CN102126082B - Laser exposure cutter and laser-based three-dimensional direct exposure imaging method - Google Patents
Laser exposure cutter and laser-based three-dimensional direct exposure imaging method Download PDFInfo
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- CN102126082B CN102126082B CN 201010604662 CN201010604662A CN102126082B CN 102126082 B CN102126082 B CN 102126082B CN 201010604662 CN201010604662 CN 201010604662 CN 201010604662 A CN201010604662 A CN 201010604662A CN 102126082 B CN102126082 B CN 102126082B
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Abstract
The invention discloses a laser exposure cutter and a laser-based three-dimensional direct exposure imaging method, and the adopted laser exposure cutter comprises an outer housing, as well as a control circuit board, a laser, a collimating lens, a diaphragm and a focusing lens, which are mounted in the outer housing, wherein a drive controller for performing drive control on the laser is arranged on the control circuit board, the shape of the outer housing is the same with that of a cutter shank of the cutter mounted on a numerical control machine, and the drive controller is connected with a control host of the numerical control machine; and the three-dimensional direct exposure imaging method comprises the following steps: 1) measuring the outer surface of a workpiece and designing a processing pattern; 2) processing the outer surface of the workpiece; 3) designing a mask pattern; 4) mounting the workpiece; 5) mounting the laser exposure cutter; 6) connecting with a device; 7) performing exposure imaging; and 8) performing follow-up processing on the surface of the workpiece. The laser exposure cutter has the advantages of reasonable design, low investment cost, simplicity in operation, good using effect and wide range of applications, and can be used for solving a plurality of practical problems in the traditional chemical etching method.
Description
Technical field
The invention belongs to the chemical etching processing technique field, especially relate to a kind of laser explosure cutter and based on the three-dimensional Direct exposure imaging method of laser.
Background technology
In the modern processing field, the chemical etching of figure processing is a kind of technological means that is widely used on the material surface, as the processing and manufacturing of printed circuit board (PCB), label nameplate etc.Wherein, the basic procedure of traditional chemical etching and processing is roughly as follows:
The first step, plate-making: make the photographic negative that needs etched figure with optical plotter or film setter;
Second step, coating: at material surface coating photosensitive resist glue or stickup photosensitive resist film;
The 3rd step, printing down: egative film closely is placed on the photosensitive resist film on the photosensitive material surface that applies, to its exposure printing down, after development, photographic fixing, forms the mask graph against corrosion that needs graphics processing again;
The 4th step, etching: to material surface etching, cleaning, and form required figure with chemical solution.
In the actual use, therefore advantage such as chemical etch technique has pattern precision height, good reproducibility, technology is simple and with low cost has obtained using widely.But above-mentioned traditional chemical etch technique is confined to the etching and processing to material plane basically.And for the figure on the 3 D stereo curved surface, traditional chemical etch technique is often helpless, and the practical application situation of graphics processing increases gradually on its 3 D stereo curved surface, the typical application as the logical radome of band.Because radome itself is the 3 D stereo curved surface of being made by composite, and need to go out frequency selection metallic pattern in the radome Surface Machining.
On the 3 D stereo curved surface, during graphics processing, stick photographic negative at the solid surface that applies photosensitive resist glue in traditional chemical etching, become the difficult point in the existing process technology.Because photographic negative is the plane film, can't fit tightly with solid surface, must be according to the amount of curvature of curved surface zones of different, just film is cut into some of differing in size and splices, pastes.Thereby in the actual mechanical process, there is following main major defect in above-mentioned traditional chemical engraving method: 1) pattern precision is poor: owing to film need be carried out manual splicing, stickup, the graphic joining precision is extremely low, can not satisfy the demand of high accuracy figure; 2) repeatable accuracy is low: the manual splicing of a large amount of Minifilms, stickup, produce cumulative errors, and cause repeatability, the uniformity deviation of product; 3) inefficiency, cost height and percent defective height: owing to splicing, the stickup of film need be hand-manipulated, and disposable use, production efficiency is extremely low, percent defective height, cost height; 4) complex-curved can't processing: for complex-curved, film must be divided into the very film of small size, to such an extent as to can't realize fully.Therefore, the chemical etching of carrying out the high accuracy complex figure on the 3 D stereo curved surface is the difficult point of process technology always, can not meet the demands well.
Summary of the invention
Technical problem to be solved by this invention is at above-mentioned deficiency of the prior art, provide a kind of simple in structure, reasonable in design, processing and fabricating convenient and use the laser explosure cutter easy to operate, that result of use is good.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of laser explosure cutter, it is characterized in that: the external shell that comprises the leading section opening, be installed in the control circuit board in the described external shell, laser instrument for generation of laser beam, the collimation camera lens that laser beam that laser instrument produces is collimated, laser beam power behind collimation camera lens collimation is controlled the diaphragm and the amasthenic lens that is installed on the described external shell leading section opening of adjustment, described collimation camera lens, diaphragm and amasthenic lens all are laid on the projecting direction of laser beam that laser instrument produces, and laser instrument, the collimation camera lens, diaphragm and amasthenic lens extremely before are laid on the same straight line described laser instrument by the back, collimation camera lens and diaphragm all are laid in described external shell inside; Described control circuit board be provided with to laser instrument drive the driving governor of control, the control signal input interface that joins with driving governor and the power module that each power unit is powered, described power module and driving governor join; The handle of a knife shape of institute's mounting cutter is identical on the shape of described external shell and the Digit Control Machine Tool; Described external shell is installed on the cutter drives main shaft of Digit Control Machine Tool; Described driving governor joins by the main control system of control signal input interface and described Digit Control Machine Tool.
Above-mentioned laser explosure cutter, it is characterized in that: described external shell comprises tool shank cartridges and is installed on the tool shank cartridges and the cylindric casing of leading section opening, described control circuit board, laser instrument, collimation camera lens and diaphragm are installed in the cylindric casing, described amasthenic lens is installed on the leading section opening of cylindric casing, and laser instrument, collimation camera lens, diaphragm and amasthenic lens all are coaxial laying with cylindric casing.
Above-mentioned laser explosure cutter, it is characterized in that: described cylindric casing rear portion is provided with for the control cable that joins with the control signal input interface and the through wires hole that passes with feed cable that power module joins, described control signal input interface joins by described control cable and main control system, and described feed cable is connected in the supply socket.
Above-mentioned laser explosure cutter, it is characterized in that: comprise also that output brightness to laser instrument detects in real time and institute's detection signal synchronous driving is carried out the regulating circuit of manual adjustments to the photodetector unit of driving governor with to the power output of laser instrument, described photodetector unit and regulating circuit all join with driving governor.
Above-mentioned laser explosure cutter is characterized in that: described laser instrument is semiconductor laser L1, and described photodetector unit is photodiode D1, and described regulating circuit is variable potentiometer VR1.
Above-mentioned laser explosure cutter is characterized in that: described driving governor is control chip Maxim3263.
Above-mentioned laser explosure cutter, it is characterized in that: the OUT+ pin of described control chip Maxim3263 joins with the anode of semiconductor laser L1 after resistance R 1, the IPin pin of control chip Maxim3263 and the anode of photodiode D1 joins and the anode of the negative electrode of photodiode D1 and semiconductor laser L1 joins, between the anode of photodiode D1 and the negative electrode and be connected to capacitor C 2, the IBO pin of described control chip Maxim3263 joins with the negative electrode of semiconductor laser L1 after inductance L 11, the OUT-pin of described control chip Maxim3263 joins with the negative electrode of semiconductor laser L1 after resistance R 3, the Fail pin of described control chip Maxim3263 joins with the OUT-pin of described control chip Maxim3263 after resistance R 4 and resistance R 2 successively, between tie point between resistance R 4 and the resistance R 2 and the OUT-pin of described control chip Maxim3263 and be connected to capacitor C 5, the IBI pin of described control chip Maxim3263 and SLW pin be equal ground connection after resistance R 5 and resistance R 7 respectively, the IMI pin of described control chip Maxim3263 and IMO pin join and join with the Oadj pin of control chip Maxim3263 after resistance R 6, the Ref1 pin of control chip Maxim3263 and Ref2 pin join and join with the Oadj pin of control chip Maxim3263 behind variable potentiometer VR1, between the Oadj pin of control chip Maxim3263 and Ref1 pin and the Ref2 pin and be connected to capacitor C 4; The VCC pin of control chip Maxim3263 is equal ground connection after capacitor C 1 and capacitor C 6 respectively, described control signal input interface is that the 1st, the 2nd, the 3rd and the 4th pin of control interface J1 joins with IN+, IN-, EN+ and the EN-pin of control chip Maxim3263 respectively, the GND pin of control chip Maxim3263 and the equal ground connection of IP pin, the the 5th and the 6th pin of control interface J1 all connects the VCC power end, the equal ground connection of the 7th and the 8th pin of control interface J1; The anode of described semiconductor laser L1 connects VCC power end and VCC power end ground connection after capacitor C 3.
Simultaneously, the invention also discloses that a kind of technology is simple, easy and simple to handle, production efficiency is high and exposure image pattern precision height, repeatable accuracy are high utilizes the laser explosure cutter to carry out method based on the three-dimensional Direct exposure imaging of laser, it is characterized in that this method may further comprise the steps:
The method of above-mentioned three-dimensional Direct exposure imaging based on laser, it is characterized in that: the X-Y axis carriage that described workpiece installing mechanism is described multi-coordinate numerically-controlled machine tool, described multi-coordinate numerically-controlled machine tool are 4-coordinate numerical control machining center or five coordinate numerical control machining centers.
The method of above-mentioned three-dimensional Direct exposure imaging based on laser, it is characterized in that: the photosensitive material layer described in the step 2 is photosensitive plastic coating.
The present invention compared with prior art has the following advantages:
1, the laser explosure cutter structure that adopts is simple, reasonable in design, processing and fabricating convenient and it is easy to operate to use, result of use good.
2, reasonable in design, with controlled ultraviolet laser beam the photosensitive resist glue that has applied on the need machining curve surface of workpiece is directly carried out the 3 D stereo exposure, form the resist pattern mask, carry out chemical etching processing again, the high accuracy figure that has proposed a kind of three-dimensional nonmetallic surface coat of metal is made new method, it merges into the three-dimensional Direct exposure imaging technology of laser with the plate-making in the conventional metals coating figure processing technology and printing down operation, solved the multiple shortcoming that exists in the existing mask-making technology, and the present invention is corresponding has the following advantages: 1. can effectively solve the difficult problem that plane egative film and curved surface fit tightly; 2. the pattern precision height behind the exposure image of the present invention, the repeatable accuracy height; 3. technology is simple, and is easy and simple to handle, and the production efficiency height is with low cost and yield rate is high; 4. can be used for the direct exposure of various complex-curved figures, be particularly useful for carrying out high accuracy complex figure manufacturing process at the 3 D stereo curved surface, efficiently solve be difficult on the 3 D stereo curved surface to make a plate, the bottleneck of printing down, make traditional chemical etching give full play to its advantage at the manufacture field of solid surface figure, it is the innovation to plate-making in traditional chemical etching, solarization platemaking technology, make the possibility that is processed into of such high accuracy complex figure, application prospect widely is provided.
3, the present invention adopts the optical system stable work in work, reliable and use cost is low, workable of laser explosure cutter, the energy of laser instrument output can be accumulated in the luminous point of a given size to greatest extent, reduce the energy of luminous point veiling glare in addition simultaneously, to obtain best exposure effect as far as possible.The laser explosure cutter optical system that with the laser diode is light source is a kind of comparatively simple, traditional optical texture, the minor diameter divergencing laser light beam that laser instrument sends is via the parallel laser light beam that expands, collimation lens is transformed to a branch of larger aperture, the adjustable diaphragm of via hole diameter then, improve the collimated light beam quality, finally by by condenser lens with light focusing the exposure three-dimensional surface, form a great luminous point of the very little light intensity of diameter, the light sensitive layer on curved body surface is exposed.Simultaneously, regulate diaphragm diameter and can adjust the exposure spot diameter.In addition, the laser explosure cutter that adopts can use after demarcating, calibrating for a long time.
4, applied widely, the present invention can be applied to the manufacturing process of multinomial product, particularly adopts the incompetent exquisite graphic making process of conventional art and technology, as leading edge of a wing curved surface antenna house, equiangular spiral antenna etc.
In sum, the present invention is reasonable in design, input cost is low, use is easy and simple to handle and result of use good, applied range, can effectively solve the traditional chemical engraving method and have that pattern precision is poor, repeatable accuracy is low, working (machining) efficiency is low, percent defective is high, complex-curvedly multiple practical problem such as can't process.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Fig. 1 adopts the assembling schematic diagram of laser explosure cutter for the present invention.
Fig. 2 adopts the use state reference map of laser explosure cutter for the present invention.
Fig. 3 adopts the circuit theory diagrams of laser explosure cutter for the present invention.
The schematic block circuit diagram of used Direct exposure imaging system when Fig. 4 carries out three-dimensional Direct exposure imaging for the present invention.
Method flow block diagram when Fig. 5 carries out three-dimensional Direct exposure imaging for the present invention.
Description of reference numerals:
1-control circuit board; 1-1-driving governor; 1-2-regulating circuit;
1-3-control signal input interface; 1-4-power module; 1-5-photodetector unit;
2-laser instrument; 3-collimation camera lens; 4-diaphragm;
5-amasthenic lens; 6-1-tool shank cartridges; 6-2-cylindric casing;
7-main control system; 8-control cable; 9-feed cable;
10-X-Y axis carriage; 11-CAD area of computer aided, 12-machining center main shaft;
Design system.
13-rotary main shaft; 14-machining center Z axle; 15-circular workpiece.
The specific embodiment
As Fig. 1, Fig. 2 and shown in Figure 3, laser explosure cutter of the present invention, the external shell that comprises the leading section opening, be installed in the control circuit board 1 in the described external shell, laser instrument 2 for generation of laser beam, the collimation camera lens 3 that laser instrument 2 laser beam that produces is collimated, laser beam power behind collimation camera lens 3 collimations is controlled the diaphragm 4 and the amasthenic lens 5 that is installed on the described external shell leading section opening of adjustment, described collimation camera lens 3, diaphragm 4 and amasthenic lens 5 all are laid on the projecting direction of laser instrument 2 laser beam that produces, and laser instrument 2, collimation camera lens 3, diaphragm 4 and amasthenic lens 5 extremely before are laid on the same straight line described laser instrument 2 by the back, collimation camera lens 3 and diaphragm 4 all are laid in described external shell inside.Described control circuit board 1 be provided with to laser instrument 2 drive the driving governor 1-1 of control, the control signal input interface 1-3 that joins with driving governor 1-1 and the power module 1-4 that each power unit is powered, described power module 1-4 and driving governor 1-1 join; The handle of a knife shape of institute's mounting cutter is identical on the shape of described external shell and the Digit Control Machine Tool.Described external shell is installed on the cutter drives main shaft of Digit Control Machine Tool.Described driving governor 1-1 joins by the main control system 7 of control signal input interface 1-3 and described Digit Control Machine Tool.
In the present embodiment, described external shell comprises tool shank cartridges 6-1 and is installed in tool shank cartridges 6-1 upward and the cylindric casing 6-2 of leading section opening, described control circuit board 1, laser instrument 2, collimation camera lens 3 and diaphragm 4 are installed in the cylindric casing 6-2, described amasthenic lens 5 is installed on the leading section opening of cylindric casing 6-2, and laser instrument 2, collimation camera lens 3, diaphragm 4 and amasthenic lens 5 all are coaxial laying with cylindric casing 6-2.
Described cylindric casing 6-2 rear portion is provided with for the control cable 8 that joins with control signal input interface 1-3 and the through wires hole that passes with feed cable 9 that power module 1-4 joins, described control signal input interface 1-3 joins with main control system 7 by described control cable 8, and described feed cable 9 is connected in the supply socket.
Simultaneously, the present invention comprises also that the output brightness to laser instrument 2 detects in real time and institute's detection signal synchronous driving is carried out the regulating circuit 1-2 of manual adjustments to the photodetector unit 1-5 of driving governor 1-1 with to the power output of laser instrument 2 that described photodetector unit 1-5 and regulating circuit 1-2 all join with driving governor 1-1.
In the present embodiment, described laser instrument 2 is semiconductor laser L1, and described photodetector unit 1-5 is photodiode D1, and described regulating circuit 1-2 is variable potentiometer VR1.Described driving governor 1-1 is control chip Maxim3263.
Actual when carrying out wiring, the OUT+ pin of described control chip Maxim3263 joins with the anode of semiconductor laser L1 after resistance R 1, the IPin pin of control chip Maxim3263 and the anode of photodiode D1 joins and the anode of the negative electrode of photodiode D1 and semiconductor laser L1 joins, between the anode of photodiode D1 and the negative electrode and be connected to capacitor C 2, the IBO pin that described control chip Maxim3263 is chip U1 joins with the negative electrode of semiconductor laser L1 after inductance L 11, the OUT-pin of described control chip Maxim3263 joins with the negative electrode of semiconductor laser L1 after resistance R 3, the Fail pin of described control chip Maxim3263 joins with the OUT-pin of described control chip Maxim3263 after resistance R 4 and resistance R 2 successively, between tie point between resistance R 4 and the resistance R 2 and the OUT-pin of described control chip Maxim3263 and be connected to capacitor C 5, the IBI pin of described control chip Maxim3263 and SLW pin be equal ground connection after resistance R 5 and resistance R 7 respectively, the IMI pin of described control chip Maxim3263 and IMO pin join and join with the Oadj pin of control chip Maxim3263 after resistance R 6, the Ref1 pin of control chip Maxim3263 and Ref2 pin join and join with the Oadj pin of control chip Maxim3263 behind variable potentiometer VR1, between the Oadj pin of control chip Maxim3263 and Ref1 pin and the Ref2 pin and be connected to capacitor C 4; The VCC pin of control chip Maxim3263 is equal ground connection after capacitor C 1 and capacitor C 6 respectively, described control signal input interface 1-3 is that the 1st, the 2nd, the 3rd and the 4th pin of control interface J1 joins with IN+, IN-, EN+ and the EN-pin of control chip Maxim3263 respectively, the GND pin of control chip Maxim3263 and the equal ground connection of IP pin, the the 5th and the 6th pin of control interface J1 all connects the VCC power end, the equal ground connection of the 7th and the 8th pin of control interface J1; The anode of described semiconductor laser L1 connects VCC power end and VCC power end ground connection after capacitor C 3.
In the actual use, the control signal that control chip Maxim3263 is used for connecting power supply, receiving Digit Control Machine Tool main control system 7 is to drive semiconductor laser L1, size and the break-make of control laser output energy, wherein L1 is the semiconductor laser of 405nm, variable potentiometer VR1 is used for regulating the upper power output of semiconductor laser L1, the output brightness of photodiode D1 monitoring semiconductor laser L1.J1 is control interface, the 155mpbs high speed differential mode control signal that input control chip Maxim3263 uses.
In conjunction with Fig. 4 and Fig. 5, the laser explosure cutter that utilizes of the present invention carries out method based on the three-dimensional Direct exposure imaging of laser, may further comprise the steps:
Thereby in the actual use, pictograph closes the physical dimension that Digit Control Machine Tool requires cutter outside the handle of a knife of described laser explosure cutter, and it can be directly installed on the cutter drives main shaft of Digit Control Machine Tool; The housing part of handle of a knife is firm not yielding, and the laser explosure cutter can use after demarcating, calibrating for a long time.
In the present embodiment, the photosensitive material layer described in the step 2 is photosensitive plastic coating.
In sum, in the actual use, parts are integrated is installed in the handle of a knife shape external shell with laser instrument 2, control circuit board 1, diaphragm 4 and amasthenic lens 5 etc., constitute one the laser explosure cutter of standard process tool form.Above-mentioned handle of a knife shape external shell can be installed on the various multi-coordinate numerical control machining centers and with the standard cutter form photosensitive plastic coating of three-dimensional surface of the work be carried out graph exposure processing.Actually add man-hour, at first produce CNC numerically controlled data file by 11 designs of CAD computer aided design system, editor, and CNC numerically controlled data file is input in the main control system 7 of multi-coordinate numerical control machining center and is saved in the Installed System Memory; Afterwards, main control system 7 is that the control instruction of CNC file drives the laser explosure cutter and does the 3 D stereo motion according to CNC numerically controlled data file; Simultaneously, main control system 7 sends control signal by the driving governor 1-1 that control signal input interface 1-3 installs on the control circuit board 1, and control laser explosure cutter namely needs the photosensitive plastic coating on the processing work outer surface to expose in accurate position to the curved body surface.
And, when carrying out the three-dimensional directly exposure of laser, specifically be that will need earlier the to expose need processing work of processing is installed on the X-Y axis carriage 10 of multi-coordinate machining center, and the laser explosure cutter be installed on the cutter drives main shaft of machining center, and rotation is forbidden in the cutter drives spindle lock.Described control cable 8 is connected with the main control system 7 of machining center with feed cable 9, utilizes accurate three-dimensional location and the locomitivity of machining center, and with the laser beam of laser explosure cutter output is exposed in need processing work surface.The stereo-motion of machining center is controlled by CNC numerically controlled data file, behind the main control system 7 of CNC file input machining center, machining center then drives X, Y and Z axle and rotating shaft according to designing requirement and utilizes the laser explosure cutter that the photosensitive plastic coating of surface of the work is carried out graph exposure processing.In addition, the needed CNC file of multi-coordinate numerical control machining center is that CAD computer aided design system 11 generates according to the threedimensional model of need processing work and the designing requirement of exposure figure on computers by the CAD Autocad, the CAD Autocad carries out accurate Calculation to the laser output power of the position, route and the laser explosure cutter that expose on the need processing work outer surface, generates CNC control data file.
The above; it only is preferred embodiment of the present invention; be not that the present invention is imposed any restrictions, every any simple modification, change and equivalent structure of above embodiment being done according to the technology of the present invention essence changes, and all still belongs in the protection domain of technical solution of the present invention.
Claims (10)
1. laser explosure cutter, the external shell that comprises the leading section opening, be installed in the control circuit board (1) in the described external shell, laser instrument (2) for generation of laser beam, the collimation camera lens (3) that laser instrument (2) laser beam that produces is collimated, laser beam power behind collimation camera lens (3) collimation is controlled the diaphragm (4) of adjustment and is installed in amasthenic lens (5) on the described external shell leading section opening, described collimation camera lens (3), diaphragm (4) and amasthenic lens (5) all are laid on the projecting direction of laser instrument (2) laser beam that produces, and laser instrument (2), collimation camera lens (3), diaphragm (4) and amasthenic lens (5), be is characterized in that: described laser instrument (2) to before being laid on the same straight line by the back, collimation camera lens (3) and diaphragm (4) all are laid in described external shell inside; Described control circuit board (1) be provided with to laser instrument (2) drive the driving governor (1-1) of control, the control signal input interface (1-3) that joins with driving governor (1-1) and the power module (1-4) that each power unit is powered, described power module (1-4) joins with driving governor (1-1); The handle of a knife shape of institute's mounting cutter is identical on the shape of described external shell and the Digit Control Machine Tool; Described external shell is installed on the cutter drives main shaft of Digit Control Machine Tool; Described driving governor (1-1) joins by the main control system (7) of control signal input interface (1-3) with described Digit Control Machine Tool.
2. according to the described laser explosure cutter of claim 1, it is characterized in that: described external shell comprises tool shank cartridges (6-1) and is installed in tool shank cartridges (6-1) upward and the cylindric casing (6-2) of leading section opening, described control circuit board (1), laser instrument (2), collimation camera lens (3) and diaphragm (4) are installed in the cylindric casing (6-2), described amasthenic lens (5) is installed on the leading section opening of cylindric casing (6-2), and laser instrument (2), collimation camera lens (3), diaphragm (4) and amasthenic lens (5) all are coaxial laying with cylindric casing (6-2).
3. according to the described laser explosure cutter of claim 2, it is characterized in that: described cylindric casing (6-2) rear portion is provided with for the control cable (8) that joins with control signal input interface (1-3) and the through wires hole that passes with feed cable (9) that power module (1-4) joins, described control signal input interface (1-3) joins by described control cable (8) and main control system (7), and described feed cable (9) is connected in the supply socket.
4. according to claim 1 or 2 described laser explosure cutters, it is characterized in that: comprise also that output brightness to laser instrument (2) detects in real time and institute's detection signal synchronous driving is carried out the regulating circuit (1-2) of manual adjustments to the photodetector unit (1-5) of driving governor (1-1) with to the power output of laser instrument (2), described photodetector unit (1-5) and regulating circuit (1-2) all join with driving governor (1-1).
5. according to the described laser explosure cutter of claim 4, it is characterized in that: described laser instrument (2) is semiconductor laser L1, and described photodetector unit (1-5) is photodiode D1, and described regulating circuit (1-2) is variable potentiometer VR1.
6. according to the described laser explosure cutter of claim 5, it is characterized in that: described driving governor (1-1) is control chip Maxim3263.
7. according to the described laser explosure cutter of claim 6, it is characterized in that: the OUT+ pin of described control chip Maxim3263 joins with the anode of semiconductor laser L1 after resistance R 1, the IPin pin of control chip Maxim3263 and the anode of photodiode D1 joins and the anode of the negative electrode of photodiode D1 and semiconductor laser L1 joins, between the anode of photodiode D1 and the negative electrode and be connected to capacitor C 2, the IBO pin of described control chip Maxim3263 joins with the negative electrode of semiconductor laser L1 after inductance L 11, the OUT-pin of described control chip Maxim3263 joins with the negative electrode of semiconductor laser L1 after resistance R 3, the Fail pin of described control chip Maxim3263 joins with the OUT-pin of described control chip Maxim3263 after resistance R 4 and resistance R 2 successively, between tie point between resistance R 4 and the resistance R 2 and the OUT-pin of described control chip Maxim3263 and be connected to capacitor C 5, the IBI pin of described control chip Maxim3263 and SLW pin be equal ground connection after resistance R 5 and resistance R 7 respectively, the IMI pin of described control chip Maxim3263 and IMO pin join and join with the Oadj pin of control chip Maxim3263 after resistance R 6, the Ref1 pin of control chip Maxim3263 and Ref2 pin join and join with the Oadj pin of control chip Maxim3263 behind variable potentiometer VR1, between the Oadj pin of control chip Maxim3263 and Ref1 pin and the Ref2 pin and be connected to capacitor C 4; The VCC pin of control chip Maxim3263 is equal ground connection after capacitor C 1 and capacitor C 6 respectively, described control signal input interface (1-3) is that the 1st, the 2nd, the 3rd and the 4th pin of control interface J1 joins with IN+, IN-, EN+ and the EN-pin of control chip Maxim3263 respectively, the GND pin of control chip Maxim3263 and the equal ground connection of IP pin, the the 5th and the 6th pin of control interface J1 all connects the VCC power end, the equal ground connection of the 7th and the 8th pin of control interface J1; The anode of described semiconductor laser L1 connects VCC power end and VCC power end ground connection after capacitor C 3.
8. one kind is utilized laser explosure cutter according to claim 1 to carry out method based on the three-dimensional Direct exposure imaging of laser, it is characterized in that this method may further comprise the steps:
Step 1, need processing work outer surface measuring and graphics processing design: adopt survey tool that outer surface structure and the size of need processing work are measured, and corresponding foundation needs the threedimensional model of processing work; Simultaneously the figure that needs on the need processing work outer surface to process is designed, and synchronous recording is carried out in designed need graphics processing;
Step 2, need processing work outer surface are handled: evenly apply one deck photosensitive material layer on the outer surface of need processing work;
Step 3, mask graph design: according to threedimensional model and the designing requirement that needs to obtain exposure figure of need processing work, adopt CAD computer aided design system (11) that the power output of laser instrument (2) in exposure position, exposure control route and the whole exposure image process on the need processing stereochemical structure workpiece outer surface is accurately designed and calculates, and the corresponding CNC digital control processing control documents that needs to carry out on the upright workpiece outer surface of processing exposure image that is created on; The described exposure figure that need to obtain be before graphics processing on the need processing stereochemical structure workpiece outer surface, at the outer surface exposure moulding of need processing stereochemical structure workpiece and need graphics processing described in the step 1 corresponding mask graph;
Step 4, need processing work are installed: will need processing work to be installed on the workpiece installing mechanism of Digit Control Machine Tool, and the need processing work that is installed on the described workpiece installing mechanism is carried out benchmark contraposition adjustment, described Digit Control Machine Tool is multi-coordinate numerically-controlled machine tool;
Step 5, laser explosure cutter are installed: the external shell rearward end of laser explosure cutter is installed on the cutter drives main shaft of Digit Control Machine Tool, and adopts retaining mechanism that described cutter drives main shaft is locked to prevent that described cutter drives main shaft from rotating;
Step 6, equipment connect: the main control system (7) of described Digit Control Machine Tool is joined with CAD computer aided design system (11) and control signal input interface (1-3) respectively, and the described CNC digital control processing control documents that generates in the step 3 is sent to main control system (7);
Step 7, exposure image: main control system (7) drives control according to the exposure position of putting down in writing in the described CNC digital control processing control documents and exposure control route to the described cutter drives main shaft of described multi-coordinate numerically-controlled machine tool, is implemented in and drives the control procedure that the laser explosure cutter installed in the step 5 carries out three-dimensional motion at need processing work outer surface under the control action of main control system (7); Simultaneously, main control system (7) is controlled driving governor (1-1) according to the power output of laser instrument (2) in the whole exposure image process of putting down in writing in the described CNC digital control processing control documents, and by driving governor (1-1) power output of laser instrument (2) is adjusted automatically, until the whole exposure image process of finishing the need processing work, and the acquisition mask graph corresponding with the graphics processing of need described in the step 1;
Step 8, need processing work surface subsequent treatment: utilize the mask graph that obtains in the step 7, and according to the surface of the work Patterning method of routine, in the outer surface processing of need processing work and need to obtain the figure of processing.
9. according to the method for the described three-dimensional Direct exposure imaging based on laser of claim 8, it is characterized in that: the X-Y axis carriage (10) that described workpiece installing mechanism is described multi-coordinate numerically-controlled machine tool, described multi-coordinate numerically-controlled machine tool are 4-coordinate numerical control machining center or five coordinate numerical control machining centers.
10. according to the method for claim 8 or 9 described three-dimensional Direct exposure imagings based on laser, it is characterized in that: the photosensitive material layer described in the step 2 is photosensitive plastic coating.
Priority Applications (1)
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| CN107042362B (en) * | 2017-03-07 | 2019-03-26 | 上海维宏电子科技股份有限公司 | Method based on laser cutting process tubing |
| CN107999967B (en) * | 2017-11-30 | 2019-05-31 | 华中科技大学 | A kind of large-scale three dimensional piece surface parallel laser lithography method and apparatus |
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| JP4469436B2 (en) * | 1999-03-19 | 2010-05-26 | 株式会社アマダ | Teaching method and apparatus for YAG laser processing machine |
| WO2003026368A1 (en) * | 2001-09-11 | 2003-03-27 | Daiken Chemical Co., Ltd. | Method for forming image on object surface including circuit substrate |
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| JP2007033882A (en) * | 2005-07-27 | 2007-02-08 | Hitachi Via Mechanics Ltd | Exposure device and exposure method, and manufacturing method for wiring board |
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