CN104752290A - Lifting system and plasma processing apparatus - Google Patents
Lifting system and plasma processing apparatus Download PDFInfo
- Publication number
- CN104752290A CN104752290A CN201310750767.1A CN201310750767A CN104752290A CN 104752290 A CN104752290 A CN 104752290A CN 201310750767 A CN201310750767 A CN 201310750767A CN 104752290 A CN104752290 A CN 104752290A
- Authority
- CN
- China
- Prior art keywords
- bracket
- pedestal
- jacking system
- substrate
- back shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a lifting system and a plasma processing apparatus. The lifting system comprises a bracket; at least three ejector pins are evenly arranged on the upper surface of the bracket in the circumferential direction at intervals; a base is located above the bracket; a driving unit drives the base to go up or down; at least three supporting shafts are evenly arranged in the circumferential direction of the bracket at intervals; each supporting shaft penetrates through the bracket from the lower surface of the bracket, and the bracket is capable of moving up and down along the supporting shaft; an elastic component sleeves the peripheral wall of each supporting shaft and is located between the bracket and the bottom end of the supporting shaft; when the base is in contact with the bracket, the driving unit drives the base to go down, so that the bracket can be driven to move down and the height of the elastic component can be compressed within the elastic range; the driving unit drives the base to go up so that the height of the elastic component can be recovered, and therefore, the bracket is capable of going up under the force of the height recovery of the elastic component. The lifting system is capable of reducing the production cost and improving the working efficiency; besides, the substrate transmission stability can be improved.
Description
Technical field
The invention belongs to semiconductor equipment manufacturing technology field, be specifically related to a kind of jacking system and plasma processing device.
Background technology
Physical vapour deposition (PVD) (Physical Vapor Deposition, hereinafter referred to as PVD) equipment is Application comparison semiconductor equipment widely, is mainly used in carrying out coating process to substrate surface.In actual applications, usually need by the manipulator be used in conjunction with each other and the jacking system for carrying out vertical lifting to substrate, the substrate not completing technique is imported into reaction chamber and the substrate completing technique is spread out of reaction chamber.
Jacking system generally includes PIN lowering or hoisting gear and pedestal lowering or hoisting gear, Fig. 1 is the structure diagram of existing PIN lowering or hoisting gear, Fig. 2 is the structure diagram of pedestal lowering or hoisting gear, see also Fig. 1 and Fig. 2, wherein, PIN lowering or hoisting gear comprises bracket 11 and the first driver element 13, wherein, bracket 11 is arranged in reaction chamber 10, and employing loop configuration, the upper surface of bracket 11 is evenly provided with at least three thimbles 12 along its circumference, and for carrying substrates S, the first driver element 13 carries out being elevated to drive substrate S to be elevated for driven bracket 11; Pedestal lowering or hoisting gear comprises pedestal 15 and the second driver element 14, pedestal 15 is for carrying substrates S, and the second driver element 14 is connected with pedestal 15, rises in order to drive pedestal 15 or declines, each thimble 12 runs through pedestal 15 from the lower surface of pedestal 15, and can be elevated in pedestal 15.First driver element 13 and the second driver element 14 adopt stepping motor or servomotor to drive usually, and the rotary motion of motor are converted to the rectilinear motion of demand by structures such as ball-screws.
This jacking system specific works process: step S1 of detailed hereafter, the substrate S not completing technique is imported into the predeterminated position in reaction chamber 10 by manipulator (not shown), so-called predeterminated position refers to the default position be positioned at directly at least three thimbles 12, first driver element 13 driven bracket 11 rises, at least three thimbles 12 are driven to rise to make it, to realize substrate S jack-up on the upper surface of manipulator, now, substrate S is positioned at directly over predeterminated position; Step S2, unloaded manipulator spreads out of reaction chamber 10, and the second driver element 14 drives pedestal 15 to rise to technique position, is held up by the substrate S be positioned at least three thimbles 12 and be located on the upper surface of pedestal 15 in the process that pedestal 15 rises; Step S3, treat that substrate S is after this technique position completes technique, the second driver element 14 drives pedestal 15 to decline, and will be positioned at the substrate S jack-up of pedestal 15 upper surface to make at least three thimbles 12, now substrate S is positioned at the top of predeterminated position, and pedestal 15 drops to the below of predeterminated position; Step S4, unloaded manipulator imports the predeterminated position in reaction chamber into via the gap between pedestal 15 and substrate S, first drive unit drives bracket 11 decline drive substrate S drops to substrate S and is positioned on the upper surface of manipulator, and the manipulator carrying the substrate S completing technique spreads out of reaction chamber 10.
But, above-mentioned jacking system is adopted inevitably to there is following technical problem in actual applications: because the lifting of this jacking system to bracket 11 and pedestal 15 adopts the mode of Electric Machine Control respectively, and the assembly work amount of employing Electric Machine Control mode is large, debug process is loaded down with trivial details, this make the assembling of whole jacking system and debugging work load large, thus cause inefficiency; And as shown in Figure 1, bracket 11 is cantilever beam structure, this causes the levelness of place, the top plane of at least three thimbles 12 low, thus causes the levelness of the substrate S carried low, thus causes the poor stability of substrate transfer.
Summary of the invention
The present invention is intended to solve in prior art the technical problem existed, and provides a kind of jacking system and plasma processing device, not only structure is simple, debug process is easy for it, debugging work load is little, thus can reduce production cost, increases work efficiency; And the levelness of substrate of carrying can be improved, and then the stability of substrate transfer can be improved.
The invention provides a kind of jacking system, comprise bracket, pedestal and driver element, the upper surface of described bracket is evenly provided with at least three thimbles, for carrying substrates along its circumferential interval, described pedestal is positioned at the top of described bracket, described driver element is for driving described pedestal to rise or declining, also comprise the circumferential interval along described bracket and at least three back shafts evenly arranged, each described back shaft runs through described bracket from the lower surface of described bracket, and described bracket can move up and down along described back shaft, the periphery wall of each described back shaft is equipped with elastomeric element, and described elastomeric element is between described bracket and the bottom of described back shaft, and when described pedestal contacts with described bracket, decline by pedestal described in described drive unit drives and can realize driving described bracket to decline, and the height of described elastomeric element is compressed in elastic range, and rise by pedestal described in described drive unit drives the height of described elastomeric element is recovered, rise under realizing restoring force that described bracket recovers at described elastomeric element height.
Wherein, the lower surface of described pedestal is provided with pressure ring, in order to drive described bracket to decline when described pedestal declines by described pressure ring.
Wherein, on each described back shaft, and the position be positioned at above described bracket is provided with locating part, for limiting the maximum height that described bracket rises along described back shaft.
Wherein, described locating part comprises nut, and described nut and described back shaft adopt thread connecting mode to fix.
Wherein, also comprise packing ring, described packing ring, between described nut and described bracket, contacts with described nut for avoiding described bracket.
Wherein, be provided with between described bracket and the periphery wall of each described back shaft without oily lining, for reducing frictional force therebetween.
Wherein, described elastomeric element comprises spring.
Wherein, each described thimble and described bracket adopt the mode be threaded to fix.
Wherein, each described thimble runs through described pedestal from the lower surface of described pedestal, and can be elevated in described pedestal, the upper surface of described pedestal is for carrying described substrate, pedestal described in described drive unit drives rises, and to be held up by the substrate on described at least three thimbles and be positioned on the upper surface of described pedestal to make it; Pedestal described in described drive unit drives declines, and will be positioned at the substrate jack-up on described pedestal upper surface with at least three thimbles described in making.
The present invention also provides a kind of plasma processing device, comprises reaction chamber, manipulator and jacking system, and described jacking system is used for being elevated the substrate in described reaction chamber; Described manipulator and described jacking system with the use of, in order to the substrate not completing technique is imported into described reaction chamber or the substrate completing technique is spread out of described reaction chamber, described jacking system adopts above-mentioned jacking system provided by the invention.
The present invention has following beneficial effect:
Jacking system provided by the invention, its circumferential interval along bracket and at least three back shafts evenly arranged, bracket is run through from the lower surface of bracket in the top of each back shaft, and bracket can move up and down along back shaft, and on the periphery wall of each back shaft, be equipped with elastomeric element, and elastomeric element is between bracket and the bottom of back shaft, and when pedestal contacts with described bracket, decline by drive unit drives pedestal and can realize driving bracket to decline, and the height of elastomeric element is compressed in elastic range; And rise by drive unit drives pedestal the height of elastomeric element is recovered, rise under realizing restoring force that bracket recovers at described elastomeric element height.As from the foregoing, this jacking system is elevated by the lifting auxiliary bracket of pedestal, this all needs to adopt the mode of Electric Machine Control to compare with prior art pedestal and the lifting of bracket, not only structure is simple, debug process is easy, debugging work load is little, thus can reduce production cost, increases work efficiency; And, this can improve the levelness of bracket compared with being cantilever beam structure with bracket in prior art, thus can improve the levelness of place, the top plane of at least three thimbles, thus the levelness of the substrate of carrying can be improved, and then the stability of substrate transfer can be improved.
Plasma processing device provided by the invention, it, by adopting jacking system provided by the invention, not only can reduce production cost, increase work efficiency; And the stability of substrate transfer can be improved.
Accompanying drawing explanation
Fig. 1 is the structure diagram of existing PIN lowering or hoisting gear;
Fig. 2 is the structure diagram of pedestal lowering or hoisting gear;
The stereogram of the jacking system that Fig. 3 provides for the embodiment of the present invention;
The structural representation of the jacking system that Fig. 4 provides for the embodiment of the present invention; And
Fig. 5 a is the schematic diagram not carrying out the current state before work of PIN lowering or hoisting gear;
Fig. 5 b is that manipulator is by the schematic diagram of predeterminated position in unprocessed substrate transfer to reaction chamber;
Fig. 5 c drives at least three thimbles to rise until will be positioned at the schematic diagram of the substrate jack-up of manipulator upper surface in the process of bracket rising;
Fig. 5 d is that at least three thimbles will be positioned at the schematic diagram of the substrate jack-up of pedestal upper surface in the process of pedestal decline;
Fig. 5 e is unloaded manipulator imports the predeterminated position of reaction chamber into schematic diagram via the gap between substrate and pedestal upper surface; And
Fig. 5 f is the schematic diagram that the drive declined at pedestal has completed the substrate decline of technique.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, jacking system provided by the invention and plasma processing device are described in detail.
The stereogram of the jacking system that Fig. 3 provides for the embodiment of the present invention.The structural representation of the jacking system that Fig. 4 provides for the embodiment of the present invention.See also Fig. 3 and Fig. 4, the jacking system that the present embodiment provides, comprise bracket 20, at least three back shafts 21, pedestal 27 and driver elements 28.Wherein, bracket 20 adopts loop configuration, and is evenly provided with at least three thimbles 22 along its circumferential interval on the upper surface of bracket 20, and for carrying substrates S, particularly, at least three thimbles 22 adopt the mode be threaded to fix with bracket 20; At least three back shafts 21 along bracket 20 circumferential interval and evenly arrange, bracket 20 is run through from the lower surface of bracket 20 in the top of each back shaft 21, and bracket 20 can move up and down along back shaft 21, the periphery wall of each back shaft 21 is equipped with elastomeric element 23, and elastomeric element 23 is between bracket 20 and the bottom of back shaft 21; Pedestal 27 is positioned at the top of bracket 20, driver element 28 rises for driving pedestal 27 or declines, and when pedestal 27 contacts with bracket 20, drive pedestal 27 to decline by driver element 28 and can realize driving bracket 20 to decline, and the height of elastomeric element 23 is compressed in elastic range; And drive pedestal 27 to rise by driver element 28 height of elastomeric element 23 is recovered, rise under realizing restoring force that bracket 20 highly recovers at elastomeric element 23.Preferably, elastomeric element 23 comprises Compress Spring.
Particularly, in the present embodiment, as shown in Figure 4, each thimble 22 runs through pedestal 27 from the lower surface of pedestal 27, and can be elevated in pedestal 27, and the upper surface of pedestal 27 is used for carrying substrates, and, driver element 28 is connected with pedestal 27 through the annular distance of bracket 20, and driver element 28 drives pedestal 27 to rise, and to be held up by the substrate S at least three thimbles 22 and be positioned on the upper surface of pedestal 27 to make it; Driver element 28 drives pedestal 27 to decline, and will be positioned at the substrate S jack-up on pedestal 27 upper surface to make at least three thimbles 22.
Preferably, the lower surface of pedestal 27 is provided with pressure ring 29, in order to drive bracket 20 to decline when pedestal 27 declines by pressure ring 29, wherein, pressure ring 29 can adopt closed loop configuration, also specifically can arrange the structure of pressure ring 29 according to actual conditions, such as, pressure ring 29 can comprise multiple sub-pressure ring, and multiple sub-pressure ring is evenly distributed on the surface corresponding with bracket 20 of pedestal 27, and the structure of every sub-pressure ring does not limit at this.Certainly, in actual applications, also can omit pressure ring 29, such as, when each back shaft 21 is positioned at the outside of pedestal 27 in bracket 20 radial direction, can declines by pedestal 27 and directly drive bracket 20 to decline.
The specific works process of the jacking system adopting the present embodiment to provide is described in detail: Fig. 5 a is the current state of not carrying out before work of PIN lowering or hoisting gear below in conjunction with Fig. 5 a ~ Fig. 5 f, wherein, driver element 28 drives pedestal 27 to decline, drive bracket 20 to decline by pressure ring 29, the pressure increase of elastomeric element 23 makes the height of elastomeric element 23 be in compressive state; Comprise the following steps:
S20, as shown in Figure 5 b, unprocessed substrate S is transferred to predeterminated position A in reaction chamber 40 by manipulator 30; Wherein, predeterminated position refers to the default position be positioned at directly at least three thimbles 22;
S21, as shown in Figure 5 c, driver element 28 drives pedestal 27 to rise, the pressure of elastomeric element 23 reduces, the height of elastomeric element 23 recovers from compressive state, elastomeric element 23 makes bracket 20 rise to extreme higher position (namely scheming bracket 20 position in c) along back shaft 21 under its restoring force, in the process that bracket 20 rises, drive at least three thimbles 22 to rise until will the substrate S jack-up of manipulator 30 upper surface be positioned at, now substrate S is positioned at the top of predeterminated position A, and unloaded manipulator 30 spreads out of reaction chamber 40;
S22, driver element 28 drives pedestal 27 to continue to rise to process station, because bracket 20 rises to extreme higher position, therefore when pedestal 27 continues to rise, bracket 20 keeps motionless, continue in the process risen at pedestal 27, the substrate S be positioned at least three thimbles 22 holds up and is positioned on the upper surface of pedestal 27 by pedestal 27, to realize carrying out technique at this process station place to the substrate S be positioned on the upper surface of pedestal 27;
S23, as fig 5d, after technique completes, driver element 28 drives pedestal 27 to drop to pressure ring 29 and contacts with bracket 20, and, in the process that pedestal 27 declines, at least three thimbles 22 will be positioned at the substrate S jack-up of pedestal 27 upper surface, and now, substrate S is positioned at the top of predeterminated position A;
S24, as depicted in fig. 5e, unloaded manipulator 30 imports the predeterminated position A of reaction chamber 40 into via the gap between substrate S and pedestal 27 upper surface;
S25, as shown in figure 5f, driver element 28 drives pedestal 27 to continue to decline, because pressure ring 29 contacts with bracket 20, therefore, while pedestal 27 declines, pressure ring 29 drives bracket 20 to decline, bracket 20 declines and drives the substrate S having completed technique to decline, until substrate S is positioned on the upper surface of manipulator 30;
S26, the manipulator 30 carrying the substrate S completing technique spreads out of reaction chamber 40.
Easy understand, a kind of course of work of the jacking system that the above-mentioned course of work just adopts the present embodiment to provide, certainly, in actual applications, in conjunction with actual conditions embody rule, can will not enumerate at this.
In the present embodiment, on each back shaft 21, and the position be positioned at above bracket 20 is provided with locating part, for limiting the maximum height that bracket 20 rises along back shaft 21, particularly, as shown in Figure 4, locating part comprises nut 24, nut 24 and back shaft 21 adopt thread connecting mode to fix, and this can prevent bracket 20 from rising to this back shaft 21 of disengaging along back shaft 21, thus can improve stability and the reliability of the jacking system that the present embodiment provides.Certainly, in actual applications, locating part also can adopt other execution modes to realize.Preferably, between nut 24 and bracket 20, be also provided with packing ring 25, for avoiding bracket 20 to contact with nut 24, contact with bracket 20 to prevent nut 24 and it is had an impact.
In addition, preferably, be provided with without oily lining 26 between bracket 20 and the periphery wall of each back shaft 21, for reducing frictional force therebetween, the levelness of bracket 20 is prevented to be affected by reducing the frictional force of bracket 20 with back shaft 21, thus can ensure that the levelness of the substrate carried is not affected, thus stability and the reliability of jacking system can be ensured further.Certainly, in actual applications, the frictional force that other modes reduce between bracket 20 and back shaft 20 can be adopted, such as, can on the surface of the two contact coating lubricating oil.
Easy understand, be also provided with holder 211 on the top of each back shaft 21, holder 211 is arranged on the inner bottom surface of reaction chamber 40, and adopts screw thread fixing mode holder 211 and reaction chamber 40 to be fixed.
In the present embodiment, driver element 28 adopts stepping motor or servomotor to drive usually, and the rotary motion of motor is converted to the rectilinear motion of demand by structures such as ball-screws.Certainly, in actual applications, other linear drive apparatus can also be adopted.
In sum, the jacking system that the present embodiment provides, its circumferential interval along bracket 20 and at least three back shafts 21 evenly arranged, bracket 20 is run through from the lower surface of bracket 20 in the top of each back shaft 21, and bracket 20 can move up and down along back shaft 21, and on the periphery wall of each back shaft 21, be equipped with elastomeric element 23, and elastomeric element 23 is between bracket 20 and the bottom of back shaft 21, and when pedestal 27 contacts with bracket 20, drive pedestal 27 to decline by driver element 28 can realize driving bracket 20 to decline, and the height of elastomeric element 23 is compressed in elastic range, and drive pedestal 27 to rise by driver element 28 height of elastomeric element 23 is recovered, rise under realizing restoring force that bracket 20 highly recovers at elastomeric element 23.As from the foregoing, this jacking system is elevated by the lifting auxiliary bracket of pedestal, this all needs to adopt the mode of Electric Machine Control to compare with prior art pedestal and the lifting of bracket, not only structure is simple, debug process is easy, debugging work load is little, thus can reduce production cost, increases work efficiency; And, this can improve the levelness of bracket compared with being cantilever beam structure with bracket in prior art, thus can improve the levelness of place, the top plane of at least three thimbles, thus the levelness of the substrate of carrying can be improved, and then the stability of substrate transfer can be improved.
As another one technical scheme, the present invention also provides a kind of plasma processing device, comprises reaction chamber, manipulator and jacking system, and jacking system is used for being elevated the substrate in reaction chamber; Manipulator and jacking system with the use of, in order to the substrate not completing technique is imported into reaction chamber or the substrate completing technique is spread out of reaction chamber, the jacking system that this jacking system adopts above-mentioned first embodiment to provide.
The plasma processing device that the present embodiment provides, it provides jacking system by adopting above-mentioned first embodiment, not only can reduce production cost, increase work efficiency; And the stability of substrate transfer can be improved.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, when not departing from principle of the present invention and essence, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a jacking system, comprises bracket, pedestal and driver element, and the upper surface of described bracket is evenly provided with at least three thimbles, for carrying substrates along its circumferential interval; Described pedestal is positioned at the top of described bracket, described driver element is for driving described pedestal to rise or declining, it is characterized in that, also comprise the circumferential interval along described bracket and at least three back shafts evenly arranged, each described back shaft runs through described bracket from the lower surface of described bracket, and described bracket can move up and down along described back shaft, the periphery wall of each described back shaft is equipped with elastomeric element, and described elastomeric element is between described bracket and the bottom of described back shaft, and
When described pedestal contacts with described bracket, decline by pedestal described in described drive unit drives and can realize driving described bracket to decline, and the height of described elastomeric element is compressed in elastic range; And rise by pedestal described in described drive unit drives the height of described elastomeric element is recovered, rise under realizing restoring force that described bracket recovers at described elastomeric element height.
2. jacking system according to claim 1, is characterized in that, the lower surface of described pedestal is provided with pressure ring, in order to drive described bracket to decline when described pedestal declines by described pressure ring.
3. jacking system according to claim 1, is characterized in that, on each described back shaft, and the position be positioned at above described bracket is provided with locating part, for limiting the maximum height that described bracket rises along described back shaft.
4. jacking system according to claim 3, is characterized in that, described locating part comprises nut, and described nut and described back shaft adopt thread connecting mode to fix.
5. jacking system according to claim 4, is characterized in that, also comprises packing ring, and described packing ring, between described nut and described bracket, contacts with described nut for avoiding described bracket.
6. jacking system according to claim 1, is characterized in that, is provided with without oily lining between described bracket and the periphery wall of each described back shaft, for reducing frictional force therebetween.
7. jacking system according to claim 1, is characterized in that, described elastomeric element comprises spring.
8. jacking system according to claim 1, is characterized in that, each described thimble and described bracket adopt the mode be threaded to fix.
9. jacking system according to claim 1, is characterized in that, each described thimble runs through described pedestal from the lower surface of described pedestal, and can be elevated in described pedestal, the upper surface of described pedestal for carrying described substrate,
Pedestal described in described drive unit drives rises, and to be held up by the substrate on described at least three thimbles and be positioned on the upper surface of described pedestal to make it;
Pedestal described in described drive unit drives declines, and will be positioned at the substrate jack-up on described pedestal upper surface with at least three thimbles described in making.
10. a plasma processing device, comprises reaction chamber, manipulator and jacking system, and described jacking system is used for being elevated the substrate in described reaction chamber; Described manipulator and described jacking system with the use of, in order to the substrate not completing technique is imported into described reaction chamber or the substrate completing technique is spread out of described reaction chamber, it is characterized in that, described jacking system adopts the jacking system described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750767.1A CN104752290B (en) | 2013-12-31 | 2013-12-31 | Jacking system and plasma processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750767.1A CN104752290B (en) | 2013-12-31 | 2013-12-31 | Jacking system and plasma processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104752290A true CN104752290A (en) | 2015-07-01 |
| CN104752290B CN104752290B (en) | 2017-10-20 |
Family
ID=53591779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310750767.1A Active CN104752290B (en) | 2013-12-31 | 2013-12-31 | Jacking system and plasma processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104752290B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106560914A (en) * | 2015-10-05 | 2017-04-12 | 亿力鑫系统科技股份有限公司 | Bearing device |
| CN108557419A (en) * | 2018-05-31 | 2018-09-21 | 君泰创新（北京）科技有限公司 | Elevator, process cavity equipment and its control method |
| CN109402591A (en) * | 2017-08-17 | 2019-03-01 | 中国电子科技集团公司第四十八研究所 | A kind of rotatable chip bench jacked |
| CN111490001A (en) * | 2020-04-20 | 2020-08-04 | 北京北方华创微电子装备有限公司 | Lifting device of semiconductor processing equipment and semiconductor processing equipment |
| CN117059531A (en) * | 2023-10-11 | 2023-11-14 | 研微(江苏)半导体科技有限公司 | Semiconductor reaction chamber and base isolation state detection method applied to same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302285A (en) * | 2008-06-13 | 2009-12-24 | Shibaura Mechatronics Corp | Plasma treatment apparatus, plasma treatment method, and method of manufacturing electronic device |
| US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
| KR20100067722A (en) * | 2008-12-12 | 2010-06-22 | 엘아이지에이디피 주식회사 | Substrate lifting apparatus |
| CN102568992A (en) * | 2010-12-27 | 2012-07-11 | 东京毅力科创株式会社 | Plasma processing apparatus |
| CN103066003A (en) * | 2012-12-10 | 2013-04-24 | 赖守亮 | Mechanical-type chip clamping-pressing device for vacuum plasma technology |
-
2013
- 2013-12-31 CN CN201310750767.1A patent/CN104752290B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302285A (en) * | 2008-06-13 | 2009-12-24 | Shibaura Mechatronics Corp | Plasma treatment apparatus, plasma treatment method, and method of manufacturing electronic device |
| US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
| KR20100067722A (en) * | 2008-12-12 | 2010-06-22 | 엘아이지에이디피 주식회사 | Substrate lifting apparatus |
| CN102568992A (en) * | 2010-12-27 | 2012-07-11 | 东京毅力科创株式会社 | Plasma processing apparatus |
| CN103066003A (en) * | 2012-12-10 | 2013-04-24 | 赖守亮 | Mechanical-type chip clamping-pressing device for vacuum plasma technology |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106560914A (en) * | 2015-10-05 | 2017-04-12 | 亿力鑫系统科技股份有限公司 | Bearing device |
| CN109402591A (en) * | 2017-08-17 | 2019-03-01 | 中国电子科技集团公司第四十八研究所 | A kind of rotatable chip bench jacked |
| CN108557419A (en) * | 2018-05-31 | 2018-09-21 | 君泰创新（北京）科技有限公司 | Elevator, process cavity equipment and its control method |
| CN111490001A (en) * | 2020-04-20 | 2020-08-04 | 北京北方华创微电子装备有限公司 | Lifting device of semiconductor processing equipment and semiconductor processing equipment |
| CN111490001B (en) * | 2020-04-20 | 2024-01-05 | 北京北方华创微电子装备有限公司 | Lifting device of semiconductor processing equipment and semiconductor processing equipment |
| CN117059531A (en) * | 2023-10-11 | 2023-11-14 | 研微(江苏)半导体科技有限公司 | Semiconductor reaction chamber and base isolation state detection method applied to same |
| CN117059531B (en) * | 2023-10-11 | 2024-01-26 | 研微(江苏)半导体科技有限公司 | Semiconductor reaction chamber and base isolation state detection method applied to same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104752290B (en) | 2017-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104752290A (en) | Lifting system and plasma processing apparatus | |
| CN104175316B (en) | Mechanical arm | |
| CN104465447A (en) | Carrying platform elevating gear, reaction cavity, and plasma processing device | |
| CN106532303A (en) | Floating plug-in electrical connector | |
| CN207656214U (en) | A kind of Novel adjusting pin and bearing press mounting equipment | |
| CN103617960A (en) | Transfer device of brittle sheet | |
| CN105552009A (en) | Semiconductor processing equipment | |
| CN104259891A (en) | Clamp assembly for rough machining of engine cylinder body | |
| CN207629538U (en) | Pressure installing mechanism, rotating disk mechanism and automatic production line | |
| CN106532304A (en) | Horizontal floating device and electrical connector comprising same | |
| CN203906801U (en) | Light mechanical sealing device for pump | |
| CN105206555A (en) | Transmission positioning system and semiconductor processing equipment | |
| CN103758895B (en) | reducer brake and engineering machinery | |
| CN106216446A (en) | A kind of for power equipment part and bending apparatus that reliability can be improved | |
| CN202501010U (en) | Ultrahigh pressure drilling mechanical seal | |
| CN204805548U (en) | Mechanical seal device for pump | |
| CN204381793U (en) | The press-loading device of valve guide bushing | |
| CN204935448U (en) | A kind of many rotating shafts synchronous clamping device | |
| CN208322831U (en) | A kind of line rail brake of linear motor | |
| CN205944059U (en) | Elevating system and semiconductor processing equipment | |
| CN106041630A (en) | Damping device for numerical-control machine tool | |
| CN204083482U (en) | Reciprocating spool retaining sealing configuration | |
| CN207309504U (en) | A kind of electro spindle back unloads knife cylinder | |
| CN204828536U (en) | Liftout rotary device | |
| CN204075781U (en) | The rough machined fixture assembly of a kind of engine cylinder-body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |