CN104752290B - Jacking system and plasma processing device - Google Patents
Jacking system and plasma processing device Download PDFInfo
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- CN104752290B CN104752290B CN201310750767.1A CN201310750767A CN104752290B CN 104752290 B CN104752290 B CN 104752290B CN 201310750767 A CN201310750767 A CN 201310750767A CN 104752290 B CN104752290 B CN 104752290B
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- bracket
- pedestal
- jacking system
- support shaft
- substrate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
Abstract
Jacking system and plasma processing device that the present invention is provided, it includes bracket, circumferentially-spaced at least three thimbles are evenly arranged with bracket upper surface and along its, pedestal is located at the top of bracket, driver element driving pedestal rises or declined, along the circumferentially-spaced of bracket and it is evenly arranged with least three support shafts, each support shaft runs through bracket from the lower surface of bracket, and bracket can be moved up and down along support shaft, elastomeric element is equipped with the periphery wall of each support shaft, and elastomeric element is located between bracket and the bottom of support shaft, when pedestal is contacted with bracket, decline by driver element driving pedestal and can be achieved to drive bracket to decline, and the height of elastomeric element is compressed in elastic range；And rising by driver element driving pedestal recovers the height of elastomeric element, to realize that bracket rises under the restoring force that elastomeric element highly recovers.It can reduce production cost, improve operating efficiency；And the stability of substrate transfer can be improved.
Description
Technical field
The invention belongs to semiconductor equipment manufacturing technology field, and in particular to a kind of jacking system and plasma process are set
It is standby.
Background technology
Physical vapour deposition (PVD) (Physical Vapor Deposition, hereinafter referred to as PVD) equipment is applied than wide
Semiconductor equipment, be mainly used in substrate surface carry out coating process.In actual applications, it usually needs by mutual cooperation
The manipulator used and the jacking system for carrying out vertical lifting to substrate, by the incoming reaction chamber of the substrate of unfinished technique
And the substrate for completing technique is spread out of into reaction chamber.
Jacking system generally includes PIN lowering or hoisting gears and pedestal lowering or hoisting gear, and Fig. 1 is the knot of existing PIN lowering or hoisting gears
Structure sketch, Fig. 2 is the structure diagram of pedestal lowering or hoisting gear, also referring to Fig. 1 and Fig. 2, wherein, PIN lowering or hoisting gears include support
The driver element 13 of frame 11 and first, wherein, bracket 11 is arranged in reaction chamber 10, and uses loop configuration, in bracket 11
At least three thimbles 12 are evenly arranged with upper surface and along its circumference, for carrying substrates S, the first driver element 13 is used to drive
Dynamic bracket 11 is lifted to drive substrate S to be lifted；Pedestal lowering or hoisting gear includes the driver element 14 of pedestal 15 and second, base
Seat 15 is used for carrying substrates S, and the second driver element 14 is connected with pedestal 15, to drive pedestal 15 to rise or fall, each
Thimble 12 runs through pedestal 15 from the lower surface of pedestal 15, and can be lifted in pedestal 15.First driver element 13 and second
Driver element 14 is generally driven using stepper motor or servomotor, and by structures such as ball-screws by the rotation of motor
The dynamic linear motion for being converted to demand of transhipment.
The detailed hereafter jacking system specific work process：Step S1, manipulator (not shown) will be not complete
Predeterminated position into the incoming reaction chambers 10 of substrate S of technique, so-called predeterminated position refers to default be located at least three tops
Position directly over pin 12, the first driver element 13 driving bracket 11 rises, so that it drives at least three thimbles 12 to rise, with
Realize substrate S from jack-up on the upper surface of manipulator, now, substrate S is located at the surface of predeterminated position；Step S2, it is unloaded
Manipulator outflow reaction chamber 10, the second driver element 14 driving pedestal 15 rise to technique position, pedestal 15 rise mistake
The substrate S at least three thimbles 12 is held up in journey and is located on the upper surface of pedestal 15；Step S3, treats substrate S
Completed in technique position after technique, the second driver element 14 driving pedestal 15 declines, to cause at least three thimbles 12 by position
Substrate S jack-up in the upper surface of pedestal 15, now substrate S is located at the top of predeterminated position, and pedestal 15 drops to predeterminated position
Lower section；Step S4, the default position of unloaded manipulator in the incoming reaction chamber in gap between pedestal 15 and substrate S
Put, the first driver element driving bracket 11, which declines, drives substrate S to drop to substrate S on the upper surface of manipulator, carries
The substrate S of technique manipulator outflow reaction chamber 10 is completed.
However, inevitably there is following technical problem in actual applications using above-mentioned jacking system：Due to this
The mode of motor control is respectively adopted in lifting of the jacking system to bracket 11 and pedestal 15, and using the assembling of motor control mode
Workload is big, debugging process is cumbersome, and this assembling for causing whole jacking system and debugging work load are big, so as to cause operating efficiency
It is low；Moreover, as shown in figure 1, bracket 11 is cantilever beam structure, this causes the level of the top place plane of at least three thimbles 12
Degree is low, thus causes the substrate S of carrying levelness low, so as to cause the stability of substrate transfer poor.
The content of the invention
Present invention seek to address that technical problem present in prior art adds there is provided a kind of jacking system and plasma
Construction equipment, it is not only simple in structure, debugging process is easy, debugging work load is small, so as to reduce production cost, improve work
Efficiency；And the levelness of the substrate of carrying can be improved, and then the stability of substrate transfer can be improved.
The present invention provides a kind of jacking system, including bracket, pedestal and driver element, on the upper surface of the bracket and
Along its it is circumferentially-spaced be evenly arranged with least three thimbles, for carrying substrates；The pedestal is located at the top of the bracket, institute
To state driver element be used to drive the pedestal to rise or decline, in addition to along the circumferentially-spaced of the bracket and is uniformly arranged
At least three support shafts, each support shaft runs through the bracket from the lower surface of the bracket, and the bracket can be along institute
State support shaft to move up and down, elastomeric element, and the elastomeric element are equipped with the periphery wall of each support shaft
Between the bottom of the bracket and the support shaft, and when the pedestal is contacted with the bracket, driven by described
Moving cell drives the pedestal to decline and can be achieved to drive the bracket to decline, and makes the height of the elastomeric element in elastic range
Interior compression；It is described to realize and driving the pedestal to rise by the driver element recovers the height of the elastomeric element
Bracket rises under the restoring force that the elastomeric element highly recovers.
Wherein, be provided with pressure ring on the lower surface of the pedestal, to when the pedestal declines by the pressure ring
The bracket is driven to decline.
Wherein, in each support shaft, and finite place piece is set at the position above the bracket, for limiting
Make the maximum height that the bracket rises along the support shaft.
Wherein, the locating part includes nut, and the nut is fixed with the support shaft using thread connecting mode.
Wherein, in addition to packing ring, the packing ring is located between the nut and the bracket, for avoid the bracket with
The nut contact.
Wherein, oil-free bushing is provided between the bracket and the periphery wall of each support shaft, for reducing two
Frictional force between person.
Wherein, the elastomeric element includes spring.
Wherein, each thimble is fixed with the bracket by the way of being threadedly coupled.
Wherein, each thimble runs through the pedestal from the lower surface of the pedestal, and can be carried out in the pedestal
Lifting, the upper surface of the pedestal is used to carry the substrate, and the driver element drives the pedestal to rise, so that it is by institute
The substrate at least three thimbles is stated to hold up and be located on the upper surface of the pedestal；The driver element is driven under the pedestal
Drop, so that at least three thimble is by the substrate jack-up on the pedestal upper surface.
The present invention also provides a kind of plasma processing device, including reaction chamber, manipulator and jacking system, the liter
Drop system is used to lift the substrate in the reaction chamber；The manipulator is used cooperatively with the jacking system, is used
To spread out of the reaction chamber, institute by the incoming reaction chamber of the substrate of unfinished technique or by the substrate for having completed technique
State the above-mentioned jacking system that jacking system is provided using the present invention.
The present invention has following beneficial effects：
The jacking system that the present invention is provided, it is along the circumferentially-spaced of bracket and at least three support shafts that are uniformly arranged, often
Bracket is run through in the top of individual support shaft from the lower surface of bracket, and bracket can be moved up and down along support shaft, and each
Elastomeric element is equipped with the periphery wall of support shaft, and elastomeric element is located between bracket and the bottom of support shaft, and in base
When seat is contacted with the bracket, decline by driver element driving pedestal and can be achieved to drive bracket to decline, and make elastomeric element
Height is compressed in elastic range；And rising by driver element driving pedestal recovers the height of elastomeric element, to realize support
Frame rises under the restoring force that the elastomeric element highly recovers.From the foregoing, it will be observed that the jacking system is aided in by the lifting of pedestal
Bracket is lifted, and this is not only tied compared with the lifting of prior art pedestal and bracket is required to by the way of the motor control
Structure is simple, debugging process is easy, debugging work load is small, so as to reduce production cost, improve operating efficiency；Moreover, this with
Bracket is compared for cantilever beam structure in the prior art, can improve the levelness of bracket, thus can improve at least three thimbles
Top where plane levelness, so as to the levelness for the substrate for improving carrying, and then substrate transfer can be improved
Stability.
The plasma processing device that the present invention is provided, it can be with by using the jacking system that provides of the present invention, not only
Reduce production cost, improve operating efficiency；And the stability of substrate transfer can be improved.
Brief description of the drawings
Fig. 1 is the structure diagram of existing PIN lowering or hoisting gears；
Fig. 2 is the structure diagram of pedestal lowering or hoisting gear；
Fig. 3 is the stereogram of jacking system provided in an embodiment of the present invention；
Fig. 4 is the structural representation of jacking system provided in an embodiment of the present invention；And
Fig. 5 a for the current state before not being operated of PIN lowering or hoisting gears schematic diagram；
Fig. 5 b are manipulator by the schematic diagram of predeterminated position in unprocessed substrate transfer to reaction chamber；
Fig. 5 c are to drive at least three thimbles to rise until by positioned at manipulator upper surface during bracket rises
The schematic diagram of substrate jack-up；
Fig. 5 d be pedestal decline during at least three thimbles by positioned at the signal of the substrate jack-up of pedestal upper surface
Figure；
The default position of gap incoming reaction chambers of Fig. 5 e for unloaded manipulator between substrate and pedestal upper surface
The schematic diagram put；And
Fig. 5 f are that the drive declined in pedestal has completed the schematic diagram that the substrate of technique declines.
Embodiment
To make those skilled in the art more fully understand technical scheme, the present invention is carried below in conjunction with the accompanying drawings
The jacking system and plasma processing device of confession are described in detail.
Fig. 3 is the stereogram of jacking system provided in an embodiment of the present invention.Fig. 4 is lifting system provided in an embodiment of the present invention
The structural representation of system.The jacking system provided also referring to Fig. 3 and Fig. 4, the present embodiment, including bracket 20, at least three
Support shaft 21, pedestal 27 and driver element 28.Wherein, bracket 20 uses loop configuration, and on the upper surface of bracket 20 and edge
Its is circumferentially-spaced to be evenly arranged with least three thimbles 22, for carrying substrates S, specifically, at least three thimbles 22 and bracket
20 are fixed by the way of threaded connection；At least three support shafts 21 are along the circumferentially-spaced of bracket 20 and are uniformly arranged, Mei Gezhi
Bracket 20 is run through in the top for supportting axle 21 from the lower surface of bracket 20, and bracket 20 can be moved up and down along support shaft 21, every
Be equipped with elastomeric element 23 on the periphery wall of individual support shaft 21, and elastomeric element 23 be located at bracket 20 and support shaft 21 bottom it
Between；Pedestal 27 be located at bracket 20 top, driver element 28 be used for drive pedestal 27 to rise or decline, and pedestal 27 with
When bracket 20 is contacted, decline by the driving pedestal 27 of driver element 28 and can be achieved to drive bracket 20 to decline, and make elastomeric element 23
Height compressed in elastic range；And rising by the driving pedestal 27 of driver element 28 recovers the height of elastomeric element 23,
To realize that bracket 20 rises under the restoring force that elastomeric element 23 highly recovers.Preferably, elastomeric element 23 includes compression spring.
Specifically, in the present embodiment, as shown in figure 4, each thimble 22 runs through pedestal 27 from the lower surface of pedestal 27, and
It can be lifted in pedestal 27, the upper surface of pedestal 27 is used for carrying substrates, also, driver element 28 passes through the ring of bracket 20
Hole is connected with pedestal 27, and the driving pedestal 27 of driver element 28 rises, so that it holds up the substrate S at least three thimbles 22
And on the upper surface of pedestal 27；The driving pedestal 27 of driver element 28 declines, so that at least three thimbles 22 will be located at pedestal
Substrate S jack-up on 27 upper surfaces.
Preferably, pressure ring 29 is provided with the lower surface of pedestal 27, to when pedestal 27 declines by the band of pressure ring 29
Dynamic bracket 20 declines, wherein, pressure ring 29 can also can specifically set pressure ring using the loop configuration closed according to actual conditions
29 structure, for example, pressure ring 29 can include many sub- pressure rings, and many sub- pressure rings are corresponding with bracket 20 in pedestal 27
It is evenly distributed on surface, the structure of every sub- pressure ring is not limited herein.Certainly, in actual applications, pressure ring can also be omitted
29, for example, when each support shaft 21 is radially located at the outside of pedestal 27 in bracket 20, can decline directly by pedestal 27
Bracket 20 is driven to decline.
The specific work process of the jacking system provided using the present embodiment is provided in detail with reference to Fig. 5 a~Fig. 5 f：
Fig. 5 a are the current state before not being operated of PIN lowering or hoisting gears, wherein, the driving pedestal 27 of driver element 28 declines, and borrows
Pressing aid ring 29 drives bracket 20 to decline, and the pressure of elastomeric element 23, which increases, causes the height of elastomeric element 23 to be in compressive state；
Comprise the following steps：
S20, as shown in Figure 5 b, manipulator 30 is by predeterminated position A in unprocessed substrate S transport to reaction chamber 40；Its
In, predeterminated position refers to the default position being located at directly at least three thimble 22；
S21, as shown in Figure 5 c, the driving pedestal 27 of driver element 28 rise, and the pressure of elastomeric element 23 reduces, elastomeric element
23 height is recovered since compressive state, and elastomeric element 23 causes bracket 20 to be risen to along support shaft 21 under its restoring force
Extreme higher position (i.e. the position of bracket 20 in Fig. 5 c), drives at least three thimbles 22 to rise directly during bracket 20 rises
To by positioned at the substrate S jack-up of the upper surface of manipulator 30, now substrate S is positioned at predeterminated position A top, unloaded manipulator 30
Spread out of reaction chamber 40；
S22, the driving pedestal 27 of driver element 28 continues to rise to process station, because bracket 20 has risen to highest order
Put, therefore bracket 20 is remained stationary as when pedestal 27 continues to rise, during pedestal 27 continues to rise, pedestal 27 will be located at
Substrate S at least three thimbles 22 holds up and is located on the upper surface of pedestal 27, is pointed to realizing at the process station
Substrate S on the upper surface of pedestal 27 carries out technique；
S23, as fig 5d, is treated after the completion of technique, the driving pedestal 27 of driver element 28 drops to pressure ring 29 and bracket 20
Contact, also, during pedestal 27 declines, at least three thimbles 22 by positioned at the substrate S jack-up of the upper surface of pedestal 27, this
When, substrate S is located at predeterminated position A top；
S24, as depicted in fig. 5e, the gap of unloaded manipulator 30 between substrate S and the upper surface of pedestal 27 are incoming anti-
Answer the predeterminated position A of chamber 40；
S25, as shown in figure 5f, the driving pedestal 27 of driver element 28 continue to decline, because pressure ring 29 is contacted with bracket 20, because
This, while pedestal 27 declines, pressure ring 29 drives bracket 20 to decline, and bracket 20, which declines, to be driven under the substrate S for having completed technique
Drop, until substrate S is located on the upper surface of manipulator 30；
S26, carries the outflow reaction chamber 40 of manipulator 30 for the substrate S for having completed technique.
It is readily appreciated that, the above-mentioned course of work is a kind of course of work of the jacking system provided using the present embodiment,
Certainly, in actual applications, actual conditions concrete application can be combined, be will not enumerate herein.
In the present embodiment, in each support shaft 21, and finite place piece is set at the position of the top of bracket 20, used
The maximum height risen in limitation bracket 20 along support shaft 21, specifically, as shown in figure 4, locating part includes nut 24, nut 24
Fixed with support shaft 21 using thread connecting mode, this can prevent bracket 20 from rising to along support shaft 21 to depart from the support shaft
21, thus the stability and reliability of the jacking system of the present embodiment offer can be provided.Certainly, in actual applications, it is spacing
Part can also be realized using other embodiment.Preferably, packing ring 25 is additionally provided between nut 24 and bracket 20, for keeping away
Exempt from bracket 20 to contact with nut 24, to prevent nut 24 is contacted with bracket 20 from producing it influence.
Furthermore it is preferred that oil-free bushing 26 is provided between bracket 20 and the periphery wall of each support shaft 21, for subtracting
Frictional force between both small, prevents the levelness of bracket 20 by shadow by bracket 20 is reduced with the frictional force of support shaft 21
Ring, thus can ensure that the levelness of the substrate of carrying is not affected, so as to be further ensured that the stabilization of jacking system
Property and reliability.Certainly, in actual applications, the frictional force between bracket 20 and support shaft 20 can be reduced using other modes,
For example, can the two contact surface on coating lubricating oil.
It is readily appreciated that, be additionally provided with fixed seat 211 on the top of each support shaft 21, fixed seat 211 is arranged on reaction chamber
On the inner bottom surface of room 40, and fixed seat 211 is fixed with reaction chamber 40 by the way of being screwed.
In the present embodiment, driver element 28 is generally driven using stepper motor or servomotor, and passes through rolling
The structures such as ballscrew are converted to the rotary motion of motor the linear motion of demand.Certainly, in actual applications, it would however also be possible to employ
Other linear drive apparatus.
In summary, the jacking system that the present embodiment is provided, it is along the circumferentially-spaced of bracket 20 and is uniformly arranged at least
Bracket 20 is run through in three support shafts 21, the top of each support shaft 21 from the lower surface of bracket 20, and bracket 20 can be along support shaft
21 move up and down, and are equipped with the periphery wall of each support shaft 21 elastomeric element 23, and elastomeric element 23 is located at
Between the bottom of bracket 20 and support shaft 21, and when pedestal 27 is contacted with bracket 20, pedestal is driven by driver element 28
27, which decline achievable drive bracket 20, declines, and the height of elastomeric element 23 is compressed in elastic range；And it is single by driving
Member 28 drive pedestal 27 rise recover the height of elastomeric element 23, with realize bracket 20 elastomeric element 23 highly recover it is extensive
Rise under multiple power.From the foregoing, it will be observed that the jacking system is lifted by the lifting auxiliary bracket of pedestal, this and prior art pedestal
It is required to compare by the way of motor control with the lifting of bracket, is not only simple in structure, debugging process is easy, debugging work load
It is small, so as to reduce production cost, improve operating efficiency；Moreover, this is compared with bracket in the prior art is cantilever beam structure,
The levelness of bracket can be improved, thus the levelness of the top place plane of at least three thimbles can be improved, so as to
The levelness of the substrate of carrying is improved, and then the stability of substrate transfer can be improved.
As another technical scheme, the present invention also provides a kind of plasma processing device, including reaction chamber, machine
Tool hand and jacking system, jacking system are used to lift the substrate in reaction chamber；Manipulator coordinates with jacking system and made
With to spread out of reaction chamber, the liter by the incoming reaction chamber of the substrate of unfinished technique or by the substrate for having completed technique
Drop system uses the jacking system that above-mentioned first embodiment is provided.
The plasma processing device that the present embodiment is provided, it provides jacking system by using above-mentioned first embodiment,
Production cost can not only be reduced, operating efficiency is improved；And the stability of substrate transfer can be improved.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, but the invention is not limited in this.For those skilled in the art, the original of the present invention is not being departed from
In the case of reason and essence, various changes and modifications can be made therein, and these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of jacking system, including bracket, pedestal and driver element, on the upper surface of the bracket and circumferentially-spaced along its
At least three thimbles are evenly arranged with, for carrying substrates；The pedestal is located at the top of the bracket, and the driver element is used
In driving the pedestal to rise or decline, it is characterised in that also including along the circumferentially-spaced of the bracket and being uniformly arranged
At least three support shafts, each support shaft runs through the bracket from the lower surface of the bracket, and the bracket can be along institute
State support shaft to move up and down, elastomeric element, and the elastomeric element are equipped with the periphery wall of each support shaft
Between the bottom of the bracket and the support shaft, and
When the pedestal is contacted with the bracket, drive the pedestal to decline by the driver element and can be achieved described in drive
Bracket declines, and the height of the elastomeric element is compressed in elastic range；And drive the base by the driver element
Seat, which rises, recovers the height of the elastomeric element, to realize the bracket under the restoring force that the elastomeric element highly recovers
Rise.
2. jacking system according to claim 1, it is characterised in that be provided with pressure ring on the lower surface of the pedestal,
To drive the bracket to decline by the pressure ring when the pedestal declines.
3. jacking system according to claim 1, it is characterised in that in each support shaft, and positioned at the support
Finite place piece is set at the position above frame, for limiting the maximum height that the bracket rises along the support shaft.
4. jacking system according to claim 3, it is characterised in that the locating part includes nut, the nut and institute
Support shaft is stated to fix using thread connecting mode.
5. jacking system according to claim 4, it is characterised in that also including packing ring, the packing ring is located at the nut
Between the bracket, for avoiding the bracket from being contacted with the nut.
6. jacking system according to claim 1, it is characterised in that in the bracket and the periphery of each support shaft
Oil-free bushing is provided between wall, for reducing frictional force therebetween.
7. jacking system according to claim 1, it is characterised in that the elastomeric element includes spring.
8. jacking system according to claim 1, it is characterised in that each thimble is connected with the bracket using screw thread
The mode connect is fixed.
9. jacking system according to claim 1, it is characterised in that the lower surface of each thimble from the pedestal is passed through
The pedestal is worn, and can be lifted in the pedestal, the upper surface of the pedestal is used to carry the substrate,
The driver element drives the pedestal to rise, so that the substrate at least three thimble is held up and is located at institute by it
State on the upper surface of pedestal；
The driver element drives the pedestal to decline, so that at least three thimble is by the pedestal upper surface
Substrate jack-up.
10. a kind of plasma processing device, including reaction chamber, manipulator and jacking system, the jacking system is used for pair
Substrate in the reaction chamber is lifted；The manipulator is used cooperatively with the jacking system, to by unfinished work
The substrate for having completed technique is spread out of the reaction chamber by the incoming reaction chamber of substrate of skill, it is characterised in that institute
Jacking system is stated using the jacking system described in claim 1-9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750767.1A CN104752290B (en) | 2013-12-31 | 2013-12-31 | Jacking system and plasma processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310750767.1A CN104752290B (en) | 2013-12-31 | 2013-12-31 | Jacking system and plasma processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104752290A CN104752290A (en) | 2015-07-01 |
| CN104752290B true CN104752290B (en) | 2017-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310750767.1A Active CN104752290B (en) | 2013-12-31 | 2013-12-31 | Jacking system and plasma processing device |
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| CN (1) | CN104752290B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201714243A (en) * | 2015-10-05 | 2017-04-16 | Els System Technology Co Ltd | Carrying device capable of carrying and moving a wafer upward and downward for providing more usage flexibility |
| CN109402591B (en) * | 2017-08-17 | 2020-12-11 | 中国电子科技集团公司第四十八研究所 | Rotatable and liftable substrate table |
| CN108557419A (en) * | 2018-05-31 | 2018-09-21 | 君泰创新（北京）科技有限公司 | Elevator, process cavity equipment and its control method |
| CN111490001B (en) * | 2020-04-20 | 2024-01-05 | 北京北方华创微电子装备有限公司 | Lifting device of semiconductor processing equipment and semiconductor processing equipment |
| CN117059531B (en) * | 2023-10-11 | 2024-01-26 | 研微(江苏)半导体科技有限公司 | Semiconductor reaction chamber and base isolation state detection method applied to same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5565892B2 (en) * | 2008-06-13 | 2014-08-06 | 芝浦メカトロニクス株式会社 | Plasma processing apparatus, plasma processing method, and electronic device manufacturing method |
| US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
| KR101135355B1 (en) * | 2008-12-12 | 2012-04-16 | 엘아이지에이디피 주식회사 | Substrate lifting apparatus |
| JP5759718B2 (en) * | 2010-12-27 | 2015-08-05 | 東京エレクトロン株式会社 | Plasma processing equipment |
| CN103066003A (en) * | 2012-12-10 | 2013-04-24 | 赖守亮 | Mechanical-type chip clamping-pressing device for vacuum plasma technology |
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| CN104752290A (en) | 2015-07-01 |
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