CN111519144B

CN111519144B - Target holder applied to pulse laser codeposition and mounting method

Info

Publication number: CN111519144B
Application number: CN202010424391.5A
Authority: CN
Inventors: 郁彩艳; 白莹; 赵慧玲; 尹延锋
Original assignee: Henan University
Current assignee: Henan University
Priority date: 2020-05-19
Filing date: 2020-05-19
Publication date: 2021-04-09
Anticipated expiration: 2040-05-19
Also published as: CN111519144A

Abstract

The invention provides a target holder applied to pulse laser codeposition and an installation method thereof, and the target holder comprises a target holder bottom and a target cover plate, wherein a raised peripheral wall is arranged around the target holder bottom, a circular groove is arranged in the middle of the target holder bottom, a plurality of screw holes are arranged on the peripheral wall, the target holder is matched with a target, the target comprises a circular target module and an annular target module which can be independently disassembled and assembled, through holes are arranged on the side walls of the circular target module and the annular target module, and through columns are arranged in the through holes; the target cover plate is also provided with two oppositely arranged adjusting areas, and two end parts of the through column are arranged in the adjusting areas. The target holder can be used for setting and fixing the position of the target material in the early stage of mounting the target material, and effectively controlling the bombarded position of the target material. The utilization rate of the whole target material is improved, pits caused by local loss of the target material are avoided, and the scrapping speed of the target material is reduced.

Description

Target holder applied to pulse laser codeposition and mounting method

Technical Field

The invention relates to the field of manufacturing and processing semiconductors, in particular to a target holder applied to pulse laser codeposition and an installation method.

Background

With the development of modern science and technology, film science has become one of the subject areas that have rapidly developed in recent years, and is an important research area of condensed state physics and material science. The functional film is the main aspect of film research, not only has abundant physical connotation, but also has very wide application in the fields of microelectronics, photoelectrons, superconducting materials and the like.

Various film-making techniques and methods have been invented for a long time: vacuum evaporation deposition, ion beam sputtering, magnetron sputtering deposition, molecular beam epitaxy, metal organic chemical vapor deposition, sol-gel methods, and the like. The above methods each have advantages and find application in several fields. However, due to their limitations, the development of thin film research and the need for the preparation of various thin films have not yet been met. With the development of laser technology and devices, and in particular high power pulsed laser technology, the features of Pulsed Laser Deposition (PLD) technology are gradually recognized and accepted.

Pulsed Laser Deposition (PLD) is also known as Pulsed Laser Ablation (PLA). Unlike other conventional film deposition methods, pulsed laser deposition is a method in which a laser is used to bombard an object, then the material in the bombarded area is ablated, the ablated material (ablated materials) is preferentially transmitted along the normal direction of the target, a plasma feather-like luminophore, i.e., plume (plume), is formed, and finally the ablated material is deposited on the preceding substrate, so as to form a deposited film. At present, the target material structure is a circular flat plate type structure, the mode of fixing the target material by the PLD target holder is as shown in figure 1, the circular flat plate type target material is put into a circular groove of the target holder, a target material cover plate is covered on the target material, and a screw hole of the target material cover plate is fixed by a nut after being aligned with a screw hole of the peripheral wall of the target holder.

The existing target material structure inevitably has the following defects: the laser beam is highly focused on a certain point of the target. When the target material is transmitted by itself, if the target material is focused at the circle center position, the circle center position of the target material is highly consumed, and if the target material is focused at the non-circle center position, the target material is highly consumed in a ring shape by taking the axis of the target support as the circle center, so that the consumption of the target material generates obvious difference; in addition, the whole target material must be replaced after the material at any position on the target material deposition surface is consumed to a limit degree, so that the target material cannot be fully utilized, not only is the material wasted, but also the cost burden of enterprises is increased, and the target material must be frequently replaced due to the low utilization rate of the target material, so that the maintenance period of the equipment is shortened due to the frequent replacement of the target material, and the utilization of the capacity of the equipment is further influenced. When the existing target material in the whole piece style is placed in the target holder, the circle center of the circular target material cannot coincide with the center of the target holder, the placed eccentric distance is random, the circle center of the bombardment ring cannot coincide, the bombardment position cannot be uniform, the utilization rate of the whole target material is nonuniform, the local loss of the target material is serious, pits appear, and the scrapping of the target material is accelerated.

Disclosure of Invention

The invention provides a target holder applied to pulse laser codeposition and an installation method, which can set and fix the position of a target in the process of installing the target and effectively control the bombarded position of the target.

The technical scheme for realizing the invention is as follows:

a target holder applied to pulse laser codeposition comprises a target holder bottom and a target cover plate, wherein a raised peripheral wall is arranged around the target holder bottom, a circular groove is arranged in the middle of the target holder bottom, a plurality of screw holes are formed in the peripheral wall, the target holder is matched with a target, the target comprises a circular target module and an annular target module which can be independently disassembled and assembled, through holes are formed in the side walls of the circular target module and the annular target module, and through columns are arranged in the through holes; the target cover plate is also provided with two oppositely arranged adjusting areas, and two end parts of the through column are arranged in the adjusting areas.

The target cover plate is annular, the outer diameter of the ring is equal to that of the target backing, the width of the ring is larger than that of the peripheral wall, the inner diameter of the ring is smaller than that of the target, and the middle hollow part of the target cover plate is used for exposing the target and is a laser bombardment area.

The target material support bottom and the target material cover plate are made of stainless steel.

The adjusting area is used for exposing two end parts of the through column and/or the outer side of part of the target, and the position of the target is convenient to adjust.

The mounting method of the target holder applied to the pulse laser codeposition comprises the following steps:

step 1, a through column penetrates through a circular target which is provided with a through hole and can be independently disassembled and assembled, and scale marks are exposed at two ends of the through column; the circular target consists of a circular target module and one or more circular target modules which can be independently disassembled and assembled;

step 2, putting the target material inserted with the through column into a circular groove of the target material support bottom, and covering a target material cover plate;

step 3, aligning the screw holes of the target cover plate with the screw holes of the target support peripheral wall, exposing the two end parts of the through column and the outer side of part of the target from the adjusting area on the target cover plate, and pre-fixing by using a nut which is not screwed at the moment;

and 4, adjusting the position of the target material to enable the circle center of the target material to coincide with the circle center of the circular groove, enabling the exposed scale values of the two end parts of the through column to be the same, and then screwing down the nut to fix the target material.

The invention has the beneficial effects that:

(1) the target cover plate and the target structure are matched with each other, so that the target can be accurately positioned, the circle center of the target is overlapped with that of the target holder, and the probability of realizing codeposition is provided; if the two are not coincident, the annular sputtering area formed by the reduction of the target after self-transmission cannot be ensured to be positioned on an independent target module, so that certain processes of co-sputtering lack sputtering elements, and the co-sputtering process becomes uncontrollable.

(2) According to the target holder structure provided by the invention, when the circle center of the target material is coincident with that of the target holder, different lasers are utilized to focus on different target material modules simultaneously, the materials of the target material modules are different, the co-deposition of PLD is realized, in the co-sputtering process, the starting position is positioned on the same target material, the number of contacts between different materials and the brightness is increased, the chances of contacting and reacting different materials in a plasma state are increased, and thus a thin film layer formed by the materials of various target material modules is formed more uniformly.

(3) The target holder can set and fix the position of the target in the process of mounting the target, and effectively controls the bombarded position of the target. The utilization rate of the whole target material is improved, pits caused by local loss of the target material are avoided, and the scrapping speed of the target material is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 shows a conventional PLD target holder with a target fixed;

FIG. 2 is a schematic view of a target holder according to the present invention;

FIG. 3 is a schematic view of a target cover plate structure;

fig. 4 is a schematic view of a method for mounting the target and the target holder.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

Example 1

A target holder applied to pulse laser codeposition comprises a target holder base 201 (figure 2) and a target cover plate 202 (figure 3), wherein the target holder base 201 is provided with a raised peripheral wall 203 and a circular groove, the peripheral wall 203 is provided with a plurality of screw holes 204, the target holder is matched with a target, the target comprises a circular target module 101 and a circular target module 102 (figure 4) which can be independently disassembled and assembled, the side walls of the circular target module 101 and the circular target module 102 are provided with through holes, and through columns 104 are arranged in the through holes; the target cover plate 202 further has two opposite adjustment regions 206, and two ends of the through-post 104 are disposed in the adjustment regions 206.

The target cover plate 202 is annular, the outer diameter of the ring is equal to that of the target backing 201, the width of the ring is larger than that of the peripheral wall 203, the inner diameter of the ring is smaller than that of the target, and the middle hollow part 207 of the target cover plate 202 is used for exposing the target and is a laser bombardment area.

The target backing plate 201 and the target cover plate 202 are made of stainless steel.

The adjustment region 206 is used to expose two ends of the through-pillar 104 and/or a portion of the outer side of the target, so as to facilitate adjustment of the position of the target.

Example 2

A target material matched with the target holder in the embodiment 1 is arranged in a process chamber of multi-Pulse Laser Deposition (PLD). The target comprises a circular target module 101 and a plurality of circular target modules 102 which can be independently disassembled and assembled, wherein the side walls of the circular target module 101 and the plurality of circular target modules 102 are provided with through holes, a through column 104 penetrates through the through holes of the circular target module 101 and the circular target modules 102, the circular target module 101 and the plurality of circular target modules 102 are fixed into a circular target, two ends of the through column 104 are exposed, and scale marks are arranged on the through column 104. The length of the through-post 104 is equal to the inner diameter of the backing plate groove. In order to facilitate the target installation, the diameter of the combined round target is smaller than the inner diameter of the target holder. An annular isolation module 105 is arranged between the circular target module 101 and the annular target module 102 or between the two annular target modules 102, a through hole is formed in the side wall of the annular isolation module 105, and the isolation module 105 prevents the target from being polluted in the codeposition process. The through hole is located at a position not more than 1/2 the thickness of the target. The scale through the two ends of the post 104, both ends are marked as zero scale lines and the middle is the maximum scale line. The material of the annular isolation module 105 is stainless steel. The circular target module 101 and the circular target module 102 are made of two or more ceramic materials for co-deposition of two or more materials. The material of the through-column 104 is preferably ceramic or stainless steel.

Example 3

The mounting method of the target holder in the embodiment 1 and the target in the embodiment 2 comprises the following steps:

step 1, combining a circular target module 101, one or more circular target modules 102 and an annular isolation module 105 which can be independently disassembled and assembled into a circular target, wherein through holes in the side walls of the circular target module 101, the one or more circular target modules 102 and the annular isolation module are aligned;

step 2, the through column 104 penetrates through the through holes of the circular target module 101 and the circular target module 102, so that the combined target is integrated, and scale marks are exposed at two ends of the through column 104;

step 3, placing the combined target inserted into the through column 104 into the circular groove of the target holder base 201, and covering the target cover plate 202;

step 4, aligning the screw holes of the target cover plate with the screw holes of the target support peripheral wall, exposing the two end parts of the through column 104 and the outer side of part of the target from the adjusting area 206 on the target cover plate 202, and pre-fixing by using nuts which are not screwed at the moment;

and 5, adjusting the position of the target material to enable the circle center of the target material to coincide with that of the circular groove, enabling the exposed scale values at the two ends of the through column 104 to be the same, and then screwing down the nut to fix the target material.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a be applied to pulse laser codeposition's target subassembly, contains target material support base (201) and target material apron (202), is equipped with bellied week wall (203) and circular recess on target material support base (201), is provided with a plurality of screw (204) on week wall (203), its characterized in that: the target holder is matched with the target, the target comprises a circular target module (101) and an annular target module (102) which can be independently disassembled and assembled, through holes are formed in the side walls of the circular target module (101) and the annular target module (102), and through columns (104) are arranged in the through holes; the target cover plate (202) is also provided with two oppositely arranged adjusting areas (206), and two ends of the through column (104) are arranged in the adjusting areas (206).

2. The target assembly for pulsed laser co-deposition as claimed in claim 1, wherein: the target cover plate (202) is annular, the outer diameter of the ring is equal to that of the target support (201), the width of the ring is larger than that of the peripheral wall (203), the inner diameter of the ring is smaller than that of the target, and the middle hollow part (207) of the target cover plate (202) is used for exposing the target and is a laser bombardment area.

3. The target assembly for pulsed laser co-deposition as claimed in claim 1, wherein: the target material of the target material support bottom (201) and the target material cover plate (202) is stainless steel.

4. The target assembly for pulsed laser co-deposition as claimed in claim 1, wherein: the adjusting area (206) is used for exposing two end parts of the through column (104) and/or part of the outer side of the target, so that the position of the target can be adjusted conveniently.

5. The method of mounting a target assembly for pulsed laser co-deposition according to any of claims 1 to 4, characterized by the steps of:

step 1, a through column (104) penetrates through a circular target which is provided with a through hole and can be independently disassembled and assembled, and scale marks are exposed at two ends of the through column (104);

step 2, putting the target inserted with the through column (104) into a circular groove of the target holder bottom (201), and covering a target cover plate (202);

step 3, aligning the screw holes of the target cover plate (202) with the screw holes of the target support peripheral wall, exposing the two end parts of the through column (104) and the outer side of part of the target from an adjusting area (206) on the target cover plate (202), and pre-fixing by using a nut which is not screwed at the moment;

and 4, adjusting the position of the target material to enable the circle center of the target material to coincide with that of the circular groove, enabling the scale values exposed at the two ends of the through column (104) to be the same, and then screwing down the nut to fix the target material.

6. The method of claim 5, wherein the step of mounting the target assembly comprises: the circular target in the step 1 is composed of a circular target module (101) and one or more circular target modules (102) which can be independently disassembled and assembled.