CN111477577A - Improved silicon wafer bearing device - Google Patents
Improved silicon wafer bearing device Download PDFInfo
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- CN111477577A CN111477577A CN202010492016.4A CN202010492016A CN111477577A CN 111477577 A CN111477577 A CN 111477577A CN 202010492016 A CN202010492016 A CN 202010492016A CN 111477577 A CN111477577 A CN 111477577A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 92
- 239000010703 silicon Substances 0.000 title claims abstract description 92
- 238000003860 storage Methods 0.000 claims abstract description 33
- 235000012431 wafers Nutrition 0.000 claims description 83
- 230000003014 reinforcing effect Effects 0.000 claims description 43
- 238000009434 installation Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 7
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000012545 processing Methods 0.000 description 29
- 239000000463 material Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000003351 stiffener Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an improved silicon wafer bearing device which comprises a bearing frame and a plurality of bearing discs, wherein the bearing frame is provided with a plurality of bearing holes; the bearing frame comprises a plurality of transverse supporting rods and two groups of guide rail group rods, the transverse supporting rods are arranged at equal intervals, and a bearing groove is formed by the space enclosed by every two transverse supporting rods and the two groups of guide rail group rods; a plurality of supporting and fixing rods are arranged among the plurality of transverse supporting rods; the bearing plate comprises a main body plate and a limiting piece; the limiting piece is arranged on the bottom surface of the main body plate, and the outer contour of the limiting piece corresponds to the inner contour of the bearing groove on the bearing frame; the width of main part board corresponds the setting with the horizontal size of bearing the weight of the groove, be equipped with a plurality of storage tanks on the top surface of main part board, a plurality of storage tanks are arranged along the equidistance of horizontal direction. The invention has simple structure, is detachable, saves plate raw materials, is convenient to process and is convenient to install.
Description
Technical Field
The invention relates to battery piece processing equipment, in particular to an improved silicon chip bearing device.
Background
The production process flow of the solar silicon wafer generally comprises silicon wafer detection, surface texture making and acid pickling, diffusion knot making, phosphorosilicate glass removal, plasma etching and acid pickling, antireflection film plating, screen printing, rapid sintering and the like. In the production and processing process, a plurality of silicon wafers to be processed are generally placed on the bearing frame, the whole bearing frame is connected and installed on the transportation rail, and the silicon wafers are driven to be transferred between the processing stations through the movement of the bearing frame, so that the silicon wafers are processed in batches. The bearing frame on the market is generally composed of a C/C composite board, specifically, a plurality of rectangular frame grooves are directly processed on the C/C composite board, so that a frame for bearing silicon wafers is formed, when the silicon wafers are placed, the silicon wafers are fixed on the rectangular frame grooves through hooks, or steps are directly processed at corresponding positions of the rectangular frame grooves, so that the silicon wafers are placed conveniently; however, the bearing frame processed in this way has a single function, and wastes sheet materials, resulting in an increase in processing cost. In order to overcome the above defects, the utility model with the publication number of CN209963033U discloses a spliced silicon wafer bearing frame, which is formed by splicing a plurality of horizontal supporting rods and a plurality of longitudinal supporting rods, so that the bearing frame is flexible to assemble and disassemble, convenient to store, and capable of saving plates and achieving the purpose of reducing the processing cost; however, the spliced bearing frame still needs to use a plurality of transverse supporting rods and longitudinal supporting rods, more C/C composite board materials are consumed, and the processing cost is still high; meanwhile, the bearing plate needs to be correspondingly installed in each bearing groove on the bearing frame, so that the silicon wafer to be processed can be placed on the bearing plate, the installation steps are complicated, and the feeding efficiency of the silicon wafer is influenced.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an improved silicon wafer bearing device which is simple in structure, detachable, convenient to process and convenient to install, and plate raw materials are saved.
The purpose of the invention is realized by the following technical scheme:
an improved silicon wafer bearing device is characterized by comprising a bearing frame and a plurality of bearing discs; the bearing frame comprises a plurality of transverse supporting rods and two groups of guide rail group rods, wherein the transverse supporting rods extend transversely and are arranged oppositely, the transverse supporting rods are arranged at equal intervals, two ends of each transverse supporting rod are detachably mounted on the two groups of guide rail group rods respectively, and a bearing groove is formed by a space surrounded by every two transverse supporting rods and the two groups of guide rail group rods; a plurality of supporting fixing rods are arranged among the plurality of transverse supporting rods and are perpendicular to the transverse supporting rods; the bearing plate comprises a main body plate and a limiting piece which is used for being matched and installed with the bearing frame; the limiting piece is arranged on the bottom surface of the main body plate, and the outer contour of the limiting piece corresponds to the inner contour of the bearing groove on the bearing frame; the width of the main body plate corresponds to the transverse size of the bearing groove, a plurality of storage grooves for storing silicon wafers are arranged on the top surface of the main body plate, and the storage grooves are arranged at equal intervals along the transverse direction; the plurality of bearing discs are correspondingly placed in the bearing grooves one by one.
The working principle of the improved silicon wafer bearing device is as follows:
firstly, placing a bearing plate in each bearing groove, and placing a limiting piece on the bottom surface of a main body plate in the bearing groove in a matching manner to realize limiting and fixing, so that the bearing plates are prevented from moving; then, placing a plurality of silicon wafers to be processed in a plurality of storage grooves on the top surface of the main body plate one by one, thereby completing the installation of the bearing plate and the placement of the silicon wafers to be processed; and then, starting the conveying chain to drive the whole bearing frame to move among the processing stations, so that the transportation and the transfer of the silicon wafers are realized. The bearing frame of the invention mainly uses the horizontal supporting rod to support the bearing disc, thereby realizing the carrying of the silicon wafer to be processed; for traditional carriage, saved the supporting rod of integral vertical setting, adopted the shorter support dead lever of length to accomplish the rigidity to horizontal supporting rod to avoid horizontal supporting rod to take place fore-and-aft bending type and become, the manufacturing of the panel of being convenient for like this reduces the processing degree of difficulty, reduces the requirement to raw and other materials, has further saved the material of carriage simultaneously, thereby is favorable to reduce cost. In the bearing plate, the outer contour of the limiting piece on the bottom surface of the main body plate is matched with the inner contour of the bearing groove, so that after the limiting piece is placed in the bearing groove, the inner side of the bearing groove can limit the movement of the limiting piece, the whole main body plate cannot move, the fixing of the main body plate is realized, and the position precision of a silicon wafer is ensured; meanwhile, the plurality of storage grooves are formed in the top surface of the main body plate, so that the silicon wafer can be placed, the movement of the silicon wafer can be limited, two purposes are achieved, the position precision of the silicon wafer is further improved, and the processing precision of the silicon wafer is improved; in addition, a plurality of silicon wafers can be loaded by installing one bearing disc, the installation process is simplified, the operation is convenient, meanwhile, the width of the bearing disc is matched with the transverse width of the bearing groove to form a rectangular or elongated bearing disc, the selection of plates is convenient during processing, the plates are not required to be cut into single independent bearing discs, the storage grooves are directly processed on the rectangular or elongated plates, and the processing difficulty is effectively reduced.
According to a preferable scheme of the invention, a plurality of limiting installation grooves arranged along the longitudinal direction are formed in the inner side of the guide rail group rod, the limiting installation grooves are arranged at equal intervals, and the limiting installation grooves are in a 7 shape; mounting hooks which are matched with the limiting mounting grooves and arranged at right angles are arranged at the two ends of the transverse supporting rod; and the mounting hooks at the two ends of the transverse supporting rod are correspondingly arranged on the limiting mounting grooves on the two groups of guide rail group rods.
Preferably, corner connecting pieces are arranged at the corners between the two ends of the transverse supporting rod and the guide rail group rods, connecting holes are formed in the corresponding positions of the guide rail group rods and the transverse supporting rod, and the corner connecting pieces are connected with the transverse supporting rod and the guide rail group rods through bolts.
According to a preferable scheme of the invention, a plurality of mounting holes are arranged on the transverse supporting rods, and the mounting holes on each transverse supporting rod are arranged in a one-to-one correspondence manner; the supporting and fixing rod is composed of a round rod, and two end parts of the supporting and fixing rod are matched with the mounting holes.
In a preferred embodiment of the present invention, the supporting and fixing rods between two adjacent sets of transverse supporting rods are staggered.
According to a preferable scheme of the invention, transverse reinforcing rods are arranged in front of the foremost transverse supporting rod and behind the rearmost transverse supporting rod, two ends of each transverse reinforcing rod are connected with the two groups of guide rail group rods, and a plurality of supporting and fixing rods are arranged between the transverse reinforcing rods and the transverse supporting rods.
Preferably, longitudinal reinforcing rods are arranged on the inner sides of the two groups of guide rail group rods, limiting grooves are arranged at the corresponding positions of the transverse supporting rods and the transverse reinforcing rods and the longitudinal reinforcing rods, and connecting grooves matched with the limiting grooves are arranged on the longitudinal reinforcing rods; the corner connecting pieces are arranged between the longitudinal reinforcing rod and the transverse supporting rod as well as between the longitudinal reinforcing rod and the transverse reinforcing rod.
In a preferred embodiment of the present invention, the guide rail assembly comprises a plurality of guide rail plates, the guide rail plates are arranged in a horizontal direction, and a vertical height of each guide rail plate is greater than a horizontal width of each guide rail plate.
In a preferred embodiment of the present invention, the top surface of the main body plate is further provided with a pick-and-place slot, the pick-and-place slot has a larger area than the storage slot, and the pick-and-place slot has a shallower depth than the storage slot.
In a preferable scheme of the invention, the bottom of the main body plate is also provided with a plurality of reinforcing ribs which are arranged in a criss-cross manner.
Compared with the prior art, the invention has the following beneficial effects:
1. the bearing frame has the advantages of saving plates and low processing cost, is convenient to store and disassemble, can be spliced into bearing frames with different sizes according to actual needs, and is good in flexibility. Compared with the traditional bearing frame, the bearing rod which is integrally and longitudinally arranged is omitted, the supporting fixing rod with shorter length is adopted to fix the position of the transverse bearing rod, so that the transverse bearing rod is prevented from longitudinally bending, the plate is more convenient to process and manufacture, the processing difficulty is reduced, the requirement on raw materials is reduced, the material of the bearing frame is further saved, and the cost is reduced.
2. According to the bearing plate, the plurality of storage grooves are formed in the main body plate, so that a plurality of silicon wafers can be loaded, the mounting process of the bearing plate is simplified, and the operation is convenient; meanwhile, the width of the main body plate is matched with the transverse width of the bearing groove to form a rectangular or elongated bearing disc, so that the selection of the plate is convenient during processing, the plate does not need to be cut into single independent bearing disc, and the storage groove is directly processed on the rectangular or elongated plate, so that the processing difficulty and the processing cost are effectively reduced; when in installation and positioning, the positioning matching with the bearing frame is realized through the limiting piece at the bottom of the main body plate, the operation is convenient,
drawings
Fig. 1-4 are schematic structural views of an improved silicon wafer carrying device according to an embodiment of the present invention, in which fig. 1 is a top view, fig. 2 is a bottom view, fig. 3 is a perspective view, and fig. 4 is a perspective view with a part of the carrying tray omitted.
Fig. 5-6 are schematic structural views of the carriage, where fig. 5 is a perspective view, and fig. 6 is an enlarged view of a in fig. 5.
Fig. 7 is a partial perspective view of a rail set bar.
Fig. 8 is a front view of the lateral support bar.
Fig. 9 is a perspective view of a support fixing rod.
Fig. 10 is a front view of the longitudinal stiffener.
Fig. 11-15 are schematic structural views of a carrier tray, wherein fig. 11 is a top view, fig. 12 is an enlarged view of B in fig. 11, fig. 13 is a bottom sectional view, fig. 14 is a perspective view, and fig. 15 is an enlarged view of C in fig. 14.
Detailed Description
The present invention will be further described with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.
Referring to fig. 1 to 15, the improved silicon wafer carrying device of the present embodiment includes a carrying frame 17 and a plurality of carrying trays 16; the bearing frame 17 comprises a plurality of transverse supporting rods extending transversely and two groups of guide rail group rods, the two groups of guide rail group rods extend along the longitudinal direction and are arranged oppositely, the plurality of transverse supporting rods are arranged at equal intervals, two ends of each transverse supporting rod are respectively detachably mounted on the two groups of guide rail group rods, and a space surrounded by every two transverse supporting rods and the two groups of guide rail group rods forms a bearing groove 15; a plurality of supporting fixing rods are arranged among the plurality of transverse supporting rods and are perpendicular to the transverse supporting rods; the bearing plate 16 comprises a main body plate and a limiting piece which is used for being matched and installed with the bearing frame 17; the limiting piece is arranged on the bottom surface of the main body plate, and the outer contour of the limiting piece corresponds to the inner contour of the bearing groove 15 on the bearing frame 17; the width of the main body plate corresponds to the transverse size of the bearing groove 15, a plurality of storage grooves for storing silicon wafers are arranged on the top surface of the main body plate, and the storage grooves are arranged at equal intervals along the transverse direction; the plurality of carrier trays 16 are placed in the carrier slots 15 in a one-to-one correspondence.
Referring to fig. 5-8, a plurality of limiting installation grooves 9 are formed in the inner side of the guide rail group rod 5 along the longitudinal direction, the limiting installation grooves 9 are arranged at equal intervals, and the limiting installation grooves 9 are 7-shaped; mounting hooks 11 which are matched with the limiting mounting grooves 9 and are arranged at right angles are arranged at two ends of the transverse supporting rod 1; and the mounting hooks 11 at the two ends of the transverse supporting rod 1 are correspondingly arranged on the limiting mounting grooves 9 on the two groups of guide rail group rods 5. Through the setting of spacing mounting groove 9 and installation hook 11, be convenient for horizontal supporting rod 1 and the installation and the dismantlement of guide rail group pole 5 to spacing effectual, accomplish the restriction to horizontal and longitudinal direction of horizontal supporting rod 1 simultaneously, design benefit, simple structure.
Referring to fig. 5-6, corner connectors 7 are disposed at corners between two ends of the transverse support rod 1 and the guide rail group rods 5, connecting holes 10 are disposed at corresponding positions of the guide rail group rods 5 and the transverse support rod 1, and the corner connectors 7 are connected with the transverse support rod 1 and the guide rail group rods 5 through bolts. Through the arrangement of the corner connecting piece 7, the stability between the transverse supporting rod 1 and the guide rail group rod 5 is further enhanced, so that the connection between the transverse supporting rod and the guide rail group rod is firmer.
Referring to fig. 5, 8 and 9, a plurality of mounting holes 6 are formed in the transverse support rods 1, and the mounting holes 6 in each transverse support rod 1 are arranged in a one-to-one correspondence manner; the supporting and fixing rod 3 is composed of a round rod, and two end parts of the supporting and fixing rod 3 are matched with the mounting holes 6. The supporting and fixing rod 3 and the transverse supporting rod 1 are installed and connected in such a way, so that the assembly and disassembly are convenient, and the processing is easy. In this embodiment, the mounting holes 6 are through holes, mounting posts 13 are disposed at two ends of the supporting and fixing rod 3, the mounting posts 13 are matched with the mounting holes 6, and the diameter of the main body of the supporting and fixing rod 3 is larger than that of the mounting holes 6; thus, the mounting holes 6 are formed as through holes, which facilitates the mounting connection of the supporting and fixing rods 3 at the front and rear sides of the transverse supporting rod 1, so that the supporting and fixing rods 3 can be mounted at corresponding positions according to actual requirements.
Referring to fig. 5, the supporting and fixing bars 3 between two adjacent sets of the transverse supporting bars 1 are arranged in a staggered manner. In this embodiment, the supporting fixing rods 3 between two adjacent sets of the horizontal supporting rods 1 are randomly arranged, and are arranged in a staggered manner or in a mutually corresponding manner.
Referring to fig. 5, the transverse reinforcing rods 2 are respectively arranged in front of the foremost transverse supporting rod 1 and behind the rearmost transverse supporting rod 1, two ends of each transverse reinforcing rod 2 are respectively connected with the two sets of guide rail group rods 5, and a plurality of supporting and fixing rods 3 are arranged between each transverse reinforcing rod 2 and each transverse supporting rod 1. In this embodiment, the transverse reinforcing rods 2 are further fixedly connected with the corners of the guide rail group rods 5 through corner connecting pieces 7 and bolts. Through the setting of horizontal stiffener 2, be favorable to improving whole carriage 17's stability. In this embodiment, the two end portions of the horizontal reinforcing rod 2 are also provided with mounting hooks 11, and the corresponding portion of the guide rail group rod 5 is also provided with a limiting mounting groove 9, so as to limit and fix the position of the horizontal reinforcing rod 2.
Referring to fig. 5, 6, 8 and 10, longitudinal reinforcing rods 4 are respectively arranged on the inner sides of the two groups of guide rail group rods 5, limiting grooves 12 are respectively arranged on the transverse supporting rods 1 and the transverse reinforcing rods 2 corresponding to the longitudinal reinforcing rods 4, and connecting grooves 14 matched with the limiting grooves 12 are arranged on the longitudinal reinforcing rods 4; and the corner connecting pieces 7 are arranged between the longitudinal reinforcing rod 4 and the transverse supporting rod 1 as well as between the longitudinal reinforcing rod and the transverse reinforcing rod 2. Through indulging the setting of stiffener 4, form the cooperation with horizontal stiffener 2 for whole bearing frame 17 is firmer all around, and stability is better, and can further carry out spacing and connection installation to all horizontal supporting rod 1, thereby improves whole bearing frame 17's stability. In this embodiment, the spacing groove 12 on the horizontal supporting rod 1 is downward, the spacing groove 12 on the horizontal reinforcing rod 2 is downward, indulge the connecting groove 14 on the reinforcing rod 4 and correspond the matching setting, set up the spacing groove 12 of different orientations like this, be favorable to improving the installation back and indulge the fastening nature and the stability between reinforcing rod 4, horizontal reinforcing rod 2 and the horizontal supporting rod 1.
Referring to fig. 5 to 8, the guide rail set bar 5 includes a plurality of guide rail plates 8, the plurality of guide rail plates 8 are arranged in a horizontal direction, and a vertical height of each guide rail plate 8 is greater than a horizontal width. In this embodiment, the plurality of rail plates 8 are connected together by bolts. By arranging the guide rail group rod 5, the bending resistance of the guide rail plate 8 in the vertical direction is obviously improved, so that the deformation resistance of the whole bearing frame 17 is improved, the top surface of a silicon wafer is ensured to be kept horizontal in the processing and transporting processes, and the processing quality of the silicon wafer is improved.
The transverse supporting rods, the supporting and fixing rods, the transverse reinforcing rods, the longitudinal reinforcing rods, the guide rail group rods and the like of the bearing frame 17 in the embodiment are all made of graphite or C-C composite materials.
In this embodiment, the depth of the storage groove 2a is smaller than the thickness of the silicon wafer. Therefore, the silicon wafer can be conveniently taken out from the storage groove 2a by workers through the edge of the silicon wafer protrusion, the structure is simple, and the practicability is high.
Referring to fig. 11, 12, 14 and 15, the storage groove 2a is provided with a chamfer 5a at each corner thereof. Through the setting of chamfer 5a, can match with the silicon chip that is equipped with chamfer 5a to the workman also can begin to take out through the chamfer 5a department of silicon chip when taking out the silicon chip, and it is more convenient to operate, and can avoid the corner of silicon chip to prick the hand.
Referring to fig. 11, 12, 14 and 15, the corners of the chamfers 5a at the corners of the storage tub 2a and the inner walls of the storage tub 2a are rounded. Therefore, the sharp corner of the silicon wafer can be prevented from directly contacting the inner wall of the storage groove 2a, the side edge of the silicon wafer is prevented from colliding with the inner wall of the storage groove 2a, and the protection of the silicon wafer is facilitated; meanwhile, the middle part of the inner wall of the whole storage groove 2a, which is only left with the chamfer 5a, is a plane and is used for positioning and fixing the silicon wafer, the structure is simple, the area of direct contact between the silicon wafer and the inner wall of the storage groove 2a is effectively reduced, and the design is ingenious.
Referring to fig. 11, 12, 14 and 15, the top surface of the main body plate 1a is further provided with a pick-and-place slot 3a, the pick-and-place slot 3a has a larger area than the storage slot 2a, and the pick-and-place slot 3a has a shallower depth than the storage slot 2 a. Thus, on the one hand, by taking in and out the slot 3aThe arrangement of the silicon wafer storage tank enables a worker to take the silicon wafer from the edge of the silicon wafer through the gap between the taking and placing groove 3a and the storage groove 2a when the processed silicon wafer needs to be taken out, so that the silicon wafer is taken out, and the operation is convenient; on the other hand, the edge of the silicon wafer can be prevented from being exposed by the arrangement of the taking and placing groove 3a, and the processing precision of the silicon wafer is improved under the protection of the taking and placing groove 3 a; in addition, the taking and placing groove 3a with larger area can also be used for placing silicon wafers with larger sizes, so that the silicon wafer taking and placing device can adapt to silicon wafers with two different sizes, and is ingenious in design.
Referring to fig. 11, 12, 14 and 15, the access slot 3a is provided with a circular slot 4a at each of four corners, and the circular slot 4a is communicated with the access slot 3 a. When the silicon wafer needs to be stored on the taking and placing groove 3a, the round groove 4a can prevent the corners of the silicon wafer from being directly touched with the corners of the taking and placing groove 3a, and the corners of the silicon wafer can be effectively protected.
Referring to fig. 13, the limiting member includes four sets of limiting posts 7a, and connecting lines of two limiting posts 7a of each set of limiting posts 7a are respectively arranged in parallel with four edges of the main body plate 1 a; the connecting lines of the four groups of limiting columns 7a form the outer contour of the limiting part. The matching with the bearing groove 15 is realized through the arrangement of the limiting columns 7a, and the position of the main body plate 1a is limited; the mode that adopts spacing post 7a, simple structure to can alleviate the weight that bears dish 16, thereby alleviate the pressure to silicon chip bearing frame 17, avoid silicon chip bearing frame 17 to take place deformation.
Referring to fig. 13, the bottom of the main body plate 1a is further provided with a plurality of ribs 6a, and the plurality of ribs 6a are arranged in a criss-cross manner. Through the arrangement of the reinforcing ribs 6a, the bearing capacity and the deformation resistance of the main body plate 1a are improved, the main body plate 1a is ensured to keep a horizontal posture, and deformation is avoided.
Referring to fig. 11, 12, 14 and 15, the two ends of the top surface of the main body plate 1a are left blank, so that the solid part of the main body plate 1a can be supported on the guide rail set rods at the two sides of the carrying frame 17, so that the main body plate 1a and the carrying money can be mounted, and the silicon wafer is prevented from being placed at the position close to the edge of the top surface of the main body plate 1 a. In this embodiment, the limiting columns 7a located at the two end portions of the main body plate 1a are disposed at the blank processing positions at the two end portions of the bottom of the main body plate 1 a; meanwhile, a plurality of sets of limiting holes 18 are formed in the guide rail set rod of the bearing frame 17, and when the bearing plate 16 of the embodiment is installed, the limiting posts 7a on the bottom surfaces of the two end portions of the main body plate 1a are correspondingly inserted into the limiting holes 18, so that the installation and position limitation of the whole bearing plate 16 are completed, and the position limitation effect of the bearing plate 16 is good.
In this embodiment, the main body plate 1a is made of a graphite material. The main body plate 1a made of graphite stores the silicon wafer, on one hand, the graphite main body plate 1a has a good heat conduction function and is in contact with the whole bottom surface of the silicon wafer, so that the silicon wafer can be uniformly heated, and the silicon wafer can be better subjected to film coating processing under specific conditions; on the other hand, the compactness of the graphite main body plate 1a is better than that of a C-C composite plate, the processed surface is smoother, damage to a coating layer on a silicon wafer is avoided, and the main body plate 1a with better compactness and high surface smoothness can avoid dust adsorption in the coating processing process, so that the coating processing precision of the silicon wafer is improved.
Referring to fig. 1 to fig. 15, the working principle of the improved silicon wafer carrying device of the present embodiment is as follows:
firstly, a bearing plate 16 is placed in each bearing groove 15, and a limiting member on the bottom surface of the main body plate is placed in the bearing groove 15 in a matching manner to realize limiting and fixing, so that the bearing plate 16 is prevented from moving; then, placing a plurality of silicon wafers to be processed in a plurality of storage grooves 2 on the top surface of the main body plate 1a one by one, thereby completing the installation of the bearing plate 16 and the placement of the silicon wafers to be processed; and then, starting the conveying chain to drive the whole bearing frame 17 to move among the processing stations, so that the transportation and the transfer of the silicon wafers are realized. The bearing frame 17 of the invention mainly uses the horizontal supporting rod 1 to complete the support of the bearing disc 16, thereby realizing the carrying of the silicon wafer to be processed; for traditional carriage 17, saved the supporting rod of integral vertical setting, adopted the shorter support dead lever 3 of length to accomplish the rigidity to horizontal supporting rod 1 to avoid horizontal supporting rod 1 to take place fore-and-aft bending type and become, the manufacturing of the panel of being convenient for like this reduces the processing degree of difficulty, reduces the requirement to raw and other materials, has further saved carriage 17's material simultaneously, thereby is favorable to reduce cost. In the carrier tray 16 of the present invention, since the outer contour of the limiting element on the bottom surface of the main body plate 1a is matched with the inner contour of the carrier slot 15, when the limiting element is placed in the carrier slot 15, the inner side of the carrier slot 15 will limit the movement of the limiting element, so that the whole main body plate 1 cannot move, the fixing of the main body plate 1 is realized, and the position accuracy of the silicon wafer is ensured; meanwhile, the plurality of storage grooves 2a are formed in the top surface of the main body plate 1, so that the silicon wafer can be placed, the movement of the silicon wafer can be limited, two purposes are achieved, the position accuracy of the silicon wafer can be further improved, and the processing accuracy of the silicon wafer can be improved; in addition, a plurality of silicon wafers can be loaded by installing one bearing disc 16, the installation process is simplified, the operation is convenient, meanwhile, the width of the bearing disc 16 is matched with the transverse width of the bearing groove 15 to form a rectangular or strip-shaped bearing disc 16, the selection of plates is convenient during processing, the storage groove 2a is directly processed on the rectangular or strip-shaped plate without cutting the plate into the single independent bearing disc 16, and the processing difficulty is effectively reduced.
The present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents and are included in the scope of the present invention.
Claims (10)
1. An improved silicon wafer bearing device is characterized by comprising a bearing frame and a plurality of bearing discs; the bearing frame comprises a plurality of transverse supporting rods and two groups of guide rail group rods, wherein the transverse supporting rods extend transversely and are arranged oppositely, the transverse supporting rods are arranged at equal intervals, two ends of each transverse supporting rod are detachably mounted on the two groups of guide rail group rods respectively, and a bearing groove is formed by a space surrounded by every two transverse supporting rods and the two groups of guide rail group rods; a plurality of supporting fixing rods are arranged among the plurality of transverse supporting rods and are perpendicular to the transverse supporting rods; the bearing plate comprises a main body plate and a limiting piece which is used for being matched and installed with the bearing frame; the limiting piece is arranged on the bottom surface of the main body plate, and the outer contour of the limiting piece corresponds to the inner contour of the bearing groove on the bearing frame; the width of the main body plate corresponds to the transverse size of the bearing groove, a plurality of storage grooves for storing silicon wafers are arranged on the top surface of the main body plate, and the storage grooves are arranged at equal intervals along the transverse direction; the plurality of bearing discs are correspondingly placed in the bearing grooves one by one.
2. The improved silicon wafer bearing device as claimed in claim 1, wherein a plurality of limiting installation grooves are arranged along the longitudinal direction on the inner side of the guide rail group rod, the limiting installation grooves are arranged at equal intervals, and the limiting installation grooves are in a 7 shape; mounting hooks which are matched with the limiting mounting grooves and arranged at right angles are arranged at the two ends of the transverse supporting rod; and the mounting hooks at the two ends of the transverse supporting rod are correspondingly arranged on the limiting mounting grooves on the two groups of guide rail group rods.
3. The improved silicon wafer bearing device as claimed in claim 2, wherein corner connectors are disposed at corners between two ends of the transverse supporting rod and the guide rail set rods, connecting holes are disposed at positions corresponding to the guide rail set rods and the transverse supporting rod, and the corner connectors are connected with the transverse supporting rod and the guide rail set rods through bolts.
4. The improved silicon wafer bearing device according to claim 1, wherein a plurality of mounting holes are formed in the transverse support rods, and the mounting holes in each transverse support rod are arranged in a one-to-one correspondence; the supporting and fixing rod is composed of a round rod, and two end parts of the supporting and fixing rod are matched with the mounting holes.
5. The improved silicon wafer bearing device as claimed in claim 1 or 4, wherein the supporting and fixing bars between two adjacent sets of transverse supporting bars are arranged in a staggered manner.
6. The improved silicon wafer bearing device as claimed in claim 3, wherein a transverse reinforcing rod is arranged in front of the foremost transverse supporting rod and behind the rearmost transverse supporting rod, both ends of the transverse reinforcing rod are connected with the two sets of guide rail set rods, and a plurality of supporting and fixing rods are arranged between the transverse reinforcing rod and the transverse supporting rod.
7. The improved silicon wafer bearing device according to claim 1, wherein 6, longitudinal reinforcing rods are arranged on the inner sides of the two sets of guide rail set rods, limiting grooves are arranged on the transverse supporting rods and the transverse reinforcing rods corresponding to the longitudinal reinforcing rods, and connecting grooves matched with the limiting grooves are arranged on the longitudinal reinforcing rods; the corner connecting pieces are arranged between the longitudinal reinforcing rod and the transverse supporting rod as well as between the longitudinal reinforcing rod and the transverse reinforcing rod.
8. The improved silicon wafer bearing device according to claim 1, wherein the guide rail set rod comprises a plurality of guide rail plates, the guide rail plates are arranged in a transverse direction, and the vertical height of each guide rail plate is larger than the transverse width.
9. The improved silicon wafer bearing device according to claim 1, wherein the top surface of the main body plate is further provided with a pick-and-place slot, the pick-and-place slot has a larger area than the storage slot, and the pick-and-place slot has a shallower depth than the storage slot.
10. The improved silicon wafer bearing device according to claim 1, wherein a plurality of reinforcing ribs are further arranged at the bottom of the main body plate, and the plurality of reinforcing ribs are arranged in a criss-cross manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010492016.4A CN111477577A (en) | 2020-06-02 | 2020-06-02 | Improved silicon wafer bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010492016.4A CN111477577A (en) | 2020-06-02 | 2020-06-02 | Improved silicon wafer bearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111477577A true CN111477577A (en) | 2020-07-31 |
Family
ID=71765049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010492016.4A Pending CN111477577A (en) | 2020-06-02 | 2020-06-02 | Improved silicon wafer bearing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111477577A (en) |
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2020
- 2020-06-02 CN CN202010492016.4A patent/CN111477577A/en active Pending
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