness than the softer section to facilitate the assembly mounting configuration. In another embodiment, the filament may be divided into three sections, a bottom section, a middle section, and a front end section, according to the bottom of the lamp base/stem. The required bending degree of the filament shape is low bending part, middle bending part and high bending part in sequence, and the composition proportion used for forming each section of the filament is adjusted according to the requirement. In addition, the filament having the bent shape may include a hard substrate having no bendability. In one embodiment, the filament has a straight portion and a bent portion, the straight portion has a hard substrate carrying an LED chip, and the periphery of the hard substrate can be covered by a phosphor glue. The bending part can be provided with an FPC for bearing the LED chip, and the periphery of the FPC can be coated by fluorescent powder glue, or the FPC without any substrate is only coated by the fluorescent powder glue. The hard substrate may be made of ceramic, glass, sapphire, BT, FR4, metal, alumina, etc.

Fig. 44 shows another embodiment of the present filament layered structure. As shown in fig. 44, the light conversion layer of the filament 400f includes a top layer 420a and a base layer 420 b. Each face of the LED chips 402,404 is in direct contact with the top layer 420 a; while the base layer 420b is not in contact with the LED chips 402, 404. During the manufacturing process, the base layer 420b may be pre-formed, followed by the LED chips 402,404 and the top layer 420 a.

Fig. 45 shows another embodiment of a filament laminate structure. The top layer 420a and the base layer 420b are both a double-layer structure including a phosphor glue layer and a glue layer. The top layer 420a includes a phosphor glue layer 4201a and a glue layer 4202 a; base layer 420b includes phosphor glue layer 4201b and glue layer 4202b, and glue layers 4202a,4202b are located on the outermost layer of the filament layer structure, and glue layers 4202a,4202b may be formed of glue 422 ″ only. In one embodiment (not shown), the top layer 420a can be divided into a plurality of phosphor glue layers or a plurality of phosphor film layers. In another embodiment (not shown), the glue layers 4202a,4202b extend outside the filament to cover all surfaces of the phosphor glue layers 4201a,4201b including the side surfaces. In this case, the adhesive layers 4202a and 4202b may be preferably transparent heat-shrinkable films with high light transmittance, which not only protects the phosphor adhesive layer, but also strengthens the filament structure.

In another embodiment, as shown in fig. 46, the base layer 420b of the filament 400l is formed as a wavy surface having undulations, and the LED chips 402 and 404 are arranged thereon to have undulations and to be in a tilted state. And thus the filament 400l has a wide light-emitting angle. That is, if the contact surface between the bottom surface of the base layer and the surface of the worktable is a horizontal plane, the LED chips are not necessarily arranged parallel to the horizontal plane, but arranged with a certain angle with the horizontal plane, and the arrangement height/angle/direction between each LED chip may also be different. In other words, if a plurality of LED chips are connected in series at the center point of the LED chip, the formed line may not be a straight line. Therefore, the filament can already have the effects of increasing the light-emitting angle and enabling the light to be emitted uniformly even in the non-bent state.

Fig. 47A shows still another embodiment of the present case. The LED filament 400h has: LED chips 402, 404; the electrodes 410, 412; gold wires 440, and a light conversion layer 420. The light conversion layer 420 is divided into a top layer 420a and a base layer 420b, wherein the base layer 420c is formed by phosphor glue having phosphor 424 and glue 422, a chip accommodating groove 428 is formed in the base layer 420c along the axial direction of the filament, and the LED chip can be fixed to the bottom of the chip accommodating groove 428 by a die attach adhesive 450 (or only by melting). Then, a gold wire 440 is disposed in the axial direction of the filament, and another phosphor paste 420d with phosphor 424 and paste 422 is used to fill the chip-accommodating trench 428 and form a top layer 420 a. In this embodiment, the top layer 420a is only disposed at the center in the radial direction of the filament, and both sides in the radial direction of the filament are the base layers 420 b. The chip-receiving groove 428 has a width greater than that of the LED chips 402 and 404, so that at least two or more (five in this embodiment) of the six surfaces of the LED chip are in contact with and covered by the top layer 420 d. When the LED chip is bonded to the base layer 420c in a normal mounting manner, the phosphor glue of the top layer 420d contacting the main light emitting surface of the LED chip can have a larger proportion of phosphor (or phosphor with higher light conversion efficiency) so that the filament has good light emission; since the base layer 420c must maintain the softness of the filament, a larger proportion of the phosphor glue in the base layer 420c is required. Preferably, the phosphor in the phosphor gel of the top layer 420d accounts for 60-85% WT; and the phosphor in the phosphor paste of the base layer 420b accounts for 40-65% WT.

Referring to fig. 47B, fig. 47B is a schematic cross-sectional view of an LED filament according to still another embodiment of the invention. According to one embodiment, the LED filament 100 capable of emitting full-cycle light includes a linear array of LED chips 102 operably connected to each other and capable of exciting light emission, an electrode 112, a plurality of wires 140 for electrically connecting the linear array of LED chips 102 and the electrode 112, and a light conversion layer 120 surrounding the linear array of LED chips 102 and the electrode 112. The light conversion layer 120 includes a first phosphor layer 2402 (which can be regarded as a base layer), a second phosphor layer 2404 and a transparent layer 2406 (which can be regarded as a top layer). The first fluorescent glue layer 2402 comprises a linear series of two-by-two tangent spherical structures, and the LED chip 102 is enclosed in the central part of the first fluorescent glue layer 2402. The transparent layer 2406 forms an outer layer of the LED filament 100, and the second phosphor layer 2404 fills a gap between the transparent layer 2406 and the first phosphor layer 2402. The amount of phosphor in the first phosphor layer 2402 may be larger than the second phosphor layer 2404 to form a sufficient light output amount and ensure continuity of light output. The glue content ratio in the second fluorescent glue layer 2404 may be greater than that of the first fluorescent glue layer 2402, or the cured softer glue (for example, silica gel is used for the second fluorescent glue layer 2404, and PI is used for the first fluorescent glue layer 2402) is used for the second fluorescent glue layer 2402, so that the hardness of the second fluorescent glue layer 2402 is less than that of the first fluorescent glue layer 2404, and at this time, since the second fluorescent glue layer 2404 at the middle point between the chips is greater than that of the first fluorescent glue layer 2402, the filament 100 may have good bending property.

Fig. 48-50 illustrate three LED chip package structures. The three packaging structures can be suitable for the filament multilayer structure of the scheme. Herein, the base layer is only illustrated as the insulating layer 460 because the LED chip and the packaging method are focused on, but it should be understood that the base layer does not exclude the possibility of a multi-layer structure including a phosphor glue layer or a phosphor film layer.

In the LED filament package structure shown in fig. 48, the filament 400i has: LED chips 402, 404; the electrodes 410, 412; gold wires 440; a light conversion layer 420, and an insulating layer 460. After the insulating layer 460 is disposed, a copper foil 430 having a plurality of radial openings is attached thereon. The upper surface of the copper foil may further have a silver plated layer, and the copper foils at the ends of the filament serve as electrodes 410,412 and extend beyond the insulating layer 460. The LED chip can be fixed on the insulating layer 460 by die attach adhesive or the like. Thereafter, a phosphor paste or film is applied to cover the LED chips 402,404, the gold wires 440, and a portion of the electrodes 410,412 to form the light conversion layer 420. The width or/and length of the opening is larger than that of the LED chip, the position of the LED chip is limited, and at least two or more than two (five surfaces in the embodiment) of the six surfaces of the LED chip are in contact with each other and are coated by the top layer fluorescent powder glue. In this embodiment, the combination of the copper foil 430 and the gold wire 440 provides a stable and flexible conductive structure for the filament; the silver layer 431 has an effect of increasing light reflection in addition to giving good electrical conductivity.

In the LED filament package structure shown in fig. 49, the filament 400j is similar to the filament 400i disclosed in fig. 48, except that (1) the LED chip used in the filament 400j is a flip chip with the same leg height, and the leg is directly connected to the silver plating layer 431 (2) the length of the opening of the filament 400i (i.e., the length in the axial direction of the filament) in front of the silver plating layer 431 must be larger than the LED chip in order to accommodate the LED chip, and the LED chips 402 and 404 of the filament 400j of this embodiment correspond to the opening 432 and are located above the copper foil 430/silver plating layer 431, so the lengths of the LED chips 402 and 404 are larger than the opening. This embodiment omits the step of bonding gold wires compared to the previous embodiments.

Fig. 50 shows an LED filament package structure in which a filament 400k is similar to the filament 400j disclosed in fig. 49. The difference is that the flip-chip configuration is performed by processing the solder pads with originally different heights to the same height (usually, processing the lower N-pole extension to the same height as the P-pole).

Fig. 51 is a perspective view of an embodiment of the auxiliary structure of the filament lamp of the present disclosure. In the filament 100a, the light-converting layer 120 at least covers the LED chips 102 and 104 and the gold wire 140. The light conversion layer 120 has phosphor 124 and glue 122 therein. The filament can be packaged in any manner disclosed in the present specification or in any other conventional manner. In this embodiment, the configuration of the top layer portion may be similar to that of fig. 39A, i.e. the front chip is connected by gold wires, and the light conversion layer 120 has a plurality of auxiliary bars 170 disposed along the axial direction of the filament but not electrically connected to the electrodes/LED chips/gold wires, and mainly located at two sides of the plurality of chips. The auxiliary strip 170 may be a copper wire, and since there is no electrical connection with the electrode/LED chip/gold wire, the auxiliary strip 170 only serves as a reinforcing filament structure, and may prevent damage to the LED chip from external force. The thickness and the number of the auxiliary strips can be adjusted according to the size, the weight and the required shape of the LED chip/filament, and the effect of supporting the filament is further achieved. In another embodiment, the light conversion layer 120 is divided into a top layer and a base layer, the top layer has a phosphor glue or a phosphor film; the base layer is made of flexible toughened glass with the thickness of 0.1-0.5mm, the hardness of 1H and the transmittance of 90 or higher.

The shape of the auxiliary strip is not limited to a straight line extending in the axial direction of the filament. Or a spiral shape or a bent shape extending along the axial direction of the filament, and different sections of the same auxiliary strip can be respectively positioned on different layers of the filament. Furthermore, the auxiliary strip may be transverse. In one embodiment, the filament has two longitudinal auxiliary strips extending along the axial direction and a plurality of transverse auxiliary strips. The transverse auxiliary strips each extend beyond the width of the filament and are connected to the vertical rods. The lateral auxiliary bar can now replace the cantilever 15 in fig. 35. Or, instead of placing the transverse auxiliary bar, only multiple sections of longitudinal auxiliary bars may be arranged, and at least one end of the longitudinal auxiliary bar is bent into an L-shape to extend beyond the width of the filament, and further, the filament may be fixed with the vertical bar or other end points in the bulb.

In an embodiment, when the auxiliary strip is made of metal or other material with better thermal conductivity, the auxiliary strip can extend out of the filament to be further connected with the stem or the heat sink of the bulb, or extend out of the bulb to contact with the outside air, so as to facilitate heat dissipation.

When the filament is bent at a small angle, the bent portion may be thermally expanded and weakened by thermal stress. Holes or notches may be suitably provided in the filament near the bend to mitigate this effect. In one embodiment, as shown in FIG. 52 (the LED chips and electrodes are omitted), the distances D1-D2 are predetermined kinks. The top layer 420a is formed of phosphor paste, and the base layer 420b is a phosphor film. A plurality of apertures 468 are provided in the top layer 420a, preferably, the apertures 468 are larger from the outside (top in the figure) of the bend and larger closer to the inside (bottom in the figure), such that the apertures 468 are triangular in this embodiment. When the filament is bent, the filament is bent by upward force application in the direction F, at the moment, the filament is easy to bend due to the plurality of holes 468 among the distances D1-D2, the holes 468 at the bent part can buffer thermal stress, and the holes with a certain size can be reserved after bending according to proper hole shapes and bending angle planning, and the holes also have the effect of improving heat dissipation.

In one embodiment, the filament has heat dissipation holes therein. Preferably, the heat dissipation holes may be arranged along the axial direction of the filament to form an elongated heat dissipation aperture. When the filament is a linear filament, the filament may be arranged vertically or diagonally, two ends of the filament are a low end and a high end, and an opening may be provided near the high end of the filament (preferably, at an end of the high end), and the opening communicates with the heat dissipation aperture to facilitate heat dissipation. And the lower end portion may also have an opening near it (preferably at the end of the lower end portion) that communicates with the heat dissipation aperture to allow cooler air below to flow in through the opening at the lower end. When the filament is a bent filament, the filament may have a plurality of high ends/a plurality of low ends according to different bent shapes, and the filament still has a heat dissipation aperture extending along the axial direction of the filament, and the filament may have openings near the plurality of high ends and openings near the plurality of low ends, which are communicated with the heat dissipation aperture. The portion of the lamp housing near the high-end opening can form a heat dissipation area, and the heat dissipation area can be a vent or can be formed by transparent materials with higher heat conductivity (for example, the opening is made first and then transparent resin mixed with heat dissipation particles is filled, and the heat dissipation particles can be high heat conduction materials with better light transmittance, such as graphite, ceramics, carbon fibers, aluminum oxide, magnesium oxide, nano silver and the like). Further, the above-mentioned filling of the bulb with a gas selected from nitrogen/helium/hydrogen may be combined with the provision of the lamp envelope with a gas-permeable opening. For example, in one embodiment, the high end opening and the low end opening of the filament are connected to a plurality of ventilation holes of the lamp envelope, respectively, so that the heat dissipation aperture in the filament is in direct contact with the outside air. When the plurality of air vents are connected with the filament, the sealed state is still maintained in the lamp shell. At this time, the enclosed lamp envelope is filled with a gas selected from nitrogen/helium/hydrogen, so as to further enhance the heat dissipation in the lamp envelope. This is done for filament lamps formed of hard or soft filaments.

Referring to fig. 36I to 36K, fig. 36I is a schematic enlarged partial cross-sectional view of a first embodiment of the lamp housing of the invention, fig. 36K is a schematic enlarged partial cross-sectional view of a second embodiment of the lamp housing of the invention, and fig. 36J is a schematic enlarged partial cross-sectional view of a third embodiment of the lamp housing of the invention. As shown in fig. 36I, the envelope 12 includes a glue layer 12a and a diffusion film 12b, the glue layer 12a is located between the envelope 12 and the diffusion film 12b, and the glue layer 12a can enhance the firmness between the diffusion film 12b and the envelope 12. The diffusion film 12b can be used to diffuse the light penetrating through the lamp housing 12, so that the LED bulbs 10c and 10d can have a more uniform illumination effect. In addition, the diffusion film 12b can be directly attached to the lamp housing 12 without the adhesive layer 12a, and the diffusion film 12b can be attached to the outside or inside of the lamp housing 12. In other embodiments, the diffusion film 12b may be replaced by a color-adjusting film, which can adjust the color temperature of the light emitted from the LED bulbs 10c and 10 d; alternatively, the diffusion film 12b may also have a function of adjusting the color temperature, for example, a light conversion substance, which may be a wavelength conversion particle, is added to the diffusion film 12 b.

As shown in fig. 36J, in order to enhance the safety of the lamp housing, in one embodiment, the lamp housing 12 may include a bonding film 12c, the bonding film 12c may be attached to the outer side or the inner side of the lamp housing 12, and in this embodiment, the bonding film 12c is located on the inner side of the lamp housing 12. The material of the adhesive film 12c may be calcium carbonate or strontium phosphate, and the thickness of the adhesive film 12c is selected according to the weight of the LED bulb lamps 10c and 10 d. If the LED bulb 10c, 10d is provided with a heat sink (e.g., a set of heat dissipating fins located between the lamp housing 12 and the lamp head 16), and when the total weight of the heat sink exceeds 100 g, at least 70% of the heat conducting paste is contained in the heat sink by 0.7-0.9W/m × K, and the thickness of the adhesive film 12c is 200 micrometers (μm) to 300 micrometers (μm). When the radiator is not filled with heat conducting glue, the weight is below 80 g, the thickness of the adhesive film 12c is 40 micrometers (mum) to 90 micrometers (mum) to play the effect of improving the explosion-proof performance, the lower limit of the thickness is related to the weight of the lamp, the problem of explosion-proof performance needs to be considered, the upper limit is more than 300μm to cause insufficient light transmittance, the material cost is increased, the material combination of the adhesive film 12c is mainly calcium carbonate or strontium phosphate, organic solvents are matched for proper blending in the process, when the lamp shell 12 is broken, the adhesive film 12c can connect broken pieces of the lamp shell 12 together, and broken holes are not easy to generate, so that the situation that a user accidentally contacts an internal charged body to cause electric shock accidents is avoided. .

The color temperature of the filament lamp can be adjusted by the matching of the LED chip and the fluorescent powder in the fluorescent powder glue/film. In addition, the lamp envelope/stem can also have the effect of adjusting the color temperature, for example, when the main material of the lamp envelope is glass (refer to fig. 36K), the light conversion substance 12d can be added during the glass sintering process to form the lamp envelope 12 with the light conversion substance 12 d; or coating a color matching film doped with a light conversion substance on the inner side or the outer side of the transparent glass; as are the stems/legs.

The filament lamp can be roughly divided into two main types of decoration and illumination according to the color temperature, when the filament lamp is mainly used for decoration, the color temperature can be adjusted to 1700-2700K, and the average color rendering evaluation index (Ra) can be 70-100, preferably 90-100. When the filament lamp is mainly used for illumination, the color temperature can be adjusted to 2500-3500K, the luminous efficiency can be 80-100 lumens/watt, and the average color rendering evaluation index (Ra) can be 60-100, preferably 80-100. The light-converting substance may be, for example, a phosphor, a dye (e.g., a silver compound, gold, titanium, silver-coated gold, gold-coated silver nanoparticles), or the like.

In addition, the diffusion film can also be coated on the inner side (such as the diffusion film 12b or coating shown in fig. 36I) or the outer side of the lamp housing, or on the stem or the vertical rod to increase the diffusion of light. For example, the main component of the diffusion membrane can be any one of calcium carbonate, calcium halophosphate and aluminum oxide, or a combination of any two of the above, or a combination of the above three. When calcium carbonate is used as a main material and a proper solution is matched to form a diffusion coating, the diffusion coating has excellent diffusion and light transmission effects (the organic rate can reach more than 90 percent). When the diffusion film is coated on the outer surface of the lamp shell, the friction force between the diffusion coating and the radiator (or the lamp holder or the plastic lamp holder) below the lamp shell is increased, and the problem that the lamp shell falls off is solved greatly.

In this example, the diffusion coating was formulated to include calcium carbonate, strontium phosphate (e.g., CMS-5000, white powder), a thickener, and ceramic activated carbon (e.g., ceramic activated carbon SW-C, colorless liquid). Specifically, when the diffusion coating is prepared by mixing calcium carbonate as a main material with a thickener, ceramic activated carbon and deionized water and then coating the mixture on the inner or outer peripheral surface of the lamp envelope, the coating thickness is between 20 and 300 μm, preferably between 20 and 30 μm. A diffusion film formed using such a material may have a light transmittance of about 90%, and in general, the light transmittance ranges from about 85% to 96%. In addition, the diffusion film can play a role in electrical isolation besides the effect of diffusing light, so that when the glass lamp tube is broken, the risk of electric shock of a user is reduced; the diffusion film can diffuse light when the light source emits light, and the light is emitted in all directions, so that a dark space is avoided, and the illumination comfort of the space is improved. Furthermore, different lighting effects can be obtained when diffusion coatings of different material compositions are selected, or by adjusting the thickness of the diffusion film.

In other embodiments, the diffusion coating may also be made of calcium carbonate as a main material, mixed with a small amount of reflective material (such as strontium phosphate or barium sulfate), a thickening agent, ceramic activated carbon, and deionized water, and coated on the lamp envelope to an average thickness of 20-30 μm. Since the purpose of the diffusion film is to diffuse light, the diffusion phenomenon is microscopically the reflection of light through particles, and the particle size of the reflective material such as strontium phosphate or barium sulfate is much larger than that of calcium carbonate, a small amount of reflective material is added into the diffusion coating to effectively increase the diffusion effect of light.

Of course, in other embodiments, calcium halophosphate or alumina may be used as the main material of the diffusion coating, the particle size of calcium carbonate is between about 2 and 4 μm, and the particle size of calcium halophosphate and alumina is between about 4 and 6 μm and 1 and 2 μm, respectively, in the case of calcium carbonate, when the light transmittance requirement range is 85% to 92%, the average thickness of the calcium halophosphate-based diffusion coating is about 20 to 30 μm, and in the same light transmittance requirement range (85% to 92%), the average thickness of the calcium halophosphate-based diffusion coating is about 25 to 35 μm, and the average thickness of the alumina-based diffusion coating is about 10 to 15 μm. If the transmittance is required to be higher, for example, 92% or more, the thickness of the diffusion coating layer based on calcium carbonate, calcium halophosphate, or alumina is required to be thinner.

Referring to fig. 36L, fig. 36L is a schematic perspective view of an LED bulb lamp according to a fifth embodiment of the present invention. The difference between the LED bulb 10E shown in fig. 36L and the LED bulb 10d shown in fig. 36E is that the lamp housing 12 of the LED bulb 10E shown in fig. 36L further includes a plurality of ventilation holes 12E, and the ventilation holes 12E are distributed at the top of the lamp housing 12 and correspond to the positions of the LED filament 100d, so that heat generated by the LED filament 100d during operation can be dissipated through convection of air through the ventilation holes 12E. In various embodiments, the lamp envelope 12 may further include a gas vent located at the bottom of the lamp envelope 12.

Referring to fig. 36M, fig. 36M is a perspective view of a lamp housing of an LED bulb lamp in an embodiment of the invention. Besides the heat dissipation structure of the LED filament, the heat dissipation structure can also be arranged on the lamp shell of the LED bulb lamp. In the above embodiments, the lamp housing may have the ventilation hole near the high end (highest point) of the filament, and the arrangement of the ventilation hole of the lamp housing is not limited thereto. In one embodiment, the top or bottom of the lamp housing 12 may also be provided with air holes 1201a, 1201 b. In one embodiment, as shown, the opening area of the top vent 1201a of the lamp housing 12 may be 100 to 500 mm, preferably 150 to 450 mm; the open area of the bottom vent 1201b of the casing may be 200 to 1200 square mm, preferably 450 to 1000 square mm. When the air holes with small areas are arranged, the danger that people contact the charged parts inside the bulb lamp can be avoided.

Referring to fig. 36N, fig. 36N is a schematic side view of an LED bulb lamp according to a sixth embodiment of the invention. The LED bulb 10f shown in fig. 36N is different from the LED bulb 10d shown in fig. 36E in the shape of the LED filaments 100d and 100f, but the shape changes of the LED filaments 100d and 100f both satisfy the curve equation. In this embodiment, the LED filament 100f has more bending undulations. In other embodiments, the LED filament may have various shape variations. As long as the curve equation is satisfied, the shape of the LED filament in the LED bulb lamp is not limited to the example shown in the drawing.

Referring to fig. 39A to 39E, details of an LED filament that can be used in an LED bulb according to various embodiments of the present invention are described below. The top layer and the base layer of the LED filament may have different structures and compositions to combine a plurality of LED filaments with different properties, and the layered structure of the LED filament of the present invention will be described below. Fig. 39A is a schematic cross-sectional view of an embodiment of an LED filament layered structure of the present invention, the LED filament 400a having: a light conversion layer 420; LED chips 402, 404; filament electrodes 410, 412; and gold wires 440. The gold wire 440 is used for electrically connecting the LED chips 402,404, and for electrically connecting the LED chips 402,404 and the filament electrodes 410, 412. The light conversion layer 420 is coated on at least two sides of the LED chips 402,404 and the filament electrodes 410, 412. The light conversion layer 420 exposes a portion of the filament electrodes 410, 412. The light conversion layer 420 may have at least a top layer 420a and a base layer 420b as the upper layer and the lower layer of the filament, respectively, in this embodiment, the top layer 420a and the base layer 420b are respectively located at two sides of the LED chips 402 and 404 and the filament electrodes 410 and 412. In the manufacturing process, the base layer 420b may be formed in advance, and then the LED chips 402 and 404 and the filament electrodes 410 and 412 are connected to the base layer 420b through the die attach adhesive 450. Gold wires 440 may be formed between LED chips 402, 404; or between the LED chips 402,404 and the filament electrodes 410, 412. The gold wire 440 may have a bent shape (e.g., a substantially M-shape in fig. 39A) to reduce the impact force, or may have a more generally arc-like or linear shape. The top layer 420a is then coated over the LED chips 402,404 and filament electrodes 410, 412. The top layer 420a need not have the same area size as the base layer 420 b. In one embodiment, the top layer 420a has a slightly smaller area than the base layer 420 b. The ten-point average roughness (Rz) of the upper surface of the base layer 420b, i.e., the contact surface of the base layer 420b with the top layer 420a, is 1nm to 200 μm; and the upper surface roughness of the top layer 420a, i.e., the Rz of the opposite surface contacting the base layer surface, may be 1 μm to 2 mm.

Referring to fig. 39A to 39E, details of an LED filament that can be used in an LED bulb according to various embodiments of the present invention are described below. The top layer and the base layer of the LED filament may have different structures and compositions to combine a plurality of LED filaments with different properties, and the layered structure of the LED filament of the present invention will be described below. Fig. 39A is a schematic cross-sectional view of an embodiment of an LED filament layered structure of the present invention, the LED filament 400a having: a light conversion layer 420; LED chips 402, 404; filament electrodes 410, 412; and gold wires 440. The gold wire 440 is used for electrically connecting the LED chips 402,404, and for electrically connecting the LED chips 402,404 and the filament electrodes 410, 412. The light conversion layer 420 is coated on at least two sides of the LED chips 402,404 and the filament electrodes 410, 412. The light conversion layer 420 exposes a portion of the filament electrodes 410, 412. The light conversion layer 420 may have at least a top layer 420a and a base layer 420b as the upper layer and the lower layer of the filament, respectively, in this embodiment, the top layer 420a and the base layer 420b are respectively located at two sides of the LED chips 402 and 404 and the filament electrodes 410 and 412. In the manufacturing process, the base layer 420b may be formed in advance, and then the LED chips 402 and 404 and the filament electrodes 410 and 412 are connected to the base layer 420b through the die attach adhesive 450. Gold wires 440 may be formed between LED chips 402, 404; or between the LED chips 402,404 and the filament electrodes 410, 412. The gold wire 440 may have a bent shape (e.g., a substantially M-shape in fig. 39A) to reduce the impact force, or may have a more generally arc-like or linear shape. The top layer 420a is then coated over the LED chips 402,404 and filament electrodes 410, 412. The top layer 420a need not have the same area size as the base layer 420 b. In one embodiment, the top layer 420a has a slightly smaller area than the base layer 420 b. The ten-point average roughness (Rz) of the upper surface of the base layer 420b, i.e., the contact surface of the base layer 420b with the top layer 420a, is 1nm to 200 μm; and the upper surface roughness of the top layer 420a, i.e., the Rz of the opposite surface contacting the base layer surface, may be 1 μm to 2 mm.

In one embodiment, the base layer 420b and the top layer 420a have a close structure therebetween, which can enhance the bonding strength between the base layer 420b and the top layer 420 a. This is because the bonding strength between the top layer and the base layer is limited when the top layer and the base layer are in contact only in a single plane. In order to increase the bonding strength between the top layer and the base layer, the contact area between the top layer and the base layer can be moderately increased; or the shapes of the two are adjusted moderately; or the interface between the two is adjusted appropriately so that there is no obvious interface between the two. In one embodiment, the sealing structure includes rough surfaces formed on the contact surfaces between the base layer 420b and the top layer 420a, respectively, thereby increasing the bonding strength between the base layer 420b and the top layer 420 a. Further, other embodiments and practices of the seal structure are as follows.

The contact area between the top layer and the base layer is increased, and the shapes of the top layer and the base layer are adjusted as follows. For example, as shown in fig. 39B (the LED chip and the filament electrode are omitted), the filament 420 includes a top layer 420a and a bottom layer 420B. In this embodiment, the top layer 420a and the base layer 420b of the LED chip disposed in the middle region in the width direction of the LED filament 400a are joined in a planar manner, but the side regions on both sides of the middle region are joined in an engaged shape. Such as the mutually corresponding wavy interfaces 420i shown in fig. 39B. The bonding interface has an increased area and an improved bonding strength as compared with the case where the top layer 420a and the base layer 420b are bonded only in a plane. However, the middle region where the LED chip is disposed does not need to be limited to be a plane, and may have undulations (as shown in fig. 39B), and the surface between the top layer 420a and the base layer 420B for increasing the bonding area does not need to be undulated, and may have a saw-tooth shape. In one embodiment, a greater roughness is provided on the top surface of the base layer 420b (i.e., the interface with the top layer 420 a) to achieve a similar effect.

Alternatively, for example, in an embodiment, as shown in fig. 39C (the LED chip and the filament electrode are omitted), the base layer 420b has a plurality of through holes 466, so that the top layer 420a penetrates into the base layer 420b to increase the contact area between the top layer 420a and the base layer 420 b; the phosphor paste used to form top layer 420a penetrates through holes 466 of base layer 420b and then further extends to the other side of base layer 420a, as shown in FIG. 39E, where FIG. 39E is a cross-sectional view of line E1-E2 in FIG. 39D. At this time, the top layer 420a and the bottom layer 420b are sandwiched by at least the upper and the lower layers, so that the riveting-like relationship is formed therebetween.

In one embodiment, the top layer 420a and the base layer 420b do not have a clear interface therebetween. The manufacturing method is not limited but can be, for example: after coating the light conversion layer (the base layer 420b) on the carrier and disposing the LED chips 402 and 404 and the filament electrodes 410 and 412 on the light conversion layer (the base layer 420b) on the carrier, and when a curing process of slightly curing the base layer 120b by heating or UV light irradiation is adopted, only one side (e.g., the side facing downward in the figure) of the base layer 420b is cured and then placed on the LED chips 402 and 404, and then the top layer 420a is disposed on the LED chips 402 and 404 and then cured again, so that a specific range between the top layer 420a and the base layer 420b forms an overlapping region, which is a transition zone where the top layer 420a and the base layer 420b are mutually fused. The presence of both the top layer 420a and the base layer 420b in the transition zone prevents the top layer 420a and the base layer 420b from peeling away from each other due to the absence of a well-defined bond interface between the two layers. For example, when applied to the layered structure of the LED filament 400a shown in fig. 39B, the interface 420i of the top layer 420a and the base layer 420B in fig. 39B will not be apparent, but instead will have a transition zone of both the top layer 420a and base layer 420B compositions.

In addition, the LED filament with a bent shape may include a rigid substrate without bendability. In one embodiment, the LED filament has a straight portion and a bent portion, the straight portion has a hard substrate carrying an LED chip, and the periphery of the hard substrate can be covered by a phosphor glue. The bending part can be provided with an FPC for bearing the LED chip, and the periphery of the FPC can be coated by fluorescent powder glue, or the FPC without any substrate is only coated by the fluorescent powder glue. The hard substrate may be made of ceramic, glass, sapphire, BT, FR4, metal, alumina, etc.

Referring to fig. 51A to 51D, fig. 51A to 51D are schematic perspective views of LED filament auxiliary strips according to first to fourth embodiments of the present invention. In the LED filament 100a of fig. 51A, the light conversion layer 120 at least covers the LED chips 102 and 104 and the gold wire 140. The light conversion layer 120 has phosphor 124 and glue 122 therein. The LED filament 100a may be packaged in any manner disclosed herein or other conventional manners. In the present embodiment, the configuration of the top layer portion may be similar to that of fig. 39A, that is, the forward-mounted LED chips 102 and 104 are connected by the gold wires 140, the light conversion layer 120 has a plurality of auxiliary bars 170 therein, the auxiliary bars 170 are disposed along the axial direction of the LED filament 100a, but the auxiliary bars 170 are not electrically connected to the filament electrodes 110 and 112/the LED chips 102 and 104/the gold wires 140, and the auxiliary bars 170 are mainly located at two sides of the plurality of LED chips 102 and 104. The auxiliary strip 170 may be, for example, metal (e.g., copper), glass, nanotubes. Since there is no electrical connection with the filament electrodes 110, 112/ LED chips 102, 104/gold wire 140, the auxiliary strip 170 serves only as a reinforcing filament structure, and damage to the LED chips 102,104 by external force can be prevented. The auxiliary bar 170 may be adjusted in thickness and number according to the size and weight of the LED chips 102 and 104/the LED filament 100 a/the desired shape of the LED filament 100a, thereby achieving the effect of supporting the LED filament 100 a. In another embodiment, the light conversion layer 120 is divided into a top layer and a base layer, the top layer has a phosphor glue or a phosphor film; the base layer is made of flexible toughened glass, the thickness of the flexible toughened glass is 0.1-0.5mm, the hardness is 1H, and the transmittance is 90 or higher. Furthermore, the auxiliary strip may be transverse.

In other embodiments, the shape of the auxiliary strip is not limited to a straight line extending in the axial direction of the filament. Or a spiral shape or a bent shape extending along the axial direction of the filament, and different sections of the same auxiliary strip can be respectively positioned on different layers of the filament. The auxiliary bar as in fig. 51B is wave-shaped; whereas the auxiliary bar of fig. 51C is spiral-shaped; the auxiliary strips of the filament and the auxiliary strips are simultaneously arranged in the top layer and the base layer of the filament, so that the function of strengthening the interlayer connection of different layers of the filament is achieved. The auxiliary bar 170a serves only as a reinforcing filament structure, and can prevent damage to the LED chips 102,104 from an external force. The thickness and number of the auxiliary bars 170a can be adjusted according to the size and weight of the LED chips 102 and 104/the LED filament 100 a/the desired shape of the LED filament 100a, thereby achieving the effect of supporting the LED filament 100 a.

As shown in fig. 51D, in an embodiment, the LED filament 100a has a plurality of auxiliary bars 170B, and the auxiliary bars 170B are also arranged laterally, which is different from the auxiliary bars 170a in that a part of the auxiliary bars 170B further extends out of the LED filament 100a, and a part of the auxiliary bars 170B extending out of the LED filament 100a can be further connected to the stem 19 as the cantilever 15 (see fig. 35A and 35B). In this case, the auxiliary bar 170b can not only enhance the overall structure of the filament, but also fix the LED filament 100a directly to the stem 19, thereby simplifying the manufacturing process. That is, the cantilever 15 (i.e., the auxiliary bar 170b) of the present embodiment can be directly formed with the LED filament 100a, thereby eliminating the need for an additional process of connecting the cantilever 15 to the LED filament 100a after the LED filament 100a is completed.

In one embodiment, the LED filament has two longitudinal auxiliary bars extending along the axial direction and a plurality of transverse auxiliary bars. The transverse auxiliary strips extend beyond the width of the LED filament and are connected with the core column (vertical rod). In this case, the lateral auxiliary bar is similar to the auxiliary bar 170b shown in FIG. 51D, which can replace the cantilever 15 in FIGS. 34 and 35A. Or, instead of placing the transverse auxiliary bar, only multiple sections of longitudinal auxiliary bars may be arranged, and at least one end of each longitudinal auxiliary bar is bent into an L shape to extend beyond the width range of the LED filament, and further, the LED filament may be fixed with the stem (upright) or other end points in the LED bulb lamp (for example, the lamp housing, the interface between the lamp housing and the lamp cap). In one embodiment, as shown in fig. 51E and 51F, the lamp envelope does not have a stem or a vertical rod, and the head and the middle of the filament have electrodes formed by transparent conductive adhesive; the head and the tail of the filament 100r are connected to form a ring; the filament 100r has a longitudinal auxiliary strip made of copper material to provide support and plastic property; the two electrodes of the filament 100r are connected with glass fibers to form a lateral auxiliary strip 170b, the lateral auxiliary strip 170b extends out of the filament 100r and is connected to the lamp envelope (for example, connected in a sintered manner), and a power supply path provided to the filament electrodes is formed on the lateral auxiliary strip 170b by a transparent conductive coating film and may extend down along the lamp envelope into the burner (not shown). At this time, the core column/upright rod for supporting the filament; the cantilever for fixing the filament is replaced by the auxiliary strip 170b and can be made of materials including glass fiber and the like, and the conductive support is replaced by the transparent auxiliary strip 170b and the transparent conductive coating film, so that light blocking can be greatly reduced; and to enhance the aesthetic appeal of the filament lamp as a whole. In one embodiment, the outer side of the electrode of the LED filament or/and the end of the auxiliary strip extending from the filament has a joint made of glass material for sintering and fixing to the lamp housing. In one embodiment, the inner side of the lamp housing, the electrode of the LED filament or/and the end of the auxiliary strip extending from the filament are formed with a male/female joint, such as a pin or hook, and a through hole, which are combined and then fixed by sintering.

In an embodiment, when the auxiliary strip is made of metal or other material with better thermal conductivity, the auxiliary strip may extend out of the filament to be further connected with the stem or the heat sink of the LED bulb, or extend out of the LED bulb to contact with the outside air, so as to facilitate heat dissipation.

Referring to fig. 52, fig. 52 is a schematic cross-sectional view of an embodiment of an LED filament. The difference between the LED filament 400a of fig. 52 and the LED filament 400a of fig. 39A is that the LED filament 400a of fig. 52 further includes a heat dissipation channel 480 and a plurality of heat dissipation holes 481. In the present embodiment, the heat dissipation channel 480 penetrates the LED filament 400a along the axial direction of the LED filament 400a and is located on the top layer 420a, but is not limited thereto. In other embodiments, the heat dissipation channel 480 may also transversely penetrate the LED filament 400 a; alternatively, the heat dissipation channels 480 may be located in the base layer 420 b; alternatively, the heat dissipation channels 480 may be plural and may be distributed on the top layer 420a or the base layer 420 b. In the present embodiment, as shown in fig. 52, the heat dissipation holes 481 are perpendicular to the axial direction of the LED filament 400a and open on the upper surface of the LED filament 400a, specifically, one end of the heat dissipation holes 481 is communicated with the heat dissipation channel 480, and the other end of the heat dissipation holes 481 penetrates the surface of the top layer 420a away from the base layer 420 b. However, the opening direction of the heat dissipation hole is not limited to this, and the heat dissipation hole can also be opened on the side of the filament; or when the heat dissipation channel is disposed on the base layer 420b, the heat dissipation holes may also be disposed on the lower surface of the filament, and the heat dissipation channel 480 and the plurality of heat dissipation holes 481 facilitate heat dissipation of the LED filament 400a, for example, when the LED filament 400a continuously works, relatively low temperature air may flow into the LED filament 400a from openings at two ends of the heat dissipation channel 480 and exchange heat with the LED chips 402 and 404 and the filament electrodes 410 and 412, and relatively high temperature air may flow out of the LED filament 400a from the heat dissipation holes 481, so that the air may circulate and convect inside and outside the LED filament 400a, thereby facilitating more efficient heat dissipation of the LED filament 400 a. In the present embodiment, the plurality of heat dissipation holes 481 may be respectively disposed corresponding to the LED chips 402 and 404, and since the LED chips 402 and 404 are the components generating the highest heat in the LED filament 400a, the heat dissipation effect is improved. The formation of the heat dissipation channels/holes is not limited, but can be formed by, for example, photo-etching a negative photosensitive resin to form thinner heat dissipation holes in any section. In addition, the arrangement/position of the heat dissipation channel and the heat dissipation holes can be adjusted by matching the bending shape/direction of the filament and the air holes of the lamp shell, for example, if the lamp filament is implemented in the lamp filament shown in fig. 3, the heat dissipation channel can be only arranged in the first bending section or the second bending section, the heat dissipation holes of the lamp filament are arranged at the highest position points of the lamp filament, and the air holes of the lamp shell can be arranged right above the heat dissipation holes; the installation direction of the lamp filament bulb can be taken into consideration, the lamp filament heat dissipation holes are configured at the highest position point of the installed lamp filament, and the air holes of the lamp shell can be suitable for the installation direction of the lamp bulb to be arranged close to the lamp holder side/the top end of the lamp shell/the side face of the lamp shell. In an embodiment, the air holes may be replaced by a heat dissipation area of the lamp housing, and the heat dissipation area may be formed by a transparent material with high thermal conductivity (for example, an opening is made first and then a transparent material such as resin or glass mixed with heat dissipation particles is filled in, and the heat dissipation particles may be, for example, highly heat conductive materials with good light transmittance such as graphite, ceramic, carbon fiber, aluminum oxide, magnesium oxide, and nano silver). In one embodiment, the filling of the LED bulb with a gas selected from nitrogen/helium/hydrogen may be combined with the gas-permeable opening of the lamp housing. For example, the LED filament with heat dissipation channels has heat dissipation holes at two ends, and the heat dissipation holes at two ends are respectively connected with two air vents on the lamp housing, so that the heat dissipation channels in the LED filament directly contact with the outside air, but the lamp housing still maintains a sealed state. At this time, the enclosed lamp envelope is filled with a gas selected from nitrogen/helium/hydrogen, so as to further enhance the heat dissipation in the lamp envelope. In addition, the heat dissipation channel may be formed after the bent shape of the filament is determined, in an embodiment, the filament has a spiral body formed by overlapping a plurality of spiral rings from bottom to top, and the spiral rings are in contact with each other on at least one side, and a linear heat dissipation channel penetrating through the spiral rings is formed on the side where the spiral rings are in contact with each other.

Referring to fig. 53, fig. 53 is a schematic cross-sectional view of an LED filament according to another embodiment of the present invention. In this embodiment, because the LED filament in the LED bulb lamp is in a pattern with irregular bending, when the LED filament is bent at a small angle, the bent portion may be weakened due to thermal expansion and thermal stress. Therefore, holes or notches can be properly arranged in the LED filament near the bent part to relieve the influence. In one embodiment, as shown in fig. 53 (the LED chip and the filament electrode are omitted), the distance D1 to D2 is a predetermined bending. The top layer 420a is formed of phosphor paste, and the base layer 420b is a phosphor film. A plurality of holes 468 are provided in the top layer 420a, preferably, the holes 468 are larger from the outside (upper side) of the bend toward the inside (lower side) of the bend, such that the holes 468 are triangular. When buckling the LED filament, the filament is buckled by the upward force application of F direction, makes the LED filament buckle easily because a plurality of holes 468 between interval D1 to D2 this moment, and the hole 468 of department of buckling can cushion the thermal stress, and plans according to suitable hole shape and angle of buckling, still can keep the hole of certain size to exist after buckling this moment, and the hole still has the radiating effect of improvement this moment. In other embodiments, the holes 468 can also be combined with the heat dissipation holes 481 and the heat dissipation channels 480 shown in fig. 7; alternatively, the heat dissipation hole 481 shown in fig. 52 may have a structure with different apertures at both ends, so that the LED filament is easily bent.

Referring to fig. 54A to 54F, fig. 54A to 54F are schematic diagrams of a linear array of LED chips according to various embodiments of the present invention. In one embodiment, the LED filament may be formed by a linear array of LED chips encapsulated by a tubular package, wherein the tubular package may be composed of a top layer 420a and a base layer 420b as shown in fig. 39A, and the LED chips may include LED dies and positive and negative contacts on the LED dies, but is not limited thereto. When the tube seal is formed directly on the linear array of LED chips 504 by a distributed liquid adhesive (e.g., a polymer coated on the LED chips 504), there are a number of situations that may adversely affect the quality of the wire-bonded LED filament. At wire bonding, a combination of downward pressure, ultrasonic energy, and heat (in some cases) is used to attach bonding wires 514 to both ends of the ohmic contacts of LED chip 504 to make a fusion joint. The LED chip 504 may be accidentally chipped or burned off during wire bonding, and if the surface is dirty or uneven, the ohmic contact of the LED chip 504 will include bonding strength and may subject the LED filament to possible damage. Further, when the liquid polymer is properly or improperly distributed over the bond wires attached to adjacent LED chips 504, bond misalignment may result. In some embodiments, to reduce this problem, the connection between the LED chips 504 is through a glue line made of conductive glue continuously coated between the positive contact and the negative contact of the adjacent LED chips 504. The conductive paste is formed by incorporating conductive particles, which may be gold or silver, into an elastic binder. Preferably, the conductive particles are made of a light-transmitting material such as nano silver, carbon nanotubes, and graphene. In some embodiments, wavelength converting particles are mixed in a conductive paste to enhance light conversion. The elastic adhesive may be silicone, epoxy, or polyimide resin (ploymeide). Preferably, the material of the elastic adhesive for the conductive paste is the same as the material of the tubular seal body. Thus, the glue line is seamlessly integrated into the tubular enclosure and can be fully extended or compressed in synchronization with the tubular enclosure. The glue line may be made, for example but not limited to, by a glue sprayer with three-dimensional movement capability. Fig. 54A and 54B are side views of a linear array of LED chips 504 with the positive a contact and the negative C contact disposed on the same side of the LED die 510, for example.

In fig. 54A, the glue line 516 connecting adjacent LED chips 504 covers substantially the entire surface of the positive a contact and the negative C contact. In fig. 54B, the glue line 516 connecting adjacent LED chips 504 partially covers the positive a contact and the negative C contact. Fig. 54C and 54D are top views of a linear array of LED chips 504 with the positive a contact and the negative C contact disposed on the same side of the LED die 510. In fig. 54A and 54B, the glue line 516 connects adjacent LED chips 504 along a straight line. In some embodiments, the glue line 516 includes a curve of arbitrary shape resulting from absorbing potentially damaging mechanical energy. Preferably, the curve has a camber (camber) of 3 to 8. Further, the curve has a camber of 2 to 6.

In fig. 54C, the glue line 516 is designed to define an S-shaped curve between the LED chips 504 to which it is connected, since the LED filament is expected to deform after being stretched or compressed. In fig. 54D, when the positive a contact and the negative C contact are not completely aligned along the long axis of the linear array of LED chips 504, the glue line 516 turns at the corner of the LED chip 504, for example, to complete the electrical connection between the adjacent LED chips 504. In fig. 54E, the linear array of LED chips 504 includes a plurality of plateaus 518 to fill gaps between adjacent LED chips 504. Preferably, the platform 518 is made of the same material from which the tubular enclosure is made. The upper surface of the platform 518 provides a continuous path for the glue line 516 to extend from the positive a contact of the LED chip 504 to the negative C contact of the LED chip 504. Alternatively, in fig. 54F, the mold 520 is formed to follow the contour of the positive a contact and the negative C contact of the LED chip 504. In proper arrangement, the die 520 defines a gap between the die 520 and the linear array of LED chips 504. The glue line 516 is formed by filling the gap with a conductive glue. In some embodiments, the LED die 510 eliminates the positive a contact and the negative C contact (which may block light when disposed over the diode region), and thus, the glue line 516 is disposed to connect the p-junction (p-junction) of the LED chip 504 with the n-junction (n-junction) of the LED chip 504. In one embodiment, the electrodes of the filament (e.g., electrodes 110 and 112 in fig. 36L) are also formed of conductive paste and may be doped with wavelength converting particles, so that the electrodes at both ends of the filament no longer block light and the overall appearance of the filament is more consistent.

Referring to fig. 55A to 55C, fig. 55A to 55C are schematic transverse cross-sectional views of LED filaments according to various embodiments of the present invention, wherein the detailed structure of the LED filament can refer to the above-mentioned embodiments. In one embodiment, the outer surface of the tubular enclosure is provided with a polishing layer. The bright surface treated LED filament is aesthetic in appearance, however, such LED filament suffers from total internal reflection (total internal reflection) and poor heat dissipation. In other embodiments, the outer surface of the tubular enclosure is provided with a textured layer that reduces total internal reflection to improve light extraction, and that also provides the tubular enclosure with a larger surface area than the polishing layer to enhance heat dissipation. In addition, when the LED filament is internally provided with the heat dissipation channel, a grain layer can be formed on the surface of the heat dissipation channel in the filament to achieve the same effect.

Fig. 55A, 55B and 55C are transverse cross-sectional views of a tubular package, wherein fig. 55A further shows the inside of the tubular package, the LED chip 1106 is located inside the tubular package, and the tubular package comprises a wavelength conversion layer 1402, a transparent adhesive 1404 and light conversion particles 1406. For example, in fig. 55A, a textured layer (on the wavelength conversion layer 1402) is formed by a sufficient concentration of light conversion particles 1406 near and protruding from the outer surface of the wavelength conversion layer 1402. In contrast, in fig. 55B and 55C, the tubular seal includes dedicated texturing layers each having a different morphology, such as wedge or cube.

The features of the various embodiments of the invention described above may be combined and changed arbitrarily without being mutually exclusive and are not limited to a specific embodiment. Such as described in the embodiment of fig. 1A, although it is not described in the embodiment of fig. 1C that the LED bulb may also include components such as a plastic base, a heat sink, etc., it is obvious to one of ordinary skill in the art that such features may be applied to fig. 1C without inventive step based on the description of fig. 1A; for another example, although the invention has been described with reference to an LED bulb lamp as an example, it is obvious that these designs can be applied to lamps of other shapes or types without creativity, such as LED candle lamps, etc., which are not listed here.

As described above, for the same LED filament or an LED bulb using the same LED filament, it is reminded that, in the above embodiments, the light conversion layer, the way in which the light conversion layer wraps the electrode and/or the LED chip, the conducting wire, the silica gel and/or the polyimide and/or the resin, the phosphor composition ratio, the filament lamp layered structure, the converted wavelength/particle size/thickness/transmittance/hardness/shape of the phosphor gel/film, the transparent layer, the heat conduction path formed by the phosphor, the circuit film, the oxidized nanoparticles, the die attach gel, the wavy stem of the LED filament body, the transparent layer, and the gas in the lamp housing, The "filament assembly", "length of conductive support of LED filament", "surface of cantilever and/or stem may be coated with graphene film", "air pressure in lamp housing", "young's coefficient of filament", "shore hardness of filament base", "auxiliary bar", "coating adhesive film on surface of lamp housing, diffusion film, color mixing film", "doping light conversion substance in lamp housing/stem/vertical rod", "heat dissipation area of lamp housing", "hole or gap of filament", "heat dissipation path in filament", "curve formula of filament shape", "air hole of lamp housing", "wavy embedded surface between top layer of filament and base layer", "zigzag embedded surface", "through hole of base layer", "light conversion layer including first fluorescent glue layer, second fluorescent glue layer and transparent layer", "auxiliary bar is wavy", and, The features of "the auxiliary strip is in a spiral shape", "the plurality of auxiliary strips are arranged in the transverse and longitudinal directions", "at least one end of the longitudinal auxiliary strip is bent into an L shape", "the LED filament has a bend", and "a hole or a notch is appropriately provided near the bend", and the like, may include one, two, more, or all technical features without mutual conflict. The corresponding content may be selected from one or a combination of the technical features included in the corresponding embodiments.

While the invention has been described in terms of preferred embodiments, it will be understood by those skilled in the art that the examples are intended in a descriptive sense only and not for purposes of limitation. It should be noted that equivalent variations and substitutions to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention is subject to the scope defined by the appended claims.

Claims (10)

1. The utility model provides a LED ball bubble lamp, includes the lamp body and connects the lamp holder of lamp body, its characterized in that, LED ball bubble lamp still includes:

the core column comprises a core column bottom and a core column top which are opposite, and the core column bottom is connected with the lamp holder;

at least two conductive brackets connected with the core column;

the LED filament comprises a filament body and two filament electrodes, the two filament electrodes are positioned at two opposite ends of the filament body, the two filament electrodes are respectively connected with the two conductive supports, and the filament body surrounds the core column; and

at least one cantilever, one end is connected with the core column, and the other end is connected with the filament body;

the LED filament includes:

the LED chips are electrically connected with each other;

the two electrodes are arranged corresponding to the LED chip and electrically connected with the LED chip; and

the light conversion layer comprises a top layer and a base layer which are respectively positioned at two sides of the LED chip, the top layer covers the LED chip and the electrodes, and parts of the two electrodes are respectively exposed; the base layer is provided with a chip accommodating groove located in the axial direction of the LED filament, and the width of the chip accommodating groove is larger than that of the LED chip.

2. The LED bulb lamp according to claim 1, wherein the base layer comprises 40-65 WT% of phosphor and glue.

3. The LED bulb lamp according to claim 1, wherein the top layer is provided with a heat dissipation channel which is axially arranged along the LED filament and penetrates through the LED filament.

4. The LED bulb lamp according to claim 3, wherein the heat dissipation channel comprises at least one heat dissipation hole perpendicular to an axial direction of the LED filament.

5. The LED bulb lamp as claimed in claim 4, wherein one end of the heat dissipation hole is communicated with the heat dissipation channel, and the other end of the heat dissipation hole penetrates through the top layer and is far away from the base layer.

6. The LED bulb lamp according to claim 4, wherein the LED filament has an upper surface and a lower surface opposite to the upper surface, and the heat dissipation holes are opened in the upper surface of the LED filament.

7. The utility model provides a LED ball bubble lamp, includes the lamp body and connects the lamp holder of lamp body, its characterized in that, LED ball bubble lamp still includes:

the core column comprises a core column bottom and a core column top which are opposite, and the core column bottom is connected with the lamp holder;

at least two conductive brackets connected with the core column;

the LED filament comprises a filament body and two filament electrodes, the two filament electrodes are positioned at two opposite ends of the filament body, the two filament electrodes are respectively connected with the two conductive supports, and the filament body surrounds the core column; and

at least one cantilever, one end is connected with the core column, and the other end is connected with the filament body;

the LED filament includes:

the LED chips are electrically connected with each other;

the two electrodes are arranged corresponding to the LED chip and electrically connected with the LED chip; and

the light conversion layer comprises a top layer and a base layer, the base layer covers six sides of the LED chip, and the top layer covers the base layer and the two electrodes and respectively exposes one part of the two electrodes.

8. The LED bulb lamp of claim 7, wherein the base layer is a first layer of phosphor paste, the first layer of phosphor paste being a linear string of two-by-two tangent spherical structures.

9. The LED bulb lamp according to claim 8, wherein the top layer comprises a second phosphor layer and a transparent layer, the second phosphor layer filling a gap between the transparent layer and the first phosphor layer.

10. The LED bulb lamp of claim 9, wherein the amount of phosphor in the first layer of phosphor paste is greater than the second layer of phosphor paste.

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