CN111447744B - Curved surface laser drilling method for circuit board - Google Patents
Curved surface laser drilling method for circuit board Download PDFInfo
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- CN111447744B CN111447744B CN202010286018.8A CN202010286018A CN111447744B CN 111447744 B CN111447744 B CN 111447744B CN 202010286018 A CN202010286018 A CN 202010286018A CN 111447744 B CN111447744 B CN 111447744B
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- circuit board
- laser
- drilling
- laser drilling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a curved surface laser drilling method of a circuit board, which comprises the following steps: step 1: placing the circuit board on a circuit board bearing table; step 2: utilize the stop gear of circuit board plummer to fix the circuit board on the circuit board plummer: and step 3: leading in drilling data and partitioning the circuit board; and 4, step 4: the laser focus testing and compensating module is used for measuring the height of the surface of the circuit board of the processing subarea and compensating the laser focus; and 5: utilizing a laser drilling module to perform laser drilling on the circuit board of the processing subarea; step 6: after the laser drilling of the processing subarea is finished, repeating the step 4 and the step 5 to process the next processing subarea; and (4) removing the fixation of the circuit board bearing table until the laser drilling of all the processing subregions of the circuit board is completed, and taking down the circuit board. According to the invention, the height of the circuit board is measured in a partition manner, the laser focus of the drilling hole is adjusted to the correct position, and the drilling operation of the curved surface of the circuit board can be reliably and accurately completed.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of laser drilling of circuit boards, in particular to a curved surface laser drilling method of a circuit board.
[ background of the invention ]
At present, all printed circuit boards on the market, whether hard boards, soft boards or soft and hard combined boards, are distributed in a plane. With the continuous improvement of the requirements of printed circuit boards, three-dimensional circuit boards, especially three-dimensional special-shaped circuit boards, gradually enter the market, but mechanical drilling cannot be done on the three-dimensional special-shaped circuit boards, and because the mechanical drilling cannot realize curved surface drilling, the risk of needle breakage is generated, and therefore laser drilling is needed. In addition, after the existing flexible circuit board is arranged on a workbench or a laser carrier of a laser drilling machine, because the workbench or the laser carrier is provided with a plurality of air suction holes, the surface of the circuit board is curved after a part of the circuit board is adsorbed, the existing laser drilling equipment only has plane drilling capability, and after the laser drilling is carried out on the uneven surface of the circuit board, the circuit board part is easy to cause bad drilling in different areas, so that the yield of the product is influenced.
[ summary of the invention ]
The invention aims to overcome the defects of the prior art and provide a curved surface laser drilling method of a circuit board, which can solve the problem of curved surface laser drilling of the circuit board.
In order to achieve the above purpose, the solution of the invention is:
a curved surface laser drilling method of a circuit board comprises the following steps:
step 1: placing the circuit board on a circuit board bearing table;
step 2: utilize the stop gear of circuit board plummer to fix the circuit board on the circuit board plummer:
and step 3: the method comprises the steps that drilling data are led in by a laser drilling module, and the surface of a circuit board is divided into a plurality of processing sub-areas according to the drilling data;
and 4, step 4: the laser focus testing and compensating module is used for measuring the height of the surface of the circuit board corresponding to the processing subarea and adjusting and compensating the laser focus to the surface of the circuit board of the processing subarea;
and 5: utilizing a laser drilling module to perform laser drilling on the circuit board of the processing subarea;
step 6: after the laser drilling of the processing subarea is finished, repeating the step 4 and the step 5 to process the next processing subarea; and (4) removing the fixation of the circuit board bearing table until the laser drilling of all the processing subregions of the circuit board is completed, and taking down the circuit board.
Preferably, a plurality of suction holes are formed in the circuit board bearing table, the circuit board is adsorbed on the circuit board bearing table in a vacuum mode through the suction holes, and after laser drilling is completed, the circuit board bearing table breaks vacuum, and the circuit board is taken down.
Preferably, the laser focus testing and compensating module adopts a laser range finder to measure the height coordinate of the circuit board. For the curved surface measurement of the circuit board, various different materials such as metal, nonmetal and the like are involved, so that the laser non-contact distance measurement is adopted, the speed is high, the measurement time is shortened, and the overall drilling efficiency is improved.
Preferably, in step 4, the laser focus testing and compensating module measures more than 3 points on the surface of the circuit board of each processing sub-area, calculates the height direction of the curved surface of the circuit board of the processing sub-area, and adjusts the blowing direction by using the flexible dust removal module when the laser drilling module drills holes on the circuit board of the processing sub-area, so that the blowing airflow blows from the high position to the low position on the surface of the circuit board of the processing sub-area, and the laser drilling module drills holes from the leeward position to the windward position.
Preferably, the flexible dust removal module blows negative ion wind.
Preferably, the laser carrier is arranged on the circuit board bearing platform, and is provided with an air suction hole matched with the through hole of the circuit board and an air suction hole matched with the air suction hole of the circuit board bearing platform, and the laser carrier is used for adsorbing the circuit board and removing laser drilling waste materials.
The working principle of the invention is as follows: when the laser drilling is carried out, the laser focus is in a focal depth, once the surface of the circuit board exceeds the laser focus for a certain distance, the laser projection light spot is too large, the power density of the laser peak value is greatly reduced, and the laser drilling cannot be effectively finished.
After the scheme is adopted, the invention has the beneficial effects that: the height of the circuit board is measured in a partitioning manner, and the laser focus of the drilling hole is adjusted to the correct position, so that the drilling operation of the curved surface of the circuit board can be reliably and accurately completed; by adjusting the blowing angle, the drilling dust can be skillfully kept away from the laser transmission path, so that the laser can be better focused; by improving the blowing components, the negative ion wind can enable the laser drilling plasma to be compounded more quickly, and the shielding of the laser drilling plasma is reduced; through using laser carrier, better absorption live the circuit board and get rid of laser drilling waste material.
[ description of the drawings ]
FIG. 1 is a flow chart of the present invention.
FIG. 2 is a schematic view of a curved surface partition interface of the circuit board of the present invention.
Fig. 3 is a schematic view of the air outlet direction of the flexible dust removal module of the present invention.
[ detailed description ] embodiments
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.
As shown in fig. 1, the present invention provides a method for laser drilling a curved surface of a circuit board, comprising the following steps:
step 1: placing the circuit board 10 on a circuit board bearing table;
step 2: the circuit board 10 is fixed on the circuit board bearing table by utilizing the limiting mechanism of the circuit board bearing table:
as one embodiment, a plurality of suction holes may be formed on the circuit board carrier, and the circuit board 10 is adsorbed on the circuit board carrier;
and step 3: the method comprises the steps of leading in drilling data by using a laser drilling module, and dividing the surface of a circuit board 10 into a plurality of processing sub-areas 1, 2, 3, 4 and 5 … … N according to the drilling data;
and 4, step 4: the laser focus testing and compensating module is used for measuring the height of the circuit board surface corresponding to the first processing subarea 1 and adjusting and compensating the laser focus to the circuit board surface of the processing subarea 1;
and 5: carrying out laser drilling on the circuit board of the processing subarea 1 by using a laser drilling module;
step 6: after the laser drilling of the processing subarea 1 is finished, processing the next processing subarea 2;
and (5) repeating the steps 4 to 5 until all the processing sub-areas 1, 2, 3, 4 and 5 … … N of the circuit board 10 are drilled by the laser, breaking the vacuum of the circuit board bearing platform, and taking down the circuit board 10.
Preferably, the laser focus testing and compensating module adopts a laser range finder to measure the height coordinate of the circuit board. For the curved surface measurement of the circuit board, various different materials such as metal, nonmetal and the like are involved, so that the laser non-contact distance measurement is adopted, the speed is high, the measurement time is shortened, and the overall drilling efficiency is improved.
As shown in fig. 2, which is a schematic sectional view of a curved surface partition of the circuit board of the present invention, a curved surface of the circuit board 10 is divided into N processing sub-regions, where the first processing sub-region 1, the second processing sub-region 2, the third processing sub-region 3, the fourth processing sub-region 4, the fifth processing sub-region 5 … … and the nth processing sub-region N are respectively, and the surface of each processing sub-region has undulation, and the height of each processing sub-region needs to be measured by using an efficient measuring instrument, such as a laser range finder, so as to adjust the laser focus position to a proper processing coordinate.
Preferably, in step 4, the laser focus testing and compensating module measures more than 3 points on the surface of the circuit board of each processing sub-area, calculates the height direction of the curved surface of the circuit board of the processing sub-area, and adjusts the blowing direction by using the flexible dust removal module when the laser drilling module drills holes on the circuit board of the processing sub-area, so that the blowing airflow blows from the high position to the low position on the surface of the circuit board of the processing sub-area, and the laser drilling module drills holes from the leeward position to the windward position.
As shown in FIG. 3, the blowing direction in the method of the present invention is schematically shown. In the first processing subregion 1, the circuit board surface height in the left and right sides is low, therefore blows and adopts the direction that arrow A shows, and the benefit of doing so is let the dust of processing leave the space that the laser beam is located fast, if the direction of blowing is opposite with the direction that A shows, then the dust that processing produced will be faced the laser beam divergence, influences the follow-up processing focus effect of laser. Similarly, in the third processing subregion 3, the surface of the wiring board is low on the left and high on the right, and therefore, the blow air takes the direction indicated by the arrow B.
Preferably, the flexible dust removal module blows negative ion wind.
Preferably, the laser carrier is arranged on the circuit board bearing platform, and is provided with an air suction hole matched with the through hole of the circuit board and an air suction hole matched with the air suction hole of the circuit board bearing platform, and the laser carrier is used for adsorbing the circuit board and removing laser drilling waste materials.
The working principle of the invention is as follows: when the laser drilling is carried out, the laser focus is in a focal depth, once the surface of the circuit board exceeds the laser focus for a certain distance, the laser projection light spot is too large, the power density of the laser peak value is greatly reduced, and the laser drilling cannot be effectively finished.
After the scheme is adopted, the invention has the beneficial effects that: the drilling laser focus is adjusted to the correct position by measuring the height of the circuit board in a partition manner, so that the drilling of the circuit board can be reliably and accurately finished; by adjusting the blowing angle, the drilling dust can be skillfully kept away from the laser transmission path, so that the laser can be better focused; by improving the blowing components, the negative ion wind can enable the laser drilling plasma to be compounded more quickly, and the shielding of the laser drilling plasma is reduced; through using laser carrier, better absorption live the circuit board and get rid of laser drilling waste material.
The above examples and drawings are not intended to limit the methods or embodiments of the present invention, and any suitable changes or modifications thereof by one of ordinary skill in the art should be considered as not departing from the scope of the present invention.
Claims (6)
1. A curved surface laser drilling method of a circuit board is characterized by comprising the following steps:
step 1: placing the circuit board on a circuit board bearing table;
step 2: fixing the circuit board on the circuit board bearing table by using a limiting mechanism of the circuit board bearing table;
and step 3: the laser drilling module is used for leading in drilling data, the surface of the circuit board is divided into a plurality of processing sub-areas according to the drilling data, and the height difference of the surface of the circuit board of each processing sub-area is smaller than the laser focal depth distance;
and 4, step 4: the laser focus testing and compensating module is used for measuring the height of the surface of the circuit board corresponding to the processing subarea and adjusting and compensating the laser focus to the surface of the circuit board of the processing subarea;
and 5: utilizing a laser drilling module to perform laser drilling on the circuit board of the processing subarea;
step 6: after the laser drilling of the processing subarea is finished, repeating the step 4 and the step 5 to process the next processing subarea; and (4) removing the fixation of the circuit board bearing table until the laser drilling of all the processing subregions of the circuit board is completed, and taking down the circuit board.
2. The method of claim 1, wherein the method comprises the steps of: a plurality of suction holes are formed in the circuit board bearing platform, the circuit board is adsorbed on the circuit board bearing platform in a vacuum mode through the suction holes, and after laser drilling is completed in all machining subareas, the circuit board bearing platform breaks vacuum, and the circuit board is taken down.
3. The method of claim 1, wherein the method comprises the steps of: and the laser focus testing and compensating module adopts a laser range finder to measure the height coordinate of the circuit board.
4. The method of claim 1, wherein the method comprises the steps of: in step 4, the laser focus testing and compensating module measures more than 3 points on the surface of the circuit board of each processing sub-area, calculates the height direction of the curved surface of the circuit board of the processing sub-area, and adjusts the blowing direction by using the flexible dust removal module when the laser drilling module drills holes on the circuit board of the processing sub-area, so that the blowing airflow blows from the high position to the low position on the surface of the circuit board of the processing sub-area, and the laser drilling module drills holes from the leeward position to the windward position.
5. The method of claim 4, wherein the method comprises the steps of: the flexible dust removal module blows negative ion wind.
6. The method of claim 2, wherein the method comprises the steps of: be provided with radium-shine carrier on the circuit board plummer, radium-shine carrier is seted up the suction hole that matches with the through-hole of circuit board to and the suction hole that matches with the circuit board plummer suction hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010286018.8A CN111447744B (en) | 2020-04-13 | 2020-04-13 | Curved surface laser drilling method for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010286018.8A CN111447744B (en) | 2020-04-13 | 2020-04-13 | Curved surface laser drilling method for circuit board |
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| CN111447744A CN111447744A (en) | 2020-07-24 |
| CN111447744B true CN111447744B (en) | 2021-06-11 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1559742A (en) * | 1997-02-06 | 2005-01-05 | ���µ�����ҵ��ʽ���� | Laser processing device |
| CN101890582A (en) * | 2010-06-30 | 2010-11-24 | 北京宏诚拓业科技发展有限公司 | Laser processing method for steel sieve tube slit |
| CN102451953A (en) * | 2010-10-20 | 2012-05-16 | 中国科学院力学研究所 | Multi-functional laser processing manufacturing system |
| CN105407642A (en) * | 2015-11-04 | 2016-03-16 | 广东正业科技股份有限公司 | Laser drilling system and laser drilling method |
| CN106735864A (en) * | 2016-12-22 | 2017-05-31 | 温州大学 | The vibration mirror scanning laser processing and device of coaxial real-time detection |
| CN209363854U (en) * | 2018-12-28 | 2019-09-10 | 恩利克（浙江）智能装备有限公司 | The device of automatic real time calibration hot spot when laser processing |
-
2020
- 2020-04-13 CN CN202010286018.8A patent/CN111447744B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1559742A (en) * | 1997-02-06 | 2005-01-05 | ���µ�����ҵ��ʽ���� | Laser processing device |
| CN101890582A (en) * | 2010-06-30 | 2010-11-24 | 北京宏诚拓业科技发展有限公司 | Laser processing method for steel sieve tube slit |
| CN102451953A (en) * | 2010-10-20 | 2012-05-16 | 中国科学院力学研究所 | Multi-functional laser processing manufacturing system |
| CN105407642A (en) * | 2015-11-04 | 2016-03-16 | 广东正业科技股份有限公司 | Laser drilling system and laser drilling method |
| CN106735864A (en) * | 2016-12-22 | 2017-05-31 | 温州大学 | The vibration mirror scanning laser processing and device of coaxial real-time detection |
| CN209363854U (en) * | 2018-12-28 | 2019-09-10 | 恩利克（浙江）智能装备有限公司 | The device of automatic real time calibration hot spot when laser processing |
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| CN111447744A (en) | 2020-07-24 |
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