CN111431519A - Small-packaged high-power solid relay - Google Patents
Small-packaged high-power solid relay Download PDFInfo
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- CN111431519A CN111431519A CN202010304823.9A CN202010304823A CN111431519A CN 111431519 A CN111431519 A CN 111431519A CN 202010304823 A CN202010304823 A CN 202010304823A CN 111431519 A CN111431519 A CN 111431519A
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- 239000007787 solid Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000005669 field effect Effects 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
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- 238000004377 microelectronic Methods 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/72—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices having more than two PN junctions; having more than three electrodes; having more than one electrode connected to the same conductivity region
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Abstract
The invention discloses a small-packaged high-power solid relay, which comprises a tube shell (1), a first substrate (2), a second substrate (3) and a driving circuit, wherein the first substrate (2) and the second substrate (3) are arranged in the tube shell (1); the driving circuit outputs a control signal according to a signal output by the input circuit, the control signal is loaded on the output circuit to control the output circuit to work, the driving circuit comprises a light emitting diode D1 and a photovoltaic array E1, the light emitting diode D1 is attached to the second substrate (3), and the photovoltaic array E1 is attached to the first substrate (2). According to the solid relay provided by the invention, the light emitting diode and the photovoltaic array of the driving circuit are respectively pasted on the first substrate and the second substrate, and the first substrate and the second substrate form a three-dimensional structure, so that the light transmission efficiency in the relay is improved, light guide glue does not need to be coated for auxiliary light guide, the process flow of relay manufacture is reduced, the utilization rate of the internal space of the relay is increased, and a larger margin is provided for relay design.
Description
Technical Field
The invention belongs to the field of relays, and particularly relates to a small-packaged high-power solid relay.
Background
A Solid State Relay (SSR), which is a contactless switch composed of a microelectronic circuit, a discrete electronic device, and a power electronic power device; the input end of the solid relay uses a tiny control signal to directly drive a heavy current load.
The solid relay can be divided into a zero voltage type (Z) and a phase modulation type (P) IN a trigger mode, and when a proper control signal IN is applied to an input end, the P-type SSR is immediately conducted. When the load current is lower than the holding current of the bidirectional controllable silicon (alternating current commutation) after the IN is cancelled, the SSR is turned off. The Z-type SSR internally comprises a zero-crossing detection circuit, and when an input signal IN is applied, the SSR can be conducted only when the voltage of a load power supply reaches a zero-crossing region, and the maximum time delay of a half period of the power supply can be possibly caused.
The traditional optical isolation solid relay is applied to a plurality of fields due to the characteristics of no mechanical contact, long service life, no electromagnetic interference and the like, and is developing towards the direction of smaller and smaller volume and larger load current at present. Most of the relays adopt a plane light guide structure, and light transmission directions are changed by using light guide glue, so that the space utilization rate of the relay is low, the light transmission efficiency is low, the load current is low, and the on-off speed is low.
Disclosure of Invention
The invention aims to provide a small-packaged high-power solid relay with input and output optically isolated by adopting a three-dimensional structure, which can improve the internal optical transmission efficiency, does not need to coat optical cement for an auxiliary conduit, reduces the process flow of relay manufacture and increases the utilization rate of the internal space of a product.
In order to achieve the purpose of the invention, the small-packaged high-power solid-state relay comprises a tube shell, a first substrate, a second substrate and a driving circuit, wherein the first substrate and the second substrate are arranged in the tube shell; the driving circuit outputs a control signal according to a signal output by the input circuit, the control signal is loaded on the output circuit to control the output circuit to work, the driving circuit comprises a light emitting diode D1 and a photovoltaic array E1, the light emitting diode D1 is attached to the first substrate, and the photovoltaic array E1 is attached to the second substrate.
Furthermore, the solid-state relay provided by the invention further comprises an acceleration circuit, and the control signal output by the driving circuit is input into the output circuit through the acceleration circuit. The accelerating circuit is used for accelerating the charging and discharging speed of the output circuit, and the on-off switching speed of the output circuit is improved.
Furthermore, the solid-state relay provided by the invention also comprises an input leading-out end connected with the input end of the input circuit and an output leading-out end connected with the output end of the output circuit.
Further, the material of the output leading-out end is oxygen-free copper. The output leading-out terminal is made of an oxygen-free copper material, the material has the characteristics of no hydrogen embrittlement phenomenon, high conductivity, corrosion resistance and good processing and welding performance, and the resistance of the output leading-out terminal of a subsequent electric appliance is below 4m omega after the material is used; the normal work of the output leading-out end of the relay connected with the power type load is ensured.
Further, the input circuit is a voltage type input circuit. The voltage type input circuit can adjust the input voltage according to the actual use requirement.
Further, the tube shell comprises a metal base and a metal cover. The metal base and the metal housing are adopted to form the pipe shell, so that the pipe shell has the functions of high air tightness, high temperature resistance, corrosion resistance, moisture resistance, good shielding and protection, firmness, durability and the like.
The invention has the beneficial effects that: according to the solid relay provided by the invention, the light emitting diode and the photovoltaic array of the driving circuit are respectively pasted on the first substrate and the second substrate, and the first substrate and the second substrate form a three-dimensional structure, so that the light transmission efficiency in the relay is improved, light guide glue does not need to be coated for auxiliary light guide, the process flow of relay manufacture is reduced, the utilization rate of the internal space of the relay is increased, and a larger margin is provided for relay design.
The solid relay provided by the invention is of a three-dimensional structure, so that the external dimension of the solid relay is only 24.5mm × 16.5.5 mm × 7.5.5 mm, which is far smaller than that of a high-power solid relay of the same type, and in addition, the solid relay can reach the direct current load capacity of 20A under the extremely small volume, which is far higher than that of a high-power solid relay with similar external dimension.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a sectional view of an internal structure of a solid-state relay provided by the present invention;
fig. 2 is one of the external views of the solid-state relay provided by the present invention;
fig. 3 is a second external view of the solid-state relay provided in the present invention;
fig. 4 is a bottom wiring diagram of the solid-state relay provided by the present invention;
fig. 5 is a schematic block circuit diagram of a solid-state relay provided by the present invention;
fig. 6 is a circuit diagram of a solid-state relay provided by the present invention;
in the drawings: 1-shell 1, 2-first base plate, 3-second base plate, 11-metal base, 12-metal cover shell, 13-input terminal and 14-output terminal.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the inventive arrangements can be practiced without one or more of the specific details, or with other methods. In other instances, well-known methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the invention.
In order to improve the light transmission efficiency inside the relay, avoid coating light guide glue for an auxiliary conduit, reduce the process flow of relay manufacture and increase the utilization rate of the internal space of a product, the invention provides a small-packaged high-power solid relay. As shown in fig. 1 to 6, the relay includes a case 1, a first substrate 2, a second substrate 3, and a driving circuit, the first substrate 2 and the second substrate 3 being mounted in the case 1; the driving circuit outputs a control signal according to a signal output by the input circuit, the control signal is loaded on the output circuit to control the output circuit to work, the driving circuit comprises a light emitting diode D1 and a photovoltaic array E1, the light emitting diode D1 is attached to the first substrate 2, and the photovoltaic array E1 is attached to the second substrate 3 to form a three-dimensional structure.
Wherein the input circuit mainly provides a loop for the input control signal to make it become the trigger signal source of the relay; the driving circuit mainly converts an input electric signal into an optical signal, converts the optical signal into an electric signal as a control signal and outputs the electric signal to the output circuit, and plays a role in photoelectric isolation in the circuit; the output circuit realizes the on-off switching of the relay under the control signal output by the driving circuit.
The main working principle of the relay is that the light-emitting diode D1 works by generating input current through power supply electrification, an optical signal emitted by the light-emitting diode D1 is converted into an electric signal through the photovoltaic array E1, the electric signal output by the photovoltaic array E1 is transmitted to an output circuit, and the on-off switching of the relay is controlled through the output circuit.
In order to accelerate the on-off speed of the output circuit, the control signal output by the driving circuit is input into the output circuit through the accelerating circuit.
The package 1 herein comprises a metal base 11 and a metal casing 12, the first substrate 2 is a printed circuit board, and the second substrate 3 is a copper-clad ceramic substrate.
An input terminal 13 connected to an input circuit terminal and an output terminal 14 connected to an output circuit terminal are mounted on the case 1. Wherein the input terminal is made of 4J29, and the output terminal 14 is made of oxygen-free copper; the input and output terminals 13 and 14 are gold plated.
The input circuit is a voltage-type input circuit, and a circuit structure shown in fig. 6 is adopted here, and includes a resistor R1, a resistor R2, and a diode D2, one end of the resistor R1 is used as an input end of the input circuit, and the other end of the resistor R1 is used as an output end of the input circuit; one end of the resistor R2 serves as the other input end of the input circuit, the other end of the resistor R2 is connected to the cathode of the diode D2, and the anode of the diode D2 serves as the other output end of the input circuit.
As shown in fig. 6, the speed-up circuit includes a resistor R3, a first transistor V1, a second transistor V2, a capacitor C1, a diode D3, and a zener diode D4; the base of the first transistor V1 is used as an input end of the accelerating circuit, the collector of the first transistor V1 is connected with the cathode of the diode D3, and the anode of the diode D3 is used as an output end of the accelerating circuit; the emitter of the first transistor V1 is connected with the emitter of the second transistor V2, the collector of the second transistor V2 is used as the other input end of the accelerating circuit, and the base of the second transistor V2 is connected with the base of the first transistor V1; the emitter of the first transistor V1 is also connected with the cathode of a voltage stabilizing diode D4, and the anode of the voltage stabilizing diode D4 is connected with the collector of the second transistor V2; the resistor R3 is connected in series between the base of the first transistor V1 and the collector of the second transistor V2, and the capacitor C1 is connected in series between the collector of the first transistor V1 and the collector of the second transistor V2; the emitter of the first transistor V1 serves as the other output terminal of the speed-up circuit.
The output circuit comprises a field effect transistor V3, the grid electrode and the drain electrode of the field effect transistor V3 are respectively connected with the output end of the accelerating circuit or the output end of the driving circuit, and the drain electrode and the source electrode of the field effect transistor V3 serve as the output end of the output circuit and are used for being connected with a load. When the grid and the drain of the field effect transistor V3 are respectively connected with the output end of the accelerating circuit, the electric signal output by the photovoltaic array E1 is transmitted to the two ends of the grid source of the field effect transistor in the output circuit through the accelerating circuit, the charging and discharging speed of the grid is accelerated, and the on-off switching of the relay is controlled through the field effect transistor V3.
Any field effect transistor V3 can be adopted, and a power type field effect transistor is adopted, the drain-source on resistance of the field effect transistor is extremely small (generally less than 3m omega), the output on resistance of the relay at the three temperatures is kept below 10m omega, the power consumption of the relay is kept in a lower range under the condition of a higher current load, the working temperature of all components inside the relay at the three temperatures is far lower than the junction temperature of the components, and the service life of the relay is further prolonged.
The solid relay that this paper provided is with the emitting diode paster on printed circuit board, and the photovoltaic array paster forms spatial structure on covering copper ceramic substrate, and this structure can improve the inside light transmission efficiency of relay, need not to scribble the leaded light and glues and assist the leaded light, has reduced the process flow that the relay was made and has increased the rate of utilization of relay inner space, provides bigger surplus for the relay design.
In order to better realize a three-dimensional structure, the light emitting diode D1 and an input circuit are all arranged on a printed circuit board, the photovoltaic array E1 is arranged on a copper-clad ceramic substrate, and the light isolation of the three-dimensional structure is realized by the up-down correspondence of the light emitting diode D1 and the input circuit; here, the acceleration circuit and the output circuit may be arranged on a copper-clad ceramic substrate.
The solid relay input and output provided by the invention adopts stereo structure light isolation, the light transmission efficiency is high, the utilization rate of the internal space of the relay is high, and the structure is compact. The input end is a voltage type input circuit, and the input voltage can be adjusted according to the actual use requirement. The output end adopts a quick connection and disconnection circuit, and the on-off switching speed of the output end is high. The output leading-out end is made of an oxygen-free copper material, so that the relay can work normally when the output end of the relay is connected with a power type load.
The input voltage specification of the solid-state relay provided by the invention can be changed through the input current limiting resistors (the resistor R1 and the resistor R2 in the drawing) of the relay, so that the required relay specification is achieved.
The present disclosure has been described in terms of the above-described embodiments, which are merely exemplary of the implementations of the present disclosure. It must be noted that the disclosed embodiments do not limit the scope of the disclosure. Rather, variations and modifications are possible within the spirit and scope of the disclosure, and these are all within the scope of the disclosure.
Claims (10)
1. The small-packaged high-power solid relay is characterized by comprising a tube shell (1), a first substrate (2), a second substrate (3) and a driving circuit, wherein the first substrate (2) and the second substrate (3) are installed in the tube shell (1); the driving circuit outputs a control signal according to a signal output by the input circuit, the control signal is loaded on the output circuit to control the output circuit to work, the driving circuit comprises a light emitting diode D1 and a photovoltaic array E1, the light emitting diode D1 is attached to the first substrate (2), and the photovoltaic array E1 is attached to the second substrate (3).
2. The small form factor high power solid state relay of claim 1, wherein: the control signal output by the driving circuit is input into the output circuit through the accelerating circuit.
3. The small form factor high power solid state relay of claim 2, wherein: the accelerating circuit comprises a resistor R3, a first transistor V1, a second transistor V2, a capacitor C1, a diode D3 and a voltage stabilizing diode D4; the base of the first transistor V1 is used as an input end of the accelerating circuit, the collector of the first transistor V1 is connected with the cathode of the diode D3, and the anode of the diode D3 is used as an output end of the accelerating circuit; the emitter of the first transistor V1 is connected with the emitter of the second transistor V2, the collector of the second transistor V2 is used as the other input end of the accelerating circuit, and the base of the second transistor V2 is connected with the base of the first transistor V1; the emitter of the first transistor V1 is also connected with the cathode of the voltage stabilizing diode D4, and the anode of the voltage stabilizing diode D4 is connected with the collector of the second transistor V2; the resistor R3 is connected in series between the base of the first transistor V1 and the collector of the second transistor V2, and the capacitor C1 is connected in series between the collector of the first transistor V1 and the collector of the second transistor V2; the emitter of the first transistor V1 serves as the other output terminal of the speed-up circuit.
4. A small packaged high power solid state relay according to any one of claims 1-3, wherein: the input end of the input circuit is connected with the input end of the input circuit, and the output end of the output circuit is connected with the output end of the output circuit.
5. The small form factor high power solid state relay of claim 4, wherein: the output leading-out end is made of oxygen-free copper.
6. The small form factor high power solid state relay of claim 1, wherein: the input circuit is a voltage type input circuit.
7. The small form factor high power solid state relay of claim 1 or 6, wherein: the input circuit comprises a resistor R1, a resistor R2 and a diode D2, wherein one end of the resistor R1 is used as one input end of the input circuit, and the other end of the resistor R1 is used as one output end of the input circuit; one end of the resistor R2 is used as the other input end of the input circuit, the other end of the resistor R2 is connected with the cathode of the diode D2, and the anode of the diode D2 is used as the other output end of the input circuit.
8. The small form factor high power solid state relay of claim 1, wherein: the output circuit comprises a field effect transistor V3.
9. The small form factor high power solid state relay of claim 8, wherein: the field effect transistor V3 is a power type field effect transistor.
10. The small form factor high power solid state relay of claim 1, wherein: the tube shell (1) comprises a metal base (11) and a metal casing (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010304823.9A CN111431519A (en) | 2020-04-17 | 2020-04-17 | Small-packaged high-power solid relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010304823.9A CN111431519A (en) | 2020-04-17 | 2020-04-17 | Small-packaged high-power solid relay |
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| Publication Number | Publication Date |
|---|---|
| CN111431519A true CN111431519A (en) | 2020-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010304823.9A Pending CN111431519A (en) | 2020-04-17 | 2020-04-17 | Small-packaged high-power solid relay |
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| CN (1) | CN111431519A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1728553A (en) * | 2005-07-28 | 2006-02-01 | 北京市科通电子继电器总厂 | Normal open type solid-state relay in high-speed switch |
| CN102723935A (en) * | 2012-05-22 | 2012-10-10 | 柏德胜 | Self-turnoff component driving protection circuit |
| CN203984384U (en) * | 2014-06-23 | 2014-12-03 | 中国航天科工集团第三研究院第八三五七研究所 | A kind of pair of photovoltaic optocoupler drives DC solid-state relay |
| CN110661514A (en) * | 2019-11-01 | 2020-01-07 | 桂林航天电子有限公司 | Quick switch optical isolation solid relay |
-
2020
- 2020-04-17 CN CN202010304823.9A patent/CN111431519A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1728553A (en) * | 2005-07-28 | 2006-02-01 | 北京市科通电子继电器总厂 | Normal open type solid-state relay in high-speed switch |
| CN102723935A (en) * | 2012-05-22 | 2012-10-10 | 柏德胜 | Self-turnoff component driving protection circuit |
| CN203984384U (en) * | 2014-06-23 | 2014-12-03 | 中国航天科工集团第三研究院第八三五七研究所 | A kind of pair of photovoltaic optocoupler drives DC solid-state relay |
| CN110661514A (en) * | 2019-11-01 | 2020-01-07 | 桂林航天电子有限公司 | Quick switch optical isolation solid relay |
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Application publication date: 20200717 |