WO2024067778A1

WO2024067778A1 - Led filament and bulb applying led filament

Info

Publication number: WO2024067778A1
Application number: PCT/CN2023/122455
Authority: WO
Inventors: 江涛; 杨荣欢; 丁建军; 余志善; 王志坤; 赵恒�
Original assignee: 嘉兴山蒲照明电器有限公司
Priority date: 2022-09-30
Filing date: 2023-09-28
Publication date: 2024-04-04

Abstract

The present application relates to the field of illumination, and discloses an LED filament. The LED filament comprises an LED chip unit, a light conversion layer, and an electrode, and is characterized in that: the light conversion layer covers the LED chip unit and part of the electrode; the outer surface of the light conversion layer is provided with a layered body, the layered body covering the light conversion layer and at least part of the electrode; and the layered body has provided therein a chromogenic material or a light-induced conversion material. The invention has uniform light emission, good heat dissipation, and high reliability.

Description

LED filament and bulb lamp using the same

Technical Field

The present application relates to the field of lighting, and in particular to an LED filament and a bulb lamp using the LED filament.

Background technique

LED has the advantages of environmental protection, energy saving, high efficiency and long life, so it has been widely valued in recent years and gradually replaced the position of traditional lighting fixtures. However, the light emission of traditional LED light sources is directional, unlike traditional lamps that can provide wide-angle lighting. Therefore, applying LED to traditional lamps has corresponding challenges depending on the type of lamps.

In recent years, an LED filament that can make LED light sources emit light similar to traditional tungsten filament bulbs and achieve 360° full-angle lighting has gradually attracted attention from the industry. This LED filament is made by connecting multiple LED chips in series and fixing them on a narrow and elongated glass substrate, then wrapping the entire glass substrate with silicone doped with fluorescent powder, and then making electrical connections to complete it. In addition, there is also a LED soft filament, which is similar to the above-mentioned filament structure, but part of the glass substrate is replaced with a flexible printed circuit (Flexible Printed Circuit, hereinafter referred to as FPC), so that the filament can have a certain degree of bending. However, the soft filament made of FPC has disadvantages such as the FPC thermal expansion coefficient is different from the silicone coating the filament, and long-term use can cause the LED chip to shift or even debond. Or FPC is not conducive to the flexible change of process conditions.

Currently, a soft filament structure without a supporting substrate is used to replace the traditional structure that requires the chip to be mounted on a substrate first and then coated with phosphor/packaged with a flexible fluorescent package with wavelength conversion function. However, some of the filament structures pose challenges to the stability of the metal bonding wires between chips when bent. When the chips in the filament are carefully arranged, if adjacent LED chips are connected by metal bonding wires, it is easy for the stress to be too concentrated on a specific part of the filament when the filament is bent, causing the metal bonding wires connecting the LED chips to be damaged or even broken. Therefore, there is still room for improvement in the quality of some embodiments.

In existing flexible filament products, different types of bulb shells have different requirements for the shape of the light-emitting diode filament, so the length of the LED filament will have different specifications. For the same filament, with the same number of LED chips, the longer the filament length, the larger the distance between two adjacent LED chips. After the filament is lit, the light spots (or granularity) observed by the naked eye will be more obvious, which seriously affects the user's viewing comfort.

In the prior art, most LED lamps use a combination of blue LED chips and yellow phosphors to emit white light. However, the emission spectrum of LED lamps is weak in the red light region, and the color rendering index is low, making it difficult to achieve a low color temperature. In order to improve the color rendering index, a certain amount of green phosphor and red phosphor are generally added. However, the relative conversion rate of red phosphor is low, which usually leads to a decrease in the overall luminous flux of the LED lamp, that is, a decrease in the light efficiency. Secondly, the three types of cone cells in the human eye, red, green and blue, have different sensitivities. If red light is lacking, the green light and blue light in the human eye will form a cyan image, which will reduce the color gamut of color reproduction, making the lighting scene dull and boring, and also affecting the quality of the lighting environment. In addition, the use of lighting with high color rendering can improve people's perception of space, while low color rendering will affect the ability to distinguish objects and accurately perceive the surrounding environment.

Existing LED filaments usually only have mixed phosphor glue coated on the outer surface of the LED filament. After drying, the glue will show different colors. When multiple LED filaments with different color temperatures are installed, they will show a variety of colors at a glance, making the LED lamp not beautiful enough when used as a decorative lamp. Some have graphene glue layers on the upper and lower sides of the substrate, and the graphene is modulated into different colors to solve the visual impact caused by the different appearance colors of the fluorescent glue layer. However, the production cost of graphene is high and it is easy to pollute the environment.

The LED chip has a first light-emitting surface and a second light-emitting surface, the first light-emitting surface and the second light-emitting surface are opposite to each other, the light emitted from the first light-emitting surface (front side) is toward the top layer, and the light emitted from the second light-emitting surface (back side) is toward the bearing layer. Generally, the back side of a flip-chip or back-plated front-mounted LED chip is basically opaque, and the brightness difference between the front and back sides of the LED chip is large. If the above-mentioned LED chip is used in the LED filament, the luminous flux in some directions will be less after the LED filament is wound, and the light output of the LED bulb will be uneven.

In addition, LED filaments are usually set in LED bulbs. In order to present the beauty of appearance and make the lighting effect of LED filaments more uniform and wide, LED filaments are bent to present various curves. However, LED chips are arranged in LED filaments, and LED chips are relatively hard objects, so it is difficult to bend LED filaments into ideal shapes. In addition, LED filaments are also prone to cracks due to stress concentration during bending.

In addition, LED filaments are generally arranged in a straight line around the core column, and the LED filaments emit very little light near the two ends. When one end of multiple LED filaments are installed close to each other near the top of the light output of the bulb, a dark area will be formed in the light output direction of the center axis of the bulb, resulting in uneven spatial distribution of the output light, uneven illumination distribution, and "darkness under the lamp" phenomenon and other problems.

At present, LED filament lamps generally use a driving power supply to convert AC into DC before driving them to emit light. However, there is ripple in the process of rectifying AC into DC by the driving power supply, which will cause the LED filament to flicker when it emits light. In order to reduce or even eliminate the flicker generated during the LED filament lighting process, an electrolytic capacitor for ripple removal is usually added to the driving power supply. The heat generated by the heating element in the driving power supply will have a great impact on the service life of the electrolytic capacitor.

When a lighting device includes multiple LED components, the multiple LED components need to be driven using different currents. This will inevitably increase circuit complexity and circuit cost if multiple drivers are used. Therefore, a shunt circuit is required to distribute current to multiple LED components.

This application is a further optimization of the above application to further meet various process and product requirements.

Summary of the invention

It is particularly noted that the present disclosure may actually include one or more invention schemes that are currently claimed or not yet claimed, and in order to avoid confusion due to unnecessary distinctions between these inventions during the writing of the specification, the possible multiple invention schemes herein may be collectively referred to as "the present application."

Many embodiments of the "present application" are briefly described herein. However, the term "present application" is only used to describe certain embodiments disclosed in this specification (whether or not in the claims), rather than a complete list of all possible embodiments. Description. Certain embodiments of various features or aspects described below as "the present application" can be combined in different ways to form an LED bulb or a part thereof.

The present application discloses an LED bulb lamp, wherein the LED filament comprises an LED chip unit, a light conversion layer and an electrode, and is characterized in that:

The light conversion layer covers the LED chip unit and part of the electrode;

A layered body is disposed on the outer surface of the light conversion layer, and the layered body covers the light conversion layer and at least a part of the electrode; a color developing material or a photoconversion material is disposed in the layered body.

In one embodiment of the present application, the light conversion layer includes a top layer and a base layer, and the layered body completely covers the top layer and the base layer.

In one embodiment of the present application, the color-developing material or photoconversion material is selected from one or a combination of the following materials: aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate or garnet, etc.

In one embodiment of the present application, the layered body appears white when not lit.

In one embodiment of the present application, when the layered body is not lit, under the RGB standard, its color value is within the range of R (235-255), G (235-255), B (235-255), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller or larger value thereof.

In one embodiment of the present application, the layered body appears gray when not lit.

In one embodiment of the present application, when the layered body is not lit, under the RGB standard, its color value is within the range of R (100-234), G value (100-234), and B value (100-234), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller or larger value thereof.

In one embodiment of the present application, titanium dioxide particles are arranged in the layered body, and the mass of the titanium dioxide accounts for 0.2% to 10% of the total mass of the layered body.

In one embodiment of the present application, the thickness of the layered body is less than or equal to the thickness of the light conversion layer.

In one embodiment of the present application, the light conversion layer includes a top layer and a base layer, and the thickness of the layered body is less than or equal to the thickness of the top layer.

In one embodiment of the present application, the base layer includes titanium dioxide, so that the color presented by the base layer is within the same RGB value range as that of the layered body.

In one embodiment of the present application, the amount of titanium dioxide added to the base layer accounts for 1% to 20% of the total weight of the solid particles in the base layer.

In one embodiment of the present application, at least one phosphor is disposed in the base layer, and the phosphor occupies The proportion of the total weight of the solid particles is 1% to 15%.

In one embodiment of the present application, the LED filament includes at least two LED chips, and the LED chips are electrically connected via metal wires.

The present application discloses an LED filament, which comprises an LED chip, a light conversion layer and an electrode, and is characterized in that:

The light conversion layer covers the LED chip and part of the electrode, and the light conversion layer includes a top layer and a base layer;

There are at least two types of LED chips, at least two types of phosphors are arranged in the top layer, and the LED filament presents different colors when not lit.

In one embodiment of the present application, the LED chips include a blue light chip, a red light chip and a green light chip.

In one embodiment of the present application, the light intensity ratio of the blue light chip, the red light chip and the green light chip is 1:3:6.

In one embodiment of the present application, the base layer is provided with a BT substrate, and the color value of the BT substrate is within the range of R (235-255), G (235-255), and B (235-255) under the RGB standard.

In one embodiment of the present application, the BT substrate is located at the outermost side of the LED filament.

In one embodiment of the present application, the LED filament is provided with three rows of LED chip arrays arranged side by side along the length direction of the LED filament, and the LED chip array is formed by LED chips, wherein the LED chips include a blue light chip, a red light chip and a green light chip.

In one embodiment of the present application, the top layer is a transparent adhesive layer, and when the LED filament is lit, the light output color is greater than or equal to 3.

In one embodiment of the present application, the top layer is provided with phosphor, the top layer corresponding to the blue light chip is provided with yellow phosphor, the top layer corresponding to the red light chip is provided with red phosphor, and the top layer corresponding to the green light chip is provided with green phosphor. The light emitted by the blue light chip, the red light chip, and the green light chip is converted into white light by the top layer.

In one embodiment of the present application, the thermal conductivity of the BT substrate is ≥ 0.8 W/(m.K).

In one embodiment of the present application, the thickness of the BT substrate is ≤0.12 mm.

In one embodiment of the present application, the light transmittance of the BT substrate is greater than or equal to 30%.

In one embodiment of the present application, the LED chips are connected to each other via metal wires or copper foil circuits.

The present application discloses an LED bulb lamp, characterized in that it comprises: a lamp holder, a lamp housing connected to the lamp holder, at least two conductive brackets, a cantilever, a stem, i.e., at least one LED filament, arranged in the lamp housing, wherein the LED filament comprises an LED chip unit, a light conversion layer, and an electrode, characterized in that:

The light conversion layer covers the LED chip unit and part of the electrode;

In one embodiment of the present application, the color-developing material or photoconversion material is selected from one or a combination of aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate or garnet.

In one embodiment of the present application, the color-developing material or photoconversion material is a combination of multiple materials such as aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate or garnet.

In one embodiment of the present application, titanium dioxide is disposed in the base layer, so that the color presented by the base layer is within the same RGB value range as the layered body.

In one embodiment of the present application, the amount of titanium dioxide added to the base layer is 1% to 20% of the total weight of the solid particles in the base layer.

In one embodiment of the present application, at least one fluorescent powder is disposed in the base layer, and the fluorescent powder accounts for 1% to 15% of the solid particles in the base layer.

The present application discloses an LED bulb lamp, characterized in that it comprises: a lamp holder, a lamp housing connected to the lamp holder, at least two conductive brackets, a cantilever, a stem, i.e., at least one LED filament, arranged in the lamp housing, wherein the LED filament comprises an LED chip, a light conversion layer, and an electrode, characterized in that:

In one embodiment of the present application, the top layer is a transparent adhesive layer, and when the LED filament is lit, the number of light output colors is greater than or equal to 3.

In one embodiment of the present application, the top layer is provided with phosphor, the top layer corresponding to the blue light chip is provided with yellow phosphor, the top layer corresponding to the red light chip is provided with red phosphor, and the top layer corresponding to the green light chip is provided with green phosphor. The light emitted by the blue light chip, the red light chip, and the green light chip are all white light after conversion by the top layer.

The present application has the following or any combination of technical effects through the above technical scheme: (1) by filling the lamp housing with a combination of nitrogen and oxygen, the service life of the base layer can be effectively improved due to the interaction between oxygen and the radicals in the base layer; (2) by designing the relationship between the diameter of the lamp head, the maximum diameter of the lamp housing, and the maximum width of the LED filament in the Y-axis direction on the YZ plane or the maximum width in the X-axis direction on the XZ plane, the heat dissipation effect of the bulb lamp can be effectively improved; (3) the thickness of the base layer is less than the thickness of the top layer. Since the thermal conductivity of the top layer is greater than the thermal conductivity of the base layer, the distance for the heat generated by the LED chip to be conducted to the outer surface of the base layer is relatively short, so that the heat is not easy to accumulate, and the heat dissipation effect of the LED filament is good; (4) the supporting layer includes a transparent layer and a base layer. The transparent layer supports a part of the base layer, thereby enhancing the strength of the base layer and facilitating die bonding. The part of the base layer not covered by the transparent layer allows a part of the heat generated by the LED chip to be directly dissipated through the base layer; (5) The transparent layer includes a first transparent layer and a second transparent layer. When the LED filament is bent, the electrode is prone to separation from the light conversion layer or the part of the light conversion layer in contact with the electrode is prone to cracks. The first transparent layer and the second transparent layer can structurally reinforce the part of the light conversion layer in contact with the electrode to prevent cracks from occurring in the part of the light conversion layer in contact with the electrode; (6) The conductor includes a covering part and an exposed part. When the LED filament is bent, the exposed part will be slightly deformed by force. The bending area is small and the deformation degree is small, which is conducive to maintaining the bending shape of the LED filament; (7) By mixing different materials, the filament can present different colors, or the filament can present different colors when lit and not lit, thereby improving the beauty and light output effect of the lamp using the filament.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (I).

FIG. 2 is a bottom view according to FIG. 1 .

Fig. 3 is a partial cross-sectional schematic diagram according to the A-A position in Fig. 1.

FIG. 4 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (II).

FIG5 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (III).

FIG6 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (IV).

FIG. 7 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (V).

FIG8 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (VI).

FIG. 9 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (VII).

FIG. 10 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (VIII).

FIG. 11 is a top view of an LED filament with the top layer removed according to some embodiments of the present application.

FIG. 12 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (IX).

FIG. 13 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (X).

FIG. 14 is a schematic diagram of the structure of LED chip bonding wires in some embodiments according to the present application.

FIG. 15 is a top view (I) of an LED filament without a top layer when the filament is not bent according to some embodiments of the present application.

FIG. 16 is a top view (II) of an LED filament without a top layer when the filament is not bent according to some embodiments of the present application.

FIG. 17 is a schematic diagram of the structure of an LED filament in an unbent state according to some embodiments of the present application (I).

FIG. 18 is a schematic structural diagram (II) of an LED filament in an unbent state in some embodiments according to the present application.

FIG. 19 is a schematic diagram of a partial structure of an LED filament in some embodiments according to the present application (I).

FIG20 is a schematic cross-sectional view of the structure of FIG19 .

FIG. 21 is a schematic diagram of a partial structure of an LED filament in some embodiments according to the present application (II).

FIG. 22 is a schematic diagram of a partial structure of an LED filament in some embodiments according to the present application (III).

FIG. 23 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XI).

FIG. 24 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XII).

FIG. 25 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XIII).

FIG. 26 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (fourteen).

FIG. 27 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XV).

FIG28 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XVI).

29 is a schematic diagram of a heat dissipation path of an LED filament in some embodiments according to the present application, wherein the left side of the figure shows an example of a layered body with additive materials of different particle sizes, and the right side of the figure shows an example of a layered body with additive materials of a single particle size.

FIG30 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XVII).

FIG31 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XVIII).

FIG32A is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XIX).

FIG32B is a schematic cross-sectional view of the length direction of an LED filament in some embodiments according to the present application.

FIG32C is a schematic cross-sectional view of the length direction of an LED filament in some embodiments according to the present application.

FIG32D is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

32E is a cross-sectional schematic diagram showing that the length direction of the LED filament is parallel to the maximum surface of the LED chip in some embodiments according to the present application.

32F is a cross-sectional schematic diagram showing that the length direction of the LED filament is parallel to the maximum surface of the LED chip in some embodiments according to the present application.

32G is a cross-sectional schematic diagram showing that the length direction of the LED filament is parallel to the maximum surface of the LED chip in some embodiments according to the present application.

32H is a cross-sectional schematic diagram showing that the length direction of the LED filament is parallel to the maximum surface of the LED chip in some embodiments according to the present application.

32I is a cross-sectional schematic diagram showing that the length direction of the LED filament is parallel to the maximum surface of the LED chip in some embodiments according to the present application.

Figure 32J is a schematic cross-sectional view of the length direction of an LED filament in some embodiments according to the present application.

FIG32K is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32L is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32M is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32N is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32O is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32P is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32Q is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32R is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32S is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG32T is a schematic cross-sectional view of an LED filament along a radial direction in some embodiments according to the present application.

FIG33 is a schematic diagram of the cross-sectional structure of an LED filament in some embodiments according to the present application (I).

FIG34 is a schematic diagram of the cross-sectional structure of an LED filament in some embodiments according to the present application (II).

Figures 35a to 35d are schematic diagrams (iii) to (vi) of the cross-sectional structures of LED filaments in some embodiments according to the present application.

FIG36 is a schematic diagram (I) of an LED bulb according to some embodiments of the present application.

FIG. 37 is a side view of the LED bulb in FIG. 36 .

FIG. 38 is another side view of the LED bulb in FIG. 36 .

FIG. 39 is a top view of the LED bulb in FIG. 36 .

FIG. 40 is a schematic diagram (II) of an LED bulb according to some embodiments of the present application.

Figure 41 is a schematic diagram of a lamp head in some embodiments according to the present application (I).

Figure 42 is a schematic diagram of the lamp holder in Figure 41 at the A-A section.

Figure 43 is a schematic diagram of a lamp head in some embodiments according to the present application (three).

Figure 44 is a schematic diagram of the lamp holder in Figure 43 at the B-B section (I).

Figure 45 is a schematic diagram of the lamp holder in Figure 43 at the B-B section (II).

FIG46A is a schematic diagram of an LED bulb in some embodiments according to the present application (III).

FIG. 46B is a schematic structural diagram (I) of an LED bulb having a buffer structure according to some embodiments of the present application.

FIG46C is a schematic diagram of the structure of an LED bulb with a buffer structure according to some embodiments of the present application (II).

FIG46D is a three-dimensional schematic diagram of an LED bulb according to some embodiments of the present application.

FIG. 47 is a side view of the LED bulb in FIG. 46A .

FIG. 48 is another side view of the LED bulb in FIG. 46A .

FIG. 49 is a top view of the LED bulb in FIG. 46A .

FIG50 is a schematic diagram (IV) of an LED bulb according to some embodiments of the present application.

FIG. 51 is a side view of the LED bulb in FIG. 50 .

FIG. 52 is another side view of the LED bulb in FIG. 50 .

FIG. 53 is a top view of the LED bulb in FIG. 50 .

Figure 54 is a schematic diagram of the structure of an LED filament in an unbent state in some embodiments according to the present application (III).

FIG. 55 is a schematic diagram of an LED bulb with the LED filament in FIG. 54 .

FIG56 is a schematic diagram (V) of an LED bulb in some embodiments of the present application.

Figure 57 is an enlarged schematic diagram of portion 62 in Figure 56.

Figure 58 is a circuit diagram of a first constant current circuit in some embodiments according to the present application.

Figure 59 is a circuit diagram of a second constant current circuit in some embodiments according to the present application.

Figure 60 is a circuit diagram of a third constant current circuit in some embodiments according to the present application.

FIG. 61 is a circuit block diagram of an LED bulb in some embodiments according to the present application.

FIG62 is a schematic diagram of the circuit structure of an LED bulb in some embodiments according to the present application (I).

FIG63 is a schematic diagram of the circuit structure of an LED bulb in some embodiments according to the present application (II).

FIG64 is a schematic diagram of the circuit structure of an LED bulb in some embodiments according to the present application (III).

R1 to R4 are the first to fourth resistors respectively; M1 is the main switch element, Q1 is the auxiliary switch element, and can adopt switch devices such as field effect tubes and triodes; 31, 32, D1 to D3 are LED chip units or LED chips; PTC is a PTC resistor; V2 is a voltage source.

Detailed ways

In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings.

Please refer to FIG. 1 to FIG. 3. FIG. 1 is a schematic diagram (I) of the structure of an LED filament according to some embodiments of the present application. FIG. 2 is a bottom view according to FIG. 1. FIG. 3 is a partial cross-sectional schematic diagram according to the A-A position in FIG. 1. As shown in FIG. 1 to FIG. 3, the LED filament 100 includes a plurality of LED chip units (102, 104), electrodes (106, 108), and a light conversion layer 110. The LED chip units (102, 104) are electrically connected to each other. The electrodes (106, 108) are arranged corresponding to the LED chip units (102, 104), and are electrically connected to the LED chip units (102, 104) through the first conductive portion 112. The light conversion layer 110 wraps the LED chip units (102, 104) and the electrodes (106, 108), and at least a portion of the two electrodes (106, 108) is exposed. The light conversion layer 110 includes silica gel, phosphor, and heat dissipation particles. In some embodiments, the LED chip unit (102, 104) includes at least one LED chip (described later), and the concentration of phosphors corresponding to each surface of the LED chip is the same, so that the light conversion rate of each surface is the same, so that the LED filament 100 obtains better light uniformity. Of course, in some other embodiments of the present application, the concentration of phosphors corresponding to each surface of the LED chip is at least two, so as to achieve directional adjustment of the light conversion rate of each surface, so that the LED filament 100 can control the light output difference of each surface according to design requirements.

As shown in FIG2 , the LED chip unit ( 102 , 104 ) includes at least one LED chip 111 . The LED chip units ( 102 , 104 ) have a first electrical connection portion 114 and a second electrical connection portion 116 , respectively. At least a portion of the first electrical connection portion 114 and the second electrical connection portion 116 are in contact with the light conversion layer 110 .

In some embodiments, as shown in FIG. 1 , the light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 wraps the LED chip unit (102, 104) and the electrodes (106, 108) and exposes at least a portion of the two electrodes (106, 108). The carrier layer 122 includes a base layer 124. The base layer 124 includes an upper surface 124a and a lower surface 124b opposite to the upper surface 124a. Relative to the lower surface 124b of the base layer 124, the upper surface 124a of the base layer 124 is close to the top layer 120. One of the first conductive portion 112 and the second conductive portion 118 is in contact with the upper surface 124a of the base layer 124 (directly or indirectly). When the LED filament 100 is bent, the curvature radius of the base layer 124 after bending under force is relatively small, and the first conductive portion 112 and the second conductive portion 118 are not easily broken. In some embodiments, the first electrical connection portion 114 and the second electrical connection portion 116 are in contact (direct contact or indirect contact) with the upper surface 124a of the base layer 124. In some embodiments, the LED chip unit (102, 104) may be a flip chip or a face-up chip. In some embodiments, the LED chip unit (102, 104) may be a micro light emitting diode (micro LED) or a sub-millimeter light emitting diode (mini LED), wherein the sub-millimeter light emitting diode refers to an LED with a package size in the range of 0.1-0.2 mm.

In some embodiments, the first conductive part 112 and the second conductive part 118 can be in the form of wires, films, glue, etched circuits, sintered circuits, such as copper wires, gold wires, circuit films, copper foils, conductive silver glue, etc.

Please refer to Figures 4 to 16. Figures 4 to 10 and Figures 12 to 13 are schematic diagrams (ii) to (x) of the structure of the LED filament in some embodiments according to the present application. Figure 11 is a top view of the LED filament after the top layer is removed in some embodiments according to the present application. Figure 14 is a schematic diagram of the structure of the LED chip bonding wire in some embodiments according to the present application. Figure 15 is a top view (i) of the LED filament in an unbent state after the top layer is removed in some embodiments according to the present application. Figure 16 is a top view (ii) of the LED filament in an unbent state after the top layer is removed in some embodiments according to the present application. In some embodiments, as shown in Figures 4 to 16, the LED filament 100 has a plurality of LED chip units (102, 104), two electrodes (106, 108), and a light conversion layer 110. The light conversion layer 110 wraps the LED chip units (102, 104) and part of the electrodes (106, 108), a part of the electrodes (106, 108) are exposed outside the light conversion layer 110, and adjacent LED chip units (102, 104) and LED chip units (102, 104) and electrodes (106, 108) are electrically connected to each other.

The LED filament 100 includes at least two LED chips 111, and the adjacent LED chips 111 are electrically connected to each other. The LED chip unit (102, 104) includes at least one LED chip 111. In some embodiments, a plurality of LED chip units 102 can form an LED segment 113, and a plurality of LED chip units 104 can form an LED segment 115 (described later in FIGS. 5 to 16, and the LED chip units (102, 104) are omitted from being labeled as LED segments (113, 115)).

The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 and the carrier layer 122 can be at least one layer of layered structure respectively. The layered structure is preferably one of a phosphor glue with high plasticity (relative to the phosphor film), a phosphor film with low plasticity or a transparent layer, or any combination of at least two of the aforementioned layered structures. The phosphor glue or phosphor film contains the following ingredients: silicone-modified polyimide and/or glue, and the phosphor glue/phosphor film can also include phosphors, inorganic oxide nanoparticles (or heat dissipation particles). The transparent layer 420c can be composed of a light-transmitting resin (such as silicone, polyimide) or a combination thereof. The glue can be but is not limited to silicone. In one embodiment, the top layer 120 and the carrier layer 122 are made of the same material.

In one embodiment, the carrier layer 122 includes a base layer 124. In the height direction of the LED filament 100 (Z-axis direction in FIG. 4 ), the height of the top layer 120 is greater than the height of the base layer 124. The base layer 124 includes an upper surface 124a and a lower surface 124b opposite to each other, and the top layer 120 includes an upper surface 120a and a lower surface 120b opposite to each other. The upper surface 124a of the base layer 124 contacts a portion of the lower surface 120b of the top layer 120. The LED chip 111 includes an upper surface 111a and a lower surface 111b relative to each other. The upper surface 111a of the LED chip 111 is closer to the upper surface 120a of the top layer 120 relative to the lower surface 111b of the LED chip 111. The distance from the lower surface 111b of the LED chip 111 to the lower surface 124b of the base layer 124 is smaller than the distance from the lower surface 111b of the LED chip 111 to the upper surface 120a of the top layer 120. Since the thermal conductivity of the top layer 120 is greater than the thermal conductivity of the base layer 124, the distance for the heat generated by the LED chip 111 to be conducted to the outer surface of the base layer 124 is relatively short, so that the heat is not easily accumulated, and the LED filament 100 obtains a better heat dissipation effect.

In most application scenarios, filament lamp products are no longer used for simple lighting purposes, but have become a part of environmental decoration. That is, when the filament lamp is not lit, consumers are concerned about the shape and appearance color of the filament (including the appearance color of the filament (or the color of the filament body) and the appearance color of the bulb); and when the filament lamp is lit, the focus is on whether the color temperature performance and illumination meet the environmental requirements. In some embodiments, the main body of the LED filament 100 may not include the portion of the electrode that exposes the light conversion layer 110. In some embodiments, when the LED filament 100 is not lit, the surface of the LED filament 100 is white, gray, black, In some embodiments, the surface of the LED filament 100 may be the surface of the light conversion layer 110. After the LED filament 100 is lit, it may emit light of a different color than when the LED filament 100 is not lit, so that the bulb lamp with the LED filament 100 can be used in different scenes (described later) to achieve different decorative effects. In some embodiments, the LED filament 100 includes a coating (not shown), and the color of the coating is white, gray, black, blue, green, purple, etc. The coating covers at least a portion of the surface of the light conversion layer 110, and preferably, the coating covers the entire surface of the light conversion layer 110. For example, a red coating is used to cover the surface of the light conversion layer 110. When the LED filament 100 is not lit, the surface of the LED filament 100 is red, and when the LED filament 100 is lit, the LED filament 100 emits white light. Of course, after the LED filament 100 is lit, it can emit light of the same color as when the LED filament 100 is not lit. For example, a white coating is used to cover the surface of the light conversion layer 110. When the LED filament 100 is not lit, the surface of the LED filament 100 is white. When the LED filament 100 is lit, the light emitted by the LED filament 100 is also white. The white coating can be aluminum oxide. In some embodiments, the surface of the top layer 120 and/or the carrier layer 122 is covered with a film, and the color of the film is black, gray, red, etc. Generally, all substances have a certain light absorption. A film with high light transmittance is preferably used, for example, the light transmittance of the film is at least greater than 80, which can prevent the luminous flux from decreasing after the LED filament 100 is lit. In some embodiments, the thickness of the film is less than the thickness of the top layer 120, and the heat emitted by the LED chip 111 is not easily accumulated in the film, taking into account the appearance and heat dissipation requirements of the LED filament 100. The film may contain phosphor or not. When the film contains phosphor, the phosphor content of the film is less than the phosphor concentration of the top layer 120 or the carrier layer 122. If the top layer 120 or the carrier layer 122 is a multi-layer structure, the phosphor content of the film is at least less than the phosphor content of one of the layers. Due to the presence of the film, the thickness of the LED filament 100 increases, and the heat conduction path of the LED filament 100 becomes longer. If the phosphor content in the film is increased to improve the heat dissipation performance of the LED filament 100, the hardness of the film will increase due to the increase in the phosphor content in the film, making the flexibility of the LED filament 100 worse, and the probability of cracks when the LED filament 100 is bent increases. In some embodiments, adding a certain amount of phosphor to the film can change the color of the LED filament 100 when it is not lit while taking into account the heat dissipation performance and flexibility of the LED filament 100. In some embodiments, after the top layer 120 and/or the base layer 124 are covered with a thin film, when the LED filament 100 is not lit, the main body of the LED filament 100 is grayish black (close to the original color of the tungsten filament), and when the LED filament 100 is lit, the light emitted by the LED filament 100 is white. In some embodiments, the color of the light conversion layer 110, the main body of the LED filament 100, etc. when the LED filament 100 is not lit, or the color of the light emitted after the LED filament 100 is lit includes a primary color, a color mixed from at least two primary colors, for example, the primary color is the three primary colors of light (RGB).

Please refer to FIG. 25 , which is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XIII). As shown in FIG. 25 , the above-mentioned coating or film is a layered body 1101 disposed on the outer surface of the light conversion layer 110. In some embodiments, the hardness of the layered body 1101 is less than that of the light conversion layer 110 to prevent the hardness of the layered body 1101 from being too hard, thereby affecting the normal bending of the LED filament 100. In some embodiments, the hardness of the layered body 1101 may be greater than that of the light conversion layer 110 to further support the entire LED filament 100. Regardless of the hardness of the layered body 1101, the overall support of the LED filament 100 can be improved by the provision of the layered body 1101.

The bulb shell of the LED filament bulb is filled with gas (to be described later), and the refractive indexes of the light conversion layer 110, the layered body 1101 and the filling gas in the bulb shell decrease in sequence. If the layered body 1101 is not provided, the light loss may be large due to the large difference in refractive index between the light conversion layer 110 and the filling gas. However, the above-mentioned arrangement of the layered body 1101 in this embodiment can make the LED The chip 111 has a small optical loss on the light output path.

The layered body 1101 can be made of silica gel or a material with silica gel as the main body. When silica gel is directly used, the layered body 1101 can be made white by the color of silica gel itself, so that the appearance of the LED filament 100 is white. After adding colorants to the silica gel, the layered body 1101 can be made to present different colors as described above. In addition, a photoreactive substance can also be added to the layered body 1101, so that after the LED chip 111 emits light, it undergoes the first light conversion through the light conversion layer 110, and then undergoes the second light conversion through the photoreactive substance in the layered body 1101, thereby achieving that when the LED filament 100 is not lit, it has a first color, and after it is lit, it has a second color different from the first color, and the first color and the second color have differences in primary colors.

In some embodiments, as shown in FIG4 , the light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 and the carrier layer 122 may each be a layered structure of at least one layer, and the upper surface 120a of the top layer 120 and the lower surface 122b of the carrier layer 122 have different colors. Since the LED filament 100 presents two different colors when not lit, it can be applied to multi-color usage scenarios.

In some embodiments, the layered body 1101 may also be made of other materials besides silicone or silicone-based materials, such as resin, plastic, polyimide (PI), polyvinyl alcohol (PVA), polyester (PET), polyethylene naphthalate (PEN), polydimethylsiloxane (PDMS), etc.

In some embodiments, the layered body 1101 may be mainly composed of silica gel, mixed with other solid powders (particles), and the solid powder particles may be non-conductive white powders, such as titanium dioxide powder, but not limited thereto, such as a mixture of inorganic oxide nanoparticles, wherein the fixed powder particles account for a certain proportion of the total weight of the layered body 1101 to meet the performance requirements of the overall filament. In some embodiments, a certain amount of titanium dioxide powder (particles) is mixed in the layered body 1101, and the titanium dioxide powder (particles) is relatively evenly distributed in the layered body 1101. The layered body 1101 is prepared from silica gel and titanium dioxide powder (particles). When the silica gel presents liquid properties under certain conditions, a certain amount of titanium dioxide is added to the silica gel. The titanium dioxide powder (particles) is evenly distributed in the silica gel by common mixture processing methods such as stirring, high-speed shaking, and planetary mixer processing. When the mixture of silica gel and titanium dioxide is in a liquid state, the layered body 1101 is disposed on the surface of the light conversion layer 110 by spin coating, spray coating, scraper coating, and infiltration (immersing the entire material in the liquid and then taking it out, and the liquid covers the surface of the material). Then, the layered body 1101 is solidified on the surface of the light conversion layer 110 by exposure, baking, natural curing, etc. The thickness of the layered body 1101 is less than or equal to the thickness of the light conversion layer 110 (the thickness refers to the length in the Z-axis direction in FIG. 4), so as to avoid the layered body 1101 being too thick to affect the light emission and flexibility of the LED filament 100. The mass of titanium dioxide accounts for 0.2% to 10% of the total mass of the layered body 1101, and further 0.7% to 5%. The color of titanium dioxide powder (particles) is white, and its relative density is the smallest among commonly used white pigments. Among white pigments of equal mass, titanium dioxide has the largest surface area and the highest pigment volume. Compared with other materials, it has a stronger ability to make the mixed material approach the color of titanium dioxide material. For example, if the mixed material needs to approach white, less titanium dioxide material can meet the demand compared with other materials. Titanium dioxide has a high reflectivity (for example, more than 80%) and refractive index (for example, 2.5 to 2.8), and it is evenly distributed in the layered body 1101. The light excited by the LED chip 111 is converted by the light conversion layer 110 and reaches the layered body 1101. After multiple refractions and reflections by the titanium dioxide powder (particles) distributed therein, it is finally emitted from the layered body 1101. The specific directionality of the light is greatly reduced, and the light output is more uniform and soft.

Please refer to FIG. 27, which is a schematic diagram of the structure of an LED filament in some embodiments of the present application (XV). As shown in FIG. 27, a certain amount of titanium dioxide is provided in the layered body 1101. Referring to the local enlarged part (circled), it can be seen that the light processed by the light conversion layer 110 is disordered in the layered body 1101, so that the specific directivity of the final emitted light is greatly reduced, forming an effect similar to diffuse reflection, and the light emitted from the layered body 1101 is uniform and soft. Of course, the amount of titanium dioxide added should not be too much, which will lead to greater light loss. For example, when the total mass of titanium dioxide is greater than 10% of the layered body 1101, the amount of titanium dioxide continues to increase and cannot continue to improve the soft light effect, but will cause greater light loss, resulting in the light output not meeting the demand. The amount of titanium dioxide added should not be too small, too small to achieve the function of homogenizing light and cannot obtain the ideal color effect, for example, when the total mass of titanium dioxide is less than 0.2% of the layered body 1101. Titanium dioxide can soften the light and make the LED filament 100 (or the layered body 1101) appear white or nearly white with a small amount of addition. More specifically, when the LED filament 100 (or the layered body 1101) is not lit, under the RGB standard, its color value is within the range of R (235-255), G (235-255), B (235-255), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller or larger value, and further, the absolute value of the difference between any two of R, G, and B is less than or equal to 5% of the smaller or larger value. Of course, the material added to the layered body 1101 can also be other color-developing materials or photoconversion materials, such as one or more combinations of aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphors, sulfates, silicates, nitrides, nitrogen oxides, oxysulfates, or garnets. For example, it can be a combination of one of aluminum oxide and silicon dioxide and titanium dioxide, wherein the mass proportion of titanium dioxide is 5% to 15% of all solid particles, preferably 8%. It can also be a combination of one of aluminum oxide and silicon dioxide and magnesium oxide or sulfate (such as barium sulfate), but it is not limited to this, and it can be a combination of one or more materials. In some embodiments, the color setting of the filament when it is not lit can be achieved through a variety of different phosphors, for example, the filament can be made to present a series of colors such as white, gray, black, etc. when it is not lit by mixing light from different phosphors.

In some embodiments, light conversion particles, such as fluorescent powder, may also be provided in the layered body 1101, and the mass proportion of the light conversion particles may account for 2% to 10%, preferably 4%, of the total amount of solid particles in the layered body 1101, so that the layered body 1101 has a light conversion effect, so that the light excited by the LED chip 111 that is not converted by the light conversion layer 110 continues to be converted by the layered body 1101 and then emitted, thereby improving the light conversion rate of the overall LED filament 100, that is, achieving a high light conversion effect through two independent light conversions.

In some embodiments, the layer 1101 has a uniform thickness and is disposed on two surfaces of the light conversion layer 110 substantially parallel to the light emitting surface of the LED chip 111 , referring to the upper surface 111 a and the lower surface 111 b parallel to the LED chip 111 in FIG. 4 .

In some embodiments, the layered body 1101 is uniformly thick and is disposed on two surfaces of the light conversion layer 110 that are substantially parallel to the light-emitting surface of the LED chip 111 and the long side surfaces (surfaces through which non-electrodes (106, 108)) that are perpendicular to the light-emitting surface of the LED chip 111, refer to Figure 4 for the upper and lower surfaces parallel to the LED chip 111 and the long side surfaces that are perpendicular to the light-emitting surface of the LED chip 111.

Please refer to FIG. 28, which is a schematic diagram of the structure of an LED filament according to some embodiments of the present application (XVI). In some embodiments, the layered body 1101 completely covers the light conversion layer 110 and at least covers a portion of the electrodes (106, 108), as shown in FIG. 28, wherein the layered body 1101 has a certain strength and toughness, which can strengthen the LED filament 100. Overall strength.

In some embodiments, the layered body 1101 may cover at least a portion of a surface of the light conversion layer 110 that is parallel to the LED chip 111 and a surface corresponding to the electrodes ( 106 , 108 ).

In some embodiments, the filler material in the layered body 1101 can be selected from one of aluminum oxide or silicon dioxide, combined with titanium dioxide and graphene, wherein titanium dioxide accounts for 0.5% to 5% of the total solid particles in the layered body 1101, preferably 1.25%. Titanium dioxide accounts for 0.1% to 3% of the total weight of the layered body 480, and further 0.4% to 2.5%. Graphene accounts for 0.1% to 1% of the total weight of the layered body 1101, preferably 0.5%. In some embodiments, graphene can be fluorinated graphene, which has excellent non-conductive properties, excellent thermal conductivity and thermal stability, and has good dispersion stability, and can maintain a relatively stable position in some materials. In terms of particle size selection, the particle size of aluminum oxide (or silicon dioxide) is larger than that of titanium dioxide, and the particle size of titanium dioxide is larger than that of graphene. That is, there are three sizes of particles in the layered body 1101. The three sizes of particles are mixed and evenly distributed in the layered body 1101. It is difficult for gaps or thermal insulation areas to form between them, and the heat dissipation effect is better.

Please refer to Figure 29, which is a schematic diagram of the heat dissipation path of the LED filament in some embodiments according to the present application, wherein the left side of the figure shows an example of a layered body with additive materials of different particle sizes, and the right side of the figure shows an example of a layered body with additive materials of a single particle size. As shown in FIG. 29 , particle 1102 represents the largest particle size (such as aluminum oxide or silicon dioxide), particle 1103 represents the medium particle size (such as titanium dioxide), and particle 1104 represents the smallest particle size (such as graphene). When the conditions for setting particles of different particle sizes are small, particles of small particle size will fill the gaps between particles of large particle size. The heat dissipation path can be mutually turned and continued between particles of small particle size (particle 1104), particles of medium particle size (particle 1103) and particles of large particle size (particle 1102) to form a complete heat dissipation path, and the heat dissipation effect of the particle (particle 1103) is good, and the heat dissipation effect of silica gel is relatively poor. In the heat dissipation path, the path length passing through the heat dissipation particle is much greater than the path length passing through silica gel (or other materials instead of silica gel as a substrate), that is, the high heat dissipation path accounts for a high proportion of the overall heat dissipation path, and the heat dissipation effect is good. On the other hand, in the heat transfer process, the area with large temperature difference and good thermal conductivity dissipates heat quickly, and heat is preferentially dissipated (lost) from this area. In the layered body 1101 with different particle sizes, the particles have good thermal conductivity, and the heat on the particles can be dissipated quickly. Then, there will be a certain temperature difference between particles with different distances from the heat source, and heat will be preferentially transferred between particles with temperature difference. However, the heat dissipation capacity of silica gel is poor, and heat is easy to accumulate. Therefore, the temperature difference is small, and the path of heat dissipation will preferentially choose the path composed of particles, and reduce the path composed of silica gel. Comparing the heat dissipation paths on the left and right sides of Figure 29, the heat dissipation path is preferably a path formed by particles in series, and under the same path length condition, as shown in path PA1, the layered body 1101 with particles of different particle sizes on the left side has a higher proportion of the length of the particle path in its heat dissipation path, and its heat dissipation effect is good. On the right drawing, there is a single particle, and there is no other smaller particle filling the gap between the particles. Its heat dissipation path can only choose silica gel. Under the same heat dissipation path length condition, the proportion of silica gel in the heat dissipation path is high, and the heat dissipation effect is inferior to the left figure. By mixing different particles (at least two particle sizes, for example, in some embodiments, aluminum oxide or magnesium oxide with a particle size between 2.5 mm and 25 mm, titanium dioxide with a particle size between 0.3 mm and 1 mm, and graphene with a particle size between 5 nm and 300 nm) with silica gel, the proportion of particles that have direct contact with the outermost side of the heat dissipation surface is increased, and at the same time, the gaps between large-sized particles are filled with particles of smaller particle sizes, thereby optimizing the microscopic heat dissipation path and improving the overall heat dissipation effect. Among them, graphene (or fluorinated graphene) has good thermal conductivity, insulation, thermal stability, etc. and is often selected as one of the added materials. In some embodiments, the layered body 1101 can be made gray or close to gray (that is, the filament is gray or close to gray). More specifically, the LED filament 100 (or layered body 1101) is made to have a color value within the range of R value (100-234), G value (100-234), and B value (100-234) under the RGB standard when it is not lit, wherein the absolute value of the difference between any two of the R value, G value, and B value is less than or equal to 10% of the smaller or larger value thereof, and further, the absolute value of the difference between any two of the R value, G value, and B value is less than or equal to 5% of the smaller or larger value thereof.

In some embodiments, the light conversion layer 110 has a top layer 120 and a base layer 124, and the layered body 1101 can be disposed on the top layer 120. In some embodiments, please refer to FIG. 30, which is a schematic diagram of the structure of an LED filament in some embodiments of the present application (XVII). As shown in FIG. 30, the layered body 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrodes (106, 108) facing the top layer 120.

In some embodiments, the layer 1101 may only cover the top layer 120 without contacting at least a portion of the surface of the electrodes ( 106 , 108 ) facing the top layer 120 .

In some embodiments, please refer to FIG. 31 , which is a schematic diagram of the structure of an LED filament in some embodiments of the present application (XVIII). As shown in FIG. 31 , the layered body 1101 can completely cover the top layer 120 and the base layer 124 , and at least cover at least a portion of the surface of the electrode ( 106 , 108 ) facing the top layer 120 and the base layer 124 .

In some embodiments, please refer to FIG. 32A, which is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XIX). As shown in FIG. 32A, the light conversion layer 110 includes a top layer 120 and a base layer 124, wherein the layer 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrode (106, 108) facing the top layer 120, and the base layer 124 is uncovered. The thickness of the layer 1101 along the radial direction of the LED filament 100 is less than or equal to the thickness of the top layer 120 along the radial direction of the LED filament 100, and further, the thickness of the layer 1101 along the radial direction of the LED filament 100 is less than or equal to one-half of the thickness of the top layer 120 along the radial direction of the filament, and further, less than or equal to one-third.

In some embodiments, the thickness of the top layer 120 can be set to 0.2 mm to 0.7 mm, and further 0.35 mm to 0.5 mm. The thickness of the base layer 124 can be set to 0.05 mm to 0.15 mm, and further 0.08 mm to 0.15 mm, to ensure that the LED filament 100 has sufficient flexibility.

In some embodiments, due to the difference in added materials between the base layer 124 and the top layer 120, there is a difference in deflection and strength per unit volume between the base layer 124 and the top layer 120. When the thickness of the base layer 124 and the top layer 120 are close, the difference in overall deflection or strength between the base layer 124 and the top layer 120 is too large due to the accumulation of differences, and the filaments are prone to delamination or breakage when bent. For example, when the ratio of the thickness of the base layer 124 to the thickness of the top layer 120 is greater than one-half, the overall flexibility and reliability of the LED filament 100 are insufficient, and the LED filament may have the aforementioned flexibility and be prone to delamination or breakage when bent. Therefore, in this embodiment, the ratio of the thickness of the base layer 124 to the thickness of the top layer 120 is less than or equal to one-half, and further, may be less than or equal to three-eighths. Thus, in this embodiment, the ratio of the thickness of the base layer 124 to the thickness of the top layer 120 is controlled. When the ratio is within the aforementioned range, better softness can be achieved, that is, the physical properties such as deflection and strength of the base layer 124 and the top layer 120 caused by the difference in the added materials can be adjusted by controlling the thickness, so that the base layer 124 and the top layer 120 have similar physical properties, which can prevent the LED filament 100 from being delaminated or broken when being bent.

In some embodiments, the ratio of the thickness of the layered body 1101 to the base layer 124 is less than or equal to one-half, and further less than or equal to three-quarters. For example, when the thickness ratio is greater than one-half, the layered body 1101 may affect the light emission of the entire filament (solid particles are added to the layered body 1101).

In some embodiments, the thickness of the layered body 1101 can be set to 0.05 mm to 0.4 mm, and further can be 0.1 mm to 0.2 mm. In some embodiments, when the thickness of the base layer 124 is too large, for example, when the base layer 124 is greater than one-fourth of the sum of the thicknesses of the layered body 1101, the top layer 120, and the base layer 124, the heat dissipation of the base layer 124 will be affected, that is, the heat dissipation path of the LED filament 100 is long and heat accumulation is easily caused. Therefore, in this embodiment, the thickness of the base layer 124 is less than or equal to one-fourth of the thickness of the LED filament 100. Specifically, as shown in FIG. 32A, the thickness of the base layer 124 is less than or equal to one-fourth of the sum of the thicknesses of the layered body 1101, the top layer 120, and the base layer 124. In this way, the heat dissipation of the base layer 124 can be maintained, the heat dissipation path of the LED filament 100 can be shortened, and heat accumulation can be avoided.

In some embodiments, as shown in FIG. 32A , the light conversion layer 110 includes a top layer 120 and a base layer 124, wherein the layer 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrode (106, 108) facing the top layer 120, and the base layer 124 is uncovered, wherein the base layer 124 is added with the same or similar additive material as that in the layer 1101, so that the base layer 124 and the layer 1101 are finally displayed in the same RGB value range, such as under the condition of the original material, titanium dioxide is added, so that the layer 1101 and the base layer 124 are both white or close to white, and the color value is within the R value (23 5～255), G value (235～255), B value (235～255), or continue to add graphene so that the layered body 1101 and the base layer 124 are both gray or close to gray, and the color value is within the range of R value (100～234), G value (100～254), B value (235～254), for example, white powder particles are added to the layered body 1101 and the base layer 124, such as adding titanium dioxide to the layered body 1101, and titanium dioxide is also added to the base layer 124, and the amount of titanium dioxide added is 1% to 20% of the total weight of the solid particles (powder) in the base layer 124, and further 3% to 15%.

In some embodiments, at least one phosphor is also provided in the base layer 124, and the phosphor accounts for 1% to 15% of the total weight of the solid particles (powder) in the base layer 124, and further 2% to 8%. The average particle size of the phosphor particles is controlled to be less than about 20um. In some embodiments, a certain amount of thermally conductive particles, including but not limited to thermally conductive particles such as aluminum oxide and silicon dioxide, can also be provided in the base layer 124 to improve the heat dissipation function of the equation, wherein the total weight of the thermally conductive particles in the base layer 124 accounts for 80% to 95% of the total weight of the solid particles. The particle size of the thermally conductive particles can be a variety of different particle sizes used in combination with each other, and the particle size selection can be selected within 1um to 30um, and further can be selected within 2um to 25um, and the average particle size is between 1um and 20um, and further can be 5um to 15um.

In some embodiments, the total weight of the thermal particles in the base layer 124 accounts for 80% to 95% of the total weight of the solid particles in the base layer 124 .

In some embodiments, the light conversion layer 110 includes a top layer 120 and a base layer 124, wherein the layer 1101 can completely cover the top layer 120 and at least cover at least a portion of the surface of the electrode (106, 108) facing the top layer 120, and the base layer 124 is uncovered, wherein the base layer 124 is added with an additive material different from that in the layer 1101, so that the colors finally presented by the base layer 124 and the layer 1101 are displayed in different RGB value ranges. In some embodiments, the RGB color standard and other color standards can be converted to each other.

In some embodiments, the additive materials in the base layer 124 and the layered body 1101 are the same, so that the base layer 124 and the layered body 1101 present the same color, for example, the base layer 124 presents white, and after the light conversion layer 110 is disposed on the base layer 124, the layered body 1101 is further disposed on the light conversion layer 110, and the layered body 1101 completely covers a portion of the light conversion layer 110, so that the formed filament appears white when not lit. Of course, the layered body 1101 may also at least cover a portion of the light conversion layer 110.

In some other embodiments of the present application, silver-gray or silver-white thermally conductive particles are added to the base layer 124, and the thermally conductive particles include but are not limited to aluminum powder or aluminum oxide, silver powder or aluminum-silver mixed powder. The silver-gray or silver-white thermally conductive particles can be arranged on the base layer 124 or the layered body 1101, so that at least one side of the flexible filament is silver-gray or silver-white.

When silver-gray or silver-white thermally conductive particles are provided in the base layer 124, the thermally conductive particles account for 0.15% to 10% of the total solid particles in the base layer 124, and further account for 0.3% to 5%. The weight of the thermally conductive particles (including but not limited to aluminum oxide or silicon dioxide, etc.) and the phosphor particles in the base layer 124 is 95% to 99% of the total weight of the solid particles in the base layer 124. By controlling the proportion of the solid particles in the base layer 124, the thermal conductivity of the substrate 124 is improved, and the heat generated when the LED chip 111 emits light is increased. Conductivity is increased.

The silver-gray or silver-white thermally conductive particles are distinguished from the thermally conductive particles, that is, the silver-gray or silver-white thermally conductive particles can be called color-developing particles, and the color-developing particles account for 0.15% to 10% of the total solid particles in the base layer 124, and further 0.3% to 5%. Of course, the silver or silver-gray thermally conductive particles, thermally conductive particles, and fluorescent powder particles can also be added to the base layer 124 in different proportions.

In one embodiment of the present application, silver or silver-gray heat-conducting particles are provided in the layered body 1101, which accounts for 0.05% to 10% of the total weight of the layered body 1101, and further 0.15% to 5%. The thickness of the top layer 120 provided on the surface of the base layer 124 facing the LED chip is 0.2mm to 0.6mm, and further 0.35mm to 0.5mm; the thickness of the base layer 124 is 0.05mm to 0.3mm, and further 0.1mm to 0.2mm; the thickness of the base layer 124 is 0.04mm to 0.3mm, and further 0.08mm to 0.15mm; and the thickness of the base layer 124 is less than one-third of the sum of the thicknesses of the base layer 124, the top layer 120, and the layered body 1101, and further one-quarter. Thus, it can meet both its appearance requirements and its light-emitting and heat-dissipating requirements.

In one embodiment of the present application, the base layer 124 may also include a multi-layer structure, for example, at least a two-layer structure, in which thermal conductive particles and fluorescent particles are added to a layer close to the LED chip, and silver-gray/silver-white thermal conductive particles are added to the outermost layer, that is, in the finished filament, the surface located on the outermost side and observable by the naked eye makes the surface appear silver-gray/silver-white.

In this embodiment of the present application, the LED chips 111 can be connected to each other through conductive metal wires, that is, for example, through metal Wire, silver wire, copper wire, aluminum wire, etc., are used to achieve electrical conduction between the LED chips 111 by wire bonding. Of course, conduction can also be achieved between the LED chip 111 and the electrodes (106, 108) by wire bonding with conductive metal wires.

In another embodiment of the present application, a copper foil circuit is provided on the base layer 124, and the copper foil circuit extends along the length direction of the base layer 124. The LED chip 111 is provided on the copper foil circuit in a flip-chip manner and is conductively connected to the copper foil circuit. The LED chip 111 extends along the length direction of the copper foil circuit or the base layer 124. At the same time, both ends of the copper foil circuit are electrically connected to the electrodes (106, 108), thereby realizing the conduction and lighting of the entire filament.

In some other embodiments of the present application, golden heat-conducting particles are added to the base layer 124, and the heat-conducting particles include but are not limited to bronze powder, brass powder, gold powder or a combination thereof. The golden heat-conducting particles can be arranged on the base layer 124 or the layered body 1101, so that at least one side of the flexible filament is golden.

When golden thermally conductive particles are provided in the base layer 124, the thermally conductive particles account for 0.5% to 15% of the total solid particles in the base layer 124, and further 1% to 10%. The weight of the thermally conductive particles (including but not limited to aluminum oxide or silicon dioxide) and the phosphor particles in the base layer 124 is 90% to 99% of the total weight of the solid particles. The silver-gray or silver-white thermally conductive particles are distinguished from the thermally conductive particles, that is, the golden thermally conductive particles can be called color-developing particles, and the color-developing particles account for 0.5% to 15% of the total solid particles in the base layer 124, and further 1% to 10%. Of course, the golden thermally conductive particles, thermally conductive particles, and phosphor particles can also be added to the base layer 124 in different proportions.

In one embodiment of the present application, the layered body 1101 is provided with golden heat-conducting particles, which account for 0.05% to 10% of the total weight of the layered body 1101, and further 0.1% to 5%. The thickness of the top layer 120 arranged on the surface of the base layer 124 facing the LED chip is 0.1mm to 1mm, and further 0.35mm to 0.5mm; the thickness of the base layer 124 is 0.05mm to 0.3mm, and further 0.1mm to 0.2mm; the thickness of the base layer 124 is 0.04mm to 0.3mm, and further 0.08mm to 0.15mm; and the thickness of the base layer 124 is less than one-third of the sum of the thickness of the base layer 124, the top layer 120, and the layered body 1101, and further one-quarter. Thus, it can meet the appearance requirements, and can also meet the light-emitting and heat-dissipating requirements.

In one embodiment of the present application, the base layer 124 may also include a multi-layer structure, for example, at least a two-layer structure, in which thermal conductive particles and fluorescent particles are added to a layer close to the LED chip, and golden thermal conductive particles are added to the outermost layer, that is, in the finished filament, the surface located on the outermost side and observable by the naked eye makes the surface appear golden.

In this embodiment of the present application, the LED chips 111 can be electrically connected through conductive metal wires, that is, through gold wires, silver wires, copper wires, aluminum wires, etc., and the LED chips 111 can be electrically connected by bonding. Of course, the LED chip 111 and the electrodes (106, 108) can also be electrically connected by bonding conductive metal wires.

In another embodiment of the present application, the base layer 124 is realized by using BT resin substrate material (hereinafter referred to as BT substrate) as the main material. The BT substrate, i.e., BT (Bismaleimide Triazine) board, is a BT resin substrate material, which is synthesized from bismaleimide (Bismaleimide, BMI) and cyanate ester (CE) resin. In an embodiment of the present application, the base layer 124 includes a BT substrate, which is located at the bottom of the base layer 124. A copper foil circuit is arranged above the BT substrate. The copper foil circuit extends along the length direction of the BT substrate, and the copper foil circuit is arranged at least 70% of the length direction of the BT substrate. Electrodes (106, 108) are arranged at both ends of the copper foil circuit, i.e., the BT substrate. The copper foil circuit is connected to the electrodes (106, 108) by wire bonding or welding. The copper foil circuit can be provided with an anti-oxidation layer on its surface as required, and the anti-oxidation layer can be formed by electroplating silver, gold or by passivation. Of course, in the process of forming the anti-oxidation layer, the copper foil circuit still reserves electrical connection points for electrical connection with the LED chip 111. The LED chip 111 is arranged on the copper foil circuit by flip chip method, that is, solder paste is arranged on the electrical connection points reserved for the copper foil circuit, and the pins of the LED chip 111 face the copper foil circuit and contact the solder paste on the electrical connection points. Through reflow soldering or laser welding or other methods, the solder paste is melted and fully combined with the pins of the LED chip 111, and then cooled and solidified so that the LED chip 111 is fixed to the copper foil circuit and electrically connected, thereby realizing the conduction and lighting of the LED filament. A packaging adhesive is provided above the LED chip 111 and the copper foil circuit. The packaging adhesive layer can be adhesive materials such as silicone, resin, polyimide, etc. as mentioned above. The adhesive material is mixed with phosphor particles, heat dissipation particles, or at least one of the solid particles as mentioned above. The adhesive completely covers the LED chip 111 and at least covers a part of the copper foil circuit, and at least covers a part of the electrode (106, 108), thereby forming a top layer 120 covering the base layer 124. The top layer 120 has at least efficient heat dissipation and light conversion effects by combining various particles mixed therein with its own material. On the top layer 120, i.e., the surface away from the chip 111, a layer 1101 is arranged, the layer 1101 completely or at least covers a part of the top layer 120, and white fixed powder is added to the layer 1101, including but not limited to titanium dioxide, aluminum oxide, magnesium oxide, silicon dioxide, etc. as described above and below, so that the layer 1101 appears white when the filament is not lit, that is, under the RGB standard, its color value is within the range of R (235-255), G (235-255), B (235-255). The weight of the white solid powder particles in the layer 1101 can account for 0.7-3% of the total weight of the layer 1101. Of course, solid powder particles of other colors can also be arranged in the layer 1101, so that the layer 1101 appears red, orange, yellow, green, blue, indigo, purple, gray, black, gold, silver, etc.

In this embodiment of the present application, the BT substrate has light transmission and light conversion functions, and its color is also white, that is, under the RGB standard, its color value is in the range of R (235~255), G (235~255), B (235~255), and it is located on the outermost side of the filament, so there is no need to set an additional white coating (such as the aforementioned layer 1101) on the base layer 124, that is, the side of the BT substrate away from the chip 111, and the layer 1101 can be used to make the LED filament appear white when it is not lit, that is, under the RGB standard, its color value is in the range of R (235~255), G (235~255), B (235~255).

In one embodiment of the present application, the light transmittance of the BT substrate is ≥30%.

In another embodiment of the present application, the light transmittance of the BT substrate is ≥35%.

In another embodiment of the present application, the light transmittance of the BT substrate is ≥80%.

Of course, in some other embodiments of the present application, different colored BT substrates can be used to make the filament appear bright when not lit. Different colors are presented in different situations, such as yellow BT substrate, blue BT substrate, gray BT substrate, black BT substrate, red BT substrate, green BT substrate, purple BT substrate, gold BT substrate, silver BT substrate, etc., so that the filament presents corresponding colors when it is not lit.

In some embodiments of the present application, the BT substrate and the layered body 1101 may be the same color, that is, the filaments present a consistent color.

In some embodiments of the present application, the BT substrate and the layered body 1101 may be different colors, that is, the filament presents different colors or at least two colors.

In one embodiment of the present application, the thickness of the base layer 124 is less than or equal to 0.20 mm, and can be further controlled to be less than or equal to 0.15 mm. Under this thickness condition, the base layer 124 can have good light transmittance and heat dissipation performance, its light transmittance is greater than or equal to 50%, and its thermal conductivity is greater than or equal to 1W/(m.K). A color layer is arranged again on the outside of the base layer 124, which can achieve a thinner thickness and better heat dissipation performance. At the same time, the thinner thickness can meet the flexibility requirements of the flexible filament.

In another embodiment of the present application, during the BT substrate molding process, phosphor particles, heat dissipation particles, or other solid particles as described above can be added to the side of the BT substrate facing the LED chip 111, so that the BT substrate body has light conversion capability; titanium dioxide (or other powder particles with specific colors), heat dissipation particles, phosphor particles, or solid particles as described above can be set on the side of the BT substrate away from the LED chip 111 to make it present the required color and achieve specific functions. For example, titanium dioxide particles are set on the side of the BT substrate away from the LED chip 111 to make it appear white.

In one embodiment of the present application, during the molding process of the BT substrate, the surface facing the LED chip 111 and the surface away from the LED chip 111 present the same color.

In another embodiment of the present application, during the BT substrate molding process, by adding different solid particles, the BT substrate can be made to have different colors on the surface facing away from the LED chip 111 and on the surface facing the LED chip 111, for example, the surface facing away is white and the surface facing away is yellow. When the filament is made white, the surface facing away does not need to be additionally provided with a white coating. The solid particles added therein can be distributed in different positions by controlling their density and being controlled by a magnetic field or an electric field.

Of course, solid particles may not be provided during the BT substrate forming process.

In one embodiment of the present application, the color presented by the filament when not lit is the same as the color presented by the filament after it is lit or the color of the light emitted.

In one embodiment of the present application, the color of the filament when it is not lit is different from the color of the filament after it is lit or the color of the light emitted.

Please refer to Figures 32B and 32C, which are schematic cross-sectional views of a filament with a BT substrate as the main material along the length direction of the filament in some embodiments of the present application. As shown in Figure 32B, in this embodiment of the present application, a BT board is used as the main material of the substrate 124 of the filament, and the BT substrate is arranged on the lower side of the base layer 124, that is, the side away from the LED chip 111, more specifically, the outermost side, that is, at least one side of the BT substrate serves as the outer surface of the LED filament. On the upper surface of the substrate 124 (facing the LED A copper foil circuit 1241 is provided on one side of the chip 111, and the copper foil circuit 1241 extends along the length direction of the LED filament and forms electrodes (106, 108) at both ends of the LED filament, that is, the base layer 124 has positive and negative electrodes located at both ends when it is formed, and the base layer 124 at least covers a portion of the electrodes (106, 108), and there is no need to additionally set positive and negative electrodes during the LED filament packaging process. Moreover, the electrodes are integrally formed with the substrate 124 when the substrate 124 is formed, and have good bonding strength. During the bending process of the LED filament, it is not easy to be damaged by breakage or peeling.

In one embodiment of the present application, the LED chip 111 and the copper foil circuit 1241 are fixed and connected by solder paste, see FIG. 32C , as shown in the figure, the upper layer of the base layer 124, that is, the side close to the LED chip 111 is the surface formed by the copper foil circuit 1241, and the LED chip 111 is fixed on the copper foil circuit 1241 by solder paste, as shown in the enlarged part of the figure, the LED chip 111 is fixed and connected to the copper foil circuit 1241 by at least two solder pastes, or at least two pins on the LED chip 111 are fixed and connected to the copper foil circuit 1241, and a top layer 120 is provided above the copper foil circuit 1241 and the LED chip 111, that is, on the side of the LED chip 111 away from the base layer 124, and the top layer 120 completely covers the LED chip on the base layer 124 and covers at least a portion of the electrode (106, 108). In another embodiment of the present application, the top layer 120 covers at least a portion of the copper foil circuit.

A layered body 1101 is disposed on the side of the top layer 120 away from the LED chip 111 or the base layer 124 . The layered body 1101 completely covers or at least covers the surface of the top layer 120 away from the base layer 124 , and the layered body 1101 at least covers a portion of the electrode ( 106 , 108 ) or the copper foil circuit 1241 .

In another embodiment of the present application, there is no contact between the layered body 1101 and the electrodes ( 106 , 108 ) or the copper foil circuit 1241 , that is, the contact area between the layered body 1101 and the base layer 124 is zero.

The LED chips 111 are arranged along the axial direction of the LED filament, that is, along the length direction of the LED filament, at uniform intervals, until the two ends of the LED filament, that is, the positions of the electrodes (106, 108). The LED chips 111 and the electrodes (106, 108) are also fixed and connected by chip flipping and solder paste, so that the entire LED filament or the LED chips 111 on the entire LED filament can be turned on and lit. That is, in the direction perpendicular to the maximum surface of the LED chip 111 or the maximum surface of the electrodes (106, 108), the projections of the LED chip 111 and the electrodes (106, 108) at least partially overlap.

In the present application, the solder paste may also be replaced by other materials having similar conductive and fixing functions, such as conductive glue.

In another embodiment of the present application, the LED chips 111 are extended at non-uniform intervals along the axial direction of the LED filament, that is, along the length direction of the LED filament, that is, there are at least two types of intervals between the LED chips 111.

In another embodiment of the present application, the LED chip 111 and the electrodes (106, 108) can also be electrically connected by metal wires by bonding. That is, in the direction perpendicular to the maximum surface of the LED chip 111 or the maximum surface of the electrodes (106, 108), the projections of the LED chip 111 and the electrodes (106, 108) do not overlap, or the overlapping area is zero.

In another embodiment of the present application, the copper foil circuit 1241 may not be provided on the base layer 124. When the LED chip 111 is fixed to the base layer 124, it is directly in contact with the BT substrate. When the LED chip 111 is fixed, a bonding adhesive is provided on the surface of the base layer 124 or the BT substrate. After the bonding adhesive is applied on the surface of the base layer 124, the LED chips 111 are arranged in a certain manner on the bonding adhesive. The LED chip 111 is placed on the adhesive and a proper pressure is applied to the LED chip 111, so that the LED chip 111 is sunken into the adhesive, that is, at least part of the area is covered with adhesive, that is, the LED chip 111 is at least partially accommodated or sunken in the adhesive in the direction perpendicular to the base layer 124, and the LED chip 111 and the base layer 124 are fixed after the adhesive is solidified. As described above, the LED chip is sunken or embedded in the adhesive, and the fixing strength is high, and the chip and the base layer 124 are not easy to fall off or delaminate. Of course, in some other embodiments, the excess adhesive can also be washed away by a specific solvent.

While the LED chip 111 is being arranged, or before or after the LED chip 111 is being arranged, electrodes are arranged at both ends of the LED filament.

After the LED chip 111 and the electrode are set, the LED chip 111 is electrically connected or signal transmitted by bonding metal wires. The LED chip 111 and the electrodes (106, 108) are also electrically connected by bonding, so that the LED filament is turned on and lit. The metal wire can be a single metal wire, such as a gold wire, a silver wire, an aluminum wire, a copper wire, etc.; or an alloy wire, that is, made of at least two metals in a certain proportion, such as a gold-silver alloy wire.

After the wire bonding is completed, glue is applied or painted on the side of the base layer 124 where the LED chip 111 is arranged to form a top layer 120. The top layer 120 completely encapsulates the LED chip 111 and the metal wire on the base layer 124, that is, the top layer 120 covers the LED chip 111 and the metal wire, and is combined with the base layer 124 to isolate the LED chip 111 and the metal wire from the external environment, and at least covers a portion of the electrode (106, 108).

In another embodiment of the present application, the base layer 124 also includes a copper foil circuit 1241, and the copper foil circuit 1241 forms electrodes (106, 108) at both ends of the filament. When the LED chip 111 is set, the LED chip 111 is fixed on the copper foil circuit 1241 by a solid crystal glue, but electrical conduction and signal transmission are achieved between the LED chips 111 and between the LED chip 111 and the electrodes (106, 108) by bonding metal wires.

In one embodiment of the present application, a top layer 120 is arranged above the LED chip 111 and the base layer 124, and the outer surface of the top layer 120 is covered with a layer 1101. In the cross section along the radial direction of the LED filament, the top layer 120 is arc-shaped or arc-shaped convex, and the layer 1101 is an arc-shaped that fits it (for example, Figure 33), so that the raw materials used are minimal, and there are no edges and corners on the surface, which avoids stress concentration and reduces costs. On the other hand, the arc of the top layer 120 and the layer 1101 preferably conforms to the arc of the beam angle diffusion angle of the LED chip 111, so that the light emitted from the LED chip 111 to the top layer 120 and the layer 1101, and finally emitted, passes through roughly the same path (the path of the light in the top layer 120 and the layer 1101), and its light conversion effect and light loss are also basically the same, and the light output at each position can be basically equivalent, ensuring the uniformity of the light output. On the other hand, the curved surface, especially the convex surface, has a light diffusion effect, the light beam is diffused rather than concentrated, making the light output range wider, and the optical diffusion is not concentrated, making the light output softer. Of course, the cross-section of the top layer 120 and the layered body 1101 can also be rectangular or conical or other shapes.

As shown in FIG. 32B , in one embodiment of the present application, the thickness of the base layer 124 is 0.04-0.12 mm, the thickness of the top layer 120 is 0.35-0.5 mm, and the thickness of the layered body 1101 is 0.1-0.2 mm. In the embodiment shown in FIG. 32B , the thickness of the base layer 124 is less than or equal to one quarter of the sum of the thickness of the base layer 124, the thickness of the top layer 120, and the thickness of the layered body 1101, ensuring LED filaments have good bending properties and are not easy to delaminate.

In some other embodiments, a variety of solid powder particles, such as heat dissipation particles, photoluminescent particles, etc., are disposed in the layered body 1101 .

Refer to 32D, which is a schematic cross-sectional diagram of the LED filament in an embodiment of the present application along the radial direction. Combined with Figure 32C, it can be seen that along the Z-axis direction, or in the direction in which the base layer 124 points to the LED chip 111, the bottom layer is the base layer 124, and the base layer 124 has a copper foil circuit 1241 embedded in it (or has an electrode 106 or 108 embedded in it), and at least a portion of the copper foil circuit 1241 is exposed outside the base layer 124. The LED chip 111 is fixed to the copper foil circuit 1241 by at least two solder pastes, and the top layer 120 completely covers the LED chip 111 and covers at least a portion of the base layer 124. The layered body 1101 is arranged on the side of the top layer 120 away from the base layer 124 and covers at least a portion of the top layer 120.

Referring to FIG. 32K , in some embodiments of the present application, the LED filament is arc-shaped or rectangular in the radial cross section. As shown in the figure, the layer 1101 covers both sides of the top layer 120 and is arc-shaped; in some embodiments, the layer 1101 only covers the side of the top layer 120 away from the LED chip, and does not cover the side of the top layer 120. Of course, it can also be said that the layer 1101 covers or encases at least a portion of the top layer 120 (the chip and wire are not shown in the figure).

In one embodiment of the present application, the LED filament can present different color area combinations arranged in a certain pattern when not lit, more specifically, different color area combinations are presented on the same LED filament, but when the LED filament is lit and emits light, the light output color is consistent or the light output is the same color. For example, the LED filament presents at least two color areas when not lit, such as a yellow area and a white area, but when it is lit, the light output is white light.

In another embodiment of the present application, the LED filament presents a combination of different color areas arranged in a certain pattern when not lit, and when the filament is lit, the light it emits is also in multiple colors.

In one embodiment of the present application, the LED filament has at least two color areas when it is not lit, and when the LED filament is lit, it emits at least two colors of light, and the light emitting color of each light emitting area is the same as the color presented by the corresponding light emitting area when it is not lit.

In another embodiment of the present application, the LED filament has at least two color areas when it is not lit, and emits at least two colors of light when the LED filament is lit, but there is at least one inconsistency between the light emitting colors of its respective light emitting areas and the colors of the corresponding light emitting areas when it is not lit.

Please refer to Figures 32B and 32E. Figure 32B is a schematic cross-sectional view along the length direction of the LED filament, that is, the axial direction of the LED filament and perpendicular to the maximum surface of the LED chip, in one embodiment of the present application. Figure 32E is a schematic cross-sectional view along the length direction of the LED filament and parallel to the maximum surface of the LED chip in one embodiment of the present application. As shown in Figure 32B, at least one row of LED chips 111 arranged along the length direction of the filament is provided on the base layer 124, that is, the LED filament has at least one row of LED chips 111 arranged along the length direction of the filament. In this embodiment of the present application, three rows of LED chips 111 arranged along the length direction of the filament are provided on the base layer 124. The types of the three rows of LED chips arranged along the length direction of the filament can be set to the same type of chips, or can be set to different types. The same type of chip is shown in, for example, FIG32E .

As described above, a base layer 124 is formed using a white BT substrate as a base material, and electrodes (106, 108) are formed at both ends of the base layer 124, and an LED chip 111 is arranged on this basis, and the top layer 120 is covered to form an LED filament. Electrical conduction is achieved between the LED chips 111 and between the LED chip 111 and the electrodes (106, 108) by bonding metal wires. Please refer to FIG. 32E , a single LED filament can be provided with multiple rows of LED chips extending along the length direction of the LED filament, wherein the types of LED chips are at least two or more. Referring to Fig. 32E, three rows of LED chip arrays are arranged side by side on a single filament, LED chip 111 forms the first row of LED array, LED chip 111' forms the second row of LED array, and LED chip 111" forms the third row of LED array. The circuit conduction between the three rows of LED arrays is independent of each other, the spacing between the LED chips is at least one, and the lines of the three rows of LED arrays do not cross. Among them, LED chip 111 is a blue light chip, LED chip 111' is a red light chip, and LED chip 111" is a green light chip. An adhesive layer is arranged above the LED chip, and the adhesive layer includes but is not limited to the materials described in the context of this article, such as silicone, resin, polyimide, etc., to form the top layer 120 as described above, and the top layer 120 is a transparent adhesive layer, so that when the LED filament is lit, the light output color is ≥3.

In another embodiment of the present application, the light color after the LED chip is lit can be ≥ 3, but the final light after the LED filament is lit is still one color.

In another embodiment of the present application, the final light output, i.e., mixed light, can be achieved as white light by adjusting the light output ratio, relative position relationship, light intensity ratio, or chip quantity ratio between the blue light chip, the red light chip, and the green light chip. For example, when controlling the light intensity, the blue light intensity: the red light intensity: the green light intensity = 1:3:6.

See Figures 32F and 32G, which are schematic cross-sectional views of the LED filament along the length (axial) direction and parallel to the maximum surface of the LED chip. In one embodiment, as shown in Figure 32F, the top layer 120 can be separately arranged relative to each row of LED chips, and the top layers 120 between each row of LED chip arrays are independent of each other and do not contact each other. In another embodiment, as shown in Figure 32G, the top layer 120 is arranged as a whole above the multiple rows of LED chip arrays, that is, the top layer 120 covers at least one row of LED chips.

Referring to FIG. 32E , in one embodiment of the present application, both ends of the LED filament, that is, each section of the LED filament is provided with a plurality of electrodes, or each end is provided with electrodes greater than or equal to the number of rows of the LED chip array, and the LED chip array is connected to its corresponding electrode, and the circuits between each row of LED chip arrays are independent, that is, along the length direction of the filament, the current direction of each row of LED chip arrays is in a single direction, and each row of LED chip arrays can be controlled individually or simultaneously, and the light output and color temperature of the LED filament can be controlled by controlling different LED chip arrays in the LED filament.

In another embodiment of the present application, an electrode (i.e., a positive electrode and a negative electrode) is respectively provided at both ends of the LED filament, and multiple rows of LED chip arrays share a positive electrode and a negative electrode. As shown in FIG32H, multiple rows of LED chip arrays are connected in parallel, that is, there are multiple current channels on one LED filament, and the multiple current channels are independent of each other. Failure of one current channel does not affect other current channels, and there is only one current direction along the length direction of the LED filament, and each row of LED chips is controlled simultaneously.

In another embodiment of the present application, an electrode (i.e., a positive electrode and a negative electrode) is respectively provided at both ends of the LED filament, and multiple rows of LED chip arrays share a positive electrode and a negative electrode. As shown in FIG32I, multiple rows of LED chip arrays are connected in series, and one LED filament has one circuit channel, but the current channel has multiple current directions or at least one current direction along the length (axial) direction of the LED filament.

In some other embodiments of the present application, at least one blue light chip, at least one red light chip, and at least one green light chip may be first connected in series or in parallel to form a multi-color light chip array, and then the multi-color light chip array may be connected in series or in parallel.

In some other embodiments of the present application, phosphor is mixed in the top layer 120 (or the light conversion layer 110), so that the top layer 120 has a light conversion function. Referring to FIG. 32F, as in one embodiment of the present application, phosphor particles are mixed in the top layer 120 arranged on the first row of LED chip arrays formed by the LED chips 111, and only corresponds to the first row of LED chip arrays, that is, corresponding to the blue light chips, wherein the added phosphor can make the light emitted by the blue light chips in the first row be converted, and the final emitted light is white light. For example, the added phosphor is yellow phosphor, and the glue layer on the first row of LED chip arrays, that is, the top layer 120 (or the light conversion layer 110) is yellow, and the LED filament point When it is lit, the area emits white light, and the color of the light emitted when it is lit is different from that of the area when it is not lit; the second row is composed of LED chip arrays consisting of LED chips 111', and the corresponding glue layer, that is, the top layer 120 (or the light conversion layer 110) is added with corresponding red light phosphors, so that the light emitted by the red light chip is converted by the top layer 120, and the final light emitted is white light; the third row is composed of LED chip arrays consisting of LED chips 111", and the corresponding glue layer, that is, the top layer 120 (or the light conversion layer 110) is added with corresponding green light phosphors, so that the light emitted by the green light chip is converted by the top layer 120, and the final light emitted is white light; finally, the LED filament is realized to emit white light as a whole.

That is, in one embodiment of the present application, LED chips 111 with multiple light-emitting colors (i.e., at least two types of LED chips 111) can be combined with different phosphors (i.e., at least two types of phosphors) to make the LED filament present different colors when not lit, and emit white light when the LED filament is lit.

In one embodiment of the present application, an LED chip 111 with a light emitting color can be used in combination with at least one phosphor to make the light emitted by the entire filament white. For example, a blue light LED chip can be used in combination with different phosphors to achieve white light when the LED filament is lit. For example, three rows of blue light LED chips can be used, respectively corresponding to red phosphor, green phosphor, and yellow phosphor, so that the filament can be mixed into white light when it is lit.

In another embodiment of the present application, an LED chip 111 with a light emitting color can be combined with at least one phosphor to make the light emitted by the entire filament white. For example, a blue light LED chip can be combined with different phosphors to achieve white light when the LED filament is lit. For example, three rows of blue light LED chips can respectively use red phosphor, green phosphor, and yellow phosphor, so that when the filament is lit, it can control the three rows of blue light LED chips separately or simultaneously, so that the LED filament emits blue light, red light, green light, blue light and red light, blue light and green light, red light and green light, blue-green-red tricolor light, or white light when it is lit.

Referring to FIG. 32J , in one embodiment of the present application, the base layer 124 includes a BT substrate 1242 as a base material, a copper foil circuit 1241 disposed on the surface of the BT substrate 1242 facing the LED chip, and a bottom layer 1243 located on the side of the BT substrate facing away from the LED chip. The copper foil circuit 1241 forms electrodes at both ends of the LED filament, and the LED chip 111 is arranged on the copper foil circuit 1241. The LED chip 111 is first connected to the copper foil circuit 1241 through a metal wire, and then the copper foil circuit 1241 is connected to the next LED chip 111 through a metal wire. That is, the LED chips 111 are electrically connected through the metal wire and the copper foil circuit 1241, and the copper foil circuit 1241 is used for switching to improve its reliability and prevent the performance impact caused by the excessive length of the wire; and the LED chip 111 is also connected to the electrodes (106, 108) through the metal wire.

32L , which is a schematic diagram of a radial cross-section of an LED filament in an embodiment, which includes a top layer 120 and a bottom layer 1243 , both of which are arc-shaped adhesive layers, and the thickness gradually decreases outward along the diameter direction.

In some embodiments of the present application, a BT substrate is used as the main substrate to form the base layer 124, wherein the BT substrate 1242 can be a white high thermal conductivity substrate with a filament having a thermal conductivity coefficient ≥ 0.8W/(m.K) and a thickness ≤ 0.12mm, and the wavelength of light emitted by the formed LED filament is in the range of 360nm to 830nm.

Referring to FIG. 32M , which is a schematic diagram of an axial cross-section of an LED filament in an embodiment of the present application, showing the relationship between the layered body 1101 and other structures in the filament, wherein the basic structure of the LED filament is the same as the description of the LED filament structure in the previous text, such as the description of the filament having the conductor segment 117 and the conductor 119 in the previous text, which will not be repeated here. As shown in FIG. 32M , the layered body 1101 can directly cover the upper surface of the top layer 120, or in other words, cover the upper surface 120a opposite to the top layer 120, which completely covers the upper surface opposite to the top layer 120 and also completely covers the conductor segment 117.

Continuing to refer to FIG. 32N and FIG. 32O, it is a schematic diagram of an axial cross section of an LED filament in an embodiment of the present application. The structure of the LED filament is basically similar to that described above and will not be described again. As shown in FIG. 32N, the top layer 120 at least covers a portion of the conductor 119, and the conductor segment 117 is not completely covered by the top layer 120, that is, the conductor 119 is at least partially exposed from the top layer 120 or the light conversion layer 110. The top layer 120 is divided into multiple segments, and the layered body 1101 covers each segment of the top layer 120 separately, and covers at least a portion of the exposed portion 123 of the conductor 119, and covers at least a portion of the electrodes (106, 108).

Referring to Figure 32O, the top layer 120 includes multiple sections spaced apart from each other, the layered body 1101 completely covers the top layer 120 and completely covers the exposed portion 123 of the conductor 119 facing the top layer, but the layered body 1101 does not completely fill the gap between the mutually separated top layers 120, and the LED filament has spaced grooves along the outward direction of the top layer 120, that is, along the outermost surface of the top layer 120, and the grooves correspond to the conductor 119.

See Figure 32P, in which the layered body 1101 can also completely fill the gaps formed by the top layer 120 being divided into multiple sections. The layered body 1101 completely fills the gaps between the top layers 120 separated from each other, and the LED filament has a flat surface or is relatively flat along the outward direction of the top layer 120, that is, along the outermost surface of the top layer 120.

In the embodiments of Figures 32N, 32O, and 32P above, the top layer 120 and the transparent layer 126 both have multiple segments, and the multiple segments are spaced apart from each other.

Referring to the following FIGS. 32Q, 32R, and 32S, which are schematic cross-sectional views of LED filaments in other embodiments of the present application along the axial direction, corresponding to FIGS. 32N, 32O, and 32P, the difference is that the top layer 120 of 32Q, 32R, and 32S includes multiple segments spaced apart from each other, but The transparent layer 126 is integrated, and the implementation of the layered body 1101 is the same as the description in the above-mentioned Figures 32N, 32O, and 32P, so it will not be repeated here. That is, the description of Figures 32N, 32O, and 32P can be used to distinguish the transparent layer 126.

Referring to FIG. 32T , it is a schematic cross-sectional view of an LED filament along the axial direction in another embodiment of the present application. The other structures of this embodiment are the same as those of the embodiment of FIG. 32M , except that the transparent layer 126 of FIG. 32T includes multiple segments spaced apart from each other, while the transparent layer 126 of FIG. 32M is integrated.

In some embodiments, please refer to FIG. 33, which is a schematic diagram of the cross-sectional structure of an LED filament in some embodiments of the present application (I). As shown in FIG. 33, when there is a base layer 124, the base layer 124 is first formed by coating, scraping, spraying, self-leveling, etc., and then the surface of the base layer 124 is solidified, that is, the LED chip 111 is fixed. After the LED chip 111 is wired and connected, a top layer 120 with an arc surface is formed by spraying, dispensing or other methods. The top layer 120 completely covers the chip 111 and its wires. In the next step, a layered body 1101 is arranged on the surface of the top layer 120 along its arc and contacts the base layer 124. After curing, it is cut to form a single filament. FIG. 33 is a schematic cross-sectional diagram of the operation, and the figure is a schematic cross-sectional diagram of the whole-plate production of the drawing, in which the arc is a convex structure.

In one embodiment, please refer to Figure 34, which is a schematic diagram of the cross-sectional structure of an LED filament in some embodiments of the present application (II). As shown in Figure 34, the cross-section of the top layer 120 can be arc-shaped, and the cross-sectional shape of the layered body 1101 is rectangular.

In one embodiment, the cross-section of the top layer 120 may be rectangular, and the cross-section of the layered body 1101 may be arc-shaped.

In one embodiment, the cross-section of the top layer 120 may be rectangular, and the cross-section of the layered body 1101 may be rectangular.

It is preferred that the top layer 120 is arc-shaped and the layered body 1101 is arc-shaped to fit (e.g., FIG. 33 ), so that the raw materials used are minimal, and the surface has no edges and corners, which avoids stress concentration while reducing costs. On the other hand, the arcs of the top layer 120 and the layered body 1101 preferably fit the arc of the beam angle of the LED chip 111, so that the light emitted from the LED chip 111 to the top layer 120 and the layered body 1101, and finally emitted, passes through roughly the same path (the path of the light in the top layer 120 and the layered body 1101), and its light conversion effect and light loss are also basically the same, and the light output at each position can be basically equivalent, ensuring the uniformity of the light output. On the other hand, the arc surface, especially the convex surface, has a light diffusion effect, and the light beam is diffused rather than concentrated, so that the light output range is wider, and the optical diffusion is not concentrated, making the light output softer.

Please refer to Figures 35a, 35b, 35c and 35d. Figures 35a to 35d are schematic diagrams (iii) to (vi) of the cross-sectional structure of an LED filament according to some embodiments of the present application. In some embodiments, the light conversion layer 110 does not have a distinction between a top layer 120 and a base layer 124, and the LED chip 111 is completely encapsulated in the light conversion layer 110, which is formed by molding or injection molding. As shown in Figure 35a, the cross section of the light conversion layer 110 is circular or nearly circular, and the cross section of the laminar body 1101 is a circular ring (close to a circular ring) that encapsulates the light conversion layer 110. As shown in Figure 35b, the cross section of the light conversion layer 110 is circular or nearly circular, and the cross section of the laminar body 1101 is a rectangle (ring) or nearly a rectangle (ring) that encapsulates the light conversion layer 110. As shown in Figure 35c, the cross section of the light conversion layer 110 is rectangular (ring) or nearly rectangular (ring), and the cross section of the laminar body 1101 is rectangular (ring) or nearly rectangular (ring) that encapsulates the light conversion layer 110. As shown in FIG. 35d , the cross section of the light conversion layer 110 is rectangular (ring) or nearly rectangular (ring), and the cross section of the layered body 1101 is circular or nearly circular covering the light conversion layer 110. The conversion layer 110 and the layered body 1101 can also be other shapes. When the cross section of the light conversion layer 110 is circular or close to circular, it is preferred that the cross section of the layered body 1101 is annular (close to a ring) so that the light output has a diffusion and softening effect, while saving materials and reducing costs. The thickness of the layered body is uniform in the radial direction, and the length of the light path or the particles encountered (probability or number) are roughly the same. The light processing, light loss, and light divergence effects are basically the same, and the light output is uniform and soft. The rectangular structure may have a light effect that is significantly different from other positions at a certain angle (for example, at a right angle to the cross section).

In some embodiments, the light conversion layer 110 and the layered body 1101 can be combined into one, that is, aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphors, sulfates, silicates, nitrides, nitrogen oxides, oxysulfates or garnets, but not limited to one or more combinations thereof, can be added to the light conversion layer 110.

In some embodiments, please refer to FIG. 5, which is a schematic diagram of the structure of an LED filament (III) according to some embodiments of the present application. When the LED chips 111 in the width direction of the LED filament 100 have only one row (as shown in FIG. 5, the LED chips 111 are arranged in the same direction), the LED filament 100 has a bendable section and an inflexible section in the length direction, and the total length of the bendable section is less than the total length of the inflexible section, so that the entire LED filament can have better support.

In some embodiments, in the length direction of the LED filament 100 , the total length of the bendable segment accounts for at least 30% of the total length of the LED filament 100 , so as to ensure the bendability of the LED filament 100 .

In some embodiments, in the length direction of the LED filament 100 , the total length of the bendable segment accounts for at least 30% and no more than 50% of the total length of the LED filament 100 , so that the LED filament 100 has both bendability and supportability.

In some embodiments, please refer to FIG. 15, which is a top view (I) of an LED filament in an unbent state according to some embodiments of the present application after the top layer is removed. When the LED chips 111 in the width direction of the LED filament 100 have two rows, and the two rows of LED chips 111 are connected in parallel (as shown in FIG. 15), similarly, the LED filament 100 has a bendable section and an unbendable section in the length direction (the Y-axis direction in FIG. 15), and the total length of the bendable section is less than the total length of the unbendable section, so that the entire LED filament 100 can have better support and bendability. .

In some embodiments, the total length of the bendable segment accounts for at least 0.001% and no more than 20% of the total length of the LED filament 100. In some embodiments, the portion of the LED filament 100 where the LED chips 111 are arranged in the length direction (i.e., the area between the leftmost LED chip 111 and the rightmost LED chip 111 in FIG. 1L ) may not have a bendable segment, but since adjacent LED chips 111 are staggered, it still has a certain degree of bendability.

In some embodiments, please refer to FIG. 16, which is a top view (II) of the LED filament in an unbent state according to some embodiments of the present application, after the top layer is removed. As shown in FIG. 16, when the LED chips 111 in the width direction of the LED filament 100 have two rows, and the two rows of LED chips 111 are connected in series in sequence (as shown in FIG. 16), the LED filament 100 has a bendable section and an unbendable section in the length direction, and the total length of the bendable section is less than the total length of the unbendable section, so that the entire LED filament has better support. In some embodiments, in the length direction of the LED filament 100, the total length of the bendable section accounts for at least 0.001% of the total length of the LED filament 100, and does not exceed 30%, so that the LED filament 100 has both bendability and support.

In the embodiments taking Figures 5, 15 and 16 as examples, the non-bendable section is the total length of the portion of the LED filament 100 including the LED chip 111 or the electrodes (106, 108) in the length direction, and the bendable section is the portion that only includes the light conversion layer 110 and/or the wire (the wire here refers to the wire connecting adjacent LED chips or the wire connecting the LED chip 111 and the electrodes (106, 108)), that is, the portion of the LED filament 100 in the length direction where the LED chip 111 or the electrodes (106, 108) are not provided constitutes the bendable section, but Figures 5, 15 and 16 are not limitations.

In some embodiments, no matter the LED filament 100 is provided with one row of LED chips 111 or two rows of LED chips 111, more than 0.5 LED chips 111 are provided per unit length (per millimeter length) so that a reasonable spacing can be provided between the LED chips 111 to meet the requirements of light uniformity and prevent serious thermal impact between the LED chips 111.

In some embodiments, as shown in FIG4 , the LED filament 100 has a light conversion layer 110, a plurality of LED segments (113, 115), and two electrodes (106, 108). The LED segments (113, 115) have at least one LED chip 111, and two adjacent LED chips 111 in the LED filament 100 are electrically connected to the two electrodes (106, 108), for example, by a circuit film, or by a first wire 128 as described later, for example, in FIG5 . The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The carrier layer 122 includes a base layer 124 and a transparent layer 126. The base layer 124 is located between the top layer 120 and the transparent layer 126 (at least on a certain cross section of the LED filament 100). The lower surface 124b of a part of the base layer 124 is in contact with the transparent layer 126. The transparent layer 126 supports a part of the base layer 124, thereby enhancing the strength of the base layer 124 and facilitating die bonding. The part of the base layer 124 not covered by the transparent layer 126 can allow the heat generated by a part of the LED chip 111 to be directly dissipated through the base layer 124. In some embodiments, the transparent layer 126 includes a first transparent layer 1261 and a second transparent layer 1262. The first transparent layer 1261 and the second transparent layer 1262 both extend along the length direction of the LED filament 100. In some embodiments, the light conversion layer 110 has a first end 1105 and a second end 1106 opposite to the first end 1105. In some embodiments, the LED chip 111 is located between the first end 1105 and the second end 1106. If the LED chip 111 closest to the first end 1105 is recorded as LED chip n1, then the LED chips 111 from the first end 1105 to the second end 1106 are LED chips n2, n3, ...nm, m is an integer and m≤800.

In some embodiments, as shown in FIG. 5 , the LED filament 100 comprises a light conversion layer 110, at least one LED segment (113, 115), electrodes (106, 108), and a conductor segment 117 for electrically connecting two adjacent LED segments (113, 115). The LED segments (113, 115) comprise at least two LED chips 111, and the LED chips 111 are electrically connected to each other through a first wire 128. In this embodiment, the conductor segment 117 comprises a conductor 119 for connecting the LED segments (113, 115), wherein the shortest distance between two LED chips 111 in two adjacent LED segments (113, 115) is greater than the distance between two adjacent LED chips 111 in the LED segments (113, 115), and the length of the first wire 128 is less than the length of the conductor 119. In this way, it is ensured that when the two LED segments (113, 115) are bent, the stress generated will not cause the conductor segment 117 to break.

In some embodiments, the light conversion layer 110 is coated on at least two sides of the LED chip 111 or the electrodes ( 106 , 108 ).

In some embodiments, the light conversion layer 110 exposes a portion of the electrodes ( 106 , 108 ).

Please refer to FIG. 6 , which is a schematic diagram (IV) of the structure of an LED filament according to some embodiments of the present application. As shown, in some embodiments, the conductor segment 117 is also located between two adjacent LED segments (113, 115), and the multiple LED chips 111 in the LED segments (113, 115) are electrically connected to each other through the first wire 128. However, the conductor 119 in the conductor segment 117 of FIG. 6 is not in the form of a wire, but in the form of a sheet or film. In some embodiments, the conductor 119 can be copper foil, gold foil or other electrically conductive materials. In this embodiment, the conductor 119 is attached to the surface of the base layer 124 and adjacent to the top layer 120, that is, between the base layer 124 and the top layer 120. In addition, the conductor segment 117 is electrically connected to the LED segments (113, 115) through the second wire 130, that is, the two LED chips 111 located in the two adjacent LED segments (113, 115) and the shortest distance from the conductor segment 117 are electrically connected to the conductor 119 in the conductor segment 117 through the second wire 130. The length of the conductor segment 117 is greater than the distance between two adjacent LED chips 111 in the LED segment (113, 115), and the length of the first wire 128 is less than the length of the conductor 119. With this design, since the conductor segment 117 has a relatively long length, it can be ensured that the conductor segment 117 has good bendability. Assuming that the maximum thickness of the LED chip 111 in the radial direction of the LED filament 100 (such as the Z-axis direction in FIG. 6) is H, the thickness of the electrode (106, 108) and the conductor 119 in the radial direction of the LED filament is 0.5H to 1.4H, preferably 0.5H to 0.7H. There is a height difference between the LED chip 111 and the electrode (106, 108), and between the LED chip 111 and the conductor 119, so that the wire bonding process can be implemented, while ensuring the quality of the wire bonding process (i.e., having good strength), and improving the stability of the product.

Please refer to FIG. 7 , which is a schematic diagram (V) of the structure of an LED filament according to some embodiments of the present application. As shown in FIG. 7 , the LED filament 100 comprises a light conversion layer 110, LED segments (113, 115), electrodes (106, 108), and a conductor segment 117 for electrically connecting two adjacent LED segments (113, 115). The LED segments (113, 115) comprise LED chips 111, and the conductor segment 117 is electrically connected to the LED segments (113, 115) through a second wire 130, that is, the two LED chips 111 located in the two adjacent LED segments (113, 115) and having the shortest distance to the conductor segment 117 are electrically connected to the conductor 119 in the conductor segment 117 through the second wire 130. The LED chips 111 are electrically connected to each other through the first wire 128. The conductor segment 117 includes a conductor 119 connecting the LED segments (113, 115). The conductor 119 is, for example, a conductive metal sheet or metal strip, such as a copper sheet or an iron sheet. The shortest distance between two LED chips 111 located in two adjacent LED segments (113, 115) is greater than the distance between two adjacent LED chips 111 in the LED segments (113, 115). The length of the first wire 128 is less than the length of the conductor 119. In this way, it is ensured that when the two LED segments are bent, the conductor segment 117 has a larger force-bearing area, and the generated stress does not cause the conductor segment 117 to break. The light conversion layer 110 covers at least two sides of the LED chip 111 or the electrodes (106, 108). The light conversion layer 110 exposes a portion of the electrodes (106, 108). The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The carrier layer 122 includes a base layer 124 and a transparent layer 126. The base layer 124 is located between the top layer 120 and the transparent layer 126. The base layer 124 and the top layer 120 cover at least two sides of the LED chip 111. The thermal conductivity of the transparent layer 126 is greater than the thermal conductivity of the base layer 124. In some embodiments, the base layer 124 is in contact with at least one side of the LED chip 111 and one side of the conductor segment 117. In this embodiment, the LED chip 111 and the conductor 119 are located on different sides of the base layer 124.

Please refer to Figures 8 to 10. Figure 8 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (VI). Figure 9 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (VII). Figure 10 is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (VIII). As shown in Figures 8 to 10, in some embodiments, the conductor 119 includes a covering portion 121 and an exposed portion 123. The exposed portion 123 includes a first exposed portion 1231 and a second exposed portion 1232. The top layer 120 The portion where the conductor 119 is exposed is the first exposed portion 1231, and the portion where the transparent layer 126 exposes the conductor 119 is the second exposed portion 1232. In some embodiments, as shown in FIG9 , the exposed portion 123 includes only the first exposed portion 1231. In some embodiments, as shown in FIG10 , the exposed portion 123 includes only the second exposed portion 1232, which can relieve stress concentration on the conductor 119.

Please refer to FIG. 11, which is a top view of an LED filament after removing the top layer according to some embodiments of the present application. In some embodiments, the LED filament 100 comprises a light conversion layer 110, LED segments (113, 115), electrodes (106, 108), and a conductor segment 117 for electrically connecting two adjacent LED segments (113, 115). The LED segments (113, 115) comprise at least one LED chip 111, and the conductor segment 117 is electrically connected to the LED segments (113, 115) through a second wire 130, that is, the two LED chips 111 respectively located in the two adjacent LED segments (113, 115) and having the shortest distance to the conductor segment 117 are electrically connected to the conductor 119 in the conductor segment 117 through the second wire 130. The conductor segment 117 comprises a conductor 119 connecting the LED segments (113, 115), and the conductor 119 is, for example, a conductive metal sheet or metal strip, such as a copper sheet or an iron sheet. The shortest distance between two LED chips 111 located in two adjacent LED segments (113, 115) is greater than the distance between two adjacent LED chips 111 in the LED segments (113, 115), and the LED chips 111 are electrically connected through a first wire 128, and the length of the first wire 128 is less than the length of the conductor 119. When the two LED segments (113, 115) are bent, the conductor segment 117 has a larger stress area, and the generated stress does not cause the conductor segment 117 to break. The light conversion layer 110 covers at least two sides of the LED chip 111 or the electrode (106, 108). The light conversion layer 110 exposes a portion of the electrode (106, 108). The light conversion layer 110 includes a top layer 120 (not shown in this figure) and a carrier layer 122. The carrier layer 122 includes a base layer 124 and a transparent layer 126. The LED chips 111 in the LED segments (113, 115) are arranged along the radial direction of the LED filament 100 (such as the X-axis direction in FIG. 11). Each LED chip 111 in the LED segments (113, 115) is respectively connected to the conductor 119 and/or the electrode (106, 108).

Please refer to FIG. 12 to FIG. 13 . FIG. 12 is a schematic diagram of the structure of an LED filament in some embodiments of the present application (IX). FIG. 13 is a schematic diagram of the structure of an LED filament in some embodiments of the present application (X). In some embodiments, the LED filament 100 has a light conversion layer 110, an LED segment (113, 115), and electrodes (106, 108). The LED segment (113, 115) has at least one LED chip 111. Adjacent LED chips 111 in the LED filament 100 and the LED chip 111 and the electrodes (106, 108) are electrically connected to each other. Adjacent LED chips 111 are connected by first wires 128. The light conversion layer 110 covers each surface of the first wires 128, that is, the first wires 128 are located in the light conversion layer 110, so as to prevent the LED filament 100 from being exposed and accidentally touched by instruments or workers when winding, thereby preventing the first wires 128 from being broken. The light conversion layer 110 wraps the LED segments (113, 115) and the electrodes (106, 108), and at least exposes a portion of the two electrodes (106, 108). The light conversion layer 110 includes a top layer 120 and a carrier layer 122. The top layer 120 covers each surface of the first wire 128. There is a certain distance between the first wire 128 and the carrier layer 122. The top layer 120 and the carrier layer 122 can each be a layered structure of at least one layer.

In some embodiments, the phosphor layer 1201 wraps a portion of the first conductive line 128 , the phosphor film layer 1202 wraps another portion of the first conductive line 128 , and the phosphor layer 1201 and the phosphor film layer 1202 together cover the first conductive line 128 .

Please refer to 14, which is a schematic diagram of the structure of the LED chip bonding wire according to some embodiments of the present application. As shown in FIG14, in some embodiments, the quality of the bonding wire is mainly determined by the five points A, B, C, D, and E in FIG14, wherein point A is the connection between the chip bonding pad 1281 and the gold ball 1282, point B is the connection between the gold ball 1282 and the first wire 128, and point C is the connection between the gold ball 1282 and the first wire 128. Point D is the connection point between the first wire 128 and the second soldering point 1283, and point E is between the second soldering point 1283 and the surface of the LED chip 111. Point B is the first bending point of the first wire 128 when it is arranged in an arc, and the wire diameter of the first wire 128 at point D is thinner, so the first wire 128 is easy to break at points B and D. Therefore, for example, when the structure as shown in Figure 14 is implemented, when the LED filament 100 is bent, it is mainly the part of the first wire 128 located in the phosphor film layer 1202 that is subjected to force, while the part of the first wire 128 located in the phosphor layer 1201 is subjected to less force. Therefore, the thickness of the phosphor layer 1201 can be less than the thickness of the phosphor film layer 1202, and the phosphor layer 1201 can cover the points B and D of the first wire 128. Due to the material properties (hardness, flexibility or bendability) of the phosphor layer 1201, the first wire 128 can be prevented from breaking at points B and D.

As shown in FIG. 12 , in some embodiments, each LED chip 111 is covered with a phosphor layer 1201, and a portion of the LED filament 100 has a phosphor film layer 1202 in direct contact with the carrier layer 122. In some embodiments, this portion is located between two adjacent LED chips 111, and the phosphor layer 1201 only covers the LED chip 111, which can achieve the above-mentioned luminous effect and reduce the production cost of the LED bulb.

As shown in FIG. 13 , the phosphor layer 1201 extends along the length direction of the LED filament 100. When coating the phosphor layer 1201, a single LED filament 100 can be coated or multiple LED filaments 100 can be coated at the same time. The coating process is simple and the production efficiency is high. There is a part of the area of the LED filament where the phosphor layer 1201 is in direct contact with the carrier layer. In some embodiments, this part of the area is located between two adjacent LED chips 111. Since the area of the phosphor layer 1201 is increased (the heat dissipation area is also increased), and the phosphor layer 1201 is relatively thin, the heat generated by the LED chip 111 is easily transferred from the phosphor layer 1201 to the phosphor film layer 1202.

Next, the chip bonding design of the LED filament is described. As shown in FIG. 15 , in some embodiments, the LED filament 100 includes an LED chip unit (102, 104) and electrodes (106, 108). The LED chip unit 102 and the LED chip unit 104 are electrically connected to the electrodes (106, 108), respectively. The extension direction of the LED chip unit 102 is parallel or substantially parallel to the extension direction of the LED chip unit 104 (such as the Y-axis direction in FIG. 15 ), and the LED chip unit 102 and the LED chip unit 104 are connected in parallel. The LED chip unit 102 and the LED chip unit 104 each include a plurality of LED chips 111, and the spacing between two adjacent LED chips 111 in the LED chip unit 102 is equal to the spacing between two adjacent LED chips 111 in the LED chip unit 104. In some embodiments, the spacing between two adjacent LED chips 111 in the LED chip unit 102 may not be equal to the spacing between two adjacent LED chips 111 in the LED chip unit 104. The light conversion layer 110 has a first end 1105 and a second end 1106 opposite to the first end 1105. The LED chip 111 is located between the first end 1105 and the second end 1106. The LED chip closest to the first end in the LED chip unit 102 is recorded as LED chip a1. The LED chips 111 from the first end 1105 to the second end 1106 are LED chips a2, a3, ... am, where m is an integer. The LED chip 111 closest to the first end 1105 in the LED chip unit 104 is recorded as LED chip b1. The LED chips 111 from the first end 1105 to the second end 1106 are LED chips a2, a3, ... am, where m is an integer. The LED chips 111 of 106 are LED chips b2, b3, ... bn in sequence, where n is an integer. In the length direction of the LED filament 100 (such as the Y-axis direction in FIG. 15 ), the LED chip bn is located between the LED chip am and the LED chip am+1 (for example, the LED chip b1 in FIG. 15 is located between the LED chip a1 and the LED chip a2), and the projection of the LED chip am in the width direction of the LED filament and the projection of the LED chip bn in the width direction of the LED filament 100 (such as the X-axis direction in FIG. 15 ) do not have an overlapping area (n=m). That is, the LED chips 111 of the LED chip unit 102 and the LED chips 111 in the LED chip unit 104 are located in the length direction of the LED filament 100 (such as the Y-axis direction in FIG. 15 ). The filaments 100 are arranged in a staggered manner in the length direction.

In another embodiment, the projections of the LED chip 111 in the LED chip unit 102 and the LED chip 111 in the LED chip unit 104 in the length direction of the LED filament have overlapping areas. The projections of the LED chip am and the LED chip bn in the length direction of the LED filament have overlapping areas. Since the spacing between the LED chip am and the LED chip bn in the width direction of the LED filament is reduced, the width of the LED filament becomes narrower, and the width of the LED filament is close to that of a traditional tungsten filament lamp, and the LED filament is more beautiful when wound. Specifically, the LED chip am and the LED chip bn have multiple side surfaces respectively. In the length direction of the LED filament, a side surface of the LED chip bn is located between the same side surface of the LED chip am and the LED chip am+1 (for example, a side surface b11 of the LED chip b1 in FIG. 15 is located between a side surface a11 of the LED chip a1 and a side surface a21 of the LED chip a2). In some embodiments, the side surface a11 is opposite to the side surface a21. In some embodiments, in the width direction of the LED filament 100 (eg, the X-axis direction in FIG. 15 ), the widths of the LED chip am and the LED chip bn are Wa and Wb, respectively, and the width W of the LED filament 100 is not less than the sum of Wa and Wb, that is, W≥Wa+Wb.

In some embodiments, as shown in FIG. 4 , the LED chip 111 has a first light emitting surface 111c and a second light emitting surface 111d, the first light emitting surface 111c and the second light emitting surface 111d are opposite to each other, the light emitted from the first light emitting surface 111c (which may refer to one side of the LED chip 111 facing the top layer 120) is directed toward the top layer 120, and the light emitted from the second light emitting surface 111d (which may refer to the other side of the LED chip 111 facing the carrier layer) is directed toward the carrier layer 122, the luminous flux of the light emitted from the first light emitting surface 111c of the LED chip 111 is substantially equal to the luminous flux emitted from the LED chip 111 (the absolute value of the difference in luminous flux between the first light emitting surface 111c and the second light emitting surface 111d is ≤30lm), the brightness difference between the first light emitting surface 111c and the second light emitting surface 111d of the LED chip 111 is small, the LED filament 100 adopts the above-mentioned LED chip 111, and the LED filament 100 emits light evenly in all directions after winding, and the LED bulb has an excellent light emission effect.

As shown in FIG16 , the LED filament 100 includes electrodes (106, 108), an LED chip 111, and a first wire 128. There are a plurality of LED chips 111, and the plurality of LED chips 111 are arranged on the LED filament 100 in two rows (i.e., adjacent LED chips 111 are staggered in the width direction of the LED filament 100 (the X-axis direction in FIG16 )), and the two rows of LED chips 111 are arranged along the length direction of the LED filament 100.

As shown in FIG. 16 , in this embodiment, the LED chip 111 has a length dimension wc along the length direction of the LED filament 100, and the ratio of the sum of the lengths wc of all LED chips 111 (i.e., Σwc) to the length of the LED filament 100 is greater than 0.5, 0.6, 0.65, or 0.7, so as to ensure the arrangement density of the LED chips 111 in the length direction of the LED filament 100, thereby improving the total luminous flux and effectively reducing the granularity of the light. The ratio of the sum of the lengths of the LED chips 111 to the length of the LED filament 100 is greater than 0.5, 0.6, 0.65, or 0.7.

Please refer to FIG. 17 , which is a schematic diagram of the structure of an LED filament in an unbent state in some embodiments according to the present application (I). As shown in FIG. 17 , in some embodiments, the basic structure of the LED filament 100 may be the same as in the aforementioned embodiments. In this embodiment, the light conversion layer 110 at the junction of the light conversion layer 110 and the electrode 106 forms a junction 132 , and the junction 132 wraps at least a portion of the electrode 106 , and the junction 132 does not cover (or include) the LED chip 111 . Please refer to FIG. 19 and FIG. 20 , FIG. 19 is a schematic diagram of the structure of a part of an LED filament in some embodiments according to the present application (I). FIG. 20 is a cross-sectional view of FIG. 19 . In some embodiments, the electrode 106 has a second portion 1062 wrapped or covered by the light conversion layer 110 and a first portion 1061 exposed outside the light conversion layer 110, and the area per unit length of the second portion 1062 is smaller than the area per unit length of the first portion 1061, so that the second portion 1062 has better bending performance.

The second portion 1062 has an end 1063, a bending section 1064 and a connecting section 1065, which are sequentially arranged in the length direction of the second portion 1062, and the connecting section 1065 is connected to the first portion 1061. The area per unit length of the bending section 1064 is smaller than the area per unit length of the end 1063 and the connecting section 1065, respectively, so that when the second portion 1062 is subjected to force, the main bending portion thereof is located at the bending section 1064.

The area per unit length of the connecting section 1065 is respectively larger than the area per unit length of the connecting section 1065 and the end 1063, so that the end of the light conversion layer 110 and the electrode 106 have a larger bonding area to improve the bonding strength and prevent cracking at the bonding point between the end of the light conversion layer 110 and the electrode 106 when the LED filament 100 is bent.

As shown in FIG. 19 , one or more grooves 1066 are provided on one or both sides of the bending section 1064 in the width direction to reduce the area per unit length of the bending section 1064 and improve the overall bendability. In addition, through the provision of the grooves 1066, the material of the light conversion layer 110 can pass through the grooves 1066, so that the light conversion layers 110 on opposite sides of the electrode 106 are connected through the light conversion layer 110 material in the grooves 1066, forming a connection method similar to riveting.

Please refer to FIG. 21 , which is a schematic diagram of a partial structure of an LED filament in some embodiments of the present application (II). As shown in FIG. 21 , one or more groups of holes 1067 are provided at the bending section 1064 to reduce the area per unit length of the bending section 1064. Specifically, the material of the light conversion layer 110 can pass through the holes 1067, so that the light conversion layer 110 at the front and back sides of the electrode 106 is connected through the light conversion layer 110 material in the holes 1067.

As shown in FIG. 19 and FIG. 20 , a through hole 1068 may be provided at the end 1063 of the electrode 106 so that the light conversion layer 110 at the front and back sides of the electrode 106 is connected through the light conversion layer 110 material in the through hole 1068 to form a connection similar to riveting.

As shown in Figures 19 and 21, the end of the terminal 1063 of the electrode 106 is configured with a curved surface 1069 to prevent stress concentration caused by the sharp corner formed at the terminal 1063, forcing the light conversion layer 110 to crack or even break. In some embodiments, the end of the terminal 1063 is configured as a spherical surface to achieve the same technical effect as above.

In some embodiments, the second portion 1062 and the first portion 1061 are made of different materials, so that the second portion 1062 has better bending performance than the first portion 1061 .

Please refer to FIG. 22 , which is a schematic diagram of a partial structure of an LED filament in some embodiments according to the present application (III). As shown in FIG. 22 , in some embodiments, the thickness (average thickness) of the second portion 1062 is less than the thickness (average thickness) of the first portion 1061 , so that the second portion 1062 has better bending performance than the first portion 1061 .

Please refer to FIG. 23, which is a schematic diagram of the structure of an LED filament in some embodiments of the present application (XI). As shown in FIG. 23, in some embodiments, an LED filament 100 is provided, and its basic structure can be the same as in the above-mentioned embodiments, that is, the LED filament 100 includes a light conversion layer 110, an LED chip 111 and an electrode 106, and the LED chip 111 is connected through a first wire 128 The LED chip 111 and the electrode 106 are connected via a second wire 130, and the light conversion layer 110 wraps the LED chip 111 and at least a portion of the electrode 106. Meanwhile, the basic structure or material composition of the light conversion layer 110 in this embodiment can also be the same as the above-mentioned embodiment.

In this embodiment, the first conductive wire 128 has a first portion 1284, and the first portion 1284 is located between the two groups of LED chips 111 in the length direction of the LED filament 100 (the X-axis direction in FIG. 23 ) (the first portion 1284 is located between the edge tangents of the two groups of LED chips 111 in the width or thickness projection direction of the LED filament 100 (the Z-axis direction in FIG. 23 ). In other words, the length of the first portion 1284 is configured to be greater than the projection length of the first portion 1284 in the width direction of the LED filament, thereby providing the first conductive wire 128 with more margin when the LED filament 100 is bent, thereby avoiding breakage.

In some embodiments, the ratio of the length of the first portion 1284 to the distance D1 between the two groups of LED chips 111 (or the projected length of the first portion 2284 in the width direction of the LED filament (X-axis direction in Figure 23)) is greater than 1.1, 1.2, 1.3 or 1.4.

In some embodiments, the ratio of the length of the first portion 1284 to the distance D1 between the two groups of LED chips 111 (or the projected length of the first portion 1284 in the width direction of the LED filament 100 (X-axis direction in FIG. 23 )) is less than 2.

In some embodiments, the first portion 1284 is configured to be arc-shaped so that its length is greater than the distance D1 between the two groups of LED chips 111 (the projected length of the first portion 1284 in the width direction of the LED filament).

Please refer to FIG. 24 , which is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XII). As shown in FIG. 24 , in some embodiments, the first portion 1284 is configured to be wavy or spiral, so that its length is greater than the distance between the two groups of LED chips 111 (the projection length of the first portion 1284 in the width direction of the LED filament (such as the X-axis direction in FIG. 24 )).

Please refer to FIG. 26 , which is a schematic diagram of the structure of an LED filament in some embodiments according to the present application (XIII). As shown in FIG. 26 , in some embodiments, the first portion 1284 (or the entire first wire 128 ) is roughly "m"-shaped when viewed from the side of the LED filament. This makes the first portion 1284 of the first wire 128 longer per unit length, and provides a greater buffer when the LED filament is bent, so as to prevent the first portion 1284 from being broken.

Please refer to FIG. 39, FIG. 36 is a schematic diagram (I) of an LED bulb lamp according to some embodiments of the present application. FIG. 37 is a side view of the LED bulb lamp in FIG. 36. FIG. 38 is another side view of the LED bulb lamp in FIG. 36. FIG. 39 is a top view of the LED bulb lamp in FIG. 36. The structure of the LED filament mentioned in FIG. 36 to FIG. 39 can refer to the structure of the LED filament 100 in FIG. 1 to FIG. 35. In this embodiment, as shown in FIG. 36 to FIG. 44, the LED bulb lamp 200 includes a lamp housing 202, a lamp head 204 connected to the lamp housing 202, at least two conductive brackets disposed in the lamp housing 202, a cantilever (not shown), a stem 206 and a single LED filament 100. The stem 206 includes a stem bottom and a stem top opposite to each other, the stem bottom is connected to the lamp head 204, and the stem top extends to the inside of the lamp housing 202, for example, the stem top 206 can be located at a position approximately at the center of the inside of the lamp housing 202. The conductive support is connected to the core column 206. The LED filament 100 includes a filament body and the aforementioned electrodes (106, 108), wherein the electrodes (106, 108) are located at opposite ends of the filament body, and the filament body is the other part of the LED filament 100 excluding the electrodes (106, 108). The electrodes (106, 108) are connected to two conductive brackets respectively. One end of the cantilever is connected to the core column 206 and the other end is connected to the filament body.

In the manufacturing process of traditional bulb lamps, in order to prevent the tungsten filament from burning in the air and oxidizing and breaking and failing, a glass structure with a trumpet stem is designed to be sleeved on the opening of the glass lamp shell and sintered and sealed, and then a vacuum pump is connected through the port of the trumpet stem to replace the air inside the lamp shell with nitrogen to prevent the tungsten filament inside the lamp shell from burning and oxidizing, and finally the port of the trumpet stem is sintered and sealed. Therefore, the vacuum pump can replace the air inside the lamp shell with full nitrogen or a combination of nitrogen and helium in a proper ratio through the stem to improve the thermal conductivity of the gas in the lamp shell, and also remove the water mist hidden in the air. In one embodiment, it can also be replaced with a combination of nitrogen and oxygen or nitrogen and air in a proper ratio, and the oxygen or air content is 1-10% of the volume of the lamp shell, preferably 1-5%. When the base layer contains saturated hydrocarbons, during the use of the LED bulb lamp, the saturated hydrocarbons will be affected by light, heat, stress, etc. to generate free radicals, and the generated free radicals or activated molecules combine with oxygen to form peroxide free radicals. Filling the lamp shell with oxygen can improve the heat resistance and light resistance of the base layer containing saturated hydrocarbons.

During the preparation of the LED bulb 200, in order to increase the refractive index of the lamp housing 202 to the light emitted by the LED filament 100, some foreign matter, such as rosin, may be attached to the inner wall of the lamp housing 202. The average thickness of the foreign matter deposited per square centimeter of the inner wall area of the lamp housing 202 is 0.01 to 2 mm, and the thickness of the foreign matter is preferably 0.01 to 0.5 mm. In one embodiment, the foreign matter content per square centimeter of the inner wall area of the lamp housing 202 accounts for 1% to 30% of the foreign matter content on the entire inner wall of the lamp housing 202, preferably 1% to 10%. The above foreign matter content can be adjusted, for example, by vacuum drying the lamp housing 202. In another embodiment, a portion of impurities may be left in the inflation gas of the lamp housing 202. The impurity content in the inflation gas is 0.1% to 20% of the volume of the lamp housing 202, preferably 0.1 to 5%. The impurity content may be adjusted by, for example, vacuum drying the lamp housing 202. Since the inflation gas contains a small amount of impurities, the light emitted by the LED filament 100 is emitted or refracted by the impurities, and the light-emitting angle is increased, which is beneficial to improving the light-emitting effect of the LED filament 100.

The LED bulb 200 is located in a spatial coordinate system (X, Y, Z), wherein the Z axis is parallel to the stem 206, and the projection lengths of the LED filament 100 on the XY plane, the YZ plane, and the XZ plane are the first length, the second length, and the third length, respectively. In one embodiment, the ratio of the first length, the second length, and the third length is 0.8:1:0.9. In some embodiments, the ratio of the first length, the second length, and the third length is (0.5 to 0.9):1:(0.6 to 1), and the ratio of the first length, the second length, and the third length is close to 1:1:1, and the LED bulb 200 has a better luminous effect and realizes full-circle light.

When the LED filament 100 is bent, it has at least one first bending point and at least two second bending points. The first bending point and the second bending point are spaced apart, and the height of any first bending point on the Z axis is greater than that of any second bending point. In some embodiments, the spacing between two adjacent first bending points on the Y axis or the X axis is equal, so that the appearance of the LED filament 100 is neat and beautiful. As shown in Figures 36 to 39, in this embodiment, the LED filament 100 has one conductor segment 117, and there are two LED segments (113, 115), and every two adjacent LED segments (113, 115) are connected through the conductor segment 117. The bending state of the LED filament 100 at the highest point presents an arc bend, that is, the LED segments (113, 115) respectively present an arc bend at the highest point of the LED filament 100, and the conductor segment 117 also presents an arc bend at the low point of the LED filament 100. The LED filament 100 can be defined as a conductor segment 117 at each bend. The conductor segment 117 is followed by a segment, and each LED segment (113, 115) forms a corresponding segment.

Furthermore, since the LED filament 100 uses a flexible base layer, the flexible base layer preferably uses an organosilicon-modified polyimide resin composition, and the organosilicon-modified polyimide resin composition includes an organosilicon-modified polyimide, a thermal curing agent, heat dissipation particles, and a phosphor. In this embodiment, the two LED segments 113 are bent to form an inverted U shape, and the conductor segment 117 is located between the two LED segments (113, 115), and the bending degree of the conductor segment 117 is the same as or greater than the bending degree of the LED segments (113, 115). That is, the two LED segments (113, 115) are bent to form an inverted U shape at the high point of the LED filament 100 and have a bending radius r1 value, and the conductor segment 117 is bent at the low point of the LED filament 100 and has a bending radius r2 value, wherein r1 is greater than r2 value. Through the configuration of the conductor segment 117, the LED filament 100 can be bent with a small turning radius in a limited space. In some embodiments, the bending points of the LED segments 113 and 115 are at the same height in the Z-axis direction in FIG. 36 . Since the LED filament 100 has a certain symmetry, the LED bulb 200 emits light more evenly. In one embodiment, the bending points of the LED segments 113 and 115 are at different heights in the Z-axis direction in FIG. 36 . For example, the height of the bending point of the LED segment 113 is greater than the height of the bending point of the LED segment 115. When the LED filament 100 has the same length, when the LED filament 100 is placed in the lamp housing in this way, part of the LED filament 100 will be more inclined to the lamp housing 202, so the heat dissipation effect of the LED filament 100 is better. In addition, in the Z-axis direction, the vertical rod 2061 of this embodiment has a lower height than the vertical rod 2061 of the previous embodiment. The height of this vertical rod 2061 corresponds to the height of the conductor segment 117, or the vertical rod 2061 is approximately in contact with part of the conductor segment 117. For example, the lowest part of the conductor segment 117 can be connected to the top of the vertical pole 2061, so that the overall shape of the LED filament 100 is not easily deformed. In different embodiments, the conductor segments 117 can pass through the through holes on the top of the vertical pole 2061 to connect with each other, or the conductor segments 117 can be glued to the top of the vertical pole 2061 to connect with each other, but it is not limited thereto. In one embodiment, the conductor segment 117 and the vertical pole 2061 can be connected by a wire, for example, a wire is led out from the top of the vertical pole 2061 to connect the conductor segment 117.

As shown in FIG. 37 , in the present embodiment, in the Z-axis direction in FIG. 37 , the height of the conductor segment 117 is higher than the two electrodes (106, 108), and the two LED segments (113, 115) extend upward from the two electrodes (106, 108) to the highest point, and then bend downward to extend to the conductor segment 117 connecting the two LED segments (113, 115). As shown in FIG. 38 , in the present embodiment, the profile of the LED filament 100 in the XZ plane is similar to a V-shape, that is, the two LED segments 113 extend obliquely upward and outward, and then bend at the highest point, and then extend obliquely downward and inward to the conductor segment 117. As shown in FIG. 39 , in the present embodiment, the profile of the LED filament 100 in the XY plane has an S-shape. As shown in FIG. 37 and FIG. 39 , in the present embodiment, the conductor segment 117 is located between the electrodes (106, 108). As shown in FIG. 39 , in the present embodiment, on the XY plane, the bending point of the LED segment 113, the bending point of the LED segment 115 and the electrodes (106, 108) are approximately located on a circle with the conductor segment 117 (or the stem 206 or the vertical rod 2061) as the center. For example, on the XY plane, the bending point of the LED segment 113, the bending point of the LED segment 115 are located on the same circle with the stem 206 or the vertical rod 2061 as the center. In some embodiments, on the XY plane, the bending point of the LED segment 113, the bending point of the LED segment 115 and the electrodes (106, 108) are located on the same circle with the stem 206 or the vertical rod 2061 as the center.

Please refer to 45, FIG40 is a schematic diagram (II) of an LED bulb lamp according to some embodiments of the present application. The LED bulb 300 has the same basic structure as the LED bulb 200 of Fig. 36. The LED bulb 300 includes a lamp housing 202, a lamp holder 204 connected to the lamp housing 202, at least two conductive brackets disposed in the lamp housing 202, a cantilever (not shown), a stem 206, and a single LED filament 100, except that the LED bulb 300 of this embodiment does not have a stand 2061. Among them, the core column 206 includes a gas filling tube, and the gas in the above-mentioned lamp housing 202 is filled through the gas filling tube. As shown in 45, in the Z-axis direction, the shortest distance from the LED filament 100 (or the bending point of the LED segment 113 or the LED segment 115) to the lamp housing 202 is H1, and the shortest distance from the conductor segment 117 of the LED filament 100 to the core column 206 is H2, H2 is less than or equal to H1, and the bending point of the LED segment (113, 115) is closer to the lamp housing 202, so the heat dissipation path of the LED filament 100 is short, thereby improving the heat dissipation effect of the LED bulb 300. In other embodiments, H2 is greater than H1 (not shown in this figure), so that the LED filament 300 is roughly located in the middle area of the lamp housing, and the luminous effect is better.

Please refer to FIG. 41 and FIG. 42. FIG. 41 is a schematic diagram of a lamp holder in some embodiments of the present application (I). FIG. 42 is a schematic diagram of the lamp holder in FIG. 41 at the A-A section. In this embodiment, the LED bulb lamp can be any LED bulb lamp disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb lamp. In this embodiment, the LED bulb lamp 200 is used as an example. A power supply component 400 (or a driving power supply) is arranged in the lamp holder 204. The power supply component 400 is electrically connected to the LED filament 100. The power supply component 400 is electrically connected to the electrodes (106, 108) of the LED filament 100. The power supply assembly 400 includes a substrate 402, on which a heating element (element that generates more heat when working, such as an integrated circuit, a resistor, etc.) and a heat-resistant element (such as an electrolytic capacitor, etc.) are provided. The lamp holder 204 has an inner surface and an outer surface opposite to the inner surface. The outer surface of the lamp holder 204 is away from the power supply assembly 400, and the heating element is closer to the inner surface of the lamp holder 204 than the heat-resistant element. The heating element has an insulating sheet 404, and the insulating sheet 404 is in contact with the inner surface of the lamp holder 204. For example, the insulating sheet 404 can be made to contact with the inner surface of the lamp holder 204 by welding or fasteners. In some embodiments, the heating element is packaged as a component as a whole, and the component has a heat sink, and the heat sink is in contact with the inner surface of the lamp holder 204. For example, after the integrated circuit and the rectifier bridge are packaged into a component, the heat sink is made to contact with the inner surface of the lamp holder 204 by welding or fasteners. The heat sink can be welded to the inner surface of the lamp holder 204 as a negative electrode line.

In some embodiments, as shown in FIG. 42 , the substrate 402 is in direct contact with the inner surface of the lamp holder 204 . Compared with the indirect contact between the substrate 402 and the lamp holder 204 through glue, the direct contact can improve the heat dissipation effect of the bulb lamp while reducing the heat transfer medium.

In some embodiments, as shown in FIG. 42 , the heating element is covered with thermal conductive adhesive. For example, the substrate 402 has a first surface 4021 and a second surface 4022. The second surface 4022 is away from the LED filament 100. The heating element and the heat-sensitive element are respectively located on the first surface 4021 and the second surface 4022. The first surface 4021 is covered with thermal conductive adhesive. The heat generated by the heating element can be transferred to the lamp holder 204 through the thermal conductive adhesive, thereby improving the heat dissipation effect of the LED bulb (not shown in this figure).

In some embodiments, please refer to FIG. 43 and FIG. 44. FIG. 43 is a schematic diagram of a lamp holder in some embodiments according to the present application (III). FIG. 44 is a schematic diagram of the lamp holder in FIG. 43 at the BB section (I). As shown in FIG. 43 and FIG. 44, in this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is disposed in the LED bulb. The power supply component can also be any LED filament disclosed in the previous embodiments. A heat conducting portion 406 is provided on the inner surface of the lamp holder 204. The heat conducting portion 406 can be a net bag for accommodating the heating element or a metal part in contact with the heating element. The thermal conductivity of the heat conducting portion 406 is greater than or equal to the thermal conductivity of the lamp holder 204. The heat generated by the heating element can be quickly transferred to the lamp holder 204 through the heat conducting portion 406, thereby improving the heat dissipation effect of the LED bulb (not shown in this figure).

In some embodiments, each surface of the power supply assembly 400 is covered with thermally conductive adhesive, and a portion of the thermally conductive adhesive contacts the inner surface of the lamp holder 204. For example, a flexible substrate can be used, and the flexible substrate is integrally mounted in the lamp holder 204, and the thermally conductive adhesive is poured into the lamp holder 204. The power supply assembly is entirely covered with thermally conductive adhesive, and the heat dissipation area is increased, thereby greatly improving the heat dissipation effect.

In another embodiment, please refer to FIG. 45, which is a schematic diagram (II) of the lamp holder in FIG. 43 at the B-B section. As shown in FIG. 45, in this embodiment, the LED bulb lamp can be any LED bulb lamp disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb lamp. The power supply assembly can also be any power supply assembly disclosed in the previous embodiments. The substrate 402 is parallel to the axial direction of the lamp holder 204 (please refer to the axial direction of the stem 206 in FIG. 36, FIG. 40, and FIG. 46A). Since all the heating elements can be placed on the side of the substrate close to the lamp holder, the heat generated by the heating elements can be quickly transferred to the lamp holder 204, thereby improving the heat dissipation efficiency of the power supply assembly 400. In addition, the heat-sensitive element and the heat-resistant element can be respectively arranged on different surfaces of the substrate 402 to reduce the influence of the heat generated by the heating element when working on the heat-sensitive element, thereby improving the overall reliability and life of the power supply module. In one embodiment, a heating element (an element that generates more heat when working, such as an IC, a resistor, etc.) and a heat-insensitive element (such as an electrolytic capacitor, etc.) are provided on the substrate 402. The heating element is closer to the inner surface of the lamp holder 204 than other electronic components (such as heat-insensitive elements or other non-heat-sensitive elements, such as capacitors). Therefore, compared with other electronic components, the heating element has a shorter heat transfer distance with the lamp holder 204, which is more conducive to the heat generated by the heating element when working to be conducted to the lamp holder 204 for heat dissipation, thereby improving the heat dissipation efficiency of the power supply component 400.

As shown in FIGS. 40 to 45 , the projections of the gas tube (not shown) and the substrate 402 on the XY plane overlap. In some embodiments, the projections of the gas tube and the substrate 402 on the XZ and/or YZ planes are spaced apart (or not overlapped), or in the height direction of the lamp holder 204 (Z-axis direction in FIG. 40 ), there is a certain distance between the gas tube and the substrate 402, and the gas tube and the substrate 402 do not contact each other, thereby increasing the accommodation space of the power supply assembly 400 and improving the utilization rate of the substrate 402. In addition, when the substrate 402 contacts the inner surface of the lamp holder 204, a cavity is formed between the first surface 4021 of the substrate 402 and the stem 206, and the heat generated by the heating element on the first surface of the substrate 402 can be transferred through the cavity, reducing the thermal impact on the heat-sensitive element on the second surface, thereby improving the service life of the power supply assembly 400.

Please refer to FIG. 46A to FIG. 49. FIG. 46A is a schematic diagram (III) of an LED bulb according to some embodiments of the present application. FIG. 47 is a side view of the LED bulb in FIG. 46A. FIG. 48 is another side view of the LED bulb in FIG. 46A. FIG. 49 is a top view of the LED bulb in FIG. 46A. Among them, the LED filament 100 shown in FIG. 46A to FIG. 49 refers to the structure of the LED filament 100 in FIG. 1 to FIG. 35. The LED bulb 500 of this embodiment has the same basic structure as the LED bulb 200 in FIG. 36. The LED bulb 500 includes a lamp housing 202, a lamp head 204 connected to the lamp housing 202, at least two conductive brackets disposed in the lamp housing 202, at least one cantilever 205, a stem 206 and an LED filament 100. It should be noted that the cantilever 205 is not shown in FIG. 47 and FIG. 48. The core column 206 includes a vertical rod 2061, and each cantilever 205 includes a first end and a second end opposite to each other. The first end of each cantilever 205 is connected to the vertical rod 2061, and the second end of each cantilever 205 is connected to the LED filament 100. The LED bulb 500 shown in FIG48 is different from the LED bulb 200 shown in FIG36 in that: in the Z-axis direction in FIG48, the height of the vertical rod 2061 is greater than the distance between the bottom of the vertical rod 2061 and the conductor segment 117, and the vertical rod 2061 includes a bottom of the vertical rod 2061 and a top of the vertical rod 2061 opposite to each other, and the bottom of the vertical rod 2061 is close to the inflation tube (not shown in this figure). As shown in FIG49, on the XY plane in FIG49, the central angle range of the arc corresponding to at least two bending points of the LED filament 100 is 170° to 220°, so that the bending points of the LED segments (113, 115) have a suitable spacing between them to ensure the heat dissipation effect of the LED filament 100. At least one cantilever 205 is located at the bending point of the LED filament 100, for example, at the bending point of the LED segment 113 or the LED segment 115. Each cantilever 205 has an intersection with the LED filament 100. On the XY plane, at least two intersections are located on a circle with the core column 206 (or the vertical rod 2061) as the center, so that the LED filament 100 has a certain symmetry, the luminous flux in each direction is roughly the same, and the LED bulb 200 emits light uniformly. In some embodiments, at least one intersection and the bending point of the conductor segment 117 are connected to form a straight line La, and the intersection located on the straight line La and the electrode (106, 108) of the LED filament 100 form a straight line Lb, and the angle α between the straight line La and the straight line Lb is in the range of 0°＜α＜90°, preferably 0°＜α＜60°, so that the LED segments (113, 115) have a suitable spacing after bending, and have better light emission and heat dissipation effects. The bending point of the LED segment (113, 115) has a curvature radius, for example, the bending point of the LED segment 113 has a curvature radius r3, and the bending point of the LED segment 115 has a curvature radius r4, r3 is equal to r4, and the light is emitted evenly on each plane. Of course, r3 can also be set to be greater than r4 or r3 can be set to be less than r4 to meet the lighting requirements and/or heat dissipation requirements in certain specific directions. The bending point of the conductor segment 117 has a curvature radius r5, r5 is less than the maximum value of r3 and r4, that is, r5＜max(r3, r4), the LED filament 100 is not easy to break, and there is a certain distance between the parts of the LED segments (113, 115) close to the core column to prevent the heat generated by the two LED segments (113, 115) from affecting each other.

Please refer to 51D, which is a three-dimensional diagram of an embodiment of the present application. As shown in FIG. 46D, the LED bulb 500 includes a lamp housing 202, a lamp head 204 connected to the lamp housing 202, a support portion (including a cantilever 205 and a stem 206), at least two conductive brackets 2065 and 2066 disposed in the lamp housing 202, a driving circuit 700, and a single light-emitting portion (i.e., LED filament) 100. The driving circuit 700 is electrically connected to the conductive brackets 2065 and 2066 and the lamp head 204. The stem 206 also has a vertical rod 2061 extending vertically to the center of the lamp housing 202. The vertical rod 2061 is located on the central axis of the lamp head 204, or the vertical rod 2061 is located on the central axis of the LED bulb 500. A plurality of cantilevers 205 are located between the vertical rod 2061 and the LED filament 100. These cantilevers 205 are used to support the LED filament 100 and enable the LED filament 100 to maintain a preset curve and shape. Each cantilever 205 includes a first end and a second end opposite to each other. The first end of each cantilever 205 is connected to the vertical rod 2061 , and the second end of each cantilever 205 is connected to the LED filament 100 .

Generally speaking, in the LED bulb 500, the number of cantilevers 205 depends on the overall shape of the LED filament 100, that is, in order to maintain the shape of the flexible LED filament 100, the basic principle is that a cantilever 205 needs to be configured at the turning point of the LED filament 100. However, considering the high lumen value LED filament lamp products, the overall length of the flexible LED filament 100 is relatively long, and the LED filament 100 may be damaged due to shaking during the transportation of the LED bulb 500. Therefore, by increasing the number of cantilevers 205, the shaking degree of the filament 100 in the LED bulb 500 is reduced, thereby reducing the probability of damage to the LED filament 100. More specifically, the number of cantilevers 205 and the turning point of the shape of the LED filament 100 are designed according to the following relationship, that is, To achieve the aforementioned advantages: the number of cantilevers 205 in the LED bulb 500 is X, and the number of turning points of the shape formed by the LED filament 100 in the LED bulb 500 is Y, that is,

Y+5≥X≥Y+2

When the number of cantilevers 205 is too small (i.e., less than Y+2), the reinforcement effect cannot be achieved; when the number of cantilevers 205 is too large (i.e., greater than Y+5), the light output will inevitably be blocked, affecting the light output effect of the LED filament 100 when working, and increasing the product manufacturing cost. Therefore, the number of cantilevers 205 is designed as above to take into account both product quality and lighting effect.

In some embodiments, please refer to FIG. 40 to FIG. 44. In this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb. The power supply assembly can also be any power supply assembly disclosed in the previous embodiments. In this embodiment, the LED filament 100 includes a top layer 120 and a bearing layer 122. When the LED filament 100 is bent, on any height direction cross section of the LED filament 100, or on the cross section of the central axis (or optical axis) of the LED chip 111, the bearing layer 122 is closer to the lamp housing 202 than the top layer 120, that is, the shortest distance from the bearing layer 122 to the lamp housing is shorter than the shortest distance from the top layer 120 to the lamp housing 202. In some embodiments, the LED filament 100 has a bending point (or bending zone) when bent, and at the bending point (or bending zone), the curvature radius of the bearing layer 122 is greater than the curvature radius of the top layer. In some embodiments, when the LED filament 100 is bent, in any height direction cross section of the LED filament 100, or in the cross section of the central axis (or optical axis) of the LED chip 111, the top layer 120 is closer to the central axis (or stem 206) of the LED bulb than the supporting layer 122, and the distance from the top layer 120 to the central axis (or stem 206) of the LED bulb is smaller than the distance from the supporting layer to the central axis (or stem 206) of the LED bulb. In some embodiments, when the LED filament 100 is bent, it has a bending point (or bending area), and at a bending point (or bending area), the light-emitting surface of the LED chip 111 faces the central axis (or stem 206) of the LED bulb. With the above design, when any LED filament 100 in the LED bulb is bent, the wire in the LED filament 100 is subjected to less bending stress and is not prone to breakage. The LED segment 113 or the LED segment 115 includes a first segment and a second segment, wherein the first segment is formed by extending upward (toward the top of the lamp housing 202) from the electrode (106, 108) to the bending point, and the second segment is formed by extending downward (toward the lamp head 204) from the bending point to the conductor segment 117 connecting the two LED segments (113, 115). The first segment and the second segment have a relative first distance and a second distance to the lamp housing 202, respectively, the first distance is smaller than the second distance, and in the direction of the first distance, the base layer 124 of the LED filament is close to the lamp housing 202, and the top layer 120 of the LED filament is far away from the lamp housing 202. For example, in FIG47 , the first segment of the LED segment 113 has a relative first distance D1 and a second distance D2 to the lamp housing 202, the first distance D1 is smaller than the second distance D2, and in the direction of the first distance D1, the base layer 124 of the LED filament is close to the lamp housing 202, and the top layer 120 of the LED filament 100 is far away from the lamp housing 202. When the LED filament 100 is bent, the wire in the LED filament 100 is subjected to less bending stress and is not easily broken, thereby improving the production quality of the LED bulb.

Please refer to Figures 46A to 49 again, the lamp housing 202 is divided into an upper part and a lower part by a plane F, and the lamp housing 202 has a maximum width at plane F, wherein the plane figure formed by the spacing (maximum horizontal spacing) in Figure 47 is located on plane F, and when the stem 206 and plane F have an intersection, the lamp housing 202 has a lamp housing top 2021 and a lamp housing bottom 2022 relative to each other, and the lamp housing bottom 2022 is close to the lamp head 204, and the length of the LED filament 100 between the lamp housing top 2021 and the plane F (or in the height direction of the LED bulb 200 (in the Z-axis direction in Figure 47), the distance from the highest point of the LED filament 100 to the plane F) is less than the length of the LED filament between the plane F and the lamp housing bottom 2022 (or in the height direction of the LED bulb 200) When the stem 206 intersects with the plane F, the inner diameter of the lamp housing 202 above the top of the stem 206 is smaller, and the volume of gas contained is small. If most of the LED filament 100 is located at the top of the stem 206, the overall heat dissipation effect of the LED filament 100 will be affected, thereby reducing product quality. If the stem 206 is spaced a certain distance from the plane F and the distance from the top of the stem 206 to the plane F is less than the height of the vertical pole 2061 (the stem 206 includes a stem top 2062 and a stem bottom 2063 relative to each other, the stem bottom 2063 is connected to the lamp holder 204, and the stem top 2062 extends toward the top 2021 of the lamp housing), the length of the LED filament 100 between the stem top 2062 and the top 2021 of the lamp housing (or the distance between the highest point of the LED filament 100 and the stem top 2062) is less than the length of the LED filament 100 between the stem top 2062 and the bottom 2022 of the lamp housing (or the distance between the stem top 2062 and the lowest point of the LED filament 100), most of the LED filaments 100 can be indirectly supported by the stem 206, thereby ensuring the stability of the shape of the LED filament 100 during transportation of the LED bulb 200. In some embodiments, when there is a spacing between the stem 206 and the plane F and the distance from the top 2062 of the stem to the plane F is greater than the height of the vertical pole 2061, the stem 206 includes a relative stem top 2062 and a stem bottom 2063, wherein the stem bottom 2063 is connected to the lamp holder 204, and the stem top 2062 extends toward the top 2021 of the lamp housing. The length of the LED filament 100 located between the stem top 2062 and the top 2021 of the lamp housing is greater than the length of the LED filament 100 located between the stem top 2062 and the bottom 2022 of the lamp housing. Since the volume of gas contained between the top 2062 of the stem and the bottom 2022 of the lamp housing is large, and most of the LED filaments 100 are located between the stem top 2062 and the bottom 2022 of the lamp housing, heat dissipation of the LED filament 100 is facilitated.

Please refer to FIG. 46B and FIG. 46C, which are schematic diagrams of the structure of an LED bulb lamp (without the housing) with a buffer (piece) structure in some embodiments of the present application. The difference between the LED bulb lamp and other embodiments of the present application is mainly in the buffer (piece) structure, and the other structures can be basically the same. The LED bulb lamp 500 (without the housing) includes a lamp body 204, a stem 206 connected to a lamp holder 206, a cantilever 205, at least one LED filament 100 and at least one buffer 2064. The stem 206 includes a vertical rod 2061, each cantilever 205 includes a first end and a second end opposite to each other, the first end of each cantilever 205 is connected to the vertical rod 2061, and the second end of each cantilever 205 is connected to the LED filament 100; it also includes a stem top 2062 and a stem bottom 2063, wherein the stem bottom 2063 is connected to the lamp body 204 and is approximately located at the center of the horizontal cross section (XY cross section) of the lamp holder 204, and the stem top 2062 is connected to the vertical rod 2061; the lamp holder 204, the stem 206 and the vertical rod 2061 may be coaxial (or approximately coaxial). In some embodiments of the present application, the buffer 2064 may include a first buffer 2064' and a second buffer 2064", and the buffer 2064 has a certain amount of deformation. In the event of vibration, it can absorb the kinetic energy generated by other devices connected thereto during the vibration (displacement) process by means of its own deformation, so as to avoid the components in the LED bulb from being severely squeezed or collided during the vibration process, thereby causing breakage or other damage.

In some embodiments of the present application, one end of the LED filament 100 is connected to the first buffer 2064', and the other end of the LED filament is connected to the second buffer 2064", and the first buffer 2064' and the second buffer 2064" are respectively arranged at the two ends of the LED filament 100, that is, a fixed connection in physical structure is formed (that is, it meets a certain mechanical strength and is not easy to fall off), and an electrical connection that is mutually conductive is also formed. One end of the buffer 2064 is connected to the LED filament 100, and the other end is connected to the stem 206, so that the buffer 2064 and the stem 206 form a fixed connection in physical structure, and also a mutually conductive electrical connection. In some embodiments of the present application, the buffer 2064 includes a first buffer 2064' and a second buffer 2064", wherein the first buffer One end of the punch 2064' is connected to the top 2062 of the stem, and the other end is connected to the LED filament 100. The other end of the LED filament 100 is connected to one end of the second buffer 2064", and the other end of the second buffer 2064" is connected to the vertical pole 2061, and cooperates with the cantilever 205 to fix the LED filament 100, wherein the second buffer 2064" is arranged along the horizontal direction (XY plane), and the first buffer 2064' is arranged along the vertical (Z axis) direction; in other words, the arrangement direction of the second buffer 2064" is perpendicular to the length direction of the stem 206, and the arrangement direction of the first buffer 2064' is parallel to the length direction of the stem 206. This arrangement is coordinated with the bending shape of the LED filament 100 to ensure that the first buffer 2064' and the second buffer 2064" have a good deformation amount in the XYZ space. Of course, the angles of the first buffer 2064' and the second buffer 2064" can also be designed according to needs, such as an inclined arrangement.

In some embodiments of the present invention, the lamp holder 204, the stem 206, and the vertical rod 2061 are fixed to each other and electrically connected. Furthermore, the buffer 2064 is a conductive material and has an electrical conduction function. After the LED filament 100 and the stem 206 or the vertical rod 2061 are connected, the two are electrically connected. For example, in some embodiments of the present application, the stem 206 has a conductive structure, such as a conductive pin that can be used to connect the buffer 2064 (or the first buffer 2064'), and a conductive wire is arranged inside the vertical rod 2061. One end of the conductive wire is connected to the stem 206 or the lamp body 204, and the other end is connected to the second buffer 2064", so that at least two of the LED filament 100, the buffer 2064, the stem 206, the vertical rod 2061, and the lamp holder 204 can form a conductive electrical circuit.

In some embodiments of the present application, the number of first buffer members 2064' is 2, the number of second buffer members 2064" is 1, and the first buffer member 2064' and the second buffer member 2064" are respectively connected to at least one LED filament. As shown in FIG. 46B , in one embodiment of the present application, the first buffer member 2064' is respectively connected to one LED filament 100, and the second buffer member 2064" is connected to two LED filaments 100, that is, the LED bulb includes at least one LED filament, or may be 2, 3 or other numbers.

In some other embodiments of the present application, the number of the first buffer member 2064' may be 1.

In some other embodiments of the present application, the number of first buffer members 2064' may be 2 or more.

In some other embodiments of the present application, the number of the second buffer member 2064" may be one.

In some other embodiments of the present application, the number of the second buffer members 2064" may be 2 or more.

In some other embodiments of the present application, the buffer member 2064 only includes the first buffer member 2064'.

In some other embodiments of the present application, the buffer member 2064 only includes the second buffer member 2064".

In some embodiments of the present application, the buffer member 2064 may be a spring structure with good deformation ability, and it has good deformation ability in both the axial and radial directions of the spring, such as stretching or compressing ability.

In some embodiments of the present application, the buffer member 2064 may be a plastic material with good ductility and recovery ability, such as silicone, resin, etc., and a conductive material may be added to the plastic material to achieve electrical conduction.

In some other embodiments of the present application, the buffer member 2064 may be a suspension wire structure extending from the core column 206, such as a wave Shaped hanging wire, bent and extended hanging wire.

In some other embodiments of the present application, the buffer member 2064 may be a combination of a suspension wire and an adhesive, and the adhesive wraps at least a portion of the suspension wire.

In some other embodiments of the present application, the buffer member 2064 may be a combination of suspension wires and adhesive material, and the adhesive material wraps all the suspension wires.

In some other embodiments of the present application, the buffer member 2064 may be a combination of a suspension wire and a glue material, and the glue material covers at least a portion of the suspension wire.

In some other embodiments of the present application, the buffer member 2064 may be a suspension wire extending from the LED filament 100 , for example, a suspension wire extending directly or indirectly from an electrode of the LED filament 100 .

In some other embodiments of the present application, the buffer 2064 can be a combination of a spring and a rubber material, such as the rubber material wraps at least or part of the spring, or the buffer 2064 includes a spring segment and a rubber material segment, and the two are connected to each other.

In some other embodiments of the present application, the buffer 2064 may also be disposed at other positions, such as one end of the buffer 2064 is directly connected to the lamp holder 204 , and the other end is connected to the LED filament 100 .

Please refer to Figures 50 to 58. Figure 50 is a schematic diagram (four) of an LED bulb according to some embodiments of the present application. Figure 51 is a side view of the LED bulb in Figure 50. Figure 52 is another side view of the LED bulb in Figure 50. Figure 53 is a top view of the LED bulb in Figure 50. In this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb. The power supply component can also be any power supply component disclosed in the previous embodiments. In this embodiment, the LED bulb includes a lamp housing 202 and a lamp head 204 connected to the lamp housing 202. A plurality of LED filaments C1, C2, C3, ..., Cn are arranged in the lamp housing 202, where n is an integer. Each LED filament (C1, C2, C3) includes the aforementioned electrodes (106, 108) (not shown in this figure). Taking the LED filament C1 as an example, after the LED filament C1 is bent, the vertical distance between the electrodes does not exceed the height of the stem 206. In some embodiments, when the LED filament C1 is not bent, it includes a first end C11 and a second end C12 opposite to each other, and the first end C11 and the second end C12 are used to connect with the power supply component to power the LED chip on the LED filament C1, and the length of the LED filament C1 is the distance from the first end C11 to the second end C12 (the same is true for other LED filaments C2 and C3). When the LED filaments (C1, C2, C3) are bent, the first end and the second end of each LED filament (C1, C2, C3) are separated from each other, so that each LED filament (C1, C2, C3) is spatially distributed, for example, the first end C11 and the second end C12 of the LED filament C1 in the figure are separated from each other. In some embodiments, in the direction of the central axis of the LED bulb, the vertical distance between the first end of any LED filament (C1, C2, C3) and the first end of other LED filaments (C1, C2, C3) does not exceed 2 cm, or/and the vertical distance between the second end of any LED filament (C1, C2, C3) and the second end of other LED filaments (C1, C2, C3) does not exceed 2 cm, so that the electrodes of multiple LED filaments (C1, C2, C3) pass through (or approximately pass through) the first plane, and the electrodes of multiple LED filaments (C1, C2, C3) pass through (or approximately pass through) the second plane. When each LED filament (C1, C2, C3) is electrically connected, the first ends of multiple LED filaments (C1, C2, C3) are connected to each other or the second ends are connected to each other, or the first end of one LED filament (C1, C2, C3) is connected to the second end of another LED filament, and the electrical connection method is simple. Among them, The first plane is close to the top 2021 of the lamp housing, and the first plane is close to the bottom 2022 of the lamp housing. The first plane and the second plane are separated from each other. The first plane and the second plane are parallel to each other, or may be at a certain angle to each other.

Each LED filament (C1, C2, C3) is distributed in a spiral shape, and each LED filament (C1, C2, C3) is respectively extended in a spiral rotation around an axis (e.g., the central axis of the LED bulb), and the angle at which the second end of the LED filament (C1, C2, C3) rotates around the central axis of the LED bulb relative to the first end exceeds 270 degrees (when the LED filament (C1, C2, C3) is projected onto a plane along the central axis of the LED bulb, the central angle of the LED filament (C1, C2, C3) on the plane is greater than 270 degrees). Preferably, the axes around which at least two LED filaments (e.g., LED filament C1 and LED filament C2) rotate coincide, that is, they rotate around the same axis, or the axes around which at least two LED filaments (e.g., LED filament C1 and LED filament C2) rotate are parallel to each other, or at a certain angle. The LED filament (C1, C2, C3) extends around the axis in a smooth curve between the first end and the second end, or in a broken line between the first end and the second end. For example, the LED filament C1 extends in a smooth curve between the first end C11 and the second end C12 around the axis, or extends in a broken line between the first end C11 and the second end C12. In some embodiments, the axis around which the LED filaments (C1, C2, C3) extend is parallel to the stem 206, or the LED filaments (C1, C2, C3) extend in a rotation around the stem 206.

There is at least one point on the LED filament C1 whose distance to the stem 206 is equal to or approximately equal to the distance from a point on the LED filament Cn (n≠1) to the stem 206. In some embodiments, in the height direction of the LED bulb, the LED filament C1, the LED filament C2, the LED filament C3, ..., and the LED filament Cn are adjacent in sequence, and the distance from the LED filament C1 to the LED filament C2 is equal to or approximately equal to the distance from the LED filament Cn to the LED filament Cn+1 (n≥2). In the xy plane, the electrodes or/and electrodes of the LED filament C1, the LED filament C2, the LED filament C3, ..., and the LED filament Cn are located on a circle with the stem 206 (or the vertical rod 2061) as the center. In the XZ plane or the YZ plane, the projections of the LED filament C1, the LED filament C2, the LED filament C3 ..., and the LED filament Cn are intertwined with each other, and the projection of a part of the LED filament Cn intersects with the projection of the LED filament Cn+1 (n≥1). In some embodiments, on the XZ plane or the YZ plane, the projection of one of the LED filaments intersects with the projections of the other LED filaments. For example, the LED bulb includes four LED filaments (C1, C2, C3, C4). On the XZ plane or the YZ plane, the projection of the LED filament C2 intersects with the projections of the LED filaments C1, C3, and C4. Of course, in other embodiments, the projection of the LED filament C2 may intersect with the projections of at least two of the LED filaments C1, C3, and C4.

Please refer to Figures 54 and 60. Figure 54 is a schematic diagram of the structure of the LED filament in an unbent state according to some embodiments of the present application (III). Figure 55 is a schematic diagram of the LED bulb lamp of the LED filament in Figure 54. In this embodiment, the LED bulb lamp can be any LED bulb lamp disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb lamp. The power supply component can also be any power supply component disclosed in the previous embodiments. As shown in Figures 54 and 55, a fixing portion 203 is provided in the lamp housing 202, and a power supply module (not shown in this figure) is connected to the fixing portion 203. The fixing portion 203 has a first opening 2031. The filament body of each LED filament 100 is located in the first opening 2031. A portion of the electrode 106 or the electrode 108 of each LED filament 100 is connected to the fixing portion 203 to fix the position of the LED filament 100. Specifically, the fixing portion 203 has a first connecting portion 2032 and a second connecting portion 2033 opposite to each other. The electrode 106 is connected to the first connecting portion 2031. 2032, the electrode 504 is connected to the second connection part 2033, the first connection part 2032 has a first end 2034 and a second end 2035 relative to each other, the second connection part 2033 has a third end 2036 and a fourth end 2037 relative to each other, compared with the second end 2035, the first end 2034 of the first connection part 2032 is closer to the third end 2036 of the second connection part 2033, when the fixing part 203 is curled, the first end 2034 of the first connection part 2032 is closer to the second end 2035 of the first connection part 2032, and the third end 2036 of the second connection part 2033 is closer to the fourth end 2037 of the second connection part 2033, that is, the first connection part 2032 and the second connection part 2033 are curled in the same direction, and the LED filament 100 is in a straight strip shape. In some embodiments, when the fixing portion 203 is curled, the first end 2034 of the first connection portion 2032 approaches the second end 2035 of the first connection portion 2032, and the fourth end 2037 of the second connection portion 2033 approaches the third end 2036 of the second connection portion 2033, that is, the first connection portion 2032 and the second connection portion 2033 are curled in opposite directions, and the LED filament 100 is in a bent state. After the fixing portion 203 is curled, the power module is electrically connected to the first connection portion 2032 and the second connection portion 2033 respectively. A carrier 201 is also provided in the lamp housing 202. After the fixing portion 203 is curled, the LED filament 100 is attached to the carrier 201. The material of the carrier 201 is selected from a material with a light transmittance of at least greater than 70%. The material of the carrier 201 can be glass, etc., to reduce the absorption of the light emitted by the LED filament 100 by the carrier 201. In other embodiments, the carrier 201 may be cylindrical, and the LED filament 100 is fixed on the carrier 201 by gluing or other methods.

Please refer to Figures 56 and 57. Figure 56 is a schematic diagram (V) of an LED bulb in some embodiments of the present application. Figure 57 is an enlarged schematic diagram of part 62 in Figure 56. In this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb. The power supply component can also be any power supply component disclosed in the previous embodiments. As shown in Figures 56 and 57, a support unit 207 is provided on the core column 206, and the support unit 207 is perpendicular to the core column 206 (or the central axis of the LED bulb), and the support unit 207 extends along the central axis of the LED bulb toward the top of the lamp housing 202. A plurality of support portions 2071 are provided on the support unit 207, and a second opening 2072 is provided on the support portion 2071. The height of the LED filament 100 is less than the width of the LED filament 100, and the LED filament 100 can first enter the support portion 2071 through the second opening 2072 at an angle. Since the minimum distance of the second opening 2072 is greater than the width of the LED filament 100, the LED filament 100 can be prevented from escaping from the support portion 2071, thereby fixing the shape of the LED filament 100.

Please refer to Figures 58 to 61. Figure 58 is a circuit diagram of a first constant current circuit in some embodiments of the present application. Figure 59 is a circuit diagram of a second constant current circuit in some embodiments of the present application. Figure 60 is a circuit diagram of a third constant current circuit in some embodiments of the present application. Figure 61 is a circuit block diagram of an LED bulb in some embodiments of the present application. In accordance with the general practice of circuit diagrams, the optional parameters of each component are marked in the figure, and the unit is the international standard unit of measurement. In the following description, for the sake of simplicity, the first resistor R1 is referred to as R1, and other components are similar. In addition, in this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is provided in this LED bulb.

As shown in the circuit of Figure 58, after power-on, the voltage at point A is the voltage divided by R4 on R3 and R4, so the current between the drain and source of the main switch element M1 (hereinafter referred to as M1) increases, making Vbe large enough to turn on the auxiliary switch element Q1 (hereinafter referred to as Q1), thereby pulling down the voltage at point A, causing the current between the drain and source of M1 to decrease. Since R1 is very small, Vbe cannot reach the on-voltage of Q1, so Q1 is turned off. When Q1 is turned off, the voltage at point A returns to the voltage divided by R4 on R3 and The voltage on R4 is divided, so that the current between the drain and source of M1 rises again, and then the above process is repeated, and finally M1 remains turned on, and the current IR1 flowing through R1 remains approximately equal to the ratio of Vbe to R1. It can be seen that the current on the load D5 is kept constant in this way.

The structure of the circuit shown in Figure 59 is basically the same as that of Figure 58, except that Figure 59 includes a resistor PTC (hereinafter referred to as PTC), which can be a positive temperature coefficient thermistor. Figure 59 shows the voltages of some points and the currents on some branches. The current flowing through the resistor PTC is IPTC = (Vin-Vbe)/PTC. Since the current of the input Q1 base is almost zero, the current of the PTC is IPTC = IR2, and IR2 = (Vbe-VB)/R2, where VB represents the voltage at point B, so (Vin-Vbe)/PTC = (Vbe-VB)/R2, where PTC represents the resistance value of the PTC resistor. According to the transformation of this formula, VB = Vbe-(Vin-Vbe)R2/PTC is obtained. From Figure 59, it can be seen that VB = ID5×R1, so ID5×R1 = Vbe-(Vin-Vbe)R2/PTC, so formula 1 is obtained:
ID5 = Vbe/R1-[(Vin-Vbe)×R2]/(PTC×R1).

According to Formula 1, the load current ID5 is also affected by the resistance of the PTC. Due to the physical properties of the transistor, the base voltage Vbe will decrease when the temperature rises. From Formula 1, it can be seen that the reduction of Vbe will reduce ID5, that is, the load current will decrease, affecting the lighting of the LED bridge bulb (or the applied lamp). On the other hand, the PTC will increase when the temperature rises. From Formula 1, it can be seen that when the PTC increases, the current ID5 will also increase, which helps to offset the fluctuation of the load current caused by the decrease of Vbe.

According to formula 1, if the PTC resistor is replaced with a negative temperature coefficient thermistor, ID5 will increase when the temperature drops, which means that the low temperature protection function of the LED bridge bulb (or the applied lamp) is realized. In addition, it can be seen from formula 1 that the resistor R1 directly affects ID5, that is, R1 directly affects the brightness of the LED bridge bulb. Therefore, when the power supply voltage remains unchanged, the load current can be set by selecting the value of R1.

According to the circuits shown in FIG58 and FIG59, M1 is used as the main switch element (which may be a metal field effect transistor, for example), and its current is affected by the negative feedback loop formed by R1, R2, and Q1, while Q1 is used as the secondary switch element, which is turned on or off by the current of M1, and finally the on-current of M1 is maintained at a fixed level, thereby realizing a constant current circuit for the load. FIG58 and FIG59 are only examples, and other circuit topologies may also be used.

In the circuit shown in FIG60 , in a preferred manner, i.e., when resistor PTC1 (hereinafter referred to as PTC1, where PTC1 may also be an NTC resistor) is added, similar to the previous analysis, after power-on, the on-current of M1 increases, causing Q3 to turn on, and the turning on of Q3 causes the on-current of M1 to decrease, also constituting a negative feedback similar to that in FIG58 and FIG59 , so that M1 maintains a constant on-current state, and the current flowing through the load LD1 is constant.

In some embodiments, each M1 and Q1 may also use other types of switch devices. In addition to using a DC voltage source, the power supply may also be a rectifier circuit, so that the external AC input (usually the mains) can be converted into DC. In addition, the fourth resistor R4 may be connected in parallel with a capacitor, so that the voltage at point A gradually increases when power is turned on, realizing the function of delayed startup.

In some embodiments, a main switch element and a negative feedback circuit are used to achieve a constant current value through the main switch element, thereby realizing a constant current circuit. This method only requires a small number of discrete components to realize a constant current circuit, and does not involve electromagnetic compatibility issues. In a specific circuit structure, PTC or NTC can also be used to improve the temperature drift phenomenon. When the constant current circuit is applied to a lamp, it occupies a small volume and has stable light emission.

In some embodiments, as shown in FIG. 61 , an LED bulb includes a constant current driving circuit 700, a shunt circuit 800, and an LED filament 100. The constant current driving circuit 700 is a constant current source that provides a constant current. The LED filament 100 includes an LED chip unit (102, 104). The LED chip unit (102, 104) is electrically connected to the shunt circuit 800. The shunt circuit 800 is used to receive the constant current of the constant current driving circuit 700 and distribute the current to the LED chip unit 102 and the LED chip unit 104. In this embodiment, the LED chip unit (102, 104) can be the aforementioned one LED chip or a plurality of LED chips connected in series.

In some embodiments, LED chip unit 102 and LED chip unit 104 are configured with different color temperatures. The brightness of LED chip unit 102 and LED chip unit 104 can be adjusted by adjusting the current flowing through LED chip unit 102 and LED chip unit 104. The color temperature can be adjusted by adjusting the brightness ratio of LED chip unit 102 and LED chip unit 104.

In some embodiments, LED chip unit 102 and LED chip unit 104 are configured as different colors.

In some embodiments, the LED chip unit 102 and the LED chip unit 104 include different numbers of light-emitting diodes.

Through the configuration of the above embodiment, only one constant current driving circuit is needed to control at least two LED components and adjust the color temperature or color. In particular, when the number of light-emitting diodes included in the LED components is different, current adjustment of different LED components can still be achieved.

Refer to FIG. 62, which is a schematic diagram (I) of the circuit structure of an LED bulb according to some embodiments of the present application. In this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is arranged in the LED bulb. In this embodiment, the circuit of the LED bulb includes an LED chip unit (102, 104). The constant current drive circuit 700 includes a constant current source A1. The shunt circuit 800 includes Q1, R1 and R2. The anode of the LED chip unit 102 is electrically connected to the anode of the LED chip unit 104 and is electrically connected to the first output terminal of the constant current source A1. The cathode of the LED chip unit 102 is electrically connected to the collector of Q1, the emitter of Q1 is electrically connected to the common ground terminal, the base of Q1 is electrically connected to the first pin of R2, and the second pin of R2 is electrically connected to the first pin of R1 and the cathode of the LED chip unit 104. The second pin of R1 is electrically connected to the common ground terminal. The second output terminal of the constant current source A1 is electrically connected to the common ground terminal.

In this embodiment, the LED chip unit 102 and the LED chip unit 104 include a light emitting diode or a plurality of light emitting diodes connected in series (ie, the LED chip 111 in the aforementioned embodiment).

The following describes the operating principle of the shunt circuit 800. In this embodiment, the constant current source A1 provides a constant current I1. After being shunted by the shunt circuit 800, the current flowing through the LED chip unit 102 is ID1, and the current flowing through the LED chip unit 104 is The current flowing through resistor R1 is IR1, and the current flowing through resistor R2 is IR2. The voltage at the base of Q1 is Vbe, and the current at the emitter of Q1 is IQ1. The currents satisfy the following relationship:
I1＝ID1+ID2
ID2＝IR1+IR2
IQ1＝ID1+IR2

In this embodiment, since the current of IR2 is small and can be ignored,
ID2≈IR1
IQ1≈ID1
IR1≈Vbe/R1

When ID2 has an increasing trend, VR1 increases, IR2 increases, and according to the amplification principle of the transistor, ID1 increases, because ID1 and ID2 add up to a constant value I1. When ID1 increases, ID2 decreases. Therefore, when ID2 has an increasing trend, the increasing trend of ID2 is suppressed by the regulation of the shunt circuit 800, so that ID2 tends to a stable value. Similarly, when ID2 has a decreasing trend, VR1 decreases, IR2 decreases. According to the amplification principle of the transistor, ID1 decreases, because ID1+ID2＝I1, so when ID1 decreases, ID2 increases. Therefore, when ID2 has a decreasing trend, the decreasing trend of ID2 is suppressed by the regulation of the shunt circuit 800, so that ID2 tends to a stable value.
ID2≈Vbe/R1
ID1＝I1–ID2

In this embodiment, Vbe is a certain value, which is about 0.7 V. The magnitudes of the currents ID1 and ID2 can be adjusted by adjusting the magnitude of the resistor R1 , so as to adjust the brightness of the LED chip unit 102 and the LED chip unit 104 .

In some embodiments, the number of LED chips included in the LED chip unit 102 is less than or equal to the number of LED chips included in the LED chip unit 104 .

In some embodiments, LED chip unit 102 and LED chip unit 104 are configured to have different colors or color temperatures.

In some embodiments, the auxiliary switch element Q1 can be replaced by a field effect transistor without affecting the technical effect to be achieved by the present application.

Please refer to FIG. 63, which is a schematic diagram (II) of the circuit structure of an LED bulb according to some embodiments of the present application. In this embodiment, the LED bulb can be any LED bulb disclosed in the previous embodiments, and any LED filament disclosed in the previous embodiments is disposed in the LED bulb. In addition, the circuit structure of the LED bulb in this embodiment is similar to the embodiment described in FIG. 62, except that the circuit of the LED bulb in this embodiment further includes an LED chip unit 103, wherein the current flowing through the LED chip unit 103 is ID3. The shunt circuit 800 further includes a transistor Q2 and resistors R3 and R4. The anode of LED chip unit 102 is electrically connected to the anode of LED chip unit 104 and the anode of LED chip unit 103 and is electrically connected to the first output terminal of constant current source A1. The cathode of LED chip unit 102 is electrically connected to the collector of Q1. The emitter of Q1 is electrically connected to the second pin of resistor R1, and its base is electrically connected to the first pin of resistor R2. The second pin of resistor R2 is electrically connected to the cathode of LED chip unit 104 and the first pin of resistor R1. The collector of transistor Q2 is electrically connected to the second pin of resistor R1, its emitter is electrically connected to the common ground terminal, and its base is electrically connected to the first pin of resistor R4. The second pin of resistor R4 is electrically connected to the cathode of LED chip unit 103 and the first pin of resistor R3. The second pin of resistor R3 is electrically connected to the common ground terminal. The second output terminal of constant current source A1 is electrically connected to the common ground terminal.

In this embodiment, the principle of the shunt circuit regulating the current of the three LED chip units (102, 103, 104) is similar to the embodiment described in FIG62. In this embodiment, the current relationship satisfies the following relationship:
I1＝ID1+ID2+ID3
ID3≈IR3
ID2≈IR1
ID1≈IQ1

In this embodiment, IR2 and IR4 can be ignored.

so:
ID3≈Vbe/R3
ID2≈Vbe/R1
ID1＝I1–ID2–ID3

In this embodiment, Vbe is a certain value, which is about 0.7 V. By adjusting the resistance values of R1 and R3, the magnitudes of the currents ID1, ID2 and ID3 can be adjusted, thereby adjusting the brightness of the LED chip units (102, 103, 104).

In this embodiment, the number of diodes included in the LED chip unit 102 is less than or equal to the number of LED chips included in the LED chip unit 104. The number of LED chips included in the LED chip unit 104 is less than or equal to the number of LED chips included in the LED chip unit 103.

In some embodiments, the LED chip units (102, 103, 104) are configured to have different colors or color temperatures.

In some embodiments, Q1 and Q2 can be replaced by field effect transistors without affecting the technical effect to be achieved by the present application.

Through the configuration of the above embodiment, only one constant current driving circuit is needed to control three LED chip units and adjust the color temperature or color. Current regulation of different LED chip units can still be achieved.

Please refer to FIG. 64, which is a schematic diagram of the circuit structure of an LED bulb lamp according to some embodiments of the present application (III). The circuit structure of the LED bulb lamp in this embodiment is similar to that of the embodiment described in FIG. 62, except that the transistor used in the shunt circuit 800 in this embodiment is a PNP transistor, while the transistor used in the embodiment described in FIG. 62 is an NPN transistor. In this embodiment, the constant current driving circuit 700 includes a constant current source A1, the LED filament 100 includes an LED chip unit 102 and an LED chip unit 104, and the shunt circuit 800 includes Q1 and R1 and R2. The emitter of Q1 is electrically connected to the first pin of R1 and the first output end of the constant current source A1, the collector thereof is electrically connected to the anode of the LED chip unit 102, and the base thereof is electrically connected to the first pin of R2. The second pin of R2 is electrically connected to the second pin of R1 and the anode of the LED chip unit 104. The cathode of the LED chip unit 102 is electrically connected to the cathode of the LED chip unit 104 and is electrically connected to a common ground terminal. The second output terminal of the constant current source A1 is electrically connected to the common ground terminal.

The operating principle of the shunt circuit 800 in this embodiment is similar to the embodiments described in FIG. 62 and FIG. 63, and will not be described in detail here. In this embodiment, since the current of IR2 is small, it can be ignored. Its current satisfies the following relationship:
ID2≈Vbe/R1
ID1＝I1–ID2

By adjusting the value of the resistor R1 , the values of the currents ID1 and ID2 can be adjusted, thereby adjusting the brightness of the LED chip unit 102 and the LED chip unit 104 .

In some embodiments, the LED chip units (102, 104) are configured to have different colors or color temperatures, and the LED filaments can be dimmed and adjusted in color.

In some embodiments, Q1 can be replaced by a field effect transistor without affecting the technical effect to be achieved by the present application.

Through the configuration of the above embodiment, only one constant current driving circuit is needed to control two LED chip units and adjust the color temperature or color. In particular, when the number of LED chips included in the LED chip units is different, current adjustment of different LED chip units can still be achieved.

Through the description of the above embodiments, technicians in this industry can reasonably expand and adjust the shunt of multiple LED chip units, not limited to two or three channels.

The "one LED filament" or "one LED filament" referred to in this application refers to a structure formed by connecting the aforementioned conductor segment and LED segment together or consisting only of LED segments (or LED chip units), having the same and continuous light conversion layer (including the same and continuously formed top layer or bottom layer), and having only two electrodes electrically connected to the conductive bracket of the bulb at both ends. The structure that meets the above description is the single LED filament structure referred to in this application.

The present application has been disclosed in the above with a preferred embodiment, but those familiar with the art should understand that the embodiment is only used to describe some of the implementation methods of the present application and should not be interpreted as a limitation. It should be noted that any changes and substitutions equivalent to the embodiment or reasonable combinations between embodiments (especially the aforementioned LED filament embodiment combined with the aforementioned LED bulb embodiment) should be included in the scope supported by the present application specification. Therefore, the scope of protection of the present application shall be based on the scope defined by the attached claims.

Claims

An LED filament, comprising an LED chip unit, a light conversion layer and an electrode, wherein the light conversion layer covers the LED chip unit and part of the electrode;

A layered body is disposed on the outer surface of the light conversion layer, and the layered body covers the light conversion layer and at least a part of the electrode; a color developing material or a photoconversion material is disposed in the layered body.
The LED filament according to claim 1, characterized in that: the light conversion layer comprises a top layer and a base layer, and the layered body completely covers the top layer and the base layer.
The LED filament according to claim 1, characterized in that the color-developing material or the photoconversion material is selected from one or a combination of the following materials: aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate or garnet, etc.
The LED filament according to claim 1, wherein the layered body appears white when not lit.
The LED filament according to claim 1 is characterized in that: when the layered body is not lit, under the RGB standard, its color value is within the range of R (235-255), G (235-255), B (235-255), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller value or the larger value thereof.
The LED filament according to claim 1, characterized in that the layered body appears gray when not lit.
The LED filament according to claim 1 is characterized in that: when the layered body is not lit, under the RGB standard, its color value is within the range of R (100-234), G value (100-234), B value (100-234), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller value or the larger value thereof.
The LED filament according to claim 3 is characterized in that titanium dioxide particles are arranged in the layered body, and the mass of the titanium dioxide accounts for 0.2% to 10% of the total mass of the layered body.
The LED filament according to claim 1, wherein the thickness of the layered body is less than or equal to the thickness of the light conversion layer.
The LED filament according to claim 1, characterized in that: the light conversion layer comprises a top layer and a base layer, and the thickness of the layered body is less than or equal to the thickness of the top layer.
The LED filament according to claim 10 is characterized in that the base layer includes titanium dioxide, so that the color presented by the base layer is in the same RGB value range as the layered body.
The LED filament according to claim 11, characterized in that the amount of titanium dioxide added to the base layer accounts for 1% to 20% of the total weight of the solid particles in the base layer.
The LED filament according to claim 10 is characterized in that at least one phosphor is disposed in the base layer, and the phosphor accounts for 1% to 15% of the total weight of the solid particles in the base layer.
The LED filament according to claim 1, characterized in that: the LED filament comprises at least two LED chips, and the LED chips are electrically connected through metal wires.
An LED filament, comprising an LED chip, a light conversion layer and an electrode, characterized in that:

The light conversion layer covers the LED chip and part of the electrode, and the light conversion layer includes a top layer and a base layer;

There are at least two types of LED chips, at least two types of phosphors are arranged in the top layer, and the LED filament presents different colors when not lit.
The LED filament according to claim 15, characterized in that the LED chips include a blue light chip, a red light chip and a green light chip.
The LED filament according to claim 15, characterized in that the light intensity ratio of the blue light chip, the red light chip and the green light chip is 1:3:6.
The LED filament according to claim 15 is characterized in that: the base layer is provided with a BT substrate, and the color value of the BT substrate is within the range of R (235-255), G (235-255), and B (235-255) under the RGB standard.
The LED filament according to claim 18, wherein the BT substrate is located at the outermost side of the LED filament.
The LED filament according to claim 15 is characterized in that: the LED filament is provided with three rows of LED chip arrays arranged side by side along the length direction of the LED filament, and the LED chip array is formed by LED chips, wherein the LED chips include a blue light chip, a red light chip and a green light chip.
The LED filament according to claim 20 is characterized in that: the top layer is a transparent adhesive layer, and when the LED filament is lit, the light output color is greater than or equal to 3.
The LED filament according to claim 20 is characterized in that: the top layer is provided with fluorescent powder, the top layer corresponding to the blue light chip is provided with yellow fluorescent powder, the top layer corresponding to the red light chip is provided with red fluorescent powder, and the top layer corresponding to the green light chip is provided with green fluorescent powder, and the light emitted by the blue light chip, the red light chip, and the green light chip are all white light after conversion by the top layer.
The LED filament according to claim 18, characterized in that the thermal conductivity of the BT substrate is ≥ 0.8 W/(m.K).
The LED filament according to claim 18, characterized in that the thickness of the BT substrate is ≤0.12 mm.
The LED filament according to claim 18, characterized in that the light transmittance of the BT substrate is greater than or equal to 30%.
The LED filament according to claim 15, characterized in that the LED chips are connected to each other through metal wires or copper foil circuits.
An LED bulb lamp, characterized in that it comprises: a lamp holder, a lamp housing connected to the lamp holder, at least two conductive brackets, a cantilever, a stem, i.e., at least one LED filament, arranged in the lamp housing, wherein the LED filament comprises an LED chip unit, a light conversion layer, and an electrode, characterized in that:

The light conversion layer covers the LED chip unit and part of the electrode;

A layered body is disposed on the outer surface of the light conversion layer, and the layered body covers the light conversion layer and at least a part of the electrode; a color developing material or a photoconversion material is disposed in the layered body.
The LED bulb according to claim 27, characterized in that the light conversion layer comprises a top layer and a base layer, and the layered body completely covers the top layer and the base layer.
The LED bulb according to claim 27, characterized in that the color-developing material or the photoconversion material is selected from one or a combination of aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphor, sulfate, silicate, nitride, nitrogen oxide, oxysulfate or garnet.
The LED bulb according to claim 27 is characterized in that the color-developing material or the photoconversion material is a combination of multiple materials selected from the group consisting of aluminum oxide, silicon dioxide, magnesium oxide, titanium dioxide, graphene, phosphors, sulfates, silicates, nitrides, nitrogen oxides, oxysulfates, or garnets.
The LED bulb according to claim 27, characterized in that the layered body appears white when not lit.
The LED bulb according to claim 27 is characterized in that: when the layered body is not lit, under the RGB standard, its color value is within the range of R (235-255), G (235-255), B (235-255), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller or larger value thereof.
The bulb lamp according to claim 27 is characterized in that: when the layered body is not lit, under the RGB standard, its color value is within the range of R (100-234), G value (100-234), B value (100-234), wherein the absolute value of the difference between any two of R, G, and B is less than or equal to 10% of the smaller or larger value thereof.
The LED bulb according to claim 30 or 31 is characterized in that titanium dioxide particles are arranged in the layered body, and the mass of the titanium dioxide accounts for 0.2% to 10% of the total mass of the layered body.
The LED bulb according to claim 27, characterized in that the thickness of the layered body is less than or equal to the thickness of the light conversion layer.
The LED bulb according to claim 27, characterized in that: the light conversion layer comprises a top layer and a base layer, and the thickness of the layered body is less than or equal to the thickness of the top layer.
The LED bulb according to claim 36 is characterized in that titanium dioxide is provided in the base layer so that the color presented by the base layer is within the same RGB numerical range as the layered body.
The LED filament according to claim 37 is characterized in that the amount of titanium dioxide added to the base layer is 1% to 20% of the total weight of the solid particles in the base layer.
The LED filament according to claim 36 is characterized in that at least one fluorescent powder is provided in the base layer, and the fluorescent powder accounts for 1% to 15% of the solid particles in the base layer.
The LED filament according to claim 27 is characterized in that: the LED filament comprises at least two LED chips, and the LED chips are electrically connected through metal wires.
An LED bulb lamp, characterized in that it comprises: a lamp holder, a lamp housing connected to the lamp holder, at least two conductive brackets, a cantilever, a stem, i.e., at least one LED filament, arranged in the lamp housing, wherein the LED filament comprises an LED chip, a light conversion layer, and an electrode, characterized in that:

The light conversion layer covers the LED chip and part of the electrode, and the light conversion layer includes a top layer and a base layer;

There are at least two types of LED chips, at least two types of phosphors are arranged in the top layer, and the LED filament presents different colors when not lit.
The LED filament according to claim 41, characterized in that: the LED chip comprises a blue light chip, a red light chip Chip and green light chip.
The LED filament according to claim 41 is characterized in that the light intensity ratio of the blue light chip, the red light chip and the green light chip is 1:3:6.
The LED filament according to claim 41 is characterized in that: the base layer is provided with a BT substrate, and the color value of the BT substrate is within the range of R (235-255), G (235-255), and B (235-255) under the RGB standard.
The LED filament according to claim 44, characterized in that the BT substrate is located at the outermost side of the LED filament.
According to claim 41, the LED filament is characterized in that: three rows of LED chip arrays are arranged side by side along the length direction of the LED filament, and the LED chip array is formed by LED chips, wherein the LED chips include blue light chips, red light chips and green light chips.
The LED filament according to claim 46 is characterized in that: the top layer is a transparent adhesive layer, and when the LED filament is lit, the number of light output colors is greater than or equal to 3.
The LED filament according to claim 46 is characterized in that: the top layer is provided with fluorescent powder, the top layer corresponding to the blue light chip is provided with yellow fluorescent powder, the top layer corresponding to the red light chip is provided with red fluorescent powder, and the top layer corresponding to the green light chip is provided with green fluorescent powder, and the light emitted by the blue light chip, the red light chip, and the green light chip are all white light after conversion by the top layer.
The LED filament according to claim 44 is characterized in that the thermal conductivity of the BT substrate is ≥ 0.8 W/(m.K).
The LED filament according to claim 44 is characterized in that the thickness of the BT substrate is ≤0.12 mm.
The LED filament according to claim 44, characterized in that the transmittance of the BT substrate is greater than or equal to 30%.
The LED filament according to claim 41 is characterized in that the LED chips are connected through metal wires or copper foil circuits.