CN207852724U

CN207852724U - The LEDbulb lamp of LED filament and the application LED filament

Info

Publication number: CN207852724U
Application number: CN201820012053.9U
Authority: CN
Inventors: 江涛
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2016-04-27
Filing date: 2017-02-17
Publication date: 2018-09-11
Anticipated expiration: 2027-02-17
Also published as: CN206958642U; CN107314258B; CN207849021U; CN207716115U; CN107314258A; CN208535603U; CN111550687A

Abstract

The utility model is related to lighting areas, disclose a kind of LED filament, including light conversion layer, LED chip, electrode, the LED chip is electrically connected with each other between the LED chip and the electrode each other, the light conversion layer is covered in the LED chip and the electrode, and make a part of exposed of two electrodes respectively, the light conversion layer includes at least a base and top layer, the top layer and the base are respectively at least one layer of layer structure, and the top layer and the thickness of the base differ.Not only illumination effect is good for the utility model structure, and filament bending is good, meanwhile, excellent in heat dissipation effect.

Description

The LEDbulb lamp of LED filament and the application LED filament

Technical field

The utility model is related to lighting areas, and in particular to a kind of LED filament and its manufacturing method and apply the LED The LEDbulb lamp of filament.

Background technology

LED has the advantage of environmentally friendly, energy saving, high efficiency and long-life, therefore is generally taken seriously in recent years, gradually Replace the status of traditional lighting lamps and lanterns.However shining for Conventional LED light sources has directive property, unlike conventional lamp can be made greatly extensively Therefore LED is applied to conventional lamp, depending on the type of lamps and lanterns, and has corresponding challenge by the illumination of angular region.

Patent No. CN204289439U discloses a kind of filament that week is luminous comprising it is mixed with the substrate of fluorescent powder, The electrode being set on the substrate installs at least one LED chip on the substrate, and is covered in the LED core The packaging plastic of on piece uses the substrate that the resin for being mixed with fluorescent powder or the silica gel for being mixed with fluorescent powder are formed to reduce substrate cost Or influence of the substrate to chip to light extraction.Patent No. EP2760057A1 discloses fluorescent powder glue-line package transparent substrate upper table The chip in face, substratum transparent wrap up the lower surface of transparent substrate, and fluorescent adhesive layer and substratum transparent are with the point method of a little point respectively It and forms dotted fluorescent adhesive layer and substratum transparent in the front of transparent panel and chip.Fluorescent powder glue-line is corresponding with substratum transparent Setting；Fluorescent powder glue-line includes silica gel and fluorescent powder, and substratum transparent includes silica gel；The edge of substratum transparent have inclined side or Inclined side with arc.

However the above patent is only mixed with fluorescent powder in substrate, or it only is mixed with fluorescent powder in filament one side, filament is whole The light-out effect and light conversion ratio of body are bad.

If the positive and negative electrode that Patent No. CN203367275U discloses dry plate LED chip is led by lead and the metal Electric part is electrically connected；It is mentioned that fluorescent adhesive layer include upper fluorescent adhesive layer and lower fluorescent adhesive layer, fluorescent adhesive layer is set on this On surface and cover the LED chip and metallic conduction part over the transparent substrate；And lower fluorescent adhesive layer is located at transparent base Lower surface.One layer of fluorescent adhesive layer is covered on the upper and lower surface of transparent substrate, the refraction loss of LED light is reduced, further increases The whole luminous flux and light efficiency of LED light source, however the transparent substrate because using is hard substrate, filament do not have flexible and Light-emitting angle is small.

Patent No. CN202252991U discloses the top and bottom of chip or its surrounding is respectively coated fluorescent powder, and chip is solid It is scheduled in flexible PCB and by glue sticking encapsulation of insulating, insulating cement is epoxide-resin glue；The electrode of chip is connected by gold thread Circuit in flexible PCB；Flexible PCB is transparent or translucent, and flexible PCB is in polyimides or polyester film base Printed circuit is made on plate, replaces aluminum substrate Frame lamp thermal component using flexible PCB, improves heat dissipation.Patent No. CN105161608A discloses a kind of LED filament light-emitting section and preparation method thereof, use non-overlapping copies chip light emitting face it Between face face correspond to arrangement, improve light-emitting uniformity and improve heat dissipation.Patent No. CN103939758A discloses the carrying of carrier Transparent and heat conduction heat dissipating layer is formed between faying face between face and LED wafer, to carry out hot friendship with the LED wafer It changes.Aforementioned patent is respectively adopted pcb board, adjustment chip array or forms heat dissipating layer, is dissipated though can improve filament to a certain extent Heat, but because radiating efficiency is low, heat easily gathers.

Present application is advanced optimized to above-mentioned application case, further to meet a variety of different process requirements.

Utility model content

The utility model aim is to provide a kind of improved filament lamp, be made simply with reaching, light-emitting angle is equivalent greatly Fruit.

To achieve the above object, the utility model provides a kind of LED filament, including light conversion layer, LED chip, electrode, institute It states LED chip to be electrically connected with each other between the LED chip and the electrode each other, the light conversion layer is covered in institute LED chip and the electrode are stated, and makes a part of exposed of two electrodes respectively, the light conversion layer includes an at least base Layer and top layer, the top layer and the base are respectively at least one layer of layer structure, the thickness of the top layer and the base It differs.The thickness of base and top layer differs so that LED filament has good illumination effect.

Further, layered structure is the arbitrary stratiform group of phosphor gel, fluorescent powder membrane, hyaline layer or this three It closes.The phosphor gel or the fluorescent powder membrane include glue, fluorescent powder, inorganic oxide nanoparticles, and inorganic nano-particle can To promote filament to radiate；Hyaline layer can be to have the function of adjusting filament light extraction efficiency as refractive index matching layers；The glue is Silica gel or containing the glue no more than 10wt% polyimides, to increase hardness, insulating properties, thermal stability and the machine of filament entirety Tool intensity；The hyaline layer is the combination of one or both of silica gel, polyimides.

Further, the base includes that fluorescent powder membrane and at least one layer of hyaline layer, the fluorescent powder membrane are located at described Between bright layer and the top layer.

Further, the base includes hard area section and soft zone section.Hard area section with it is glimmering possessed by the soft zone section Light powder is identical as organic oxygen compound particle；The glue of the hard area section is the silica gel for being mixed into PI, and the glue of the soft zone section is not to be added The silica gel of PI；The hard area section can be interconnected with the soft zone section.Hard area section has to be conducive to compared with the higher hardness of soft zone section Component installation configuration.

Further, the top layer and the base are double-layer structure, the double-layer structure include fluorescent powder glue-line and Glue-line, the glue-line extend outside filament and coat all faces of the fluorescent powder glue-line.The glue-line is transparent heat shrinkage film. Transparent heat shrinkage film has the effect of strengthening filament structure other than protecting fluorescent powder glue-line.

Further, the LED chip surface for contacting the base is LED chip lower surface, opposite with LED chip lower surface LED chip surface be LED chip upper surface, the top layer in the plane where the LED chip upper surface be equipped with hole. Since the LED filament in LEDbulb lamp is in yo-yo pattern is bent, when LED filament is bent with smaller angle, bend Place may expanded by heating and heated stress influence and become fragile, hole can slow down this influence.

Further, from the outside of LED filament bending place to inside, described hole becomes larger.Carry out bending LED filament When, exerted a force bending filament upward by the directions F, at this time since space D 1 to multiple holes between D2 makes LED filament be easy bending, The hole of bending place can buffer thermal stress, and be planned according to void shape appropriate and bending angle, can still retain after bending A certain size hole exists, and hole also has the effect of improving heat dissipation at this time.

Further, be equipped with heat dissipation channel in the top layer, and the heat dissipation channel along LED filament axially through LED filament.

Further, heat dissipation channel, and the heat dissipation channel lateral direction penetrating LED filament are equipped in the base.

Further, further include heat emission hole, one end of heat emission hole is connected to heat dissipation channel, and the other end of heat emission hole then penetrates through top Surface of the layer far from base.Heat dissipation channel contributes to the heat dissipation of LED filament with multiple heat emission holes, such as in LED filament continue working When, among the air of relative low temperature can flow into LED filament by the both ends open of heat dissipation channel, and with LED chip and filament electricity Pole carries out heat exchange, and the air of relatively-high temperature can then be flowed to except LED filament by heat emission hole, and thereby, air can be in LED filament Internal and outer loop and convection current, can help LED filament efficiently to radiate.The heat dissipation channel or heat emission hole are using light The mode of etching minus sensing optical activity resin is formed.With in forming thinner heat dissipation channel heat emission hole on arbitrary section.

The utility model separately provides a kind of LED filament, including light conversion layer, LED chip, electrode, and the LED chip is each other Between be electrically connected with each other between the LED chip and the electrode, the light conversion layer is covered in the LED chip and institute Electrode is stated, and makes a part of exposed of two electrodes respectively, the light conversion layer includes at least a base and top layer, described Top layer and the base are respectively at least one layer of layer structure, and the top layer and the hardness of the base differ.

The utility model separately provides a kind of LED filament, including light conversion layer, LED chip, electrode, and the LED chip is each other Between be electrically connected with each other between the LED chip and the electrode, the light conversion layer is covered in the LED chip and institute Electrode is stated, and makes a part of exposed of two electrodes respectively, the light conversion layer includes at least a base and top layer, described Top layer and the base are respectively at least one layer of layer structure, and the Wavelength-converting of the top layer and the base, light transmittance are not It is identical.

The utility model separately provides a kind of LED filament, including light conversion layer, LED chip, electrode, the LED chip It is electrically connected with each other between the LED chip and the electrode each other, the light conversion layer is covered in the LED chip With the electrode, and making a part of exposed of two electrodes respectively, the light conversion layer includes at least a base and top layer, The top layer and the base are respectively at least one layer of layer structure, the constituent particle granules of the top layer and the base Size differs.

The utility model separately provides a kind of LEDbulb lamp, and the LEDbulb lamp includes：

Lamp housing；

Lamp cap is connect with lamp housing；

Stem and upright bar, the stem are set in the lamp housing, and the upright bar extends to the lamp housing by the stem Center；

At least two conducting brackets are set in lamp housing and connect the stem；And

LED filament, the LED filament are single LED filament, and the LED filament passes through described in conducting bracket connection Stem；

The first end of cantilever, the cantilever is connected to the upright bar, and the second end of the cantilever is connected to the LED light Silk, the second end have the pincers portion of the fixed LED filament.LED filament is single item, can be bent into various forms, In LEDbulb lamp when being closely located to lamp housing center, comprehensive can around shine, and apply LED filament LED ball steep Lamp can also meet the requirement of full optical illumination.

Further, the LEDbulb lamp is full light LEDbulb lamp.

Further, further include driving circuit, the conducting bracket and the lamp is electrically connected in the driving circuit Head.

Further, the stem includes opposite stem bottom and stem top, and the stem bottom connects the lamp Head, institute

It states and is extended to inside the lamp housing at the top of stem.

Further, the LED filament is around the upright bar.

Further, the LED filament is wavy convex recessed.Wavy convex recessed LED filament can ensure LED filament shines uniform, it is easier to provide full optical illumination.

Further, the young's modulus of the LED filament is 0.1x10¹⁰Pa~0.3x10¹⁰Pa.

Further, the LEDbulb lamp is full light LEDbulb lamp.

Advantageous effect：The utility model penetrate said structure design, reached one of advantageous effect as described below or its Meaning combination：(1) top layer of light conversion layer is differed with groundwork thickness so that LED filament has good illumination effect；(2) can Adjust the light extraction efficiency of filament；(3) hardness, insulating properties, thermal stability and the mechanical strength of filament entirety are enhanced；(4) energy Enough strengthen the structure of filament item；(5) hole can buffer thermal stress and improve heat dissipation；(6) heat dissipation channel has with multiple heat emission holes Help the heat dissipation of LED filament, such as in LED filament continue working, the air of relative low temperature can be by the both ends open of heat dissipation channel It flows among LED filament, and heat exchange is carried out with LED chip and filament electrode, and the air of relatively-high temperature then can be by radiating Hole flows to except LED filament, and thereby, air can help LED filament more to have inside LED filament with outer loop and convection current Efficient radiate；(7) LED filament is single item, can be bent into various forms, lamp is closely located in LEDbulb lamp It when shell center, comprehensive can around shine, and apply the LEDbulb lamp of LED filament that can also meet wanting for full optical illumination It asks；(8) it is uniform can to ensure that LED filament shines for wavy convex recessed LED filament, it is easier to provide full optical illumination.

Description of the drawings

Figure 1A shows the ball bulb lamp structure figure made by the LED filament using the utility model；

Figure 1B shows the structure chart that lamp housing radiator connects in Figure 1A；

Fig. 1 C are the stereoscopic schematic diagram of one embodiment LEDbulb lamp of the utility model, wherein several filaments are in modularity group Dress；

Fig. 2 shows the amplification assumption diagrams of a-quadrant in Figure 1B；

Fig. 3 is the schematic diagram after the filament assembly expansion of an embodiment shown in Fig. 1 C；

Fig. 4 is the expanded schematic diagram of another embodiment of filament assembly；

Fig. 5 is the expanded schematic diagram of another embodiment of filament assembly；

Fig. 6 is the shaping tool stereoscopic schematic diagram applied to the utility model；

Fig. 7 is filament assembly molding status diagram on shaping tool；

Fig. 8 is another embodiment schematic diagram of filament assembly, wherein between filament not equidistantly；

Fig. 9 a are the schematic diagram of single led filament main light-emitting surface；

Fig. 9 b are the schematic diagram of single led filament time light-emitting surface；

Solids of the Figure 10 for positive and negative electrode conducting wire in one embodiment of LEDbulb lamp of the utility model in filament assembly lower end Schematic diagram；

Figure 11 shows for solid of the positive and negative electrode in filament assembly upper end in another embodiment of LEDbulb lamp of the utility model It is intended to；

Figure 12 is the LEDbulb lamp of the utility model shown in Fig. 1 C along the sectional view in the directions X-X, wherein auxiliary stand and lamp Silk component is connect with hook mode group；

Figure 13 is LED filament component described in Figure 12 and partial enlarged view of the auxiliary stand with unification embodiment；

Figure 14 is the positive expanded schematic diagram of one embodiment of filament support of the utility model；

Figure 15 be filament support shown in Figure 14 be electric conductor when one embodiment back side expanded schematic diagram；

Figure 16 be filament support shown in Figure 14 be electric conductor when one embodiment back side expanded schematic diagram；

Figure 17 is the expanded schematic diagram of one embodiment of filament support of the utility model；

Figure 18 is the circuit diagram of filament support shown in Figure 17；

Figure 19 is to be installed with the filament lamp stereogram of this case filament support in one embodiment of the utility model；

Figure 20 is to be installed with the filament lamp stereogram of this case filament support in one embodiment of the utility model；

Figure 21 is the three-dimensional partial cutaway schematic of the utility model LED filament first embodiment；

Figure 22 is the partial cutaway schematic of the positions 2-2 in Figure 21；

Figure 23,24 for the utility model LED filament first embodiment electrode configuration corresponding with LED chip other realities Illustration is applied to be intended to；

Figure 25 is the three-dimensional partial cutaway schematic of the utility model LED filament second embodiment；

Figure 26 is the partial cutaway schematic of the positions 5-5 in Figure 25；

Figure 27 A are the circuit film first embodiment schematic diagram of the utility model LED filament not cut；

Figure 27 B are that the circuit film first embodiment of the utility model LED filament not cut is covered on the signal of LED chip Figure；

Figure 28 A are the circuit film second embodiment schematic diagram of the utility model LED filament not cut；

Figure 28 B are that the circuit film second embodiment of the utility model LED filament not cut is covered on the signal of LED chip Figure；

Figure 29 A are the circuit film 3rd embodiment schematic diagram of the utility model LED filament not cut；

Figure 29 B are that the circuit film 3rd embodiment of the utility model LED filament not cut is covered on the signal of LED chip Figure；

Figure 30 A to 30E are the production method first embodiment schematic diagram of the utility model LED filament；

Figure 31 is the schematic diagram of the production method second embodiment of the utility model LED filament；

Figure 32 A to 32E are the schematic diagram of the production method 3rd embodiment of the utility model LED filament；

Figure 33 is the structural schematic diagram of the first embodiment of the utility model LEDbulb lamp；

Figure 34 is the structural schematic diagram of the second embodiment of the utility model LEDbulb lamp；

Figure 35 A are the stereoscopic schematic diagram of the 3rd embodiment of the utility model LEDbulb lamp；

Figure 35 B are the vertical view projection figure for illustrating one embodiment of the utility model bulb lamp filament shape；

Figure 36 A are the section close-up schematic view of dashed circle part in Figure 35 A；

Figure 36 B-36D are the schematic diagram for showing the various embodiments of the electrode section of the utility model filament；

Figure 36 E are the stereoscopic schematic diagram of the fourth embodiment of the utility model LEDbulb lamp；Figure 36 F and 36G are its side Front view and side side view；Figure 36 H are its vertical view；

Figure 36 I-36K are partial cross section's enlarged diagram of three kinds of different embodiments of the utility model lamp housing；

Figure 36 L are the stereoscopic schematic diagram of the 5th embodiment of the utility model LEDbulb lamp；

Figure 36 M are the stereoscopic schematic diagram of an embodiment of the utility model LED light shell；

Figure 36 N are the stereoscopic schematic diagram of the sixth embodiment of the utility model LEDbulb lamp；Figure 37 is the utility model The stereoscopic schematic diagram of 7th embodiment of LEDbulb lamp；

Figure 38 is the schematic top plan view of the circuit board of the driving circuit of the utility model LEDbulb lamp；

Figure 39 A-39E, 40-46 are respectively the schematic cross-section of the utility model filament layer structure difference embodiment；Wherein Figure 39 B are the schematic cross-section for the filament layer structure for increasing bond strength；Figure 39 C-39E are the lamp for showing to increase bond strength One embodiment of silk layer structure, wherein Figure 39 C be the stereogram for only showing base, and Figure 39 D are to show standing for top layer and base Body figure, Figure 39 E are the sectional view of E1-E2 lines in Figure 39 D；

Figure 47 A are the stereoscopic schematic diagram of one embodiment of the utility model filament layer structure；

Figure 47 B are the sectional view of one embodiment of the utility model layer structure；

Figure 48-50 is respectively the sectional view of the utility model filament packaging structure difference embodiment；

Figure 51 A-51D are the filament solid signal for being provided with first to fourth embodiment of the utility model filament assistant strip Figure；

Figure 51 E-51F are the schematic diagram for implementing the utility model filament assistant strip in bulb lamp；

Figure 52 is the schematic cross-section of an embodiment of the utility model LED filament；

Figure 53 is the schematic cross-section of another embodiment of the utility model LED filament；

Figure 54 A to 54F are the schematic diagram of the line array of the LED chip of the multiple embodiments of the utility model；

Figure 55 A to 55C are respectively the transverse sectional view of the LED filament of the multiple embodiments of the utility model.

Specific implementation mode

It is understandable to enable the above objects, features, and advantages of the utility model to become apparent, below in conjunction with the accompanying drawings with tool Body embodiment is described in detail the embodiment of the utility model.

Traditional bulb lamp in the production process, in order to avoid tungsten filament fails in combustion synthesis in air and oxidation scission, therefore The glass structure object that a loudspeaker stem can be designed is sleeved on the opening of glass lamp housing and is sintered sealing, then penetrates loudspeaker core again Air inside lamp housing is substituted into nitrogen by the port connection vacuum pump of column, avoids the tungsten filament combustion oxidation inside lamp housing, finally again The port of loudspeaker stem is sintered sealing.In addition, substituting while can will also spread aerial water inside lamp housing by gas Mist removes together.Further, A is please referred to Fig.1, Figure 1A show the LEDbulb lamp 1 using LED filament 11, LEDbulb lamp 1 Include lamp housing 12, several LED filaments 11, auxiliary stand 13 to connect and support LED filament 11, metal mandril 14 to It substitutes the gas in LEDbulb lamp 1 and the function of heat conduction is provided, radiator 157 connects metal mandril 14 and by metal mandril 14 Transmitted be thermally conducted to except LEDbulb lamp, plastic lamp base 17, lamp cap 16 and in lamp cap 16 driving circuit (figure Do not show).In order to improve the light efficiency performance of LEDbulb lamp 1, lamp housing 12 must have preferable transparency and heat-conducting effect, because This, the present embodiment is preferred using glass lamp housing, has high light transmission in addition and the plastic lamp housing of high heat conduction effect also may be selected, and is examined Consider demand of the market segment to low color temperature bulb lamp, can moderately be adulterated with golden yellow material, or in lamp housing in lamp housing Inner surface plates the film of last layer golden yellow, the blue light that the micro absorption part LED chip of appropriateness is sent out, to downgrade LED ball Steep the colour temperature performance of lamp 1.Or lamp housing also can be the lamp housing of cloudy surface or minute surface.As previously mentioned, vacuum pump penetrates metal mandril 14 can substitute the air inside lamp housing the ratio mixing for helping nitrogen or nitrogen and helium appropriateness, to improve gas in lamp housing Thermal conductivity, while having also been removed the water mist hidden in air.In addition, lacking the heat conduction auxiliary of metallic support, LED filament 11 The heat of generation is not easy to be directly transferred to outside lamp housing, however penetrates metal mandril 14 to absorb the heat that LED filament 11 radiates Source, so that it may to conduct the heat to radiator 157 rapidly to be discharged outside lamp housing.If in addition, in view of improving asking for light efficiency performance Topic can also be used the glass stem of traditional not extinction, and have the stone of high heat conduction characteristic again in its surface plating last layer light-permeable Black alkene can improved heat radiation problem.Radiator 157 is slightly in the open end that hollow cylinder is centered around lamp housing 12, and inside can place Metal, ceramics or high heat conduction plastics with good heat conductive effect can be selected in material for the driving circuit of LED filament 11, be elected to When with metal material (such as Al aluminium) come as radiator 157, because the thermal conduction characteristic of metal material is fine, but its hot spoke It is very poor (such as radiance of aluminium only about 0.1) to penetrate characteristic, so surface needs coating to reinforce thermal radiation effect, such as aluminium oxide (radiance about 0.4) just has preferable thermal radiation effect.Radiator 157 is preferably provided with a lid in the open end close to lamp housing 12 Plate 1501, surface can coat aluminium oxide or the reflecting coating of white, and one can increase the heat-conducting area of radiator 157 and improvement Thermal radiation property, fully absorbs the heat of the generation of LED filament 11 and LED filament 11 can be sent out by conducting to the spherical shell external world, two Light reflection goes out outside lamp housing to improve light efficiency.It is passed through for metal mandril 14 and auxiliary stand 13 in addition, being provided on cover board 1501 Hole.Driving circuit can pass through auxiliary stand 13 and is electrically connected with several LED filaments 11, provide power supply to light LED LED chip on filament 11, the input lead of the driving circuit other end, which is then done with the lamp cap 17 of 1 tail end of LEDbulb lamp, electrically to be connected It connects.

As previously mentioned, traditional bulb lamp is in the production process, the opening that glass lamp housing can be sleeved on loudspeaker stem adds To be sintered sealing, since the material of the two is all glass, it can mutually be melted after high temperature sintering and achieve the purpose that sealing.But Change in embodiment using after metal mandril 14, the sintering sealing effect of metal and glass can not just be reached as glass horn stem Effect, therefore the present embodiment for connection metal mandril 14 157 structure of radiator adjusted, to reach sealing bulb lamp The purpose of lamp housing.As shown in Figure 1B, the external form of radiator 157 is covered in the open end of lamp housing 12, edge just as a bottle cap It is connect with the open end glass of lamp housing 12 with bending part 1572, is the amplification knot of a-quadrant in Figure 1B please also refer to Fig. 2, Fig. 2 Composition, the port centre of the bending part 1572 have the recessed portion 1573 of indent, the rough open end glass than lamp housing 12 of width Glass thickness more greatly, therefore the entire open end of lamp housing 12 can by recessed portion 1573 completely covering envelope.Recessed portion 1573 It is interior moderately to insert the good fluid sealant of leakproofness, make radiator 157 and the connection of lamp housing 12 more firm.Radiator 157 Plastic lamp base 17 can be added again between lamp cap 16, safety when with maintenance personnel's device or removal bulb lamp.

Upright symmetrical pattern arrangement can be presented in the arrangement mode of several LED filaments 11 around metal mandril 14, so And in view of the demand of full optical illumination, filament preferably using tiltedly put and non-parallel to metal mandril 14 by the way of it is preferable.LED filament LED chip in 11 can moderately select jumbo chip and shinny to be driven with low current, to achieve the purpose that relatively low fever, It allows the light efficiency of LED filament 11 that can be more than 180lm/W, the whole lamp brightness of LEDbulb lamp 1 can so be allowed to surmount 700lm easily.This Outside, for whole bulb lamp, the ornaments optimum position of lamp source is the ball immediate vicinity of lamp housing, and long filament can not It all furnishes in this area, therefore several more shorter LED filaments is selected to can reach preferably full light effect, at this The length of LED chip is ideal with 20mm or less in embodiment, and 15~10mm is best selection, but can also be used The LED chip of 10x20mm, 14x34mm, 14x28mm equidimension.In addition, lamp source, which is dispersed into a plurality of short filament, can allow heat source Dispersion, can not only increase the heat dissipation effect of LEDbulb lamp entirety, even if the light change rate at the position of 12 top of lamp housing It can be far below 50%, i.e. the brightness of lamp housing top is not less than the 50% of the most bright position brightness of LEDbulb lamp.

Metal mandril above-mentioned can also be changed to ceramic stem in the present embodiment into, the preferred material of ceramic material is oxygen Change aluminium or aluminium nitride, thermal radiation absorption rate can more effectively absorb the heat that LED filament is sent out more than glass height, Except heat derives LEDbulb lamp.In other embodiments, the material of radiator (together with the screw socket of LEDbulb lamp) also may be used Select the ceramic material with good heat conductive effect, so that it may with integrally formed with ceramic stem, the spiral shell of LEDbulb lamp can be removed from Mouthful need to thermal resistance glued with radiator and increasing LED filament heat dissipation path, there is better heat dissipation effect.

In the present embodiment, the luminous efficiency of LEDbulb lamp is, for example, 30~400lm/W, preferably 50~250lm/ W.The whole lamp brightness of LEDbulb lamp is for example up to 800lm.The colour temperature of LEDbulb lamp is 2200K~6500K, preferably 2500K~4000K.In addition, the shape of gel coated LED chip can be square or rectangular, vertical and horizontal ratio Such as it is 1:1~1:100.

The LED filament 11 of LEDbulb lamp shown in Figure 1A and Figure 1B, in processing a plurality of filament of generally use 11 respectively with The auxiliary stand 13 is welded to each other, and welding procedure is relatively complicated, and due to using spot welding mode, to the performance of material It is more stringent with size requirement, and there are the risks of rosin joint.In order to simplify technique, the process time of LED filament is saved, simultaneously In order to improve the reliability of welding and reduce the dependence to material, the utility model provides another LEDbulb lamp 5 such as Fig. 1 C institutes Show, LEDbulb lamp 5 includes：Lamp housing 52, LED filament component 51, auxiliary stand 53, metal mandril 54, lamp cap 57, and be set to Driving circuit (not shown) in lamp cap 57.Wherein, auxiliary stand 53 is connecting and supporting LED filament component 51.Metal core Column 54 is substituting the gas in LEDbulb lamp 5 and provide the function of heat conduction.Upright bar 541 extends from metal mandril 54；And it assists Holder 53 extends from upright bar 541.

Fig. 3 is the expanded schematic diagram of the filament assembly 51 of LEDbulb lamp 5 shown in Fig. 1 C.The LED filament component 51 is one Body formed module, LED filament component 51 include a plurality of LED filament 511, and the structure of LED filament 511 can be soft or hard LED Filament.A plurality of LED filament 511 is integrally connected by first connecting portion 512 positioned at its both ends and second connecting portion 513.Adding During work, a plurality of LED filament 511 and first connecting portion 512, second connecting portion 513 can in being combined as a whole in plane, without Must again individually every LED filament 511 respectively with 53 spot-welded of auxiliary stand, it is not only simple for process, saved process time, And the problem of there is no rosin joints.

In above-described embodiment, first connecting portion 512 and second connecting portion 513 are all the connection shape of multiple T fonts.Its The vertical portion of middle T words forms the electrode 511A and 511B of LED filament 511.Wherein, include the first connecting portion of electrode 511A 512 and the second connecting portion 512 including electrode 511B can be one of the forming.In another embodiment, electrode 511A with 511B can be initially formed in the both ends of LED filament 511, then respectively be connect with first connecting portion 512, second connecting portion 513.Herein So-called connection can be the modes such as welding, male and female shape cooperation, riveting.

The shape of LED filament component 51 can be sector shown in Fig. 3 before bending, or it is shown in Fig. 4 substantially Rectangular configuration.When using fan-shaped structure, the length of the first connecting elements 320 is less than the length of the second connecting elements 322, i.e., by The radius for the near circular that first connecting elements 320 surrounds is less than the circular radius that the second connecting elements 322 surrounds.In this way Design LED filament component 51 can be more stable when being hung on auxiliary stand 53 using hook form.When using rectangle shown in Fig. 4 When structure, LED filament component 61 includes a plurality of LED filament 611 and is connected to first connection at 611 both ends of a plurality of LED filament Component 612 and the second connecting elements 613, the length of the first connecting elements 612 are equal to the length of the second connecting elements 613.So The LED filament component 61 that formation is arranged can be more regular and error is smaller.Two kinds of LED filament components 51,61 of Fig. 3 and Fig. 4 have There are one common ground, i.e., is substantially equidistantly arranged between a plurality of LED filament, be more advantageous to uniform light extraction in this way.

Fig. 8 shows when being the situation that does not arrange equidistantly between a plurality of LED filament in another embodiment, wherein LED light Spacing between silk 5111 and LED filament 5112 is significantly greater than the spacing between other LED filaments.When needs are sent out in emphasis direction In the case of light, this constructive embodiment may be used, it usually needs the luminous local LED filament of emphasis can arrange intensive A bit, secondary light emission direction can be selected the sparse arranged distribution of multiple LED filaments.Only with LED filament in certain Fig. 8 Component be it is fan-shaped as an example, in other embodiments LED filament equidistantly arrangement not may be adapted to LED filament component is square The situation of the regular figures such as shape or other irregular figures.

LED filament component 71 can also embodiment as shown in Figure 5, the reality of the present embodiment LED filament component 71 as shown in figure 3 Apply example the difference is that, LED filament component 71 includes two LED filament sub-component 71A, 71B, two filament sub-component 71A, 71B is symmetrical set, and is convenient for manufacture in this way, improves processing efficiency, and overall structure is more attractive, certain two filament sub-components 71A, 71B may be unsymmetric structure.Each filament sub-component 71A, 71B include at least two LED filaments 711, preferably It is three.711 both ends of LED filament are connected separately with the first connecting elements 712 and the second connecting elements 713.When actual processing, often A filament sub-component 71A, 71B are respectively process by integral molding techniques.So design not only has and is easily worked, work The simple advantage of skill, and user can arbitrarily remove one of filament sub-component according to actual needs, and only leave one Filament sub-component.

The usual LED filament component forms even shape after shaping, needs to bend to before being packed into lamp housing specific Shape, in order to which the LED filament component is shaped to scheduled shape and structure, as shown in fig. 6, the utility model also provides one kind Filament shaping tool 109, filament shaping tool 109 include filament shaping portion 1011, and filament shaping portion 1011 can be cylindric Or irregular roundness taper.In this example example, filament shaping portion 1011 be it is upper it is " small " under " big " cylindrical-shaped structure, filament is whole The top in shape portion 1011 is formed with the first limited cover 1021, the other end of first limited cover 1021 relative to filament shaping portion 1011 (being lower end in the present embodiment) is formed with the second limited cover 1031, and the first limited cover 1021 and the second limited cover 1031 are used for limiting The first connecting elements 512 and the second connecting elements 513 of LED filament component, LED filament 511 are then covered on filament shaping portion 1011 and by pressed by external force along the surface curvature in filament shaping portion 1011, to form curved surface.As shown in fig. 7, being Status diagram of the LED filament component 51 after molding before leaving filament shaping tool 109 is pressed.As seen from Figure 6, The diameter of one limited cover 1021 is less than the diameter of the second limited cover 1031, the first limited cover 1021 and the second limited cover 1031 it is straight Diameter can be slightly larger than the diameter in filament shaping connected to it portion 101 respectively.Such structure can so that limit effect is more preferable.

It, can be with as shown in figure 9, LED filament 511 be set in order to adjust the illumination effect of the utility model LEDbulb lamp Main light-emitting surface 511A and time light-emitting surface 511B are counted into, LED filament 511 is equipped with through main light-emitting surface 511A and time light-emitting surface 511B Loophole 5113.As shown in Fig. 9 (a), the LED chip 111 at several intervals is placed on main light-emitting surface 511A, and in Fig. 9 (b) In, then it is not provided with LED chip 111 on secondary light-emitting surface 511B.Therefore the light emission luminance of main light-emitting surface 511A compares time light-emitting surface 511B is eager to excel very much.Can (towards 54 side of stem) all be arranged inwardly according to actual needs in main light-emitting surface 511A by us, All (backwards to 54 side of stem) can also be arranged outwardly in main light-emitting surface 511A or even part main light-emitting surface 511A is set inwardly It sets, part main light-emitting surface 511A is arranged outwardly.Light emission luminance effect can be freely adjusted by these designs.

The positive and negative electrode conducting wire (not labeled) of LEDbulb lamp 1 shown in figure 1A is connected to the upper of the auxiliary stand 13 End and lower end are welded in order to facilitate LED filament and positive and negative electrode conducting wire, and the utility model also also can be as in Figure 10, positive wire 1a The lower end of LED filament component 51, i.e. 513 one end of the second connecting elements are connected to cathode conductor 1b.Due to positive wire The length of 1a and cathode conductor 1b have shorter length so that the conducting wire is not easy to shake in welding, and promoting welding can By property.Optionally, the second connecting elements 513 of LED filament component 51 also can with stem or other extend on the inside of the light bulb Supporter be connected and fixed, positive wire 1a and cathode conductor 1b can be configured flexibly at this time, as long as reach electrical connection lamp cap with The purpose of LED filament component 51.

Certainly, in other embodiments can also be as shown in figure 11, positive wire 2a and cathode conductor 2b are respectively welded In the upper end of LED filament component 51, i.e. the first connecting elements 512.The advantages of this design, is, passes through the positive wire 2a of lengthening It can prevent lamp cap shaking when welding from causing wire-break with cathode conductor 2b.

Figure 12 is the sectional view of the LEDbulb lamp along the directions X-X of the utility model shown in Fig. 1 C, and Figure 13 is LED in Figure 12 Filament assembly and partial enlarged view of the auxiliary stand with unification embodiment.In embodiment, auxiliary stand 53 can be that metal is (i.e. golden Belong to conducting bracket), and auxiliary stand 53 is connect with LED filament component 51 with hook mode group；Specifically, by existing product institute Auxiliary stand and each LED filament generally use spot welding mode are stated, not only efficiency is low, and is easy to cause rosin joint, influences lamp Performance.To solve these problems, in the utility model embodiment, auxiliary stand 53 has hook 531, LED filament component 51 are hung on by the first connecting elements 512 of upper end on the hook 531 of auxiliary stand 53.To realize the connection of the two, to Effectively solve the problems, such as that spot welding efficiency is low and connection reliability.

In embodiment shown in Figure 13, auxiliary stand 53 is metal, and separated in auxiliary stand 53 and form notch 532, (conduction auxiliary stand in the prior art is conducting electric current structure, is easy galvano-cautery) is so that auxiliary stand 53 is not It by electric current, only play fixed supporting role, to prevent galvano-cautery risk of the auxiliary stand 53 because of long-time service.

In addition, auxiliary stand 53 can be metal, plastics, glass or ceramic material or combinations thereof.In an embodiment, upright bar Auxiliary stand 53 is not set between 541 and the first connecting elements 512 of filament assembly, and the top of upright bar 541 has water The hook-shaped of extension is put down, to be combined with the first connecting elements 531.Alternatively, the top of upright bar 541 and the first connecting elements 541 it Between can have each other structure that male and female connects assembled with profit.

In the embodiment of above section, the first connecting elements 512 and the second connecting elements 513 are connected by LED filament 511 It connects.But it is initially integrated that the first connecting elements also can be with the second connecting elements, such as shown in Figure 14, LED filament component It may include that holder 324, multiple holders 324 are connected between the first connecting elements 320 and the second connecting elements 322 in 30d, Multiple holders 324 are located at the lower section of multiple filaments 300 in Figure 15.In an embodiment, the first connecting elements 320, holder 324, the second connecting structure 322 can be the insulator of integration, and the electricity on the first connecting elements 320, the second connecting elements 322 The circuit that pole constructs and electrode 310, electrode 312 can be known forms (such as printing etc.), or is formed with metal implantation, And it is combined with the first connecting elements 320, holder 324, the second connecting elements 32.

In an embodiment, the first connecting elements 320, holder 324, the second connecting structure 322 shown in Figure 14 can be Integrated electric conductor.Under this situation, front elevation can still be illustrated with Figure 14, and Figure 15 is then the back view of LED filament component. In Figure 14, including multiple filaments 300 of electrode 310,312 are formed in the top of holder 324；At this time to avoid short circuit, such as Shown in Figure 15, insulating segment 324i is provided in holder 324, insulating segment 324i can utilize extra quality molding, metal embedment, metal- The rack integral of the heterogeneous jointing-and-forming of plastics or other similar fashions and other parts.In other embodiment, insulating segment 324i also engages the holder part of upper and lower using modes such as solids.In an embodiment, when the first connecting elements 320, When holder 324, the second connecting structure 322 are electric conductor, the back side of LED filament component also can be as shown in figure 16, and holder 324 is disconnected It opens as upper bracket 324t and lower bracket 324b, to avoid short circuit.

Electric connection mode using the LED filament of LED filament component also can be series connection.Filament assembly 30g in Figure 17 It is similar with the filament assembly 51 of Fig. 3, but filament assembly 51 is sector, filament assembly 30g is rectangle.Filament assembly 30g first Connecting elements 320 and the second connecting elements 322 are presented linearly, and are respectively provided with insulation division 320i and insulation division 322i. The insulation division 322i of the insulation division 320i of first connecting elements 320 and the second connecting elements 322 offsets one from another without standing facing each other.Such as When such as the first connecting elements 320 between the first each two electrode 310 in Figure 17 as a linkage section, then the by left One, third, the 5th linkage section are conduction, remaining is insulation division 322i.And at this time the second connecting elements 322 first, third, Five linkage sections be insulation division 322i, remaining be conductive.So so that electric current is connected with a direction, and between multiple filaments Form series connection.It is formed by that circuit is as shown in figure 18, the anode of filament assembly is located at below right end, and cathode is located at left end lower section. Positive charge flows through each filament from the electrode 312 below left end and is made of filament electrode and first/second connecting elements Conductive channel arrived later left end filament cathode.Figure 18 filament series connection in addition to in connecting elements be arranged insulation division or The mode of disconnecting circuit other than being formed, can also be formed with filament being arranged the mode of diode, with limit electric current with Single direction circulates.

Figure 19 and Figure 20 is shown after forming lamps and lanterns using the filament assembly of Fig. 3, and structure is connected using in first/second Part makes opening or/and the height configuration of conducting wire avoids short circuit to adjust.In Figure 19 and Figure 20, upright bar 19a can be to insulate simultaneously Auxiliary stand 315 is connected, filament assembly is placed in auxiliary stand 315.First connecting elements has two openings respectively in front and back, makes It obtains the first connecting elements and is divided into first part 320l and second part 320r.There are one openings for second connecting elements 322 tool. Conducting wire 14a, the 14b extended from stem up extends the first part 320l for being respectively connected to the first connecting elements and Two part 320r.In Figure 20, there are one openings for the first connecting elements 320, and there are two openings for the second connecting elements tool so that second Connecting elements is divided into first part 322l and second part 322r.The conducting wire 14a and 14b extended from stem is respectively It is connect with the first part 322l of the second connecting elements and second part 322r.

Then explanation can be applied to the LED filament in above-mentioned filament assembly.Please also refer to Figure 21 to 22, Figure 21 is this reality With the three-dimensional partial cutaway schematic of New LED filament first embodiment, Figure 22 is the part section signal of the positions 2-2 in Figure 21 Figure.According to first embodiment, LED filament 100 includes 102,104, at least two electrode 110 of multiple LED chips, 112, Yi Jiguang Conversion layer 120 (in a particular embodiment, light conversion layer can be referred to as glue-line or layer of silica gel), the fluorescent powder 124 in light conversion layer 120 Certain radiation (such as light) can be absorbed and emitted beam.

LED filament 100 is after its electrode 110,112 is powered (voltage source or current source), you can it emits beam, with For the present embodiment, the light sent out can be essentially 360 degree of the light close to point light source；The utility model is implemented Example LED filament is applied to bulb lamp (such as, but not limited to Figure 33,34), then can send out full light (omni-directional Light), it is detailed later.

It can be seen from figure 21 that the cross sectional shape of the LED filament 100 of the utility model is rectangle, but LED filament 100 cross sectional shape is not limited thereto, and can also be triangle, circle, ellipse, polygon either diamond shape, or even also Can be using rectangular, but chamfering or fillet can be used in corner.

LED chip 102,104 can be single LED chip, can also be two LED chips, naturally it is also possible to be to include Plurality of LEDs chip is equal to or more than three LED chips.The shape of LED chip can be, but not limited to long strip type, long strip type Chip can have less electrode, reduce the chance of masking LED emitted lights.In addition, on the surface of LED chip 102,104 The conductive transparent indium-tin-oxide of last layer (Indium Tim Oxide, ITO) can be plated, which contributes to The uniform diffusion profile of electric current and improving luminous efficiency of LED chip.Specifically, LED chip 102,104 Aspect Ratios can be set in 2:1 to 10:1, such as, but not limited to 14x28 or 10x20.In addition, LED chip 102,104 can also use high-power LED core Then piece is operated with low current, although under the case where such LED chip 102,104 maintains low current density, can still be protected There is enough brightness, and LED chip not will produce a large amount of heat source, makes whole luminous efficiency good.

The transparent substrate of sapphire substrate or light-permeable can be used in LED chip 102,104 in itself, thus, LED 102,104 substrate of of chip itself will not cover the light that LED chip 102,104 is sent out, that is to say, that LED chip 102, 104 itself can emit beam from its circumferential surface.

It is electrically connected with each other between described two or multiple LED chips 102,104, by taking this embodiment as an example, each LED chip 102, it 104 is electrically connected for series system, but is electrically connected mode and is not limited thereto, series system after first parallel connection also can be used It is electrically connected, such as, but not limited to after the first parallel connection of each two LED chip 102,104, the chip 102,104 after each two parallel connections is again Series connection.

Electrode 110,112 is configured corresponding to LED chip 102,104, and is electrically connected LED chip 102,104.According to this reality Example is applied, electrode 110,112 is the both ends for being configured at the LED chip 102,104 after series connection, a part for each electrode 110,112 It exposes to except light conversion layer 120.Electrode 110,112 corresponds to the mode that LED chip 102,104 configures and is not limited thereto, Please refer to Figure 23,24, Figure 23,24 for the utility model LED filament first embodiment electrode it is corresponding with LED chip configure Other embodiment schematic diagram.It can see that LED chip 102,104 is to be configured to a reverse U shape and adjacent LED chip in Figure 23 102, it 104 is electrically connected using series system, 110,112, electrode is configured at the both ends of U-shaped and is respectively electrically connected to Adjacent LED chip 102,104.It is in that two parallel lines arrange that Figure 24, which can be seen that LED chip 102,104 substantially, is respectively gone here and there Connection formula is electrically connected, and 110,112 both ends for being configured at two parallel line of electrode, and electric with adjacent LED chip 102,104 Property connection, formed first go here and there after and be electrically connected.Be in embodiment in Figure 24 by taking two electrodes 110,112 as an example, but not with This is limited, and 3 or 4 electrodes 110,112 also can be used, such as the electrode 110,112 of one of them in figure is individual with two Sub-electrode replaces, and two sub-electrodes are respectively positive pole, and 110,112, the electrode retained is common ground terminal.Or It is to replace two electrodes 110,112 in figure with two sub-electrodes, to be applicable in different applications.

Please arrange in pairs or groups Figure 33, and electrode 110,112 can have 111,113 (seeing Figure 21) of perforation in its exposed area, to When being assembled in LEDbulb lamp 10a, conducting bracket 14a, 14b are provided and are electrically connected, is detailed later.

Referring again to Figure 21 to 22, according to the present embodiment, electric connection above-mentioned is to be electrically connected phase by conducting wire 140 Adjacent LED chip 102,104 and electrode 110,112, conducting wire 140 can be gold threads, and the routing of LED encapsulation can be used in conducting wire 140 Gold thread is connected adjacent LED chip 102,104 and electrode 110,112 by processing procedure.The side Q-type may be used in the processing procedure of this routing Formula carries out routing, can be seen that from Figure 22, and the shape of the conducting wire 140 is in M fonts, this M fonts conducting wire 140 is so that the conducting wire 140 are in non-tight state, provide buffering effect, when LED filament 100 is bent, conducting wire 140 will not be broken.Outside conducting wire 140 Shape is also not limited to M fonts, and any shape that can slow down tight state, such as S-shaped etc. can be used.M fonts herein not to The shape for limiting conducting wire 140 is in M fonts, but to indicate to provide any shape of buffering effect, for example, working as conducting wire 140 Length be longer than the length of the routing to arch upward naturally between two adjacent electrodes 110,112, buffering effect can be provided, at this point, The shape that conducting wire 140 is in may have multiple wavy bendings in arched part.

Light conversion layer 120 includes glue and wavelength convert particle, is respectively silica gel 122 and fluorescent powder 124 in an embodiment, Light conversion layer 120 is covered in LED chip 102,104 and electrode 110,112, and makes a part for two electrodes 110,112 respectively It is exposed.In the present embodiment, each surface in six faces of LED chip 102,104 is covered with light conversion layer 120, i.e., described Six faces are covered and can be described as light conversion layer 120 and wrapped up LED chip 102,104 by light conversion layers 120, this covering or package can To be but not limited to be in direct contact, preferably, in the present embodiment, each surface in six faces of LED chip 102,104 It is in direct contact light conversion layer 120.However, when implementing, light conversion layer 120 can only cover each LED chip 102,104 6 Two surfaces in surface imply that light conversion layer 120 is in direct contact two surfaces, this two surface being in direct contact can be but It is not limited to the top surface in Figure 22 or bottom surface.Likewise, light conversion layer 120 can be in direct contact two tables of two electrodes 110,112 Face.The fluorescent powder 124 of metal oxide-type may be used in fluorescent powder 124, and such fluorescent powder 124 has preferable thermal conductivity.It is glimmering Light powder 124 can be harder than silica gel 122, and 124 granular size of fluorescent powder is about 1 to 30 micron (μm), and it is about 5 that size, which also can be used, To 20 μm of fluorescent powder 124, the size of identical fluorescent powder 124 is roughly the same, fluorescent powder 124 shown in Figure 22 because of section relationship, The position analysed is different, and the sectional area of section is just made to have size not.In other embodiments, aforementioned silica gel 122 can be with With polyimides Polyimide, or otherwise known as resin material replace or replace a part or as additive, to have preferably Toughness reduces cracking or brittle probability.Supplementary explanation, each surface in six faces of LED chip 102,104 is at least Some is in direct contact light conversion layer 120 and/or 102,104 wherein one~two sides of LED chip and is converted through crystal-bonding adhesive and light Layer between be bonded, also belong to six faces above-mentioned by light conversion layer cladding and/or LED chip be in direct contact light conversion layer etc. Same concept.Crystal-bonding adhesive above-mentioned can also mix fluorescent powder in other embodiments, to increase whole light conversion efficiency, crystal-bonding adhesive Generally also it is silica gel, is that crystal-bonding adhesive often mixes silver powder or heat dissipation powder is led to improve with the silica gel difference of mixed fluorescent powder Thermal effect.

Fluorescent powder 124 in light conversion layer 120 can absorb some form of radiation syndrome and go out light, such as fluorescent powder 124 Absorb the light of shorter wavelength and the light for the longer wavelength that shines.In one embodiment, fluorescent powder 124 absorbs blue light and sends out Huang Light, this yellow light form white light with after unabsorbed blue light.And six surfaces of aforementioned LED chip 102,104 are all covered It is covered in the embodiment of light conversion layer 120, the absorption of fluorescent powder 124 sends out longer after the light for the shorter wavelength that each surface is sent out The light of wavelength, due to fluorescent powder 124 around each outer surface of LED chip 102,104 to form LED filament 100 Ontology, therefore, each outer surface of LED filament 100 can send out mixing light.

The composition ratio (composition ratio) of fluorescent powder 124 and silica gel 122 is 1:1 to 99:1, preferable ratio is 1:1 to 50:1, this ratio can be weight ratio, can also be volume ratio.2 are please referred to Fig.2, in this embodiment, fluorescent powder 124 compares Example is more than silica gel 122 so that 124 density of fluorescent powder is improved and then contacted with each other, and as shown in the straight line in Figure 22, is arranged together The fluorescent powder 124 being in contact forms thermally conductive pathways (thermally conductive pathways as shown in arrow in Figure 22), is said into one, light conversion layer 120 With being formed by thermally conductive pathways by fluorescent powder that is adjacent and being in contact 124, the thermally conductive pathways are from LED chip 102,104 tables Face to the outer surface of LED filament 100, therefore the heat that LED chip 102,104 generates can be transmitted to the outer of light conversion layer 120 Portion so that LED filament 100 has the problem of better heat dissipation effect, light conversion layer 120 has also postponed yellow.And fluorescent powder 124 Coloured light conversion ratio can so improve the light efficiency of LEDbulb lamp entirety to 30% to 70%, LED filament can also be increased 100 hardness promotes the pliability of LED filament 100, in addition need not support LED filament with frame.In addition, general After silica gel forming, surface is more smooth, is unfavorable for the light that LED chip 102,104 is generated with fluorescent powder 124 and penetrates away. In the present embodiment, since 124 ratio of fluorescent powder in silica gel 122 improves, the surface roughness of LED filament 100 can be effectively increased With the surface area of filament entirety, that is to say, that be effectively increased the whole heat dissipation area of LED filament 100 so that LED filament 100 have more preferably heat dissipation effect.In addition, also due to the whole surface area of LED filament 100 increases, therefore increase filament table The point light source of 124 light of face fluorescent powder conversion, and then promote the luminous efficiency of LEDbulb lamp entirety.In addition, light conversion layer surface Can be various lens shapes, with different optical effects；Or moderately retain gap in light conversion layer, it can promote scattered Heat.

Furthermore in the present embodiment, the LED chip for sending out blue light can be used in LED chip 102,104, and fluorescent powder 124 is Can correspond to using yellow fluorescent powder (such as:Garnet series phosphor powders, YAG fluorescent powder), whereby so that LED filament 100 is sent out White light when implementation, can suitably allocate the ratio of fluorescent powder 124 and silica gel 122 so that the spectrum of white light more meet it is traditional white The spectrum of vehement lamp can absorb blue light and be converted into green-yellow light or feux rouges of further arranging in pairs or groups in addition, fluorescent powder 124 also can be used Fluorescent powder 124 can fit light tune by fully absorbing the blue light that LED chip 102,104 is sent out by a large amount of fluorescent powder 124 Ratio with different fluorescent powders 124 converts most blue light to green-yellow light, and least a portion of blue light is then all converted to red Light so that the Integral luminous colour temperature of LED filament 100 is expected closer to 2400 to 2600K (spectrum of conventional incandescent).

In the ratio of suitably allotment fluorescent powder 124 and silica gel 122, you can adjustment 100 pliability of LED filament (deflection), imply that young's modulus (Yong ' s Modulus) Y of LED filament 100 can be between 0.1 to 0.3x10¹⁰Pa (Pa) between, consider the application of bulb lamp, can adjust the young's modulus of LED filament 100 to 0.15 to 0.25x10¹⁰Pa (Pa) it Between, such the problem of improving conventional LED light bulb filament easy fracture, but still with enough rigidity and pliability.

It please continue and illustrate refering to the three-dimensional part section that Figure 25-26, Figure 25 are the utility model LED filament second embodiment Figure；Figure 26 is the partial cutaway schematic of the positions 5-5 in Figure 25.

According to LED filament second embodiment, LED filament 200 includes 202,204, at least two electrode of multiple LED chips 210,212 and light conversion layer 220.It is electrically connected with each other between LED chip 202,204, electrode 210,212 corresponds to LED chip 202,204 configuration, and it is electrically connected LED chip 202,204.Light conversion layer 220 cover LED chip 202,204 and electrode 210, 212, and make a part of exposed of two electrodes 210,212 respectively, wherein light conversion layer 220 includes silica gel 222, oxidation nanometer grain Sub (Nanoparticle) 226 and fluorescent powder 224.

Oxidation nanometer particle 226 can be (such as inorganic oxide nano-particle), and size belongs to nano level particle, ruler Very little to be less than fluorescent powder 224, the material of oxidation nanometer particle can be but not limited to the oxidation nanometer particle 226 of tool heat-conducting effect, Such as, but not limited to aluminium oxide (Al₂O₃), silica (SiO₂), zirconium oxide (ZrO₂), titanium oxide (TiO₂), calcium oxide (CaO), oxygen Change the materials such as strontium (SrO) and barium monoxide (BaO) and is formed by nano-particle.These oxidation nanometer particle mean sizes be about 10 to 300nm, most of particle size fall within 20 to 100nm.

It can see that in fig. 26,222 inner addition oxidation nanometer particle 226 of silica gel and fluorescent powder 224, due to oxidation nanometer The hardness of particle 226 is different with fluorescent powder 224 with cost, therefore, oxidation nanometer particle 226, fluorescent powder 224 and silica gel 222 The visual cost of ratio, thermal conductivity and whole pliability etc. consider and change.Secondly as the size of oxidation nanometer particle 226 is small In fluorescent powder 224, therefore oxidation nanometer particle 226 can fill up the gap between 224 particle of fluorescent powder, increase mutual contact surface Product, forms more thermally conductive pathways, as shown in the straight line in Figure 26, promotes the whole heat-conducting effect of LED filament 200.Meanwhile oxygen Changing nano-particle 226 can also allow light to generate deviation scattering, and the coloured light transfer efficiency for improving fluorescent powder 224 is simultaneously adequately uniformly mixed Light, allow LED filament 200 the characteristics of luminescence more preferably.

In other embodiments, fluorescent powder is evenly distributed on polyimides Polyimide, or otherwise known as in resin material, Under the best circumstances, each fluorescent powder is coated by polyimides Polyimide or resin material, can solve fluorescence Bisque is cracked or the problem of embrittlement.When practical application, it is extremely difficult to each fluorescent powder and is wrapped by, and/or in polyimides It, still must be mixed with the silica gel of part in Polyimide, or otherwise known as in resin material.In this case, it should be considered as glimmering Light powder is by polyimides Polyimide, or under the equivalents that are coated otherwise known as resin material.

LED filament 200 further includes multichip circuit film 240 (can also claim light transmission circuit film), LED chip 202,204 and electrode 210, it 212 is electrically connected with each other through circuit film 240, light conversion layer 220 is covered in circuit film 240.

LED filament can be hard filament (such as shore hardness may be greater than D50, young's modulus can be between 0.02 to 20x10⁹Between pa) or soft filament (such as shore hardness may be less than D50, and young's modulus be situated between can be in 0.1 to 0.3x10¹⁰Between pa).When application filament assembly of this filament in Fig. 3, two electrodes 110,112 in Figure 21 can be by the One interconnecting piece 512 and second connecting portion 513 replace, and electrode 511A and electrode 511B are electrically connected with filament at this time, it is preferable that electricity At least part of pole 511A and electrode 511B can be embedded in filament.In in this case, since the demand for supportive is higher than Pliability, therefore the hardness of filament can be kept ideal higher than D50 by the selection of glue or using baking processing procedure.

Please refer to Figure 27 A, Figure 27 A are the circuit film first embodiment of the utility model LED filament not cut Schematic diagram.Circuit film 240 includes the first film 242 and the conducting wire 244 positioned at the first film surface.First film 242 can be but It is not limited to film, below for convenience of description, the first film 242 is illustrated by embodiment of film, but and non-limiting reality It only can be film with the first novel film 242.In this embodiment, conducting wire 244 is in a strip shape, and respectively parallel Row.Different forms also can be used in conducting wire 244, such as the second embodiment of Figure 28 A circuit films, circuit film 240a include thin Film 242a and conducting wire 244a, wherein conducting wire 244a are to be distributed on film 242a in the pattern of oblique parallel line, respectively Spacing between adjacent conductive line can be less than or wait 70 μm, to have preferable electrical characteristic.And in the circuit film of Figure 29 A In 3rd embodiment, circuit film 240b includes film 242b and conducting wire 244b, and wherein conducting wire 244b is i.e. in staggeredly net The pattern of ruling is distributed on film 242b, and line width can be about 10 μm, and thickness can be about 2 μm.Conducting wire 244,244a, The form of 244b is not limited, and is electrically connected between LED chip 202,204 or LED chip 202,204 and electrode as long as can reach 210, between 212.

242 material of the film can be but be not limited to Kapton (Polyimide Film, PI film), light transmittance About 92% or more.244 material of conducting wire on film 242 can be but be not limited to indium tin oxide (ITO), nano-silver thread electricity Road, metal grill or carbon nanotubes make.For the shining of LED chip, silver-colored (Au) itself has quite good Reflecting effect will not extinction, and nano-silver thread is constituted cable shape branch with the line width of nano-scale, simultaneously with low resistance With the characteristic of high light transmission, therefore nano-silver thread is highly suitable for conducting wire 244,244a, 244b.In order to increase nano-silver thread with The gluing effect of LED core plate electrode can be adulterated golden (Au) in nano-silver thread.

The production method of circuit film 240 can be prior to forming conducting wire 244 on a film 242；Secondly, there is conduction in this Slot 246 is formed on the film 242 of circuit 244.

Figure 27 A are please referred to, since the conducting wire 244 on circuit film 240 is not covered with the surface of entire circuit film 240, Therefore, the light that LED chip 202,204 is sent out will not be covered or absorbed by conducting wire 244.The LED filament of first embodiment 100 is are electrically connected using gold thread, and the LED filament 200 of second embodiment is then electrically connected using circuit film 240 It connects, circuit film 240 has many advantages, such as that the line width being electrically connected is wider, flexible preferable, not easy to break compared to conducting wire 140.

Circuit film 240 and LED chip 202,204, the electric connection of electrode 210,212, can in advance chip 202, 204,210,212 position to be electrically connected of electrode is coated in advance with conducting paste, e.g. elargol, tin cream or doped with conductive gold The conducting resinl of metal particles can be used heating or irradiated with UV light, you can reach electric connection after being configured with circuit film 240 Effect.

It please continue refering to Figure 30 A to 30E, illustrate for the production method first embodiment of the utility model LED filament 200 Figure.The production method of LED filament includes：

S20：LED chip 202,204 and at least two electrodes 210,212 are configured in (such as Figure 30 A) on carrier 280；

S22：It is electrically connected LED chip 202,204 and electrode 210,212 (such as Figure 30 B)；And

S24：Light conversion layer 220 is set in LED chip 202,204 and electrode 210,212, wherein light conversion layer 220 covers Lid LED chip 202,204 and electrode 210,212, and expose outside a part for electrode 210,212 at least two, wherein light is converted Layer 220 includes silica gel 222 and fluorescent powder 224 (such as Figure 30 C to 30E).

Wherein, the mode (such as Figure 30 A) of LED chip 202,204 is configured in step S20, according to this embodiment, to be configured to square Figurate number group shape, each file on figure, therefore after processing procedure, can respectively form single LED filament 200.It is configuring When LED chip 202,204, series-parallel corresponding positive and negative electrode configuration when need to consider subsequently to be electrically connected.Carrier 280 can be but It is not limited to glass substrate or metal substrate.The shape of carrier can be such as the tablet of Figure 30 A or the reeded plate of the tool of Figure 31 Object, the groove can be used to configure base 120b.

The electric connection (such as Figure 30 B) of step S22 is in this embodiment to be with the circuit film 240a that do not cut of Figure 28 A Example is electrically connected LED chip 202,204 and electrode 210,212.In addition to this, not cutting such as Figure 27 A or 29A also can be used Circuit film 240,240b are electrically connected, or are electrically connected using the conducting wire 140 such as Figure 24.

The setting light conversion layer of step S24 is on LED chip 202,204 and electrode 210,212, when practical operation, can adopt It is carried out with various ways, first, is illustrated by taking Figure 30 C to 30E as an example comprising：

S240：Light conversion layer (top layer 220a) is coated in LED chip 202,204 and electrode 210,212 not in contact with carrier 280 Side；

S242：Overturning has been coated with the LED chip 202,204 and electrode 210,212 of light conversion layer (top layer 220a)；And

S244：Light conversion layer (base 220b) is coated in the another of the LED chip and the uncoated light conversion layer of the electrode Side.

Wherein, it is named as top layer 220a in the light conversion layer 220 of step S240, in step with difference for ease of description The light conversion layer 220 of S244 is named as base 220b.

In step S240, after top layer 220a is coated on LED chip 202,204 and electrode 210,212, silica gel 222 and fluorescence Powder 224 can fill up the gap between LED chip 202,204 and electrode 210,212, then to having been coated with the LED core of top layer 220a Piece 202,204 is cured (or solidification) program with electrode 210,212, so that top layer cures and coats the LED core above carrier Piece 202,204 and electrode 210,212, while exposing outside in electrode 210,212 at least two subregion.This program curing is for example But it is not limited to heating or ultraviolet light (UV) irradiation.

The overturning of step S242, which has been coated with the LED chip 202,204 of light conversion layer (top layer 220a) and electrode 210,212, to be had Several ways, one are that LED chip 202,204 is only configured at electrode 210,212 on carrier 280, have no the relationship of sticking together therebetween, It can directly overturn, and the semi-finished product after overturning can be placed in again on the carrier.

Another way can have to stick together between carrier 280 and LED chip 202,204, electrode 210,212 Colloid substance, such as the photoresist that uses of manufacture of semiconductor or the crystal-bonding adhesive convenient for removal, this colloid substance after appropriate baking, Have the effect of temporary fixed LED chip 202,204, electrode 210,212 on carrier 280.Therefore, it is had been coated in overturning Before or after the LED chip 202 of top layer 220a, 204, electrode 210,212, the light being coated on substrate can be cleaned with acetone Resistance, or the crystal-bonding adhesive with corresponding solvent cleaning on substrate, you can by have been coated with top layer 220a LED chip 202,204, Electrode 210,212 is detached with carrier 280, forms LED filament semi-finished product (such as Figure 30 D).In addition, also can further clean described LED filament semi-finished product, to remove remaining photoresist or crystal-bonding adhesive.

Finally, step S244 be coating light conversion layer (base 220b) in LED chip 202,204 and electrode 210,212 not It is coated with the other side of light conversion layer 220a, and base 220b is made to cure (such as Figure 30 E).

Top layer 220a in Figure 30 C is slightly larger than the circuit film 240a not cut, but is not limited thereto when implementation.And scheming Top layer 220a (due to overlapping relationship) slightly identical as the size of base 220b in 30E, but be not limited thereto when implementation, Its size optionally can have large and small difference.

After step S24, it separately may include that the cutting of step S26 covers the LED chip 202,204 and electricity of light conversion layer Pole 210,212, i.e., such as the cutting position that Figure 30 E chain lines are drawn, thus, which the strip component after cutting is LED filament 200.The cutting mode of step S24 is not limited with Figure 30 E, also can each two adjacent columns file LED chip 202,204 it is cut into single LED filament.

Figure 27 A, 28A and 29A do not cut circuit film 240,240a, 240b are covered on LED chip 202,204 and electrode 210,212 correspondence is respectively found in Figure 27 B, 28B and 29B, and the chain-dotted line in figure is cutting line, is detailed later.

It is to be arranged in a manner of rectangular array, but production method is not limited thereto, in step in the processing procedure of Figure 30 A to 30E The configuration mode of rapid S20, also can only configure the LED chip 202,204 of single file, thus, i.e. without carrying out step S26 Cutting process.

About the second embodiment of 200 production method of LED filament, Figure 31, the production method packet of second embodiment are please referred to It includes：

S20A：Light conversion layer (base 120b) is coated on carrier 180；

S20B：LED chip 102,104 is configured with electrode 110,112 in the light conversion layer (base 120b) on carrier 180 On；

S22：It is electrically connected LED chip 102,104 and electrode 110,112；And

S24：Light conversion layer (top layer 120a) is coated in LED chip 102,104 and electrode 110,112 not in contact with light conversion layer The side of (base 120b), wherein light conversion layer 120 is covered in LED chip 102,104 and electrode 110,112, and makes two respectively A part of exposed 110, the 112 of a electrode 110,112, wherein light conversion layer 120 includes silica gel 122 and fluorescent powder 124.

As can be seen from Figure 31, a base 120b is first set on carrier 180, this base 120b is also light conversion layer A part implies that include silica gel 122 and fluorescent powder 124, in this preparation method, though first base 120b is set on carrier 180, But it is not limited thereto, when implementation, carrier 180 can also not used, and directly carry out the direct configuration LED chip of step S20B 102,104 with electrode 110,112 on base 120b.

The thickness of base 120b can be 50 to 100 microns (μm), and depending on fluorescent powder 124 and 122 ratio of silica gel, thickness can be 60 to 80 μm.After having carried out step S20, heating can be used or irradiated come slightly solidification basic unit 120b with UV light, and dropping After temperature condensation, LED chip 102,104 gets adhered with electrode 110,112 is fixed on base 120b.In addition to this, it also can be used Crystal-bonding adhesive sticks together fixed LED chip 102,104 and electrode 110,112 on base 120b.

After the electric connection for completing S22, S24 configuration top layer 120a can be directly carried out in LED chip 102,104 and electricity Pole 110,112 and cures top layer 120a not in contact with the side of base 120b.Thus, you can save overturning step or removal To stick together carrier 180, LED chip 102,104, with the colloid substance of electrode 110,112 the step of.

According to the embodiment of Figure 31, after having carried out step S24, the cutting that can also carry out step S26 covers light turn Change the LED chip 102,104 and electrode 110,112 of layer.

For aforementioned base 120b to carry LED chip 102,104 and electrode 110,112, thickness can be 0.5 to 3mm (milli Rice) or 1 to 2mm, after configuration is complete, base can suitably be heated so that the surfaces base 120b slightly melt, in base 120b LED chip 102,104 can be made to stick together fixation with electrode 110,112 after cooling condensation.

Secondly, the fluorescent powder 124 of base 120b can be adjusted suitably with the doping ratio of silica gel 122, so that its hardness obtains It is suitable for subsequent electric connection program, such as, but not limited to, the hardness after adulterating and curing can be in shore hardness (HS) 60HD More than.Thus, in addition to making LED filament 100,200 that integrally there is hardness appropriate, conducting wire (gold thread) routing also may make The stability of processing procedure improves, and after finished goods, LED filament 100,200 is either pressurized or bends, and can maintain good electricity Property connection.

In the embodiment of Figure 31, base 120b need to carry LED chip 102,104 and electrode 110,122, therefore, solidification Rear hardness or hardness before curing need it is appropriately designed, so that subsequent be electrically connected (such as needs harder base when routing 120b supports LED chip 102,104 and electrode 110,122), and top layer 120a then no this item demands, therefore, top layer 120a and base Layer 120b silica gel 122 can be different from the ratio of fluorescent powder 124, visual global design demand and change.Certainly, Figure 31's In embodiment, light conversion layer 120 can also include 224 (not shown) of aforementioned oxidation nano-particle.

Then, Figure 32 A to 32E are please referred to, are the signal of the production method 3rd embodiment of the utility model LED filament Figure.

LED light wire production method 3rd embodiment includes：

S202：Configure conductive foil 130 on light conversion layer (base 120b) (as shown in fig. 32 a)；

S204：Configure LED chip 102,104 and electrode 110,112 on conductive foil 130 (as shown in fig. 32b)；

S22：It is electrically connected LED chip 102,104 and electrode 110,112 (as shown in fig. 32 c)；And

S24：Light conversion layer (top layer 120a) is coated in LED chip 102,104 and electrode 110,112 not in contact with conductive foil 130 side, wherein light conversion layer 120 is covered in LED chip 102,104 and electrode 110,112, and makes two electrodes respectively 110,112 it is a part of exposed, wherein light conversion layer 120 includes silica gel 122 and fluorescent powder 124.

Please refer to Figure 32 A, step S202 light conversion layers can be described as base 120b, and conductive foil 130 can have as aforementioned There are multiple openings (132), 132 width of being open is less than the length of LED chip 102,104, and is open and 132 respectively corresponds to It the luminous zone of LED chip 102,104 will not be by 130 institute of conductive foil when being emitted beam by driving in favor of LED chip 102,104 Masking.

Conductive foil 130 can be the copper foil of electroplate, but be not limited thereto, and 132 formation of being open can led It is formed with impact style on electric foil 130.

It before step S202, can also increase a step, be that base 120b is first configured on a support plate, or be straight It connects and base 120b is configured on a workbench.

Step S204 please refers to Figure 32 B, for LED chip 102,104 and electrode 110,112 are configured at conductive foil 130 On, as aforementioned, the light-emitting zone of LED chip 102,104 can be corresponded to the opening 132 of conductive foil 130 by when configuration.

With continued reference to Figure 32 C, the electric connection of step S22 is carried out using routing mode in the present embodiment, each is led Two ends of line (such as gold thread) are connection conductive foil 130 and adjacent LED chip 102,104 or adjacent electrode 110,112, to be formed It is electrically connected, in the present embodiment, is electrically connected with connecting.

Then, Figure 32 D are please referred to.Such as the embodiment of Figure 31, the light conversion layer system of step S24 can be described as top layer 120a, When configuring top layer 120a on LED chip 102,104 and electrode 110,112, the material of top layer 120a (silica gel 122 with it is glimmering Light powder 124) it can be filled to the gap of beneath chips.

The fluorescent powder 124 of deployed ratio and silica gel 122 can be directly coated at LED by the configuration mode of top layer 120a In addition to this chip 102,104, also first can be coated with one on electrode 110,112 in LED chip 102,104 and electrode 110,112 Layer phosphor powder layer, is then coated silica gel, carries out program curing again thereafter.Another way is, by fluorescent powder and silica gel It is changed at many levels that alternately coating (or spraying) is in LED chip 102,104 and electrode 110,112, in this way, more uniform point can be obtained The effect of cloth.

After completing step S24, cutting process can be carried out again, also will each LED filament 100 cut down, such as Figure 32 E It is shown.

In the embodiment of Figure 32 A to 32E, LED chip 102,104 and the electric connection of electrode 110,112 are via gold Belong to foil 130 to complete with conducting wire 140 so that the connection relation between LED chip 102,104 and electrode 110,112 has more can Flexibility, when entire LED filament 100 is when being bent, the relationship of electric connection is also not easy to be destroyed.

Finally, Figure 33 and 34 is please referred to, for the first embodiment of LEDbulb lamp 10a, 10b of the aforementioned LED filament of application And the structural schematic diagram of second embodiment.It can be seen from the figure that, LEDbulb lamp 10a, 10b include lamp housing 12, lamp cap 16, are set to At least two conducting bracket 14a, 14b, the driving circuit 18 in lamp cap and single LED filament 100 in lamp housing 12.

Conducting bracket 14a, 14b are for electrically connecting to two electrodes 110,112 of LED filament 100, also can be used for supporting The weight of LED filament 100.Driving circuit 18 is that electric connection conducting bracket 14a, 14b and lamp cap 16, lamp cap 16 are connected to tradition Bulb lamp lamp holder when, lamp holder is to provide lamp cap 16 power supply, driving circuit 18 be from lamp cap 16 obtain power supply after driving The LED filament 100 shines.Due to the LED filament 100 can full face shine, entire LEDbulb lamp 10a, 10b can Generate full light above-mentioned.

The definition of full light described herein, depending on every country is to the specification of certain bulb, this definition also can be with Time and change, therefore, the citing of this exposure full light, not limiting the scope of the utility model.Full light Definition, such as american energy star plan (US Energy Star Program Requirements for Lamps (Light Bulbs)) there is corresponding definition to the light shape of bulb lamp (full light light bulb), with pedestal upper, light bulb is downward Be 180 degree when formula configures bulb lamp, above vertical, be 0 degree below vertical, it is required that between 0-135 degree each angle brightness (luminous intensity (cd)) should not have more than 25% difference with average brightness, and 135 to total between 180 degree Luminous flux (total flux (lm)) will at least account for the 5% of whole lamp.For another example 801 specifications of JEL of Japan require LED light In the section of 120 degree of ranges, luminous flux need to be less than the 70% of total light flux.

In the present embodiment, conducting bracket 14a, 14b but is not limited thereto, visual LED filament for two 100 conduction or supportive demand and accelerate.

Lamp housing 12 is to can be used that translucency is preferable or the preferable lamp housing of thermal conductivity, such as, but not limited to glass or plastic lantern Shell.When implementation, also doping last layer yellow film can be plated with golden yellow material or lamp housing surface in lamp housing 12, to inhale in right amount The blue light that receiving portions LED chip 102,104 is sent out adjusts the colour temperature of LEDbulb lamp 10a, 10b emitted light.When production, The gaseous mixture that gas in lamp housing 12 can be changed to nitrogen or nitrogen and helium or hydrogen and helium using vacuum pump is (appropriate Mixed proportion) so that the heat transfer of air in lamp housing 12 is more preferably, and remove the aqueous vapor of air in lamp housing.It is filled in lamp housing Air in 12 can be mainly selected from least one in the group being made of helium, hydrogen, and hydrogen accounts in lamp housing 12 always The percent by volume of capacity can be 5% to 50%, and the air pressure in lamp housing 12 can be 0.4 to 1.0 atmospheric pressure.

In Figure 33,34 embodiment, LEDbulb lamp 10a, 10b further includes stem 19 and radiating subassembly 17, and stem 19 is set In in lamp housing 12, radiating subassembly 17 is between lamp cap 16 and lamp housing 12 and connection stem 19, LED filament 100 are propped up via conduction Frame 14a, 14b connect stem 19.Stem 19 can be used to the gas substituted in LEDbulb lamp 10b and heat conduction is provided function, heat dissipation Component 17 connects stem 19 and lamp cap 16 and transmitted it be thermally conducted to except LEDbulb lamp 10b.Radiating subassembly 17 is located at Between lamp cap 16 and lamp housing 12 and connection stem 19, LED filament 100 connect stem 19.

19 material of stem of LEDbulb lamp 10a, 10b can be the metal or ceramics for having preferable heat-conducting effect, ceramic material Material can be aluminium oxide or aluminium nitride, and thermal radiation absorption rate can more effectively absorb 100 institute of LED filament more than glass height The heat sent out can be by lamp housing through stem 74 with vacuum pump by except heat derives LEDbulb lamp 10b when practical operation Air inside 12 substitutes the ratio mixing for helping nitrogen or nitrogen and helium or hydrogen and helium appropriateness, to improve lamp housing The thermal conductivity of gas in 12, while having also been removed the water mist hidden in air.Radiating subassembly 17 can slightly be in hollow cylinder It is centered around the open end of lamp housing 12, metal, ceramics or high heat conduction plastics with good heat conductive effect can be selected in material.Heat dissipation The material of component 17 (together with the screw socket of LEDbulb lamp) is alternatively the ceramic material with good heat conductive effect, radiating subassembly 17 Also the component that can be one of the forming with ceramic stem 19, the screw socket that can so remove LEDbulb lamp 10b from need to be with radiating subassembly 17 Thermal resistance that is glued and increasing by 100 heat dissipation path of LED filament, has better heat dissipation effect.

Figure 33 is please referred to, the height of radiating subassembly 17 is L1, and the height at 17 bottom of radiating subassembly to 12 top of lamp housing is The range of the ratio (L1/L2) of L2, L1 and L2 is 1/30 to 1/3.The ratio is smaller, then the beam angle of LEDbulb lamp 10a, 10b The light that degree is i.e. bigger, LEDbulb lamp 10a, 10b is sent out by radiating subassembly 17 hide we i.e. less and LEDbulb lamp 10a, The distribution for the light that 10b is sent out is i.e. closer to full light.

In the embodiment of Figure 33, LED filament 100 is to be bent into about 270 degree of circle, and 100 ontology of LED filament is in wave Shape it is convex with it is recessed, and be to maintain its wavy shape, LEDbulb lamp 10b separately may include cantilever 15 to be supported in LED filament At 100 wavy ontology peaks and troughs, thus, which LEDbulb lamp 10b can more be held by the LED filament suitably bent The illumination of full light is easily provided, in addition, the LED filament structure processing of one and assembly technology are more simple and convenient, while cost It can reduce very much.In the embodiment of Figure 34, the arc angle that LED filament 100 is formed by arc is about 270 degree, but in other realities It applies in example, LED filament 100 is formed by arc angle can be close to 360 degree, alternatively, single LEDbulb lamp 10b may include at least Two LED filaments 100, and each LED filament 100 is bent to form the arc angle of about 180 degree so that two LED filaments 100 are suitably matched It postpones, about 360 degree of arc angle can be formed.

In certain embodiments, cantilever 15 and/or stem 19 can be coated with the material of high reflection property, such as but unlimited In white material.Further, it is contemplated that heat dissipation characteristics, the material of the high reflection property can be selected with high-heating radiation absorption characteristic Material, such as, but not limited to graphene (Graphene), in other words, the surface of cantilever 15 and/or stem 19 can be coated with Graphene film.

5A and Figure 37 is please referred to Fig.3, Figure 35 A are the stereoscopic schematic diagram of the 3rd embodiment of LEDbulb lamp；Figure 36 E and figure 36L, Figure 36 N are respectively the 4th, the 5th of LEDbulb lamp, the stereoscopic schematic diagram of sixth embodiment；Figure 37 is LEDbulb lamp The 7th embodiment stereoscopic schematic diagram.According to 3rd embodiment, LEDbulb lamp 10c includes lamp housing 12, connects the lamp of lamp housing 12 First 16, at least two conducting bracket 14a, 14b, driving circuit 18, cantilever 15, stem 19 and the single LED light in lamp housing 12 Silk 100.Driving circuit 18 is electrically connected to conducting bracket 14a, 14b and lamp cap 16.And the 4th to sixth embodiment LED ball Bubble lamp is similar to 3rd embodiment, and the LEDbulb lamp 10d of the 7th embodiment includes two LED filaments 100a, 100b, from top It overlooking, described two LED filaments 100a, 100b are to bend to close to round (complete or tool notch ring-type), and regarded from side, Two LED filament 100a, 100b are to be located at different plumb heights.

LED filament 100,100a, 100b area of section be less than Figure 33, the sectional area of filament 100, LED in 34 embodiments Filament 100,100a, 100b electrode 110,112 be electrically connected to conducting bracket 14a, 14b, carry out driving circuit to receive 18 power supply,

Similar to the second embodiment of Figure 33,34, LED filament 100,100a, 100b of Figure 35 and 37 are bent into from top Portion's vertical view is rounded, meanwhile, LED filament 100,100a, 100b can also be bent into wavy (from side), this is wavy Structure not only novel appearance, and it is uniform to ensure that LED filament 100,100a, 100b shine.Meanwhile single LED light Silk 100 is less compared to the binding site that more LED filaments are needed when being connect with conducting bracket 14a, 14b, in practice single LED light Silk 100 only needs two basic change point as shown in figure 35, effectively reduces the risk of failure welding or reduces machinery pressure and is close to Process when connecing.In an embodiment (such as Figure 35 B), LED filament bendable is converted under the overlook observation of top with wave-like Mode surrounds light bulb center or stem.In different embodiments, from the LED filament under the overlook observation of top can be in similar round or U-like shape.The upright bar 19a that stem 19 separately extends perpendicularly to 12 center of lamp housing with one, a first end of each cantilever 15 are connected to Upright bar 19a, and a second end of each cantilever 15 is connected to LED filament 100,100a, the 100b, please refers to Figure 36 A, figure 36A is the section close-up schematic view of dashed circle part in Figure 35 A, and the second end of each cantilever 15 has a pincers portion 15a, Pincers portion 15a fixes LED filament 100,100a, 100b, and pincers portion 15a can be to fixed LED filament 100, the wave of 100a, 100b The wave crest or trough of wave-like, but be not limited thereto, i.e. pincers portion 15a can also be used to the fixed wavy wave crest of LED filament with Part between trough.The shape of pincers portion 15a can be matched with the shape of LED filament 100,100a, 100b truncation surface, and pincers portion 15a hole sizes can be slightly less than the size of the shape of LED filament 100,100a, 100b truncation surface, therefore, during fabrication, can LED filament 100,100a, 100b are passed through the endoporus (not labeled) of pincers portion 15a, it is fitted close with being formed.Another fixation side Formula is to form the pincers portion via bending program, furthermore, it is understood that being that LED filament 100,100a, 100b are first placed in cantilever 15 Free end, followed by jig by free end around LED filament 100,100a, 100b and bend, to form pincers portion 15a.Not Second end with cantilever in embodiment 15 can extend directly into the inside of LED filament 100 and as auxiliary in LED filament 100 Item is helped, to strengthen the mechanical strength of LED filament 100, related embodiment is as be described hereinafter.

The material of cantilever 15 can be but not limited to carbon spring steel, to provide rigidity appropriate and elasticity, to reduce Impact of the external vibration to LED filament, ensures that LED filament is unlikely to deform.Since upright bar 19a is the center for extending to lamp housing 12, And cantilever 15 is connected near the top of upright bar 19a, therefore, the plumb height of LED filament 100 is close in lamp housing 12 The heart, therefore the characteristics of luminescence of LEDbulb lamp 10c is close to the characteristics of luminescence of traditional bulb lamp so that it shines more uniformly, simultaneously Light emission luminance can also reach the luminance level of traditional bulb lamp.In addition, in the present embodiment, the cantilever 15 first of LED filament 100 End is connect with the upright bar 19a of stem 19, and the second end of cantilever 15 is connected to LED filament 100,100a, the 100b by pincers portion 15a External insulation face so that cantilever 15 is non-conductive, when avoiding previous cantilever conduction because by electric current generate heat by cause Wire in cantilever 15 expands with heat and contract with cold, and is burst to avoid glass stem 19.

Electrode 110,112 and the connection relation between conducting bracket 14a, 14b can be mechanical compression connections, also may be used To be to be welded to connect, the mechanical connection can be first conducting bracket 14a, 14b pass through electrode 110,112 perforation 111, 113, then reflexed conducting bracket 14a, 14b free end so that conducting bracket 14a, 14b clamp electrode 110,112 and form electricity Property connection.Welded type connection can be in the way of being welded etc. using silver-base alloy weldering, silver soldering, WU conducting bracket 14a, 14b and Electrode 110,112 connects.In addition, similar to the relationship in Figure 36 A between cantilever 15 and filament 100, filament and conducting bracket Electrode with filament can also be with the mode of Figure 36 A in a wherein side for conducting bracket (not shown) or electrode (such as Figure 36 C) Pincers portion is formed to fix.In addition, as shown in figure 36b, electrode 5061 can be hook-shaped in favor of being bound to conducting bracket.Implement in one In example, as shown in Figure 36 D, filament has the groove 5066 of accommodating electrode to house electrode 5064, so that electrode is hidden in filament body In without exposed, so that filament is reached more preferably light-out effect.

In an embodiment, light bulb shown in Figure 35 A can be the light bulb of A dimensions.Two conducting brackets and LED light Two contact points of silk 100, the i.e. two end electrodes of filament, the distance on horizontal plane can be within 3 centimetres, preferably 2 lis Within rice.Wavy due to filament is surround so that filament lamp is achieving the effect that except full light, moreover it is possible to reach two contacts Point it is close to each other so that conducting bracket is substantially at the lower section of filament, it is visually excessively noticeable not lofty and can be whole with filament Body forms graceful curve.When being observed by side, the distance of the highest point and the lowest point of filament wave is excellent at 2.2-3.8 centimetres It is selected in 2.2-2.8 centimetres.Thereby ensuring that possessing certain heat-dissipating space above filament.

As shown in Figure 35 A, filament shape can outline be considered as fitting equation：Filament spatial is located at shown in Figure 35 A Cartesian coordinate system；X-y plane is located at upright bar 19a top plans, and (when bulb lamp without core rod/upright bar, origin can be considered that ball steeps The spherical portion centers point of shell), and x-y plane is perpendicular to the short transverse of LEDbulb lamp 10c.Two filament electrodes (weld Point, that is, the contact point or fusion point) it is symmetrically distributed in y-axis both sides；Z-axis and stem (or LEDbulb lamp 10c Planar central axis) it is coaxial.Variation of the shape of LED filament 100 according to t (t is the variable between 0 to 1) in x, y and z directionss, Namely any point of LED filament is X, Y, Z in the position of x, y, z coordinate system and meets fitting equation, as follows：

X=m1*cos (t*360)；

Y=m2*sin (t*360)；

Z=n*cos (t*360*k)；

LED filament 100 is changed in the x, y and z directions according to t, and X=0, Shu Y Shu max (maximum value of Shu Y Shu)=m2, Shu Z are worked as Shu max (maximum value of Shu Z Shu)=n；Work as Y=0, Shu X Shu max (maximum value of Shu X Shu)=m1, Shu Z Shu max=n；Work as Z=0, Shu X Shu max= M1, Shu Y Shu max=m2；M1 represents X-direction length, 24≤m1≤27 (unit mm)；M2 represents Y-direction length, 24≤m2≤27 (unit mm)；So that filament environment and has good luminous flux in blister, n represents filament apogee distance on the directions z The height of x-y plane, 0 n≤14 ＜, unit mm；Filament turning point is less also easy to produce the case where gold thread fracture under the conditions of this；K The number for representing peak position is unfavorable for processing more to avoid strut (or cantilever/transverse direction assistant strip), and set k values as 2≤k≤8.The curve that aforesaid equation is described can be considered the benchmark of filament spatial distribution.In the item of certain techniques and equipment Under part, filament actual disposition with situation described by the fitting equation as a result, will have 0 to 25% spatial diversity value.And Can be the opposite highest of Z axis or opposite minimum, space difference value is smaller, perhaps in the filament areas for having fulcrum It can be considered 0 to 20%.Alternatively, when lamp housing radius is r, r herein is constantly to cut off the circle to be formed upwards from lamp housing bottom to cut Value when the radius maximum in face, can be by above-mentioned m1, and m2, n values are set as 0.8*r≤m1≤0.9*r；0.8r≤m2≤0.9r；0 ＜ n≤0.47*r.And it more can further set that when filament length G, then filament is long as p value when using the radius of lamp holder joints Degree is between 1.2*p≤G≤5.6r.By this setting, it can make filament in the case of maintaining said effect, moreover it is possible to will be required Filament length/LED chip inhibit in minimum zone, not only save filament material, also inhibit the heating in light bulb.

In another embodiment, as shown in Figure 35 B, filament can be considered a similar round in the projection of x-y plane, if center The planar projective point distance of point to filament can be considered that filament projection distance r, the circular arc angle that filament planar projective is formed are visual Incident point (subpoint of i.e. one of filament electrode) for θ and filament end point can be considered θ=0.Its arc angle θ is about Between 180 ° to 360 °, under the status of implementation of part, the height that filament can pass through Z axis adjusts to be formed>360 ° of circular arc.Filament is thrown Radius r is penetrated according to different process means and equipment making, might have ± 20% variation, if each incident point is linked, Can outline be considered as a similar round.In addition, the filament is associated in the variation of Z axis and with θ, it is rough can be considered function z=nXcos (k θ+π), n represents the height of filament apogee distance x-y plane on the directions z；0 n≤14 ＜, unit mm；K represents peak position Number, 2≤k≤8, and according to different technique and equipment making process, might have ± 20% variation.

Furthermore since the interior shape of pincers portion 15a (shape in hole) is matched with the outer shape in 100 section of LED filament, because This, as long as being suitably designed, you can so that the orientation in 100 section of LED filament is both facing to particular orientation, by taking Figure 36 A as an example, LED The top layer 120a of filament 100 is fixed in the about 10 o'clock direction towards schema, to ensure the hair of entire LED filament 100 Smooth surface is along the direction being substantially the same, it is ensured that visually the light-emitting surface of LED filament 100 is consistent.If more in LED filament 100 A LED chip is with formal dress configuration and linear arrangement, then one sides of the top layer 120a far from base 120b is main light-emitting surface, and base Layer one sides of the 120b far from top layer 120a is time light-emitting surface, and main light-emitting surface and time light-emitting surface are relative to each other.Main light-emitting surface is LED light When silk 100 is luminous, the most one side of light throughput；And secondary light-emitting surface is when to be then LED filament 100 shine, light throughput time More one sides.In the present embodiment, conductive foil 130 is formed between top layer 120a and base 120b, to allow multiple LED chips It is electrically connected, but not limited to this.In the present embodiment, 100 zigzag of LED filament but its main light-emitting surface remains out, also The either segment for being main light-emitting surface all can be towards lamp housing 12 or lamp cap 16 in unspecified angle, and secondary light-emitting surface is then all towards stem 19 (or can keep inside towards 19 top of stem, that is, secondary light-emitting surface), thereby, when LED filament 100 shines, makes LED ball steep Generally speaking lamp 10c can generate the full light close to 360 degree of illumination effects.

Figure 36 E are please referred to, Figure 36 E are the stereoscopic schematic diagram of the fourth embodiment of the utility model LEDbulb lamp.Figure 36 E The LEDbulb lamp 10c of LEDbulb lamp 10d and Figure 35 A be substantially the same, main difference is filament portion.Such as Figure 36 E institutes Show, LEDbulb lamp 10d includes lamp housing 12, connect the lamp cap 16 of lamp housing 12, at least two conducting bracket 14a in lamp housing 12, 14b, cantilever 15, stem 19 and single LED filament 100d.Stem 19 includes the core at the top of opposite stem bottom and stem Column bottom connects the lamp cap 16, is extended to inside lamp housing 12 at the top of stem, such as can be located inside lamp housing 12 about at the top of stem Centered on position.In the present embodiment, stem 19 includes upright bar 19a, and upright bar 19a is considered as whole one of stem 19 herein Part, therefore the top of stem 19 is the top of upright bar 19a.Conducting bracket 14a, 14b connect the stem 19.LED filament 100d includes filament ontology and two filament electrodes 110,112, and two filament electrode 110,112 is located at the phase of the filament ontology To both ends, filament ontology is the other parts that LED filament 100d does not include filament electrode 110,112.Two filament electrodes 110, 112 are separately connected two conducting bracket 14a, 14b, and the filament ontology is around the stem 19.One end of cantilever 15 connects stem 19 and the other end connect filament ontology.

It is the fourth embodiment side of the utility model LEDbulb lamp referring to Figure 36 E and Figure 36 F to 36H, Figure 36 F The schematic elevation view in face, Figure 36 G are the schematic side view of the fourth embodiment side of the utility model LEDbulb lamp, and Figure 36 H are The schematic top plan view of the fourth embodiment of the utility model LEDbulb lamp.In the short transverse of the LEDbulb lamp 10d (i.e. The directions z), it is H by 12 bottom end of lamp housing to distance between 12 top of lamp housing, has between two filament electrode 110,112 first high The poor Δ H1, the first difference in height Δ H1 of degree can be 0 between 1/10H.In other words, the difference in height between filament electrode 110,112 Minimum can be 0, that is to say, that both filament electrodes 110,112 are located at same level, and between filament electrode 110,112 Difference in height maximum can be 1/10H.Preferably, the range of the first difference in height Δ H1 0 between 1/20H.In an embodiment, The range of first difference in height Δ H1 is between 0 millimeter to 5 millimeters.Further, the range of the first difference in height Δ H1 is at 1 millimeter to 5 Between millimeter.Further, the range of the first difference in height Δ H1 is between 1 millimeter to 2 millimeters.

In an embodiment, the shortest straight line distance between two filament electrodes 110,112 is less than 3 centimetres.Also, in height On direction, two filament electrodes 110,112 are located at by 12 bottom end of lamp housing 1/2 between 3/4H.

As shown in Figure 36 F, filament ontology bending rises and falls and has the highest point and the lowest point, the peak with it is minimum There is the second difference in height Δ H2 between point.In the present embodiment, the minimum point of the filament ontology is adjacent filament electrode 110 Endpoint location；In other embodiments, if filament ontology bends downward place (part bent towards lamp cap 16) in a z-direction Less than filament electrode 110,112, then minimum point is that the filament ontology bends downward place.Wherein, the first difference in height Δ H1 is small In the second difference in height Δ H2, the range of the second difference in height Δ H2 is 2/10 between 4/10H.In an embodiment, second The range of difference in height Δ H2 is between 2.2 centimetres to 3.8 centimetres, it is preferable that the range of the second difference in height Δ H2 at 2.2 centimetres extremely Between 2.8 centimetres.Not only illumination effect is good through the above structure for the utility model, and makes simply, and light-emitting angle is big.

In an embodiment, in the height direction (i.e. the directions z), the peak and minimum point of filament ontology are all fallen within from lamp 1/3 is started between 4/5H in 12 bottom end of shell.Also, the filament ontology between two filament electrodes 110,112 is luminescence segment, the hair 50% or more of light section is higher than the position of two filament electrodes 110,112 in the height direction.Preferably, the 30% of the luminescence segment It is higher than the position at 19 top (i.e. the tops upright bar 19a) of the stem in the height direction above.

In an embodiment, the filament ontology on the lateral projection face of the LEDbulb lamp 10d be in a filament lateral projection (can refer to LED filament 100d shown in Figure 36 F and 36G), the lateral projection face is parallel to the height of the LEDbulb lamp 10d Spend direction (directions z), the filament lateral projection have peak and minimum point, and between the peak and the minimum point With difference in height in the short transverse, between the difference in height is the 1/8 to 3/8 of the height H of lamp housing 12.

In an embodiment, the filament ontology on the horizontal plane of the LEDbulb lamp in (can refer to Figure 36 H's The vertical view of filament ontology), it is in a filament floor projection, the filament floor projection can be the shape of similar round or U-like shape.Institute Horizontal plane is stated perpendicular to the directions z and is parallel to x-y plane.In the present embodiment, as shown in Figure 36 H, filament ontology is in institute State on horizontal plane is in U-like shape.In addition to this, the both ends (i.e. two filament electrodes 110,112) of the filament floor projection it Between the shortest distance can be 0 to 3 centimetre between.

In an embodiment, the filament ontology is more than 270 degree around the angle of the stem.For example, such as Figure 35 B and figure Shown in 36H, filament ontology is more than 270 degree in the arc angle θ of the projection of x-y plane, so can reach preferable illuminating effect. In different embodiments, as shown in Figure 35 B, the distance of the central point of the filament floor projection to the filament floor projection is R, the filament floor projection be formed by arc angle be θ, arc angle θ ranging from be greater than or equal to 30 degree and be less than or Equal to 360 degree.(with reference to figure 36G) in an embodiment, the quantity of the filament ontology is one, and in the LEDbulb lamp 10d In (i.e. side view) on the perspective plane of special angle, described two conducting brackets 14a, 14b can be overlapped (conductive branch shown in Figure 36 G Frame 14a, 14b only show conducting bracket 14a because of overlapping), and the filament ontology can cross over the both sides of stem 19, and it is described Two conducting bracket 14a, 14b can then be located at the wherein side of stem 19.Since conducting bracket 14a, 14b are only located at the same of stem 19 Side, that is to say, that the other side of stem 19 does not have any conducting bracket, therefore less likely blocks LED filament 100d and sent out The light gone out, and also it is easy the position of check and correction two conducting bracket.

In an embodiment, the filament ontology includes that (figure is not for the LED chip of the configuration of multiple formal dress and linear arrangement Show), the filament ontology corresponds to the multiple LED chip and defines opposite main light-emitting surface and secondary light-emitting surface.Such as Figure 36 A institutes Show, one sides of the top layer 120a far from base 120b is main light-emitting surface, and one sides of the base 120b far from top layer 120a is secondary shine Face, main light-emitting surface and time light-emitting surface are relative to each other.Main light-emitting surface is LED filament 100 when shining, light throughput it is most one Face；And secondary light-emitting surface is when to be then LED filament 100 shine, the more one side of light throughput time.Such as Figure 36 E and Figure 36 F to 36H institutes Show, the filament ontology includes main light-emitting surface 1001 and time light-emitting surface 1002.The either segment of main light-emitting surface 1001 is in unspecified angle Towards lamp housing 12 or lamp cap 16, that is, towards except LEDbulb lamp 10d or towards except lamp housing 12, and secondary light-emitting surface 1002 Either segment in unspecified angle towards stem 19 or the top of stem 19, that is, towards within LEDbulb lamp 10d or towards lamp housing 12 center.In other words, when user is by external observation LEDbulb lamp 10d, it mainly can preferentially see LED filament 100d Main light-emitting surface 1001, the effect of illumination thereby can be improved.

In the present embodiment, as shown in Figure 36 E and Figure 36 F to 36H, the shape of LED filament 100d meets curve above-mentioned Equation：X=m1*cos (t*360)；Y=m2*sin (t*360)；Z=n*cos (t*360*k).About the curvilinear equation Formula can refer to explanation above-mentioned, be repeated no more in this.

In addition to this, LED filament 100d is defined with appearance, as shown in Figure 36 E, the filament ontology packet of LED filament 100d At least one first bending section (not indicating) and at least 2 second bending sections (not indicating) are included, the first bending section is located at 2 second bendings Between section, two filament electrode 110,112 is located at described 2 second one end of bending section far from first bending section. In this present embodiment, more cantilevers 15 are respectively connected to the bending place of the first bending section and the second bending section, so as to more preferable twelve Earthly Branches Support the filament ontology differently curved section.First bending section is bent towards first direction, and the second bending section is bent towards second direction, And first bending section and 2 second bending sections form wavy loop configuration.

As shown in Figure 36 E, in the present embodiment, first direction is towards the direction of lamp cap 16, and second direction is far from lamp First 16 direction, that is to say, that from the point of view of the direction of Figure 36 E, (i.e. bending place can be closer to lamp towards being bent downwardly for the first bending section It is first 16), and 2 second bending sections are towards being bent upwards (i.e. bending place can be further from lamp cap 16).In various embodiments, first Direction is alternatively the direction far from lamp cap 16, and second direction can be then towards the direction of lamp cap 16, that is to say, that the first bending section Also can be towards being bent upwards, and 2 second bending sections then can be towards being bent downwardly.

In the present embodiment, the first bending section and 2 second bending sections in being on the first lateral projection face of LEDbulb lamp 10d Inverted U-shaped, the first bending section and 2 second bending sections on the second side perspective plane of LEDbulb lamp 10d in taking the shape of the letter U or M shapes, and described Side perspective plane is parallel to the short transverse (directions z) of LED ball bubble 10d lamps, and first side with the second side perspective plane Perpendicular to one another with the second side perspective plane on perspective plane.Wherein, the first lateral projection face can refer to side view shown in Figure 36 G, figure Filament ontology in 36G is inverted U shape；And the second side perspective plane can refer to front view shown in Figure 36 F, the filament sheet in Figure 36 F Body is in M shapes.If the bending place minimum point of the first bending section 1003 of filament ontology is close with the height of filament electrode 110,112, Then the filament ontology in Figure 36 F can take the shape of the letter U.In the present embodiment, as shown in Figure 36 H, the first bending section and 2 second bending sections In can take the shape of the letter U on the horizontal plane of LEDbulb lamp 10d or it is inverted U-shaped (according to observation direction depending on, in Figure 36 H in fall U Shape), the horizontal plane perpendicular to the LEDbulb lamp 10d short transverse (directions z) and be parallel to x-y plane.

Figure 38 is please referred to, Figure 38 is the schematic top plan view of the circuit board of the driving circuit of the utility model LEDbulb lamp.It drives Dynamic circuit 18 includes the circuit board 18a for being fixed on lamp holder 16, and conducting bracket 14a, 14b are to be electrically connected to circuit board 18a, and lead to It crosses upright bar 19a and is electrically connected with the electrode of LED filament 100a, 100b 110,112, circuit board 18a includes L-shaped groove hole 18b, L Shape slot 18b is in hook, and the size of the sectional area for being dimensioned slightly smaller than conducting bracket 14a, 14b of the tip of its hook, because This, when conducting bracket 14a, 14b are placed in along L-shaped groove hole 18b, L-shaped groove hole 18b can be easy to fix in conducting bracket 14a, 14b, and this structure is more advantageous to circuit board 18a and is welded to each other with conducting bracket 14a, 14b.It should be noted that as schemed In embodiment shown in 35 and Figure 37, the length L settings of conducting bracket 14a, 14b want relatively reasonable and are just unlikely to cause two to lead Electric holder 14a, 14b can not be electrically connected with circuit board 18a respectively because of too long and short-circuit or too short.The conducting bracket Length L (unit mm) science needs to meet：

Constant 3.2 is safe electrical appliance spacing in this formula.The wherein described A is the thickness of the vertical direction of circuit board 18a Expose the length of the part of circuit board 18a with described conducting bracket 14a, 14b；The B is that two conducting brackets 14a, 14b are parallel Partial spacing；The H is the length that conducting bracket 14a, 14b are cast between the position extremely insertion circuit board 18a of stem 19.It needs Illustrate, the range of the length L of conducting bracket described in the utility model between 0.5L~2L all can be used, preferably Range between 0.75L~1.5L.The L values obtained by above formula are only a kind of embodiment, are not constituted to this reality With novel conducting bracket size sole limitation.

Figure 37 specifically is please referred to, for having the situation having along vertical direction there are two LED filament in Figure 37, is located at The length unit of the length Z=L+Y, Z of the conducting bracket of the LED filament of the top are mm.The wherein described Y is two LED filaments Conducting bracket spacing.

Institute's drawings is only one of which embodiment, can also use it in the silica gel of mixed fluorescent powder in previous embodiment His glue class such as polyimides Polyimide or the substitution of other resin materials or a substitution part, to improve the tortoise of light conversion layer It splits or the problem of embrittlement.

Further, the top layer of LED filament and base can have different structure and ingredient, to be combined into a variety of differences The LED filament of property.Illustrate the layer structure of the LED filament of this case below.Figure 39 A are the LED filament stratiform of the utility model One embodiment sectional schematic diagram of structure, LED filament 400a have：Light conversion layer 420；LED chip 402,404；Electrode 410, 412；And the gold thread 440 for being electrically connected LED chip and LED chip (or electrode).Light conversion layer 420 be coated on LED chip/ On at least both sides of electrode.Light conversion layer 420 exposes a part for electrode 410,412.Light conversion layer 420 can at least have one A top layer 420a and base 420b, respectively as the upper layer and lower layer of filament, top layer 420a and base in this embodiment Layer 420b is located at the both sides of LED chip/electrode.In processing procedure, base 420b can be formed in advance, secondly by LED core Piece 402,404 and electrode 410,412 are connected to base 420b by crystal-bonding adhesive 450.Gold thread 440 can be formed in LED chip each other Between；Or between LED chip and electrode.The shape of gold thread 440 can have bending shape (such as being slightly in M fonts in Figure 39 A) Also can be more typical arcuation or linear to slow down impact force.Thereafter top layer 420a is coated in LED chip and electrode. The size of top layer 420a is not required to identical as base 420b.In an embodiment, the area of top layer 420a is slightly less than base 420b.In an embodiment, base upper surface；It it is 1nm-200 μm with 10 mean roughness (Rz) of the contact surface of top layer； And the upper table surface roughness of top layer, that is, the Rz for contacting the opposing face in base face can be 1 μm of -2mm.

When between top layer and base only to contact on a single plane, the bond strength between top layer and base is limited.For Increase the bond strength between top layer and base, can moderately increase the contact area between top layer and base；Or it moderately adjusts Both whole shape；Or the interface moderately adjusted between the two makes that apparent boundary interface is not present between the two.

The way for increasing both contacts area between top layer and base, and adjustment shape is as described below.Such as Figure 39 B institutes Show and (omit LED chip and electrode in figure), includes top layer 420a and base 420b in filament 420.On the mutual contact surface of the two The surface that at least part of formation is fitted into mutually, in this embodiment, LED chip is configured at the centre in filament width direction The top layer 420a and base 420b in region are plane engagement, but the side area of intermediate region both sides is that chimeric shape engages.Example Wavy interface 420i as shown in Figure 39 B in correspondence with each other.The case where being only plane engagement between top layer and base It compares, the area for engaging interface increases and improves bond strength between the two.But the stage casing region for configuring LED chip also may not be used It need to be limited to plane, and can also have heaving of the sea (as shown in figure 46), and be used for increasing joint surface between top layer and base Long-pending surface is also not required to stick to wavy, also can be zigzag etc..In an embodiment, in base upper surface (namely with The contact surface of top layer) the larger roughness of setting is similar to achieve the effect that.

Another way can be (LED chip and electrode to be omitted in figure) as shown in Figure 39 C, base for example, in an embodiment Layer 420b has multiple perforations 466 so that top layer 420a penetrates among base 420b and increases between top layer 420a and base 420b Contact area；It can further be extended into after perforation 466 for forming the phosphor gel infiltration base 420b of top layer 420a The other side of base 420a, as shown in Figure 39 E, Figure 30 E are the E1-E2 line sectional drawings of Figure 39 D.At this time at least due to top layer 420a Make the relationship that similar riveting is presented between the two by sandwiching base above and below.

In an embodiment, between top layer and bottom and do not have clear joint surface.Production method does not limit but can example Such as carry out it is above-mentioned " after having carried out step S20, can be used heating or with UV light irradiate come slightly solidification basic unit 120b " Curing process when, can only first solidification basic unit it is unilateral after put to LED chip, then configure top layer after in LED chip again It is secondary to be cured, so so that be intermediate zone warm each other between top layer and bottom, top layer and bottom are existed simultaneously in intermediate zone The ingredient of layer, due to not having sharply divided engagement interface between top layer and bottom so that the two is shelled mutually from engagement interface From the case where be avoided.Such as when applied to filament layered structure shown in Figure 39 B, the top layer 420a in Figure 39 B and bottom The interface 420i of layer 420b is by unobvious, instead has the intermediate zone of top layer and bottom ingredient simultaneously.

420 top layer 420a and base 420b may respectively be at least one layer of layer structure in light conversion layer.It is layered Structure can be selected from：Shapeable high phosphor gel, shapeable low fluorescent powder membrane, hyaline layer or the random layer of this three Shape combines.Phosphor gel/the fluorescent powder membrane includes following component：Glue 422/422 ', fluorescent powder 424/424 ', inorganic oxide Nano-particle 426/426 '.Glue 422/422 ' can be but be not limited to silica gel.In an embodiment, it may include in glue 422/422 ' 10%Wt or lower polyimides (Polyimide, hereinafter referred to as PI) is steady with the hardness, insulating properties, heat that increase filament entirety Qualitative and mechanical strength, PI solid contents can be 5-40%Wt, and viscosity can be 5-20Pa.S.Such as the glue 422 ' in Figure 39 A There can be higher hardness with sharp die bond and routing.Inorganic oxide nano-particle 426/426 ' can be but be not limited to oxidation aluminum shot Son, particle can be 100-600 nanometers, and it acts as the heat dissipations for promoting filament.Top layer 420a can be identical with base 420b, also may be used Suitably be adjusted, both make hardness (such as being adjusted by packaging plastic composition or fluorescent powder ratio), Wavelength-converting, Situation differentiation is regarded in the features such as constituent particle granules size, thickness, light transmittance.For another example fluorescent powder membrane and phosphor gel can It is optionally adjusted to be more than 20%, 50% or 70%.The shore hardness of phosphor gel can be D40-70；And Shao of fluorescent powder membrane Family name's hardness can be D20-70.The thickness of fluorescent powder membrane can be 0.1-0.5 millimeters；Refractive index is 1.4 or higher；Light transmittance is 40%-95%.Hyaline layer (glue-line, insulating layer) can be by high light-transmissive resin such as silica gel, polyimides (Polyimide, below letter Claim PI) or combinations thereof and constitute.In an embodiment, hyaline layer can be to have adjustment filament light extraction as refractive index matching layers The effect of efficiency.

Figure 40 shows another embodiment of LED filament layer structure.In this embodiment, LED chip 402,404, gold Line 440, top layer 420a are configured at the both sides of base 420b, that is to say, that base 420b is located at the centre of two top layer 420a.Electricity Pole 410,412 is respectively configured at the both ends of base 420b.LED chip 402,404 above and below in figure in two top layer 420a can It is connected to same electrode 410/412 by gold thread.In this way, light extraction can be made to be more uniformly distributed.

Figure 41 shows another embodiment of LED filament layer structure.In this embodiment, the base 420b of filament 400c It is further divided into the fluorescent powder membrane 4201b and hyaline layer 4202b of different hardness.Harder fluorescent powder membrane 4201b be located at compared with Between soft hyaline layer 4202b and top layer 420a.LED chip 402,402 and electrode 410,412 are configured at harder fluorescent powder On film 4201b.Since fluorescent powder membrane 4201b has higher hardness so that LED chip 402,404, electrode 410,412, gold Line 440 has more stable configuration basis.And since hyaline layer 4202b has larger pliability so that light conversion layer 420 is whole Body has better suppleness.In this embodiment, fluorescent powder membrane 4201b has the glue 422 ' for being mixed into PI.Film layer 4202b is only With glue 422 ".Glue 422 " is silica gel.Hyaline layer 4202b has highest light transmittance.Preferably, the shore of hyaline layer 4202b Hardness number can be D20-40, and the Shore durometer number of fluorescent powder film layer 4201b can be higher than hyaline layer 4202b about 40.Optionally, Hyaline layer 4202b can be to have the function of adjusting filament light-emitting angle as refractive index matching layers.Such as hyaline layer 4202b Thickness is the optical thickness of 1/4 wavelength, and the thickness of hyaline layer 4202b can be different according to actual wavelength of light, makes light Line generates interference because being reflected in multiple interfaces such as LED chip/fluorescent powder membrane, fluorescent powder membrane/hyaline layer, hyaline layer/air Phenomenon can be such that reflected light reduces.In other embodiments, hyaline layer does not limit only one layer, if for example, upper two layers of setting Or three layers of hyaline layer, keep reflectivity lower.Such as with three layers of hyaline layer that thickness is 1/4,1/2,1/4 wavelength optical When, the effect of wide wavestrip antiradar reflectivity can be obtained.In the utility model embodiment, the thickness of hyaline layer can be according to different waves Long LED chip/fluorescent powder membrane/phosphor gel adjusts, if the ratio that interference phenomenon reduces reflection can be met, such as The thickness of hyaline layer is positive and negative 20% integral multiple of 1/2,1/4 wave optical thickness.And the thickness of hyaline layer can be according to its internal layer LED chip/fluorescent powder membrane/phosphor gel adjust, refer to accounting for all wavelengths luminous intensity to project light luminous intensity It adjusts based on wave band of the ratio more than 60%, adjusts based on the wave band for being preferably more than 80%.Hyaline layer can be selected Refractive index is the material that its internal layer refractive index opens radical sign positive and negative 20%, such as in Figure 41, when the fluorescent powder of hyaline layer 4202b internal layers When film 4201b refractive index is 2, the refractive index of hyaline layer 4202b is about 1.414 ± 20%.In this way, light reflection damage can be reduced effectively It loses.

In an embodiment (not shown), base 420b is divided into two layers, can have different hardness/thickness/ The characteristics such as Wavelength-converting.

Figure 42 shows another embodiment of this case filament layer structure.In this embodiment, the base of filament 400d 420b only has glue 422 '.Glue 422 ' is silica gel and has been mixed into PI, is configured with being installed in favor of component with higher hardness.In This, base 420b, which compares other layers, has higher light transmittance.

Figure 43 shows the layer structure figure of filament in one embodiment of this case, and the base 420b in figure points are hard area section 4203b And soft zone section 4204b, hard area section 4203b and soft zone section 4204b are alternately configured.Hard area section 4203b and soft zone section 4204b Possessed fluorescent powder 424 ' can be identical with organic oxygen compound particle 426 ', and the glue 422 ' of hard area section 4203b is to be mixed into PI Silica gel；The glue 422 " of soft zone section 4204b is the silica gel that PI is not added.Therefore section 4203b in hard area has higher compared with soft zone section Hardness and conducive to component installation configuration.In another embodiment, filament can be according to allocation position closest to the bottom of lamp holder/stem Portion, which rises, is divided into three sections such as bottom, middle part, front end.Required filament shape bending degree be sequentially low bending part, in Bending degree, high bending degree, and demand to form composition ratio used in each section of filament to adjust according to this.In addition, with curved The filament of folding shape may include the hard substrate for not having bendable folding endurance.In an embodiment, filament has straight line portion and bending part, directly Have in line portion and carry the hard substrate of LED chip, around can be coated by phosphor gel.And bending part can have carrying LED The FPC of chip, around can be coated by phosphor gel, or do not have any substrate only by phosphor gel coating chip.Hard substrate It can be formed by such as materials such as ceramics, glass, sapphire, BT, FR4, metal, aluminium oxide.

Figure 44 shows another embodiment of this case filament layer structure.As shown in figure 44, the light conversion layer of filament 400f Including top layer 420a and base 420b.Each face of LED chip 402,404 is in direct contact with top layer 420a；And base 420b is not contacted with LED chip 402,404.In manufacturing process, it can be pre-formed base 420b, secondly form LED chip 402,404 and top layer 420a.

Figure 45 shows another embodiment of filament layer structure.Wherein top layer 420a and base 420b is comprising fluorescence The double-layer structure of arogel layer and glue-line.Top layer 420a includes fluorescent powder glue-line 4201a and glue-line 4202a；Base 420b includes Fluorescent powder glue-line 4201b and glue-line 4202b, and glue-line 4202a, 4202b are located at the outermost layer of filament layer structure, glue-line 4202a, 4202b can be formed only by glue 422 ".The (not shown) in an embodiment, top layer 420a can be divided into multiple fluorescent powder glue-lines Or multiple fluorescent powder film layers.In another embodiment (not shown), glue-line 4202a, 4202b extend outside filament and are wrapped Cover all faces for including side of fluorescent powder glue-line 4201a, 4201b.Glue-line 4202a at this time, 4202b preferably can be high light transmission Transparent heat shrinkage film has the effect of strengthening filament structure other than protecting fluorescent powder glue-line.

In another embodiment, as shown in figure 46, the base 420b of filament 400l is formed to have the wave that height rises and falls Shape surface, LED chip 402,404 are configured thereon that and rise and fall with height and be in tilting state.Thus filament 400l have compared with Wide light-emitting angle.That is, if using the contact surface of the bottom surface of base and table surface as horizontal plane, LED chip is matched It sets and does not need to be parallel with horizontal plane, but mode with certain angle between horizontal plane configures, and each LED chip Between configuration height/angle/direction also can be difference.In other words, if concatenating multiple LED chips with LED chip central point When, it can not be straight line to be formed by lines.Even if in this way, can make filament in the state of no bending, increase is just had been provided with The effect of light-emitting angle and uniform in light emission.

Figure 47 shows the another embodiment of this case.LED filament 400h has：LED chip 402,404；Electrode 410,412； Gold thread 440 and light conversion layer 420.Wherein light conversion layer 420 divides for top layer 420a and base 420b, wherein first to have The phosphor gel of fluorescent powder 424 and glue 422 forms base 420c, and the chip formed in base 420c positioned at filament axial direction houses ditch 428, LED chip can be fixed on the bottom that chip houses ditch 428 by crystal-bonding adhesive 450 (can also be used only and dissolve mode).Secondly In configuring gold thread 440 in filament axial direction, filled up again with another phosphor gel 420d with fluorescent powder 424 and glue 422 thereafter Chip houses ditch 428 and forms top layer 420a.In this embodiment, top layer 420a is only configured at the centre of filament radially, And the both sides of filament radially are all base 420b.The width that chip houses ditch 428 is more than LED chip 402,404, makes in LED It is more than at least two faces in six faces of chip that (the present embodiment is five faces) contacts and is coated by top layer 420d.When When LED chip is engaged in a manner of formal dress on base 420c, the phosphor gel of the top layer 420d contacted with LED chip main light-emitting surface It can be with the fluorescent powder (or the higher fluorescent powder of light conversion efficiency) of larger proportion, so that filament has good light extraction；And Pliabilitys of the base 420c due to that must maintain filament, must be with larger proportion in the phosphor gel of base 420c Glue.Preferably, fluorescent powder accounts for 60-85%WT in the phosphor gel of top layer 420d；And fluorescent powder in the phosphor gel of base 420b Account for 40-65%WT.

Figure 47 B are please referred to, Figure 47 B are the schematic cross-section of the LED filament of the utility model another embodiment.It is real according to one Example is applied, the LED filament 100 that can send out full light includes the line that operationally interconnects and can excite luminous LED chip 102 Multiple conducting wires 140 and the encirclement of shape array, electrode 112, the line array for being for electrically connecting to LED chip 102 and electrode 112 The line array of LED chip 102 and the light conversion layer 120 of electrode 112.Wherein, light conversion layer 120 includes the first fluorescent adhesive layer 2402 (can be considered base), the second fluorescent adhesive layer 2404 and hyaline layer 2406 (both this can be considered top layer).First fluorescent adhesive layer 2402 include the chondritic of the tangent two-by-two of linear consecutive, and LED chip 102 is enclosed in the center of the first fluorescent adhesive layer 2402 Part.Hyaline layer 2406 forms the outer layer of LED filament 100, and the second fluorescent adhesive layer 2404 fills up hyaline layer 2406 and the first fluorescence Gap between glue-line 2402.Fluorescent powder amount in first fluorescent adhesive layer 2402 can be more than the second fluorescent adhesive layer 2404, to be formed Enough amount of light and the continuity for ensuring light extraction.Glue content ratio in second fluorescent adhesive layer 2404 can be more than the first fluorescence Glue-line 2402 or the use of the second fluorescent adhesive layer 2402 glue softer after curing (such as the second fluorescent adhesive layer 2404 uses silica gel, First fluorescent adhesive layer 2402 use PI) so that the hardness of the second fluorescent adhesive layer 2402 be less than the first fluorescent adhesive layer 2404, at this time by The second fluorescent adhesive layer 2404 of intermediate point is more than the first fluorescent adhesive layer 2402 between chip so that filament 100 can have good Bending.

Figure 48-50 shows three kinds of LED core chip packages.The filament multilayer knot of this applicable this case of three kinds of encapsulating structures Structure.In this, because stressing LED chip and packaged type, therefore base is only illustrated with insulating layer 460, it is understood that, Base be also not excluded for include the multilayered structure of fluorescent powder glue-line or fluorescent powder film layer possibility.

In LED filament encapsulating structure shown in Figure 48, filament 400i has：LED chip 402,404；Electrode 410, 412；Gold thread 440；Light conversion layer 420 and insulating layer 460.After configuring insulating layer 460, thereon by pasting with more The copper foil 430 of a radial opening.Copper foil upper surface can further have silver coating, be located at filament end to end both ends copper foil as electricity Pole 410,412 simultaneously extends beyond insulating layer 460.Secondly LED chip can be fixed on insulating layer 460 by modes such as crystal-bonding adhesives On.Thereafter, apply phosphor gel or fluorescent powder membrane, it is made to coat LED chip 402,404, gold thread 440 and electrode 410,412 A part, to form light conversion layer 420.The width and/or length of opening are more than LED chip, limit the position of LED chip, And make at least two faces in six faces of LED chip or more (the present embodiment is five faces) contact and by overlayer fluorescent powder Glue coats.In this embodiment, the filament that is combined as of the collocation of copper foil 430 gold thread 440 brings firm and maintains leading for pliability Electric structure；Silver coating 431 also has the effect of increasing light reflection other than bringing good electric conductivity.

In LED filament encapsulating structure shown in Figure 49, filament 400j is similar to the filament 400i disclosed by Figure 48, no It is that the LED chip that (1) filament 400j is used is the identical flip-chip of foot welding height with place, is directly connected on leg silver-plated The length (length i.e. in filament axial direction) of (2) filament 400i openings noted earlier must for LED chip to be accommodated on layer 431 LED chip must be more than, and the LED chip 402 of the filament 400j of the present embodiment, 404 corresponding openings 432 are simultaneously plated positioned at copper foil 430/ The top of silver layer 431, therefore the length of LED chip 402,404 is more than opening.The present embodiment is omitted compared to previous embodiment The step of beating gold thread.

In LED filament encapsulating structure shown in Figure 50, filament 400k is similar to the filament 400j disclosed by Figure 49.It is different Place is, has used positive cartridge chip carrying out flip-chip configuration, i.e., by the different leg processing of height originally for after identical height (being usually that the lower poles N are extended processing to be and the extremely same height of P) carries out flip-chip configuration.

Figure 51 shows the stereogram of the embodiment of a filament lamp supplementary structure of this case.In filament 100a, light conversion layer 120 at least coat LED chip 102,104 and gold thread 140.There is fluorescent powder 124 and glue 122 in light conversion layer 120.The envelope of filament Dress mode can be the packaged type of the filament of any mode or other conventional approaches disclosed by this specification.In the present embodiment In, the configuration of top layer portion can be the configuration of similar Figure 39 A, i.e., connect positive cartridge chip by gold thread, have in light conversion layer 120 Have multiple along the configuration of filament axial direction but electric property is not connect with electrode/LED chip/gold thread, and is predominantly located at multiple The assistant strip 170 of the both sides of chip.Assistant strip 170 can be copper wire, be electrically connected due to not having with electrode/LED chip/gold thread, Therefore assistant strip 170 is only used as reinforcement filamentray structure to use, and external force can be prevented for the damage of LED chip.Assistant strip can Thickness and quantity are adjusted depending on LED chip/filament size/weight/required filament shape, and then reaches the effect of filament supports Fruit.In another embodiment, light conversion layer 120 divides for top layer and base, and top layer has phosphor gel or fluorescent powder membrane；Base It is 90 or higher to select flexible tempered glass, thickness 0.1-0.5mm, hardness 1H, transmitance.

The shape of assistant strip is not limited to along axially extending linear of filament.Can also be axially extending along filament Spiral-shaped or bending shape, the different sections of same root assistant strip are discriminably located at the different layers of filament.In addition, auxiliary It can also be transverse direction to help item.In an embodiment, filament has the two longitudinal assistant strips axially extended and multiple cross To lateral assistant strip.Lateral assistant strip extends beyond the width of filament and is connected with upright bar.Lateral assistant strip at this time It may replace the cantilever 15 in Figure 35.Or lateral assistant strip can not be also placed, longitudinal assistant strip of multistage is only configured, and will indulge Be bent into L fonts at least one end of assistant strip and extend beyond the width range of filament, and further can with upright bar or Be in light bulb other endpoints with anchored filament.

In an embodiment, when assistant strip is metal or the preferable material of other thermal conductivity, can be extended out filament it is outer into It is connect with the radiator of stem or light bulb to one step, or extends outside light bulb and contacted with extraneous air, radiated with profit.

When filament is bent with smaller angle, bending place may expanded by heating and heated stress influence and become fragile. It nearby can be suitably set hole or notch in bending place in filament, to slow down this influence.In an embodiment, such as Figure 52 (figures Middle omission LED chip and electrode) shown in, it is scheduled bending place between space D 1-D2.Top layer 420a is formed by phosphor gel, Base 420b is fluorescent powder membrane.Multiple holes 468 are set in top layer 420a, and preferably hole 468 is from the outside of bending place (in figure Top) it rises, closer to curved inside place (lower section in figure), hole is bigger, and such embodiment Hole 468 is triangle.It carries out curved When rolling over filament, exerted a force bending filament upward by the directions F, at this time due to multiple holes 468 between space D 1-D2 so that filament is easy The hole 468 of bending, bending place can buffer thermal stress, and be planned according to void shape appropriate and bending angle, after bending A certain size hole can still be retained to exist, hole also has the effect of improving heat dissipation at this time.

In an embodiment, there is heat emission hole in filament.Preferably, heat emission hole can be formed along the axial arrangement of filament The heat dissipation aperture of strip.When filament is linear filament, filament can be that setting or oblique line configure, at this time the two of filament End is divided into end portion and high end, (the preferably endpoint of high end) can have opening, opening near the high end of filament It is connected with heat dissipation aperture and is radiated with profit.And nearby (the preferably endpoint of end portion) can also have and heat dissipation aperture company end portion Logical opening, so that the colder air in lower section is flowed into from the opening of low side.When filament is the filament with flexure type shape, according to Different flexure type shapes may cause filament to have multiple high ends/multiple end portions, still have at this time along filament in filament Axially extending heat dissipation aperture nearby can all have the opening being connected to heat dissipation aperture in multiple high ends of filament, and Nearby can all have the opening being connected to heat dissipation aperture in multiple end portions.It can be formed close to high open-ended part in lamp housing Radiating area, radiating area can be ventilation mouth or the higher transparency material of optional thermal conductivity forms and (such as first makes opening and fill out again Enter the transparent resin for being mixed with heat dissipation particle, the citing of heat dissipation particle can be graphite, ceramics, carbon fiber, aluminium oxide, magnesia, nanometer The preferable highly heat-conductive material of the translucency such as silver).Further, aforementioned filling the doing selected from nitrogen/helium/hydrogen gas in light bulb The way that ventilation mouth can be also arranged in method with lamp housing is combined.Such as one in embodiment, the height on filament is open-ended to be opened with end portion Mouth is connect with multiple ventilation mouths of lamp housing respectively so that the heat dissipation aperture in filament is in direct contact with extraneous air.When multiple When gas port is connect with filament, closed state is still maintained in lamp housing.At this time in closed lamp housing filling selected from nitrogen/helium/ Hydrogen gas can further promote the heat dissipation in lamp housing.This way is suitable for hard filament or soft filament is formed by filament lamp.

Figure 36 I to 36K are please referred to, Figure 36 I are that partial cross section's amplification of the first embodiment of the lamp housing of the utility model is shown It is intended to, Figure 36 K are partial cross section's enlarged diagram of the second embodiment of the lamp housing of the utility model, and Figure 36 J are that this practicality is new Partial cross section's enlarged diagram of the 3rd embodiment of the lamp housing of type.As shown in Figure 36 I, lamp housing 12 includes glue-line 12a and diffusion Film 12b, glue-line 12a are between lamp housing 12 and diffusion barrier 12b, jail that glue-line 12a can be between enhanced diffustion film 12b and lamp housing 12 Solidity.Diffusion barrier 12b then can be used for spreading the light for penetrating lamp housing 12, make LEDbulb lamp 10c, 10d can be with light evenly According to effect.In addition to this, diffusion barrier 12b can be also attached directly to without glue-line 12a on lamp housing 12, and diffusion barrier 12b can be attached It in the outside or inside of lamp housing 12.In other embodiments, diffusion barrier 12b also can use toning film to substitute, and toning film is adjustable The colour temperature for the light that LEDbulb lamp 10c, 10d is sent out；Alternatively, diffusion barrier 12b can have both the function of adjustment colour temperature, such as spreading Light transformational substance is added in film 12b, the smooth transformational substance can be wavelength convert particle.

As shown in Figure 36 J, in order to promote the safety of lamp housing, in an embodiment, lamp housing 12 may include gluing film 12c, The gluing film 12c can be attached to the outside or inside of lamp housing 12, and in this present embodiment, the gluing film 12c is located at lamp housing 12 Inside.The material of adhesive film 12c can be calcium carbonate or strontium phosphate, the selection of adhesive film 12c thickness and LEDbulb lamp 10c, The weight of 10d is related.If LEDbulb lamp 10c, 10d is provided with radiator (such as heat dissipation of the position between lamp housing 12 and lamp cap 16 Fins group), and when the total weight of radiator is more than 100 grams, at least 70% 0.7 to 0.9W/m*K heat conduction is contained in radiator Glue, the thickness of adhesive film 12c will be at 200 microns (μm) between 300 microns (μm) at this time.When radiator is not injected into heat-conducting glue When, for weight about at 80 grams or less, the thickness of adhesive film 12c, which is 40 microns (μm) to 90 microns (μm), can play explosion-proof The effect of promotion, the lower limit of thickness is related with the weight of lamp, must consider explosion-proof sex chromosome mosaicism, and the upper limit can make light transmission more than 300 μm Rate is insufficient, increases material cost, the combination of materials of adhesive film 12c is mainly calcium carbonate or strontium phosphate, is arranged in pairs or groups among process organic Solvent carries out reconciliation appropriate, and after lamp housing 12 is broken, adhesive film 12c can link together the fragmentation of lamp housing 12, be not easy to produce Raw broken hole accidentally comes in contact internally charged body to avoid user, electric shock accidents occurs..

The colour temperature of filament lamp can be adjusted by the collocation of LED chip and the fluorescent powder in phosphor gel/film.Except this it Outside, lamp housing/stem/upright bar can also have effects that colour temperature adjustment, such as when the main material of lamp housing is glass (with reference to figure 36K) When, light transformational substance 12d can be added in glass sintering, to form the lamp housing 12 with light transformational substance 12d；Or transparent Toning film of the coating mixed with light transformational substance on glass inner side or outside；Stem/upright bar is also such.

Filament lamp can be roughly divided into two kinds of main Types of decoration and illumination according to colour temperature, when filament lamp is main to decorate When purposes, colour temperature can be adjusted to 1700-2700K, it can be 70-100, preferably 90-100 averagely to drill color evaluation number (Ra). When filament lamp with illuminate for main application when, colour temperature can be adjusted to 2500-3500K, luminous efficiency can be 80-100 lumens/ Watt, it can be 60-100, preferably 80-100 averagely to drill color evaluation number (Ra).Light transformational substance can be such as fluorescent powder, dyestuff (such as nano-particle of silver compound, gold, titanium, silver cladding gold, golden coated with silver) etc..

In addition it is also possible on the inside of lamp housing (the diffusion barrier 12b as shown in Figure 36 I or coating) or outside or stem, It is coated with diffusion barrier in upright bar, increases the diffusion of light.For example, the main component when diffusion barrier can be calcium carbonate, calcium halophosphate activated by antimony andmanganese And aluminium oxide is wherein any, or in which wantonly two kinds of combination or three kinds of combination.It is main material when utilizing calcium carbonate Solution appropriate of arranging in pairs or groups is formed by diffusion coating, by the effect with excellent diffusion and light transmission (having an opportunity to reach 90% or more) Fruit.When diffusion barrier is coated on the outer surface of lamp housing, radiator below diffusion coating and lamp housing (or lamp cap, plastic lantern Seat) between frictional force increase, and significantly solve the problems, such as that lamp housing falls off.

In the present embodiment, in allotment, the constituent of diffusion coating include calcium carbonate, strontium phosphate (such as CMS-5000, White powder), thickener and ceramics activated carbon (such as ceramic active carbon SW-C, colourless liquid).Specifically, when diffusion applies For layer using calcium carbonate as main material, arrange in pairs or groups thickener, ceramic active carbon and deionized water are coated on the inner peripheral surface of lamp housing after mixing Or on peripheral surface, the thickness of coating is fallen between 20 to 300 μm, preferably can be between 20-30 μm.It is formed using this material Diffusion barrier, can be with about 90% light transmittance, it is however generally that, the range of light transmittance is about 85% to 96%.In addition, this expansion Film is dissipated other than having the effect of spreading light, moreover it is possible to play the role of electric isolution, so that when glass lamp ruptures, Reduce the risk that user gets an electric shock；This diffusion barrier can make light source when luminous, and light is allowed to generate diffusion, past to penetrate from all directions Go out, to avoid the formation of dark space, the illumination comfort of room for promotion.In addition, when the diffusion coating of selection different materials ingredient, or When being the diffusion barrier by adjusting different-thickness, different illuminating effects can be obtained.

In other embodiments, diffusion coating can also calcium carbonate be main material, reflecting material (such as strontium phosphate for arranging in pairs or groups a small amount of Or barium sulfate), thickener, ceramic active carbon and deionized water, after mixing be coated on lamp housing on, the average thickness of coating is fallen Between 20 to 30 μm.Since the purpose of diffusion barrier is that light is allowed to generate diffusion, diffusion phenomenon is light through particle for microcosmic The grain diameter size of the reflecting materials such as reflex, strontium phosphate or barium sulfate can be much larger than the grain size of calcium carbonate, and therefore, selection exists A small amount of reflecting material is added in diffusion coating, can effectively increase the diffusion effect of light.

Certainly, in other embodiment, calcium halophosphate activated by antimony andmanganese or aluminium oxide can also be selected for the main material of diffusion coating, carbonic acid The grain size of the particle of calcium is about fallen between 2 to 4 μm, and the grain size of the particle of calcium halophosphate activated by antimony andmanganese and aluminium oxide about respectively falls in 4 Between to 6 μm between 1 to 2 μm, by taking calcium carbonate as an example, when the claimed range of light transmittance is fallen 85% to 92%, it is whole with Calcium carbonate is the average thickness that need to coat of diffusion coating of main material about at 20 to 30 μm, in identical light transmittance requirement range Under (85% to 92%), calcium halophosphate activated by antimony andmanganese, which is the average thickness that need to coat of diffusion coating of main material, can fall at 25 to 35 μm, oxygen Changing the average thickness that the diffusion coating that aluminium is main material need to coat can fall at 10 to 15 μm.If when light transmittance demand higher, example Such as 92% or more, then it is then needed using calcium carbonate, calcium halophosphate activated by antimony andmanganese or aluminium oxide as the diffusion coating thickness of main material thinner.

Figure 36 L are please referred to, Figure 36 L are the stereoscopic schematic diagram of the 5th embodiment of the utility model LEDbulb lamp.Figure 36 L Shown in the difference of LEDbulb lamp 10d shown in LEDbulb lamp 10e and Figure 36 E be, the LEDbulb lamp 10e's of Figure 36 L Lamp housing 12 further includes multiple air hole 12e, these air holes 12e is distributed in the top of lamp housing 12 and corresponds to LED filament 100d's Position, so that generated heat can be shed through cross-ventilation by air hole 12e when LED filament 100d being allowed to operate. In different embodiments, lamp housing 12 may also include the air hole positioned at the bottom of lamp housing 12.

Figure 36 M are please referred to, Figure 36 M are the stereogram of the lamp housing of LEDbulb lamp in one embodiment of the utility model.In addition to Except the radiator structure of LED filament itself, radiator structure can be also set on the lamp housing of LEDbulb lamp.In previous embodiment, Lamp housing can nearby have air hole close to the high end of filament (peak), and the setting of the air hole of lamp housing is not limited to This.In an embodiment, the top or bottom of lamp housing 12 may also set up air hole 1201a, 1201b.In an embodiment, such as Shown in figure, the perforated area of the top air hole 1201a of lamp housing 12 can be 100 to 500 square millimeters, preferably 150 to 450 Square millimeter；The perforated area of the bottom air hole 1201b of shell can be 200 to 1200 square millimeters, preferably 450 to 1000 square millimeters.It, can be to avoid human contact to the internally charged position of bulb lamp when the smaller air hole of setting area It is dangerous.

Figure 36 N are please referred to, Figure 36 N are the schematic side view of the sixth embodiment of the utility model LEDbulb lamp.Figure 36 N Shown in the difference of LEDbulb lamp 10d shown in LEDbulb lamp 10f and Figure 36 E be the shape of LED filament 100d, 100f Difference, but the change in shape of LED filament 100d, 100f all meet fitting equation above-mentioned.In the present embodiment, LED light There are silk 100f more bendings to rise and fall.In other embodiments, LED filament can have variously-shaped variation.As long as institute can be met Fitting equation is stated, the shape of the LED filament in LEDbulb lamp is not limited to example shown in the drawings of the present case.

Figure 39 A to 39E are please referred to, illustrate adoptable LED in the LEDbulb lamp of the multiple embodiments of the utility model below The thin portion structure of filament.Wherein, the top layer of LED filament and base can have different structure and ingredient, a variety of to be combined into LED filament of different nature will be described below the layer structure of the LED filament of the utility model.Figure 39 A are the utility model One embodiment schematic cross-section of LED filament layer structure, LED filament 400a have：Light conversion layer 420；LED chip 402, 404；Filament electrode 410,412；And gold thread 440.Gold thread 440 is used to be electrically connected LED chip 402,404, and for being electrically connected Connect LED chip 402,404 and filament electrode 410,412.Light conversion layer 420 is coated on LED chip 402,404 and filament electrode 410, on 412 at least both sides.Light conversion layer 420 exposes a part for filament electrode 410,412.Light conversion layer 420 can be extremely There is an a top layer 420a and base 420b, respectively as the upper layer and lower layer of filament, the top layer in this embodiment less 420a and base 420b is located at the both sides of LED chip 402,404 and filament electrode 410,412.It, can be advance in processing procedure Ground forms base 420b, and LED chip 402,404 and filament electrode 410,412 are secondly connected to base by crystal-bonding adhesive 450 420b.Gold thread 440 can be formed between LED chip 402,404；Or LED chip 402,404 and filament electrode 410, Between 412.The shape of gold thread 440 can have bending shape (such as being slightly in M fonts in Figure 39 A) to slow down impact force, also can be More typical arcuation or linear.Thereafter top layer 420a is coated in LED chip 402,404 and filament electrode 410,412.Top The size of layer 420a is not required to identical as base 420b.In an embodiment, the area of top layer 420a is slightly less than base 420b. 10 mean roughness (Rz) of the upper surface of base 420b, i.e. base 420b and the contact surface of top layer 420a are 1nm to 200 μ m；And the upper table surface roughness of top layer 420a, that is, the Rz for contacting the opposing face in base face can be 1 μm to 2mm.

In an embodiment, there is closed structure, closed structure can enhance base between base 420b and top layer 420a Bond strength between 420b and top layer 420a.This is because when between top layer and base only to contact on a single plane, Bond strength between top layer and base is limited.In order to increase the bond strength between top layer and base, can moderately increase top layer with Contact area between base；Or moderately adjust the shape of the two；Or the interface moderately adjusted between the two makes between the two There is no apparent boundary interfaces.In one embodiment, the closed structure includes rough surface, and the rough surface is respectively formed in On contact surface between base 420b and top layer 420a, thereby increase the bond strength of base 420b and top layer 420a.In addition, close Other kind of embodiment and the way for closing structure are as described below.

The way for increasing both contacts area between top layer and base, and adjustment shape is as described below.Such as Figure 39 B institutes Show and (omit LED chip and filament electrode in figure), includes top layer 420a and base 420b in filament 420.The mutual contact of the two The surface that at least part of formation is fitted into mutually on face, in this embodiment, LED chip is configured at LED filament 400a width The top layer 420a and base 420b of intermediate region in direction are plane engagement, but the side area of intermediate region both sides is chimeric Shape engages.Such as the wavy interface 420i shown in Figure 39 B in correspondence with each other.Between top layer 420a and base 420b Only the case where plane engagement, is compared, and the area for engaging interface increases and improves bond strength between the two.But configure LED core The stage casing region of piece can also be not required to be limited to plane, and can also have heaving of the sea (as shown in Figure 39 B), and top layer 420a and base The surface for being used for increasing bonding area between layer 420b is also not required to stick to wavy, also can be zigzag etc..Implement in one In example, in the larger roughness of the upper surfaces base 420b (namely with the contact surface of top layer 420a) setting to reach similar effect Fruit.

Another way can be (LED chip and filament electricity to be omitted in figure as shown in Figure 39 C for example, in an embodiment Pole), base 420b has multiple perforations 466 so that top layer 420a penetrates among base 420b and increases top layer 420a and base Contact area between 420b；It can be further after perforation 466 for forming the phosphor gel infiltration base 420b of top layer 420a The other side for extending into base 420a, as shown in Figure 39 E, Figure 39 E are the E1-E2 line sectional views of Figure 39 D.At this time due to top layer 420a at least makes the relationship that similar riveting is presented between the two by sandwiching base 420b above and below.

In an embodiment, between top layer 420a and base 420b and do not have clear joint surface.Production method is unlimited It calmly but can be such as：Light conversion layer (base 420b) is being coated on carrier, and is configuring LED chip 402,404 and filament electricity Pole 410,412 is irradiated after on the light conversion layer (base 420b) on carrier, and using heating or with UV light come slightly Can only unilateral (such as the side in figure downward) of elder generation solidification basic unit 420b be to put afterwards when the curing process of solidification basic unit 120b To LED chip 402,404, then configures top layer 420a and cured again after in LED chip 402,404, so so that top Particular range between floor 420a and base 420b, which can be formed, overlaps area, and it is that top layer 420a and base 420b melts each other that this, which overlaps area, The intermediate zone of sum.The ingredient that top layer 420a and base 420b are existed simultaneously in intermediate zone, due to top layer 420a and base 420b it Between do not have sharply divided engagement interface so that the two from engagement interface remove mutually the case where be avoided.Such as when answering For shown in Figure 39 B when LED filament 400a layered structures, the interface 420i of top layer 420a and base 420b in Figure 39 B By unobvious, instead there is the intermediate zone of top layer 420a ingredients and base's 420b ingredients simultaneously.

In addition, the LED filament with bending shape may include the hard substrate for not having bendable folding endurance.In an embodiment, LED Filament has straight line portion and bending part, has the hard substrate for carrying LED chip in straight line portion, around can be by phosphor gel packet It covers.And bending part can have carrying LED chip FPC, around can be coated by phosphor gel, or do not have any substrate only by Phosphor gel coating chip.Hard substrate can be such as materials such as ceramics, glass, sapphire, BT, FR4, metal, aluminium oxide institute shape At.

Figure 51 A to 51D are please referred to, Figure 51 A-51D are first to fourth embodiment of the utility model LED filament assistant strip Stereoscopic schematic diagram.In the LED filament 100a of Figure 51 A, light conversion layer 120 at least coats LED chip 102,104 and gold thread 140. There is fluorescent powder 124 and glue 122 in light conversion layer 120.The packaged type of LED filament 100a can be appointing disclosed by this specification Where the packaged type of the filament of formula or other conventional approaches.In this present embodiment, the configuration of top layer portion can be similar Figure 39 A Configuration, i.e., packed LED chip 102,104 is connected by gold thread 140, there are in light conversion layer 120 multiple assistant strips 170, Assistant strip 170 is configured along LED filament 100a axial directions, but assistant strip 170 and filament electrode 110,112/LED chips 102, Electric property does not connect 104/ gold thread 140, and assistant strip 170 is predominantly located at the both sides of multiple LED chips 102,104.Assistant strip 170 can be such as metal (such as copper), glass, nanometer pipe.Due to filament electrode 110,112/LED chips 102,104/ gold thread 140 do not have electrical connection, therefore assistant strip 170 is only used as reinforcement filamentray structure to use, and external force can be prevented for LED chip 102,104 damage.170 visual LED chip 102 of assistant strip, the size of 104/LED filaments 100a and weight/required LED filament The shape of 100a adjusts thickness and quantity, and then achievees the effect that support LED filament 100a.In another embodiment, Light conversion layer 120 divides for top layer and base, and top layer has phosphor gel or fluorescent powder membrane；Base selects flexible tempered glass, Thickness is 0.1 to 0.5mm, hardness 1H, and transmitance is 90 or higher.In addition, assistant strip can also be transverse direction.

In other embodiments, the shape of assistant strip is not limited to along axially extending linear of filament.Can also be Along the axially extending spiral-shaped or bending shape of filament, the different sections of same root assistant strip are discriminably located at filament Different layers.If the assistant strip in Figure 51 B is wave-like；And the assistant strip of Figure 51 C is spiral-shaped；The assistant strip of both this It all exists simultaneously in the top layer and base of filament, therefore has the function of strengthening the different interlayer engagement of filament.Assistant strip 170a is only It is used as reinforcement filamentray structure, and external force can be prevented for the damage of LED chip 102,104.The visual LED of assistant strip 170a Chip 102,104/LED filaments 100a the shape of size and weight/required LED filament 100a adjust thickness and quantity, And then achieve the effect that support LED filament 100a.

As illustrated in figure 5 1d, in an embodiment, there are multiple assistant strip 170b, these assistant strips in LED filament 100a 170b is similarly transversely arranged, with assistant strip 170a's the difference is that, assistant strip 170b is also pierced by LED filament into an extension 100a, also, assistant strip 170b is pierced by the part of LED filament 100a to be further attached to stem 19 as cantilever 15 (with reference to figure 35A and Figure 35 B).In the case, assistant strip 170b is other than it can enhance filament overall structure, moreover it is possible to by LED Filament 100a is affixed directly on stem 19, simplifies processing procedure.That is, the cantilever 15 (i.e. assistant strip 170b) of the present embodiment can It directly shapes, eliminates after needing first to complete LED filament 100a, then cantilever 15 is connected to LED light with together with LED filament 100a The additional process of silk 100a.

In an embodiment, LED filament has the two longitudinal assistant strips axially extended and multiple transverse directions simultaneously Lateral assistant strip.Lateral assistant strip extends beyond the width of LED filament and is connected with stem (upright bar).At this time laterally Assistant strip assistant strip 170b as shown in Figure 51 D may replace the cantilever 15 in Figure 34 and Figure 35 A.Alternatively, can not also place Lateral assistant strip, only configures longitudinal assistant strip of multistage, and at least one end of longitudinal assistant strip is bent into L fonts and is extended Width range beyond LED filament, and further can be with other endpoint (examples in stem (upright bar) or LEDbulb lamp Such as:The interface of lamp housing, lamp housing and lamp cap) to fix LED filament.In an embodiment, as shown in Figure 51 E and 51F, in lamp housing Without stem, upright bar, the head and centre of filament have is formed by electrode by light transmitting electro-conductive glue；The head of filament 100r and Tail portion is connected to form ring-type；Longitudinal assistant strip with copper material is with supportive and shapeable in filament 100r；Lamp Two electrodes of silk 100r are connected with glass fibre and form lateral assistant strip 170b, and lateral assistant strip 170b extends filament 100r And it is connected on lamp housing (such as being connected with sintering processing), is supplied to the power source path of filament electrode by transparent conductive coat It is formed on lateral assistant strip 170b and (not shown) in lamp cap can be extended downward into along lamp housing.At this time due to filament supports Stem/upright bar；And the cantilever of anchored filament is replaced by assistant strip 170b, and can be added by being formed comprising materials such as glass fibres Upper conducting bracket is replaced by the assistant strip 170b and electrically conducting transparent film of light transmission, therefore can be greatly decreased and be in the light；And promote lamp The aesthetic feeling of silk lamp entirety.In an embodiment, on the outside of the electrode of LED filament or/and from the assistant strip end that filament extends Joint portion with glass material, to be sintered to fix to lamp housing.In an embodiment, upper and LED filament electricity on the inside of lamp housing Pole or/and respectively it is formed with male female joint portion from the assistant strip end that filament extends, such as a side is latch or hook-shaped, one Side is perforation, and the two can again be fixed the two with sintering processing after combining.

In an embodiment, when assistant strip is metal or the preferable material of other thermal conductivity, assistant strip can be extended out It further connect, or extends empty with outside outside LEDbulb lamp with the radiator of stem or LEDbulb lamp outside filament Gas contacts, and is radiated with profit.

Figure 52 is please referred to, Figure 52 is the schematic cross-section of an embodiment of LED filament.The LED filament 400a of Figure 52 and figure The LED filament of 39A 400a's the difference is that, the LED filament 400a of Figure 52 further includes heat dissipation channel 480 and multiple heat emission holes 481. In the present embodiment, heat dissipation channel 480 along LED filament 400a axially through LED filament 400a, and be located at top layer 420a, But not limited to this.In other embodiments, heat dissipation channel 480 also can lateral direction penetrating LED filament 400a；Alternatively, heat dissipation channel 480 Base 420b can be located at；Alternatively, heat dissipation channel 480 has multiple, and top layer 420a or base 420b can be distributed in.In the present embodiment In, as shown in figure 52, heat emission hole 481 then perpendicular to the axial direction of LED filament 400a and is opened on the upper surfaces LED filament 400a, tool For body, one end of heat emission hole 481 is connected to heat dissipation channel 480, and the other end of heat emission hole 481 then penetrates through top layer 420a far from base The surface of layer 420b.But heat emission hole opening direction is not limited to this, and can also be opened on the side of filament；Or when heat dissipation channel is set When base 420b, heat emission hole also may be disposed at the lower surface of filament, and heat dissipation channel 480 contributes to LED with multiple heat emission holes 481 The heat dissipation of filament 400a, for example, in LED filament 400a continue workings, the air of relative low temperature can be by the two of heat dissipation channel 480 End opening flows among LED filament 400a, and carries out heat exchange with LED chip 402,404 and filament electrode 410,412, and The air of relatively-high temperature can then be flowed to by heat emission hole 481 except LED filament 400a, and thereby, air can be inside LED filament 400a With outer loop and convection current, LED filament 400a can be helped efficiently to radiate.In the present embodiment, multiple heat emission holes 481 can It corresponds respectively to LED chip 402,404 and is arranged, since LED chip 402,404 is highest group of heat production in LED filament 400a Part, such setting are able to preferably improve heat dissipation effect.The generation type of radiating channel/heat emission hole is unlimited but can be by such as photetching The mode for carving minus sensing optical activity resin forms, in forming thinner heat dissipation channel heat emission hole on arbitrary section.In addition, Configuration/position of radiating channel and heat emission hole can be come with bending shape/direction of matched with filaments and the ventilative hole site of lamp housing Adjustment, if such as when being implemented in the filament of Fig. 3, radiating channel can only be configured at the first bending section or the second bending section, and The heat emission hole of filament is configured at the extreme higher position point of filament, and the air hole of lamp housing is configured in the surface of heat emission hole；Also may be used The installation direction of filament bulb is taken into account, filament heat emission hole is configured to the extreme higher position point of the filament after installation, at this time The installation direction that the air hole of lamp housing can fit light bulb is provided close to lamp cap side/lamp housing top/lamp housing side.In an embodiment, Air hole can be replaced with the radiating area of lamp housing, the higher transparency material formation of the optional thermal conductivity of radiating area (such as first make and open Mouth is further filled with the resin or the translucent materials such as glass for being mixed with heat dissipation particle, the citing of heat dissipation particle can be graphite, ceramics, carbon fiber, The preferable highly heat-conductive material of the translucency such as aluminium oxide, magnesia, nano silver).It is aforementioned to work as in LEDbulb lamp in an embodiment The way that ventilation mouth can be also arranged in middle way of the filling selected from nitrogen/helium/hydrogen gas with lamp housing is combined.For example, logical with heat dissipation Heat emission hole is arranged in both ends in the LED filament in road, and the heat emission hole at both ends is connect with two ventilation mouths on lamp housing respectively so that Heat dissipation channel in LED filament is in direct contact with extraneous air, but closed state is still maintained in lamp housing.At this time in closed Filling is selected from nitrogen/helium/hydrogen gas in lamp housing, can further promote the heat dissipation in lamp housing.In addition, heat dissipation channel can be prerequisite Determine to re-form after filament bending shape, in an embodiment, filament have from lower to upper with multiple helical rings are up folded and At conveyor screw, and in multiple helical rings at least side be contact with each other, at this time in the side that multiple helical rings contact with each other It is upper to form a heat dissipation channel linear and through multiple helical rings.

Figure 53 is please referred to, Figure 53 is the schematic cross-section of another embodiment of the utility model LED filament.In the present embodiment In, since the LED filament in LEDbulb lamp is in the yo-yo pattern of bending, when LED filament is bent with smaller angle, Bending place may expanded by heating and heated stress influence and become fragile.It therefore, can also be appropriate near bending place in LED filament Hole or notch is arranged in ground, to slow down this influence.In an embodiment, such as Figure 53 (omitting LED chip and filament electrode in figure) Shown, space D 1 is to being scheduled bending place between D2.Top layer 420a is formed by phosphor gel, and base 420b is fluorescent powder membrane. Multiple holes 468 are set in top layer 420a, it is preferable that hole 468 is on the outside of the bending place (top in figure), closer to curved (lower section in figure) hole is bigger inside, and such embodiment Hole 468 is triangle.When carrying out bending LED filament, by the side F To the filament of force bending upward, at this time due to space D 1 to multiple holes 468 between D2 so that LED filament is easy bending, bending The hole 468 at place can buffer thermal stress, and be planned according to void shape appropriate and bending angle, and one can be still retained after bending The hole for determining size exists, and hole also has the effect of improving heat dissipation at this time.In other embodiments, this hole 468 also can be with Heat emission hole 481 and heat dissipation channel 480 shown in Fig. 7 combine；Alternatively, both ends of the hole can also be used in heat emission hole 481 shown in Figure 52 The structure that diameter differs in size, so that LED filament is easy bending.

Figure 54 A to 54F are please referred to, Figure 54 A to 54F are the line array of the LED chip of the multiple embodiments of the utility model Schematic diagram.In an embodiment, LED filament can be sealed body by tubulose and coat the line array of LED chip and be formed, wherein institute It can be that the top layer 420a and base 420b as shown in Figure 39 A is formed, and LED chip may include then LED to state tubulose envelope body Positive contact on crystal grain and LED grain and negative contacts, but not limited to this.When tubulose envelope body is by the liquid adhesive of distribution Agent (polymer being such as coated in LED chip 504) is formed directly on the line array of LED chip 504, can there are many situation The quality of the LED filament made with routing can be adversely affected.In routing, downward pressure, ultrasonic energy are used And the combination of hot (in some cases), closing line 514 is attached to the both ends of the Ohmic contact of LED chip 504 to make Fusion point.LED chip 504 accident fragmentation or may be burnt out in routing, if also, surface is dirty or out-of-flatness, LED chip 504 Ohmic contact will will include bond strength and LED filament can be made by possible damage.Further, work as liquid polymeric Object is appropriate or is inadequately distributed on the closing line for being attached to adjacent LED chip 504, may result in engagement dislocation.One In a little embodiments, in order to reduce this problem, the connection between LED chip 504 is to penetrate tree lace, and tree lace is by being continuously coated on phase Made by conducting resinl between the positive contact and negative contacts of adjacent LED chip 504.Conducting resinl is mixed by by conducting particles Elastic adhesive and formed, conducting particles can be gold or silver.Preferably, conducting particles is by translucent material such as nano silver, receives Made by rice carbon pipe and graphene.In some embodiments, wavelength convert particle is mixed in conducting resinl to strengthen light conversion.Bullet Property adhesive can be silica gel (silicone), epoxy resin (epoxy) or polyimide resin (ploymide).Preferably, The material of elastic adhesive for conducting resinl and the material identical for making tubulose envelope body.Thus, this tree lace is seamlessly to integrate To tubulose Feng Tizhong and it fully synchronous with tubulose envelope body can extend or compress.Tree lace can with but it is unlimited for example by having three-dimensional shifting The glue sprayer of kinetic force is made.Figure 54 A and 54B is the side view of the line array of LED chip 504, wherein positive A Contact is, for example, to be arranged in the same side of LED grain 510 with cathode C contacts.

In Figure 54 A, the tree lace 516 of connection adjacent LED chip 504 generally covers anode A contacts and cathode C contacts All surfaces.In Figure 54 B, 516 part of tree lace covering anode A contacts and the cathode C contacts of connection adjacent LED chip 504.Figure 54C and Figure 54 D are the top view of the line array of LED chip 504, wherein positive A contacts are arranged with cathode C contacts in LED crystalline substances The same side of grain 510.In Figure 54 A and 54B, tree lace 516 connects adjacent LED chip 504 along straight line.In some embodiments In, tree lace 516 includes the curve of any form, due to absorbing possible destructive mechanical energy.Preferably, curve Camber (sinuosity) is 3 to 8.Further, the camber of curve is 2 to 6.

In Figure 54 C, since it is expected that LED filament will produce deformation after being stretched or compressed, thus tree lace 516 is designed as Definition has a sigmoid curve between the LED chip 504 of its connection.In Figure 54 D, when positive A contacts and cathode C contacts are not When perfectly aligned along the long axis of the line array of LED chip 504, tree lace 516 can for example turn in the corner of LED chip 504 To complete the electric connection of adjacent LED chip 504.In Figure 54 E, the line array of LED chip 504 includes plural platform 518 To fill up the gap between adjacent LED chip 504.Preferably, platform 518 is sealed made by the identical material of body by making tubulose 's.The upper surface of platform 518 provides continuity channel, and tree lace 516 is allowed to extend to LED core by the positive A contacts of LED chip 504 The cathode C contacts of piece 504.Alternatively, in Figure 54 F, mould 520 is the positive A contacts and cathode C contacts for shining LED chip 504 Profile and make.Under appropriate arrange, the definition of mould 520 has a gap, be located at mould 520 and LED chip 504 line array it Between.Tree lace 516 is formed by conducting resinl is filled up this gap.In some embodiments, LED grain 510 can remove positive A Contact and cathode C contacts (its setting may block light when on diode region), thus, tree lace 516 is set as connection LED The p junctions (p-junction) of chip 504 and the n junctions (n-junction) of LED chip 504.In an embodiment, filament Electrode (such as electrode 110 and 112 in Figure 36 L) is also formed by conducting resinl, and can mixed with wavelength convert particle so that The electrode at filament both ends is no longer in the light, and the appearance of filament entirety is more consistent.

Figure 55 A to 55C are please referred to, Figure 55 A to 55C are the lateral cross section of the LED filament of the multiple embodiments of the utility model The thin portion structure of schematic diagram, wherein LED filament can refer to aforesaid plurality of embodiment.In one embodiment, the appearance of tubulose envelope body Face is provided with polishing layer.LED filament with glossy surface processing is in appearance with aesthetic feeling, however, such LED filament can meet with Meet total internal reflection (total internal reflection) and the bad problem that radiates.In other embodiments, tubulose seals body Outer surface be provided with lines layer (texturized layer), lines layer can reduce total internal reflection to improve the extraction of light, line Road floor also allows tubulose envelope body to have the surface area than polishing layer bigger to reinforce radiating.In addition, when having aforementioned dissipate in LED filament When the passage of heat, it also can form lines layer in the surface of the heat dissipation channel in filament and reach same effect.

Figure 55 A, 55B and 55C are the view in transverse section that tubulose seals body, and wherein Figure 55 A also show the inside of tubulose envelope body, LED chip 1106 is located at the inside of tubulose envelope body, and tubulose envelope body includes that wavelength conversion layer 1402, clear binder 1404 and light turn Change particle 1406.For example, in Figure 55 A, lines layer (being located on wavelength conversion layer 1402) is turned by the enough light of closeness Particle 1406 is changed to approach and protrude the outer surface of wavelength conversion layer 1402 and formed.In contrast, in Figure 55 B and 55C, pipe Shape seals the lines layer that body includes exclusive, these lines layers respectively have different forms, such as wedge shape or cube shaped.

The various embodiment features of the utility model described above, can the arbitrarily combination change in the case where not having to be mutually exclusive It changes, it is not limited to specifically in a kind of embodiment.Such as described in embodiment shown in figure 1A, although these features are not being schemed Illustrate that LEDbulb lamp also may include having the component such as plastic lamp base, radiator in embodiment shown in 1C, it will be apparent that this These features not inventively can be applied to Fig. 1 C by field those of ordinary skill according to the explanation of Figure 1A；In another example this Although utility model is illustrated various creation schemes by taking LEDbulb lamp as an example, these apparent designs may not be used It is applied in the lamp of other shapes or type through creative, such as LED candle lamp etc. will not enumerate herein.

The realization of the utility model LED filament and its each embodiment of manufacturing method and LEDbulb lamp as described above, needs It should be recalled that for same root LED filament or for using the LEDbulb lamp of the LED filament, it is described above each Such as " light conversion layer ", " light conversion layer wraps up the mode of electrode and/or LED chip ", " conducting wire ", " silicon involved in embodiment Glue and/or polyimides and/or resin ", " fluorescent powder composition ratio ", " filament lamp layer structure ", " conversion of phosphor gel/film Wavelength/particle size/thickness/light transmittance/hardness/shape ", " hyaline layer ", " fluorescent powder composition thermally conductive pathways ", " circuit film ", " oxidation nanometer particle ", " crystal-bonding adhesive ", " LED filament ontology is wavy ", " stem ", " gas in lamp housing ", " filament assembly ", " length of conducting bracket ", " length of the conducting bracket of LED filament ", " surface of cantilever and/or stem can be coated with graphite Alkene film ", " air pressure in lamp housing ", " young's modulus of filament ", " shore hardness of filament base ", " assistant strip ", " lamp housing table Face is coated with gluing film, diffusion barrier, toning film ", " mixed with light transformational substance in lamp housing/stem/upright bar ", " lamp housing tool radiating area ", " filament have hole or notch ", " there is heat dissipation path in filament ", " curve equation of filament shape ", " air hole of lamp housing ", " the wavy chimeric surface between filament top layer and base ", " chimeric surface is zigzag ", " perforation of base ", " light conversion layer packet Include the first fluorescent adhesive layer, the second fluorescent adhesive layer and hyaline layer ", " assistant strip is wave-like ", " assistant strip be spiral-shaped ", " multiple assistant strips are laterally and longitudinally arranged ", " at least one end of longitudinal assistant strip is bent into L fonts ", " LED filament has bending The features such as place " and " bending place is nearby suitably set hole or notch " may include one in the case where not conflicting with each other A, two, multiple or all technical characteristics.It includes technology in corresponding embodiment that related corresponding content system, which can be selected from, One or a combination set of feature.

The utility model has hereinbefore been disclosed with preferred embodiment, and so being familiar with the technology person should be understood that the reality It applies example to be only used for describing the utility model, and is not construed as limitation the scope of the utility model.It should be noted that such as with this Embodiment equivalent variation and displacement, should all be set as being covered by the scope of the utility model.Therefore, the protection of the utility model Range is when being subject to the scope of which is defined in the appended claims.

Claims

1. a kind of LED filament, including light conversion layer, LED chip, two electrodes, the LED chip is each other and the LED Be electrically connected with each other between chip and the electrode, which is characterized in that the light conversion layer be covered in the LED chip with it is described Electrode, and make a part of exposed of two electrodes respectively, the light conversion layer include at least a base and top layer, the top Layer and the base are respectively at least one layer of layer structure, and the top layer and the thickness of the base differ.

2. LED filament as described in claim 1, which is characterized in that layered structure be phosphor gel, fluorescent powder membrane, thoroughly Bright layer or the arbitrary layered combinations thereof of this three.

3. LED filament as described in claim 1, which is characterized in that the base includes that fluorescent powder membrane and at least one layer are transparent Layer, the fluorescent powder membrane is between the hyaline layer and the top layer.

4. LED filament as described in claim 1, which is characterized in that the base includes hard area section and soft zone section, the hard area Section is interconnected with the soft zone section.

5. LED filament as described in claim 1, which is characterized in that the top layer and the base are double-layer structure, described Double-layer structure includes fluorescent powder glue-line and glue-line, and the glue-line extends outside filament and coats all of the fluorescent powder glue-line Face.

6. LED filament as described in claim 1, which is characterized in that the LED chip surface for contacting the base is LED chip Lower surface, the LED chip surface opposite with LED chip lower surface are LED chip upper surface, and the top layer is in the LED chip Plane where upper surface is equipped with hole.

7. LED filament as claimed in claim 6, which is characterized in that from the outside of LED filament bending place to inside, the hole Hole becomes larger.

8. LED filament as described in claim 1, which is characterized in that be equipped with heat dissipation channel in the top layer, and the heat dissipation is logical Road is along LED filament axially through LED filament.

9. LED filament as described in claim 1, which is characterized in that be equipped with heat dissipation channel in the base, and the heat dissipation is logical Road lateral direction penetrating LED filament.

10. LED filament as claimed in claim 8 or 9, which is characterized in that further include heat emission hole, one end connection of heat emission hole dissipates The other end of the passage of heat, heat emission hole then penetrates through surface of the top layer far from base.

11. a kind of LED filament, including light conversion layer, LED chip, electrode, the LED chip is each other and the LED chip It is electrically connected with each other between the electrode, which is characterized in that the light conversion layer is covered in the LED chip and the electricity Pole, and make a part of exposed of two electrodes respectively, the light conversion layer include at least a base and top layer, the top layer And the base is respectively at least one layer of layer structure, the top layer and the hardness of the base differ.

12. a kind of LED filament, including light conversion layer, LED chip, electrode, the LED chip is each other and the LED chip It is electrically connected with each other between the electrode, which is characterized in that the light conversion layer is covered in the LED chip and the electricity Pole, and make a part of exposed of two electrodes respectively, the light conversion layer include at least a base and top layer, the top layer And the base is respectively at least one layer of layer structure, the top layer is differed with the Wavelength-converting of the base, light transmittance.

13. a kind of LED filament, including light conversion layer, LED chip, electrode, the LED chip is each other and the LED chip It is electrically connected with each other between the electrode, which is characterized in that the light conversion layer is covered in the LED chip and the electricity Pole, and make a part of exposed of two electrodes respectively, the light conversion layer include at least a base and top layer, the top layer And the base is respectively at least one layer of layer structure, the constituent particle granules size of the top layer and the base not phase Together.

14. a kind of LEDbulb lamp, which is characterized in that the LEDbulb lamp includes：

Lamp housing；

Lamp cap is connect with lamp housing；

Stem and upright bar, the stem are set in the lamp housing, and the upright bar is extended to the center of the lamp housing by the stem；

At least two conducting brackets are set in the lamp housing and connect the stem；And

Claim 1~9,11~13 any one of them LED filaments, the LED filament are single LED filament, the LED light Silk connects the stem by the conducting bracket；

The first end of cantilever, the cantilever is connected to the upright bar, and the second end of the cantilever is connected to the LED filament, institute Stating second end has the pincers portion of the fixed LED filament.

15. LEDbulb lamp as claimed in claim 14, which is characterized in that the LEDbulb lamp is full light bulb lamp.

16. LEDbulb lamp as claimed in claim 14, which is characterized in that further include driving circuit, the driving circuit is electric respectively Property the connection conducting bracket and lamp cap.

17. LEDbulb lamp as claimed in claim 14, which is characterized in that the stem includes opposite stem bottom and core Column top, the stem bottom connect the lamp cap, are extended to inside the lamp housing at the top of the stem.

18. LEDbulb lamp as claimed in claim 14, which is characterized in that the LED filament is around the upright bar.

19. LEDbulb lamp as claimed in claim 14, which is characterized in that the LED filament is wavy convex recessed.

20. LEDbulb lamp as claimed in claim 14, which is characterized in that the young's modulus of the LED filament is 0.1x10¹⁰ Pa~0.3x10¹⁰Pa.

21. such as claim 16~19 any one of them LEDbulb lamp, which is characterized in that the LEDbulb lamp is full light Bulb lamp.