CN111498431A

CN111498431A - Cleaning sheet and conveying member with cleaning function

Info

Publication number: CN111498431A
Application number: CN202010074870.9A
Authority: CN
Inventors: 深道佑一
Original assignee: Nitto Denko Corp
Current assignee: Nitto Denko Corp
Priority date: 2019-01-30
Filing date: 2020-01-22
Publication date: 2020-08-07
Also published as: KR20200094672A; JP2020121275A; TW202031373A

Abstract

The invention provides a cleaning sheet and a conveying member with a cleaning function. Provided is a cleaning sheet which can be suitably used for a conveying member conveyed into a substrate processing apparatus and has excellent foreign matter removal performance and corrosion resistance of semiconductor wiring. Further, a conveying member with a cleaning function having excellent foreign matter removal performance and corrosion resistance of semiconductor wiring, which is provided with such a cleaning sheet and conveying member, is provided. The cleaning sheet of the present invention is a cleaning sheet having a cleaning layer, and the cleaning layer has a chloride ion content of 100ppm or less.

Description

Cleaning sheet and conveying member with cleaning function

Technical Field

The present invention relates to a cleaning sheet and a conveying member with a cleaning function.

Background

Various substrate processing apparatuses that are averse to foreign matter, such as manufacturing apparatuses for semiconductors, flat panel displays, printed circuit boards, and the like, and inspection apparatuses, are conveyed while a conveying apparatus (typically, a chuck table or the like) is brought into physical contact with a substrate. In this case, if foreign matter adheres to the transfer device, the subsequent substrates are contaminated one by one, and therefore, it is necessary to periodically stop the device and perform a cleaning process. As a result, there are problems that the operation rate of the processing apparatus is lowered and that a large amount of labor is required for the cleaning process of the apparatus.

In order to overcome such a problem, a method of removing foreign matter adhering to a conveying device by conveying a plate-like member into a substrate processing apparatus has been proposed (see patent document 1). According to this method, since the substrate processing apparatus does not need to be stopped to perform the cleaning process, the problem of a decrease in the operation rate of the processing apparatus is eliminated. However, this method cannot sufficiently remove foreign matter adhering to the conveying device.

On the other hand, a method of removing foreign substances adhering to a conveying device by conveying a substrate having an adhesive substance adhered thereto as a cleaning member into a substrate processing apparatus has been proposed (see patent document 2). This method is superior to the method described in patent document 1 in the removal of foreign matter. However, the method described in patent document 2 may cause a problem that the adhesive substance is too strongly adhered to the contact portion of the transport device to be separated. As a result, there is a possibility that the substrate having the adhesive substance adhered thereto cannot be reliably conveyed, and the conveying apparatus is damaged.

As means for solving the above-described problems, the present applicant has reported a cleaning sheet that uses an acrylic polymer, polyimide, or polyester as a cleaning layer and that can be suitably used as a transport member for transporting the sheet into a substrate processing apparatus (patent documents 3 and 4).

In a substrate processing apparatus, a substrate to be transported generally includes semiconductor wiring such as aluminum wiring. In the conventional substrate processing apparatus, chlorine ions often remain due to cleaning processing or the like in the apparatus, and there is a problem that semiconductor wiring is corroded by the chlorine ions.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 11-87458

Patent document 2: japanese laid-open patent publication No. 10-154686

Patent document 3: japanese patent laid-open publication No. 2007-307521

Patent document 4: japanese patent application laid-open No. 2010-259970

Disclosure of Invention

Problems to be solved by the invention

The invention provides a cleaning sheet which can be suitably used for a conveying member conveyed into a substrate processing device and has excellent foreign matter removal performance and corrosion resistance of semiconductor wiring. Further, a conveying member with a cleaning function having excellent foreign matter removal performance and corrosion resistance of semiconductor wiring, which is provided with such a cleaning sheet and conveying member, is provided.

Means for solving the problems

The cleaning sheet of the present invention is a cleaning sheet having a cleaning layer, and the cleaning layer has a chloride ion content of 100ppm or less.

In one embodiment, the thickness of the cleaning layer is 1 μm to 500 μm.

In one embodiment, the cleaning sheet of the present invention comprises an adhesive layer.

In one embodiment, the cleaning sheet of the present invention comprises a support.

The conveying member with a cleaning function of the present invention includes the cleaning sheet and the conveying member.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a cleaning sheet which can be suitably used for a transport member transported into a substrate processing apparatus and has excellent foreign matter removal performance and corrosion resistance of semiconductor wiring can be provided. Further, it is possible to provide a conveying member with a cleaning function having such a cleaning sheet and a conveying member and having excellent foreign matter removal performance and corrosion resistance of semiconductor wiring.

Drawings

Fig. 1 is a schematic sectional view showing one embodiment of a cleaning sheet of the present invention.

Fig. 2 is a schematic sectional view showing another embodiment of the cleaning sheet of the present invention.

Fig. 3 is a schematic sectional view showing still another embodiment of the cleaning sheet of the present invention.

Fig. 4 is a schematic cross-sectional view showing one embodiment of a conveying member with a cleaning function of the present invention.

Description of the reference numerals

Cleaning sheet 100

Cleaning layer 10

Protective film 20

Adhesive layer 30

Support body 40

Conveying member 300 with cleaning function

Conveying member 200

Detailed Description

"1. cleaning tablet

The cleaning sheet of the present invention has a cleaning layer. The cleaning sheet of the present invention may be composed of only the cleaning layer, or may have another layer.

The cleaning sheet of the present invention is preferably excellent in heat resistance and can be used sufficiently even in a high-temperature environment. The high temperature environment is preferably 150 ℃ or higher, more preferably 200 ℃ or higher, further preferably 250 ℃ or higher, further preferably 300 ℃ or higher, and particularly preferably 350 ℃ or higher.

The cleaning sheet of the present invention has a cleaning layer having a chloride ion content of 100ppm or less, preferably 50ppm or less, more preferably 20ppm or less, still more preferably 15ppm or less, and particularly preferably 10ppm or less. When the chlorine ion content of the cleaning layer is within the above range, even if the cleaning sheet of the present invention is used for cleaning a substrate processing apparatus, the chlorine ion remains in the substrate processing apparatus at a substantially negligible level, and the problem of corrosion of semiconductor wiring by the chlorine ion can be avoided.

Fig. 1 is a schematic sectional view showing one embodiment of a cleaning sheet of the present invention. In fig. 1, a cleaning sheet 100 has a cleaning layer 10 and a protective film 20. The protective film 20 may be provided for the purpose of protection of the cleaning layer 10, or the like, or may be omitted for the purpose. That is, the cleaning sheet of the present invention may be constituted only by the cleaning layer 10.

Fig. 2 is a schematic sectional view showing another embodiment of the cleaning sheet of the present invention. In fig. 2, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protection of the cleaning layer 10, or the like, or may be omitted depending on the purpose.

Fig. 3 is a schematic sectional view showing still another embodiment of the cleaning sheet of the present invention. In fig. 3, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, a support 40, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protection of the cleaning layer 10, or the like, or may be omitted depending on the purpose.

The thickness of the cleaning sheet of the present invention may be any suitable thickness depending on the constitution thereof.

"1-1 cleaning layer

The cleaning layer may be made of any appropriate material as long as the chloride ion content is 100ppm or less, within a range not impairing the effects of the present invention.

The cleaning layer preferably comprises polybenzoxazole.

Polybenzoxazole is a resin having heat resistance and insulation properties, and is used in semiconductor devices as a bump protection film, an interlayer insulating film, and the like. As a result of various experiments and studies on polybenzoxazole having excellent heat resistance, it has been found that a layer containing polybenzoxazole exhibits not only excellent heat resistance but also an unexpected effect of excellent foreign matter removal performance, and thus it has been found that the layer containing polybenzoxazole can be suitably used for a cleaning sheet to be transported into a substrate processing apparatus in which a process area in which transportation or the like under high temperature conditions is required is set.

The cleaning sheet of the present invention has excellent foreign matter removal performance and heat resistance when the cleaning layer includes polybenzoxazole. Therefore, the cleaning sheet of the present invention can be suitably used as a transport member for the purpose of removing foreign matter or the like, which is transported into a substrate processing apparatus in which a process area in which transport or the like is required under high temperature conditions is set, in the case where the cleaning layer provided in the cleaning sheet contains polybenzoxazole.

In the case where the cleaning layer contains polybenzoxazole, the content ratio of polybenzoxazole in the cleaning layer is preferably 50 to 100% by weight, more preferably 70 to 100% by weight, even more preferably 90 to 100% by weight, particularly preferably 95 to 100% by weight, and most preferably 98 to 100% by weight. When the content ratio of polybenzoxazole in the cleaning layer is within the above range, a cleaning sheet having more excellent foreign matter removal performance and heat resistance can be provided.

Specifically, it is preferable to wash a polybenzoxazole precursor solution at 50m L heated to 30 to 70 ℃ with 2L of ion exchange water as a washing method, wherein the polybenzoxazole precursor solution is dropped into the ion exchange water 0.001m L to 1m L at a time to obtain a precipitate of the polybenzoxazole precursor, and then the polybenzoxazole precursor is stirred (for example, at a rotation speed of 10 to 1000rpm for 1 to 10 minutes) to discard the washing liquid, and the washing is repeated 3 or more times (preferably 3 to 5 times) to obtain a polybenzoxazole precursor having a low chlorine concentration.

Any suitable other component may be contained in the cleaning layer within a range not impairing the effects of the present invention. Examples of such other components include heat-resistant resins other than polybenzoxazole, surfactants, plasticizers, antioxidants, conductivity imparting agents, ultraviolet absorbers, and light stabilizers.

The thickness of the cleaning layer is preferably 1 μm to 500. mu.m, more preferably 3 μm to 100. mu.m, and still more preferably 5 μm to 50 μm. By setting the thickness of the cleaning layer within the above range, a cleaning sheet having excellent foreign matter removal performance and excellent transport performance into the substrate processing apparatus can be provided.

The cleaning layer has substantially no adhesive force. That is, for example, a cleaning layer formed of an adhesive substance, a cleaning layer formed by fixing an adhesive tape, or the like is excluded from the cleaning layer in the present invention. When the cleaning sheet of the present invention includes a cleaning layer having substantially adhesive force, there is a fear that a contact portion between the cleaning layer and, for example, a transport device in a substrate processing apparatus may become too strongly adhered to be not separated. As a result, there is a possibility that the substrate cannot be reliably conveyed and the conveying device is damaged.

The cleaning layer has substantially no adhesive force as described above. Specifically, the 180 DEG peel adhesion A to the mirror surface of a silicon wafer, which is defined in JIS-Z-0237, is preferably less than 0.20N/10mm, and more preferably 0.01 to 0.10N/10 mm. When the 180 ° peel adhesion a of the cleaning layer to the mirror surface of the silicon wafer, which is defined in JIS-Z-0237, is within such a range, the cleaning layer has substantially no adhesion, and the adhesion of the cleaning layer to, for example, a contact portion of a transport device in the substrate processing apparatus can be reduced, and as a result, the substrate can be transported reliably, and the transport device can be made less susceptible to damage.

The cleaning layer preferably has a weight loss by heat at 400 ℃ of 5% or less, more preferably 4% or less, still more preferably 3% or less, particularly preferably 2.5% or less, and most preferably 2% or less. When the thermal weight loss of the cleaning layer at 400 ℃ is within the above range, a cleaning sheet having more excellent heat resistance can be provided.

The cleaning layer preferably has a weight loss by heat at 500 ℃ of 10% or less, more preferably 8% or less, further preferably 6% or less, particularly preferably 4% or less, and most preferably 3% or less. When the thermal weight loss of the cleaning layer at 500 ℃ is within the above range, a cleaning sheet having more excellent heat resistance can be provided.

The thermal weight loss at 400 ℃ and 500 ℃ of the cleaning layer can be measured, for example, using a thermal analyzer (TG-DTA) "Thermoplus TG 8120" (manufactured by Rigaku Corporation).

The thermal decomposition temperature of the cleaning layer is preferably 380 ℃ or higher, more preferably 400 ℃ or higher, still more preferably 430 ℃ or higher, particularly preferably 470 ℃ or higher, and most preferably 500 ℃ or higher. When the thermal decomposition temperature of the cleaning layer is within the above range, a cleaning sheet having more excellent heat resistance can be provided.

The thermal decomposition temperature of the cleaning layer can be measured, for example, using a thermal analyzer (TG-DTA) "Thermo plus TG 8120" (manufactured by Rigaku Corporation).

The amount of exhaust gas generated at 200 ℃ in the cleaning layer is preferably 300ppm or less, more preferably 250ppm or less, still more preferably 200ppm or less, particularly preferably 150ppm or less, and most preferably 100ppm or less. When the amount of outgas generated at 200 ℃ in the cleaning layer is within the above range, a cleaning sheet having more excellent heat resistance can be provided. In addition, when the amount of exhaust gas generated at 200 ℃ in the cleaning layer is too large compared to the above range, there is a concern that the generated exhaust gas may cause contamination of the periphery (for example, contamination in the substrate processing apparatus).

The amount of exhaust gas generated at 300 ℃ in the cleaning layer is preferably 1000ppm or less, more preferably 500ppm or less, further preferably 300ppm or less, particularly preferably 100ppm or less, and most preferably 50ppm or less. When the amount of outgas generated in the cleaning layer at 300 ℃ is within the above range, a cleaning sheet having more excellent heat resistance can be provided. In addition, when the amount of exhaust gas generated at 300 ℃ in the cleaning layer is too large compared to the above range, there is a concern that the generated exhaust gas may cause contamination of the periphery (for example, contamination in the substrate processing apparatus).

The amount of outgas generated in the cleaning layer is measured, for example, by placing a predetermined amount of a sample in a sample cup, heating the sample in a furnace-type pyrolysis furnace (for example, "PY 2020 iD" manufactured by Frontier L laboratories L td.) at 200 ℃ for 10 minutes or at 300 ℃ for 10 minutes, trapping a part of volatile components in a column immersed in liquid nitrogen, and then terminating the heating.

The cleaning layer preferably has an elastic modulus at 25 ℃ of 0.5GPa or more, more preferably 0.7GPa or more, still more preferably 1.0GPa or more, particularly preferably 1.3GPa or more, and most preferably 1.5GPa or more. When the elastic modulus of the cleaning layer at 25 ℃ is within the above range, a cleaning sheet having more excellent foreign matter removal performance can be provided.

The cleaning layer preferably has an elastic modulus at 200 ℃ of 0.1GPa or more, more preferably 0.3GPa or more, still more preferably 0.5GPa or more, particularly preferably 0.8GPa or more, and most preferably 1.0GPa or more. When the elastic modulus of the cleaning layer at 200 ℃ is within the above range, a cleaning sheet having excellent foreign matter removal performance even in a high-temperature environment can be provided.

The modulus of elasticity of the cleaning layer at 25 ℃ and 200 ℃ can be measured, for example, using "RSA G2" (manufactured by TA Instruments).

The cleaning layer preferably has a transmittance at 400nm of 50% or more, more preferably 55% or more, further preferably 60% or more, particularly preferably 65% or more, and most preferably 70% or more. When the transmittance at 400nm of the cleaning layer is within the above range, the transparency is high, and therefore a cleaning sheet excellent in foreign matter visibility can be provided.

The transmittance at 400nm of the cleaning layer can be measured, for example, by using a spectrophotometer "V-670" (manufactured by Nissan Spectroscopy).

The cleaning layer preferably has a transmittance at 400nm of 50% or more, more preferably 55% or more, further preferably 60% or more, particularly preferably 65% or more, and most preferably 70% or more, after exposure to an environment at 200 ℃ for 3 hours. When the transmittance at 400nm of the cleaning layer after exposure to an environment of 200 ℃ for 3 hours is within the above range, the transparency is high even after exposure to a high-temperature environment, and therefore, a cleaning sheet excellent in foreign matter visibility even after exposure to a high-temperature environment can be provided.

The transmittance at 400nm of the cleaning layer after exposure to an environment at 200 ℃ for 3 hours can be determined, for example, as follows: after the cleaning layer was exposed to an atmosphere at 200 ℃ for 3 hours, it was measured using a spectrophotometer "V-670" (Nissan Spectroscopy).

The 180-degree peel adhesion B specified in JIS-Z-0237 of the dummy wafer to the mirror surface of the cleaning layer is preferably 10N/10mm or more, more preferably 15N/10mm or more, still more preferably 20N/10mm or more, particularly preferably 25N/10mm or more, and most preferably 30N/10mm or more. When the 180-degree peel adhesion B of the cleaning layer to the mirror surface of the dummy wafer, which is defined in JIS-Z-0237, is within the above range, for example, the adhesion between the cleaning layer and the conveying member such as the dummy wafer is high, and the cleaning layer is not easily peeled off from the conveying member such as the dummy wafer during cleaning.

The 180-degree peel adhesion B specified in JIS-Z-0237 of the cleaning layer to the mirror surface of the dummy wafer can be measured, for example, by forming the cleaning layer on the mirror surface of a silicon wafer as a dummy wafer according to JIS-Z-0237.

The number of residues of the cleaning layer on the mirror surface of the dummy wafer, which are obtained by the cross dicing method, is preferably 15/25 or more, more preferably 18/25 or more, still more preferably 20/25 or more, particularly preferably 23/25 or more, and most preferably 25/25 or more. When the number of residues of the cleaning layer on the mirror surface of the dummy wafer, which is obtained by the cross-cut method for the cleaning layer, is within the above range, for example, the adhesion between the cleaning layer and the conveying member such as the dummy wafer becomes higher, and the cleaning layer becomes less likely to be peeled off from the conveying member such as the dummy wafer during cleaning.

The residual number of the cleaning layer to the mirror surface of the dummy wafer, which is obtained by the cross cutting method, can be measured, for example, as follows: the test surface was subjected to measurement by making 6 parallel cuts at 2mm intervals on the billet with a cutter blade, making 6 parallel cuts at 2mm intervals in the same manner as the cuts were made perpendicular to the test surface to prepare 25 checkerboards, strongly pressing a tape (for example, "BT-315 ST" manufactured by ritonao electric corporation) having an adhesive strength of 16N/20mm to the checkerboard portion, peeling off the end of the tape at an angle of 45 °, and comparing the state of the checkerboard with a standard chart for evaluation.

1-2 support body

The cleaning sheet of the present invention may include a support. The support may be a single layer or a multilayer.

The thickness of the support body may be any appropriate thickness within a range not impairing the effect of the present invention. The thickness is preferably 500 μm or less, more preferably 1 to 400 μm, still more preferably 1 to 300 μm, particularly preferably 1 to 200 μm, and most preferably 1 to 100 μm.

The support may be any suitable support as long as the effect of the present invention is not impaired. Examples of such a support include films of plastics, engineering plastics, and super engineering plastics. Specific examples of the plastic, engineering plastic and super engineering plastic include polyimide, polyethylene terephthalate, cellulose acetate, polycarbonate, polypropylene, polyamide and the like.

The material of the support may be appropriately selected for each physical property such as molecular weight according to the purpose.

The method of forming the support can be selected appropriately according to the purpose.

The surface of the support may be subjected to a conventional surface treatment, for example, a chemical or physical treatment such as a chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, or ionizing radiation treatment, or a coating treatment with an undercoat agent, in order to improve adhesion to an adjacent layer, holding properties, or the like.

1-3 adhesive layer

The cleaning sheet of the present invention may be provided with an adhesive layer. As a material of such an adhesive layer, any appropriate material may be used within a range in which the effects of the present invention are not impaired. As a material of such an adhesive layer, for example, an acrylic adhesive, a silicone adhesive, a rubber adhesive, a urethane adhesive, or the like can be used.

The adhesive layer is provided, for example, for adhering to a mirror surface of the dummy wafer. Thus, the cleaning sheet of the present invention is stuck to a dummy wafer as a conveying member, and the conveying member with a cleaning function of the present invention can be formed.

The 180-degree peel adhesion C of the pressure-sensitive adhesive layer to the mirror surface of the dummy wafer, which is defined in JIS-Z-0237, is preferably 10N/10mm or more, more preferably 15N/10mm or more, still more preferably 20N/10mm or more, particularly preferably 25N/10mm or more, and most preferably 30N/10mm or more. When the 180-degree peel adhesion force C of the pressure-sensitive adhesive layer to the mirror surface of the pseudo wafer, which is defined in JIS-Z-0237, is in the above range, for example, the adhesion force between the pressure-sensitive adhesive layer and the pseudo wafer becomes high, and the cleaning sheet becomes less likely to be peeled off from the pseudo wafer during cleaning.

The thickness of the pressure-sensitive adhesive layer is preferably 1 to 200. mu.m, more preferably 2 to 100. mu.m, still more preferably 3 to 80 μm, particularly preferably 4 to 60 μm, and most preferably 5 to 50 μm.

1-4 protective film

The cleaning sheet of the present invention may have a protective film for protecting the cleaning layer, the support, the adhesive layer, and the like. The protective film may be peeled off at an appropriate stage.

The protective film may be any appropriate film within a range not impairing the effects of the present invention. Examples of the material of such a film include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymers, ionomer resins, ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid ester copolymers, polystyrene, polycarbonate, polyimide, and fluorine resins.

The protective film may be subjected to any appropriate peeling treatment within a range not to impair the effects of the present invention. The peeling treatment is typically performed by a peeling agent. Examples of the release agent include silicone release agents, long-chain alkyl release agents, fluorine release agents, fatty acid amide release agents, and silica release agents.

The thickness of the protective film is preferably 1 μm to 100. mu.m.

The method of forming the protective film is appropriately selected according to the purpose, and can be formed by, for example, injection molding, extrusion molding, blow molding, or the like.

1-5 Process for producing cleaning sheet

As a method for producing the cleaning sheet, any appropriate method may be employed within a range not impairing the effects of the present invention. Examples of such a production method include the following methods: (1) a method in which a varnish solution of a cleaning layer is cast onto a support, and after uniformly forming a film by a spin coater or the like, the cleaning layer is directly formed on the support by heating; (2) a method of forming a laminate including a separator and an adhesive film by, for example, a method of attaching an adhesive film (a film having a cleaning layer on one surface of a label support and a normal adhesive layer on the other surface) as a constituent material of the label and the reinforcing portion to the separator, and then, a method of peeling off and removing an unnecessary adhesive film from the separator by simultaneously or separately punching only the adhesive film of the laminate into respective shapes of the label and/or the reinforcing portion.

(2. conveying component with cleaning function)

The conveying member with a cleaning function of the present invention includes the cleaning sheet of the present invention and a conveying member.

Fig. 4 is a schematic cross-sectional view showing one embodiment of a conveying member with a cleaning function of the present invention. In fig. 4, the conveying member 300 with a cleaning function has a cleaning sheet 100 and a conveying member 200. When the cleaning sheet 100 has an adhesive layer, the outermost layer of the cleaning sheet 100 on the conveying member 200 side is preferably an adhesive layer.

The transport means may be any suitable transport means as long as the effects of the present invention are not impaired, and examples of such transport means include semiconductor wafers (e.g., silicon wafers), flat panel display substrates such as L CD and PDP, optical disks, MR heads, and the like.

Examples

The present invention will be described in more detail below with reference to examples and comparative examples. However, the present invention is not limited to these examples in any way. In the following description, "part" and "%" are based on weight unless otherwise specified.

< measurement of chloride ion content of cleaning layer >

The extraction container was charged with 100m L of ion-exchanged water and washed, and the operation was repeated 3 times, then 100m L of ion-exchanged water was charged into the extraction container, and the container was charged into a 120 ℃ dryer for 2 hours, then the container was taken out of the dryer, the ion-exchanged water was discarded and washed, and after that, 25m L of ion-exchanged water was added to the extraction container using a measuring cylinder, 0.5g of the sample was prepared, rounded, then placed into the extraction container, and charged into the 120 ℃ dryer for 20 hours, and after that, the sample was taken out of the dryer, cooled at room temperature for 1 hour, and then measured by an ion chromatography analyzer (ICS-2000, manufactured by Thermo Fisher), thereby obtaining the amount of chloride ions.

< measurement of 180 ℃ peel adhesion A of cleaning layer to mirror surface of silicon wafer specified in JIS-Z-0237 >

A cleaning layer was formed on the mirror surface of a silicon wafer, and the measurement was carried out in accordance with JIS-Z-0237.

< 180 degree peel adhesion C of adhesive layer to mirror surface of dummy wafer, stipulated in JIS-Z-0237 >

A cleaning layer was formed on a mirror surface of a silicon wafer as a dummy wafer and measured according to JIS-Z-0237.

< evaluation of cleaning Performance >

For example, the number of foreign substances of 0.200 μm or more on the mirror surface of a silicon wafer can be measured using a foreign substance inspection apparatus (SFS 6200, made by K L a Tencor) (hereinafter referred to as apparatus a) to evaluate.

More specifically, the conveying member with the cleaning function was conveyed to a liner film peeling apparatus (HR-300 CW) for producing a cleaning sheet (hereinafter referred to as apparatus B), and the number of foreign matters before and after conveyance of the conveying member with the cleaning function was measured to evaluate the number of foreign matters.

< conveyance Property evaluation >

For example, the evaluation can be performed as follows: in the apparatus B, the conveying member with the cleaning function was conveyed to the chuck table, vacuum-sucked, and after the vacuum was released, whether the conveying member with the cleaning function could be peeled off from the chuck table by the lift pin was evaluated.

[ production example 1 ]: production of Polybenzoxazole varnish (1)

4, 4' - (hexafluoroisopropylidene) bis (2-aminophenol): 36.6g, pyridine: 27.7g, N-methyl-2-pyrrolidone: 500g, stirred at room temperature until 4, 4' - (hexafluoroisopropylidene) bis (2-aminophenol) was completely dissolved. Thereafter, trimethylchlorosilane: 27.2g, stirred at room temperature for 60 minutes. Thereafter, 4' -bis (chlorocarbonyl) diphenyl ether was slowly added over 5 minutes: 29.5g, stirred at room temperature for 5 hours.

The obtained polybenzoxazole precursor solution (50 m L) was washed with 2L of ion-exchanged water heated to 50 ℃ to obtain a precipitate of a polybenzoxazole precursor, which was added dropwise to the ion-exchanged water at 0.05m L each time to obtain a washing solution, and then the solution was stirred at 100rpm for 3 minutes to discard the washing solution, and the washing was repeated 4 times, and the obtained precipitate was dried at 130 ℃ for 8 hours, and 4 times the amount of N-methyl-2-pyrrolidone was added to the dried precipitate to redissolve the precipitate, thereby obtaining a varnish of polybenzoxazole (1).

[ production example 2 ]: preparation of Polybenzoxazole varnish (C1)

A varnish of polybenzoxazole (C1) was obtained in the same manner as in production example 1, except that the polybenzoxazole precursor solution 50m L was washed with 2L ion-exchanged water heated to 50 ℃.

[ production example 3 ]: preparation of Polybenzoxazole varnish (C2)

A varnish of polybenzoxazole (C2) was obtained in the same manner as in production example 1, except that the polybenzoxazole precursor solution 50m L was washed with 2L ion-exchanged water at 25 ℃ and the operation was repeated 4 times.

[ production example 4 ]: preparation of Polybenzoxazole varnish (C3)

A varnish of polybenzoxazole (C3) was obtained in the same manner as in production example 1, except that the polybenzoxazole precursor solution 50m L was washed with 2L ion-exchanged water at 25 ℃ and the operation was repeated 1 time.

[ example 1 ]: production and evaluation of conveying Member (1c) with cleaning function having cleaning layer (1a) comprising polybenzoxazole

The varnish (1) of polybenzoxazole obtained in production example 1 was coated on a mirror surface of an 8-inch silicon wafer by spin coating, heated at 150 ℃ for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300 ℃ for 2 hours under vacuum to obtain a conveying member (1c) with a cleaning function, which contains a cleaning layer (1a) of polybenzoxazole and has a thickness of 10 μm.

The results of the various evaluations are shown in table 1.

[ comparative example 1 ]: production and evaluation of conveying Member (C1C) with cleaning function having cleaning layer (C1a) comprising polybenzoxazole

The varnish (2) of polybenzoxazole obtained in production example 2 was coated on a mirror surface of an 8-inch silicon wafer by spin coating, heated at 150 ℃ for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300 ℃ for 2 hours under vacuum to obtain a cleaning-function-carrying conveying member (C1C) having a thickness of 10 μm of a cleaning layer (C1a) containing polybenzoxazole.

The results of the various evaluations are shown in table 1.

[ comparative example 2 ]: production and evaluation of conveying Member (C2C) with cleaning function having cleaning layer (C2a) comprising polybenzoxazole

The varnish (3) of polybenzoxazole obtained in production example 3 was coated on a mirror surface of an 8-inch silicon wafer by spin coating, heated at 150 ℃ for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300 ℃ for 2 hours under vacuum to obtain a cleaning-function-carrying conveying member (C2C) having a thickness of 10 μm of a cleaning layer (C2a) containing polybenzoxazole.

The results of the various evaluations are shown in table 1.

[ comparative example 3 ]: production and evaluation of conveying Member (C3C) with cleaning function having cleaning layer (C3a) comprising polybenzoxazole

The varnish (4) of polybenzoxazole obtained in production example 4 was coated on a mirror surface of an 8-inch silicon wafer by spin coating, heated at 150 ℃ for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300 ℃ for 2 hours under vacuum to obtain a cleaning-function-carrying conveying member (C3C) having a thickness of 10 μm of a cleaning layer (C3a) containing polybenzoxazole.

The results of the various evaluations are shown in table 1.

[ Table 1]

Industrial applicability

The cleaning sheet and the conveying member with a cleaning function of the present invention can be suitably used for cleaning substrate processing apparatuses such as various manufacturing apparatuses and inspection apparatuses.

Claims

1. A cleaning sheet comprising a cleaning layer,

the cleaning layer has a chloride ion content of 100ppm or less.

2. The cleaning sheet according to claim 1, wherein the cleaning layer has a thickness of 1 μm to 500 μm.

3. The cleaning sheet of claim 1 or 2, comprising an adhesive layer.

4. A cleaning sheet according to any one of claims 1 to 3, comprising a support.

5. A conveying member with a cleaning function, comprising the cleaning sheet according to any one of claims 1 to 4 and a conveying member.