CN111458044A - Transient temperature measuring device and method based on snapshot spectral imaging technology - Google Patents
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Abstract
The invention discloses a transient temperature measuring device and method based on a snapshot spectral imaging technology, relates to the technical field of radiation temperature measurement, and solves the problems of few spectral bands, poor time resolution capability and the like of a traditional multispectral temperature measuring system. The system comprises a band-pass filter (1), an optical imaging objective lens (2), a snapshot type spectral imaging module (3), a high-speed area array image sensor (4), an image acquisition and storage module (5), an image processing module (6) and a temperature inversion module (7), wherein the snapshot type spectral imaging module (3) is used for fusing spectral information containing radiation of a measured object and two-dimensional spatial information through the optical imaging objective lens (2) to form a two-dimensional image, and is used for realizing simultaneous detection of the two-dimensional spatial information and the spectral information of the measured object by single exposure; the invention has simple structure, high temperature measurement precision, wide measurement range and high time resolution, and is suitable for temperature field measurement in the transient change process.
Description
Technical Field
The invention relates to the technical field of radiation temperature measurement, in particular to a transient temperature measuring device and method based on a snapshot spectral imaging technology.
Background
In many important fields such as industrial and agricultural production, scientific research and aerospace, as one of the most basic physical quantities, temperature is an important parameter which is always very concerned by people. With the continuous development of science and technology, the requirements on the diversification of temperature measurement means and the measurement precision achieved by the temperature measurement means are higher and higher. According to different measurement means, the existing temperature measurement technology can be generally divided into two types of contact temperature measurement and non-contact temperature measurement, a multispectral temperature measurement system is used as a typical non-contact temperature measurement mode, radiation information under different wavelengths can be obtained under the condition that a temperature field of a measured object is not interfered, and the temperature of the measured object is reconstructed by adopting a certain algorithm in combination with an emissivity model. The traditional multispectral temperature measurement system needs to adopt a camera array or a spectrum splitting mode, the optical acquisition system is complex in structure and expensive in price, in consideration of volume and weight, the system can only acquire information of a few or dozens of spectrum channels generally, the system is greatly limited in temperature measurement range, measurement accuracy, time resolution capability and the like, the practicability and the universality need to be further improved, and the establishment of a proper multispectral acquisition system is still an important problem in the field.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the traditional multispectral temperature measurement system has the problems of less spectrum segment number, poor time resolution capability and the like. The present invention provides a transient temperature measurement device and method based on snapshot spectral imaging technology that solves the above-mentioned problems.
The invention is realized by the following technical scheme:
the transient temperature measuring device based on the snapshot spectral imaging technology comprises a band-pass filter, an optical imaging objective lens, a snapshot spectral imaging module, a high-speed area array image sensor, an image acquisition and storage module, an image processing module and a temperature inversion module;
the band-pass filter is combined with a high-speed area array image sensor to limit the working waveband of the measuring device, is used for gating light radiation in a working wavelength range and cutting off the light radiation outside the working wavelength range, and the high-speed area array image sensor is a near-infrared area array sensor; the band-pass filter and the high-speed area array image sensor limit the working wavelength range to 800 nm-2500 nm, and the corresponding temperature measurement range is 1160K-3600K;
preferably, the high-speed area array image sensor can also be a mid-infrared area array sensor, the band-pass filter and the high-speed area array image sensor limit the working wavelength range to 2500nm to 5000nm, and the corresponding temperature measurement range is 580K to 1160K;
the high-speed area array image sensor can also be a sensor array consisting of a single area array sensor or a plurality of area array sensors, and is used for detecting the instantaneous temperature field change process of a measured object with time resolution superior to microsecond level;
the optical imaging objective lens is used for collecting the radiation of the measured object to enter the measuring device;
the snapshot type spectral imaging module is used for fusing spectral information containing radiation of a measured object with two-dimensional spatial information through the optical imaging objective lens to form a two-dimensional image, the snapshot type spectral imaging module utilizes a micro lens array and a birefringent prism group to establish common-path interference, performs polarized light interference on light radiation containing multi-wavelength information from the measured object to obtain a two-dimensional interference pattern array, inverts a spectral image sequence of the measured object through a Fourier transform technology, and is used for realizing simultaneous detection of the two-dimensional spatial information and the spectral information of the measured object by single exposure;
the high-speed area array image sensor is used for converting the two-dimensional image into a digital image, the digital image comprises light radiation information, and the highest working frame frequency of the high-speed area array image sensor determines the time resolution capability of the system;
the image acquisition and storage module stores the digital image and controls the high-speed area array image sensor, and the image acquisition and storage module comprises an electronic shutter for controlling the high-speed area array image sensor, exposure time, a frame rate and an image acquisition area;
the image processing module is used for inverting the two-dimensional image to obtain spectral information and spatial distribution information of the measured object, wherein the spectral information and the spatial distribution information comprise spectral image sequences of the measured object at the same moment and under multiple wavelengths;
the temperature inversion module calculates polynomial coefficients including the real temperature of the measured object and a spectral reflectivity model based on the combination of the spectral image sequences, a spectral emissivity model described by a polynomial about wavelength and a least square method, obtains the evolution process of the temperature field of the measured object along with time by processing image data at different moments, and the spectral emission model adopts a polynomial about wavelength to describe and simulates the change of the emissivity of the object along with the wavelength; and determining the coefficient of the polynomial through curve fitting under a plurality of wavelengths, namely realizing the measurement of the spectral emissivity of the object.
The snapshot type spectral imaging module comprises a micro-lens array, a linear polarization polarizer, a Nomarski prism, an analyzer and a focal plane which are sequentially arranged;
the microlens array is used for decomposing incident light into M × N array sub-beams;
the linear polarization polarizer is used for generating linearly polarized light, and the vibration direction of the linear polarization polarizer and the optical axis of the Nomarski prism form an angle of 45 degrees;
linearly polarized light of the array sub-beams is decomposed into two beams of light through two mutually perpendicular optical wedges of the Nomarski prism, the two beams of light are o light and e light respectively, the o light in the first optical wedge of the Nomarski prism is a sub-beam I, the e light is a sub-beam II, and the o light is converted into the e light and the e light is converted into the o light after entering the second optical wedge;
the Nomarski prism is used for generating an optical delay difference value of the sub-beam I and the sub-beam II;
and the transmission vibration direction of the analyzer is parallel to the linear polarization polarizer and is used for forming interference fringes on the focal plane after transmitting the sub-beams I and II.
The snapshot type spectral imaging module also comprises an achromatic lambda/2 wave plate and another Nomarski prism;
sequentially adding an achromatic lambda/2 wave plate and another Nomarski prism between the Nomarski prism and the analyzer, wherein the achromatic lambda/2 wave plate is used for independently rotating the polarization directions of the sub-beam I and the sub-beam II respectively, and the rotation size is pi/2;
and the other Nomarski prism is used for doubling the optical path difference of the sub-beam I and the sub-beam II, and the optical delay difference of the doubled sub-beam I and the doubled sub-beam II is 2.
The transient temperature measuring method based on the snapshot spectral imaging technology comprises the following steps:
the measuring device for measuring the transient temperature of the measured object comprises a band-pass filter, an optical imaging objective lens, a snapshot type spectral imaging module, a high-speed area array image sensor, an image acquisition and storage module, an image processing module and a temperature inversion module;
the radiation of the object to be measured is collected by an optical imaging objective lens and enters a measuring device;
the snapshot type spectral imaging module processes light radiation penetrating through the optical imaging objective lens, spectral information containing radiation of a measured object and two-dimensional space information are fused to form a two-dimensional image, then the light radiation information is converted into a digital image by the high-speed area array image sensor, the digital image is collected and stored by the image collecting and storing module, the image collecting and storing module controls the high-speed area array image sensor, the image processing module inverts the two-dimensional image information generated by the snapshot type spectral imaging module into spectral information and space distribution information of the measured object, and the image processing module obtains a spectral image sequence of the measured object at the same moment and under multiple wavelengths; the temperature inversion module obtains the real temperature of the measured object by using the spectral image sequence of the measured object obtained by the image processing module, the spectral emissivity model described by the polynomial about the wavelength and a data fitting method based on the least square method, and obtains the polynomial coefficient of the spectral reflectivity model, wherein the band-pass filter is combined with the high-speed area array image sensor to limit the working waveband of the temperature measuring device.
Furthermore, the band-pass filter is combined with the high-speed area array image sensor to limit the working section of the temperature measuring device to 800 nm-2500 nm.
Further, the image acquisition and storage module comprises an electronic shutter for controlling the high-speed area array image sensor, exposure time, a frame rate and an image acquisition area.
Further, the snapshot type spectral imaging module further comprises a micro-lens array, a linear polarization polarizer, a Nomarski prism, an achromatic lambda/2 wave plate, another Nomarski prism, an analyzer and a focal plane which are sequentially arranged, and the method for improving the temperature inversion accuracy of the snapshot type spectral imaging module further comprises the following steps:
the microlens array decomposes incident optical radiation into M × N array beamlets;
the array sub-beam light enters a first optical wedge of a Nomarski prism through a linear polarization polarizer and then is decomposed into two beams of light, wherein the two beams of light are o light and e light, the o light is a sub-beam I, and the e light is a sub-beam II;
the optical delay difference between the sub-beam I and the sub-beam II is as follows after two beams of light penetrate through the first optical wedge of the Nomarski prism and enter the second optical wedge;
the light radiation passes through an achromatic lambda/2 wave plate, and the polarization directions of the sub-beam I and the sub-beam II respectively and independently rotate pi/2;
after passing through another Nomarski prism and reaching a focal plane through an analyzer, the optical delay difference between the sub-beam I and the sub-beam II is doubled to 2; the spectral resolution of the snapshot-type spectral imaging module is improved, so that a more accurate radiation value of a measured object under a single wavelength is obtained, the temperature inversion accuracy is improved, and interference fringes are formed on a focal plane;
the image acquisition and storage module, the image processing module and the temperature inversion module are used for inverting the spectral information and the spatial distribution information of the measured object based on the wavelength information and the spatial distribution information of the light radiation contained in the Fourier transform and the stripes.
The invention has the following advantages and beneficial effects:
the temperature measuring device can set a temperature measuring interval according to the measurement requirement, the temperature measuring range can cover 580K-3600K and cover a low-temperature region and a high-temperature region, compared with the traditional measuring technology, because the data fitting is carried out on the radiation measuring data under a plurality of wavelengths, the influence of radiation measuring errors on the measuring result is reduced, and the realized temperature range is wider;
the spectral emissivity of the measured object is described by a polynomial about the wavelength, and the data fitting is carried out on the radiation intensity measured under a plurality of wavelengths by using a least square method, so that the influence of the spectral emissivity on the temperature measurement along with the wavelength change can be eliminated, and the applicability is greatly improved.
The measuring device of the invention can realize the temperature field measurement of the measured object in the transient process by adopting a single optical imaging objective lens, and compared with the traditional multispectral temperature measuring method, the measuring device of the invention has the advantages of simple optical system structure, high temperature measuring precision, wide measuring range and high time resolution, and is suitable for the temperature field measurement in the transient change process.
The temperature measuring device of the invention uses a high-speed image sensor or a high-speed camera system, can be superior to microsecond time resolution, monitors the temperature field in the transient change process of the measured object, and has certain significance for widening the application field of non-contact temperature measurement technology, improving the universality of equipment and promoting the development of multispectral radiation temperature measurement technology.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
fig. 1 is a schematic diagram of a transient temperature measuring device based on snapshot spectral imaging technology according to the present invention.
FIG. 2 is a schematic diagram of a snapshot-type spectral imaging module according to the present invention.
Description of reference numerals:
1. a band-pass filter; 2. an optical imaging objective lens; 3. a snapshot-type spectral imaging module; 4. a high-speed area array image sensor; 5. an image acquisition and storage module; 6. an image processing module; 7. a temperature inversion module; 31. a microlens array; 32. a linear polarizing polarizer; 33. a Nomarski prism; 34. an achromatic lambda/2 wave plate; 35. another Nomarski prism; 36. an analyzer; 37. a focal plane.
Detailed Description
Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangements of components set forth in the following description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any inventive changes, are within the scope of the present invention.
A transient temperature measuring device based on snapshot spectral imaging technology, as shown in fig. 1 and 2, the measuring device for measuring the transient temperature of a measured object comprises a band-pass filter 1, an optical imaging objective lens 2, a snapshot spectral imaging module 3, a high-speed area array image sensor 4, an image acquisition and storage module 5, an image processing module 6 and a temperature inversion module 7;
the band-pass filter 1 is combined with a high-speed area array image sensor 4 to limit the working waveband of the measuring device, is used for gating light radiation in a working wavelength range and cutting off light radiation outside the working wavelength range, and the high-speed area array image sensor 4 is a near-infrared area array sensor; the band-pass filter 1 and the high-speed area array image sensor 4 limit the working wavelength range to 800-2500 nm, the corresponding temperature measurement range is 1160-3600K, the instantaneous temperature field change process of the measured object is detected with a time resolution superior to microsecond level, and the temperature field monitoring and diagnosis of the transient phenomenon is realized. (ii) a
Preferably, the high-speed area array image sensor 4 can also be a mid-infrared area array sensor, the band-pass filter 1 and the high-speed area array image sensor 4 limit the working wavelength range to 2500nm to 5000nm, and the corresponding temperature measurement range is 580K to 1160K;
the high-speed area array image sensor 4 can also be a single area array sensor or a sensor array formed by a plurality of area array sensors;
the optical imaging objective lens 2 is used for collecting the radiation of the measured object into the measuring device;
the snapshot type spectral imaging module 3 is used for fusing spectral information containing radiation of a measured object with two-dimensional spatial information through the optical imaging objective lens 2 to form a two-dimensional image, the snapshot type spectral imaging module 3 establishes common-path interference by using a micro lens array and a birefringent prism group, performs polarized light interference on light radiation containing multi-wavelength information from the measured object to obtain a two-dimensional interference pattern array, inverts a spectral image sequence of the measured object through a Fourier transform technology, and is used for realizing two-dimensional spatial detection and spectral detection of the measured object while performing single exposure;
the high-speed area array image sensor 4 is used for converting the two-dimensional image into a digital image, the digital image comprises light radiation information, and the highest working frame frequency of the high-speed area array image sensor 4 determines the time resolution capability of the system;
the image acquisition and storage module 5 stores the digital image and controls the high-speed area array image sensor 4, and the image acquisition and storage module 5 comprises an electronic shutter for controlling the high-speed area array image sensor 4, exposure time, a frame rate and an image acquisition area;
the image processing module 6 is configured to invert the two-dimensional image to obtain spectral information and spatial distribution information of the object to be measured, where the spectral information and the spatial distribution information include a sequence of spectral images of the object to be measured at a same time and under multiple wavelengths;
the temperature inversion module 7 obtains polynomial coefficients including the true temperature of the measured object and a spectral reflectivity model by calculating based on the spectral image sequence combination, a spectral emissivity model described by a polynomial about wavelength and a least square method, obtains the evolution process of the temperature field of the measured object along with time by processing image data at different moments, and simulates the change of the emissivity of the object along with the wavelength by describing the spectral emission model by a polynomial about wavelength; and determining the coefficient of the polynomial through curve fitting under a plurality of wavelengths, namely realizing the measurement of the spectral emissivity of the object.
The snapshot type spectral imaging module 3 comprises a micro-lens array 31, a linear polarization polarizer 32, a Nomarski prism 33, an analyzer 36 and a focal plane 37 which are sequentially arranged;
the microlens array 31 is used for decomposing incident light into M × N array sub-beams;
the linear polarization polarizer 32 is used for generating linearly polarized light, and the vibration direction of the linear polarization polarizer and the optical axis of the Nomarski prism 33 form an angle of 45 degrees; linearly polarized light passes through two mutually perpendicular optical wedges of the Nomarski prism 33 and is decomposed into o light and e light, the o light in the first optical wedge of the Nomarski prism 33 is a sub-beam I, the e light is a sub-beam II, and the o light is converted into the e light and the e light is converted into the o light after entering the second optical wedge;
the Nomarski prism 33 is used for generating the optical delay difference between the sub-beam I and the sub-beam II;
the polarization direction of the analyzer 36 is parallel to the linear polarization polarizer 32, and is used for forming interference fringes on the focal plane 37 after the sub-beams i and ii pass through.
The snapshot type spectral imaging module 3 further comprises an achromatic lambda/2 wave plate 34 and another Nomarski prism 35;
an achromatic lambda/2 wave plate 34 and another Nomarski prism 35 are sequentially added between the Nomarski prism 33 and the focal plane 37, wherein the achromatic lambda/2 wave plate 34 is used for independently rotating the polarization directions of the sub-beam I and the sub-beam II respectively, and the rotation size is pi/2;
the other Nomarski prism 35 is used for doubling the optical path difference of the sub-beam I and the sub-beam II, and the optical delay difference of the doubled sub-beam I and the doubled sub-beam II is 2.
The transient temperature measuring method based on the snapshot spectral imaging technology comprises the following steps:
the measuring device for measuring the transient temperature of the measured object comprises a band-pass filter 1, an optical imaging objective lens 2, a snapshot type spectral imaging module 3, a high-speed area array image sensor 4, an image acquisition and storage module 5, an image processing module 6 and a temperature inversion module 7;
the radiation of the measured object enters the measuring device by adopting an optical imaging objective lens 2;
the snapshot type spectral imaging module 3 processes light radiation penetrating through the optical imaging objective lens 2, spectral information containing radiation of a measured object and two-dimensional space information are fused to form a two-dimensional image, then the light radiation information is converted into a digital image by the high-speed area array image sensor 4, the digital image is collected and stored by the image collecting and storing module 5, the image collecting and storing module 5 controls the high-speed area array image sensor 4, the image processing module 6 inverts the two-dimensional image information generated by the snapshot type spectral imaging module 3 into spectral information and spatial distribution information of the measured object, and the image processing module 6 obtains a spectral image sequence of the measured object under multiple wavelengths at the same moment; the temperature inversion module 7 obtains the real temperature of the measured object by using the spectral image sequence of the measured object obtained by the image processing module 6, the spectral emissivity model described by the polynomial about the wavelength and a data fitting method based on the least square method, and obtains the polynomial coefficient of the spectral reflectivity model, wherein the band-pass filter 1 is combined with the high-speed area array image sensor 4 to limit the working section of the temperature measuring device.
Furthermore, the band-pass filter 1 is combined with the high-speed area array image sensor 4 to limit the working section of the temperature measuring device to 800 nm-2500 nm.
Further, the image acquisition and storage module 5 includes an electronic shutter for controlling the high-speed area array image sensor 4, an exposure time, a frame rate, and an image acquisition area.
Further, the snapshot type spectral imaging module 3 further includes a microlens array 31, a linear polarization polarizer 32, a Nomarski prism 33, an achromatic λ/2 wave plate 34, another Nomarski prism 35, an analyzer 36, and a focal plane 37, which are sequentially arranged, and the snapshot type spectral imaging module 3 is further included, and the method for improving the temperature inversion accuracy includes the following steps:
the array sub-beam light enters a first optical wedge of a Nomarski prism 33 through a linear polarization polarizer 32 and is decomposed into two beams of light, wherein the two beams of light are o light and e light, the o light is a sub-beam I, and the e light is a sub-beam II;
the optical delay difference between the sub-beam I and the sub-beam II is as follows after the two beams of light penetrate through the first optical wedge of the Nomarski prism 33 and enter the second optical wedge;
the light radiation passes through a dispersion-eliminating lambda/2 wave plate 34, and the polarization directions of the sub-beam I and the sub-beam II respectively and independently rotate pi/2;
the optical delay difference between the sub-beam I and the sub-beam II is doubled to 2 after passing through another Nomarski prism 35 and passing through an analyzer 36; the spectral resolution of the snapshot type spectral imaging module 3 is improved, so that a more accurate radiation value of a measured object under a single wavelength is obtained, the temperature inversion accuracy is improved, and interference fringes are formed on the focal plane 37;
the image acquisition and storage module 5, the image processing module 6 and the temperature inversion module 7 invert the spectral information and the spatial distribution information of the object to be measured based on the wavelength information and the spatial distribution information of the optical radiation contained in the fourier transform and the interference fringes.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. The transient temperature measuring device based on the snapshot spectral imaging technology is characterized in that the measuring device for measuring the transient temperature of a measured object comprises a band-pass filter (1), an optical imaging objective lens (2), a snapshot type spectral imaging module (3), a high-speed area array image sensor (4), an image acquisition and storage module (5), an image processing module (6) and a temperature inversion module (7);
the band-pass filter (1) is combined with the high-speed area array image sensor (4) and used for limiting the working waveband of the measuring device, gating the optical radiation in the working wavelength range and cutting off the optical radiation outside the working wavelength range;
the optical imaging objective lens (2) is used for collecting the optical radiation of the measured object into the measuring device;
the snapshot type spectral imaging module (3) is used for fusing spectral information containing radiation of a measured object and two-dimensional spatial information through the optical imaging objective lens (2) to form a two-dimensional image, and is used for realizing simultaneous detection of the two-dimensional spatial information and the spectral information of the measured object through single exposure;
the high-speed area array image sensor (4) is used for converting the two-dimensional image into a digital image, the digital image comprises light radiation information, and the high-speed area array image sensor (4) is used for detecting the instantaneous temperature field change process of a measured object with time resolution better than microsecond level;
the image acquisition and storage module (5) stores the digital image and controls the high-speed area array image sensor (4), and the image acquisition and storage module (5) comprises an electronic shutter for controlling the high-speed area array image sensor (4), exposure time, a frame rate and an image acquisition area;
the image processing module (6) is used for inverting the two-dimensional image to obtain spectral information and spatial distribution information of the measured object, wherein the spectral information and the spatial distribution information comprise spectral image sequences of the measured object under multiple wavelengths at the same time;
and the temperature inversion module (7) calculates polynomial coefficients including the real temperature and the spectral reflectivity model of the measured object by combining a spectral emissivity model described by a polynomial about the wavelength and a least square method based on the spectral image sequence.
2. The transient temperature measurement device based on snapshot spectral imaging technology of claim 1, wherein the snapshot type spectral imaging module (3) further comprises a microlens array (31), a linear polarization polarizer (32), a Nomarski prism (33), an analyzer (36) and a focal plane (37) which are sequentially arranged;
the microlens array (31) is used for decomposing incident light into M × N array sub-beams;
the linear polarization polarizer (32) is used for generating linearly polarized light, and the vibration direction of the linear polarization polarizer and the optical axis of the Nomarski prism (33) form an angle of 45 degrees;
linearly polarized light of the array sub-beams is decomposed into two beams of light through two mutually perpendicular optical wedges of the Nomarski prism (33), wherein the two beams of light are o light and e light respectively, the o light in the first optical wedge of the Nomarski prism (33) is a sub-beam I, the e light is a sub-beam II, and the o light is converted into the e light and the e light is converted into the o light after entering the second optical wedge;
the Nomarski prism (33) is used for generating the optical delay difference between the sub-beam I and the sub-beam II;
the transmission direction of the analyzer (36) is parallel to the linear polarization polarizer (32) and is used for forming interference fringes on the focal plane (37) after the sub-beams I and II penetrate through the linear polarization polarizer.
3. A snapshot spectral imaging technique based transient temperature measurement arrangement according to claim 2, characterized in that the snapshot type spectral imaging module (3) further comprises a de-dispersive λ/2 plate (34) and a further Nomarski prism (35);
an achromatic lambda/2 wave plate (34) and another Nomarski prism (35) are sequentially added between the Nomarski prism (33) and the analyzer (36), the achromatic lambda/2 wave plate (34) is used for independently rotating the polarization directions of the sub-beam I and the sub-beam II respectively, and the rotation size is pi/2;
and the other Nomarski prism (35) is used for doubling the optical path difference of the sub-beam I and the sub-beam II, and the optical delay difference of the doubled sub-beam I and the doubled sub-beam II is 2.
4. The transient temperature measurement method based on the snapshot spectral imaging technology is characterized in that the method for realizing the transient temperature measurement by applying any one of the devices in claims 1-3 comprises the following steps:
the measuring device for measuring the transient temperature of the measured object comprises a band-pass filter (1), an optical imaging objective lens (2), a snapshot type spectral imaging module (3), a high-speed area array image sensor (4), an image acquisition and storage module (5), an image processing module (6) and a temperature inversion module (7);
the light radiation of the measured object is collected by an optical imaging objective lens (2) and enters a measuring device;
the snapshot type spectral imaging module (3) processes light radiation penetrating through the optical imaging objective lens (2), spectral information containing radiation of a measured object and two-dimensional spatial information are fused to form a two-dimensional image, then the light radiation information is converted into a digital image by the high-speed area array image sensor (4), the digital image is collected and stored by the image collecting and storing module (5), the image collecting and storing module (5) controls the high-speed area array image sensor (4), the image processing module (6) inverts the two-dimensional image information generated by the snapshot type spectral imaging module (3) into spectral information and spatial distribution information of the measured object, and the image processing module (6) obtains a spectral image sequence of the measured object under multiple wavelengths at the same moment; the temperature inversion module (7) obtains the real temperature of the measured object by using the spectral image sequence of the measured object obtained by the image processing module (6), the spectral emissivity model described by the polynomial about the wavelength and a data fitting method based on the least square method, and obtains the polynomial coefficient of the spectral reflectivity model, wherein the band-pass filter (1) is combined with the high-speed area array image sensor (4) to limit the working waveband of the temperature measuring device.
5. The snapshot spectral imaging technology-based transient temperature measurement method according to claim 4, wherein the band-pass filter (1) is combined with the high-speed area array image sensor (4) to limit the working section of the temperature measurement device to 800 nm-2500 nm.
6. The snapshot spectral imaging technique-based transient temperature measurement method according to claim 4, wherein the image acquisition storage module (5) comprises an electronic shutter controlling the high-speed area array image sensor (4), an exposure time, a frame rate, and an image acquisition area.
7. The transient temperature measurement method based on the snapshot spectral imaging technology according to claim 4, wherein the snapshot type spectral imaging module (3) further comprises a microlens array (31), a linear polarization polarizer (32), a Nomarski prism (33), an achromatic lambda/2 wave plate (34), another Nomarski prism (35), an analyzer (36) and a focal plane (37) which are sequentially arranged, and the method for improving the temperature inversion accuracy further comprises the following steps:
the microlens array (31) decomposes the incident optical radiation into M × N array beamlets;
the array sub-beam light enters a first optical wedge of a Nomarski prism (33) through a linear polarization polarizer (32) and is decomposed into two beams of light, namely o light and e light, wherein the o light is a sub-beam I, and the e light is a sub-beam II;
the optical delay difference between the sub-beam I and the sub-beam II is as follows after the two beams of light penetrate through the first optical wedge of the Nomarski prism (33) and enter the second optical wedge;
the light radiation passes through an achromatic lambda/2 wave plate (34), and the polarization directions of the sub-beam I and the sub-beam II respectively and independently rotate pi/2;
after passing through another Nomarski prism (35) and reaching a focal plane (37) through an analyzer (36), the optical retardation difference between the sub-beam I and the sub-beam II is doubled to 2; and forming interference fringes on the focal plane (37);
the image acquisition and storage module (5), the image processing module (6) and the temperature inversion module (7) invert the spectral information and the spatial distribution information of the measured object based on the wavelength information and the spatial distribution information of the light radiation contained in the Fourier transform and the stripes.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112857410A (en) * | 2021-01-12 | 2021-05-28 | 中国科学院微电子研究所 | Digital distributed interference imaging system |
| CN113418613A (en) * | 2021-06-22 | 2021-09-21 | 中北大学 | High-temperature transient measurement system and method based on multispectral colorimetry |
| CN114543998A (en) * | 2022-02-17 | 2022-05-27 | 中北大学 | Temperature field space-time distribution measuring device based on staring type snapshot type spectral imaging |
| CN114626205A (en) * | 2022-02-18 | 2022-06-14 | 西北核技术研究所 | Simulation method and simulation device for radiation transient response of area array photoelectric image sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112857410A (en) * | 2021-01-12 | 2021-05-28 | 中国科学院微电子研究所 | Digital distributed interference imaging system |
| CN113418613A (en) * | 2021-06-22 | 2021-09-21 | 中北大学 | High-temperature transient measurement system and method based on multispectral colorimetry |
| CN113418613B (en) * | 2021-06-22 | 2023-04-07 | 中北大学 | High-temperature transient measurement system and method based on multispectral colorimetry |
| CN114543998A (en) * | 2022-02-17 | 2022-05-27 | 中北大学 | Temperature field space-time distribution measuring device based on staring type snapshot type spectral imaging |
| CN114626205A (en) * | 2022-02-18 | 2022-06-14 | 西北核技术研究所 | Simulation method and simulation device for radiation transient response of area array photoelectric image sensor |
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