CN111468945B - Copper joint machining system and machining process - Google Patents

Copper joint machining system and machining process Download PDF

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Publication number
CN111468945B
CN111468945B CN202010209054.4A CN202010209054A CN111468945B CN 111468945 B CN111468945 B CN 111468945B CN 202010209054 A CN202010209054 A CN 202010209054A CN 111468945 B CN111468945 B CN 111468945B
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China
Prior art keywords
joint
joint body
conveying line
positioning jig
soldering
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CN111468945A (en
Inventor
叶军
顾敏
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Suzhou Aijiu Electric Co ltd
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Suzhou Aijiu Electric Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P23/00Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass

Abstract

The invention relates to a copper joint processing system and a processing technology, wherein the processing system comprises: the stamping equipment is used for stamping and forming the joint body, and a discharge guide plate is arranged at the discharge end of the stamping equipment; with the loading attachment that ejection of compact baffle butt joint, loading attachment includes: the feeding device comprises a feeding conveying line, a material arranging vibration disc and a positioning jig, wherein the feeding conveying line is butted with the discharging end of the discharging guide plate, the material arranging vibration disc is matched with the discharging end of the feeding conveying line, and the positioning jig is butted with the material arranging vibration disc; the electroplating box is used for carrying out electroplating silver plating treatment on the joint body, and the feeding conveying line is immersed in the electroplating box; the liquid dipping device is used for smearing soldering flux on the joint body on the positioning jig; and a soldering machine for performing a soldering process. By the processing system, the consistency of the whole copper joint processing process is stronger, the working efficiency is improved, and the manual workload is reduced.

Description

Copper joint machining system and machining process
Technical Field
The invention relates to the technical field of copper joint machining, in particular to a copper joint machining system and a copper joint machining process.
Background
A copper joint for car door window usually needs to pass through steps such as punching press, electroplating, soldering tin, and each step is all independently accomplished at present, and the continuity is relatively poor, has reduced production efficiency.
Disclosure of Invention
In order to solve the technical problems, the invention provides a copper joint processing system and a processing technology, and the copper joint processing system and the processing technology have the advantage of improving the production efficiency.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a copper joint machining system, comprising:
the stamping equipment is used for stamping and forming the joint body, and a discharge guide plate is arranged at the discharge end of the stamping equipment;
with the loading attachment that ejection of compact baffle butt joint, loading attachment includes: the feeding device comprises a feeding conveying line, a material arranging vibration disc and a positioning jig, wherein the feeding conveying line is butted with the discharging end of the discharging guide plate, the material arranging vibration disc is matched with the discharging end of the feeding conveying line, and the positioning jig is butted with the material arranging vibration disc;
the electroplating box is used for carrying out electroplating silver plating treatment on the joint body, and the feeding conveying line is immersed in the electroplating box;
the liquid dipping device is used for smearing soldering flux on the joint body on the positioning jig; and the number of the first and second groups,
a soldering machine for performing a soldering process.
As a preferable aspect of the present invention, the feeding conveyor line includes: the lifting conveying belt is immersed in the electroplating box and is butted with the discharging guide plate, the lifting conveying belt is butted with the plane conveying belt, and the discharging end of the lifting conveying belt is butted with the material arranging vibration disc.
As a preferable scheme of the invention, a drying box is arranged on the electroplating box, a drying channel is arranged on the drying box, and the lifting conveyer belt penetrates through the drying channel.
As a preferable aspect of the present invention, the positioning jig includes: the positioning seat, set up constant head tank on the positioning seat and set up the positioning seat just is located the detection sensor of constant head tank both sides, detection sensor detects when the constant head tank embeds joint body, dip in the liquid device and paint the scaling powder to connect on the body.
As a preferable aspect of the present invention, the dip apparatus includes: the liquid storage box, dip in the liquid head and be used for the drive dip in liquid head reciprocating motion's actuating mechanism.
As a preferable aspect of the present invention, the drive mechanism includes: the liquid dipping head comprises a mounting frame, a transverse driving assembly arranged on the mounting frame, a movable seat arranged at the driving end of the transverse driving assembly, and a longitudinal driving assembly fixed at the driving end of the longitudinal driving assembly, wherein the liquid dipping head is assembled at the driving end of the longitudinal driving assembly.
In a preferred embodiment of the present invention, a sponge sleeve is provided at an end of the dipping head.
According to the technical scheme, firstly, the conductive raw materials are punched by a punching device, the joint body is formed by using a corresponding punching die, the formed joint body slides from a discharge guide plate to a plane conveyor belt to be conveyed forwards, the plane conveyor belt is immersed in an electroplating box, the joint body can be subjected to silver plating treatment by the electroplating box, then the joint body subjected to silver plating is transferred to a material arranging vibration disc by a lifting conveyor belt, and meanwhile, the joint body is dried by a drying box in the lifting process, so that the electroplating solution is prevented from remaining on the surface of the joint body; arranging and arranging the joint bodies in a preset arrangement direction by a material arranging vibration disc, arranging the joint bodies into positioning grooves from a material discharge outlet of the joint bodies, generating a detection signal by a detection sensor at the moment, driving the liquid dipping heads to move downwards by a longitudinal driving assembly, immersing the sponge sleeves in a liquid storage box, sucking a certain amount of soldering flux by the sponge sleeves at the moment, driving the movable seats to move by a transverse driving assembly after the longitudinal driving assembly is reset to transfer the liquid dipping heads to the positions above the positioning grooves, driving the liquid dipping heads to press downwards by the longitudinal driving assembly to paint the soldering flux on the joint bodies, and finally manually clamping the joint bodies to perform soldering treatment by a soldering machine, so that the continuity of the whole copper joint processing process is stronger, the working efficiency is improved, and the manual workload is reduced; simultaneously, the selectable scaling powder that has the colour for have the colour on the tin piece after the soldering is accomplished, be convenient for installer discerns the tin piece position when the wiring, make the installation more convenient.
On the other hand, the invention also provides a copper joint processing technology, and the processing technology is based on the processing system of any technical scheme, and the processing system comprises:
the method comprises the following steps: stamping the conductive raw material to form a connector body, and discharging the connector body from a discharge guide plate;
step two: the joint body is conveyed forwards by the feeding conveying line, the electroplating silver plating treatment is carried out on the joint body through the electroplating box in the conveying process, and then the joint body is input into the material arranging vibration disc for arrangement and arrangement;
step three: after the joint body is embedded into the positioning jig according to a preset arrangement direction, the liquid dipping device is used for dipping soldering flux and smearing the soldering flux on the welding position of the joint body;
step four: and manually clamping the joint body from the positioning jig, and performing soldering tin treatment through a soldering machine.
As a preferable scheme of the present invention, the connector body is further subjected to a drying process after the plating silver plating process.
According to the technical scheme, through the processing steps, the consistency of the processing process of the whole copper joint is higher, the working efficiency is improved, and the manual workload is reduced.
In conclusion, the invention has the following beneficial effects:
the embodiment of the invention provides a copper joint processing system and a processing technology, wherein the processing system comprises: the stamping equipment is used for stamping and forming the joint body, and a discharge guide plate is arranged at the discharge end of the stamping equipment; with the loading attachment that ejection of compact baffle butt joint, loading attachment includes: the feeding device comprises a feeding conveying line, a material arranging vibration disc and a positioning jig, wherein the feeding conveying line is butted with the discharging end of the discharging guide plate, the material arranging vibration disc is matched with the discharging end of the feeding conveying line, and the positioning jig is butted with the material arranging vibration disc; the electroplating box is used for carrying out electroplating silver plating treatment on the joint body, and the feeding conveying line is immersed in the electroplating box; the liquid dipping device is used for smearing soldering flux on the joint body on the positioning jig; and a soldering machine for performing a soldering process. By the processing system, the consistency of the whole copper joint processing process is stronger, the working efficiency is improved, and the manual workload is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a positioning fixture in an embodiment of the invention.
FIG. 3 is a schematic structural view of a dipping device according to an embodiment of the present invention.
The corresponding part names indicated by the numbers and letters in the drawings:
1. a stamping device; 11. a discharging guide plate; 2. a feeding device; 21. a feeding conveying line; 211. a planar conveyor belt; 212. lifting the conveyor belt; 22. a material arranging vibration disc; 23. positioning a jig; 231. positioning seats; 232. positioning a groove; 233. a detection sensor; 3. electroplating box; 4. a liquid dipping device; 41. a liquid storage box; 42. a liquid dipping head; 421. a sponge sleeve; 43. a drive mechanism; 431. a mounting frame; 432. a lateral drive assembly; 433. a movable seat; 434. a longitudinal drive assembly; 5. a soldering machine; 6. and (5) a drying box.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
A copper joint processing system, as shown in fig. 1 to 3, comprising: the stamping equipment 1 is used for stamping and forming the joint body, and a discharge guide plate 11 is arranged at the discharge end of the stamping equipment 1; and the feeding device 2 is butted with the discharging guide plate 11, and the feeding device 2 comprises: the feeding device comprises a feeding conveying line 21 butted with the discharging end of the discharging guide plate 11, a material arranging vibration disc 22 matched with the discharging end of the feeding conveying line 21, and a positioning jig 23 butted with the material arranging vibration disc 22; the electroplating box 3 is used for carrying out electroplating silver plating treatment on the joint body, and the feeding conveying line 21 is immersed in the electroplating box 3; the liquid dipping device 4 is used for smearing soldering flux on the joint body on the positioning jig 23; and a soldering machine 5 for performing a soldering process.
Specifically, the feeding conveyor line 21 includes: submergence is in electroplating box 3 and the plane conveyer belt 211 that docks mutually with ejection of compact baffle 11, the promotion conveyer belt 212 that docks mutually with plane conveyer belt 211, the discharge end that promotes conveyer belt 212 docks mutually with reason material vibration dish 22, still be equipped with a plurality of promotion baffles on promoting conveyer belt 212 for it is better to promote the performance, of course, in some embodiments, can also set up horizontal conveyer belt at the end that promotes conveyer belt 212, in order to conveniently to connect the body input to reason material vibration dish 22 in, reason material vibration dish 22 will connect the body to arrange into the direction that the welding face is up.
The positioning jig 23 includes: positioning seat 231, set up the constant head tank 232 on positioning seat 231 and set up at positioning seat 231 and be located the detection sensor 233 of constant head tank 232 both sides, detection sensor 233 adopts photoelectric sensor, and detection sensor 233 detects when the embedded joint body that connects of constant head tank 232, dips in liquid device 4 and paints the scaling powder to connecting the body on.
The dip apparatus 4 includes: the liquid storage box 41, the liquid dipping head 42 and the driving mechanism 43 for driving the liquid dipping head 42 to reciprocate are arranged, and the driving mechanism 43 comprises: the soldering flux machine comprises a mounting frame 431, a transverse driving assembly 432 arranged on the mounting frame 431, a movable seat 433 arranged at the driving end of the transverse driving assembly 432, and a longitudinal driving assembly 434 fixed to the movable seat, wherein the liquid dipping head 42 is assembled at the driving end of the longitudinal driving assembly 434, the transverse driving assembly 432 and the longitudinal driving assembly 434 both adopt air cylinders or lead screw slider assemblies, and meanwhile, a sponge sleeve 421 is arranged at the end part of the liquid dipping head 42 so as to store soldering flux.
Further, be equipped with stoving case 6 on electroplating box 3, stoving case 6 goes up the stoving passageway, promotes conveyer belt 212 and passes the stoving passageway.
When in processing, firstly, the conductive raw material is stamped by the stamping equipment 1, the joint body is molded by using a corresponding stamping die, the molded joint body slides from the discharge guide plate 11 to the plane conveyor belt 211 to be conveyed forwards, the plane conveyor belt is immersed in the electroplating box 3, the joint body can be subjected to silver plating treatment by the electroplating box 3, then the joint body subjected to silver plating is transferred to the material arranging vibration disc 22 by the lifting conveyor belt 212, and meanwhile, the joint body is dried by the drying box 6 in the re-lifting process, so that the electroplating solution is prevented from remaining on the surface of the joint body; then the joint bodies are arranged and sorted in a preset arrangement direction by the material arranging vibration disc 22, the joint bodies are discharged into the positioning grooves 232 from a discharge outlet of the joint bodies, the detection sensor 233 generates a detection signal at the moment, the longitudinal driving assembly 434 drives the liquid dipping head 42 to move downwards, the sponge sleeve 421 is immersed in the liquid storage box 41, a certain amount of soldering flux can be sucked into the sponge sleeve 421 at the moment, the longitudinal driving assembly 434 resets, the transverse driving assembly 432 drives the movable seat 433 to move to transfer the liquid dipping head 42 to the positions above the positioning grooves 232, the longitudinal driving assembly 434 drives the liquid dipping head 42 to press downwards to paint the soldering flux on the joint bodies, and finally the joint bodies are manually clamped and soldered by the soldering machine 5, so that the continuity of the whole copper joint processing process is stronger, the working efficiency is improved, and the manual workload is reduced; simultaneously, the selectable scaling powder that has the colour for have the colour on the tin piece after the soldering is accomplished, be convenient for installer discerns the tin piece position when the wiring, make the installation more convenient.
The embodiment further provides a copper joint processing technology, which is based on the processing system and comprises:
the method comprises the following steps: stamping the conductive raw material to form a connector body, and discharging the connector body from the discharge guide plate 11;
step two: the joint body is conveyed forwards by a feeding conveying line 21, and is subjected to electroplating silver plating treatment by an electroplating box 3 in the conveying process, and then is input into a material arranging vibration disc 22 for arrangement and arrangement; meanwhile, the connector body is dried after the electroplating silver plating treatment.
Step three: after the joint body is embedded into the positioning jig 23 according to a preset arrangement direction, the soldering flux is dipped by the liquid dipping device 4 and coated on the welding position of the joint body;
step four: the joint body is manually gripped from the positioning jig 23 and subjected to soldering by the soldering machine 5.
Through the processing steps, the consistency of the processing process of the whole copper joint is stronger, the working efficiency is improved, and the manual workload is reduced.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. A copper joint machining system, comprising:
the stamping equipment is used for stamping and forming the joint body, and a discharge guide plate is arranged at the discharge end of the stamping equipment;
with the loading attachment that ejection of compact baffle butt joint, loading attachment includes: the feeding device comprises a feeding conveying line, a material arranging vibration disc and a positioning jig, wherein the feeding conveying line is butted with the discharging end of the discharging guide plate, the material arranging vibration disc is matched with the discharging end of the feeding conveying line, and the positioning jig is butted with the material arranging vibration disc;
the electroplating box is used for carrying out electroplating silver plating treatment on the joint body, and the feeding conveying line is immersed in the electroplating box;
the liquid dipping device is used for smearing soldering flux on the joint body on the positioning jig; and the number of the first and second groups,
a soldering machine for performing a soldering process.
2. The copper joint machining system according to claim 1, wherein the feeding conveyor line includes: the lifting conveying belt is immersed in the electroplating box and is butted with the discharging guide plate, the lifting conveying belt is butted with the plane conveying belt, and the discharging end of the lifting conveying belt is butted with the material arranging vibration disc.
3. The copper joint machining system according to claim 2, wherein a drying box is provided on the plating box, the drying box has a drying passage, and the elevating conveyor belt passes through the drying passage.
4. The copper joint machining system according to claim 3, wherein the positioning jig includes: the positioning seat, set up constant head tank on the positioning seat and set up the positioning seat just is located the detection sensor of constant head tank both sides, detection sensor detects when the constant head tank embeds joint body, dip in the liquid device and paint the scaling powder to connect on the body.
5. The copper joint machining system according to claim 3, wherein the fluid dipping device includes: the liquid storage box, dip in the liquid head and be used for the drive dip in liquid head reciprocating motion's actuating mechanism.
6. The copper joint machining system according to claim 5, wherein the drive mechanism includes: the liquid dipping head comprises a mounting frame, a transverse driving assembly arranged on the mounting frame, a movable seat arranged at the driving end of the transverse driving assembly, and a longitudinal driving assembly fixed at the driving end of the longitudinal driving assembly, wherein the liquid dipping head is assembled at the driving end of the longitudinal driving assembly.
7. The copper joint machining system according to claim 5, wherein a sponge sleeve is provided at an end of the dipping head.
8. A copper joint machining process, characterized in that the machining process is based on the machining system of any one of claims 1-7, and comprises:
the method comprises the following steps: stamping the conductive raw material to form a connector body, and discharging the connector body from a discharge guide plate;
step two: the joint body is conveyed forwards by the feeding conveying line, the electroplating silver plating treatment is carried out on the joint body through the electroplating box in the conveying process, and then the joint body is input into the material arranging vibration disc for arrangement and arrangement;
step three: after the joint body is embedded into the positioning jig according to a preset arrangement direction, the liquid dipping device is used for dipping soldering flux and smearing the soldering flux on the welding position of the joint body;
step four: and manually clamping the joint body from the positioning jig, and performing soldering tin treatment through a soldering machine.
9. The process for manufacturing a copper joint according to claim 8, wherein the joint body is dried after the plating silver plating.
CN202010209054.4A 2020-03-23 2020-03-23 Copper joint machining system and machining process Active CN111468945B (en)

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CN202010209054.4A CN111468945B (en) 2020-03-23 2020-03-23 Copper joint machining system and machining process

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Application Number Priority Date Filing Date Title
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CN111468945B true CN111468945B (en) 2021-05-14

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202013008637U1 (en) * 2013-09-30 2013-11-22 Volker & Simon Reinhardt GbR (vertretungsberechtigter Gesellschafter: Herr Volker Reinhardt, 74906 Bad Rappenau-Fürfeld) Punching nibbling center and welding device for a punch nibbling center
CN106670348A (en) * 2016-05-30 2017-05-17 深圳市大圣神通机器人科技有限公司 Automatic production line
CN207105422U (en) * 2017-06-29 2018-03-16 诸暨市凯马精工机械有限公司 A kind of brazed joint punch press positioning and feeding device
CN207402079U (en) * 2017-09-26 2018-05-25 霍州煤电集团白龙工贸有限公司 A kind of full-automatic pin fastener type belt buckles production system
CN110385495A (en) * 2019-06-27 2019-10-29 苏州艾久电气有限公司 Button electrode connector automates scolding tin production system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202013008637U1 (en) * 2013-09-30 2013-11-22 Volker & Simon Reinhardt GbR (vertretungsberechtigter Gesellschafter: Herr Volker Reinhardt, 74906 Bad Rappenau-Fürfeld) Punching nibbling center and welding device for a punch nibbling center
CN106670348A (en) * 2016-05-30 2017-05-17 深圳市大圣神通机器人科技有限公司 Automatic production line
CN207105422U (en) * 2017-06-29 2018-03-16 诸暨市凯马精工机械有限公司 A kind of brazed joint punch press positioning and feeding device
CN207402079U (en) * 2017-09-26 2018-05-25 霍州煤电集团白龙工贸有限公司 A kind of full-automatic pin fastener type belt buckles production system
CN110385495A (en) * 2019-06-27 2019-10-29 苏州艾久电气有限公司 Button electrode connector automates scolding tin production system

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Address after: 215000 Floor 3, Building 1, No. 2, Zhiwei Road, Qiandeng Town, Kunshan City, Suzhou, Jiangsu Province

Patentee after: SUZHOU AIJIU ELECTRIC CO.,LTD.

Address before: 215000 66-28 Linggang Road, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province

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