CN111548175A - 一种低膨胀率抗热震耐侵蚀高强浇注料 - Google Patents
一种低膨胀率抗热震耐侵蚀高强浇注料 Download PDFInfo
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- 230000003628 erosive effect Effects 0.000 title claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000002245 particle Substances 0.000 claims abstract description 48
- 239000005350 fused silica glass Substances 0.000 claims abstract description 37
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000035939 shock Effects 0.000 claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 12
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000004113 Sepiolite Substances 0.000 claims abstract description 11
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 11
- 229910052624 sepiolite Inorganic materials 0.000 claims abstract description 11
- 235000019355 sepiolite Nutrition 0.000 claims abstract description 11
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 11
- 229910002076 stabilized zirconia Inorganic materials 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 8
- GCLGEJMYGQKIIW-UHFFFAOYSA-H sodium hexametaphosphate Chemical compound [Na]OP1(=O)OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])OP(=O)(O[Na])O1 GCLGEJMYGQKIIW-UHFFFAOYSA-H 0.000 claims abstract description 8
- 235000019982 sodium hexametaphosphate Nutrition 0.000 claims abstract description 8
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 13
- 239000007767 bonding agent Substances 0.000 abstract description 3
- 229910052727 yttrium Inorganic materials 0.000 abstract 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 229910052863 mullite Inorganic materials 0.000 description 4
- 239000004927 clay Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000156 glass melt Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011819 refractory material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021488 crystalline silicon dioxide Inorganic materials 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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Abstract
本发明公开了一种低膨胀率抗热震耐侵蚀高强浇注料，所述浇注料由以下重量百分比的原料制备：3.1~5mm的熔融石英颗粒0.01~28%、1.1~3mm的熔融石英颗粒20~35%、0.01~1mm的熔融石英颗粒10~20%、200目的碳化硅粉10~15%、320目的海泡石粉料1~3%、钇稳定氧化锆3~5%，硅微粉3~8%、金属硅粉1~3%、活性氧化铝微粉4~8%、氧化铍3~5%、硅溶胶8~12%、六偏磷酸钠0.01~0.2%。本发明通过采用熔融石英做骨料，同时添加碳化硅粉、硅微粉、金属硅粉、活性氧化铝微粉、硅溶胶、海泡石粉料、钇稳定氧化锆、氧化铍做结合剂制成浇注料，其制作成的推板的体积密度为1.95g/cm3，明显降低了推板的体积密度，并且其热震稳定性更高。
Description
技术领域
本发明涉及推板窑领域，尤其涉及一种低膨胀率抗热震耐侵蚀高强浇注料。
背景技术
推板窑是隔焰烧成的窑炉，主要用于轻质砖、建筑用S瓦、玻璃瓦等物品的烧制。推板是推板窑的主要窑具，其主要用于承载烧制物品进出推板窑，在推板窑中起到至关重要的作用。在烧窑过程中温度较高，推板自身要耐高温，还要承受产品的重量和推进器的巨大压力。推板由浇注料浇筑而成，推板按材质分为：粘土质、高铝质、堇青石-莫来石质、莫来石质、粘土碳化硅质、氮化硅结合碳化硅质。粘土质推板一般是烧成制品，因环保因素，此材质的推板逐步淘汰；高铝质推板一般是预制推板，此推板重量重，蓄热高，热稳性差，使用效果不好；堇青石-莫来石质、莫来石质、粘土碳化硅质、氮化硅结合碳化硅质这些材质的推板属于高档推板，主要用于陶瓷等制品的烧成，使用效果好，但其成本太高，不利于市面推广，因此，有必要研究一种热稳定性好、生产成本低的推板浇注料来迎合市场需求。
发明内容
本发明目的是针对上述问题，提供一种热震稳定性更高的低膨胀率抗热震耐侵蚀高强浇注料。
为了实现上述目的，本发明的技术方案是：
一种低膨胀率抗热震耐侵蚀高强浇注料，所述浇注料由以下重量百分比的原料制备：3.1~5mm的熔融石英颗粒0.01~28%、1.1~3mm的熔融石英颗粒20~35%、0.01~1mm的熔融石英颗粒10~20%、200目的碳化硅粉10~15%、320目的海泡石粉料1~3%、钇稳定氧化锆3~5%，硅微粉3~8%、金属硅粉1~3%、活性氧化铝微粉4~8%、氧化铍3~5%、硅溶胶8~12%、六偏磷酸钠0.01~0.2%。
进一步的，所述浇注料由以下重量百分比的原料制备：3.5~4.5mm的熔融石英颗粒15%、1.5~2.5mm的熔融石英颗粒25%、0.05~1mm的熔融石英颗粒15%、200目的碳化硅粉12%、320目的海泡石粉料2%、钇稳定氧化锆4%，硅微粉5%、金属硅粉2%、活性氧化铝微粉5%、氧化铍5%、硅溶胶9.9%、六偏磷酸钠0.1%。
与现有技术相比，本发明具有的优点和积极效果是：
本发明采用熔融石英为主要原料对浇注料进行制作，熔融石英是用天然高纯度二氧化硅经电炉在高于1760℃以上温度熔融，然后快速冷却而制得的，此过程中将晶型二氧化硅转变为非晶型的玻璃熔体。熔融石英熔化温度约1713℃，二氧化硅含量不低于99.5%，晶态石英含量不大于0.5%，真比重2.21g/cm3，莫氏硬度7.0，导热系数低，热容量小，0~1200℃的热膨胀系数5×10-7/℃，几乎是所有耐火材料中最小的，因而它具有极高的热震稳定性。
本发明通过采用不同粒径的熔融石英做骨料，同时添加碳化硅粉、硅微粉、金属硅粉、活性氧化铝微粉、硅溶胶、海泡石粉料、钇稳定氧化锆、氧化铍做结合剂制成浇注料，其制作成的推板的体积密度为1.95g/cm3，明显降低了推板的体积密度，并且制作成的推板的热熔低，能减少推板炉加热体系的热损失，其热膨胀系数在目前所用材料中属于最低值，从而使得其热震稳定性更高；另一方面，熔融石英的成本相对于堇青石-莫来石质和莫来石质、碳化硅质等材质来说相对较低，有效降低了推板的生产成本，具有很大的市场推广前景。
具体实施方式
下面将结合本发明的实施例，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
实施例1、本实施例中的低膨胀率抗热震耐侵蚀高强浇注料由以下重量百分比的原料制备：3.1~3.5mm的熔融石英颗粒10%、1.1~1.5mm的熔融石英颗粒20%、0.01~0.05mm的熔融石英颗粒20%、200目的碳化硅粉10%、320目的海泡石粉料3%、钇稳定氧化锆5%，硅微粉8%、金属硅粉3%、活性氧化铝微粉8%、氧化铍3%、硅溶胶9.8%、六偏磷酸钠0.2%。
实施例2、本实施例中的低膨胀率抗热震耐侵蚀高强浇注料由以下重量百分比的原料制备：3.5~4.5mm的熔融石英颗粒15%、1.5~2.5mm的熔融石英颗粒25%、0.05~1mm的熔融石英颗粒15%、200目的碳化硅粉12%、320目的海泡石粉料2%、钇稳定氧化锆4%，硅微粉5%、金属硅粉2%、活性氧化铝微粉5%、氧化铍5%、硅溶胶9.9%、六偏磷酸钠0.1%。
实施例3、本实施例中的低膨胀率抗热震耐侵蚀高强浇注料由以下重量百分比的原料制备：4.5~5mm的熔融石英颗粒25%、2.5~3mm的熔融石英颗粒20%、0.5~1mm的熔融石英颗粒20%、200目的碳化硅粉10%、320目的海泡石粉料1%、钇稳定氧化锆3%，硅微粉3%、金属硅粉1%、活性氧化铝微粉5%、氧化铍3.8%、硅溶胶8%、六偏磷酸钠0.2%。
本发明采用熔融石英为主要原料对浇注料进行制作，熔融石英是用天然高纯度二氧化硅经电炉在高于1760℃以上温度熔融，然后快速冷却而制得的，此过程中将晶型二氧化硅转变为非晶型的玻璃熔体。熔融石英熔化温度约1713℃，二氧化硅含量不低于99.5%，晶态石英含量不大于0.5%，真比重2.21g/cm3，莫氏硬度7.0，导热系数低，热容量小，0~1200℃的热膨胀系数5×10-7/℃，几乎是所有耐火材料中最小的，因而它具有极高的热震稳定性。
本发明通过采用不同粒径的熔融石英做骨料，同时添加碳化硅粉、硅微粉、金属硅粉、活性氧化铝微粉、硅溶胶、海泡石粉料、钇稳定氧化锆、氧化铍做结合剂制成浇注料，其制作成的推板的体积密度为1.95g/cm3，明显降低了推板的体积密度，并且制作成的推板的热熔低，能减少推板炉加热体系的热损失，其热膨胀系数在目前所用材料中属于最低值，从而使得其热震稳定性更高；另一方面，熔融石英的成本相对于堇青石-莫来石质和莫来石质、碳化硅质等材质来说相对较低，有效降低了推板的生产成本，具有很大的市场推广前景。
Claims (2)
1.一种低膨胀率抗热震耐侵蚀高强浇注料，其特征在于：所述浇注料由以下重量百分比的原料制备：3.1~5mm的熔融石英颗粒0.01~28%、1.1~3mm的熔融石英颗粒20~35%、0.01~1mm的熔融石英颗粒10~20%、200目的碳化硅粉10~15%、320目的海泡石粉料1~3%、钇稳定氧化锆3~5%，硅微粉3~8%、金属硅粉1~3%、活性氧化铝微粉4~8%、氧化铍3~5%、硅溶胶8~12%、六偏磷酸钠0.01~0.2%。
2.如权利要求1所述的低膨胀率抗热震耐侵蚀高强浇注料，其特征在于：所述浇注料由以下重量百分比的原料制备：3.5~4.5mm的熔融石英颗粒15%、1.5~2.5mm的熔融石英颗粒25%、0.05~1mm的熔融石英颗粒15%、200目的碳化硅粉12%、320目的海泡石粉料2%、钇稳定氧化锆4%，硅微粉5%、金属硅粉2%、活性氧化铝微粉5%、氧化铍5%、硅溶胶9.9%、六偏磷酸钠0.1%。
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