CN111533081A - Composite flexible pressure sensor based on bionic microstructure and preparation method thereof - Google Patents

Composite flexible pressure sensor based on bionic microstructure and preparation method thereof Download PDF

Info

Publication number
CN111533081A
CN111533081A CN202010417381.9A CN202010417381A CN111533081A CN 111533081 A CN111533081 A CN 111533081A CN 202010417381 A CN202010417381 A CN 202010417381A CN 111533081 A CN111533081 A CN 111533081A
Authority
CN
China
Prior art keywords
layer
bionic
dome
stage
microstructure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010417381.9A
Other languages
Chinese (zh)
Other versions
CN111533081B (en
Inventor
刘振泽
何井全
钱志辉
田彦涛
梁亮
孙吉
王成喜
程丽丽
王奎霖
于金良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jilin University
Original Assignee
Jilin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jilin University filed Critical Jilin University
Priority to CN202010417381.9A priority Critical patent/CN111533081B/en
Publication of CN111533081A publication Critical patent/CN111533081A/en
Application granted granted Critical
Publication of CN111533081B publication Critical patent/CN111533081B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009Structural features, others than packages, for protecting a device against environmental influences
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/14Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0264Pressure sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention provides a composite flexible pressure sensor based on a bionic microstructure and a preparation method thereof. The pressure sensor is divided into a capacitance layer, a common matrix layer and a piezoresistive layer from top to bottom. The capacitor layer comprises a protective film layer, a first electrode layer, a dielectric layer and a second electrode layer from top to bottom; the piezoresistive layer comprises a transverse electrode layer, a longitudinal electrode layer, a dielectric layer, an interlaced electrode layer and a substrate film from top to bottom. The dielectric layer adopts a double-layer double-stage dome bionic microstructure, and the material is a polymer with adjustable elastic modulus, which is the same as that of the common matrix layer. The dielectric layer adopts a single-layer double-stage dome bionic microstructure, and the material is a nano-scale conductive composite material prepared by filling multi-wall carbon nanotubes (MWCNT) and Carbon Black (CB) into a flexible polymer. The bottom staggered electrode layer adopts a multi-stage S-shaped interconnection wire structure. The invention has the characteristics of high sensitivity, good stability and strong anti-interference performance while ensuring a larger detection range.

Description

Composite flexible pressure sensor based on bionic microstructure and preparation method thereof
Technical Field
The invention belongs to the field of flexible electronics and sensors, and particularly relates to a composite flexible pressure sensor based on a bionic microstructure and a preparation method thereof.
Background
With the continuous development of flexible electronic devices, in order to meet the requirements of the intelligent era, various flexible pressure sensors have been developed worldwide for detecting pressures of different magnitudes. The flexible pressure sensor has the advantages of simple structure, ultra-thin structure, very small mass, variable characteristic and good stability, and is widely applied to the fields of electronic skin, human body physiological signal detection, motion state acquisition, intelligent home, intelligent clothes, intelligent artificial limbs, robot technology and the like.
At present, flexible pressure sensors have been of interest to researchers in terms of sensitivity, pressure detection range, interference immunity, repeatability, stretchability, transparence, and the like. Literature investigations have shown that there are still two major drawbacks to existing flexible tactile sensors: firstly, the detection range of the flexible pressure sensor focusing on tiny pressure detection is generally smaller, and the sensitivity is smaller under high pressure (the pressure in the detection range is larger), so that the development of the flexible pressure sensor in more application fields is limited; secondly, the flexible pressure sensor generally can not collect multi-source signals at the same time, multi-signal detection is mainly realized through planar integration (sensor array) of a plurality of sensors, and a signal processing system is combined to analyze and identify the pressure application position, so that the workload of signal processing is remarkably increased, the integration level of the flexible pressure sensor is reduced, and meanwhile, the cost is further increased due to the fact that a plurality of sensors are manufactured, and a solution is urgently needed.
Therefore, the composite flexible pressure sensor based on the bionic microstructure is developed, and has good comprehensive characteristics of high sensitivity, stability and the like in a large pressure sensing range. The pressure information visualization can be realized by combining the acquired multi-source signals with a signal acquisition and processing system. In the detection process, the same pressure is not required to be applied to the sensor for multiple times, so that the reliability is improved, and the error is reduced. The performance of detecting a plurality of electric signals simultaneously is improved, and application advantages are created for the miniaturized sensor.
Disclosure of Invention
Aiming at the defects of the flexible pressure sensor, the invention provides a composite flexible pressure sensor based on a bionic microstructure and a preparation method thereof. The flexible pressure sensor is integrally designed in a composite structure, and bionic structures are adopted in a dielectric layer and a dielectric layer; the conductive film in the capacitor layer is used as an electrode, the elastic polymer PDMS with the double-layer double-stage dome bionic microstructure is introduced between the first electrode layer and the second electrode layer, and one side of the upper layer with the dome bionic microstructure is mutually contacted with one side of the lower layer with the dome bionic microstructure; the transverse and longitudinal electrode layers, the dielectric layer and the staggered electrode layer in the piezoresistive layer form differential layer distribution, wherein the nanoscale conductive composite material with a single-layer double-stage dome structure is used as the dielectric layer, and the upper-layer multi-stage S-shaped interconnection micron-sized wire, the separation layer and the lower-layer multi-stage S-shaped interconnection micron-sized wire are used as the staggered electrode layer.
The pressure sensor is divided into a capacitance layer, a common matrix layer and a piezoresistive layer from top to bottom. The capacitor layer comprises a protective film layer, a first electrode layer, a dielectric layer and a second electrode layer from top to bottom; the piezoresistive layer comprises a transverse electrode layer, a longitudinal electrode layer, a dielectric layer, an interlaced electrode layer and a substrate film from top to bottom. The dielectric layer adopts a double-layer double-stage dome bionic microstructure, and the material is a polymer with adjustable elastic modulus, which is the same as that of the common matrix layer. The dielectric layer adopts a single-layer double-stage dome bionic microstructure, and the material is a nano-scale conductive composite material prepared by filling multi-wall carbon nanotubes (MWCNT) and Carbon Black (CB) into a flexible polymer. The bottom staggered electrode layer adopts a multi-stage S-shaped interconnection wire structure, so that the influence on an electric signal is obviously reduced when the sensor is bent or twisted to a certain limit, and the extensibility of the flexible pressure sensor is further improved. The materials of the protective film layer and the substrate film are flexible insulating materials with protective functions and respectively cover the top and the bottom of the sensor. The composite flexible pressure sensor based on the bionic microstructure has the characteristics of large detection range, high sensitivity, good stability and strong anti-interference performance. In addition, the sensor can distinguish the position of applying pressure by collecting multi-source signals, and provides wider space for the practical application of the flexible pressure sensor in the aspect of pressure information visualization.
The specific technical scheme of the invention is as follows:
a composite flexible pressure sensor based on a bionic microstructure is divided into a capacitance layer, a common matrix layer and a piezoresistive layer from top to bottom. The capacitor layer comprises a protective film layer 1, a first electrode layer 2, a dielectric layer 3 with a bionic structure and a second electrode layer 4 from top to bottom; the four layers are overlapped in parallel according to the sequence plane; the piezoresistive layer comprises a transverse electrode layer 6, a longitudinal electrode layer 6, a dielectric layer 7 with a bionic structure, an upper multi-stage S-shaped interconnection micron-sized wire 8, a separation layer 9, a lower multi-stage S-shaped interconnection micron-sized wire 10 and a substrate film 11 with a protective effect at the bottom from top to bottom; the staggered electrode layer consists of an upper-layer multi-stage S-shaped interconnection micron-sized wire 8, a separation layer 9 and a lower-layer multi-stage S-shaped interconnection micron-sized wire 10; the dielectric layer 7 is laminated with the transverse and longitudinal electrode layers 6 in the same shape and attached to the lower surface of the common substrate layer 5, and then forms a differential layer distribution with the interleaved electrode layers.
Further, the double-layer double-stage dome bionic microstructure is characterized in that the upper-layer double-stage dome bionic microstructure is opposite to the lower-layer double-stage dome bionic microstructure, the first-stage dome bionic microstructures 12 are regularly distributed and are relatively uniform in height, the average height of the protrusions is 20-40 micrometers, and the average width of the protrusions is 15-20 micrometers; the secondary dome bionic microstructures 13 are randomly distributed on the surface of each primary dome bionic microstructure 12, the height-width ratio of the secondary dome bionic microstructures is close to that of the primary dome bionic microstructures, and the volume of the secondary dome bionic microstructures is 5-6 times smaller than that of the primary dome bionic microstructures.
Further, the single-layer double-stage dome bionic microstructure is opposite to the staggered electrode layers, the first-stage dome bionic microstructure 12 is distributed without gaps and is close in height, the average height of the protrusions is 10-20 microns, and the average width is 10-15 microns; the secondary dome bionic microstructures 13 are randomly distributed on the surface of each primary dome bionic microstructure 12, the height-width ratio of the secondary dome bionic microstructures is close to that of the primary dome bionic microstructures, and the volume of the secondary dome bionic microstructures is 5-6 times smaller than that of the primary dome bionic microstructures.
Furthermore, the thickness of the protective film layer and the thickness of the substrate film layer are 30-50 μm, and the thickness of the electrode film is 150-250 nm.
The invention provides a preparation method of a composite flexible pressure sensor based on a bionic microstructure, which comprises the following steps:
and (3) putting the PDMS solution fully mixed with the prepolymer and the curing agent in a ratio of 10:1 into a vacuum drier, spin-coating the PDMS mixture on the surface of an inverse mould of the single-layer double-stage dome bionic microstructure, curing, stripping, and sputtering and depositing a conductive film on the other side. And manufacturing two single-layer double-stage dome bionic microstructure films with the electrode layers, wherein the dome structures are opposite and any one side is selected to be attached to the flexible insulating protection film layer.
And secondly, spin-coating a positive photoresist AZ6130 with the thickness of 40-50 mu m on the monocrystalline silicon substrate, developing the photoresist film by a photoetching technology, hard-baking and etching to obtain a microstructure mould opposite to the common matrix layer, putting a PDMS solution in which a prepolymer and a curing agent are fully mixed in a ratio of 8:1 into a vacuum drier, and then spin-coating the PDMS mixture on the surface of the reverse film, curing and stripping.
And then, attaching the concave-convex structure side of the public matrix layer obtained in the previous step to a covering grinding tool, and taking down the covering grinding tool after sputtering deposition to obtain the transverse and longitudinal electrode layers. And the MWCNT/CB/PDMS nano composite material solution is coated on the surface of a reverse mould of a single-layer double-stage dome bionic microstructure by scraping, a curing agent is added, then the mixture is placed in a vacuum chamber to extract internal gas, and the internal gas is cured at high temperature and then attached to the transverse and longitudinal electrodes.
And then putting the PDMS solution in which the prepolymer and the curing agent are fully mixed in a ratio of 10:1 into a vacuum dryer, then immersing the PDMS mixture into a reverse mold of a separation layer structure, enabling the liquid level of the mixture solution to be lower than the depth of a groove of the mold, curing, stripping and printing an upper-layer multi-stage S-shaped interconnection silver micron-sized lead on the surface of the mixture solution. And printing the lower-layer multistage S-shaped interconnected silver micron-sized wire on a base film, and attaching the lower-layer multistage S-shaped interconnected silver micron-sized wire to the electrodeless side of the structure obtained in the previous step.
And finally, laminating the obtained structures together in sequence in an up-down corresponding manner, introducing an electrode flexible wire to be connected with the conductive film, and packaging to obtain the composite flexible pressure sensor based on the bionic microstructure.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. the invention adopts a composite structure design, and is a flexible pressure sensor prepared by a micro-structured polymer material, a conductive material and a protective insulating material. The elastic modulus of the common matrix layer is two orders of magnitude higher than that of the upper dielectric layer and the lower dielectric layer, and deformation is not easy to occur under the condition of elasticity. The characteristic that the hardness of the polymer polydimethylsiloxane is adjustable is reasonably utilized, and the process of converting pressure into various electric signals cannot be influenced after the capacitor layer and the piezoresistive layer are assembled together.
2. The two-stage dome structure is a bionic microstructure, the elastic polymer structure is more compact due to deformation of the sensor under pressure, the distance between electrode layers is further reduced, and the contact area is increased, so that a larger electric signal is output. The double-stage dome bionic microstructure increases the friction between double layers and can avoid sliding displacement. The pressure detection device not only can improve the detection capability of the micro pressure, but also can assist the composite structure to further improve the pressure detection range. The problems that a film sensor which pays attention to tiny pressure detection is small in detection range and poor in sensitivity under high pressure are solved.
3. The differential layer distribution structure can convert the pressure signal into a plurality of electric signals for analyzing the size and the position information of the pressure. In addition, the special structure enables sliding displacement to be hardly generated among multiple layers of the sensor, and stability of the flexible pressure sensor in the practical application process is improved.
4. The invention improves the signal acquisition performance and replaces the traditional mode of realizing multi-signal detection by planar integration (sensor array) of a plurality of sensors. On one hand, the functions of the array sensing elements are integrated into the sensor, and miniaturization is realized; on the other hand, the manufacturing process can be simplified, and the cost can be reduced.
5. The composite flexible pressure sensor based on the bionic microstructure has the characteristics of high sensitivity, good stability and strong anti-interference performance while ensuring a larger detection range, and can realize the visualization of pressure information by combining a signal acquisition and processing system. The performance is improved, and the multifunction is realized, so that the application field of the flexible pressure sensor can be further expanded.
Drawings
FIG. 1 is a schematic diagram of a split structure of a composite flexible pressure sensor based on a bionic microstructure.
FIG. 2 is a cross-sectional view of an inner piezoresistive layer of the composite flexible pressure sensor based on a bionic microstructure along an XOZ plane.
FIG. 3 is a structural schematic diagram of a dome bionic microstructure with primary microspheres distributed in a regular array.
FIG. 4 is a schematic diagram of a bionic microstructure of a double-stage dome of a composite flexible pressure sensor based on the bionic microstructure.
FIG. 5 is a schematic structural diagram of a dome bionic microstructure with gapless array distribution of primary microspheres.
FIG. 6 is a schematic diagram of a multi-level "S" type interconnection micron-sized wire.
FIG. 7 is a cross-sectional view of the present invention with localized stress on the flexible pressure sensor.
FIG. 8 is a top view of a bottom staggered electrode layer of the composite flexible pressure sensor based on the bionic microstructure.
Fig. 9a. schematic analysis diagram based on sensor bottom with lateral electrodes.
Figure 9b. schematic analysis diagram based on sensor bottom with longitudinal electrodes.
In fig. 9a and 9 b: the thick solid line is a multilevel S-shaped interconnection micron-scale wire, and the part of one end of the thick solid line is thinned and can be regarded as an appropriate value R01-4 represents the region of local compressive deformation causing resistance value variation
In the figure: 1. the multilayer bionic micro-structure comprises a protective film layer, 2, a first electrode layer, 3, a dielectric layer, 4, a second electrode layer, 5, a common matrix layer, 6, transverse and longitudinal electrode layers, 7, a dielectric layer, 8, an upper-layer multi-stage S-shaped interconnection micron-sized lead, 9, a separation layer, 10, a lower-layer multi-stage S-shaped interconnection micron-sized lead, 11, a substrate film, 12, a first-stage dome bionic micro-structure, 13, a second-stage dome bionic micro-structure
Detailed Description
The following detailed description of the embodiments of the present invention will make the objects, technical solutions, features, etc. of the present invention more clearly understood and easily understood by referring to the accompanying drawings, and the examples are only for explaining the present invention and selecting preferred materials to describe the preparation method in detail, but not for limiting the present invention.
Reference is made to fig. 1, which is a schematic view illustrating a split structure of a composite flexible pressure sensor based on a bionic microstructure according to the present invention. The multilayer thin film transistor sequentially comprises a protective thin film layer 1, a first electrode layer 2, a dielectric layer 3, a second electrode layer 4, a common matrix layer 5, transverse and longitudinal electrode layers 6, a dielectric layer 7, an upper-layer multistage S-shaped interconnection micron-sized lead 8, a separation layer 9, a lower-layer multistage S-shaped interconnection micron-sized lead 10 and a substrate thin film 11 from top to bottom. The interleaved electrode layer is composed of upper multi-level S-shaped interconnected micron-sized wires 8, a separation layer 9 and lower multi-level S-shaped interconnected micron-sized wires 10. The dielectric layer 3 is provided with a double-layer double-stage dome bionic microstructure, and one side of each layer with the double-stage dome bionic microstructure is mutually contacted. The dielectric layer 7 has a single-layer double-stage dome bionic microstructure, and one side with the double-stage dome bionic microstructure faces the staggered electrode layer, and the partial cross-sectional structure is shown in fig. 2.
The bionic microstructure of the double-layer double-stage dome of the capacitor layer is characterized in that the bionic microstructure 12 of the first-stage dome is regularly distributed and relatively uniform in height, as shown in the attached figure 3, the average height of the protrusions is 20-40 micrometers, and the average width of the protrusions is 15-20 micrometers. The secondary dome bionic microstructures 13 are randomly distributed on the surface of each primary dome bionic microstructure, and refer to the attached figure 4. The average height of the protrusions is 3 to 6 μm, and the average width is 2 to 3 μm. The bionic microstructure of the single-layer double-stage dome of the piezoresistive layer is in gapless distribution and close in height, and as shown in the attached figure 5, the average height is 10-20 microns, and the average width is 10-15 microns. Similarly, the secondary dome bionic microstructures are randomly distributed on the surface of each primary dome bionic microstructure, the average height of the protrusions is 2-3 micrometers, and the average width of the protrusions is 1-2 micrometers. The thicknesses of the protective film layer and the substrate film are 30-50 mu m, the thickness of the conductive film deposited by sputtering is 150-250 nm, and the thickness of the middle common matrix layer is 40-80 mu m. Referring to FIG. 6, the multi-level S-shaped interconnection micron-sized conductive line has an overall line width of 50-100 μm and a height of 500-700 nm.
The working principle of the invention is as follows:
the two-stage dome biomimetic microstructure of the present invention is suggested by the facial skin structure and the integumentary sensory organs of the vertebrate, naemarkia alligator, which has excellent mechanical perceptibility.
Vertebrates have a rich sensory organ and, in combination with different surface structures, can exhibit a very strong overall sensitivity to a variety of stimuli. In the case of pressure stimulation, it is possible to have a high sensitivity to pressure within a specific range, and to instantaneously identify and respond to the pressure-stimulated part of the body. The method depends on a plurality of vertebrate sensory receptors which are distributed on the face, the oral cavity, the skin and other positions in a discrete way, and the south American Karman crocodile is particularly sensitive to pressure stimulation and can accurately locate the prey through tiny pressure waves on the water surface.
Research shows that the skin of the south American Kaimen crocodile comprises a plurality of tiny sense organs with discrete head and face, the sense organs are similar in size, are in the shape of a micro dome or a micro dome, and are distributed in a large number and in a wide range. The outer stratum corneum of the region containing these tiny sense organs is thinner and increases sensitivity to pressure without losing protective function. In particular, there are randomly distributed on the face/mandible of the crocodile nammayu a plurality of small dome-like structures of different grades, and on each dome-like structure there are also randomly distributed a plurality of tiny sense organs. When the head of the crocodile floats on the water surface in a semi-floating mode, the large-small double-stage structure increases the contact area of the crocodile and the water, and further increases the sensitivity to tiny pressure waves on the water surface. Multiple tiny sense organs form a highly resolved pressure sensing array, allowing the location of a game to be ascertained.
Based on the facial skin structure and the cortex sensory organ characteristics of the crocodile namcei, the invention designs the upper dielectric layer and the lower dielectric layer into a double-stage micro-dome structure. In detail, when the sensor of the present invention is subjected to external stress, the sensor is deformed as shown in fig. 7, and PDMS can change its elasticity by adjusting the ratio of the curing agent to the raw solution and the curing time, that is, the more the curing agent is added, the harder the curing, the ratio and hardness thereof conform to a logarithmic curve, so that the dielectric layer and the dielectric layer are preferentially deformed. External pressure can be simply divided into low pressure and high pressure for the sensor, and when the sensor bears very low pressure, the deformation contact occurs to the primary structure after the secondary structure in the double-layer double-stage dome bionic microstructure contacts, so that the face-to-face elastic polymer structure is tighter, the distance between the first electrode layer and the second electrode layer is further reduced, and therefore, larger electric signal output is realized. This takes full advantage of the high sensitivity, low hysteresis and high stability of the capacitive layer. When the sensor bears higher pressure and the change curve of the pressure and the electric signal of the capacitance layer is almost close to horizontal saturation, the piezoresistive layer can help to overcome the defect and share a part of pressure to generate corresponding deformation. The secondary structure in the single-layer double-stage dome bionic microstructure is in deformation contact with the staggered electrodes, so that the sensitivity of the piezoresistive layer is improved, the contact area between each microstructure and the staggered electrodes can be further increased, the nano composite material can form more complex conductive paths, and larger electric signal output is realized. And acquiring two layers of changed electric signals respectively, and acquiring pressure information after analysis and processing. In fact, the piezoresistive layer can not only provide a plurality of signals for visualizing pressure information, but also play an auxiliary role in the aspect of expanding the detection range of the sensor and keeping higher sensitivity.
Under the condition, for the capacitance layer comprising the double-layer double-stage dome bionic microstructure, the relative elastic PDMS microstructure is tighter under the applied external stress, namely the dielectric constant is indirectly increasedrAnd the distance d between the first electrode layer and the second electrode layer becomes smaller. Thus changing the capacitance of the circuit as described by the following calculation formula. For the special case of micro pressure, the secondary dome bionic microstructure can be preferentially contacted and deformed to cause capacitance change.
Figure BDA0002495534700000061
The capacitance C is closely dependent on the dielectric constant of the interlayer materialrThe effective electrode area A and the distance d between the two plate electrodes,0is the dielectric constant in vacuum.
In this case, for the piezoresistive layer containing the single-layer double-stage dome bionic microstructure, the dielectric layer is deformed under stress, the contact area between each microstructure and the staggered electrode layer is increased, and meanwhile, the nanocomposite can form a certain complex conductive path. In fact, compressive deformation causes an increase in the contact area and a decrease in the thickness of the nanocomposite and indirectly increases the overall resistivity, thus changing the resistance of the circuit as described by the following calculation formula.
Figure BDA0002495534700000062
The resistance is closely dependent on the cross-sectional area B between the nanocomposite layer and the electrode and the total thickness m of the nanocomposite layer, ρ being the resistivity.
When the sensor is subjected to external pressure, the pressure information can be converted into a plurality of electrical signal changes. Signals collected by a first electrode and a second electrode in the capacitance layer are changed into electric signals 1, signals collected by the transverse electrode and the staggered electrode layer A1 end in the piezoresistive layer are changed into electric signals 2, signals collected by the transverse electrode and the staggered electrode layer A2 end are changed into electric signals 3, signals collected by the staggered electrode layer A1 end and the staggered electrode layer A2 end are changed into electric signals 4, and signals collected by the longitudinal electrode and the staggered electrode layer B1 end are changed into electric signals 5. Signals collected at the ends of the longitudinal electrodes and the staggered electrode layer B2 are changed into electric signals 6, and signals collected at the ends of the staggered electrode layer B1 and the ends of the staggered electrode layer B2 are changed into electric signals 7, which is shown in the attached figures 8 and 9.
The following detailed analysis illustrates the principles of the pressure information visualization function:
the comprehensive performance index is an important factor for determining the application field of the flexible pressure sensor, and the pressure information visualization function is a supplement to the good performance index, so that the application field of the sensor can be further expanded. The improvement of the signal acquisition performance is the basis for realizing the pressure information visualization function, so that the comprehensive performance is improved, multi-source signals can be acquired, and two groups of electric signals obtained by a differential layer distribution structure are combined with a signal acquisition and processing system, so that the pressure information visualization function is realized.
The bottom piezoresistive layer structure design of the invention actually divides the plane of the sensor into 9 areas, when the local pressure deforms, referring to the attached figure 7, the upper electric signal 2, the electric signal 3 and the electric signal 4 determine the position information of the pressure in the X-axis coordinate direction, and the lower electric signal 5, the electric signal 6 and the electric signal 7 determine the position information of the pressure in the Y-axis coordinate direction. The magnitude of the pressure needs to be determined by comprehensive analysis of the change of all electric signals of the sensor. How to determine the position information will be explained in detail below by taking the X-axis coordinate as an example, referring to fig. 9a and 9b (solid line is the lower electrode to which the proper value R is coupled)0Calculated resistance of, in fact, calculated resistance R0A local resistance value increase by reducing the cross-sectional area of the wire, and a resistance is not connected in series between the wires)The corresponding electric signal, namely the resistance in the initial state is approximately equal to the sum of the resistance value of the proper value resistor and the resistance of the microstructure. When the sensor is subjected to external pressure at the elliptical position, the resistance between the upper and lower electrodes at the elliptical position changes, the on-resistance decreases as the pressure increases, and the resulting resistance value changes in a range of R0And between approximately zero ohms (R)0The actual resistance value is less than or equal to 0). The pressure reaches a value such that the resistance is sufficiently small that measuring the resistance between a1 and a2 will cause the calculated resistance at the corresponding location to be shorted. From the perspective of the two-dimensional coordinate information for determining pressure alone, the greater the local pressure on the externally applied sensor, the closer the determined result is to the ideal value.
Examples
The preparation method of the composite flexible pressure sensor based on the bionic microstructure specifically comprises the following steps:
the method comprises the following steps: the PDMS solution obtained by fully mixing the prepolymer and the curing agent in a ratio of 10:1 is put into a vacuum drier, so that bubbles generated in the PDMS mixture in the stirring process can be removed. Then, the PDMS mixture is coated on the surface of a reverse mould of the single-layer double-stage dome bionic microstructure in a spin mode, the forward rotating speed is 1000r/min, the forward rotating speed lasts 45s, the backward rotating speed is 5000r/min, and the backward rotating speed lasts 50 s;
step two: curing the PDMS solution at 100 deg.C for 50 min, and peeling to obtain PDMS film with thickness of about 60 μm on one side of the dielectric layer 3 shown in FIG. 1;
step two: curing the PDMS solution for 50 minutes at the temperature of 100 ℃, stripping to obtain a PDMS film, and performing the third step: plating an electrode film on the smooth side of the PDMS film by a radio frequency sputtering method, wherein the radio frequency current is 100mA, the sputtering time is 5 minutes, the target material is a copper target material, and the thickness of the obtained electrode film is about 200 nm;
step four: cleaning and drying the surface of the monocrystalline silicon substrate, and then spin-coating a positive photoresist (AZ6130) with the thickness of 40-50 μm on the surface of the monocrystalline silicon substrate, wherein the spin-coating process conditions are forward rotation lasting for 15s, the rotating speed is 1500r/min, and backward rotation lasting for 40s, and the rotating speed is 2000 r/min. And sequentially carrying out soft baking, alignment exposure, post baking, development, hard baking and etching to obtain the micro-structure mold with the opposite common matrix layer 5. Putting the PDMS solution fully mixed by the prepolymer and the curing agent according to the proportion of 8:1 into a vacuum drier, spin-coating the PDMS mixture on the surface of a reverse mould, wherein the forward rotation speed is 1000r/min, the continuous rotation speed is 45s, the backward rotation speed is 5000r/min, and the continuous rotation speed is 50 s; curing and stripping under the same conditions as in the second step to obtain a common matrix layer 5;
step five: and C, attaching the concave-convex structure side of the public matrix layer obtained in the step four to the masking grinding tool, and depositing a copper film on the surface of the masking grinding tool through sputtering, wherein the thickness of the copper film is about 200 nm. Then taking down the covering grinding tool to obtain a transverse electrode layer 6 and a longitudinal electrode layer 6;
step six: repeating the first step, the second step and the third step, wherein one sides of the two prepared films with the two-stage dome bionic microstructure are opposite, and the two prepared films are laminated between a flexible Polyimide (PI) film and a common matrix layer, so that the manufacturing of the capacitance layer of the composite flexible pressure sensor based on the bionic microstructure is completed;
step seven: the preparation method comprises the following steps of (1) coating a PDMS nano composite material solution with the content of 8% MWCNT and 3% CB particles on the surface of a reverse mould of a single-layer double-stage dome bionic microstructure by scraping, curing for 30 minutes at 100 ℃, stripping from the mould, and attaching the nano composite membrane on transverse and longitudinal electrodes after the nano composite membrane is completely cured;
step eight: placing the PDMS solution obtained by mixing the prepolymer and the curing agent in a ratio of 10:1 into a vacuum drier, then making the PDMS mixture invade into a counter mold with a partition layer structure, making the liquid level of the mixture solution lower than the depth of the mold groove and have a thickness of about 30 μm, curing under the same conditions as in the second step, and stripping
Step nine: adopting an ink-jet printing technology on the surface of the structure obtained in the step eight, directly printing the nano silver ink to prepare an upper-layer multi-stage S-shaped interconnected silver micron-sized wire 8, and referring to the attached drawings 1 and 5;
step ten: printing and preparing a lower-layer multi-stage S-shaped interconnected silver micron-sized lead 10 on the upper surface of the flexible Polyimide (PI) substrate film by referring to the attached drawings 1 and 5, and attaching the lead to the side without the electrode of the structure obtained in the sixth step;
step eleven: and introducing an electrode flexible wire connected with the conductive film, and finally correspondingly packaging the obtained structure from top to bottom in sequence to obtain the composite flexible pressure sensor based on the bionic microstructure.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (9)

1. The utility model provides a combined type flexible pressure sensor based on bionic microstructure which characterized in that from the top down divide into electric capacity layer, public matrix layer and piezoresistive layer, and wherein, electric capacity layer from the top down includes: the bionic electrode comprises a protective film layer (1), a first electrode layer (2), a dielectric layer (3) with a bionic structure and a second electrode layer (4); the four layers are overlapped in parallel according to the sequence plane; the piezoresistive layer comprises from top to bottom: the bionic electrode comprises transverse and longitudinal electrode layers (6), a dielectric layer (7) with a bionic structure, an upper-layer multi-stage S-shaped interconnection micron-sized lead (8), a separation layer (9), a lower-layer multi-stage S-shaped interconnection micron-sized lead (10) and a substrate film (11) with a protective effect at the bottom; the staggered electrode layer consists of an upper-layer multi-stage S-shaped interconnection micron-sized lead (8), a separation layer (9) and a lower-layer multi-stage S-shaped interconnection micron-sized lead (10); the dielectric layer (7) and the transverse and longitudinal electrode layers (6) are superposed in the same shape and attached to the lower surface of the common substrate layer (5); the transverse and longitudinal electrode layers (6), the dielectric layer (7) and the staggered electrode layers form a differential layer distribution;
the differential layers are distributed, the cross section of the differential layers is that two layers of microstructures are mutually alternated at different heights, and the electrical signals collected by the piezoresistive layers can be divided into two groups; the upper layer electric signal is used for determining the position information of the applied pressure in the X-axis direction, and the lower layer electric signal is used for determining the position information of the applied pressure in the Y-axis direction.
2. The composite flexible pressure sensor based on the bionic microstructure as claimed in claim 1, wherein the dielectric layer (3) adopts a double-layer double-stage dome bionic microstructure, the upper double-stage dome bionic microstructure is opposite to the lower double-stage dome bionic microstructure, the first-stage dome bionic microstructures (12) are regularly distributed and relatively uniform in height, the average height of the protrusions is 20-40 μm, and the average width is 15-20 μm; the secondary dome bionic microstructures (13) are randomly distributed on the surface of each primary dome bionic microstructure (12), the height-width ratio of the secondary dome bionic microstructures is close to that of the primary dome bionic microstructures, and the volume of the secondary dome bionic microstructures is 5-6 times smaller than that of the primary dome bionic microstructures.
3. The composite flexible pressure sensor based on the bionic microstructure according to claim 1 or 2, wherein the dielectric layer (7) adopts a single-layer double-stage dome bionic microstructure, the dome bionic microstructure is opposite to the staggered electrode layer, the first-stage dome bionic microstructures (12) are distributed without gaps and have close heights, the average height of the protrusions is 10-20 μm, and the average width is 10-15 μm; the secondary dome bionic microstructures (13) are randomly distributed on the surface of each primary dome bionic microstructure (12), the height-width ratio of the secondary dome bionic microstructures is close to that of the primary dome bionic microstructures, and the volume of the secondary dome bionic microstructures is 5-6 times smaller than that of the primary dome bionic microstructures.
4. The composite flexible pressure sensor based on the bionic microstructure as claimed in claim 3, wherein the thickness of the protective film layer (1) and the base film (11) is 30-50 μm; the materials of the dielectric layer (3) and the common matrix layer (5) are selected from Polydimethylsiloxane (PDMS).
5. The composite flexible pressure sensor based on bionic microstructures according to claim 1, wherein the staggered electrode layers are of a multi-stage S-shaped interconnection wire structure, a small section of the cross-sectional area of the top end of the S-shaped wire at one stage is smaller than that of the other parts, and wires at the other stages are distributed in a normal S shape.
6. The composite flexible pressure sensor based on bionic microstructure as claimed in claim 2, wherein the piezoresistive layer divides the sensor into 9 regions, and the signal processing system is combined to determine the position information of local pressure; the contact between the double-layer double-stage dome bionic microstructures is dome-to-dome or dome-to-groove.
7. A preparation method of a composite flexible pressure sensor based on a bionic microstructure is characterized by comprising the following steps:
the method comprises the following steps: putting a PDMS solution in which a prepolymer and a curing agent are fully mixed in a ratio of 10:1 into a vacuum drier, spin-coating a PDMS mixture on the surface of an inverse mould of the single-layer double-stage dome bionic microstructure, curing and stripping, and sputtering and depositing a conductive film on the other side;
step two: manufacturing two single-layer double-stage dome bionic microstructures with electrode layers in the first step, wherein the double-stage dome bionic microstructures are opposite and any one side of the double-stage dome bionic microstructures is selected to be attached to the flexible insulating protection film layer;
step three: spin-coating a positive photoresist AZ6130 with the thickness of 40-50 mu m on a monocrystalline silicon substrate, developing the photoresist film by a photoetching technology, hard-baking and etching to obtain a microstructure mould with an opposite public matrix layer (5), putting a PDMS solution in which a prepolymer and a curing agent are fully mixed in a ratio of 8:1 into a vacuum drier, then spin-coating the PDMS mixture on the surface of a reverse film, curing and stripping;
step four: attaching the concave-convex structure side of the public matrix layer (5) obtained in the step three to a covering grinding tool, and taking down the covering grinding tool after sputtering deposition to obtain a transverse electrode layer (6) and a longitudinal electrode layer (6);
step five: the nano composite material solution is coated on the surface of a reverse mould of the single-layer double-stage dome bionic microstructure in a scraping way, is added with a curing agent, is placed in a vacuum chamber to extract internal gas, is cured at high temperature and is attached to the transverse and longitudinal electrodes;
step six: putting a PDMS solution in which a prepolymer and a curing agent are fully mixed in a ratio of 10:1 into a vacuum dryer, then, immersing a PDMS mixture into a reverse mold of a separation layer structure, enabling the liquid level of the mixture solution to be lower than the depth of a groove of the mold, curing, stripping and printing an upper-layer multi-stage S-shaped interconnected silver micron-sized lead (8) on the surface of the mixture solution;
step seven: printing a lower-layer multistage S-shaped interconnection silver micron-sized lead (10) on a base film, and attaching the lower-layer multistage S-shaped interconnection silver micron-sized lead to the electrodeless side of the structure obtained in the sixth step;
step eight: and finally, laminating the structures obtained in the second step, the fifth step and the seventh step together in sequence in an up-down corresponding manner, introducing an electrode to be connected with a conductive film, and packaging to obtain the composite flexible pressure sensor based on the bionic microstructure.
8. The method of claim 7, wherein the thickness of the conductive film deposited by sputtering in the first step is 150-250 nm.
9. The method according to claim 7, wherein the spin-coating photoresist AZ6130 in the third step has the following spin-coating process conditions: the forward rotation lasts for 15s, the rotating speed is 1500r/min, the backward rotation lasts for 40s, and the rotating speed is 2000 r/min; the spin coating process conditions of the liquid PDMS are as follows: the forward rotation lasts for 45s, the rotating speed is 1000r/min, the backward rotation lasts for 50s, and the rotating speed is 5000 r/min; the PDMS solution curing conditions were 50 minutes at 100 ℃.
CN202010417381.9A 2020-05-18 2020-05-18 Composite flexible pressure sensor based on bionic microstructure and preparation method thereof Active CN111533081B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010417381.9A CN111533081B (en) 2020-05-18 2020-05-18 Composite flexible pressure sensor based on bionic microstructure and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010417381.9A CN111533081B (en) 2020-05-18 2020-05-18 Composite flexible pressure sensor based on bionic microstructure and preparation method thereof

Publications (2)

Publication Number Publication Date
CN111533081A true CN111533081A (en) 2020-08-14
CN111533081B CN111533081B (en) 2022-07-05

Family

ID=71972049

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010417381.9A Active CN111533081B (en) 2020-05-18 2020-05-18 Composite flexible pressure sensor based on bionic microstructure and preparation method thereof

Country Status (1)

Country Link
CN (1) CN111533081B (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112202366A (en) * 2020-10-29 2021-01-08 吉林大学 Low-frequency ultralow-wind-speed flexible wind power converter and preparation method thereof
CN112577643A (en) * 2020-12-11 2021-03-30 武汉大学 Wide-range capacitive flexible sensor for realizing triaxial force measurement
CN112834087A (en) * 2021-01-06 2021-05-25 武汉大学 Double-layer flexible pressure sensor and preparation method thereof
CN113029321A (en) * 2021-02-26 2021-06-25 中国兵器工业集团第二一四研究所苏州研发中心 Capacitive MEMS vector acoustic wave sensor capable of inhibiting vibration interference and processing method thereof
CN113138042A (en) * 2021-04-30 2021-07-20 温州大学 Capacitive flexible pressure sensor of PDMS-PS polymer dielectric and manufacturing process thereof
CN113155327A (en) * 2021-03-30 2021-07-23 中国科学院深圳先进技术研究院 Bionic microarray flexible electrode, preparation method thereof and flexible pressure sensor
CN113541527A (en) * 2021-06-27 2021-10-22 西北工业大学 Composite flexible actuator based on electrothermal material/dielectric elastic polymer and method
CN113545855A (en) * 2021-05-31 2021-10-26 中国科学院自动化研究所 Force detection system and method applied to vascular interventional operation
CN113570676A (en) * 2021-08-19 2021-10-29 北京京东振世信息技术有限公司 Counting method and device
CN113865754A (en) * 2021-10-15 2021-12-31 北方工业大学 Flexible sensing unit capable of detecting multi-level force and manufacturing method
CN113945305A (en) * 2021-10-18 2022-01-18 安徽大学 Capacitive flexible touch sensor based on hierarchical inclined micro-cylinder structure
CN114354030A (en) * 2021-12-07 2022-04-15 之江实验室 Wide-range flexible pressure sensor with modulus gradient microstructure and preparation method
CN114414108A (en) * 2022-01-18 2022-04-29 清华大学 Flexible pressure sensor provided with microstructures and method for manufacturing same
CN114623958A (en) * 2022-02-25 2022-06-14 武汉大学 Flexible touch sensor based on electrode array and preparation method thereof
WO2022204932A1 (en) * 2021-03-30 2022-10-06 中国科学院深圳先进技术研究院 Bionic microarray flexible electrode and preparation method therefor, and flexible pressure sensor
CN115406856A (en) * 2022-09-13 2022-11-29 吉林大学 Heat radiation detection type bionic infrared sensing element and preparation method thereof
TWI795104B (en) * 2021-11-30 2023-03-01 財團法人工業技術研究院 Physiological sensing device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140104751A1 (en) * 2012-06-15 2014-04-17 Ellen T. Chen Nanobiomimetic Supercapacitors with High Rate High Energy Storage
US20160033343A1 (en) * 2014-08-01 2016-02-04 The Board Of Trustees Of The Leland Stanford Junior University Methods and apparatus concerning multi-tactile sensitive (e-skin) pressure sensors
CN108007617A (en) * 2017-12-05 2018-05-08 浙江大学 Pressure resistance type flexible touch sensation sensor and its manufacture method with micro- frustum of a cone substrate
CN108225620A (en) * 2017-12-22 2018-06-29 江苏大学 A kind of flexible touch sensation sensor with multi-layer structure and preparation method thereof
CN108474697A (en) * 2015-12-15 2018-08-31 D·卢塞 Conducing composite material
CN110082010A (en) * 2019-03-29 2019-08-02 中国科学院电子学研究所 Flexible touch sensation sensor array and array scanning system applied to it
CN110329986A (en) * 2019-06-24 2019-10-15 华中科技大学 A kind of Bionic flexible force snesor and preparation method thereof
WO2020087027A1 (en) * 2018-10-26 2020-04-30 The Board Of Trustees Of The Leland Stanford Junior University Sensor apparatus for normal and shear force differentiation

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140104751A1 (en) * 2012-06-15 2014-04-17 Ellen T. Chen Nanobiomimetic Supercapacitors with High Rate High Energy Storage
US20160033343A1 (en) * 2014-08-01 2016-02-04 The Board Of Trustees Of The Leland Stanford Junior University Methods and apparatus concerning multi-tactile sensitive (e-skin) pressure sensors
CN108474697A (en) * 2015-12-15 2018-08-31 D·卢塞 Conducing composite material
CN108007617A (en) * 2017-12-05 2018-05-08 浙江大学 Pressure resistance type flexible touch sensation sensor and its manufacture method with micro- frustum of a cone substrate
CN108225620A (en) * 2017-12-22 2018-06-29 江苏大学 A kind of flexible touch sensation sensor with multi-layer structure and preparation method thereof
WO2020087027A1 (en) * 2018-10-26 2020-04-30 The Board Of Trustees Of The Leland Stanford Junior University Sensor apparatus for normal and shear force differentiation
CN110082010A (en) * 2019-03-29 2019-08-02 中国科学院电子学研究所 Flexible touch sensation sensor array and array scanning system applied to it
CN110329986A (en) * 2019-06-24 2019-10-15 华中科技大学 A kind of Bionic flexible force snesor and preparation method thereof

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112202366A (en) * 2020-10-29 2021-01-08 吉林大学 Low-frequency ultralow-wind-speed flexible wind power converter and preparation method thereof
CN112577643A (en) * 2020-12-11 2021-03-30 武汉大学 Wide-range capacitive flexible sensor for realizing triaxial force measurement
CN112834087B (en) * 2021-01-06 2022-02-01 武汉大学 Double-layer flexible pressure sensor and preparation method thereof
CN112834087A (en) * 2021-01-06 2021-05-25 武汉大学 Double-layer flexible pressure sensor and preparation method thereof
CN113029321A (en) * 2021-02-26 2021-06-25 中国兵器工业集团第二一四研究所苏州研发中心 Capacitive MEMS vector acoustic wave sensor capable of inhibiting vibration interference and processing method thereof
CN113029321B (en) * 2021-02-26 2023-08-04 中国兵器工业集团第二一四研究所苏州研发中心 Capacitive MEMS vector acoustic wave sensor capable of inhibiting vibration interference and processing method thereof
CN113155327A (en) * 2021-03-30 2021-07-23 中国科学院深圳先进技术研究院 Bionic microarray flexible electrode, preparation method thereof and flexible pressure sensor
WO2022204932A1 (en) * 2021-03-30 2022-10-06 中国科学院深圳先进技术研究院 Bionic microarray flexible electrode and preparation method therefor, and flexible pressure sensor
CN113138042A (en) * 2021-04-30 2021-07-20 温州大学 Capacitive flexible pressure sensor of PDMS-PS polymer dielectric and manufacturing process thereof
CN113545855A (en) * 2021-05-31 2021-10-26 中国科学院自动化研究所 Force detection system and method applied to vascular interventional operation
CN113541527A (en) * 2021-06-27 2021-10-22 西北工业大学 Composite flexible actuator based on electrothermal material/dielectric elastic polymer and method
CN113541527B (en) * 2021-06-27 2023-10-27 西北工业大学 Composite flexible actuator based on electrothermal material and dielectric elastic polymer and method
CN113570676B (en) * 2021-08-19 2023-11-03 北京京东振世信息技术有限公司 Counting method and device
CN113570676A (en) * 2021-08-19 2021-10-29 北京京东振世信息技术有限公司 Counting method and device
CN113865754A (en) * 2021-10-15 2021-12-31 北方工业大学 Flexible sensing unit capable of detecting multi-level force and manufacturing method
WO2023065540A1 (en) * 2021-10-18 2023-04-27 安徽大学 Capacitive flexible tactile sensor based on graded inclined micro-cylindrical structure
CN113945305A (en) * 2021-10-18 2022-01-18 安徽大学 Capacitive flexible touch sensor based on hierarchical inclined micro-cylinder structure
TWI795104B (en) * 2021-11-30 2023-03-01 財團法人工業技術研究院 Physiological sensing device
CN114354030A (en) * 2021-12-07 2022-04-15 之江实验室 Wide-range flexible pressure sensor with modulus gradient microstructure and preparation method
WO2023138195A1 (en) * 2022-01-18 2023-07-27 清华大学 Flexible pressure sensor provided with microstructure and manufacturing method therefor
CN114414108A (en) * 2022-01-18 2022-04-29 清华大学 Flexible pressure sensor provided with microstructures and method for manufacturing same
CN114623958A (en) * 2022-02-25 2022-06-14 武汉大学 Flexible touch sensor based on electrode array and preparation method thereof
CN114623958B (en) * 2022-02-25 2023-06-20 武汉大学 Flexible touch sensor based on electrode array and preparation method thereof
CN115406856A (en) * 2022-09-13 2022-11-29 吉林大学 Heat radiation detection type bionic infrared sensing element and preparation method thereof

Also Published As

Publication number Publication date
CN111533081B (en) 2022-07-05

Similar Documents

Publication Publication Date Title
CN111533081B (en) Composite flexible pressure sensor based on bionic microstructure and preparation method thereof
CN106197774B (en) Flexible piezoresistive tactile sensor array and preparation method thereof
CN110082010A (en) Flexible touch sensation sensor array and array scanning system applied to it
CN109752029B (en) Preparation method of paper-based capacitive flexible sensor
CN106568539A (en) Polymer substrate-based monolithic integrated temperature and humidity flexible sensor and preparation method
CN204924512U (en) Three -dimensional electric capacity sense of touch sensing array of floating electrode formula
CN109406012A (en) A kind of threedimensional haptic sensor array of flexible piezoelectric formula and preparation method thereof
CN107588872A (en) Three-dimensional force flexible touch sensation sensor based on conductive fabric
CN111297321A (en) Transparent flexible sensor, preparation method thereof, electronic skin and wearable device
CN111693189B (en) Novel flexible force-sensitive sensor and preparation method thereof
CN106092384A (en) Capacitance type pressure sensor and preparation method thereof
US11784587B2 (en) Electronic sensing apparatus and a method of producing the electronic sensing apparatus
Zou et al. Highly sensitive flexible pressure sensor based on ionic dielectric layer with hierarchical ridge microstructure
CN111473904A (en) Integrated flexible three-dimensional force touch sensor and manufacturing method thereof
Gao et al. Highly conductive and stretching-insensitive films for wearable accurate pressure perception
CN112504518A (en) Flexible capacitive pressure sensor and preparation method thereof
CN112378552A (en) Multi-layer electronic skin
CN110849508B (en) Flexible pressure sensor based on discrete contact structure and preparation method thereof
CN112429700A (en) Preparation method of flexible pressure sensor with pressure-sensitive structure
CN113340480A (en) Flexible pressure sensor and preparation method thereof
CN201051025Y (en) An array piezoelectric sensing device
Lü et al. Multilayer microstructured high-sensitive ultrawide-range flexible pressure sensor with modulus gradient
CN115356007A (en) Temperature and pressure dual-mode sensing unit, preparation method and sensor prepared by temperature and pressure dual-mode sensing unit
CN108557759A (en) High-performance flexible touch force sensor and preparation method thereof
CN109916292A (en) A kind of preparation method of multi-layer capacity formula flexible intelligent wearable sensors part

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant