CN111490001B - Lifting device of semiconductor processing equipment and semiconductor processing equipment - Google Patents
Lifting device of semiconductor processing equipment and semiconductor processing equipment Download PDFInfo
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- CN111490001B CN111490001B CN202010312012.3A CN202010312012A CN111490001B CN 111490001 B CN111490001 B CN 111490001B CN 202010312012 A CN202010312012 A CN 202010312012A CN 111490001 B CN111490001 B CN 111490001B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 28
- 230000008569 process Effects 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 230000033001 locomotion Effects 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 57
- 230000003028 elevating effect Effects 0.000 description 4
- 238000000407 epitaxy Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a lifting device of semiconductor processing equipment and the semiconductor processing equipment, the lifting device is used for driving a tray lifting bracket and a wafer lifting bracket of the semiconductor processing equipment to do lifting movement, the lifting device comprises: a rotary motor for providing rotary power; the transmission mechanism is respectively connected with the rotating motor and the tray lifting bracket, and is used for converting the rotating power provided by the rotating motor into linear power and driving the tray lifting bracket to move among a process position, an initial position and an unloading position; and the synchronizing mechanism is respectively connected with the tray lifting support and the wafer lifting support and is used for driving the wafer lifting support and the tray lifting support to synchronously lift when the tray lifting support moves between the initial position and the unloading position. The lifting device of the semiconductor processing equipment can meet the requirements on the positioning precision and repeated positioning precision of the tray at three stations, realize the adjustable lifting speed and improve the structural stability.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a lifting device of semiconductor processing equipment and the semiconductor processing equipment.
Background
The single-chip silicon epitaxy process system mainly realizes the lifting and rotating functions of the tray and the thimble and the process through a rotating and lifting system. For the lifting function, it is required to realize smooth switching between a process position (where the tray is in the process position), an initial position (where the ejector pins hold the wafer, and separate the wafer from the tray), and an unloading position (where the wafer is taken and put), and linkage with the wafer lifting support, so as to realize transfer of the wafer between the tray and the ejector pins. In order to meet the requirements of high efficiency, stability and process consistency of lifting movement, the lifting speed is required to be relatively slow when the ejector pins are in contact with the wafer, the lifting speed is required to be relatively fast at other movement positions, and meanwhile, the positioning precision and repeated positioning precision of the tray at three stations are also required to be high.
The lifting device adopted in the related art realizes the switching of the tray lifting support among the three stations mainly through two air cylinders and the linkage of the tray lifting support and the wafer lifting support. Specifically, the tray is lowered from the process position to the unloading position as follows: firstly, a first cylinder drives a tray lifting bracket to descend from a process position to an initial position; then, the second cylinder drives the tray lifting support and the wafer lifting support to synchronously descend from the initial position until reaching the unloading position.
However, the above-mentioned lifting device inevitably has the following problems in practical applications:
firstly, the motion precision of the cylinder is low, and the requirements on the positioning precision and repeated positioning precision of the tray at three stations cannot be met.
Secondly, the lifting speed driven by the air cylinder is not adjustable, and different requirements on the lifting speed in different processes of transferring wafers cannot be met.
Thirdly, the lifting device is poor in structural stability.
Disclosure of Invention
The invention aims at solving at least one of the technical problems in the prior art, and provides a lifting device of semiconductor processing equipment and the semiconductor processing equipment, which can meet the requirements on the positioning precision and repeated positioning precision of a tray at three stations, realize the adjustable lifting speed and improve the structural stability.
In order to achieve the above object, the present invention provides a lifting device for a semiconductor processing apparatus for driving a tray lifting support and a wafer lifting support of the semiconductor processing apparatus to make lifting motions, the lifting device comprising:
a rotary motor for providing rotary power;
the transmission mechanism is respectively connected with the rotating motor and the tray lifting bracket, and is used for converting the rotating power provided by the rotating motor into linear power and driving the tray lifting bracket to move among a process position, an initial position and an unloading position which are arranged from high to low; the method comprises the steps of,
and the synchronous mechanism is respectively connected with the tray lifting support and the wafer lifting support and is used for driving the wafer lifting support and the tray lifting support to synchronously lift when the tray lifting support moves between the initial position and the unloading position.
Optionally, the synchronization mechanism includes a fixing member, an elastic member, and a linkage member, wherein the fixing member is disposed stationary with respect to the wafer lift bracket and is capable of defining an upper limit position of a movement range of the wafer lift bracket;
the elastic component is respectively connected with the fixing component and the wafer lifting bracket and applies upward elastic force to the wafer lifting bracket;
the linkage component is respectively connected with the tray lifting support and the wafer lifting support and is used for driving the wafer lifting support and the tray lifting support to synchronously descend when the tray lifting support moves from the initial position to the unloading position.
Optionally, the elastic component includes a fixed end connected with the fixed component and a movable end located above the fixed end and connected with the wafer lifting bracket; and, the fixing member can limit the upper limit position of the movement range of the wafer lift bracket by blocking the movable end of the elastic member from continuing to move upward.
Optionally, the elastic member includes a compression spring.
Optionally, the linkage component comprises a first connecting piece, a second connecting piece and a pull rod, wherein the first connecting piece is connected with the tray lifting bracket; the second connecting piece is connected with the wafer lifting bracket, and a through hole is vertically arranged in the second connecting piece;
the pull rod is arranged in the through hole in a penetrating mode, the lower end of the pull rod is connected with the first connecting piece, a pulling portion is arranged at the upper end of the pull rod, the pulling portion is overlapped on the second connecting piece when the tray lifting support is located at the initial position, and the second connecting piece is driven to descend when the tray lifting support moves from the initial position to the unloading position.
Optionally, the transmission mechanism comprises a vertically arranged screw rod and a moving piece in threaded fit with the screw rod; wherein the screw rod is connected with a driving shaft of the rotating motor; the moving piece is connected with the tray lifting support.
Optionally, the lifting device further comprises a motor fixing bracket, a screw rod fixing seat and a base, wherein,
the motor fixing bracket and the base are fixedly connected with a fixing support of the semiconductor processing equipment; the rotating motor and the fixed part are connected with the motor fixed bracket;
the screw rod fixing seat is fixedly connected with the motor fixing support, the upper end of the screw rod is connected with the driving shaft of the rotating motor, and the lower end of the screw rod penetrates through the screw rod fixing seat and is rotatably connected with the base; and, the screw has a height adjusting structure for adjusting the upper end height of the screw by changing the length of the screw.
Optionally, the lifting device further comprises a linear guide rail vertically arranged, and a first sliding piece and a second sliding piece which are in sliding fit with the linear guide rail, wherein the first sliding piece is connected with the tray lifting bracket; the second sliding piece is connected with the wafer lifting bracket.
Optionally, the lifting device further comprises three sensors and a sensing piece arranged on the tray lifting support, wherein the positions of the three sensors are set so that the sensing piece can be detected when the tray lifting support moves to the process position, the initial position and the unloading position respectively.
As another technical scheme, the invention also provides a semiconductor processing device, which comprises a reaction chamber, a tray, a thimble and a lifting device, wherein the tray and the thimble are arranged in the reaction chamber, the lifting device is respectively connected with the tray and the thimble through a tray lifting support and a wafer lifting support and is used for driving the tray lifting support and the wafer lifting support to do lifting motion, and the lifting device adopts the lifting device provided by the invention.
The invention has the beneficial effects that:
the lifting device of the semiconductor processing equipment provided by the invention utilizes the rotating motor to provide rotating power, utilizes the transmission mechanism to convert the rotating power provided by the rotating motor into linear power, drives the tray lifting support to move among a process position, an initial position and an unloading position, and utilizes the synchronous mechanism to drive the wafer lifting support and the tray lifting support to synchronously lift when the tray lifting support moves between the initial position and the unloading position, so that the smooth switching of the tray lifting support among the process position, the initial position and the unloading position and the linkage with the wafer lifting support can be realized, and the wafer can be transferred between the tray and the thimble. The lifting device is driven by the rotating motor, can meet the requirements on the positioning precision and repeated positioning precision of the tray at three stations relative to the cylinder driving, realizes adjustable lifting speed, and can improve the structural stability.
The semiconductor processing equipment provided by the invention can meet the requirements on the positioning precision and repeated positioning precision of the tray at three stations by adopting the lifting device provided by the invention, realizes adjustable lifting speed and can improve the structural stability.
Drawings
Fig. 1 is an installation schematic diagram of a lifting device of a semiconductor processing apparatus according to an embodiment of the present invention;
fig. 2 is a front view of a lifting device of a semiconductor processing apparatus according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of a lifting device of a semiconductor processing apparatus according to an embodiment of the present invention;
fig. 4 is a side view of a lifting device of a semiconductor processing apparatus according to an embodiment of the present invention.
Detailed Description
In order to enable those skilled in the art to better understand the technical scheme of the present invention, the lifting device of the semiconductor processing equipment and the semiconductor processing equipment provided by the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, an elevating device of a semiconductor processing apparatus according to an embodiment of the present invention is configured to drive a tray elevating bracket 3 and a wafer elevating bracket 4 of the semiconductor processing apparatus to perform an elevating motion. The semiconductor processing apparatus includes a reaction chamber (not shown), a tray 1 provided in the reaction chamber, a thimble 2, and a lifting device 5, the lifting device 5 being connected to a tray lifting bracket 3 through a first connection member 31, the tray lifting bracket 3 being connected to the tray 1; the lift device 5 is connected to the wafer lift bracket 4 via a second connector 41, and the wafer lift bracket 4 is connected to the thimble 2. The lifting device 5 is used for driving the tray lifting support 3 and the wafer lifting support 4 to do lifting motion so as to achieve lifting motion of the tray 1 and the thimble 2.
Taking semiconductor processing equipment as an epitaxy process equipment for example, the tray 1 is used for bearing wafers 6, the tray lifting support 3 comprises a vertically arranged tray lifting shaft, the upper end of the tray lifting shaft is connected with the tray 1, and the lower end of the tray lifting shaft extends downwards to the outside of the reaction chamber and is connected with the lifting device 5. The wafer lifting support 4 comprises a hollow thimble lifting shaft, and the thimble lifting shaft is sleeved on the tray lifting shaft and can move relatively. The upper ends of the thimble lifting shafts are connected with the thimbles 2, and the lower ends extend downwards to the outside of the reaction chamber and are connected with the lifting device 5. In practical application, different semiconductor processing devices, the structures and connection modes of the tray, the ejector pin, the tray lifting bracket and the wafer lifting bracket are different, and the invention is not limited to this.
The tray lifting support 3 is moved between a process position, an initial position, and an unloading position set from high to low by driving of the lifting device 5. Specifically, when the tray lifting support 3 is located at the process position, the tray 1 is located at the process position, and the top end of the ejector pin is lower than the bearing surface of the tray 1, so that the wafer 6 placed on the tray 1 can be processed at the moment. Under the drive of the lifting device 5, the tray lifting support 3 can independently descend from the process position to the initial position, in the process, the ejector pins 2 and the wafer lifting support 4 are static, and when the tray lifting support 3 reaches the initial position, the top end of the ejector pins 2 is higher than the bearing surface of the Gao Yutuo tray 1, so that the ejector pins 2 can lift the wafers 6 on the tray 1, the wafers 6 are separated from the tray 1, and the transfer of the wafers 6 between the tray 1 and the ejector pins 2 is completed. The tray lifting support 3 and the wafer lifting support 4 are synchronously lowered under the driving of the lifting device 5 until the tray lifting support 3 reaches an unloading position, at which the robot can perform the wafer picking and placing operation to complete the loading and unloading of the wafer 6.
A specific implementation of the lifting device 5 provided in this embodiment will be described in detail below. Specifically, referring to fig. 2 and 3, the lifting device 5 includes a rotary motor 51, a transmission mechanism 52, and a synchronization mechanism 53, wherein the rotary motor 51 is used to provide rotary power. Optionally, the rotating motor 51 is a servo motor, which has higher control precision and position precision, so that the positioning precision and the repeated positioning precision are further improved, and the lifting speed is adjustable.
In the present embodiment, the elevation device 5 is connected to the tray elevation support 3 through a first connection member 31, and is connected to the wafer elevation support 4 through a second connection member 41. Specifically, the transmission mechanism 52 is connected to the rotary motor 51 and the first connecting member 31, respectively, to convert the rotary power provided by the rotary motor 31 into linear power and drive the first connecting member 31 to perform lifting movement, so as to move the tray lifting bracket 3 between the process position and the unloading position.
In the present embodiment, the transmission mechanism 52 includes a vertically disposed lead screw 521 and a mover 524 screw-engaged with the lead screw 521; wherein the screw 521 is connected with a driving shaft 511 of the rotating motor 51 through a coupling 512; the moving member 524 is connected to the first connecting member 31 through the third connecting member 32. The screw 521 is rotated by the driving of the rotating motor 51, and a mover 524 screwed to the screw 521 is movable along the screw 521. Alternatively, the moving member 524 is a nut, and is sleeved on the lead screw 521, and the nut is fixedly connected with the third connecting member 32 through the connecting flange 525. The screw 521 may be a ball screw or the like.
In this embodiment, the lifting device 5 further includes a motor fixing bracket 54, a screw rod fixing seat 522, and a base 55, where the motor fixing bracket 54 and the base 55 are fixedly connected with a fixing support 7 of the semiconductor processing apparatus, and the fixing support 7 may be a rotating support for mounting the tray rotating device, for example, the semiconductor processing apparatus is an epitaxial processing apparatus, but in practical application, the fixing support 7 may also be other components that can be stationary relative to the tray.
The rotating motor 51 is mounted on the motor fixing bracket 54, and the driving shaft 511 is vertically downward, the screw rod fixing seat 522 is fixedly connected with the motor fixing bracket 54, the upper end of the screw rod 521 is connected with the driving shaft 511 of the rotating motor 51, and the lower end penetrates the screw rod fixing seat 522 and is rotatably connected with the base 55. Optionally, the lower end of the lead screw 521 cooperates with a bearing 526 provided in the base 55 to achieve a rotatable connection with the base 55.
Alternatively, the screw 521 has a height adjusting structure 523 for adjusting the upper end height of the screw 521 by changing the length of the screw 521. By means of the height adjusting structure 523, the screw 521 can be connected with the driving shaft 511 of the rotating motor 51 more flexibly and conveniently.
In the present embodiment, the transmission mechanism 52 is a screw-nut structure, but the present invention is not limited thereto, and in practical applications, the transmission mechanism may be another transmission structure capable of converting rotational power into linear power, such as a rack-and-pinion structure.
The synchronous mechanism 53 is respectively connected with the first connecting piece 31 and the second connecting piece 41, and is used for driving the first connecting piece 31 to synchronously lift and lower through the second connecting piece 41 when the tray lifting support 3 moves between the initial position and the unloading position, so that the wafer lifting support 4 and the tray lifting support 3 can synchronously lift and lower. Specifically, in the present embodiment, the synchronizing mechanism 53 includes a fixing member, an elastic member 532, and a linking member 531, wherein the fixing member is provided stationary with respect to the second connecting member 41, in the present embodiment, the fixing member is the motor fixing bracket 54, in other words, the motor fixing bracket 54 also serves as the fixing member, and of course, the fixing member may be provided separately and fixedly connected to the fixing support 7 of the semiconductor processing apparatus in practical use.
The elastic member 532 is connected to the motor fixing bracket 54 (i.e., the above-described fixing member) and the fourth link 42, respectively, and the fourth link 42 is connected to the second link 41. And, the elastic member 532 applies an upward elastic force to the fourth link 42 so that the fourth link 42 can drive the second link 41 and the wafer lift bracket 4 to move, so that the wafer lift bracket 4 can be restored to an upper limit position of its moving range by the elastic force of the elastic member 532 when the tray lift bracket 3 moves between the initial position and the process position. The upper limit position is set such that the top height of the ejector pins 2 can be higher than the carrying surface of the tray 1 when the tray lifting bracket 3 moves to the initial position, so that the wafer can be separated from the tray 1.
In the present embodiment, the elastic member 532 includes a fixed end (lower end) connected to the motor fixing bracket 54, the fixed end being fixedly connected to the motor fixing bracket 54 through the support plate 533; the elastic member 532 further includes a movable end (upper end) located above the fixed end and connected to the fourth link 42. The motor fixing bracket 54 can block the fourth link 42 from continuing to move upward, indirectly blocks the movable end of the elastic member 532 from continuing to move upward, and the blocking position is set as the upper limit position of the movement range of the wafer lift bracket 4. That is, when the wafer lift bracket 4 is lifted to the upper limit position of the movement range thereof, the movable end of the fourth link 42 together with the elastic member 532 cannot be lifted further by the blocking action of the motor fixing bracket 54, thereby realizing the limitation of the upper limit position of the movement range of the wafer lift bracket 4. Optionally, the elastic member 532 includes a compression spring. The compression spring is preferably always in a compressed state. Of course, in practical applications, the elastic member 532 is not limited to the compression spring, and any other elastic member, such as an extension spring, may be used.
The linkage member 53 is used to drive the wafer lift bracket 4 to descend synchronously with the tray lift bracket 3 when the tray lift bracket 3 moves from the initial position to the unloading position. Specifically, the linkage member 53 includes the above-mentioned first connecting piece 31, the above-mentioned second connecting piece 41, and the tie bar 531, wherein the first connecting piece 31 is connected to the tray lifting bracket 3, the second connecting piece 41 is connected to the wafer lifting bracket 4, and a through hole is vertically provided in the second connecting piece 41; the pull rod 531 is disposed in the through hole, and the lower end of the pull rod 531 is connected to the first connecting member 31, and the upper end of the pull rod 531 is provided with a pulling portion 531a, where the pulling portion 531a is overlapped on the second connecting member 41 when the tray lifting support 3 is located at the initial position, and drives the second connecting member 41 to descend when the tray lifting support 3 moves from the initial position to the unloading position. In this embodiment, the pulling portion 531a is a boss having an outer diameter larger than that of the pull lever 531.
Optionally, the lifting device further comprises a linear guide 561 and a first sliding member 562 and a second sliding member 563 slidingly engaged with the linear guide 561, wherein the linear guide 561 is vertically fixed on the fixed support 7 of the semiconductor processing apparatus; the first slider 562 is connected with the first connector 31; the second slider 563 is connected to the second connector 41. By means of the linear guide 561 and the first and second sliding members 562 and 563 slidably engaged therewith, both the first and second connection members 31 and 41 can be moved along the linear guide 561, thereby not only providing a guiding function but also improving structural stability. Alternatively, the first slider 562 and the second slider 563 are both sliders, and in practical applications, the number and size of the sliders may be designed according to the weight bearing of the first connector 31 and the second connector 41.
Referring to fig. 2 and 4, in the present embodiment, the lifting device 5 further includes three sensors 57 and sensing pieces 58 provided on the first connection piece 31, wherein the respective positions of the three sensors 57 are set to be able to detect the sensing pieces 58 when the tray lifting stand 3 is moved to the process position, the initial position, and the unloading position, respectively. Thereby, it can be known whether the tray lifting support 3 has moved to the corresponding station. The sensor 57 is, for example, a non-contact sensor, and the sensing member 58 is a shutter.
In summary, the lifting device of the semiconductor processing apparatus provided by the embodiment of the invention uses the rotating motor to provide the rotating power, uses the transmission mechanism to convert the rotating power provided by the rotating motor into the linear power, drives the tray lifting support to move between the process position and the unloading position, and uses the synchronization mechanism to drive the wafer lifting support and the tray lifting support to synchronously lift when the tray lifting support moves from the initial position to the unloading position, thereby realizing smooth switching of the tray lifting support between the process position, the initial position and the unloading position and linkage with the wafer lifting support so as to realize the transfer of the wafer between the tray and the thimble. According to the lifting device, the rotating motor is adopted for driving, so that the requirements on the positioning precision and repeated positioning precision of the tray at three stations can be met, the lifting speed can be adjusted, and the structural stability can be improved.
As another technical solution, an embodiment of the present invention further provides a semiconductor processing apparatus, including a reaction chamber, a tray and a thimble disposed in the reaction chamber, and a lifting device, taking the tray 1 and the thimble 3 shown in fig. 1 and the lifting device 5 as an example, the lifting device 5 is connected with the tray 1 and the thimble 2 through the tray lifting support 3 and the wafer lifting support 4, respectively, and is used for driving the tray lifting support 3 and the wafer lifting support 4 to perform lifting motion. The lifting device 5 adopts the lifting device provided by the embodiment of the invention.
Optionally, the semiconductor processing apparatus comprises an epitaxial processing apparatus. Of course, the semiconductor processing apparatus provided in the embodiment of the present invention may be other apparatuses that need to be equipped with a lifting device.
The semiconductor processing equipment provided by the embodiment of the invention can meet the requirements on the positioning precision and repeated positioning precision of the tray at three stations by adopting the lifting device provided by the embodiment of the invention, realizes adjustable lifting speed and can improve the structural stability.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (9)
1. A lifting device for a semiconductor processing apparatus for driving a tray lifting support and a wafer lifting support of the semiconductor processing apparatus to perform lifting movement, the lifting device comprising:
a rotary motor for providing rotary power;
the transmission mechanism is respectively connected with the rotating motor and the tray lifting bracket, and is used for converting the rotating power provided by the rotating motor into linear power and driving the tray lifting bracket to move among a process position, an initial position and an unloading position which are arranged from high to low; the method comprises the steps of,
the synchronous mechanism is respectively connected with the tray lifting bracket and the wafer lifting bracket and is used for driving the wafer lifting bracket and the tray lifting bracket to synchronously lift when the tray lifting bracket moves between the initial position and the unloading position;
the synchronous mechanism comprises a fixed part, an elastic part and a linkage part, wherein the fixed part is arranged to be stationary relative to the wafer lifting bracket and can limit the upper limit position of the movement range of the wafer lifting bracket;
the elastic component is respectively connected with the fixing component and the wafer lifting bracket and applies upward elastic force to the wafer lifting bracket;
the linkage component is respectively connected with the tray lifting support and the wafer lifting support and is used for driving the wafer lifting support and the tray lifting support to synchronously descend when the tray lifting support moves from the initial position to the unloading position.
2. The lift apparatus of claim 1, wherein the elastic member includes a fixed end coupled to the fixed member and a movable end positioned above the fixed end and coupled to the wafer lift bracket; and, the fixing member can limit the upper limit position of the movement range of the wafer lift bracket by blocking the movable end of the elastic member from continuing to move upward.
3. A lifting device according to claim 1 or 2, wherein the resilient member comprises a compression spring.
4. The lifting device of claim 1 or 2, wherein the linkage member comprises a first connector, a second connector, and a pull rod, wherein the first connector is connected to the pallet lifting bracket; the second connecting piece is connected with the wafer lifting bracket, and a through hole is vertically arranged in the second connecting piece;
the pull rod is arranged in the through hole in a penetrating mode, the lower end of the pull rod is connected with the first connecting piece, a pulling portion is arranged at the upper end of the pull rod, the pulling portion is overlapped on the second connecting piece when the tray lifting support is located at the initial position, and the second connecting piece is driven to descend when the tray lifting support moves from the initial position to the unloading position.
5. The lifting device according to claim 1, wherein the transmission mechanism comprises a vertically arranged screw rod and a moving member in threaded engagement with the screw rod; wherein the screw rod is connected with a driving shaft of the rotating motor; the moving piece is connected with the tray lifting support.
6. The lifting device of claim 5, further comprising a motor mount, a screw mount, and a base, wherein,
the motor fixing bracket and the base are fixedly connected with a fixing support of the semiconductor processing equipment; the rotating motor and the fixed part are connected with the motor fixed bracket;
the screw rod fixing seat is fixedly connected with the motor fixing support, the upper end of the screw rod is connected with the driving shaft of the rotating motor, and the lower end of the screw rod penetrates through the screw rod fixing seat and is rotatably connected with the base; and, the screw has a height adjusting structure for adjusting the upper end height of the screw by changing the length of the screw.
7. The lifting device of claim 1, further comprising a vertically disposed linear guide rail and first and second slides in sliding engagement therewith, wherein the first slide is coupled to the pallet lifting bracket; the second sliding piece is connected with the wafer lifting bracket.
8. The lifting device of claim 1, further comprising three sensors and a sensing member disposed on the pallet lifting support, wherein respective positions of the three sensors are configured to respectively detect the sensing member when the pallet lifting support is moved to the process position, the initial position, and the unloading position, respectively.
9. A semiconductor processing apparatus comprising a reaction chamber, a tray and a thimble disposed in the reaction chamber, and a lifting device connected to the tray and the thimble, respectively, by a tray lifting support and a wafer lifting support, for driving the tray lifting support and the wafer lifting support to move up and down, characterized in that the lifting device adopts the lifting device according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010312012.3A CN111490001B (en) | 2020-04-20 | 2020-04-20 | Lifting device of semiconductor processing equipment and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010312012.3A CN111490001B (en) | 2020-04-20 | 2020-04-20 | Lifting device of semiconductor processing equipment and semiconductor processing equipment |
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| CN111490001A CN111490001A (en) | 2020-08-04 |
| CN111490001B true CN111490001B (en) | 2024-01-05 |
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| CN112466799A (en) * | 2020-12-02 | 2021-03-09 | 北京北方华创微电子装备有限公司 | Method for controlling running speed of lifting mechanism |
Citations (4)
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| CN104465447A (en) * | 2013-09-17 | 2015-03-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying platform elevating gear, reaction cavity, and plasma processing device |
| CN104576491A (en) * | 2013-10-16 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Ejector pin lifting device and reaction chamber |
| CN104752290A (en) * | 2013-12-31 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting system and plasma processing apparatus |
| CN208762575U (en) * | 2018-07-10 | 2019-04-19 | 北京北方华创微电子装备有限公司 | Substrate transfer system |
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| US6827789B2 (en) * | 2002-07-01 | 2004-12-07 | Semigear, Inc. | Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104465447A (en) * | 2013-09-17 | 2015-03-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Carrying platform elevating gear, reaction cavity, and plasma processing device |
| CN104576491A (en) * | 2013-10-16 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Ejector pin lifting device and reaction chamber |
| CN104752290A (en) * | 2013-12-31 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Lifting system and plasma processing apparatus |
| CN208762575U (en) * | 2018-07-10 | 2019-04-19 | 北京北方华创微电子装备有限公司 | Substrate transfer system |
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