CN111541470A - High density integrated multi-beam tile assembly - Google Patents
High density integrated multi-beam tile assembly Download PDFInfo
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- CN111541470A CN111541470A CN202010301234.5A CN202010301234A CN111541470A CN 111541470 A CN111541470 A CN 111541470A CN 202010301234 A CN202010301234 A CN 202010301234A CN 111541470 A CN111541470 A CN 111541470A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
- H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
- H04B7/0408—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas using two or more beams, i.e. beam diversity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q25/00—Antennas or antenna systems providing at least two radiating patterns
- H01Q25/002—Antennas or antenna systems providing at least two radiating patterns providing at least two patterns of different beamwidth; Variable beamwidth antennas
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/403—Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency
- H04B1/405—Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency with multiple discrete channels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/50—Circuits using different frequencies for the two directions of communication
- H04B1/52—Hybrid arrangements, i.e. arrangements for transition from single-path two-direction transmission to single-direction transmission on each of two paths or vice versa
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
- H04B7/04—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
- H04B7/06—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
- H04B7/0613—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station using simultaneous transmission
- H04B7/0615—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station using simultaneous transmission of weighted versions of same signal
- H04B7/0617—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station using simultaneous transmission of weighted versions of same signal for beam forming
Abstract
The invention provides a high-density integrated multi-beam tile type component, which belongs to the technical field of antennas and comprises a printed adapter plate and a multi-channel multi-beam functional module chip; in the multi-channel multi-beam functional module chip, a signal amplification functional layer is used for carrying out amplitude amplification on component communication information and simulating phase change and amplitude attenuation of a phase shift attenuation layer on the component communication information; in the printed adapter plate, the multi-beam synthesis network is used for shunting or combining the radio frequency channel signals connected with the network; the beam control circuit is used for sending control signals to the amplitude and the phase of each channel in the multi-beam assembly according to the system instruction, and realizing the change of the amplitude and the phase of each channel of the assembly. The high-density integrated multi-beam tile type component provided by the invention can meet the functional requirements of multi-channel and multi-beam, realizes the miniaturization, low profile, design simplification and high integration of the multi-beam TR component, can adjust the scale of the TR component according to the actual requirements, and meets the requirements of system size, weight and universality.
Description
Technical Field
The invention belongs to the technical field of antennas, and particularly relates to a high-density integrated multi-beam tile type assembly.
Background
The transceiver module (TR module) of the active phased array antenna is positioned between the antenna and the signal synthesis/decomposition network, has the main functions of amplifying, phase-shifting and attenuating microwave signals according to external control signals, and is the core of an active phased array antenna system. In a multi-beam phased array antenna system, a TR component needs to be provided with an independent amplitude and phase modulation and feed unit for each beam signal, when the number of the beam signals is larger, the number of required amplitude and phase control devices and feed networks is larger, and the number of radio frequency interfaces, control interfaces and power supply interfaces for interconnecting the TR component and external parts is larger. Therefore, the traditional multi-beam phased array antenna has the advantages of complex design, low expandability, large volume and weight, high assembly difficulty and high cost, causes a lot of obstacles to practical application, and limits the wide application of the multi-beam phased array to a great extent.
Disclosure of Invention
The invention aims to provide a high-density integrated multi-beam tile type component, and aims to solve the technical problems that in the prior art, a TR component of a multi-beam phased array is low in integration level, large in volume and weight, high in assembly difficulty and high in application cost.
In order to achieve the purpose, the invention adopts the technical scheme that: there is provided a high density integrated multi-beam tile assembly comprising:
printing a patch panel; and
the multi-channel multi-beam function module chips are arranged in a plurality and are attached to the printed adapter plate;
the multi-channel multi-beam functional module chip includes:
the signal amplification functional layer is electrically connected with the printed adapter plate and is used for carrying out amplitude amplification on the component communication information;
the analog phase-shift attenuation layer is used for phase change and amplitude attenuation of component communication information; and
the linking layer is arranged between the signal amplification functional layer and the analog phase-shift attenuation layer, is respectively electrically connected with the signal amplification functional layer and the analog phase-shift attenuation layer, and is used for signal transmission, power supply and control between the signal amplification functional layer and the analog phase-shift attenuation layer;
the printed interposer includes:
a substrate;
the multi-beam synthesis network is arranged on the substrate and comprises a plurality of mutually independent beam networks, and each beam network is electrically connected with the signal amplification functional layer and is used for shunting or combining the radio frequency channel signals connected with the network;
the beam control circuit is arranged on the substrate, is electrically connected with the signal amplification functional layer and is used for sending a control signal to the amplitude and the phase of each channel in the multi-beam assembly according to a system instruction so as to realize the change of the amplitude and the phase of each channel of the assembly; and
and the power supply circuit is arranged on the substrate and used for power supply connection.
As another embodiment of the present application, a bonding pad for electrically connecting with the printed interposer is attached to a non-chip surface of the signal amplification functional layer.
As another embodiment of the present application, the connection layer is a square matrix type bonding pad structure.
As another embodiment of this application, the welding has first metal shielding apron on the signal amplification functional layer, the welding has second metal shielding apron on the decay layer is moved in the simulation phase, the signal amplification functional layer with the simulation is moved and is filled with low-loss sealing medium between the decay layer.
As another embodiment of the present application, the multi-beam combining network is disposed inside the substrate, the beam control circuit is attached to the substrate, and the power supply circuit is attached to the substrate.
As another embodiment of the present application, the substrate is further provided with radio frequency connectors, the radio frequency connectors are distributed on the periphery of the multi-channel multi-beam functional module chip, and the radio frequency connectors are electrically connected to the signal amplification functional layer and are used for being connected to a signal transceiver module to complete transmission and reception of radio frequency signals of the high-density integrated multi-beam tile assembly.
As another embodiment of the present application, the rf connectors are distributed on the periphery of the multi-channel multi-beam functional module chip in a rectangular array.
As another embodiment of the present application, the rf connector comprises a subminiature push-in rf coaxial connector.
As another embodiment of the present application, a plurality of the multi-channel multi-beam functional module chips are disposed on the printed interposer in a rectangular array.
As another embodiment of the present application, the signal amplification functional layer and the analog phase shift attenuation layer are both of a multilayer ceramic dielectric substrate structure.
The high-density integrated multi-beam tile type assembly provided by the invention has the beneficial effects that: compared with the prior art, the multi-channel multi-beam function module chip in the high-density integrated multi-beam tile type assembly is of a three-dimensional stacked structure, each multi-channel multi-beam function module chip is provided with a structure for amplifying amplitude of communication information of the assembly and a structure for changing phase and attenuating amplitude of the communication information of the assembly, the printed adapter plate is provided with a circuit structure for splitting or combining radio frequency channel signals connected with the network, a circuit structure for realizing the change of amplitude and phase of each channel of the assembly and a circuit structure for supplying power, the chip is pasted on the printed adapter plate, and then the printed adapter plate is matched, so that the high-density integrated multi-beam tile type assembly has complete functions, the functional requirements of multi-channel multi-beam can be realized, and the miniaturization, low section, simplicity in design and high integration of the multi-beam TR assembly can be realized, due to the adoption of a surface mounting process, the assembly is simple, the scale of the TR component can be adjusted according to actual requirements, and the requirements on the size, weight and universality of a system are met, so that the high-density integrated multi-beam tile type component disclosed by the invention is more widely applied.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Figure 1 is an exploded view of a high density integrated multi-beam tile assembly provided by an embodiment of the present invention;
fig. 2 is an exploded view of a multi-channel multi-beam functional module chip employed in an embodiment of the present invention;
fig. 3 is an exploded view of an assembly structure of a signal amplification functional layer and a first metal shielding cover plate employed in an embodiment of the present invention;
FIG. 4 is a schematic bottom view of the functional signal amplification layer of FIG. 2;
FIG. 5 is an exploded view of an assembled structure of an analog phase shift attenuation layer and a second metal shielding cover plate according to an embodiment of the present invention;
FIG. 6 is a schematic perspective view of a bonding layer according to an embodiment of the present invention;
fig. 7 is a schematic top view of a high density integrated multi-beam tile assembly according to an embodiment of the present invention;
fig. 8 is a schematic bottom view of a high density integrated multi-beam tile assembly according to an embodiment of the present invention.
In the figure: 1. printing a patch panel; 101. a substrate; 2. a multi-channel multi-beam functional module chip; 201. a signal amplification functional layer; 202. simulating a phase shift attenuation layer; 203. a tie layer; 3. a pad; 4. a first metal shielding cover plate; 5. a second metal shielding cover plate; 6. radio frequency connector
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, 2, 7 and 8, the high density integrated multi-beam tile assembly of the present invention will now be described. The high-density integrated multi-beam tile type component comprises a printed adapter plate 1 and a multi-channel multi-beam functional module chip 2; the multi-channel multi-beam functional module chips 2 are arranged in a plurality, and the multi-channel multi-beam functional module chips 2 are attached to the printed adapter plate 1.
The multi-channel multi-beam functional module chip 2 comprises a signal amplification functional layer 201, an analog phase shift attenuation layer 202 and a connecting layer 203; the signal amplification functional layer 201 is electrically connected with the printed adapter plate 1 and is used for carrying out amplitude amplification on the component communication information; the analog phase-shift attenuation layer 202 is used for component communication information phase change and amplitude attenuation; the tie layer 203 is arranged between the signal amplification functional layer 201 and the analog phase-shift attenuation layer 202, is electrically connected with the signal amplification functional layer 201 and the analog phase-shift attenuation layer 202 respectively, and is used for signal transmission, power supply and control between the signal amplification functional layer 201 and the analog phase-shift attenuation layer 202;
the printed adapter plate 1 comprises a substrate 101, a multi-beam synthesis network, a beam control circuit and a power supply circuit; the multi-beam synthesis network is arranged on the substrate 101 and comprises a plurality of mutually independent beam networks, and each beam network is electrically connected with the signal amplification functional layer 201 and is used for shunting or combining the radio frequency channel signals connected with the network; the beam control circuit is arranged on the substrate 101, is electrically connected with the signal amplification functional layer 201, and is used for sending a control signal to the amplitude and phase of each channel in the multi-beam assembly according to a system instruction to realize the change of the amplitude and phase of each channel of the assembly; the power supply circuit is disposed on the substrate 101 for power supply connection.
Compared with the prior art, the high-density integrated multi-beam tile type assembly provided by the invention has the advantages that the multi-channel multi-beam function module chips 2 are of a three-dimensional stacked structure, each multi-channel multi-beam function module chip 2 is provided with a structure for amplifying amplitude of communication information of the assembly and a structure for changing phase and attenuating amplitude of the communication information of the assembly, the printed adapter plate 1 is provided with a circuit structure for splitting or combining radio frequency channel signals connected with the network, a circuit structure for changing amplitude and phase of each channel of the assembly and a circuit structure for supplying power, the chip is attached to the printed adapter plate 1, and then the printed adapter plate 1 is matched, so that the high-density integrated multi-beam tile type assembly is complete in function, the functional requirements of multi-channel multi-beam can be met, and the miniaturization, the miniaturization and the multi-beam TR assembly can be realized, The high-density integrated multi-beam tile type component has the advantages of low profile, simplified design and high integration, and is simple to assemble due to the adoption of a surface-mounted process, the scale of the TR component can be adjusted according to actual requirements, and the requirements on the size, weight and universality of a system are met, so that the high-density integrated multi-beam tile type component disclosed by the invention is more widely applied.
Specifically, the multi-channel multi-beam functional module chip 2 in this embodiment may be a surface-mounted module chip with a four-channel multi-beam function.
Specifically, the power supply circuit is used as a connection part between the assembly and an external system power supply, namely, the power supply circuit is connected with a system power supply and a power supply terminal of an internal chip of the assembly to supply required voltage and current to the internal chip of the assembly.
Specifically, the beam control circuit is electrically connected to the broadcast control circuit of the system and the control end of the radio frequency channel amplitude-phase chip in the multi-channel multi-beam functional module chip 2.
Referring to fig. 2 and 4, as an embodiment of the high-density integrated multi-beam tile assembly provided by the present invention, a bonding pad 3 for electrically connecting with the printed interposer 1 is attached to the non-chip surface of the signal amplification functional layer 201. The pad 3 is the circuit of multichannel multi-beam functional module chip 2 and draws forth the end, welds multichannel multi-beam functional module chip 2 wholly on printing keysets 1 through pad 3, realizes module chip's table subsides for the assembly of chip is simple convenient, and assembly structure occupation space is little, improves assembly efficiency, is favorable to the holistic miniaturization of subassembly and simplification.
Referring to fig. 2 and 6, as a specific implementation manner of the embodiment of the present invention, the bonding layer 203 is a square matrix type bonding pad structure. The electrical connection between the signal amplification functional layer 201 and the analog phase shift attenuation layer 202 is realized through a matrix welding spot process, the SIP-type three-dimensional stacking of the multi-channel multi-beam functional module chip 2 is realized, the size of the multi-channel multi-beam functional module chip 2 is greatly reduced, more multi-channel multi-beam functional module chips 2 can be arranged on one printed adapter plate 1, the integral integration degree of the assembly is favorably further improved, and the integral miniaturization of the assembly is further facilitated.
Referring to fig. 2, 3 and 5, a first metal shielding cover plate 4 is welded on the signal amplification functional layer 201, a second metal shielding cover plate 5 is welded on the analog phase shift attenuation layer 202, and a low-loss sealing medium is filled between the signal amplification functional layer 201 and the analog phase shift attenuation layer 202. A concave structure is arranged on the signal amplification functional layer 201, a chip element is arranged in the concave structure, and the first metal shielding cover plate 4 is used for shielding the chip structure; the analog phase shift attenuation layer 202 is provided with a concave structure, a chip element is arranged in the concave structure, and the second metal shielding cover plate 5 is used for shielding the chip structure. The metal cover plate structure occupies a small space, has a good shielding effect, is matched with a low-loss sealing medium to form an air tightness packaging structure, guarantees air tightness and enables the use performance to be stable and reliable.
As a specific implementation manner of the embodiment of the present invention, in order to fully utilize the substrate space, the integration level, and simplify the assembly process, the multi-beam combining network is disposed inside the substrate 101, the beam control circuit is surface-mounted on the substrate 101, and the power supply circuit is surface-mounted on the substrate 101.
Specifically, the beam steering circuit is attached to the back surface of the substrate 101, i.e., the surface shown in fig. 8.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 7, in order to realize the connection between the component and other modules and fully utilize the space on the printed interposer 1, the substrate 101 is further provided with the radio frequency connector 6, the radio frequency connector 6 is distributed on the periphery of the multi-channel multi-beam functional module chip 2, the radio frequency connector 6 is electrically connected to the signal amplification functional layer 201 and is used for being connected to a signal transceiver module (e.g., an antenna) to complete the transmission and transmission of the radio frequency signal of the high-density integrated multi-beam tile component.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 7, wherein the rf connectors 6 are distributed around the periphery of the multi-channel multi-beam functional module chip 2 in a rectangular array, which is beneficial to improving flexibility and expandability of component design.
As a specific implementation of the embodiment of the present invention, the radio frequency connector 6 comprises a subminiature push-on radio frequency coaxial connector (SMP connector). The volume is small, the weight is light, the frequency band is wide, the link is reliable, and the miniaturization and high-integration design of the assembly is facilitated.
As a specific implementation manner of the embodiment of the present invention, please refer to fig. 1 and fig. 7, a plurality of multi-channel multi-beam functional module chips 2 are arranged on the printed adapter board 1 in a rectangular array manner, which is beneficial to the expansion of the components.
As a specific implementation manner of the embodiment of the present invention, the beam control circuit includes a field programmable gate array chip (FPGA chip), a memory chip, and a crystal oscillator and a voltage regulator chip. The field programmable gate array chip is electrically interconnected with the storage chip, the crystal oscillator and the voltage stabilizing chip, the voltage stabilizing chip provides working voltage for the field programmable gate array chip, the crystal oscillator provides clock reference for the field programmable gate array chip, and the storage chip provides data storage for the field programmable gate array chip. The field programmable gate array chip is electrically connected with the multi-channel multi-beam functional module chip and is used for sending the amplitude and phase control command of each channel for controlling the beams of the system.
As a specific implementation manner of the embodiment of the present invention, the signal amplification functional layer 201 and the analog phase shift attenuation layer 202 are both of a multilayer ceramic dielectric substrate structure. The multi-layer ceramic dielectric substrate structure enables the multi-channel multi-beam functional module chip 2 to integrate a plurality of amplifiers and analog amplitude phase multi-channel chips, and in order to improve the integration density, the multi-layer ceramic substrate structure is applied to carry out three-dimensional packaging circuit design on the chips, so that high isolation design among the chips is realized.
The high-density integrated multi-beam tile type component can be widely applied to the field of microwave and millimeter wave phased array satellite communication, and has very wide application value and technical effect of applicability.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A high density integrated multi-beam tile assembly, comprising:
printing a patch panel; and
the multi-channel multi-beam function module chips are arranged in a plurality and are attached to the printed adapter plate;
the multi-channel multi-beam functional module chip includes:
the signal amplification functional layer is electrically connected with the printed adapter plate and is used for carrying out amplitude amplification on the component communication information;
the analog phase-shift attenuation layer is used for phase change and amplitude attenuation of component communication information; and
the linking layer is arranged between the signal amplification functional layer and the analog phase-shift attenuation layer, is respectively electrically connected with the signal amplification functional layer and the analog phase-shift attenuation layer, and is used for signal transmission, power supply and control between the signal amplification functional layer and the analog phase-shift attenuation layer;
the printed interposer includes:
a substrate;
the multi-beam synthesis network is arranged on the substrate and comprises a plurality of mutually independent beam networks, and each beam network is electrically connected with the signal amplification functional layer and is used for shunting or combining the radio frequency channel signals connected with the network;
the beam control circuit is arranged on the substrate, is electrically connected with the signal amplification functional layer and is used for sending a control signal to the amplitude and the phase of each channel in the multi-beam assembly according to a system instruction so as to realize the change of the amplitude and the phase of each channel of the assembly; and
and the power supply circuit is arranged on the substrate and used for power supply connection.
2. The high-density integrated multi-beam tile assembly of claim 1, wherein the non-chip surface of the signal amplification functional layer is affixed with pads for electrical connection to the printed interposer.
3. The high-density integrated multi-beam tile assembly of claim 1, wherein the tie layer is a matrix type spot structure.
4. The high-density integrated multi-beam tile assembly of claim 3, wherein the functional signal amplification layer is welded with a first metallic shielding cover plate, the attenuated analog phase shift layer is welded with a second metallic shielding cover plate, and a low-loss sealing medium is filled between the functional signal amplification layer and the attenuated analog phase shift layer.
5. The high-density integrated multi-beam tile assembly of claim 1, wherein the multi-beam combining network is disposed within the substrate, the beam control circuitry is surface mounted on the substrate, and the power supply circuitry is surface mounted on the substrate.
6. The high-density integrated multi-beam tile assembly of claim 1, wherein the substrate further comprises rf connectors disposed on the periphery of the multi-channel multi-beam functional module chip, the rf connectors being electrically connected to the signal amplification functional layer and configured to connect to the signal transceiver module to complete transmission and reception of rf signals of the high-density integrated multi-beam tile assembly.
7. The high-density integrated multi-beam tile assembly of claim 6, wherein the radio frequency connectors are distributed around the periphery of the multi-channel multi-beam functional module chip in a rectangular array.
8. The high density integrated multi-beam tile assembly of claim 6, wherein the radio frequency connector comprises a subminiature push-in radio frequency coaxial connector.
9. The high density integrated multi-beam tile assembly of any one of claims 1-8 wherein a plurality of the multi-channel multi-beam functional module chips are mounted on the printed interposer in a rectangular array.
10. The high-density integrated multi-beam tile assembly of any one of claims 1-8, wherein the functional signal amplification layer and the analog phase shift attenuation layer are both multilayer ceramic dielectric substrate structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010301234.5A CN111541470A (en) | 2020-04-16 | 2020-04-16 | High density integrated multi-beam tile assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010301234.5A CN111541470A (en) | 2020-04-16 | 2020-04-16 | High density integrated multi-beam tile assembly |
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| CN111541470A true CN111541470A (en) | 2020-08-14 |
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| CN202010301234.5A Pending CN111541470A (en) | 2020-04-16 | 2020-04-16 | High density integrated multi-beam tile assembly |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141708A (en) * | 2021-04-29 | 2021-07-20 | 成都天锐星通科技有限公司 | Multi-beam chip integrated module and phased array system |
| CN113824456A (en) * | 2021-09-14 | 2021-12-21 | 重庆两江卫星移动通信有限公司 | Active multi-beam tile-type phased array receiving assembly |
| CN113839201A (en) * | 2021-11-29 | 2021-12-24 | 成都雷电微力科技股份有限公司 | Thin type phased array antenna structure |
| CN114614855A (en) * | 2022-03-21 | 2022-06-10 | 中国电子科技集团公司第二十研究所 | Tile type multi-channel T/R assembly |
| CN114614275A (en) * | 2022-05-11 | 2022-06-10 | 成都锐芯盛通电子科技有限公司 | HTCC dual-beam tile-type airtight SIP module |
| CN117040561A (en) * | 2023-08-08 | 2023-11-10 | 石家庄烽瓷电子技术有限公司 | Tile type multi-beam system based on HTCC |
-
2020
- 2020-04-16 CN CN202010301234.5A patent/CN111541470A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141708A (en) * | 2021-04-29 | 2021-07-20 | 成都天锐星通科技有限公司 | Multi-beam chip integrated module and phased array system |
| WO2022227763A1 (en) * | 2021-04-29 | 2022-11-03 | 成都天锐星通科技有限公司 | Multi-beam chip integration module and phased array system |
| CN113824456A (en) * | 2021-09-14 | 2021-12-21 | 重庆两江卫星移动通信有限公司 | Active multi-beam tile-type phased array receiving assembly |
| CN113824456B (en) * | 2021-09-14 | 2023-03-21 | 重庆两江卫星移动通信有限公司 | Active multi-beam tile-type phased array receiving assembly |
| CN113839201A (en) * | 2021-11-29 | 2021-12-24 | 成都雷电微力科技股份有限公司 | Thin type phased array antenna structure |
| CN113839201B (en) * | 2021-11-29 | 2022-02-11 | 成都雷电微力科技股份有限公司 | Thin type phased array antenna structure |
| CN114614855A (en) * | 2022-03-21 | 2022-06-10 | 中国电子科技集团公司第二十研究所 | Tile type multi-channel T/R assembly |
| CN114614275A (en) * | 2022-05-11 | 2022-06-10 | 成都锐芯盛通电子科技有限公司 | HTCC dual-beam tile-type airtight SIP module |
| CN114614275B (en) * | 2022-05-11 | 2022-09-20 | 成都锐芯盛通电子科技有限公司 | HTCC dual-beam tile-type airtight SIP module |
| CN117040561A (en) * | 2023-08-08 | 2023-11-10 | 石家庄烽瓷电子技术有限公司 | Tile type multi-beam system based on HTCC |
| CN117040561B (en) * | 2023-08-08 | 2024-04-19 | 石家庄烽瓷电子技术有限公司 | Tile type multi-beam system based on HTCC |
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