CN111389876B - Micro-explosion device for destroying electronic chip - Google Patents
Micro-explosion device for destroying electronic chip Download PDFInfo
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- CN111389876B CN111389876B CN202010300806.8A CN202010300806A CN111389876B CN 111389876 B CN111389876 B CN 111389876B CN 202010300806 A CN202010300806 A CN 202010300806A CN 111389876 B CN111389876 B CN 111389876B
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- upper shell
- explosion
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- tenon
- guard plate
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- 238000004880 explosion Methods 0.000 title claims abstract description 33
- 239000002360 explosive Substances 0.000 claims abstract description 22
- 230000000977 initiatory effect Effects 0.000 claims abstract description 14
- 230000006378 damage Effects 0.000 claims abstract description 13
- 239000012634 fragment Substances 0.000 claims abstract description 9
- 238000005474 detonation Methods 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims description 6
- 239000011247 coating layer Substances 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Disintegrating Or Milling (AREA)
- Working Measures On Existing Buildindgs (AREA)
Abstract
The invention discloses a micro-explosion device for destroying an electronic chip. The device comprises an upper shell, a detonating primer, an initiating explosive device chamber and a lower guard plate, wherein a cavity body is opened below the upper shell, fixed lugs are arranged at two ends of the outer part of the cavity body, the detonating primer is provided with 2 detonating signal wires, the detonating primer is led out from the side wall of the upper shell, the upper part of the initiating explosive device chamber is filled with high-energy explosive, and the lower part of the initiating explosive device chamber is filled with heat-insulating substances; the lower guard plate is provided with an explosion orientation window, an energy attenuation plate is arranged in the explosion orientation window, and a plurality of prefabricated fragments are arranged on the energy attenuation plate. The micro-explosion device has the advantages of controllable explosion time and power, small volume, long storage time, good environmental adaptability and convenient assembly and disassembly, can effectively perform physical damage on the appointed electronic chip, and simultaneously controls the explosion power through the energy attenuation plate so that other electronic elements are not damaged, thereby achieving the aim of destroying the appointed electronic chip under a certain condition and improving the data security of the electronic chip.
Description
Technical Field
The invention relates to the technical field of electronic chip safety protection, in particular to a micro-explosion device for destroying an electronic chip.
Background
Along with development of technology, electronic chips are more and more powerful, and chips with storage and control functions become important carriers of technology and information, and in some cases, the chips with storage and control functions need to be destroyed, but the destruction of key electronic chips is often a circuit fusing method, so the key electronic chips are not destroyed essentially, and can be recovered under specific conditions.
In order to thoroughly destroy the information stored in the electronic chip, the only method is to physically destroy the chip wafer, and the chip cannot be destroyed due to the fact that the artificial physical destruction is easily interfered by various factors, so that a chip-level micro-explosion device is needed, the power of the common explosion damage device is quite high, and the micro-explosion device which is only used for chip-level damage is not needed, particularly, the micro-explosion device which is only used for the appointed electronic chip and does not damage other elements around the appointed element is not needed. The patent (application number 201510187373.9) issued by Liu Peng et al of Beijing university discloses a self-destruction microsystem for a nonvolatile memory chip and a self-destruction method thereof, which specifically comprises: when the memory chip is in a normal state, the micro safety disarming unit short-circuits the micro energy conversion element, so that the micro energy conversion element is ensured not to fire; when the self-destruction decision chip judging system needs the self-destruction of the storage chip, a deblocking instruction is sent to the micro safety deblocking unit through a deblocking control end, the micro safety deblocking unit connected with a pair of ignition electrodes of the micro energy conversion unit in parallel is disconnected to release insurance, then the ignition control end sends an ignition signal to the micro energy conversion unit, the micro energy conversion unit heats to cause the energy-containing medicament in the packaging shell to burn or even generate detonation, and a large amount of heat is released in the reaction process, so that the storage chip is subjected to irreparable physical damage, and the irrecoverable destruction of information in the storage chip is realized. However, this patent only proposes a conceptual approach to physical destruction of the chip, and does not design a specific device for physical destruction of the electronic chip.
Disclosure of Invention
The invention aims to provide a micro-explosion device for destroying an electronic chip, which has the advantages of controllable explosion time and power, small volume, long storage time, good environmental adaptability and convenient loading and unloading.
The technical solution for realizing the purpose of the invention is as follows: a micro-explosion device for destroying an electronic chip comprises an upper shell, a detonating primer, an initiating explosive device chamber and a lower guard plate;
the upper shell and the lower guard plate form a sealed space, and the initiating explosive device chamber are arranged in the sealed space; the center of the lower guard plate is provided with an explosion orientation window.
Further, the upper shell and the lower guard plate adopt a mortise and tenon fixing mode or a thread fixing mode.
Further, the mortise and tenon fixing mode is specifically as follows:
the upper shell is a cavity with an opening at the bottom, a first fixing support lug and a second fixing support lug are arranged at two ends of the outer wall of the upper shell, a first device fixing hole and a second device fixing hole are respectively formed in the first fixing support lug and the second fixing support lug, and a first tenon seat, a fourth tenon seat and a shoulder are arranged at the bottom end inside the upper shell;
the lower guard plate is provided with first to fourth tenon protrusions, the thickness of the lower guard plate is matched with the depth of the shoulder of the upper shell, and the positions and the thicknesses of the first to fourth tenon protrusions are matched with the first to fourth tenon seats of the upper shell.
Further, the width of the first to fourth tenon protrusions is larger than that of the first to fourth tenon bases.
Further, the thread fixing mode is specifically as follows:
the upper shell is a cavity with a circular opening at the bottom, an internal thread is arranged in the circular opening, the lower guard plate is a circular plate with an external thread, and the internal thread is matched with the external thread.
Further, the detonating primer is provided with 2 detonating signal wires, and the 2 detonating signal wires are led out from the side wall of the upper shell.
Further, the upper layer of the initiating explosive device chamber is filled with high-energy explosive and the lower layer is filled with heat-insulating substances.
Further, the inner surface of the upper shell, the outer surface of the detonating primer and the upper surface of the lower guard plate are provided with anti-corrosion coating layers.
Further, an energy attenuation plate is arranged in the explosion orientation window.
Further, 4-16 prefabricated fragments are arranged on the energy attenuation plate, and after the device is detonated, the electronic chip is bombarded by the prefabricated fragments simultaneously.
Compared with the prior art, the invention has the remarkable advantages that: (1) When the protected electronic chip is destroyed, the destroying power is controllable, the destroying time is controllable, the complete physical destruction can be completed aiming at the electronic chip, and peripheral circuits and other electronic elements are not damaged; (2) The method is applicable to different types of electronic chips and has good universality; (3) The device has the advantages of small volume, long storage time, good environmental adaptability and convenient assembly and disassembly.
Drawings
Fig. 1 is a schematic structural view of a micro-explosion device for destroying an electronic chip according to the present invention.
FIG. 2 is a schematic view of section A-A of FIG. 1 in accordance with the present invention.
Fig. 3 is a schematic bottom view of the upper housing of the present invention.
FIG. 4 is a schematic bottom view of the lower shield of the present invention.
Fig. 5 is a schematic structural view of a screw thread fixing mode in the present invention.
Fig. 6 is a schematic structural diagram of prefabricated fragments on an energy attenuation plate in the present invention, where (a), (b), and (c) are schematic structural diagrams of 4, 9, and 16 prefabricated fragments on the energy attenuation plate, respectively.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings.
Referring to fig. 1 to 6, the micro-explosion device for destroying an electronic chip of the present invention comprises an upper casing 4, a primer cap 3, a initiating explosive device chamber 5 and a lower guard plate 8;
the upper shell 4 and the lower guard plate 8 form a sealed space, and the initiating explosive device 3 and the initiating explosive device chamber 5 are arranged in the sealed space; the lower guard plate 8 is provided with an explosion orientation window 9, and the explosion orientation window 9 is positioned in the center of the lower guard plate 8.
Further, the upper casing 4 and the lower guard plate 8 are fixed by mortise and tenon or by threads.
As a specific example, the mortise and tenon fixing manner is specifically as follows:
referring to fig. 3, in order to fix the device to a designated position, a first fixing support lug 1 and a second fixing support lug 6 are arranged outside the upper housing 4, and a first device fixing hole 12 and a second device fixing hole 7 are respectively formed in the first fixing support lug 1 and the second fixing support lug 6, so that the device can be easily fixed by using bolts; the bottom end inside the upper shell 4 is provided with first to fourth tenon seats 111, 112, 113 and 114 and a shoulder 13;
referring to fig. 4, the lower guard plate 8 is provided with first to fourth tenon protrusions 101, 102, 103 and 104, the thickness of the lower guard plate 8 is matched with the depth of the shoulder 13 of the upper shell 4, and the positions and thicknesses of the first to fourth tenon protrusions 101, 102, 103 and 104 are matched with the first to fourth tenon seats 111, 112, 113 and 114 of the upper shell 4.
Further, the widths of the first to fourth tenon 101, 102, 103 and 104 are larger than the widths of the first to fourth tenon seats 111, 112, 113 and 114, and the combination of the lower protective body 8 and the upper shell 4 adopts a pressing method, so that the two can be combined conveniently, and for the convenience of pressing, round chamfers are arranged on the two short end surfaces of the first to fourth tenon 101, 102, 103 and 104.
Further, the thread fixing mode is specifically as follows:
the upper shell 4 is a cavity with a circular opening below, an internal thread 15 is arranged in the circular opening, the lower guard plate is a circular plate with an external thread 16, and the internal thread 15 is matched with the external thread 16, as shown in fig. 5.
The detonating primer 3 is provided with 2 detonating signal wires 2, and the 2 detonating signal wires 2 are led out from the side wall of the upper shell 4;
the upper layer of the initiating explosive device chamber 5 is filled with high-energy explosive 51, and the lower layer is filled with heat-insulating substances 52, as shown in fig. 2;
the inner surface of the upper shell 4, the outer surface of the primer detonator 3 and the upper surface of the lower guard plate 8 are provided with anti-corrosion coating layers;
an energy attenuation panel 14 is disposed within the explosion-oriented window 9.
As a specific example, in order to increase the destruction resistance of the upper case 4 upon explosion, each corner of the inside of the upper case 4 is provided with a rounded chamfer, and the explosion-oriented window 9 may be provided in an inverted trapezoid shape for better explosion effect.
As a specific example, to obtain a better explosion effect, 4-16 prefabricated fragments are provided on the energy attenuation plate, as shown in fig. 6 (a) - (c), so that after the device is detonated, a plurality of prefabricated fragments bombard the electronic chip at the same time.
As a specific example, in order to conveniently dissipate the heat generated by the operation of the electronic chip, the materials of the upper case 4 and the lower guard plate 8 are metal, and preferential treatment is aluminum or aluminum alloy.
The heat insulating material 52 serves to prevent the electronic chip from affecting the initiating explosive device during operation.
The assembly process of the invention is to invert the upper shell 4, firstly install the detonating cap 3 and the detonating signal wire 2, set the high explosive 51, then cover the high explosive 51 completely with the heat insulation material, finally install the lower guard plate 8, and place the energy attenuation plate 14 in the explosion orientation window 9 of the lower guard plate 8.
The working process of the invention is that after the detonation signal wire 2 receives the detonation signal, the detonation detonator 3 is detonated, the high-energy explosive 51 is detonated, and the shock wave of the high-energy explosive 51 is bombarded on the electronic chip after passing through the energy attenuation plate 14.
In terms of device generality, the number of the fixing lugs of the upper shell 4 is not limited to 2, the positions of the fixing lugs are not limited to two sides of the upper shell 4, and if the area of a required destroying chip is overlarge, the fixing lugs can be arranged 4, and the positions of the fixing lugs can be arranged at 4 corners of the upper shell 4 and can also be arranged outside 4 sides; when the electronic chip is too large, more than 4 tenon bases and less than 4 tenon bases can be arranged, the upper shell is not limited to a rectangle as long as the upper shell 4 can be combined with the lower protection body, and the detonation tool formed by combining all or part of the above conditions with the embodiment of the invention is within the protection scope of the patent according to the specific shape of the electronic chip.
Claims (6)
1. The micro-explosion device for destroying the electronic chip is characterized by comprising an upper shell (4), a detonation detonator (3), an initiating explosive device chamber (5) and a lower guard plate (8);
the upper shell (4) and the lower guard plate (8) form a sealed space, and the detonating cap (3) and the initiating explosive device chamber (5) are arranged in the sealed space; an explosion orientation window (9) is arranged in the center of the lower guard plate (8);
the upper shell (4) and the lower guard plate (8) are fixed in a mortise and tenon mode or a thread mode;
the mortise and tenon fixing mode is specifically as follows:
the upper shell (4) is a cavity with an opening at the bottom, a first fixing support lug (1) and a second fixing support lug (6) are arranged at two ends of the outer wall of the upper shell, a first device fixing hole (12) and a second device fixing hole (7) are respectively arranged on the first fixing support lug (1) and the second fixing support lug (6), and a first tenon seat (111), a fourth tenon seat (112, 113, 114) and a shoulder (13) are arranged at the bottom end of the inner part of the upper shell (4);
the lower guard plate (8) is provided with first to fourth tenon protrusions (101, 102, 103 and 104), the thickness of the lower guard plate (8) is matched with the depth of a shoulder (13) of the upper shell (4), and the positions and the thicknesses of the first to fourth tenon protrusions (101, 102, 103 and 104) are matched with first to fourth tenon seats (111, 112, 113 and 114) of the upper shell (4);
the width of the first to fourth tenon (101, 102, 103, 104) is larger than the width of the first to fourth tenon seats (111, 112, 113, 114);
the thread fixing mode is specifically as follows:
the upper shell (4) is a cavity with a circular opening at the bottom, an internal thread (15) is arranged in the circular opening, the lower guard plate is a circular plate with an external thread (16), and the internal thread (15) is matched with the external thread (16).
2. The micro-explosion device for destroying electronic chips according to claim 1, wherein the detonating cap (3) is provided with 2 detonating signal wires (2), and the 2 detonating signal wires (2) are led out from the side wall of the upper shell (4).
3. The micro-explosion device for destroying electronic chips according to claim 1, wherein the upper layer of the initiating explosive device chamber (5) is filled with high explosive material (51) and the lower layer is filled with heat insulating material (52).
4. The micro-explosion device for destroying electronic chips according to claim 1, wherein the inner surface of the upper housing (4), the outer surface of the blasting cap (3), and the upper surface of the lower guard plate (8) are provided with an anti-corrosion coating layer.
5. A micro-explosion device for the destruction of electronic chips according to claim 1, characterized in that an energy attenuation plate (14) is arranged in the explosion-oriented window (9).
6. The micro-explosion device for destroying electronic chips according to claim 5, wherein 4-16 prefabricated fragments are arranged on the energy attenuation plate (14), and after the device is detonated, the electronic chips are bombarded by a plurality of prefabricated fragments simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010300806.8A CN111389876B (en) | 2020-04-16 | 2020-04-16 | Micro-explosion device for destroying electronic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010300806.8A CN111389876B (en) | 2020-04-16 | 2020-04-16 | Micro-explosion device for destroying electronic chip |
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| Publication Number | Publication Date |
|---|---|
| CN111389876A CN111389876A (en) | 2020-07-10 |
| CN111389876B true CN111389876B (en) | 2024-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010300806.8A Active CN111389876B (en) | 2020-04-16 | 2020-04-16 | Micro-explosion device for destroying electronic chip |
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| CN (1) | CN111389876B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112317520B (en) * | 2021-01-06 | 2021-05-07 | 南方科技大学 | Method and device for controllably exploding and crushing waste power batteries |
| CN113838809A (en) * | 2021-09-22 | 2021-12-24 | 深圳先进技术研究院 | Chip attachment device capable of realizing chip self-destruction and control method thereof |
| CN114001607B (en) * | 2021-11-17 | 2023-01-13 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
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|---|---|---|---|---|
| DE3879936D1 (en) * | 1988-07-19 | 1993-05-06 | Stuvex Int Nv | CLAMPING DEVICE FOR EXPLOSION PANELS. |
| JPH05166464A (en) * | 1991-12-13 | 1993-07-02 | Sony Corp | Disassembly device for cathode ray tube and method for using this device |
| CN2145766Y (en) * | 1992-12-12 | 1993-11-10 | 淮南矿业学院 | Jacket type anti-explosion container |
| CN103514383A (en) * | 2012-06-29 | 2014-01-15 | 北京理工大学 | Outward-embedded type chip explosion self-destruction micro device |
| CN204423378U (en) * | 2015-02-06 | 2015-06-24 | 江苏华宁电子系统工程有限公司 | A kind of electronic chip machinery self-desttruction equipment |
| CN205050144U (en) * | 2015-10-16 | 2016-02-24 | 莆田学院 | Area is prevented mistake and is ruined electron chip machinery destructors of function |
| CN108592707A (en) * | 2018-07-27 | 2018-09-28 | 中国工程物理研究院化工材料研究所 | A kind of micro electronmechanical intelligent and safe priming device and preparation method thereof |
| CN212121186U (en) * | 2020-04-16 | 2020-12-11 | 泰鑫高科(北京)技术有限公司 | Micro-explosion device for destroying electronic chip |
-
2020
- 2020-04-16 CN CN202010300806.8A patent/CN111389876B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3879936D1 (en) * | 1988-07-19 | 1993-05-06 | Stuvex Int Nv | CLAMPING DEVICE FOR EXPLOSION PANELS. |
| JPH05166464A (en) * | 1991-12-13 | 1993-07-02 | Sony Corp | Disassembly device for cathode ray tube and method for using this device |
| CN2145766Y (en) * | 1992-12-12 | 1993-11-10 | 淮南矿业学院 | Jacket type anti-explosion container |
| CN103514383A (en) * | 2012-06-29 | 2014-01-15 | 北京理工大学 | Outward-embedded type chip explosion self-destruction micro device |
| CN204423378U (en) * | 2015-02-06 | 2015-06-24 | 江苏华宁电子系统工程有限公司 | A kind of electronic chip machinery self-desttruction equipment |
| CN205050144U (en) * | 2015-10-16 | 2016-02-24 | 莆田学院 | Area is prevented mistake and is ruined electron chip machinery destructors of function |
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| CN212121186U (en) * | 2020-04-16 | 2020-12-11 | 泰鑫高科(北京)技术有限公司 | Micro-explosion device for destroying electronic chip |
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